Production method of high-density multilayer circuit board

Abstract

The invention discloses a production method of a high-density multilayer circuit board, and relates to the technical field of circuit boards, the production method comprises cutting, a control room is fixedly mounted on the right side of the cutting, and a pattern transfer device is fixedly mounted on the right side of the control room. The control chamber fixedly installed on the right side of the cutting machine plays a role in intelligent control and adjustment, the pattern transfer device fixedly installed on the right side of the control chamber achieves the effect of inner and outer layer separation work, and meanwhile, plate grinding and film pasting are achieved through the effect of the inner and outer pattern layers; comprising a circuit pattern and a photoinduced solder resist pattern, the function is realized through irradiation of ultraviolet light, the irradiated local area is cured, and then the circuit pattern or the solder resist pattern is formed through development, so that the development has excellent resolution, the circuit quality can be obviously improved, and the production cost is reduced. The improvement of the etching quality is greatly related to the acceleration of the etching rate, and the photosensitive adhesive coated on the surface of the copper foil is removed by the inner layer mold stripping.

Description

Technical Field

[0001] The invention relates to the technical field of circuit boards, and in particular to a production method for a high-density multi-layer circuit board. Background Art

[0002] At present, the design and connection of all electronic instrument circuits are mostly based on printed circuit boards. With the technological progress of the electronics industry, in order to better meet the needs of miniaturization of electronic equipment, the number of layers of flexible circuit boards continues to increase, and printed circuit boards are developing in the direction of multi-layer and dense. Multi-layer flexible printed circuit boards are made of two or more printed circuit graphic sheets stacked together, which will produce residual stress in the processing process, resulting in unstable product dimensions.

[0003] For example, the Chinese patent publication number CN104202930B discloses a method for producing a high-density multi-layer circuit board. It only solves the problem of a method for producing a high-density multi-layer circuit board with high product qualification rate, simple process, high production efficiency and stable conductive performance of the produced circuit board. However, it does not solve the problems of improving the lamination stability and improving the lamination slide plate, so as to meet the resin filling requirements and quality stability of the high-density multi-layer circuit board.

[0004] The existing technology has the following problems: However, the existing technology does not solve the problems of improving the lamination stability and improving the lamination slide plate, so as to meet the resin filling requirements and quality stability of high-density multi-layer circuit boards; at the same time, it is difficult to protect the circuit layer and improve the line quality through quality inspection in the integrated detection process due to the subdivision of the inner and outer layers; at the same time, it does not solve the problem of curing the irradiated local area and then developing it to form a circuit pattern or solder mask pattern, so that the development has excellent resolution, which can significantly improve the line quality, and the improvement of etching quality is closely related to the acceleration of etching rate, and the inner layer demolding removes the photosensitive adhesive coated on the surface of the copper foil to form a circuit pattern. Summary of the invention

[0005] The present invention provides a method for producing a high-density multi-layer circuit board to solve the problems raised in the above background technology.

[0006] In order to solve the above technical problems, the technical solution adopted by the present invention is: A production method for a high-density multilayer circuit board includes cutting materials, a control room is fixedly installed on the right side of the cutting materials, a pattern transfer device is fixedly installed on the right side of the control room, an ultrasonic generator is fixedly installed below the pattern transfer device, a browning device is fixedly installed below the ultrasonic generator, a laminating device is fixedly installed below the browning device, a laser device is fixedly installed below the laminating device, and an electroplating molding device is fixedly installed below the laser device.

[0007] A further improvement of the technical solution of the present invention is that an inner layer graphic transfer is fixedly installed on the right side of the cutting and located on the inner cavity of the graphic transfer device, an outer layer graphic transfer is fixedly installed below the inner cavity of the graphic transfer device, and an AOI is fixedly connected to the right side of the inner layer graphic transfer.

[0008] A further improvement of the technical solution of the present invention is that a drilling hole is fixedly installed on the right side of the laminating device, copper deposition is fixedly connected below the drilling hole, board plating is fixedly connected to the left side of the copper deposition, and outer layer pattern transfer is fixedly connected to the left side of the board plating.

[0009] A further improvement of the technical solution of the present invention is that the left side of the outer layer graphic transfer is fixedly connected with silk screen solder resist ink, the left side of the silk screen solder resist ink is fixedly installed with solder resist graphic transfer, and the left side of the solder resist graphic transfer is fixedly installed with silk screen characters.

[0010] A further improvement of the technical solution of the present invention is that a milling shape is fixedly installed below the silk-screen characters, an electric measurement is fixedly installed on the right side of the milling shape, a final inspection is fixedly installed on the right side of the electric measurement, and a vacuum package is fixedly installed on the right side of the final inspection.

[0011] A further improvement of the technical solution of the present invention lies in that an inner layer grinding plate is fixedly installed below the inner layer graphic transfer, an inner layer film is fixedly installed below the inner layer grinding plate, a film alignment is fixedly installed below the inner layer film, an exposure is fixedly installed below the film alignment, a development is fixedly installed below the exposure, an etching is fixedly installed below the development, and a demolding is fixedly installed below the etching.

[0012] A further improvement of the technical solution of the present invention lies in that an outer grinding plate is fixedly installed under the outer layer pattern transfer, an outer film is fixedly installed under the outer grinding plate, a film alignment is fixedly installed under the outer layer film, an exposure device 2 is fixedly installed under the film alignment, a pattern electroplating device is fixedly installed under the exposure device 2, a development device 2 is fixedly installed under the pattern electroplating device, an etching device 2 is fixedly installed under the development device 2, and a stripping and tinning device is fixedly installed under the etching device 2.

[0013] A further improvement of the technical solution of the present invention is that: a film alignment device 3 is fixedly installed below the solder resist pattern transfer, an exposure device 3 is fixedly installed below the film alignment device 3, and a development device 3 is fixedly installed below the exposure device 3.

[0014] A further improvement of the technical solution of the present invention is: a method for producing a high-density multi-layer circuit board, the method for producing a high-density multi-layer circuit board comprising the following steps: Step 1: Preparation: Prepare the raw materials required for the prefabricated parts; then use the control room to control the production process of the multi-layer circuit board; Step 2: Subtracting process: Simplifying the process by using a pattern transfer device, an ultrasonic generator, a browning device, a laminating device, a laser device, and an electroplating molding device; Step 3: Inner and outer layer work: put the raw materials prepared in the pattern transfer device step into the inner layer pattern transfer and outer layer pattern transfer to achieve uniform work on the raw material production; Step 4: Molding: Move the finished circuit board to the final inspection of the molding structure for electrical testing; Step 5: Packaging: After the pressed circuit board is tested and qualified, it is vacuum packed for sale.

[0015] Due to the adoption of the above technical solution, the present invention has the following technical advances compared with the prior art: The invention provides a production method of a high-density multilayer circuit board. The invention adopts the mutual cooperation among a control room, a pattern transfer device, an inner layer pattern transfer, and an outer layer pattern transfer. The control room fixedly installed on the right side of the material cutting plays the role of intelligent control and regulation. The pattern transfer device fixedly installed on the right side of the control room realizes the function of separating the inner and outer layers, and at the same time, the inner and outer layers are used to realize the grinding and film pasting. When the photosensitive mask pattern in the film alignment pattern transfer, including the circuit pattern and the photoresist pattern, is irradiated with ultraviolet light to solidify the irradiated local area, and then developed to form the circuit pattern or the solder resist pattern. When the development has excellent resolution, the circuit quality can be significantly improved. The improvement of etching quality is closely related to the acceleration of etching rate. The inner layer demolding removes the photosensitive adhesive coated on the surface of the copper foil to form a circuit pattern. When the outer layer pattern is electroplated on the copper surface showing the circuit after the film drying process is completed, the copper layer is thickened by electroplating method, and then a layer of tin is plated as the protective layer of the circuit.

[0016] The present invention provides a production method of a high-density multilayer circuit board. The method adopts mutual cooperation between an ultrasonic generator, a browning device, a laminating device, a laser device, and an electroplating forming device. The ultrasonic generator fixedly installed under a pattern transfer device realizes a high-frequency alternating current signal that matches the ultrasonic generator and the ultrasonic transducer, which is used to drive the ultrasonic transducer to work. The browning device fixedly installed under the ultrasonic generator serves to increase the bonding force between the original board and the PP, press them together within a certain time, and avoid the browning layer absorbing water to cause the board to explode. The laminating device fixedly installed under the browning device realizes a pre-pressing section: volatiles and residual gases are driven away, so that the layers are tightly bonded. Pre-pressing is the key to lamination; medium-pressure section: fully fill the resin glue and drive out the bubbles in the resin glue to prevent the pressure from being too high at one time; pressure section: cure the semi-cured sheet to the C stage state; k-reduction section: gradually reduce the pressure to reduce the internal stress of the board and reduce warping. The laser device fixedly installed under the lamination device uses a high-energy-density laser to locally irradiate the PCB board to vaporize or discolor the surface material, leaving a permanent mark. The electroplating molding device fixedly installed under the laser device is wear-resistant and has good reliability. For gold finger circuit boards, it mainly uses the good conductivity of gold. The advantages of gold-plated circuit boards are strong conductivity, good oxidation resistance, long service life, dense plating, and relatively wear-resistant. They are generally used in bonding, welding and plugging occasions.

[0017] The present invention provides a production method of a high-density multi-layer circuit board, which adopts the mutual cooperation among AOI, drilling, copper deposition, silk-screen solder resist ink, solder resist pattern transfer, and silk-screen characters, and the AOI fixedly connected on the right side of the inner layer pattern transfer plays the role of AOI detection equipment. The working principle is that in the automatic detection process, the AOI detection equipment machine automatically scans the PCBA product through a high-definition CCD camera, collects images, compares the test points with qualified parameters in the database, and checks the solder joint defects on the target PCBA through image processing, and displays or automatically marks the defects. The fixedly installed drilling holes on the right side of the laminating device realize the feature of through holes in order to meet the needs of customers. The through holes of the circuit board must be plugged. In this way, in changing the traditional aluminum sheet plugging process, the white mesh is used to complete the board surface solder resist and plugging of the circuit board, so that the production is stable, the quality is reliable, and it is easy to use. More perfect, the copper sinking fixedly connected under the drilling hole uses the principle that chemical formaldehyde can oxidize and reduce chemical copper ions in the strong alkaline environment of potassium permanganate, and the silk-screen solder mask ink fixedly connected on the left side of the outer pattern transfer plays the role of etching resistance, acid and alkali resistance, and electroplating resistance, and plays the role of insulation, reflow resistance, gold resistance, gold dotting, tin resistance, silver resistance and salt spray, etc. The left side of the silk-screen solder mask ink is fixedly installed with the solder mask pattern transfer to avoid the circuit pad bridge short circuit during the welding process, thereby effectively protecting the pad, reducing the solder short circuit in the non-solder mask area, and providing the circuit board with a good electrical environment and chemical resistance protective layer, thereby ensuring that the surface of the circuit board is not oxidized and damaged, so that the silk-screen characters fixedly installed on the left side of the solder mask pattern transfer can be realized to facilitate the installation and maintenance of the circuit, and the required logo patterns and text codes are printed on the upper and lower surfaces of the PCB board. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural schematic diagram of the present invention; Figure 2 It is a schematic diagram of the subdivided process structure of the present invention; Figure 3 It is a schematic diagram of the structure of the inner layer pattern transfer process of the present invention; Figure 4 It is a schematic diagram of the outer layer pattern transfer process structure of the present invention; Figure 5 It is a structural schematic diagram of the solder mask pattern transfer process of the present invention.

[0019] In the figure: 1. Cutting; 2. Control room; 3. Pattern transfer device; 31. Inner pattern transfer; 311. Inner grinding plate; 312. Inner film; 313. Film alignment; 314. Exposure; 315. Development; 316. Etching; 317. Demolding; 32. Outer pattern transfer; 321. Outer grinding plate; 322. Outer film; 323. Film alignment; 324. Exposure II; 325. Pattern electroplating; 326. Development II; 327. Etching Engraving two; 328, mold stripping, tin; 4, ultrasonic generator; 5, browning device; 6, laminating device; 7, laser device; 8, electroplating molding device; 81, board plating; 9, AOI; 10, drilling; 11, copper plating; 12, silk screen solder mask ink; 13, solder mask pattern transfer; 131, film alignment three; 132, exposure three; 133, development three; 14, silk screen characters; 15, milling shape; 16, electrical measurement; 17, final inspection; 18, vacuum packaging. Implementation

[0020] The present invention is further described in detail below in conjunction with embodiments: Example

[0021] like Figure 1-5 As shown, the present invention provides a method for producing a high-density multilayer circuit board, including cutting 1, a control room 2 is fixedly installed on the right side of the cutting 1, a graphic transfer device 3 is fixedly installed on the right side of the control room 2, an ultrasonic generator 4 is fixedly installed below the graphic transfer device 3, a browning device 5 is fixedly installed below the ultrasonic generator 4, a laminating device 6 is fixedly installed below the browning device 5, a laser device 7 is fixedly installed below the laminating device 6, and an electroplating molding device 8 is fixedly installed below the laser device 7.

[0022] In this embodiment, the control room 2 fixedly installed on the right side of the cutting machine 1 plays a role of intelligent control and regulation, the graphic transfer device 3 fixedly installed on the right side of the control room 2 realizes the separation of the inner and outer layers, and the ultrasonic generator 4 fixedly installed below the graphic transfer device 3 realizes the high-frequency AC signal that matches the ultrasonic generator and the ultrasonic transducer, which is used to drive the ultrasonic transducer to work. The browning device 5 fixedly installed below the ultrasonic generator 4 increases the bonding force between the original board and the PP, presses them together within a certain period of time, and avoids the browning layer absorbing water, which causes the board to burst, so that the laminating device 6 fixedly installed below the browning device 5 realizes the pre-pressing section: drives away volatiles and residual gases, and makes the layers tightly bonded. Pre-pressing is the key to lamination; medium pressure section: fully fill the resin glue and drive out the bubbles in the resin glue to prevent the pressure from being too high at one time; pressure section: cure the semi-cured sheet to the C stage state; k-reducing section: gradually reduce the pressure to reduce the internal stress of the board and reduce warping. The laser device 7 fixedly installed under the lamination device 6 uses a high-energy-density laser to locally irradiate the PCB board to vaporize or discolor the surface material, thereby leaving a permanent mark. The electroplating molding device 8 fixedly installed under the laser device 7 is wear-resistant and has good reliability. For the gold finger circuit board, it mainly uses the good conductivity of gold. The advantages of gold-plated circuit boards are strong conductivity, good oxidation resistance, long service life, dense coating, and relatively wear-resistant. They are generally used in bonding, welding and plugging occasions. Example

[0023] like Figure 1-5 As shown, on the basis of Example 1, the present invention provides a technical solution: preferably, an inner layer graphic transfer 31 is fixedly installed on the right side of the opening 1 and located on the inner cavity of the graphic transfer device 3, an outer layer graphic transfer 32 is fixedly installed below the inner cavity of the graphic transfer device 3, the right side of the inner layer graphic transfer 31 is fixedly connected with AOI9, the right side of the laminating device 6 is fixedly installed with a drilling hole 10, the bottom of the drilling hole 10 is fixedly connected with a copper plating 11, the left side of the copper plating 11 is fixedly connected with a board plating 81, the left side of the board plating 81 is fixedly connected with an outer layer graphic transfer 32, the left side of the outer layer graphic transfer 32 is fixedly connected with a silk-screen solder resist ink 12, the left side of the silk-screen solder resist ink 12 is fixedly installed with a solder resist graphic transfer 13, and the left side of the solder resist graphic transfer 13 is fixedly installed with a silk-screen character 14.

[0024] In this embodiment, the AOI 9 fixedly connected on the right side of the inner layer pattern transfer 31 acts as an AOI detection device. The working principle is that during the automatic detection process, the AOI detection equipment machine automatically scans the PCBA product through a high-definition CCD camera, collects images, compares the test points with the qualified parameters in the database, and checks the solder joint defects on the target PCBA through image processing, and displays or automatically marks the defects. The drill hole 10 fixedly installed on the right side of the laminating device 6 realizes the characteristic of through-hole in order to meet the needs of customers. The through-holes of the circuit board must be plugged. In this way, in changing the traditional aluminum sheet plugging process, the white mesh is used to complete the solder mask and plugging of the circuit board surface, so that its production is stable, the quality is reliable, and it is more perfect to use. The copper slurry 11 fixedly connected under the drill hole 10 uses the principle of chemical formaldehyde to oxidize and reduce chemical copper ions in the strong alkaline environment of potassium permanganate, so that the outer layer fixedly connected on the left side of the plate plating 81 Graphic transfer 32 acid etching subtractive process: the mask pattern plays an anti-corrosion role, and the position where the copper needs to be exposed is covered with a dry film. After the development, etching and film stripping processes, an outer layer pattern is formed. The silk screen solder mask ink 12 fixedly connected on the left side of the outer layer pattern transfer 32 plays the role of etching resistance, acid and alkali resistance, and electroplating resistance. It also plays the role of insulation, reflow resistance, gold resistance, gold plating resistance, tin plating resistance, silver plating resistance and salt spray resistance. The solder mask pattern transfer 13 is fixedly installed on the left side of the silk screen solder mask ink 12 to avoid circuit pad bridge short circuit during welding, thereby effectively protecting the pad, reducing solder short circuit in non-solder mask areas, and providing the circuit board with a good electrical environment and chemical resistance protective layer, thereby ensuring that the surface of the circuit board is not oxidized and damaged, so that the silk screen characters 14 fixedly installed on the left side of the solder mask pattern transfer 13 can be used to print the required logo patterns and text codes on the upper and lower surfaces of the PCB board in order to facilitate the installation and maintenance of the circuit. Example

[0025] like Figure 1-5As shown, on the basis of Example 1, the present invention provides a technical solution: preferably, a milling shape 15 is fixedly installed below the silk-screen character 14, an electric measurement 16 is fixedly installed on the right side of the milling shape 15, a final inspection 17 is fixedly installed on the right side of the electric measurement 16, a vacuum packaging 18 is fixedly installed on the right side of the final inspection 17, an inner layer grinding plate 311 is fixedly installed below the inner layer graphic transfer 31, an inner layer film 312 is fixedly installed below the inner layer grinding plate 311, a film alignment 313 is fixedly installed below the inner layer film 312, an exposure 314 is fixedly installed below the film alignment 313, a development 315 is fixedly installed below the exposure 314, and a development 315 is fixedly installed below the development 314. An etching device 316 is fixedly installed below 315, a demolding device 317 is fixedly installed below the etching device 316, an outer grinding plate 321 is fixedly installed below the outer grinding plate 321, an outer film 322 is fixedly installed below the outer film 322, a film alignment 323 is fixedly installed below the film alignment 323, an exposure device 324 is fixedly installed below the film alignment 323, a pattern electroplating device 325 is fixedly installed below the exposure device 324, a developing device 326 is fixedly installed below the pattern electroplating device 325, an etching device 327 is fixedly installed below the developing device 326, and a demolding device and tin device 328 are fixedly installed below the etching device 327.

[0026] In this embodiment, the milling shape 15 fixedly installed below the silk-screen characters 14 and the electric test 16 fixedly installed on the right side of the milling shape 15 are used to achieve the function of keeping the shape consistent with the program setting and electrical detection, and then the final inspection 17 fixedly installed on the right side of the electric test 16 and the vacuum packaging 18 fixedly installed on the right side of the final inspection 17 are used to play the role of final detection and packaging, and at the same time, the inner and outer layers are used to realize grinding and film pasting, and the photosensitive mask pattern in the film alignment pattern transfer, including the circuit pattern and the photoresist pattern, is irradiated with ultraviolet light to solidify the irradiated local area, and then developed to form a circuit pattern or a solder resist pattern, and the development has excellent resolution, which can significantly improve the circuit quality. The improvement of etching quality is closely related to the acceleration of etching rate. The inner layer demolding removes the photosensitive adhesive coated on the surface of the copper foil to form a circuit pattern, and the outer layer pattern is electroplated on the copper surface of the circuit after the film drying process is completed. The copper layer is thickened by electroplating, and then a layer of tin is plated as a protective layer for the circuit. Example

[0027] like Figure 1-5 As shown, based on Example 1, the present invention provides a technical solution: preferably, a film alignment three 131 is fixedly installed below the solder mask pattern transfer 13, an exposure three 132 is fixedly installed below the film alignment three 131, and a development three 133 is fixedly installed below the exposure three 132.

[0028] In this embodiment, the film alignment three 131 fixedly installed under the solder resist pattern transfer 13 is used to transfer the photosensitive mask pattern in the film alignment pattern, including the circuit pattern and the photoresist pattern. The exposure three 132 fixedly installed under the film alignment three 131 is used to solidify the irradiated local area through ultraviolet light irradiation. The developing three 133 fixedly installed under the exposure three 132 is used to form the circuit pattern or the solder resist pattern through development. The development has excellent resolution and can significantly improve the circuit quality. Example

[0029] like Figure 1-5 As shown, based on Example 1, the present invention provides a method for producing a high-density multi-layer circuit board, and the method for producing a high-density multi-layer circuit board comprises the following steps: Step 1: Preparation: Prepare the raw materials required for the prefabricated parts in the material cutting 1; then use the control room 2 to control the production process of the multi-layer circuit board; Step 2: Subtracting process: simplifying the process by using the pattern transfer device 3, the ultrasonic generator 4, the browning device 5, the laminating device 6, the laser device 7, and the electroplating molding device 8; Step 3: Inner and outer layer work: put the raw materials prepared by the pattern transfer device 3 into the inner layer pattern transfer 31 and the outer layer pattern transfer 32 to achieve uniform work on the raw material production; Step 4: Forming: Move the finished circuit board from electrical testing 16 to final inspection of the formed structure 17; Step 5: Packaging: After the pressed circuit board is tested and found to be qualified, it is then sold using vacuum packaging 18.

[0030] In summary, if Figure 1-5As shown, the control room 2 fixedly installed on the right side of the cutting machine 1 plays a role of intelligent control and regulation, the graphic transfer device 3 fixedly installed on the right side of the control room 2 realizes the separation of the inner and outer layers, the ultrasonic generator 4 fixedly installed below the graphic transfer device 3 realizes the high-frequency AC signal that matches the ultrasonic generator and the ultrasonic transducer, which is used to drive the ultrasonic transducer to work, and the browning device 5 fixedly installed below the ultrasonic generator 4 increases the bonding force between the original board and the PP, pressing them together within a certain period of time to avoid the browning layer absorbing water and causing the board to burst, so that the laminating device 6 fixedly installed below the browning device 5 realizes the pre-pressing section: driving away volatiles and residual gases to make the layers tightly bonded. Pre-pressing is the key to lamination; medium pressure section: fully fill the resin glue and drive out the bubbles in the resin glue to prevent the pressure from being too high at one time; pressure section: cure the semi-cured sheet to the C stage state; k-reducing section: gradually reduce the pressure to reduce the internal stress of the board and reduce the warping. The laser device 7 fixedly installed under the lamination device 6 uses a high-energy-density laser to locally irradiate the PCB board to vaporize or discolor the surface material, thereby leaving a permanent mark. The electroplating molding device 8 fixedly installed under the laser device 7 is wear-resistant and reliable. For the gold finger circuit board, it mainly uses the good conductivity of gold. The advantages of gold-plated circuit boards are strong conductivity, good oxidation resistance, long life, dense plating, and relatively wear-resistant. They are generally used in binding, welding, and plugging situations to transfer the inner layer pattern 31. The AOI9 fixedly connected on the right side plays the role of AOI detection equipment. The working principle is that during the automatic detection process, the AOI detection equipment machine automatically scans the PCBA product through a high-definition CCD camera, collects images, and compares the test points with the qualified parameters in the database. After image processing, the solder joint defects on the target PCBA are checked, and the defects are displayed or automatically marked. The drill hole 10 fixedly installed on the right side of the lamination device 6 realizes the characteristic of through-hole in order to meet customer needs. The through holes of the circuit board must be plugged. In this way, in changing the traditional aluminum sheet plugging process, the white mesh is used to complete the solder mask and plugging of the circuit board surface, so that its production is stable, the quality is reliable, and it is more perfect to use. The copper slurry 11 fixedly connected under the drill hole 10 uses the chemical formaldehyde in the strong alkaline environment of potassium permanganate to oxidize and reduce the chemical copper ions, so that the outer layer pattern 32 fixed on the left side of the plated 81 is transferred. Acid etching subtractive process: The mask pattern plays an anti-corrosion role, and the position where the copper needs to be exposed is covered with a dry film. After the development, etching and film stripping processes, an outer layer pattern is formed. The silk screen solder resist ink 12 fixedly connected to the left side of the outer layer pattern transfer 32 plays the role of anti-etching, acid and alkali resistance, and electroplating resistance. It also plays the role of insulation, reflow resistance, resistance to gold, gold doping, tin, silver and salt spray. The solder resist pattern transfer 13 is fixedly installed on the left side of the silk screen solder resist ink 12 to avoid short circuit of the circuit pad bridge during the welding process, thereby effectively protecting the pad, reducing the solder short circuit in the non-solder mask area, and providing a good electrical environment and chemical protection layer for the circuit board.Thereby ensuring that the surface of the circuit board is not oxidized and damaged, the silk-screen characters 14 fixedly installed on the left side of the solder mask pattern transfer 13 are realized to facilitate the installation and maintenance of the circuit, etc., and the required logo patterns and text codes are printed on the upper and lower surfaces of the PCB board. The milling shape 15 fixedly installed below the silk-screen characters 14 and the electric test 16 fixedly installed on the right side of the milling shape 15 are realized to keep the shape consistent with the program setting and the function of electric detection, and then the final inspection 17 fixedly installed on the right side of the electric test 16 and the vacuum packaging 18 fixedly installed on the right side of the final inspection 17 are used to play the role of final detection and packaging, and at the same time, the role of the inner and outer layers is used to realize the grinding and film pasting, and the photosensitive mask pattern in the film alignment pattern transfer, including the circuit pattern and the photoresist pattern, is cured by ultraviolet light irradiation, and then developed to form a circuit pattern or solder mask pattern. The development has excellent resolution, which can significantly improve the circuit quality. The improvement of etching quality is closely related to the acceleration of etching rate. The inner layer stripping removes the photosensitive adhesive coated on the surface of the copper foil to form a circuit pattern. The outer layer pattern is electroplated on the copper surface of the circuit after the dry film process is completed. The copper layer is thickened by electroplating, and then a layer of tin is plated as a protective layer for the circuit. The film alignment three 131 fixedly installed under the solder mask pattern transfer 13 makes the photosensitive mask pattern in the film alignment pattern transfer, including the circuit pattern and the photoresist pattern. The exposure three 132 fixedly installed under the film alignment three 131 has the function of curing the irradiated local area through ultraviolet light irradiation. The development three 133 fixedly installed under the exposure three 132 is then developed to form a circuit pattern or solder mask pattern. The development has excellent resolution, which can significantly improve the circuit quality.

[0031] The above generally describes the present invention in detail, but it is obvious to a person skilled in the art that some modifications or improvements can be made to the present invention. Therefore, modifications or improvements that do not depart from the spirit of the present invention are within the scope of protection of the present invention.

Claims

1. A method for producing a high-density multi-layer circuit board, comprising cutting (1), characterized in that: A control room (2) is fixedly installed on the right side of the material cutting machine (1), and a pattern transfer device (3) is fixedly installed on the right side of the control room (2); An ultrasonic generator (4) is fixedly installed below the pattern transfer device (3), and a browning device (5) is fixedly installed below the ultrasonic generator (4); A laminating device (6) is fixedly installed below the browning device (5), a laser device (7) is fixedly installed below the laminating device (6), and an electroplating molding device (8) is fixedly installed below the laser device (7).

2. The method for producing a high-density multi-layer circuit board according to claim 1, characterized in that: An inner layer pattern transfer (31) is fixedly installed on the right side of the cutting material (1) and located above the inner cavity of the pattern transfer device (3), an outer layer pattern transfer (32) is fixedly installed below the inner cavity of the pattern transfer device (3), and an AOI (9) is fixedly connected to the right side of the inner layer pattern transfer (31).

3. The method for producing a high-density multi-layer circuit board according to claim 1, characterized in that: A drilling hole (10) is fixedly installed on the right side of the laminating device (6), a copper sink (11) is fixedly connected below the drilling hole (10), a plate plating (81) is fixedly connected to the left side of the copper sink (11), and an outer layer pattern transfer (32) is fixedly connected to the left side of the plate plating (81).

4. The method for producing a high-density multi-layer circuit board according to claim 3, characterized in that: The left side of the outer layer pattern transfer (32) is fixedly connected to a silk screen solder resist ink (12), the left side of the silk screen solder resist ink (12) is fixedly installed with a solder resist pattern transfer (13), and the left side of the solder resist pattern transfer (13) is fixedly installed with a silk screen character (14).

5. The method for producing a high-density multi-layer circuit board according to claim 4, characterized in that: A milling profile (15) is fixedly installed below the silk-screen characters (14), an electric measurement (16) is fixedly installed on the right side of the milling profile (15), a final inspection (17) is fixedly installed on the right side of the electric measurement (16), and a vacuum package (18) is fixedly installed on the right side of the final inspection (17).

6. The method for producing a high-density multi-layer circuit board according to claim 2, characterized in that: An inner layer grinding plate (311) is fixedly mounted below the inner layer pattern transfer (31), an inner layer film (312) is fixedly mounted below the inner layer grinding plate (311), a film alignment (313) is fixedly mounted below the inner layer film (312), an exposure (314) is fixedly mounted below the film alignment (313), a development (315) is fixedly mounted below the exposure (314), an etching (316) is fixedly mounted below the development (315), and a demolding (317) is fixedly mounted below the etching (316).

7. The method for producing a high-density multi-layer circuit board according to claim 3, characterized in that: An outer grinding plate (321) is fixedly mounted below the outer pattern transfer (32), an outer film (322) is fixedly mounted below the outer grinding plate (321), a film alignment (323) is fixedly mounted below the outer film (322), an exposure device (324) is fixedly mounted below the film alignment (323), a pattern electroplating device (325) is fixedly mounted below the exposure device (324), a developing device (326) is fixedly mounted below the pattern electroplating device (325), an etching device (327) is fixedly mounted below the developing device (326), and a stripping device and tin (328) are fixedly mounted below the etching device (327).

8. The method for producing a high-density multi-layer circuit board according to claim 4, characterized in that: A film alignment device (131) is fixedly installed below the solder resist pattern transfer device (13), an exposure device (132) is fixedly installed below the film alignment device (131), and a development device (133) is fixedly installed below the exposure device (132).

9. A method for producing a high-density multi-layer circuit board, comprising the method for producing a high-density multi-layer circuit board according to any one of claims 1 to 8, characterized in that: The production method of the high-density multi-layer circuit board comprises the following steps: Step 1: Preparation: Cutting (1) Prepare the raw materials required for the prefabricated parts; then use the control room (2) to control the production process of the multi-layer circuit board; Step 2: Simplifying the process: using the pattern transfer device (3), the ultrasonic generator (4), the browning device (5), the laminating device (6), the laser device (7), and the electroplating molding device (8) to simplify the process; Step 3: Inner and outer layer work: put the raw materials prepared in the pattern transfer device (3) into the inner layer pattern transfer (31) and outer layer pattern transfer (32) to achieve uniform production of the raw materials; Step 4: Forming: Move the finished circuit board from electrical testing (16) to final inspection of the formed structure (17); Step 5: Packaging: After the pressed circuit board is tested and found to be qualified, it is then vacuum packaged (18) for sale.

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