Novel flexible circuit board welding method and system

Abstract

A welding method of a novel flexible circuit board and a vehicle wherein the welding method of the novel flexible circuit board comprises the following steps: S100: windowing a flexible flat cable or a film of the flexible flat cable to expose a conductor in the flexible flat cable at the windowing position; s200, the windowing position of the flexible flat cable is coated with solder paste; s300, solder paste detection is carried out; the height, the volume, the area, the short circuit and the offset of the solder paste are detected, and related data information is compensated to equipment in the following steps to ensure the precision; s400, pasting a double faced adhesive tape near the solder paste; s500, a branch circuit board is pasted and assembled on the double-faced adhesive tape; and S600, welding the branch circuit board and the flexible flat cable at the windowing position so as to manufacture the novel flexible circuit board. The method has the beneficial effects that no pollution is caused in the production process; the machining precision is high, and the welding quality and reliability of products are guaranteed; the production efficiency is high and the production cost is low.

Description

Technical Field

[0001] The present application relates to the technical field of sewage treatment, and in particular to a welding method and system for a novel flexible circuit board. Background Art

[0002] Flexible Printed Circuit (FPC). In the field of manufacturing the cell contact system (CCS) of new energy battery packs, the industry usually uses traditional FPC as the acquisition of electrical signals. Although FPC can meet the functional requirements of the product, the manufacturing cost is relatively high, and the traditional FPC is manufactured by etching process, which is not environmentally friendly. However, we originally use new energy for environmental protection, which will cause contradictions.

[0003] Therefore, the industry is researching and developing a new flexible circuit board to replace the traditional design. At present, some people have proposed to use flexible flat cable (FFC) to connect flexible die-cutting circuit (FDC) to make a new flexible circuit board (Flexible flat cable connectflexible die-cut circuit, FCC). At present, the production process used for this new product is reflow soldering and high current pulse soldering.

[0004] However, the applicant found that the current process has the following defects: reflow soldering may have quality problems such as cold soldering, and due to the particularity of the process, the entire product needs to be passed through the furnace and the entire board needs to be welded, which will increase the product protection cost and tooling cost, and is not suitable for welding and manufacturing of products such as FCC; high-current pulse welding is a single-point local welding method. Although it is suitable for welding and manufacturing of products such as FCC, it leads to a long welding time and is easy to burn the insulator of FFC, which poses certain quality risks. At the same time, local single-point welding also increases the labor cost, which indirectly leads to an increase in processing costs.

[0005] Therefore, it is urgent to develop a new type of welding method and system for flexible circuit boards with good welding quality and low cost. Summary of the invention

[0006] The present application aims to solve one of the above technical problems at least to some extent.

[0007] To this end, the first purpose of the present application is to propose a novel welding method for a flexible circuit board with good welding quality and low cost.

[0008] The second purpose of this application is to provide a novel welding system for flexible circuit boards.

[0009] To achieve the above-mentioned purpose, the first aspect of the present application discloses a welding method for a new flexible circuit board, comprising the following steps: S100: opening a window in a flexible flat cable, or a film of a flexible flat cable, so that the conductor in the flexible flat cable is exposed at the window position; S200: applying solder paste at the window position of the flexible flat cable; S300: performing solder paste detection; detecting the height, volume, area, short circuit and offset of the solder paste, and compensating the relevant data information to the equipment of the subsequent steps to ensure accuracy; S400: pasting double-sided tape near the solder paste; S500: pasting and assembling a branch circuit board at the double-sided tape; S600: welding the branch circuit board to the flexible flat cable at the window position, thereby making a new flexible circuit board.

[0010] In addition, the novel welding method of the flexible circuit board according to the above technical solution of the present application may also have the following additional technical features: Optionally, during the coating process of step S200, visual positioning is adopted, and the three-axis platform is used to apply solder paste; when pasting and assembling the branch circuit board in step S500, visual positioning is adopted, and the welding position is automatically identified by target grabbing to perform precise assembly positioning; before welding in step S600, visual positioning is first adopted to guide the welding head to accurately position the welding area.

[0011] Optionally, the solder paste applied in step S200 is laser-specific solder paste; and the welding in step S600 is laser welding.

[0012] Optionally, before welding, step S600 also uses a rangefinder to measure distance, monitor the height position information of the product, and adjust the height of the welding head and the focal length of the laser welding.

[0013] Optionally, when welding is performed in step S600, the temperature at the welding position is monitored; when the monitored welding temperature deviates from the set temperature, the laser driver is driven to automatically compensate the power to adjust the laser welding temperature so that the actual welding temperature matches the set temperature.

[0014] To achieve the above-mentioned objectives, the second aspect of the present application proposes a new type of flexible circuit board welding system, including: a window opening module, used to open a window on a flexible flat cable, or a film of a flexible flat cable, so that the conductor in the flexible flat cable is exposed at the window opening position; a tinning module, used to apply solder paste at the window opening position of the flexible flat cable; a solder paste detection module, used to detect the height, volume, area, short circuit and offset of the solder paste, and compensate the relevant data information to the equipment of the subsequent steps to ensure accuracy; a glue sticking module, used to stick double-sided tape near the solder paste; a patch module, used to stick and assemble a branch circuit board at the double-sided tape; a welding module, used to weld the branch circuit board to the flexible flat cable at the window opening position, thereby making a new type of flexible circuit board.

[0015] Optionally, it also includes: a first visual positioning module arranged in the tinning module, which is used to be arranged in a three-axis platform in the tinning module, and visual positioning is adopted when the three-axis platform is carrying solder paste to apply; a second visual positioning module arranged in the patch module, which is used to adopt visual positioning when pasting and assembling branch circuit boards, automatically grasp the target to identify the welding position, and perform precise assembly positioning; a third visual positioning module arranged in the welding module, which is used to adopt visual positioning before welding, and guide the welding head to accurately position the welding area.

[0016] Optionally, it also includes: a laser-specific solder paste silo arranged in the tinning module, which is used to provide laser-specific solder paste when applying solder paste; a laser generator and a laser welding head arranged in the welding module, which are used to perform laser welding.

[0017] Optionally, it also includes: a rangefinder arranged in the welding module, which is used to measure the distance before welding, monitor the height position information of the product, and adjust the height of the welding head and the focal length of the laser welding.

[0018] Optionally, it also includes: a temperature monitoring module arranged in the welding module, which is used to monitor the temperature at the welding position during welding; when the monitored welding temperature deviates from the set temperature, the laser driver is driven to automatically compensate the power to adjust the laser welding temperature so that the actual welding temperature matches the set temperature.

[0019] The beneficial effects of the present application are: 1. No pollution in the production process; 2. High processing precision, and can ensure the welding quality and reliability of the product; 3. High production efficiency and low production cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a flow chart of a novel welding method for a flexible circuit board provided by an embodiment of the present application; Figure 2It is a structural block diagram of a novel welding system for a flexible circuit board provided by an embodiment of the present application; Figure 3 This is an equipment diagram of a novel flexible circuit board welding system provided in one embodiment of the present application. DETAILED DESCRIPTION

[0021] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or components / elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be construed as limiting the present application.

[0022] The following describes a novel welding method and system for a flexible circuit board according to an embodiment of the present application in conjunction with the accompanying drawings.

[0023] Figure 1 FIG. 1 is a flow chart of a novel method for welding a flexible circuit board provided by an embodiment of the present application. Figure 1 As shown, the welding method of the novel flexible circuit board includes the following steps: S100: opening a window on a flexible flat cable or a film of a flexible flat cable to expose the conductor in the flexible flat cable at the window opening position; S200: applying solder paste at the window opening position of the flexible flat cable; S300: performing solder paste detection; detecting the height, volume, area, short circuit and offset of the solder paste, and compensating the relevant data information to the equipment of the subsequent steps to ensure accuracy; S400: pasting double-sided tape near the solder paste; S500: pasting and assembling a branch circuit board at the double-sided tape; S600: welding the branch circuit board and the flexible flat cable at the window opening position to form a novel flexible circuit board.

[0024] Specifically, the branch circuit board is generally a flexible die-cutting circuit board (FDC), and in special cases it can also be a small flexible circuit board. The method of the present application is: using a flexible flat cable (FFC) as a substrate, punching holes and opening windows on the insulating film of the FFC, exposing part of the conductor, and forming a window portion (i.e., the window opening position); then welding a branch circuit board at the window portion, which can be specifically a flexible die-cut circuit board (FDC), to produce a new flexible circuit board of this embodiment. The applicant calls it FCC, and its full English name is Flexible flat cable connect flexible die-cut circuit, that is, FFC connected to FDC. The raw materials of the new flexible circuit board FCC do not use the traditional flexible circuit board FPC that needs to be manufactured through an etching process, and the production process does not require the use of chemically polluted processes, thereby ensuring that the new process flow and the products produced are green and environmentally friendly.

[0025] It should be noted that in the embodiments of the present application, the flexible flat cable used may be a finished product or a semi-finished product. Specifically, Figure 2 The window opening module and the tinning module are connected by a dotted line, which means that the two devices may not be directly connected; in the window opening process, a window can be opened on the finished flexible flat cable by a machine tool, that is, the surface film is removed to expose the internal conductor; the flexible flat cable can also be a semi-finished product, that is, the film of the flexible flat cable is punched out with a hole by a punching machine, and then the film coating process is performed to produce the finished flexible flat cable. This application requests protection for the window opening process step, which is one of the key steps in the production of FCC, and protects the production process of non-flexible flat cables.

[0026] After the window opening process is completed, the continuous production line is entered to perform steps S200-S600. Figure 3 As shown: Figure 3For some key step equipment, the outer cover is removed to show the internal assembly line and the parts being processed. The figure uses straight lines to connect them to show their connection relationship. First, the soldering machine on the upper left, step S200, the soldering machine applies solder paste everywhere at the window position; then enter the next equipment - solder paste detection equipment (Solder The assembly line then moves the workpiece to the next device, the double-sided adhesive sticking device, and performs step S400, which is used to stick double-sided adhesive near the position of the solder paste. The purpose of this double-sided adhesive is to fix the branch (i.e., FDC or small-sized FPC) to facilitate the assembly of the next process and stabilize the operation. The assembly line then moves the workpiece to the next device, the placement machine, and performs step S500, which is used to stick and assemble the branch circuit board at the double-sided adhesive. The branch circuit board is stuck with the double-sided adhesive of the previous process and accurately fixed in the correct position to ensure that no displacement occurs during the movement of the product or during the welding of the product. Finally, the assembly line moves the workpiece to the next device, the welding machine, and uses the welding head to melt the solder paste at the window position, so that the two materials of the branch circuit board and FFC can be reliably welded, thereby making a new type of flexible circuit board FCC.

[0027] According to the welding method of the novel flexible circuit board of the present application, there is no pollution in the production process; the SPI equipment ensures the processing accuracy, and cooperates with the double-sided tape and patch processes to ensure the welding quality and reliability of the product; the production efficiency is high and the production cost is low.

[0028] According to an embodiment of the present application, in the coating process of step S200, visual positioning is adopted, and the three-axis platform is used to apply solder paste; when pasting and assembling the branch circuit board in step S500, visual positioning is adopted, and the welding position is automatically identified by target grabbing to perform precise assembly positioning; before welding, in step S600, visual positioning is first adopted to guide the welding head to accurately position the welding area.

[0029] Specifically, visual positioning devices can be configured on tinning machines, chip mounters and welding machines to improve processing accuracy. Among them, step S500 uses the chip mounter assembly branch, and the chip mount process is equipped with a visual positioning system to automatically grasp the target to identify the welding position and perform precise assembly positioning.

[0030] According to an embodiment of the present application, the solder paste applied in step S200 is laser-specific solder paste; and the welding in step S600 is laser welding.

[0031] Specifically, since laser welding is a contactless type, there is no need to customize a dedicated welding head, which can save tooling costs and reduce the use of consumables. It has the advantages of high welding efficiency, guaranteed quality and efficiency, and lower manufacturing costs than reflow soldering and high-current pulse welding, making it mass-producible.

[0032] When using laser welding, a laser generator can be configured in the laser welding machine to drive the laser welding head. A semiconductor laser with a wavelength of 915nm and a power of 200W~300W can be used.

[0033] According to an embodiment of the present application, before welding, step S600 also uses a rangefinder to measure the distance, monitor the height position information of the product, and adjust the height of the welding head and the focal length of the laser welding.

[0034] Specifically, the laser welding machine uses a three-axis module to control the movement of the welding head on three coordinate axes. A rangefinder is provided to automatically monitor the height position of the product and automatically adjust the z-axis height to adapt to the focal length of the laser welding, thereby ensuring precise welding and preventing laser heating position errors that may damage the equipment or circuit boards.

[0035] According to one embodiment of the present application, when welding is performed in step S600, the temperature at the welding position is monitored; when the monitored welding temperature deviates from the set temperature, the laser driver is driven to automatically compensate the power to adjust the laser welding temperature so that the actual welding temperature matches the set temperature.

[0036] Specifically, an infrared temperature measuring device can be used to monitor the temperature, which can drive the power of the laser to achieve closed-loop control of the temperature, thereby ensuring a smooth welding process, ensuring welding quality, and improving product quality.

[0037] Based on the above embodiments, the embodiments of the present invention also provide a novel welding system for a flexible circuit board; Figure 2 is a structural block diagram of a novel flexible circuit board welding system provided by an embodiment of the present application. Figure 3 1 is a device diagram of a novel flexible circuit board welding system provided by an embodiment of the present application; Figure 2-3As shown: the welding system of the new flexible circuit board includes: a window opening module, which is used to open a window on the flexible flat cable, or the film of the flexible flat cable, so that the conductor in the flexible flat cable is exposed at the window opening position; a tinning module, which is used to apply solder paste at the window opening position of the flexible flat cable; a solder paste detection module, which is used to detect the height, volume, area, short circuit and offset of the solder paste, and compensate the relevant data information to the equipment of the subsequent steps to ensure accuracy; a glue sticking module, which is used to stick double-sided tape near the solder paste; a patch module, which sticks and assembles a branch circuit board at the double-sided tape; a welding module, which is used to weld the branch circuit board and the flexible flat cable at the window opening position, thereby making a new flexible circuit board.

[0038] According to one embodiment of the present application, it also includes: a first visual positioning module arranged in the tinning module, which is used to be arranged in a three-axis platform in the tinning module, and visual positioning is adopted when the three-axis platform is carrying solder paste to apply; a second visual positioning module arranged in the patch module, which is used to adopt visual positioning when pasting and assembling branch circuit boards, automatically grasp the target to identify the welding position, and perform precise assembly positioning; a third visual positioning module arranged in the welding module, which is used to adopt visual positioning before welding, and guide the welding head to accurately position the welding area.

[0039] According to one embodiment of the present application, it also includes: a laser-specific solder paste silo arranged in the tinning module, which is used to provide laser-specific solder paste when applying solder paste; a laser generator and a laser welding head arranged in the welding module, which are used to perform laser welding.

[0040] According to one embodiment of the present application, it also includes: a rangefinder arranged in the welding module, which is used to measure the distance before welding, monitor the height position information of the product, and adjust the height of the welding head and the focal length of the laser welding.

[0041] According to one embodiment of the present application, it also includes: a temperature monitoring module arranged in the welding module, which is used to monitor the temperature at the welding position during welding; when the monitored welding temperature deviates from the set temperature, the laser driver is driven to automatically compensate the power to adjust the laser welding temperature so that the actual welding temperature matches the set temperature.

[0042] According to a novel welding system for a flexible circuit board of the present application, there is no pollution in the production process; the SPI equipment ensures the processing accuracy, and cooperates with the double-sided tape and patch processes to ensure the welding quality and reliability of the product; the production efficiency is high and the production cost is low.

[0043] The above embodiments are preferred implementation schemes of the present application. In addition, the present application may also be implemented in other ways. Any obvious replacement without departing from the concept of the present application is within the protection scope of the present application.

Claims

1. A novel welding method for a flexible circuit board, characterized in that: The following steps are involved: S100: opening a window in the flexible flat cable or a film of the flexible flat cable so that the conductor in the flexible flat cable is exposed at the window opening position; S200: applying solder paste at the window opening position of the flexible flat cable; S300: Perform solder paste inspection; inspect the height, volume, area, short circuit and offset of the solder paste, and compensate the relevant data information to the equipment in the subsequent steps to ensure accuracy; S400: applying double-sided tape near the solder paste; S500: Paste and assemble the branch circuit board on the double-sided tape; S600: welding the branch circuit board and the flexible flat cable at the window opening position to manufacture a new type of flexible circuit board.

2. The novel welding method of flexible circuit board according to claim 1, characterized in that: During the coating process of step S200, visual positioning is adopted, and the three-axis platform is used to apply solder paste; When the branch circuit board is pasted and assembled in step S500, visual positioning is adopted to automatically grasp the target and identify the welding position, so as to perform accurate assembly positioning; In step S600, before welding, visual positioning is used to guide the welding head to accurately position the welding area.

3. The welding method of a novel flexible circuit board according to claim 1 is characterized in that: The solder paste applied in step S200 is laser-specific solder paste; the welding in step S600 is laser welding.

4. The novel welding method of flexible circuit board according to claim 3 is characterized in that: In step S600, before welding, a distance meter is used to measure the distance, monitor the height position information of the product, and adjust the height of the welding head and the focal length of the laser welding.

5. The novel welding method of a flexible circuit board according to claim 3 is characterized in that: When welding is performed in step S600, the temperature at the welding position is monitored; when the monitored welding temperature deviates from the set temperature, the laser driver is driven to automatically compensate the power to adjust the laser welding temperature so that the actual welding temperature matches the set temperature.

6. A novel welding system for flexible circuit boards, characterized in that: include: A window opening module is used to open a window on the flexible flat cable or the film of the flexible flat cable so that the conductor in the flexible flat cable is exposed at the window opening position; A tinning module, used for applying solder paste at the window opening position of the flexible flat cable; Solder paste detection module, used to detect the height, volume, area, short circuit and offset of solder paste, and compensate the relevant data information to the equipment in the subsequent steps to ensure accuracy; A glue sticking module, used for sticking double-sided tape near the solder paste; For patch module, assemble the branch circuit board by sticking it on the double-sided tape; The welding module is used to weld the branch circuit board and the flexible flat cable at the window opening position, so as to manufacture a new type of flexible circuit board.

7. A novel welding system for a flexible printed circuit board according to claim 6, characterized in that: Also includes: A first visual positioning module is provided in the tinning module, and is used to be provided in a three-axis platform in the tinning module, and visual positioning is adopted when the three-axis platform is used to apply the tin paste; The second visual positioning module provided in the patch module is used to adopt visual positioning, automatically grasp the target to identify the welding position, and perform accurate assembly positioning when pasting and assembling the branch circuit board; The third visual positioning module arranged in the welding module is used to use visual positioning before welding to guide the welding head to accurately position the welding area.

8. The novel welding system for flexible printed circuit board according to claim 6 is characterized in that: Also includes: A laser-specific solder paste silo provided in the tinning module is used to provide laser-specific solder paste when applying the solder paste; The laser generator and the laser welding head arranged in the welding module are used for laser welding.

9. The novel welding system for flexible printed circuit board according to claim 8 is characterized in that: Also includes: The rangefinder arranged in the welding module is used to measure the distance before welding, monitor the height position information of the product, and adjust the height of the welding head and the focal length of the laser welding.

10. The novel welding system for flexible printed circuit board according to claim 8, characterized in that: Also includes: The temperature monitoring module arranged in the welding module is used to monitor the temperature at the welding position during welding; when the monitored welding temperature deviates from the set temperature, the laser driver is driven to automatically compensate the power to adjust the laser welding temperature so that the actual welding temperature matches the set temperature.

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