Semiconductor wafer processing system

Abstract

The invention provides a processing system of a semiconductor wafer, which can restrain increase of cost even under the condition that a plurality of processing devices are arranged. In a semiconductor wafer processing system (1) in which a plurality of processing devices (10) are arranged in an X-axis direction, which is one direction, each processing device (10) includes: a holding table that holds a semiconductor wafer; and a processing unit (30) for processing the semiconductor wafer held by the holding table, the plurality of processing devices (10) being operated by a common monitor (110) and being controlled by a common control unit (100).

Description

Technical Field

[0001] The present invention relates to a semiconductor wafer processing system. Background Art

[0002] The processing system is configured to include: a processing device including a holding stage and a processing unit; a control unit; and a monitor (for example, refer to Patent Document 1).

[0003] Patent Document 1: Japanese Patent Application Publication No. 2021-002256

[0004] If a plurality of processing devices such as those disclosed in Patent Document 1 are provided, costs will be incurred. Summary of the invention

[0005] An object of the present invention is to provide a semiconductor wafer processing system capable of suppressing a cost increase even when a plurality of processing devices are provided.

[0006] In order to solve the above-mentioned problems and achieve the purpose, the semiconductor chip processing system of the present invention is characterized in that a plurality of processing devices are arranged in one direction, and the processing device includes: a holding workbench, which holds the semiconductor wafer; and a processing unit, which processes the semiconductor wafer held by the holding workbench, and the plurality of processing devices are operated through a common monitor and controlled by a common control unit.

[0007] The semiconductor wafer processing system may further include a cover extending along the one direction to cover the plurality of processing devices.

[0008] In the semiconductor wafer processing system, the processing unit can perform at least any one of processing, cleaning, film formation, inspection, imaging, attachment of a supporting member, and detachment of a supporting member on the semiconductor wafer.

[0009] In the above-mentioned semiconductor chip processing system, the processing unit may include: a spindle that is capable of rotating; a mounting seat that is fixed to the front end of the spindle; and a processing tool that is supported on the mounting seat to process the semiconductor chip, and the processing tool is at least any one of a cutting tool, a turning tool blade, a grinding wheel, and a polishing pad.

[0010] In the semiconductor wafer processing system, the processing unit may be a laser beam irradiation unit that irradiates the semiconductor wafer with laser beam.

[0011] The present invention has an effect of being able to suppress a cost increase even when a plurality of processing devices are installed. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1This is a perspective view schematically showing a configuration example of a semiconductor wafer processing system according to the first embodiment.

[0013] Figure 2 It is schematically shown Figure 1 A perspective view of a configuration example of a processing device in a semiconductor wafer processing system shown.

[0014] Figure 3 It is schematically shown Figure 2 A side view of a structural example of a processing unit of a processing device shown in FIG.

[0015] Figure 4 It is shown Figure 1 FIG. 1 is a front view of a display example of a monitor of a semiconductor wafer processing system shown.

[0016] Figure 5 This is a plan view schematically showing the interior of a processing chamber cover of a semiconductor wafer processing system according to a second embodiment.

[0017] Figure 6 It is a schematic diagram to show Figure 5 A plan view of an example of a semiconductor wafer processing system holding a movable stage is shown.

[0018] Figure 7 The partial cross section schematically shows the use of Figure 5 The illustrated embodiment is a front view of an example in which a processing unit of any processing device of a processing system for processing a semiconductor wafer performs cutting processing.

[0019] Figure 8 The partial cross section schematically shows the use of Figure 5 The illustrated semiconductor wafer processing system is a front view of an example in which a processing unit of any other processing device performs cutting processing.

[0020] Description of symbols

[0021] 1: semiconductor wafer processing system; 2: cover; 10: processing device; 20: holding table; 30: processing unit; 31: cutting tool (processing tool); 33: spindle; 34: mounting seat; 100: control unit; 110: monitor; 200: semiconductor wafer; 205: belt (supporting member); X: one direction. DETAILED DESCRIPTION

[0022] The mode (embodiment) for implementing the present invention is described in detail with reference to the accompanying drawings. The present invention is not limited to the contents described in the following embodiments. In addition, the constituent elements described below include elements that can be easily thought of by those skilled in the art, and substantially the same elements. Moreover, the structures described below can be appropriately combined. In addition, various omissions, substitutions or changes in the structure can be made within the scope of the gist of the present invention.

[0023] [Implementation method 1]

[0024] A semiconductor wafer processing system according to a first embodiment of the present invention will be described with reference to the drawings. Figure 1 This is a perspective view schematically showing a configuration example of a semiconductor wafer processing system according to the first embodiment. Figure 2 It is schematically shown Figure 1 A perspective view of a configuration example of a processing device in a semiconductor wafer processing system shown. Figure 3 It is schematically shown Figure 2 A side view of a structural example of a processing unit of a processing device shown in FIG. Figure 4 It is shown Figure 1 FIG. 1 is a front view of a display example of a monitor of a semiconductor wafer processing system shown.

[0025] (Semiconductor wafer processing system)

[0026] like Figure 1 As shown, the semiconductor wafer processing system 1 has a plurality of processing devices 10, a control unit 100, a monitor 110 and an input unit 120. The processing device 10 is a Figure 2 The device for processing the semiconductor wafer 200 shown in the first embodiment is a processing device for cutting the semiconductor wafer 200 .

[0027] In the first embodiment, the semiconductor wafer 200 to be processed by the processing device 10 is formed into a disk shape using silicon or gallium as a substrate, and a device 203 is formed in a grid-shaped area divided by a plurality of predetermined dividing lines 202 formed in a grid shape on the front side 201. The device 203 is, for example, an integrated circuit such as an IC (Integrated Circuit) or an LSI (LargeScale Integration), or a semiconductor memory (semiconductor storage device). In the first embodiment, the back side 204 of the semiconductor wafer 200 is attached to the central part of a belt 205, which is a disk shape with a larger outer diameter than the semiconductor wafer 200 and has a ring frame 206 attached to the outer edge of the belt 205, and the semiconductor wafer 200 is cut by the processing device 10.

[0028] like Figure 2As shown, the processing device 10 includes: a holding table 20, which uses a holding surface 21 to attract and hold the semiconductor wafer 200; a processing unit 30, which processes the semiconductor wafer 200 held by the holding table 20; and a photographing unit 40, which photographs the semiconductor wafer 200 held by the holding table 20. Figure 2 As shown, the processing device 10 includes a moving unit 50 that moves the holding table 20 and the processing unit 30 relatively.

[0029] The moving unit 50 includes: an X-axis moving unit 51, which holds the worktable 20 for processing and feeding in the X-axis direction parallel to the horizontal direction; a Y-axis moving unit 52, which indexes and feeds the processing unit 30 in the Y-axis direction parallel to the horizontal direction and perpendicular to the X-axis direction; a Z-axis moving unit 53, which cuts and feeds the processing unit 30 in the Z-axis direction parallel to the vertical direction, and the vertical direction is perpendicular to both the X-axis direction and the Y-axis direction; and a rotation moving unit 54, which rotates the holding worktable 20 around an axis parallel to the Z-axis direction.

[0030] The X-axis moving unit 51 moves the holding table 20 in the X-axis direction as the processing and feeding direction, thereby relatively processing and feeding the holding table 20 and the processing unit 30 along the X-axis direction. The X-axis moving unit 51 is provided in the apparatus body 11.

[0031] The Y-axis moving unit 52 moves the processing unit 30 in the Y-axis direction as the indexing feeding direction, thereby indexing the holding table 20 and the processing unit 30 relatively along the Y-axis direction. The Y-axis moving unit 52 is provided on a gate-shaped support frame 12 erected from the apparatus body 11.

[0032] The Z-axis moving unit 53 moves the processing unit 30 in the Z-axis direction as the cutting feed direction, thereby cutting and feeding the holding table 20 and the processing unit 30 relatively along the Z-axis direction. The Z-axis moving unit 53 is provided on the moving frame 13 that moves in the Y-axis direction by the Y-axis moving unit 52. The rotation moving unit 54 is supported by the X-axis moving unit 51, supports the holding table 20, and is arranged to be movable in the X-axis direction together with the holding table 20.

[0033] The X-axis moving unit 51, the Y-axis moving unit 52, and the Z-axis moving unit 53 include: a known ball screw rotatably arranged around the axis; a known motor that rotates the ball screw around the axis; and a known guide rail that supports the holding table 20 or the processing unit 30 to be movable in the X-axis direction, the Y-axis direction, or the Z-axis direction. The rotation moving unit 54 includes a motor that rotates the holding table 20 around the axis, etc.

[0034] The holding table 20 is in the shape of a disk, and a holding surface 21 for holding the semiconductor wafer 200 is formed of porous ceramics, etc. In addition, the holding table 20 is provided to be freely movable along the X-axis direction between the processing area below the processing unit 30 and the loading and unloading area away from the bottom of the processing unit 30 to load and unload the semiconductor wafer 200, and is provided to be freely rotatable around an axis parallel to the Z-axis direction by a rotational moving unit 54.

[0035] The holding table 20 is connected to a vacuum suction source (not shown) and is sucked by the vacuum suction source to suck and hold the semiconductor wafer 200 placed on the holding surface 21. In the first embodiment, the holding table 20 sucks and holds the back side 204 of the semiconductor wafer 200 via the belt 205. Figure 2 As shown, a plurality of clamping parts 22 for clamping the annular frame 206 are arranged around the holding table 20 .

[0036] In the first embodiment, the processing unit 30 is a cutting unit that performs cutting processing on the semiconductor wafer 200 held by the holding table 20 using the cutting tool 31. The processing unit 30 is provided to be movable in the Y-axis direction relative to the semiconductor wafer 200 held by the holding table 20 by the Y-axis moving unit 52, and is provided to be movable in the Z-axis direction by the Z-axis moving unit 53.

[0037] The processing unit 30 is installed on the gate-shaped support frame 12 erected from the device body 11 by means of the Y-axis moving unit 52, the Z-axis moving unit 53, etc. The processing unit 30 can position the cutting tool 31 at any position of the holding surface 21 of the holding table 20 by means of the Y-axis moving unit 52 and the Z-axis moving unit 53, respectively.

[0038] like Figure 2 and Figure 3 As shown, the processing unit 30 includes: a spindle housing 32, which is configured to be movable in the Y-axis direction and the Z-axis direction by means of a Y-axis moving unit 52 and a Z-axis moving unit 53; a spindle 33 (only Figure 3 ), which is supported by the spindle housing 32 in a manner that it can rotate freely around an axis parallel to the Y-axis direction, and is rotated around the axis by a spindle motor not shown; the mounting seat 34 (only in Figure 3 and a cutting tool 31 as a processing tool, which is supported by a mounting seat 34 and mounted on the front end of the spindle 33, and the semiconductor wafer 200 is cut.

[0039] The cutting tool 31 is an extremely thin cutting tool having a roughly annular shape. In the first embodiment, the cutting tool 31 has: an annular cutting blade that cuts the semiconductor wafer 200; and an annular ring base that supports the cutting blade at the outer edge and is detachably mounted on the spindle 23. The cutting blade has abrasive grains such as diamond or CBN (Cubic Bon Nitride) and a bonding material (bonding material) such as metal or resin. In addition, in the present invention, the cutting tool 31 may also be a so-called washer tool consisting only of a cutting blade.

[0040] The spindle housing 32 is supported by the Z-axis moving unit 53 so as to be movable in the Z-axis direction, and is supported by the Y-axis moving unit 52 so as to be movable in the Y-axis direction via the Z-axis moving unit 53. The spindle housing 32 accommodates the portion of the spindle 23 other than the front end portion and the spindle motor (not shown), etc., and supports the spindle 23 so as to be rotatable about the axis.

[0041] The cutting tool 31 is fixed to the front end of the spindle 23. The spindle 23 is rotated by a spindle motor (not shown), and the front end protrudes from the front end surface of the spindle housing 32. The front end of the spindle 23 is formed to gradually taper toward the front end, and the cutting tool 31 is mounted via a mounting seat 34.

[0042] The axes of the spindle 23 of the processing unit 30 and the cutting tool 31 are set to be parallel to the Y-axis direction.

[0043] The imaging unit 40 is fixed to the processing unit 30 so as to move integrally with the processing unit 30. The imaging unit 40 has an imaging element for imaging the area to be divided of the semiconductor wafer 200 held by the holding table 20 before cutting. The imaging element is, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (Complementary MOS) imaging element. The imaging unit 40 images the semiconductor wafer 200 held by the holding table 20, obtains an image for performing alignment, etc., of the semiconductor wafer 200 and the cutting tool 31, and outputs the obtained image to the control unit 100.

[0044] In addition, the processing device 10 has: an X-axis direction position detection unit (not shown) for detecting the position of the holding table 20 in the X-axis direction; a Y-axis direction position detection unit (not shown) for detecting the position of the processing unit 30 in the Y-axis direction; and a Z-axis direction position detection unit for detecting the position of the processing unit 30 in the Z-axis direction. The X-axis direction position detection unit and the Y-axis direction position detection unit can be composed of a linear scale and a reading head parallel to the X-axis direction or the Y-axis direction.

[0045] In addition, the Z-axis direction position detection unit detects the Z-axis direction position of the processing unit 30 using the pulse of the motor of the Z-axis moving unit 53. The X-axis direction position detection unit, the Y-axis direction position detection unit, and the Z-axis direction position detection unit detect the X-axis direction position of the holding table 20, the Y-axis direction or Z-axis direction position of the lower end of the cutting edge of the cutting tool 31 of the processing unit 30, and output the detection results to the control unit 100. In addition, in the first embodiment, the X-axis direction, Y-axis direction, and Z-axis direction positions of the components of the processing device 10 are determined at positions based on a predetermined reference position (not shown). Among them, the Z-axis direction reference position is the position of the processing unit 30 when the lower end of the cutting edge of the cutting tool 31 and the holding surface 21 are located on the same plane.

[0046] The processing conditions of the processing device 10 of the above structure are registered in the control unit 100 by the operator, etc., and the semiconductor wafer 200 before cutting is placed on the holding surface 21 of the holding table 20. When the control unit 100 receives the start instruction of the processing operation from the operator, the processing operation is started. In the first embodiment, during the processing operation, the control unit 100 sucks and holds the back side 204 of the semiconductor wafer 200 on the holding surface 21 of the holding table 20 via the belt 205, and clamps the annular frame 206 with the clamping part 22.

[0047] In the first embodiment, during the processing operation, the control unit 100 rotates the spindle 23 about the axis, controls the moving unit 50 to move the holding table 20 toward the processing area, and the imaging unit 40 images the semiconductor wafer 200, and performs alignment based on the image captured by the imaging unit 40. In the first embodiment, during the processing operation, the control unit 100 controls the moving unit 50 and the cutting unit 20, etc., and moves the semiconductor wafer 200 and the processing unit 30 relatively along the predetermined dividing lines 202, while causing the cutting tool 31 to cut into each predetermined dividing line 202 to divide the semiconductor wafer 200 into individual devices 203.

[0048] In embodiment 1, during the processing operation, when the processing device 10 cuts all the predetermined dividing lines of the semiconductor wafer 200, the control unit 100 controls the moving unit 50 to move the holding workbench 20 to the loading and unloading area, and the control unit 100 stops the suction and holding of the holding workbench 20 to end the processing operation.

[0049] In the first embodiment, a semiconductor wafer processing system 1 is provided with a plurality of (four in the first embodiment) processing devices 10 arranged in the X-axis direction as one direction. The semiconductor wafer processing system 1 of the first embodiment further includes a cover 2 covering the plurality of processing devices 10. Figure 1As shown, the cover 2 has two first cover parts 3 formed in a flat plate shape and extending in the X-axis direction over at least two or more processing devices 10, and two second cover parts 4 connecting the two edges of the two first cover parts 3 in the X-axis direction, and the cover 2 covers the lower part of the device body 11 of the plurality of processing devices 10. In addition, regarding the cover 2, all the processing devices 10 can be covered by one cover 2, which can reduce costs, but at least two or more processing devices 10 can be covered by one cover 2 and a plurality of covers 2 can be connected to each other. In this case, the number of covers 2 can be reduced and costs can be reduced compared to the conventional design of providing one cover 2 for one processing device 10.

[0050] In addition, in the semiconductor wafer processing system 1 in the first embodiment, the upper part of the apparatus main body 11 of each processing device 10, that is, the processing area and the loading and unloading area are covered by the processing chamber cover 5, and the upper part of the apparatus main body 11 of the processing device 10 is partitioned by the partition plate 6. Therefore, in the first embodiment, the holding table 20 is moved in the X-axis direction on the apparatus main body 11 of each processing device 10, and the holding table 20 is restricted from moving across the apparatus main bodies 11 of a plurality of processing devices 10. In addition, in the first embodiment, each processing area of ​​the semiconductor wafer processing system 1 is connected to a duct for exhaust (not shown).

[0051] The control unit 100 controls each component of the plurality of processing devices 10 respectively, so that the processing devices 10 perform processing operations on the semiconductor wafer 200. That is, in the first embodiment, the plurality of processing devices 10 are controlled by the common control unit 100. In addition, the control unit 100 is a computer having an operation processing device and an input / output interface device, the operation processing device having a microprocessor such as a CPU (central processing unit), and the storage device having a memory such as a ROM (read only memory) or a RAM (random access memory). The operation processing device of the control unit 100 performs operation processing according to a computer program stored in the storage device, and outputs a control signal for controlling each processing device 10 to each component of each processing device 10 via the input / output interface device.

[0052] The monitor 110 is a display unit composed of a liquid crystal display device or the like that displays the state of processing operation, images, etc. The monitor 110 can display a menu for selecting any processing device 10 among the plurality of processing devices 10. Figure 4 The selection screen 111 illustrated in FIG. 1 and the device screen for setting various information and processing conditions of the processing device 10 selected through the selection screen 111 are shown in FIG. Figure 4In the selection screen 111 shown, the processing devices 10 are indicated by reference numerals 10 - 1 , 10 - 2 , 10 - 3 , and 10 - 4 .

[0053] The input unit 120 is used by the operator to register processing conditions, etc. In the first embodiment, the input unit 120 is composed of a touch panel provided on the monitor 110. The input unit 120 can be operated, for example, Figure 4 The selection screen 111 shown in the figure is used to select any one of the processing devices 10-1, 10-2, 10-3, and 10-4. Figure 4 The selection screen 111 shown shows an example in which a processing device 10 represented by a mesh is selected. In this way, in the first embodiment, a plurality of processing devices 10 are operated through one input unit 120 provided on one monitor 110 .

[0054] Furthermore, the semiconductor wafer processing system 1 includes a notification unit 130 that emits at least one of sound and light to notify the operator.

[0055] In the semiconductor wafer processing system 1 of the first embodiment described above, the plurality of processing devices 10 are operated by the common monitor 110 and controlled by the common control unit 100 , thereby achieving the effect of suppressing cost increase even when the plurality of processing devices 10 are provided.

[0056] In the semiconductor wafer processing system 1 of the first embodiment, a plurality of processing devices 10 are arranged in the X-axis direction, and the plurality of processing devices 10 are not covered with individual covers but are covered with one cover 2, thereby achieving low cost.

[0057] In addition, when a plurality of independent processing devices 10 are arranged in a row, gaps are required between the processing devices 10, but the semiconductor wafer processing system 1 of embodiment 1 only has partitions 6 between the processing devices 10, so that the installation area can be reduced compared to the independent processing devices 10 that are adjacently arranged.

[0058] [Implementation method 2]

[0059] A semiconductor wafer processing system according to a second embodiment will be described with reference to the drawings. Figure 5 This is a plan view schematically showing the interior of a processing chamber cover of a semiconductor wafer processing system according to a second embodiment. Figure 6 It is a schematic diagram to show Figure 5 A plan view of an example of a semiconductor wafer processing system holding a movable stage is shown. Figure 7 The partial cross section schematically shows the use of Figure 5The illustrated embodiment is a front view of an example in which a processing unit of any processing device of a processing system for processing a semiconductor wafer performs cutting processing. Figure 8 The partial cross section schematically shows the use of Figure 5 The illustrated semiconductor wafer processing system is a front view of an example in which a processing unit of any other processing device performs cutting processing. Figure 5 , Figure 6 , Figure 7 as well as Figure 8 The same reference numerals are used to denote the same components as those in Embodiment 1, and description thereof will be omitted.

[0060] like Figure 5 and Figure 6 As shown, in the semiconductor wafer processing system 1 of the second embodiment, an opening 7 through which the holding table 20 can pass is provided on the partition plate 6, and the holding tables 20 of all the processing devices 10 are arranged to be freely movable in the X-axis direction according to each X-axis moving unit 51 and the rotation moving unit 54 by a common axis motor 55, allowing each holding table 20 to move across the device body 11 of a plurality of processing devices 10. That is, as Figure 6 As shown, the semiconductor wafer processing system 1 of the second embodiment can position a plurality of holding tables 20 on any device body 11 among a plurality of processing devices 10 , and can perform cutting processing on the semiconductor wafers 200 held by the plurality of holding tables 20 by any processing unit 30 .

[0061] In addition, the axis motor 55 is formed linearly along the X-axis direction on the device body 11 of the plurality of processing devices 10, and the axis motor 55 includes: a transmission shaft 56, which is composed of a plurality of magnets in which N poles are joined to each other and S poles are joined to each other; and a slider 57, which is fixed to the X-axis moving unit 51 that supports each holding table 20 to be movable in the X-axis direction and has a built-in coil, and the transmission shaft 56 passes through the inner side of the slider 57. The axis motor 55 supplies current to the coil of the slider 57, so that each holding table 20 moves independently along the length direction of the transmission shaft 56.

[0062] In addition, in the semiconductor wafer processing system 1 of the second embodiment, it is possible to use the cutting tool 31 of any processing unit 30 in the plurality of processing devices 10 as shown in FIG. Figure 7 After the substrate of the semiconductor wafer 200 is cut to the center in the thickness direction to form the cutting groove 207 as shown in FIG. 1 , the cutting tool 31 of any other processing unit 30 is used as shown in FIG. Figure 8 The bottom of the cutting groove 207 is cut as shown. That is, the semiconductor wafer processing system of the second embodiment can be as follows. Figure 7 and Figure 8As shown, the semiconductor wafer 200 is divided into individual devices 203 by performing so-called step processing.

[0063] In the semiconductor wafer processing system 1 of the second embodiment, a plurality of processing devices 10 are operated by a common monitor 110 and controlled by a common control unit 100. Therefore, similar to the first embodiment, it is possible to suppress cost increases even when a plurality of processing devices 10 are provided.

[0064] In addition, the present invention is not limited to the above-mentioned embodiment. That is, it can be implemented in various modifications within the scope of the main purpose of the present invention. For example, the processing unit 30 is not limited to a cutting unit, and can also be a processing unit that performs lathe cutting, grinding, lapping, cleaning, film formation, inspection, photography, sticking of supporting parts such as tapes, and peeling of supporting parts such as tapes on the semiconductor wafer 200. In this way, in the present invention, the processing unit 30 performs at least any one of processing, cleaning, film formation, inspection, photography, sticking of supporting parts, and peeling of supporting parts.

[0065] That is, in the present invention, the processing unit 30 can be any processing unit of different types, such as an inspection unit that performs arbitrary inspection on the workpiece, a photographing unit, a tape sticking machine that sticks a tape to the workpiece, a tape peeling machine, a protective film forming unit that forms a protective film such as a resin on the workpiece, etc.

[0066] In addition, in the present invention, the processing unit 30 can be a laser light irradiation unit that irradiates a laser light with a transmissive or absorptive wavelength onto the semiconductor chip 200, or it can be a processing unit that provides a processing medium such as liquid or gas, such as a high-pressure water cleaning nozzle that sprays pressurized liquid onto the semiconductor chip 200, or a plasma generating source.

[0067] In addition, in the present invention, the processing tool of the processing unit 30 is not limited to the cutting tool 31, and can also be a turning tool, a grinding wheel, a grinding pad, etc. Thus, in the present invention, the processing tool can be at least any one of the cutting tool 31, a turning tool blade, a grinding wheel, and a grinding pad.

Claims

1. A semiconductor wafer processing system, in, Multiple processing devices are arranged in a row in one direction. The processing device comprises: a holding stage that holds a semiconductor wafer; and a processing unit for processing the semiconductor wafer held by the holding table, The plurality of processing devices are operated through a common monitor and controlled by a common control unit.

2. The semiconductor wafer processing system according to claim 1, in, The semiconductor wafer processing system also has a cover, which extends along the one direction and covers the plurality of processing devices.

3. The semiconductor wafer processing system according to claim 1 or 2, in, The processing unit performs at least any one of processing, cleaning, film formation, inspection, imaging, attachment of a supporting member, and detachment of a supporting member on a semiconductor wafer.

4. The semiconductor wafer processing system according to claim 1 or 2, in, The processing unit contains: a main shaft, which is capable of rotating; A mounting seat fixed to the front end of the spindle; and A processing tool is supported by the mounting seat and processes the semiconductor wafer. The processing tool is at least one of a cutting tool, a turning blade, a grinding wheel, and a polishing pad.

5. The semiconductor wafer processing system according to claim 1 or 2, in, The processing unit is a laser beam irradiation unit that irradiates a semiconductor wafer with a laser beam.

Images