Heat dissipation pad with noise reduction mechanism
By integrating the noise reduction module of the active noise reduction controller, speaker and microphone in the heat dissipation pad, it processes and offsets the noise generated by the heat dissipation fan, and solves the noise problem of the heat dissipation pad and achieves a quieter heat dissipation effect.
Patent Information
- Application Number
- CN202310681951.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-06-09
- Publication Date
- 2024-12-10
AI Technical Summary
When existing heat dissipation pads use cooling fans for heat dissipation, they will generate a lot of noise, affecting the user experience.
A cooling pad with a noise reduction mechanism is designed. By setting up a noise reduction module of an active noise reduction controller, speaker and microphone in the housing chamber, the noise reduction controller is used to process the noise signal generated by the cooling fan and pass through the speaker. Inverting noise signals are emitted to cancel the noise, combined with the support assembly allows the microphone to detect the noise source more accurately.
It effectively reduces the noise during the operation of the cooling fan, provides a quieter use environment, and adapts to different usage needs through the adjustment of the supporting components.
Smart Images

Figure CN119105632A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of a heat dissipation pad, and in particular to a heat dissipation pad with a noise reduction mechanism. Background Art
[0002] Computers have become an indispensable product for modern people to handle work affairs. In order to achieve more functions, the electronic components used are becoming more and more complex and more numerous. This will generate heat and become the so-called heat source. With the increase of processing data and the increase of speed, the heat generated will also increase greatly. Therefore, if the aforementioned heat is not removed effectively, it will increase the working environment temperature of the computer and its internal electronic components, which will relatively deteriorate its performance. In severe cases, it may even damage the electronic components or cause the computer to crash.
[0003] In order to solve the above problems, the industry has developed products such as cooling pads for notebook computers. The main purpose of the cooling pads is to install a cooling fan inside the cooling pads to blow away the heat generated by the electronic heat source, thereby achieving the purpose of heat dissipation. Among them, speeding up the speed of the cooling fan to provide a large amount of airflow is the simplest and most economical method. However, this method generates a lot of noise. Summary of the invention
[0004] An object of the present invention is to provide a heat dissipation pad with a noise reduction mechanism, which can overcome the disturbing noise generated by the operation of the heat dissipation fan by setting a noise reduction module.
[0005] In order to achieve the above-mentioned objectives, the present invention provides a heat dissipation pad with a noise reduction mechanism, comprising a base, at least one heat dissipation fan and a noise reduction module, the base comprising a receiving seat and a accommodating chamber formed inside the receiving seat, the receiving seat being provided with a plurality of ventilation holes communicating with the accommodating chamber; the heat dissipation fan being arranged in the accommodating chamber and corresponding to each of the ventilation holes; the noise reduction module being arranged in the accommodating chamber, the noise reduction module comprising an active noise reduction controller, a speaker electrically connected to the active noise reduction controller and a microphone electrically connected to the active noise reduction controller; wherein after receiving the noise emitted by the heat dissipation fan, the microphone, through the operation and transmission signal of the active noise reduction controller, emits a noise reduction sound from the speaker that can offset the noise of the heat dissipation fan.
[0006] As a heat dissipation pad with a noise reduction mechanism of the present invention, the noise reduction module also includes a circuit board, and the active noise reduction controller, the speaker and the microphone are electrically connected through the circuit board.
[0007] As a heat dissipation pad with a noise reduction mechanism of the present invention, the circuit board is electrically connected to the heat dissipation fan.
[0008] As a heat dissipation pad with a noise reduction mechanism of the present invention, the noise reduction module also includes a circuit board and a conductive wire, the active noise reduction controller and the speaker are fixed on the circuit board, and the microphone is electrically connected to the circuit board through the conductive wire and is located on one side of the heat dissipation fan.
[0009] As a heat dissipation pad with a noise reduction mechanism of the present invention, the noise reduction module also includes a circuit board and a plurality of conductive wires. The number of microphones is plural, and each of the microphones is electrically connected to the circuit board through each of the conductive wires.
[0010] As a heat dissipation pad with a noise reduction mechanism of the present invention, the microphone includes a reference microphone and an error microphone.
[0011] As a heat dissipation pad with a noise reduction mechanism of the present invention, the base also includes a lower plate, the receiving seat has an upper plate and a surrounding plate bent and extended from the upper plate, the lower plate is connected to the surrounding plate, and the accommodating chamber is formed between the receiving seat and the lower plate.
[0012] As a heat dissipation pad with a noise reduction mechanism of the present invention, the lower plate is provided with a plurality of through grooves communicating with the accommodating chamber.
[0013] The heat dissipation pad with a noise reduction mechanism of the present invention further includes a support assembly, one end of which is pivotally connected to one side of the base, and the other end of which can be bent to abut against the other side of the base.
[0014] As a heat dissipation pad with a noise reduction mechanism of the present invention, the lower plate is provided with a plurality of protrusions, and the support assembly includes a first support member and a second support member, the two ends of the first support member are respectively pivotally connected to the base and one end of the second support member, and the other end of the second support member can be selectively stopped at one of the protrusions.
[0015] The present invention also has the following effects: by separating the microphone from the active noise reduction controller and the speaker, the microphone can be arranged adjacent to the cooling fan, thereby more accurately detecting the noise source and implementing countermeasures. By setting the supporting component, the base can be adjusted to different elevation angles according to the needs of the user. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is a cross-sectional view of the heat dissipation pad assembly with a noise reduction mechanism of the present invention.
[0017] Figure 2 It is a combined cross-sectional view of the heat dissipation pad with a noise reduction mechanism of the present invention from another direction.
[0018] Figure 3It is a block diagram of the noise reduction module and the heat dissipation fan of the present invention.
[0019] Figure 4 It is a combined cross-sectional view of another embodiment of the present invention.
[0020] Figure 5 It is a combined cross-sectional view of yet another embodiment of the present invention.
[0021] In the figure: 10: base; 11: receiving seat; 111: upper plate; 112: ventilation hole; 113: enclosure; 12: lower plate; 121: through groove; 122: convex body; 13: accommodating chamber; 20: cooling fan; 30, 30A, 30B: noise reduction module; 31: active noise reduction controller; 32: speaker; 33: microphone; 331: reference microphone; 332: error microphone; 34: circuit board; 35: conductive wire; 40: supporting assembly; 41: first supporting member; 42: second supporting member. DETAILED DESCRIPTION
[0022] The present invention is further described below in conjunction with the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it, but the embodiments are not intended to limit the present invention.
[0023] See also Figures 1 to 3 As shown, the present invention provides a heat dissipation pad with a noise reduction mechanism, which mainly includes a base 10 , at least one heat dissipation fan 20 and a noise reduction module 30 .
[0024] The base 10 mainly includes a receiving seat 11 and a lower plate 12. The receiving seat 11 has an upper plate 111 and a surrounding plate 113 bent downwardly from the upper plate 111. The lower plate 12 is connected to the surrounding plate 113 to form a receiving chamber 13 inside the receiving seat 11 and the lower plate 12. The upper plate 111 is provided with a plurality of ventilation holes 112 communicating with the receiving chamber 13. The lower plate 12 is provided with a plurality of through grooves 121 to communicate with the receiving chamber 13. In addition, a plurality of convex bodies 122 are provided on one side of the lower plate 12, and each convex body 122 is arranged at equal intervals.
[0025] The cooling fans 20 are disposed in the accommodating chamber 13 and are arranged corresponding to the ventilation holes 112 . In this embodiment, the number of the cooling fans 20 is two, but it is not limited thereto and may be a single number. The cooling fans 20 are arranged at intervals and fixed below the upper plate 111 .
[0026] The noise reduction module 30 is disposed in the accommodating chamber 13 , and mainly includes an active noise cancellation controller (ANC) 31 , a speaker 32 electrically connected to the ANC controller 31 , and a microphone 33 electrically connected to the ANC controller 31 .
[0027] The noise reduction module 30 of this embodiment further includes a circuit board 34, wherein the active noise reduction controller 31, the speaker 32 and the microphone 33 are electrically connected through the circuit on the circuit board 34. The microphone 33 includes a reference microphone 331 and an error microphone 332 (such as Figure 3 The power source of the circuit board 34 is provided by the cooling fan 20 .
[0028] The heat dissipation pad with noise reduction mechanism of the present invention can be provided to a laptop computer (not shown in the figure) for placement, wherein the heat dissipation fan 20 will operate according to the fan control signal. The larger the value of the fan control signal, the faster the motor speed in the heat dissipation fan 20, the stronger the heat dissipation effect, but it will also generate a larger noise. In one embodiment, the fan control signal can be a square wave signal of pulse width modulation (PWM), and the motor speed in the heat dissipation fan 20 is adjusted by changing its duty cycle. The noise source of the heat dissipation fan 20 during operation comes from the air flow caused by the rotation of the motor, wherein the narrowband component may come from the thickness noise of the volume displacement generated by the movement of the fan blade, or the blade passing frequency (BPF) noise caused by the variable load force on the surface of the fan blade (including axial lift and fan surface tension). Since the blade passing frequency and related harmonics are related to the pressure disturbance generated when each fan blade passes through a fixed reference point, a specific narrowband noise will be generated when a periodic pressure wave is generated at the tip of the fan blade. On the other hand, when air flows through the fan blades, it will peel off from the boundary layer of the fan blades or the two sides of the blade tip to form alternating vortices. This phenomenon is called vortex shedding. Vortex shedding will cause the instantaneous speed of the fluid on both sides of the fan blade to be different. Under different fluid speeds, the instantaneous pressure on both sides of the fan blade is also different, so the fan blades will vibrate and produce specific broadband noise.
[0029] The reference microphone 331 is disposed near each blade of the cooling fan 20 to capture the noise generated when the cooling fan 20 is running, and transmits a measured broadband noise signal to the active noise reduction controller 31, wherein the broadband noise signal includes a broadband noise spectrum of the airflow noise generated when the cooling fan 20 is running. In one embodiment, the reference microphone 331 can be a digital micro-electromechanical system (MEMS) microphone, which has high heat resistance, high vibration resistance, and high radio frequency interference resistance.
[0030] The error microphone 332 is used to capture the overall noise of each blade of the cooling fan 20 when it is running, and output a corresponding error signal to the active noise reduction controller 31, wherein the noise signal represents the noise signal to be eliminated during the operation of each blade. Since the cooling fan 20 is the main noise source, the error microphone 332 can be set close to the cooling fan 20, wherein the distance between the reference microphone 331 and the active noise reduction controller 31 is greater than the distance between the error microphone 332 and the active noise reduction controller 31. The error microphone 332 can detect noise through a main path and a secondary path: the main path is related to the signal transmission path between the cooling fan 20 and the error microphone 332, and the noise signal is captured through the main path; and the secondary path is related to the signal transmission path between the speaker 32 and the error microphone 332, and one of the related inverse noise signals, a corrected inverse noise signal, is captured through the secondary path. In more detail, the error signal output by the error microphone 332 is the difference between the noise signal and the corrected inverse noise signal, and the smaller the value of the error signal, the better the noise reduction effect. In one embodiment, the error microphone 332 may be a digital MEMS microphone, which has high heat resistance, high vibration resistance, and high radio frequency interference resistance, etc. However, the type of the error microphone 332 does not limit the scope of the present invention.
[0031] The active noise reduction controller 31 can receive a synchronization signal, a broadband noise signal from a reference microphone 331, and an error signal from an error microphone 332, wherein the synchronization signal includes information about the structure (e.g., the number of fan blades) and operation settings (e.g., motor speed in different modes) of the relevant cooling fan 20. Based on the synchronization signal and the broadband noise signal, the active noise reduction controller 31 can calculate the broadband noise in the noise generated by the cooling fan 20 during actual operation; based on the synchronization signal and the error signal, the active noise reduction controller 31 can calculate the narrowband noise in the noise generated by the cooling fan 20 during actual operation. Based on the calculated broadband noise and narrowband noise, the active noise reduction controller 31 can provide a speaker control signal to drive the speaker 32, so that the anti-phase noise signal provided by the speaker 32 can effectively offset the noise signal, that is, to reduce the error signal to 0 as much as possible.
[0032] The speaker 32 is an electronic component that can convert electronic signals into sound signals, and generally includes a diaphragm and a driving circuit composed of an electromagnet and a voice coil. The speaker 32 can operate according to a speaker control signal provided by the active noise reduction controller 31. When the current of the speaker control signal passes through the voice coil, the voice coil vibrates with the frequency of the current, and the diaphragm connected to the voice coil also vibrates, thereby driving the surrounding air to vibrate and generate a noise reduction sound. In the embodiment of the present invention, the diaphragm of the speaker 32 can generate an anti-phase noise signal according to the speaker control signal.
[0033] In one embodiment, the heat dissipation pad with a noise reduction mechanism of the present invention also includes a support assembly 40, one end of which is pivotally connected to one side of the base 10, and the other end can be bent to press against the other side of the base 10, so that the base 10 forms an inclined shape. The support assembly 40 mainly includes a first support member 41 and a second support member 42. The two ends of the first support member 41 are respectively pivotally connected to the base 10 and one end of the second support member 42, and the other end of the second support member 42 can be selectively stopped at one of the aforementioned protrusions 122, so that the base 10 can present different elevation angles.
[0034] See also Figure 4 As shown, the noise reduction module 30A of this embodiment has most of the technical features of the aforementioned noise reduction module 30, wherein the microphone 33 is separately arranged from the active noise reduction controller 31 and the speaker 32, and the microphone 33 is electrically connected to the circuit board 34 through a conductive wire 35, so that the microphone 33 can be arranged near the location of the cooling fan 20, so as to more accurately grasp the noise emitted by it.
[0035] See also Figure 5 As shown, the noise reduction module 30B of this embodiment has most of the technical features of the aforementioned noise reduction module 30, wherein the microphones 33 and the conductive wires 35 are plural, and each microphone 33 is electrically connected to the circuit board 34 through each conductive wire 35. In this way, each microphone 33 is arranged between each cooling fan 20 and on one side of the cooling fan 20 according to actual usage requirements.
[0036] The above-described embodiments are only preferred embodiments for fully illustrating the present invention, and the protection scope of the present invention is not limited thereto. Equivalent substitutions or changes made by those skilled in the art based on the present invention are within the protection scope of the present invention. The protection scope of the present invention shall be subject to the claims.
Claims
1. A heat dissipation pad with a noise reduction mechanism, characterized in that: include: A base body, including a receiving seat and a receiving chamber formed inside the receiving seat, wherein the receiving seat is provided with a plurality of ventilation holes communicating with the receiving chamber; At least one heat dissipation fan is disposed in the accommodating chamber and is arranged corresponding to each of the ventilation holes; and a noise reduction module, disposed in the accommodating chamber, the noise reduction module comprising an active noise reduction controller, a speaker electrically connected to the active noise reduction controller, and a microphone electrically connected to the active noise reduction controller; After receiving the noise emitted by the cooling fan, the microphone operates and transmits a signal through the active noise reduction controller, thereby emitting a noise reduction sound from the speaker that can offset the noise of the cooling fan.
2. The heat dissipation pad with noise reduction mechanism as claimed in claim 1, characterized in that: The noise reduction module also includes a circuit board, and the active noise reduction controller, the speaker and the microphone are electrically connected through the circuit board.
3. The heat dissipation pad with noise reduction mechanism as claimed in claim 2, characterized in that: The circuit board is electrically connected to the heat dissipation fan.
4. The heat dissipation pad with noise reduction mechanism as claimed in claim 1, characterized in that: The noise reduction module also includes a circuit board and a conducting wire. The active noise reduction controller and the speaker are fixed on the circuit board. The microphone is electrically connected to the circuit board through the conducting wire and is located on one side of the cooling fan.
5. The heat dissipation pad with noise reduction mechanism as claimed in claim 1, characterized in that: The noise reduction module further includes a circuit board and a plurality of conducting wires. The number of microphones is plural, and each of the microphones is electrically connected to the circuit board through each of the conducting wires.
6. The heat dissipation pad with noise reduction mechanism as claimed in claim 1, characterized in that: The microphone includes a reference microphone and an error microphone.
7. The heat dissipation pad with noise reduction mechanism as claimed in claim 1, characterized in that: The base also includes a lower plate. The receiving seat has an upper plate and a surrounding plate extending from the upper plate by bending. The lower plate is connected to the surrounding plate. The accommodating chamber is formed between the receiving seat and the lower plate.
8. The heat dissipation pad with noise reduction mechanism as claimed in claim 7, characterized in that: The lower plate is provided with a plurality of through slots communicated with the accommodating chamber.
9. The heat dissipation pad with noise reduction mechanism as claimed in claim 7, characterized in that: The utility model also comprises a supporting component, one end of which is pivotally connected to one side of the base body, and the other end of which can be bent to abut against the other side of the base body.
10. The heat dissipation pad with noise reduction mechanism as claimed in claim 9, characterized in that: The lower plate is provided with a plurality of protrusions, and the support assembly includes a first support member and a second support member. The two ends of the first support member are respectively pivotally connected to the base and one end of the second support member, and the other end of the second support member can be selectively stopped at one of the protrusions.
