Computing equipment based on phase change liquid cooling technology

Abstract

The invention provides computing equipment based on a phase change liquid cooling technology. The computing equipment comprises a body, a jet flow component and a power component, the interior of the body is divided into a first containing cavity and a second containing cavity through a partition plate, the first containing cavity is used for containing first cooling liquid, the second containing cavity is used for containing a heating element and second cooling liquid, and the temperature of the second cooling liquid is higher than that of the first cooling liquid; the body is provided with a liquid supplementing opening communicated with the first containing cavity and an exhaust opening communicated with the second containing cavity. The power part is connected with the jet flow part and used for pumping the first cooling liquid into the heating element through the jet flow part. According to the invention, the critical heat flux density can be improved, and efficient jet cooling of a heating element with relatively high heat flux density is realized. Besides, the first containing cavity and the second containing cavity which are divided by the partition plate can contain working media with different temperatures respectively, a proper supercooling environment can be built, meanwhile, the influence of cavitation on the power component is avoided, and the reliability and usability of the power component are guaranteed.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a computing device based on phase change liquid cooling technology. Background Art

[0002] With the rapid development of chip density, the single-point heat dissipation problem of chips has become a concern. In order to deal with this problem, phase change immersion cooling technology has been applied, that is, the heating element can be immersed in a phase change medium, which can boil at normal pressure and near normal temperature, and can complete the cooling of the heating element by evaporating and absorbing heat.

[0003] However, the existing phase change working fluid is contained in a container, and its heat dissipation form is a passive form, the critical heat flux density is low, and it is also easy to cause local liquid shortage, and the heat dissipation capacity is limited. Summary of the invention

[0004] The purpose of the present application is to provide a computing device based on phase change liquid cooling technology to increase the critical heat flux density and improve the heat dissipation capacity through immersion and jet heat dissipation.

[0005] The present application provides a computing device based on phase change liquid cooling technology, which includes: a body, a jet component and a power component; a partition is arranged in the body, and the space in the body is divided into a first cavity and a second cavity by the partition, the first cavity is used to contain a first coolant, and the second cavity is used to contain a heating element and a second coolant, and the temperature of the second coolant is higher than the temperature of the first coolant; a liquid replenishment port and an exhaust port are arranged on the body, the liquid replenishment port is connected with the first cavity, and the exhaust port is connected with the second cavity; the jet component is arranged in the second cavity; the power component is arranged in the first cavity and connected with the jet component, and is used to pump the first coolant into the jet component and jet it onto the heating element through the jet component.

[0006] In the present application, by cooperating with the power component and the jet component, the working fluid can be sprayed to the heating element at a high speed, thereby greatly increasing the critical heat flux density, and realizing efficient jet cooling of heating elements such as CPUs with high heat flux density. In addition, by separating the first and second chambers by the partition, the power component can be set in the first coolant and the heating element can be set in the second coolant, thereby creating a suitable supercooling environment, while avoiding the influence of cavitation on the power component, and ensuring the reliability and availability of the power component.

[0007] In a possible design, there is a gap between the top of the partition and the top of the body, and the gap can be used for the circulation of the gaseous working medium to facilitate the discharge of the gaseous working medium from the exhaust port.

[0008] In a possible design, one end of the partition is connected to the bottom of the body, and the partition extends in the height direction of the body to separate the first cavity and the second cavity in the horizontal direction of the body. The partition can separate the first cavity and the second cavity in the body in the horizontal direction, so that the heat dissipation device can be placed horizontally.

[0009] In a possible design, the first cavity and the second cavity are distributed in the height direction of the body. The body has a relatively large height and can be used in a vertical standing posture, thereby meeting the needs in special working environments.

[0010] In a possible design, the partition includes a bottom plate and a side plate, the bottom plate is respectively connected to the side plate and the side wall of the main body, and the bottom plate, the side plate and the side wall of the main body enclose the first cavity; the space in the main body below the bottom plate constitutes the second cavity, thereby enabling the heat dissipation device to be used in a vertical standing posture, expanding the application scenarios of the heat dissipation device.

[0011] In a possible design, an overflow port is provided on the body, the overflow port is connected to the second cavity, and the distance between the overflow port and the bottom of the body is smaller than the distance between the top of the partition and the bottom of the body. By providing an overflow port on the side wall of the second cavity, and the height of the overflow port is lower than the height of the partition, when the liquid level in the second cavity rises to the overflow port, the second coolant can overflow from the overflow port without backflow from the partition. In this way, it can be ensured that the first coolant extracted by the power component can have a certain degree of supercooling, which is conducive to creating a suitable supercooling environment and improving heat dissipation efficiency.

[0012] In a possible design, the partition and the body are integrally formed, that is, during the processing and manufacturing of the body, the partition connected to the side wall of the body can be directly formed on the body, thereby ensuring the reliability of the overall structure of the body.

[0013] In a possible design, the partition is detachably connected to the body, so as to facilitate adjustment of the size of the partition to obtain the first cavity and the second cavity of different volumes.

[0014] In a possible design, the jet component includes a nozzle and a pipeline, the nozzle is arranged in the second cavity, a plurality of spray holes are arranged on the nozzle, one end of the pipeline is connected to the nozzle, and the other end of the pipeline is connected to the power component, the power component can pump the first coolant extracted from the second cavity into the nozzle through the pipeline, and the nozzle can spray on the corresponding heating element through the spray hole. The power provided by the power component can make the first coolant sprayed from the nozzle have a higher flow rate, and by spraying the first coolant to the heating element at a high speed, the boiling heat transfer coefficient and the critical heat flux density can be greatly improved, and efficient jet cooling of heating elements such as CPUs with high heat flux density can be achieved.

[0015] In a possible design, the computing device further includes a first liquid level detection device, which is connected to the body and disposed in the first cavity, and is used to detect the first liquid level of the first coolant; the distance between the first liquid level detection device and the bottom of the body is greater than the distance between the liquid inlet of the power component and the bottom of the body. The first liquid level detection device can detect the first liquid level of the first coolant in the first cavity in real time, and can send a first detection signal to the controller, and the controller controls the opening and closing of the liquid supply valve according to the first detection signal, so that the working fluid added to the first cavity through the liquid replenishment port can maintain the first liquid level in the first cavity at an expected position, which can be a certain position that can immerse the liquid inlet of the power component, so as to ensure that the power component can extract the first coolant through the liquid inlet.

[0016] In a possible design, the computing device further includes a second liquid level detection device, which is connected to the body and disposed in the second cavity, and is used to detect the second liquid level of the second coolant; the distance between the second liquid level detection device and the bottom of the body is greater than the distance between the upper surface of the heating element and the bottom of the body. The second liquid level detection device may be located above the heating element and adjacent to a certain position on the upper surface of the heating element, and when the second liquid level is flush with the second liquid level detection device, or when the height of the second liquid level is greater than the height of the second liquid level detection device, the second coolant can immerse the heating element. When the height of the second liquid level is lower than the height of the second liquid level detection device, part of the heating element will leak out of the second coolant and cannot obtain effective heat dissipation. At this time, the second liquid level detection device can send a second detection signal, and the controller can control the liquid supply valve to have a larger opening according to the second detection signal, so that the liquid level of the first coolant in the first cavity can rise rapidly and overflow into the second cavity through the top of the partition, thereby replenishing the second cavity and allowing the liquid working medium in the second cavity to immerse the heating element and achieve effective heat dissipation.

[0017] In a possible design, the computing device further includes a third liquid level detection device, which is connected to the body and disposed in the second cavity, and is used to detect the third liquid level of the second coolant; the distance between the third liquid level detection device and the bottom of the body is greater than the distance between the second liquid level detection device and the bottom of the body, and the distance between the third liquid level detection device and the bottom of the body is less than or equal to the distance between the overflow port and the bottom of the body. When the third liquid level detection device detects the third liquid level, a third detection signal may be issued, and the controller may control the liquid supply valve to close and stop replenishing liquid according to the third detection signal, so as to prevent the working fluid from overflowing from the overflow port and causing waste.

[0018] In a possible design, the computing device further includes a liquid supply valve connected to the liquid replenishment port. The liquid supply valve can be electrically connected or signal-connected to an external controller, and the controller can control the liquid supply valve to open or close, and can adjust the opening of the liquid supply valve, thereby adjusting the flow rate of the liquid working medium flowing through the liquid replenishment port, so as to control the first liquid level of the first coolant in the first cavity.

[0019] In a possible design, the computing device further includes a condensing device, which is connected to the exhaust port and is used to condense the gaseous working medium output from the exhaust port into a liquid working medium. The part of the second coolant that evaporates and changes into a gaseous state can enter the condensing device through the exhaust port and can be condensed into a liquid state by the condensing device. The working medium condensed into a liquid state can be collected again in the first cavity or collected in an external recovery device, so as to recycle the coolant, reduce coolant consumption, and reduce costs.

[0020] In a possible design, the computing device further includes a cabinet, and at least one of the bodies is installed in the cabinet. The cabinet may have a large space in the horizontal direction, so that the heat dissipation device can be placed in the horizontal direction, and the first cavity and the second cavity in the heat dissipation device can be distributed in the horizontal direction. In addition, the cabinet may also have a large space in the vertical direction, so that the heat dissipation device can be placed in the vertical direction, and the first cavity and the second cavity in the heat dissipation device can be distributed in the vertical direction.

[0021] It should be understood that the foregoing general description and the following detailed description are exemplary only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A schematic diagram of the structure of a heat dissipation device in a computing device based on phase change liquid cooling technology provided by an embodiment of the present application;

[0023] Figure 2A state diagram of a heat dissipation device in a computing device based on phase change liquid cooling technology provided in an embodiment of the present application during operation;

[0024] Figure 3 A state diagram of a heat dissipation device in a computing device based on phase change liquid cooling technology provided in an embodiment of the present application when operating under small and medium load conditions;

[0025] Figure 4 A state diagram of a heat dissipation device in a computing device based on phase change liquid cooling technology provided in an embodiment of the present application when operating under high load conditions;

[0026] Figure 5 A schematic diagram of the structure of a heat dissipation device in a computing device based on phase change liquid cooling technology provided by another embodiment of the present application;

[0027] Figure 6 A state diagram of a heat dissipation device in a computing device based on phase change liquid cooling technology during operation provided in another embodiment of the present application.

[0028] Reference numerals:

[0029] 1-Ontology;

[0030] 11- first cavity;

[0031] 12- second chamber;

[0032] 13- Fluid infusion port;

[0033] 14- Exhaust port;

[0034] 15- Overflow port;

[0035] 2- jet components;

[0036] 21- nozzle;

[0037] 22-pipeline;

[0038] 3- Power components;

[0039] 4- Partition;

[0040] 41- bottom plate;

[0041] 42-side panels;

[0042] 5- Gap;

[0043] 6- first liquid level detection device;

[0044] 7- second liquid level detection device;

[0045] 8- third liquid level detection device;

[0046] A-first coolant;

[0047] B-second coolant;

[0048] 100-heating element;

[0049] Z-height direction.

[0050] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application. DETAILED DESCRIPTION

[0051] In order to better understand the technical solution of the present application, the embodiments of the present application are described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to explain the present application and are not used to limit the present application.

[0052] In the description of this application, unless otherwise clearly specified and limited, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance; unless otherwise specified or explained, the term "plurality" refers to two or more; the terms "connected" and "fixed" should be understood in a broad sense, for example, "connected" can be a fixed connection, a detachable connection, an integral connection, or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0053] Phase change immersion cooling technology is generally considered to dissipate heat for components with high heat generation, such as chips. In actual operation, a container containing a liquid phase change medium is usually used, and the chip can be immersed in the medium. The heat of the chip can be transferred to the medium, and the liquid medium evaporates and changes into a gaseous state when heated. The heat of the chip can be absorbed during the evaporation phase change process, thereby achieving cooling of the chip.

[0054] However, there is generally an upper limit to the heat transfer capacity of the liquid working fluid. The working fluid has a critical heat flux (CHF). When the actual heat dissipation density exceeds the critical heat flux, a large amount of gas generated by the boiling of the liquid working fluid will hinder the flow of the surrounding liquid to the heat dissipation surface of the chip, which causes the boiling heat transfer capacity of the working fluid to deteriorate significantly. In addition, the boiling heat transfer of the working fluid in the container is a passive form, which is prone to local liquid shortage.

[0055] The embodiment of the present application provides a computing device based on phase change liquid cooling technology (hereinafter referred to as computing device), the computing device includes a server and a heat dissipation device, the server can be a cloud server, or a server of a distributed system, or a server combined with a blockchain, etc., and a large number of electronic components are integrated in the server, wherein some electronic components have a high calorific value, such as a chip, a graphics processing unit (GPU), a graphics card, and a memory bar, etc. These electronic components with high calorific value can be used as heating elements in the embodiment of the present application, and in addition, the above-mentioned electronic components with high calorific value are not used as a limitation on the heating elements provided in the embodiment of the present application. In one embodiment, the heating element can also be a component with high calorific value composed of devices such as chips. In addition, the computing device includes a cabinet, the cabinet can be used as the shell of the server, and the heat dissipation device can be arranged in the cabinet for dissipating the above-mentioned heating element. In one embodiment, the cabinet can have at least one mounting portion, and the heat dissipation device can be installed on the mounting portion. When there are multiple mounting portions, the heat dissipation device can also have multiple, and be installed one by one on the corresponding mounting portion. In one embodiment, the mounting portion may be a groove-shaped structure, so that the heat sink can be fixedly embedded in the groove-shaped structure, which can facilitate the installation of the heat sink and ensure the installation stability of the heat sink. Of course, the structure of the mounting portion is not limited to the above-mentioned groove-shaped structure, and can also be a part of the cabinet. The heat sink can be installed on the mounting portion by connecting parts such as screws.

[0056] In one embodiment, Figure 1 A schematic diagram of the structure of a heat dissipation device in a computing device based on phase change liquid cooling technology provided by an embodiment of the present application. Figure 2 The state diagram of the heat dissipation device in the computing device based on the phase change liquid cooling technology provided in the embodiment of the present application during operation is shown in FIG. Figure 1 and Figure 2 The heat dissipation device includes a body 1, wherein the body 1 has a space therein, and a partition 4 is provided in the body 1. The space in the body 1 can be divided into a first cavity 11 and a second cavity 12 by the partition 4. The first cavity 11 and the second cavity 12 are not connected to each other. The first cavity 11 is used to contain a first coolant A, and the second cavity 12 is used to contain a heating element 100 and a second coolant B. The heating element 100 can be placed in the second cavity 12 and immersed in the second coolant B. The heat of the heating element 100 can be transferred to the second coolant B, so that the second coolant B has a higher temperature. The first coolant A in the first cavity 11 does not contact the heating element 100, and can be separated from the second coolant B in the second cavity 12 by the partition 4, so that the first coolant A has a relatively low temperature, that is, the temperature of the first coolant A is lower than the temperature of the second coolant B.

[0057] The body 1 is provided with a liquid replenishing port 13, which is in communication with the first cavity 11. Liquid working medium can be replenished into the first cavity 11 through the liquid replenishing port 13. The replenished liquid working medium can be called the first coolant A in the first cavity 11. If the first coolant A in the first cavity 11 is input into the second cavity 12, the first coolant A that enters the second cavity 12 from the first cavity 11 is mixed with the second coolant B originally in the second cavity 12, and the temperature will be assimilated. At this time, all the liquid working medium in the second cavity 12 can be called the second coolant B. In other words, the coolants in the first cavity 11 and the second cavity 12 are the same liquid working medium, and the difference is that the temperature of the second coolant B in the second cavity 12 is higher than the temperature of the first coolant A in the first cavity 11.

[0058] The main body 1 is provided with an exhaust port 14, which is connected to the second cavity 12. After the second coolant B in the second cavity 12 absorbs the heat from the heating element 100, it will boil, so that part of the second coolant B will be transformed into a gaseous state. The gaseous working medium can be discharged from the exhaust port 14 to the outside of the second cavity 12 to ensure the stability of the pressure in the second cavity 12. In one embodiment, the computing device also includes a condensing device, which is connected to the exhaust port 14 and is used to condense the gaseous working medium output from the exhaust port 14 into a liquid working medium. In other words, the part of the second coolant B that evaporates and changes into a gaseous state can enter the condensing device through the exhaust port 14, and can be condensed into a liquid state through the condensing device. The working medium condensed into a liquid state can be collected again in the first cavity 11, or collected in an external recovery device, so as to recycle the coolant, reduce the coolant consumption, and reduce the cost.

[0059] The computing device also includes a power component 3 , which may be a water pump, a hydraulic pump or the like, capable of extracting the first coolant A in the first cavity 11 and spraying it onto the heating element 100 in the second cavity 12 through the jet component 2 .

[0060] The jet component 2 may be a nozzle, a jet orifice plate, etc. For example, the jet component 2 includes a nozzle 21 and a pipeline 22. The nozzle 21 is disposed in the second cavity 12. A plurality of spray holes are disposed on the nozzle 21. One end of the pipeline 22 is connected to the nozzle 21, and the other end of the pipeline 22 is connected to the power component 3. The power component 3 can pump the first coolant A extracted from the second cavity 12 into the nozzle 21 through the pipeline 22, and the nozzle 21 can spray on the corresponding heating element 100 through the spray hole. The power provided by the power component 3 can make the first coolant A sprayed from the nozzle 21 have a higher flow rate. By spraying the first coolant A to the heating element 100 at a high speed, the boiling heat transfer coefficient and the critical heat flux density can be greatly improved, and efficient jet cooling of the heating element 100 such as the CPU with a high heat flux density can be achieved.

[0061] In addition, if it is considered to place a power component 3 such as a pump, a jet component 2, a heating element 100 and a liquid working fluid together in a container having only a single cavity, the pump can extract the liquid working fluid and spray it onto the heating element 100 through the jet component 2 to realize an internal circulation jet cooling method. However, since the liquid working fluid continuously exchanges heat with the heating element 100, the liquid working fluid in the container is nearly saturated, and the new working fluid added to the container will be quickly assimilated by the nearly saturated working fluid in the container. When the pump directly extracts the nearly saturated working fluid, the working fluid will easily vaporize under negative pressure and cavitation will occur, which will significantly affect the performance of the pump. Due to the impact of cavitation on the impeller in the pump, the reliability of the pump will also be greatly reduced.

[0062] To this end, in this embodiment, a first cavity 11 and a second cavity 12 separated from each other are provided in the main body 1, and the first coolant A entering the first cavity 11 through the liquid replenishing port 13 will not directly contact the second coolant B and the heating element 100 in the second cavity 12, so that the working fluid extracted by the power component 3 located in the first cavity 11 has a certain degree of supercooling, and the supercooling can be matched according to the cavitation margin required by the power component 3, so as to create a suitable working environment, effectively avoid the influence of cavitation on the power component 3, and ensure the reliability and availability of the power component 3.

[0063] Therefore, the computing device based on phase change liquid cooling technology provided by the embodiment of the present application can spray the working fluid to the heating element 100 at a high speed through the cooperation of the power component 3 and the jet component 2, thereby greatly improving the critical heat flux density and realizing efficient jet cooling of the heating element 100 such as the CPU with a high heat flux density. In addition, the first cavity 11 and the second cavity 12 separated by the partition 4 can make the power component 3 set in the first coolant A and the heating element 100 set in the second coolant B, so as to create a suitable supercooling environment, while avoiding the influence of cavitation on the power component 3, and ensuring the reliability and availability of the power component 3.

[0064] In one embodiment, the body 1 and the partition 4 can be an integrally formed structure, that is, during the processing and manufacturing of the body 1, the partition 4 can be formed at the same time, and the first cavity 11 and the second cavity 12 can be separated in the body 1 by the partition 4, so that the structure can be simplified, and the processing and manufacturing of the body 1 and the partition 4 can be facilitated, and the reliability of the overall structure can be ensured. In addition, in some other embodiments, the partition 4 can also be connected to the body 1 by a detachable connection method, so that the size of the partition 4 can be adjusted to obtain first cavities 11 and second cavities 12 of different volumes.

[0065] In one embodiment, referring to Figure 1 , there is a gap 5 between the top of the partition 4 and the top of the main body 1. Among them, the top of the main body 1 can be a closed structure, for example, the top of the main body 1 has a cover plate, and there is a gap 5 between the inner side of the cover plate and the top of the partition 4, and the gap 5 can be used for the circulation of gaseous working medium. In one embodiment, the exhaust port 14 and the liquid replenishing port 13 can be arranged on the same side of the main body 1, for example, the exhaust port 14 and the liquid replenishing port 13 are both arranged on the side wall of the first cavity 11, and the working medium converted from the second coolant B into gaseous state can flow to the exhaust port 14 through the gap 5 between the top of the main body 1 and the top of the partition 4, and be discharged through the exhaust port 14. In the design where the exhaust port 14 and the liquid replenishing port 13 are located on the same side of the main body 1, the distance between the exhaust port 14 and the liquid replenishing port 13 can be made closer, so that after the gaseous working medium at the exhaust port 14 is condensed, the condensed liquid working medium can be quickly transported to an external recovery device, or replenished to the first cavity 11. In some other embodiments, the exhaust port 14 may also be provided on the side wall of the second cavity 12, so as to shorten the path of the working medium transformed from the second coolant B into a gaseous state and discharged from the exhaust port 14, which is conducive to the rapid discharge of the gaseous working medium from the exhaust port 14 and is conducive to maintaining the stability of the pressure in the body 1. In some other embodiments, the exhaust port 14 may also be provided on the cover plate at the top of the body 1, which is not limited in this embodiment.

[0066] In this embodiment, Figure 3The state diagram of the heat dissipation device in the computing device based on the phase change liquid cooling technology provided in the embodiment of the present application when working under small and medium load conditions, refer to Figure 3 , the gap 5 between the top of the main body 1 and the top of the partition 4 can also be used for the liquid working medium to flow from the first cavity 11 to the second cavity 12. Specifically, when the liquid level of the second coolant B in the second cavity 12 is low and the liquid working medium needs to be supplemented, the first coolant A can be supplemented into the first cavity 11 through the liquid replenishment port 13 to increase the liquid level of the first coolant A, so that the first coolant A can automatically overflow into the second cavity 12 through the top of the partition 4, thereby achieving a small flow of liquid replenishment to the second cavity 12, and achieving a basic balance between the amount of liquid replenishment and the amount of the second coolant B that is transformed into a gaseous state, while ensuring the heat dissipation effect, and reducing the waste of the working medium flow. Among them, in the case of the above-mentioned small flow liquid replenishment, the power component 3 can stop running, thereby saving energy consumption and reducing costs.

[0067] also, Figure 4 The state diagram of the heat dissipation device in the computing device based on the phase change liquid cooling technology provided in the embodiment of the present application when working under high load conditions, refer to Figure 4 When the density of the heating element 100 is relatively high and it is difficult to achieve effective heat dissipation by using the above-mentioned small flow rate liquid replenishment method, the first coolant A in the first cavity 11 can be sprayed onto the heating element 100 at a high speed and in large quantities through the cooperation of the power component 3 and the jet component 2, thereby greatly improving the critical heat flux density and achieving efficient heat dissipation of the heating element 100 with relatively high density. Among them, the pipeline 22 of the jet component 2 can cross the partition 4 from the gap 5 between the top of the partition 4 and the top of the body 1, so that the power component 3 located in the first cavity 11 and the nozzle 21 located in the second cavity 12 can be connected through the pipeline 22.

[0068] In this embodiment, for the refilling operation in the second cavity 12, the first coolant A in the first cavity 11 can be overflowed from the top of the partition 4 to replenish the second cavity 12, and the power component 3 and the jet component 2 do not need to participate in the work. The power component 3 and the jet component 2 can choose to start working only when the density of the heating element 100 is large to perform jet heat dissipation, thereby achieving decoupling of the refilling work and the jet heat dissipation work in the second cavity 12, without the need to use the power component 3 and the jet component 2 for refilling, thereby reducing energy consumption.

[0069] In one embodiment, referring to Figure 1, one end of the partition 4 is connected to the bottom of the main body 1, and the partition 4 extends in the height direction Z of the main body 1, and is used to separate the first cavity 11 and the second cavity 12 in the horizontal direction of the main body 1. In this embodiment, the heat dissipation device can be placed horizontally, and the partition 4 can separate the first cavity 11 and the second cavity 12 in the main body 1 in the horizontal direction. Among them, the shape of the cross-section of the main body 1 can be a regular polygon, a circle, an ellipse or a special shape. In this embodiment, the main body 1 can be a rectangular parallelepiped, and the rectangular parallelepiped has a length, a width and a height. The horizontal direction of the main body 1 can be the length direction or the width direction of the main body 1.

[0070] In one embodiment, Figure 5 A schematic diagram of a heat dissipation device in a computing device based on phase change liquid cooling technology provided in another embodiment of the present application, referring to Figure 5 , the first cavity 11 and the second cavity 12 can be distributed in the height direction Z of the body 1. In this embodiment, the body 1 has a large height and can be used in a vertical upright position, thereby meeting the needs of special working environments. The working principle of the heat dissipation device used in a vertical position in this embodiment is similar to that of the heat dissipation device used in a horizontal position, which will not be repeated here.

[0071] In one embodiment, referring to Figure 5 The partition 4 includes a bottom plate 41 and a side plate 42. The bottom plate 41 is connected to the side plate 42 and the side wall of the main body 1 respectively. The bottom plate 41, the side plate 42 and the side wall of the main body 1 enclose a first cavity 11; the space below the bottom plate 41 in the main body 1 constitutes a second cavity 12.

[0072] In this embodiment, the partition 4 composed of the bottom plate 41 and the side plate 42 can separate the first cavity 11 and the second cavity 12 in the height direction Z of the main body 1, so that the heat dissipation device can be used in a vertical upright posture, thereby expanding the application scenario of the heat dissipation device. Among them, the partition 4 can be an integrally formed structure with the main body 1, that is, during the processing and manufacturing process of the main body 1, the partition 4 connected to the side wall of the main body 1 can be directly formed on the main body 1, so as to ensure the reliability of the overall structure of the main body 1. In addition, in some other embodiments, the partition 4 can also be connected to the main body 1 by a detachable connection, so as to facilitate the adjustment of the size specifications of the partition 4 to obtain the first cavity 11 and the second cavity 12 of different volumes.

[0073] Figure 6 A state diagram of a heat dissipation device in a computing device based on phase change liquid cooling technology provided in another embodiment of the present application during operation, referring to Figure 6During operation of the heat dissipation device having the first cavity 11 and the second cavity 12 arranged along the height direction Z of the main body 1, the heating element 100 can be immersed in the second coolant B in the second cavity 12 located below, wherein the heating element 100 can be fixed on the side wall of the second cavity 12, or placed on the bottom of the second cavity 12, the power component 3 is installed on the side wall of the first cavity 11, or on the bottom plate 41, or on the side plate 42, the nozzle 21 of the jet component 2 is arranged in the second cavity 12, and can be aligned with the position of the heating element 100 to be cooled, so that the injected working fluid can directly impact the heating element 100.

[0074] For example, refer to Figure 6 , the pipeline 22 of the jet component 2 can pass through the bottom plate 41. Specifically, the bottom plate 41 can be provided with a hole, the pipeline 22 can pass through the hole, and the pipeline 22 and the hole can be sealed by a seal. Exemplarily, the pipeline 22 can also bypass the bottom of the side plate 42, which is not limited in this embodiment.

[0075] The first coolant A in the first cavity 11 located at the top can overflow from the top of the side plate 42 into the second cavity 12 located at the bottom, so as to achieve a small flow of liquid replenishment to the second cavity 12 .

[0076] In one embodiment, referring to Figure 1 The main body 1 is provided with an overflow port 15 , which is communicated with the second cavity 12 , and a distance H1 between the overflow port 15 and the bottom of the main body 1 is smaller than a distance H2 between the top of the partition 4 and the bottom of the main body 1 .

[0077] Among them, refer to Figure 4 , when the working medium is injected into the second chamber 12 only through the jet component 2, or referring to Figure 2 In the case where the working medium is sprayed into the second cavity 12 through the jet component 2 and overflows into the second cavity 12 through the top of the partition 4, when the amount of the second coolant B vaporized in the second cavity 12 is less than the amount sprayed only by the jet component 2, or when the amount of the second coolant B vaporized in the second cavity 12 is less than the amount sprayed by the jet component 2 and the amount overflowed from the top of the partition 4, the liquid level in the second cavity 12 will gradually rise. If the overflow port 15 is not provided, the gradually rising liquid level will eventually flow back from the partition 4, that is, the second coolant B in the second cavity 12 will flow back into the first cavity 11, and mix with the first coolant A in the first cavity 11, and assimilate the first coolant A, which will destroy the supercooling environment.

[0078] To this end, in this embodiment, an overflow port 15 is provided on the side wall of the second cavity 12, and the height of the overflow port 15 is lower than the height of the partition 4, so that when the liquid level in the second cavity 12 rises to the overflow port 15, the second coolant B can overflow from the overflow port 15 without backflow from the partition 4. In this way, it can be ensured that the first coolant A extracted from the power component 3 can have a certain degree of supercooling, which is conducive to creating a suitable supercooling environment and improving the heat dissipation efficiency.

[0079] In one embodiment, referring to Figure 1 The computing device further includes a first liquid level detection device 6, which is connected to the body 1 and disposed in the first cavity 11, and is used to detect the first liquid level of the first coolant A. The first liquid level detection device 6 may be a liquid level sensor, such as a float type liquid level sensor, a float type liquid level sensor, a static pressure type liquid level sensor, etc.

[0080] Among them, a liquid supply valve can be connected to the liquid replenishment port 13, and the liquid supply valve can be electrically connected or signal-connected to an external controller. The controller can control the opening or closing of the liquid supply valve, and can adjust the opening of the liquid supply valve, thereby adjusting the flow of the liquid working medium flowing through the liquid replenishment port 13, so as to control the first liquid level of the first coolant A in the first cavity 11. Specifically, the first liquid level of the first coolant A in the first cavity 11 can be detected in real time by the first liquid level detection device 6, and a first detection signal can be sent to the controller. The controller controls the opening and closing and the opening of the liquid supply valve according to the first detection signal, so that the working medium added to the first cavity 11 through the liquid replenishment port 13 can maintain the first liquid level in the first cavity 11 at an expected position, and the expected position can be a certain position that can immerse the liquid inlet of the power component 3, so as to ensure that the power component 3 can extract the first coolant A through the liquid inlet. In this embodiment, the distance between the first liquid level detection device 6 and the bottom of the main body 1 is greater than the distance between the liquid inlet of the power component 3 and the bottom of the main body 1. When the height of the first liquid level is lower than the height of the first liquid level detection device 6, the first liquid level detection device 6 can send the above-mentioned first detection signal to achieve liquid replenishment in the first cavity 11 through the control of the liquid supply valve by the controller, thereby ensuring that the first coolant A in the first cavity 11 can submerge the liquid inlet of the power component 3.

[0081] In one embodiment, the computing device also includes a second liquid level detection device 7, which is connected to the main body 1 and arranged in the second cavity 12, for detecting the second liquid level of the second coolant B. The distance between the second liquid level detection device 7 and the bottom of the main body 1 is greater than the distance between the upper surface of the heating element 100 and the bottom of the main body 1.

[0082] The second liquid level detection device 7 may be a liquid level sensor that is the same as the first liquid level detection device 6, and may also be electrically connected or signal connected to the controller. The second liquid level detection device 7 may be located above the heating element 100 and adjacent to a certain position on the upper surface of the heating element 100. When the second liquid level is flush with the second liquid level detection device 7, or when the height of the second liquid level is greater than the height of the second liquid level detection device 7, the second cooling liquid B may immerse the heating element 100. When the height of the second liquid level is lower than the height of the second liquid level detection device 7, part of the heating element 100 will leak out of the second coolant B and cannot obtain effective heat dissipation. At this time, the second liquid level detection device 7 can send a second detection signal, and the controller can control the liquid supply valve to have a larger opening according to the second detection signal, so that the liquid level of the first coolant A in the first cavity 11 can rise rapidly, and can overflow into the second cavity 12 through the top of the partition 4, so as to replenish the second cavity 12, so that the liquid working medium in the second cavity 12 can immerse the heating element 100, and achieve effective heat dissipation.

[0083] In one embodiment, the computing device also includes a third liquid level detection device 8, which is connected to the main body 1 and is arranged in the second cavity 12, for detecting the third liquid level of the second coolant B; the distance between the third liquid level detection device 8 and the bottom of the main body 1 is greater than the distance between the second liquid level detection device 7 and the bottom of the main body 1, and the distance between the third liquid level detection device 8 and the bottom of the main body 1 is less than or equal to the distance between the overflow port 15 and the bottom of the main body 1.

[0084] Among them, the third liquid level detection device 8 can be a liquid level sensor that is the same as the first liquid level detection device 6 and the second liquid level detection device 7, and can also be electrically connected or signal connected to the controller. The third liquid level detection device 8 can be located at the same height as the overflow port 15, or slightly lower than the overflow port 15. When the third liquid level reaches the position of the third liquid level detection device 8, it means that if the second volume 12 is continuously replenished, the second coolant B in the second volume 12 will overflow from the overflow port 15, causing waste of the working fluid. When the third liquid level detection device 8 detects the third liquid level, a third detection signal can be issued, and the controller can control the liquid supply valve to close and stop replenishing according to the third detection signal to prevent the working fluid from overflowing from the overflow port 15 and causing waste.

[0085] The above are only preferred embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A computing device based on phase change liquid cooling technology, characterized in that: include: A body (1), wherein a partition is arranged inside the body (1), and the space inside the body (1) is divided into a first cavity (11) and a second cavity (12) by the partition, wherein the first cavity (11) is used to contain a first cooling liquid (A), and the second cavity (12) is used to contain a heating element (100) and a second cooling liquid (B), and the temperature of the second cooling liquid (B) is higher than the temperature of the first cooling liquid (A); a liquid replenishing port (13) and an exhaust port (14) are arranged on the body (1), wherein the liquid replenishing port (13) is communicated with the first cavity (11), and the exhaust port (14) is communicated with the second cavity (12); A jet component (2) is arranged in the second chamber (12); A power component (3) is arranged in the first cavity (11) and connected to the jet component (2), and is used to pump the first coolant (A) into the jet component (2) and jet the first coolant (A) onto the heating element (100) through the jet component (2).

2. The computing device based on phase change liquid cooling technology according to claim 1, characterized in that: There is a gap (5) between the top of the partition (4) and the top of the body (1).

3. The computing device based on phase change liquid cooling technology according to claim 1 or 2, characterized in that: One end of the partition (4) is connected to the bottom of the body (1), and the partition (4) extends in the height direction (Z) of the body (1) and is used to separate the first cavity (11) and the second cavity (12) in the horizontal direction of the body (1).

4. The computing device based on phase change liquid cooling technology according to claim 1, characterized in that: The first cavity (11) and the second cavity (12) are distributed in the height direction (Z) of the body (1).

5. The computing device based on phase change liquid cooling technology according to claim 4, characterized in that: The partition (4) comprises a bottom plate (41) and a side plate (42); the bottom plate (41) is connected to the side plate (42) and the side wall of the body (1) respectively; the bottom plate (41), the side plate (42) and the side wall of the body (1) enclose the first cavity (11); The space in the body (1) below the bottom plate (41) constitutes the second cavity (12).

6. The computing device based on phase change liquid cooling technology according to any one of claims 1 to 5, characterized in that: The main body (1) is provided with an overflow port (15), the overflow port (15) is connected to the second cavity (12), and the distance between the overflow port (15) and the bottom of the main body (1) is smaller than the distance between the top of the partition (4) and the bottom of the main body (1).

7. The computing device based on phase change liquid cooling technology according to any one of claims 1 to 6, characterized in that: The partition plate (4) and the main body (1) are integrally formed.

8. The computing device based on phase change liquid cooling technology according to any one of claims 1 to 6, characterized in that: The partition (4) is detachably connected to the main body (1).

9. The computing device based on phase change liquid cooling technology according to any one of claims 1 to 7, characterized in that: The jet component (2) comprises a nozzle (21) and a pipeline (22); the nozzle (21) is arranged in the second cavity (12); a plurality of spray holes are arranged on the nozzle (21); one end of the pipeline (22) is connected to the nozzle (21); and the other end of the pipeline (22) is connected to the power component (3).

10. The computing device based on phase change liquid cooling technology according to any one of claims 1 to 9, characterized in that: It also includes a first liquid level detection device (6), which is connected to the body (1) and is arranged in the first cavity (11) and is used to detect a first liquid level of the first cooling liquid (A); The distance between the first liquid level detection device (6) and the bottom of the body (1) is greater than the distance between the liquid inlet of the power component (3) and the bottom of the body (1).

11. The computing device based on phase change liquid cooling technology according to claim 6, characterized in that: It also includes a second liquid level detection device (7), which is connected to the body (1) and is arranged in the second cavity (12) and is used to detect a second liquid level of the second cooling liquid (B); The distance between the second liquid level detection device (7) and the bottom of the body (1) is greater than the distance between the upper surface of the heating element (100) and the bottom of the body (1).

12. The computing device based on phase change liquid cooling technology according to claim 11, characterized in that: It also includes a third liquid level detection device (8), which is connected to the body (1) and is arranged in the second cavity (12) and is used to detect a third liquid level of the second coolant (B); The distance between the third liquid level detection device (8) and the bottom of the body (1) is greater than the distance between the second liquid level detection device (7) and the bottom of the body (1), and the distance between the third liquid level detection device (8) and the bottom of the body (1) is less than or equal to the distance between the overflow port (15) and the bottom of the body (1).

13. The computing device based on phase change liquid cooling technology according to any one of claims 1 to 12, characterized in that: It also includes a liquid supply valve, which is connected to the liquid replenishing port (13).

14. The computing device based on phase change liquid cooling technology according to any one of claims 1 to 13, characterized in that: It also comprises a condensing device, which is connected to the exhaust port (14) and is used to condense the gaseous working medium output from the exhaust port (14) into a liquid working medium.

15. The computing device based on phase change liquid cooling technology according to any one of claims 1 to 14, characterized in that: It also includes a cabinet, in which at least one of the bodies is installed.

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