System comprising heating component and actinic radiation source and method of using system

Abstract

Systems including a heating component and an actinic radiation source and methods of using the systems are disclosed. A system may include a heating component to heat a photocurable composition over a substrate; an actinic radiation source configured to emit actinic radiation having a wavelength of less than 700 nm; and a controller configured to determine a target temperature to be generated by the first heating member when the photocurable composition is exposed by the actinic radiation source to achieve a photocuring temperature of the photocurable composition, where the photocuring temperature is higher than an ambient temperature. A method may include dispensing a photocurable composition over a substrate; photocuring the layer of the photocurable composition at a photocuring temperature that is higher than ambient temperature; and baking the cured layer to form a baked layer. The system and method may allow the thickness variation of the layer to be 0% or near 0%.

Description

Technical Field

[0001] The present disclosure relates to systems including heating components and actinic radiation sources and methods of using these systems. Background Art

[0002] Inkjet adaptive planarization (IAP) is used in microelectronics manufacturing. As the size of microelectronic components continues to decrease, processing including IAP becomes more difficult. The IAP process may include dispensing a photocurable composition over a substrate and arranging the substrate to contact the photocurable composition. The IAP process may also include photocuring a layer of the photocurable composition by exposing the photocurable composition to actinic radiation to form a cured layer. The photocuring is performed at room temperature, for example, at 20°C. Then, the cured layer is baked to form a baked layer. The thickness of the baked layer is thinner than the thickness of the photocurable composition. The thickness variation reduces the planarization performance of the baked layer formed by the above-mentioned IAP process. The surface of the resulting baked layer may have an uneven morphology having some areas at a locally lower height and other areas at a locally higher height. It is desirable to have a planarization layer with no height difference or at least a small height difference across such a surface. Summary of the invention

[0003] In one aspect, a system includes: a first heating component for heating a photocurable composition above a substrate; an actinic radiation source configured to emit actinic radiation having a wavelength less than 700 nm; and a controller configured to determine a target temperature to be generated by the first heating component when the photocurable composition is exposed by the actinic radiation source to achieve a photocuring temperature of the photocurable composition, wherein the photocuring temperature is higher than an ambient temperature.

[0004] In an embodiment, the system comprises an apparatus, and the first heating component and the source of actinic radiation are located in a same station within the apparatus.

[0005] In another embodiment, the system further includes a first substrate chuck configured to hold a substrate while the photocurable composition is at the photocuring temperature and exposed to actinic radiation.

[0006] In a particular embodiment, the system further includes: a second substrate chuck configured to hold the substrate while the photocurable composition is exposed to the first heating component; and a substrate transfer tool configured to transfer the substrate having the photocurable composition between the first substrate chuck and the second substrate chuck.

[0007] In yet another embodiment, the system further includes a dispensing head configured to dispense the photocurable composition over the substrate.

[0008] In yet another embodiment, the system further includes a station configured to place a superstrate in contact with the photocurable composition covering the substrate.

[0009] In other embodiments, the system further comprises a second heating component configured to heat a cured layer corresponding to the photocurable composition to form a baked layer, wherein the second heating component is configured to heat the substrate and the cured layer to a baking temperature higher than the photocuring temperature.

[0010] In another embodiment, the system further comprises a temperature sensor configured to generate a first signal corresponding to the temperature of the photocurable composition, wherein the controller is further configured to receive the first signal and send a second signal for causing the actinic radiation source to be activated when the temperature is at the photocuring temperature + / - 5°C.

[0011] On the other hand, a method includes: dispensing a photocurable composition over a substrate, wherein the photocurable composition includes a multifunctional monomer; photocuring the photocurable composition when the photocurable composition is at a photocuring temperature higher than an ambient temperature, wherein the photocurable photocurable composition forms a cured layer over the substrate; and baking the cured layer to form a baked layer, wherein the baking is performed at a baking temperature higher than the photocuring temperature.

[0012] In an embodiment, the light curing temperature is greater than 25°C.

[0013] In certain embodiments, the baking temperature is at most 500°C.

[0014] In another embodiment, the photocurable composition is at a photocuring temperature while the photocurable composition is in contact with the substrate and the superstrate.

[0015] In yet another embodiment, the cured thickness is the thickness of the cured layer of the photocurable composition before baking, the baked thickness is the thickness of the baked layer, and the thickness variation is:

[0016] ((T2-T1) / T1)×100%, where

[0017] T1 is the cured thickness,

[0018] T2 is the baking thickness, and

[0019] The thickness variation ranged from -2.0% to 2.0%.

[0020] In other embodiments, the multifunctional monomer includes a difunctional monomer, a trifunctional monomer, or a tetrafunctional monomer.

[0021] In another embodiment, the multifunctional monomer includes two or more vinyl groups.

[0022] In certain embodiments, the multifunctional monomer includes at least one aromatic ring structure.

[0023] In another embodiment, the multifunctional monomer comprises an acrylate group.

[0024] In another embodiment, the photocurable composition has a multifunctional monomer content of at least 90 wt % by weight of the photocurable composition.

[0025] In other embodiments, the method further includes receiving a baking temperature of the layer to be baked and cured; and determining the light curing temperature based on the baking temperature.

[0026] In other aspects, a system includes: a photocuring station configured to form a cured layer over a substrate at a photocuring temperature, wherein the photocuring temperature is higher than an ambient temperature; a baking station configured to bake the cured layer at the baking temperature to form a baked layer; and a controller configured to determine the photocuring temperature based at least in part on the baking temperature.

[0027] In an embodiment, the photocuring station includes a heating component configured to heat the photocurable composition above the substrate to a temperature at the photocuring temperature or a temperature closer to the photocuring temperature than the ambient temperature; and an actinic radiation source configured to emit radiation having a wavelength less than 700 nm.

[0028] In another embodiment, the system further includes a robot arm configured to move the substrate having the cured layer from the light curing station to the baking station. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The implementations are illustrated by way of example and are not limited to the accompanying drawings.

[0030] Figure 1 Included are illustrations of cross-sectional views of portions of a substrate, a layer of a photocurable composition, and a superstrate prior to photocuring the photocurable composition.

[0031] Figure 2 Including light curing and baking Figure 1 Illustration of a cross-sectional view of a substrate and layers.

[0032] Figure 3 Included is a conceptual diagram of an apparatus that may be used in forming a layer from a photocurable composition.

[0033] Figure 4 Included is a conceptual diagram of another apparatus that may be used in forming a layer from a photocurable composition.

[0034] Figure 5 A conceptual diagram of a system including apparatus that can be used in forming a layer from a photocurable composition.

[0035] Figure 6 A process flow diagram for forming a layer from a photocurable composition is included.

[0036] Figure 7 Included is an illustration of a cross-sectional view of a portion of a substrate chuck and a substrate as a droplet of a photocurable composition is dispensed over the substrate.

[0037] Figure 8 Including when the combination of the cover plate and the substrate and the droplet are moving closer to each other Figure 7 Illustration of a cross-sectional view of a substrate chuck and a substrate.

[0038] Fig. 9 Including when forming a photocurable composition layer Figure 8 Illustration of a cross-sectional view of a substrate chuck, a substrate, and a superstrate.

[0039] Fig.10 Including during the pre-exposure heating operation Fig. 9 Illustration of a cross-sectional view of a substrate chuck, a substrate, a cover plate, and a layer of a photocurable composition.

[0040] Fig.11 During the photocuring of the photocurable composition layer to form a cured layer Fig.10 Illustration of a cross-sectional view of a substrate chuck, a substrate, a cover plate, and a layer of a photocurable composition.

[0041] Fig.12 After removing the superstrate and baking the cured layer to form a baked layer Fig.11 Illustration of a cross-sectional view of a substrate chuck, substrate, superstrate, and cured layer.

[0042] Fig.13 Included are graphs illustrating thickness variation caused by a photocuring operation as a function of photocuring temperature for substrate features of different sizes.

[0043] Fig.14 Included is a graph illustrating the thickness change caused by the baking operation as a function of the photocuring temperature for different baking temperatures.

[0044] Fig.15 Included are graphs illustrating the thickness change caused by the baking operation as a function of the photocuring temperature for different photocurable compositions.

[0045] Fig.16Included are graphs illustrating thickness changes caused by a baking operation as a function of dose of actinic radiation for different photocuring temperatures.

[0046] Skilled technicians understand that the elements in the figures are illustrated for simplicity and clarity and are not necessarily drawn to scale. For example, the size of some elements in the figures may be exaggerated relative to other elements to help improve the understanding of the implementation of the present invention. DETAILED DESCRIPTION

[0047] The following description is provided in conjunction with the accompanying drawings to assist in understanding the teachings disclosed herein. The following discussion will focus on specific implementations of the teachings. This focus is provided to assist in describing the teachings and should not be interpreted as a limitation on the scope or applicability of the teachings.

[0048] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those of ordinary skill in the art to which the invention belongs. Materials, methods and examples are illustrative only and are not intended to be limiting. To the extent not described herein, many details about specific materials and processing actions are conventional and can be found in textbooks and other sources in the art.

[0049] Before introducing details of systems and methods that can be used to achieve the benefits described herein, it is now described with respect to illustrating how the shape of a layer of a photocurable composition can change during processing. Figure 1 and Figure 2 Thickness variations due to processing and planarization performance are introduced and described. Specific thicknesses and depths are provided to illustrate specific examples and are not intended to limit the scope of the invention as defined in the appended claims.

[0050] Figure 1 A cross-sectional view of a portion including a substrate 10, a layer of a photocurable composition 20 prior to photocuring (hereinafter, a "precured layer"), and a superstrate 30 having a planar bottom surface. The substrate 10 includes features 12 and trenches 14 between the features 12. Dimension 16 corresponds to the depth of the trenches 14 and is 200 nm for this particular example.

[0051] Because the photocurable composition is a fluid that contacts the planar bottom surface of the superstrate 30, the upper surface of the pre-cured layer 20 of the photocurable composition is planar. Dimension 22 corresponds to the thickness of the pre-cured layer 20 between the feature 12 and the bottom surface of the superstrate 30. In this particular example, dimension 22 is 40 nm. Dimension 24 corresponds to the thickness of the pre-cured layer 20 between the bottom of the trench 14 and the bottom surface of the superstrate 30. Dimension 24 is the sum of dimension 16 (the depth of the trench 14) and dimension 22 (the thickness of the pre-cured layer above the feature 12). Dimension 24 can be determined using Equation 1 below.

[0052] D 24 =D 16 +D 22 , (Equation 1)

[0053] in,

[0054] D 24 It is size 24,

[0055] D 16 It is size 16, and

[0056] D 22 It is size 22.

[0057] When using the aforementioned depth of 16 and thickness of 22,

[0058] D 24 =200nm+40nm=240nm.

[0059] Photocuring the pre-cured layer 20 polymerizes the monomers in the photocurable composition and forms a cured layer. During polymerization, covalent bonds are formed between the monomers in the photocurable composition and the atoms are pulled closer together, thereby shrinking the photocurable composition. After photocuring, the cured layer is baked to form a Figure 2 During the baking process, additional crosslinking occurs and causes the polymeric material to further shrink. In addition, during the baking process, some rearrangement and relaxation of the polymer may occur. Reactions such as oxidation, decomposition, degradation of the material at high temperature, or a combination thereof may occur.

[0060] Polymerization and any or all of the previously described reactions may contribute to thermal shrinkage. Figure 2 Included is substrate 10 and baked layer 40 after removal of superstrate 30. In a particular example, baked layer 40 has shrunk 5% (-5% thickness change) compared to pre-cured layer 20. Dimension 42 corresponds to the thickness of baked layer 40 over feature 12, and dimension 44 corresponds to the thickness of baked layer 20 in and over trench 14. Since the thickness change is -5%, dimension 42 is 95% of dimension 22 and dimension 44 is 95% of dimension 24. Therefore, dimension 42 is 38 nm, and dimension 44 is 228 nm.

[0061] When the upper surface of the pre-cured layer 16 is at the same height, the baked layer 40 has an upper surface with different areas at different heights. Dimension 48 corresponds to the height difference along the upper surface of the baked layer 40 between (1) the portion of the baked layer 40 covering the feature 12 of the substrate 10 and (2) the portion of the baked layer 40 above the groove 14. Dimension 48 can be determined using Equation 2 below.

[0062] D48 =D 42 -(D 44 -D 16 ), (Equation 2)

[0063] in,

[0064] D 48 It is size 48,

[0065] D 42 It is size 42, and

[0066] D 44 It is size 44.

[0067] When using the value of the size,

[0068] D 48 =38nm–(228nm-200nm)=10nm.

[0069] By reducing the thickness variation due to photocuring and baking, dimension 48 can be reduced and help planarization performance. When the thickness variation is -1%, dimension 48 can be reduced to 1.6nm, and when the thickness variation is 0%, dimension 48 can be 0nm.

[0070] As described herein, the thickness variation can be reduced by photocuring the photocurable composition at a temperature above ambient temperature. The ambient temperature is the temperature of the room in which the station performing the photocuring is located within the device. For example, the ambient temperature can be in the range of 20°C to 25°C. Photocuring at the photocuring temperature can help reduce the thickness variation associated with photocuring, and baking can produce a baked layer having an upper surface with a smaller height difference along such an upper surface compared to a different baked layer made from the same photocurable composition, wherein the precured layer is photocured at ambient temperature and then baked. The reduced thickness variation allows for better planarization performance.

[0071] In this specification, the thickness variation may be between any two of (1) a precured layer of a photocurable composition, (2) a cured layer corresponding to the precured layer, or (3) a baked layer corresponding to the precured layer. Unless expressly stated otherwise, the thickness variation is expressed as a percentage.

[0072] The thickness variation can be determined using Equation 3 below:

[0073] ((T2-T1) / T1)×100%, (Equation 3)

[0074] in,

[0075] T1 is the layer thickness at a relatively early point in the process, and

[0076] T2 is the layer thickness at a relatively late point in the process.

[0077] For example, T1 can be the thickness of the pre-cured layer, and T2 can be the thickness of the cured layer or the thickness of the baked layer. Alternatively, T1 can be the thickness of the cured layer, and T2 can be the thickness of the baked layer. Negative values ​​correspond to contraction, while positive values ​​correspond to expansion. The thickness change is described in terms of how far the thickness change is from 0%. Thus, a thickness change of -4.0% can be reduced to -1.0%, even though -4.0% is literally less than -1.0%.

[0078] The thickness measurements used to determine thickness variation should be at substantially the same locations and surface features, such as over protrusions, within recesses, within scribe lines between molds, and the like. The thickness measurements should be within an area of ​​the substrate surrounded by an isolation zone that extends a distance range of 1 mm to 9 mm from the peripheral edge toward the center of the substrate, for example, 3 mm. Thickness measurements can be made using an atomic force microscope (AFM); an interferometer; an ellipsometer; a profilometer; or any suitable instrument for measuring layer thickness or layer surface profile. As an alternative to thickness measurements, the relative height difference at two locations can be measured because the relative height difference at the two locations can represent the flatness of the planarization layer. In an implementation, a contour map can be generated from the upper surface of the layer to illustrate the height variation across such a surface.

[0079] The thickness variation may be a single thickness variation, or an average of multiple thickness variations between pairs of thickness measurements, or an average of a contour plot corresponding to the top surface of a pre-cured layer, a cured layer, or a baked layer.

[0080] The system can be configured to perform a dispensing operation of a photocurable composition, a pre-exposure heating operation, a photocuring operation, and a baking operation. The previously listed system operations can be performed in a process such as Figure 3 The device 300 or Figure 4 400 in a single device, or may be distributed among devices such as Figure 5 The system is well suited for IAP processing. The system can also be used to form a patterned layer from a photocurable composition.

[0081] After reading this specification, a skilled person will be able to determine the number of devices and their corresponding operations when designing a system. Figure 4 and Figure 5 Before we introduce the system in Figure 3 The system in.

[0082] Figure 3A conceptual diagram including a top view of a system in the form of an apparatus 300 that may be used to form a layer from a photocurable composition covering a substrate.

[0083] The apparatus 300 includes a substrate transport tool 310, a substrate container 321, a dispensing station 323, a pre-exposure heating and photocuring station 326, a post-exposure baking station 329, a controller 350, and a memory 352. The dispensing station 323 may include a substrate chuck 333, and the post-exposure baking station 329 may include a substrate chuck 339 and a dispensing head 346. The substrate chuck 333 may be coupled to a stage (not shown) that allows the substrate chuck 333 to move between the stations 323 and 326. The pre-exposure heating and photocuring station 326 may be configured to perform a pre-exposure heating operation and a photocuring operation. As will be described later with respect to Figure 4 As described, the pre-exposure heating operation may be performed at one station, and the photocuring operation may be performed at a different station.

[0084] Below, some of the components are described with respect to the functions each of the previously mentioned components performs.More details on the operation of the components, in particular stations 323, 326 and 329, are described in more detail later in this specification with respect to a method of using the apparatus 300.

[0085] The substrate transfer tool 310 can be configured to transfer one or more substrates to or from any one of the substrate container 321, the dispensing station 323, the pre-exposure heating and photocuring station 326, and the post-exposure baking station 329. The substrate transfer tool 310 can be or include one or more components of an equipment front end module (EFEM). The components of the EFEM can include one or more of the following: a robot arm, a robot arm suitable for holding a wafer, a sensor, a motor for moving the robot arm, another motor for moving the robot arm, etc. The robot arm can be configured to move the substrate with a cured layer between stations, for example, from the pre-exposure heating and photocuring station 326 to the post-exposure baking station 329. In an implementation, a specific substrate and a cover plate can have similar shapes and sizes.

[0086] The substrate container 321 may hold a plurality of substrates. The substrates may be removed from the substrate container 321, processed at a station of the apparatus 300 such as stations 323, 326, 329, or a combination thereof, and returned to the substrate container 321 when processing within the apparatus 300 is partially or completely performed.

[0087] The distribution station 323 can be configured to receive substrates, and make the photocurable composition can be distributed above the substrate. When the substrate is located above the substrate chuck 333, the photocurable composition can be distributed above the substrate using a distribution head 346. The distribution head 346 can include one or more nozzles for distributing the photocurable composition. The dotted line in the distribution head 346 is used to indicate that the photocurable composition is distributed along the bottom side of the distribution head 346. The distribution head 346 can be configured to be fixed or moved when distributing the photocurable composition. More details about the photocurable composition and the method for distributing and processing the photocurable composition will be described later in this specification. The stage coupled to the substrate chuck 333 can transfer the substrate and the photocurable composition of the cover substrate from the distribution station 323 to the pre-exposure heating and light curing station 326.

[0088] The pre-exposure heating and photocuring station 326 can be configured to perform two operations. The pre-exposure heating and photocuring station 326 can be configured to heat the photocurable composition before being exposed to actinic radiation. The pre-exposure heating and photocuring station 326 can be configured to photocure the photocurable composition by exposing the photocurable composition to actinic radiation. In another implementation, the operations to be performed by the pre-exposure heating and photocuring station 326 can be divided into two different stations. Figure 4 A system having apparatus 400 is included. Pre-exposure heating and light-curing station 326 is replaced by pre-exposure heating station 425 and light-curing station 427 .

[0089] and Figure 3 The heating components associated with the pre-exposure heating and photocuring station 326 illustrated in the figure can be activated to heat the photocurable composition. More details about the heating components of the pre-exposure heating and photocuring station 326 will be described later in this specification. Direct temperature measurement of the photocurable composition may be difficult to obtain. Therefore, the temperature of the photocurable composition may correspond to different temperatures in the pre-exposure heating and photocuring station 326. The temperature of the photocurable composition in the form of droplets or the pre-cured layer formed subsequently can be related to the temperature of the substrate chuck 333, the substrate covering the substrate chuck 333, or the cover plate (if there is a cover plate) in contact with the photocurable composition. The temperature of the photocurable composition can be determined using the temperature of the substrate chuck 333, the substrate covering the substrate chuck 333, or the cover plate (if there is a cover plate). Because the direct temperature measurement of the photocurable composition may be impractical, the user of the system can use the temperature of the substrate chuck 333, the substrate, or the cover plate (if there is a cover plate) to control the operation.

[0090] When the temperature of the substrate chuck 333, substrate or cover plate is at the target temperature or within the tolerance of such temperature, the heating component can be deactivated or placed in a holding state to keep the substrate chuck 333 or substrate at the target photocuring or within the tolerance of such temperature. The tolerance of such temperature can be + / -5°C, 2°C, 1°C or 0.5°C of the target temperature. When the photocurable composition is photocured, the target temperature can be the same as or different from the desired photocuring temperature. After the desired photocuring temperature is known, the target temperature can be determined. More details about the target temperature are described with respect to the method using the device 300.

[0091] The pre-exposure heating and photocuring station 326 can be used to form a cured layer from a photocurable composition covering the substrate. If the cover plate has not yet contacted the photocurable composition, the cover plate can be arranged to contact the droplets of the photocurable composition, so that the droplets of the photocurable composition are combined and form a pre-cured layer of the photocurable composition. When the pre-cured layer is at the photocuring temperature, the pre-cured layer of the photocurable composition can be photocured by exposing the pre-cured layer to actinic radiation. Actinic radiation can polymerize the polymerizable material in the photocurable composition. The cured layer refers to the polymerized photocurable composition layer after the pre-cured layer of the photocurable composition is photocured using actinic radiation and before the polymerized photocurable composition layer is further processed during the post-exposure baking operation. When the photocuring operation is completed, the cover plate can be removed. The substrate transfer tool 310 can transfer the substrate and the cured layer from the pre-exposure heating and photocuring station 326 to the post-exposure baking station 329.

[0092] The post-exposure baking station 329 can further polymerize or crosslink the photocurable composition within the cured layer, cause different reactions of the components within the photocurable composition, expel volatile components within the photocurable composition, and the like. The post-exposure baking station 329 can have any design including a heating component as described with respect to the pre-exposure heating and photocuring station 326. The heating component of the post-exposure baking station 329 can be the same or different from the heating component of the pre-exposure heating and photocuring station 326. In an implementation, the post-exposure baking station 329 may include a heating component configured to operate at a higher temperature than the pre-exposure heating and photocuring station 326. The temperature for post-exposure baking can be at least 150°C. The highest processing temperature associated with the post-exposure baking station 329 can be as high as 500°C. Sufficient heat shielding can be used to help prevent the heat from the post-exposure baking station 329 from adversely affecting the operation of another part of the device 300.

[0093] Each of the substrate chucks 333 and 339 may be a vacuum chuck, a pin-type chuck, a groove-type chuck, an electrostatic chuck, an electromagnetic chuck, etc. The substrate chucks 333 and 339 may be of the same type, such as a vacuum chuck, or may be of different types. For example, one of the substrate chucks may be a vacuum chuck, and the other of the substrate chucks may be an electrostatic or electromagnetic chuck. Each of the substrate chucks 333 and 339 may or may not have heating elements, cooling elements, or both that may be used to heat or cool the substrate and layers and, if present, the cover plate covering the substrate.

[0094] The stage can be coupled to one or more substrate chucks and used to move the substrate chucks within the apparatus 300. Different stages can be coupled to different substrate chucks, or a combination of such substrate chucks can be coupled to the same stage. The stage can also allow for the use of fewer substrate chucks. The substrate chuck can be coupled to a stage that can be moved between at least two different stations. Thus, it is not necessary for each station to have a dedicated substrate chuck. In a non-limiting example, the substrate can be arranged on a substrate chuck 333 coupled to a stage positioned within the dispensing station 323, and after the photocurable composition is dispensed, the stage can move the substrate chuck 333, the substrate, and the photocurable composition to the pre-exposure heating and photocuring station 326. After the operations in the pre-exposure heating and photocuring station 326 are completed and the substrate and cured layer are removed, the stage can move the substrate chuck 333 back to the dispensing station 323 to receive another subsequent substrate. At a later time relative to the dispensing station 323, the substrate chuck 333 can be moved to the dispensing station 323. Figure 4 In another implementation described, each station may have a dedicated substrate chuck.

[0095] The controller 350 can control Figure 3 The device 300, Figure 4 The device 400 or Figure 5 The following description of the controller 350 focuses on Figure 3 Except for the specific details of the devices 400 and 501, the description of the controller 350 also applies to Figure 4 The device 400 and Figure 5 The device 501 in.

[0096] The controller 350 may communicate with any or all components of the device 300 previously described and possibly with other components within or outside the device 300. The controller 350 may operate using a computer-readable program optionally stored in a memory 352. The controller 350 may include a processor (e.g., a central processing unit of a microprocessor or microcontroller), a field programmable gate array (FPGA), an application specific integrated circuit (ASIC), etc. The controller 350 may be located within the device 300. In another implementation of the system (not shown), the controller 350 may be at least a portion of a computer external to the device 300, wherein such a computer is bidirectionally coupled to the device 300. The memory 352 may include a non-transitory computer-readable medium including instructions for performing actions associated with or between transfer operations. The memory 352 may also include a data table that may be accessed by the controller 350 to assist in determining operating parameters, such as a local area density of the photocurable composition to be dispensed, a target temperature, a photocuring temperature, a dose of actinic radiation, a post-exposure bake temperature, or another parameter used in the method described below. Similar to controller 350, memory 352 may be part of the system and may be located within device 300 or external to device 300. In another implementation, any or all components may include a local controller that provides some of the functionality that would otherwise be provided by controller 350.

[0097] The previously described operations performed by any particular station may be moved with or combined with another station. For example, dispensing and pre-exposure heating and light curing may be performed in the same station, pre-exposure heating and light curing may be performed in the same station, etc. In another configuration, operations performed by one station may be performed in a separate station. Figure 4 A conceptual diagram includes a top view of another system in the form of an apparatus 400 that may be used to form a baked layer over a substrate. Apparatus 400 is the same as apparatus 300 except as described below.

[0098] Figure 3 The pre-exposure heating and light curing station 326 is Figure 4 425 and 427 are replaced by the pre-exposure heating station 425 and the light-curing station 427 in the apparatus 400. The design of each of the stations 425 and 427 can be more easily optimized compared to the pre-exposure heating and light-curing station 326 that performs both the pre-exposure heating and light-curing operations. Compared to the apparatus 300, the separate stations 425 and 427 may increase the cost of the apparatus 400 due to more components, and the footprint of the apparatus 400 may be larger than the footprint of the apparatus 300.

[0099] Figure 3 The distribution head 346 in Figure 4The dispensing module 440 is replaced by the dispensing module 440 in the dispensing station 423. The dispensing module 440 is configured to dispense the photocurable composition over the substrate when the substrate is located at the dispensing station 423. The dispensing station 423 provides the functions previously described with respect to the dispensing station 323. The dispensing module 440 may include a device coupled to a track (not shown) and allowing the dispensing module 440 to be moved with respect to the substrate. Figure 4 The dispensing module 440 includes a gantry-based system for an end portion 442 that moves in directions corresponding to the top and bottom of the substrate. The dispensing module 440 includes a bridge 444 coupled to the end portion 442 and that can pass over the substrate chuck 433. The dispensing head 446 is coupled to Figure 4 The dispensing module 440 includes a bridge 444 between the left and right sides of the dispensing head 446 and is configured to move along the bridge. The dispensing head 446 may include one or more nozzles for dispensing a photocurable composition. The dotted lines in the dispensing head 446 are used to indicate that the photocurable composition is distributed along the bottom side of the dispensing head 446. As described below with respect to the dispensing head 346, the dispensing module 440 is configured to distribute the photocurable composition with different surface densities.

[0100] Substrate chucks 433, 435, and 437 may have any of the configurations previously described with respect to substrate chucks 333 and 339. Figure 4 In the embodiment, each station has a dedicated substrate chuck. Any of the substrate chucks 433, 435 and 437 can be coupled to a stage that can help move the substrate chuck. The substrate chuck 433 can be moved to provide assistance during the dispensing of the photocurable composition. Compared to the substrate chuck 433, the substrate chucks 435 and 437 may not need to be moved and need not be coupled to the stage. In another implementation, Figure 4 Any one or more of the substrate chucks in the embodiment may be replaced by a substrate chuck similar to substrate chuck 333, which is coupled to the stage to allow for Figure 4 Movement between any two or more of the stations 423, 435, and 427 illustrated in FIG.

[0101] The controller 350 is coupled to Figure 4 Stations 423, 425 and 427 and their components in and supporting the previous Figure 3 The dispensing, pre-exposure heating, and light curing operations are described.

[0102] Not all stations in apparatus 300 or apparatus 400 may be present in a single apparatus. Any one or more of stations 323, 326, 329, 423, 425, and 427 may be located in different apparatuses. As a non-limiting example, the temperature at which post-exposure bake station 329 operates may be too high for one or more other stations in the apparatus. Post-exposure bake station 329 may interfere with the operation of the apparatus in a different apparatus. Figure 3 Station 326 or Figure 4Appropriate temperature control of the pre-cured layer of the photocurable composition during photocuring within station 427.

[0103] Figure 5 The system 500 includes apparatuses 501 and 503. The apparatus 501 and 503 are similar in structure to each other except that the post-exposure bake station 329 and the substrate chuck 339 are moved to the apparatus 503. Figure 3 The apparatus 503 may also include a substrate transfer tool 510, a substrate container 521, a controller 550, and a memory 552. The substrate transfer tool 510 provides the same functions as described with respect to the substrate transfer tool 310, and the substrate container 521 provides the same functions as described with respect to the substrate container 321.

[0104] The controller 550 and the memory 552 may be used to provide functions that support the substrate transfer tool 510, the substrate container 521, the post-exposure bake station 329, and the substrate chuck 339. The controller 550 may have any of the architectures and components described with respect to the controller 350, and the memory 552 may have any of the architectures and components described with respect to the memory 352.

[0105] Controllers 350 and 550 may communicate with each other. For example, one or both of controllers 350 and 550 may be used to confirm that a particular batch of substrates with cured layers at substrate container 521 have completed processing within apparatus 501 before baking the substrates and cured layers at post-exposure bake station 329 in apparatus 503. In another embodiment, apparatuses 501 and 503 may share a common controller, a common memory, or both a common controller and a common memory, rather than having separate controllers or separate memories in apparatuses 501 and 503.

[0106] Note the method of using apparatus 300 to form a baked layer over a substrate. Figure 6 Including relative to Figure 3 and Figures 7 to 12 A process flow diagram of the method described is provided below. A specific process flow is described below in conjunction with the accompanying drawings, and this specific process flow relates to an IAP process. Many different process flows can be used and the process flows still use the concepts described herein to achieve benefits. For example, the process can be used for imprint lithography of a patterned resist layer that is a photocurable composition made using a patterned overlay. As used hereinafter, the unpatterned substrate is referred to as a blank and the patterned overlay is referred to as a template. Other variations of the process flow are described later in this specification. After describing the method relative to apparatus 300, a description is given of processes such as when using Figure 4 The device 400 or Figure 5 The system 500 in FIG. 5 is another example of how the process may be changed. Figures 7 to 9 , Fig.11 , Fig.12 The substrate chuck 333 may include a Fig.10 The heating element, temperature sensor, or both are shown in FIG. Figures 7 to 9 , Fig.11 and Fig.12 No pictures in Fig.10 The heating components and temperature sensors in the substrate chuck 333 are used to simplify the integration Figures 7 to 9 , Fig.11 and Fig.12 An understanding of the operations performed.

[0107] refer to Figure 3 , the method may include transferring a substrate from a substrate container 321 to a dispensing station 323. The controller 350 or a local controller may send a signal for causing the substrate transfer tool 310 to remove the substrate from the substrate container 321 and move the substrate to the dispensing station 323. The substrate transfer tool 310 may place the substrate on a substrate chuck 333 within the dispensing station 323.

[0108] The method may include Figure 6 The photocurable composition is dispensed above the substrate at frame 222 in the embodiment. The photocurable composition may include a polymerizable material and a photoinitiator. The photocurable composition may include or may not include a solvent. In other implementations, the photocurable composition may include another additive. Non-limiting examples of another additive may be a surfactant, a dispersant, a stabilizer, an inhibitor, a dye, or a combination thereof.

[0109] The polymerizable material may include a single monomer compound or a mixture of monomer compounds. In an embodiment, the polymerizable material may include a multifunctional monomer. The multifunctional monomer in the photocurable composition may constitute a major part of the photocurable composition based on weight percentage. In one embodiment, the amount of the multifunctional monomer in the photocurable composition may be at least 60 weight % based on the gross weight of the photocurable composition, or at least 70 weight % based on the gross weight of the photocurable composition, or at least 80 weight %, or at least 90 weight %, or at least 92 weight %, or at least 95 weight %. In another implementation, the amount of the multifunctional monomer may be at most 99.5 weight % based on the gross weight of the photocurable composition, such as at most 99 weight % based on the gross weight of the photocurable composition, or at most 98 weight %, or at most 97 weight %, or at most 95 weight %, or at most 93 weight %, or at most 90 weight %. In addition, the amount of the multifunctional monomer can be within a range comprising any of the above minimum and maximum values, for example, in a range of 60 wt % to 99.5 wt %, 70 wt % to 99 wt %, 80 wt % to 98 wt %, or 90 wt % to 97 wt % based on the total weight of the photocurable composition.

[0110] In one implementation, the multifunctional monomer can be a difunctional monomer, a trifunctional monomer or a tetrafunctional monomer. The functional group can be a vinyl group, an acrylate group, an acrylamide group, a methacrylate group, a maleimide group, an epoxy group, a lactone group, an acetal group, a cyclic ether group, a lactam group, a hydroxyl group, a carboxyl group, a sulfide group or an amine group, and other possibilities are also available. The multifunctional monomer compound can include functional groups of the same type (for example, all functional groups in the multifunctional monomer compound are vinyl groups) or different types of functional groups. In an implementation, the multifunctional monomer can include multifunctional acrylate monomers, multifunctional vinyl monomers or combinations thereof.

[0111] In a specific implementation, the multifunctional monomer may include at least two acrylate groups or at least three or at least four acrylate groups. As used herein, the term acrylate monomer refers to substituted and unsubstituted acrylate monomers. Non-limiting examples of substituted acrylate monomers may be C1-C8 alkyl acrylates, for example, methacrylate or ethyl acrylate.

[0112] In another implementation, the multifunctional monomer may include at least two, or at least three, or at least four vinyl groups.

[0113] In an implementation, the multifunctional monomer may include both an acrylate group and a vinyl group. In another implementation, the multifunctional monomer may further include one or more aromatic ring structures.

[0114] Another multifunctional monomer may include two or more vinyl groups and at least one aromatic ring structure, for example, one or more benzene rings. In an implementation, the multifunctional monomer may include a vinylbenzene or divinylbenzene compound. In a specific implementation, the multifunctional monomer may be a biphenyl or diphenylmethane compound including two, three or four vinyl groups.

[0115] Table 1 below includes a list of exemplary multifunctional monomer compounds that can be used as polymerizable materials in the photocurable composition. This list is intended to be illustrative rather than comprehensive and is not intended to limit the polymerizable material compounds that can be used.

[0116] Table 1 - Exemplary multifunctional monomer compounds

[0117]

[0118]

[0119] The photoinitiator may include a single photoinitiator compound or a mixture of photoinitiator compounds. In the same or another implementation, the photoinitiator compound may be an oxime ester compound. The oxime ester compound may have a structure of formula (1):

[0120]

[0121] in,

[0122] R1 is an aromatic ring system or a heteroaromatic ring system,

[0123] R2 is H or C1-C8 alkyl, and

[0124] R3 is H or C1-C8 alkyl.

[0125] In certain implementations, the photoinitiator of the photocurable composition may also include a photoinitiator compound that is not an oxime ester compound.

[0126] Table 2 below includes a list of exemplary photoinitiator compounds that can be used in the photocurable composition. This list is intended to be illustrative rather than comprehensive and is not intended to limit the initiator compounds that can be used.

[0127] Table 2 - Exemplary Initiator Compounds

[0128]

[0129] Irgacure compounds are available from BASF SE, Ludwigshafen am Rhein, Germany. Omnirad is available from IGM Group, Waalwijk, The Netherlands.

[0130] The amount of the photoinitiator in the photocurable composition can be at least 1.0% by weight based on the total weight of the photocurable composition, or at least 1.5% by weight, at least 2.0% by weight, at least 2.5% by weight, at least 3.0% by weight, at least 3.5% by weight, or at least 4.0% by weight based on the total weight of the photocurable composition. On the other hand, the amount of the multifunctional monomer in the photocurable composition can be up to 10.0% by weight based on the total weight of the photocurable composition, up to 8.0% by weight, up to 7.0% by weight, up to 6.0% by weight, up to 5.0% by weight, or up to 4.0% by weight based on the total weight of the photocurable composition. The amount of the photoinitiator in the photocurable composition can be a value between any of the above minimum and maximum numbers, for example, in the range of 1.0% to 10.0% by weight, 1.5% to 8.0% by weight, or 2.0% to 7.0% by weight based on the total weight of the photocurable composition.

[0131] In an implementation, the photocurable composition can be substantially free of solvent. As used herein, if not otherwise indicated, the term solvent refers to a compound that can dissolve or disperse polymerizable materials but does not polymerize itself during the photocuring of the photocurable composition. The term "substantially free of solvent" means in this article that the amount of solvent is at most 5 weight % based on the gross weight of the photocurable composition. In a specific implementation, the amount of solvent can be at most 3 weight %, at most 2 weight %, at most 1 weight % based on the gross weight of the photocurable composition, or except unavoidable impurities, the photocurable composition can be free of solvent.

[0132] On the other hand, photocurable composition can include the solvent of 5 % by weight of the gross weight based on photocurable composition that amount is greater than.In particular aspects, the amount of solvent can be at least 10 % by weight based on the gross weight of photocurable composition, or at least 15 % by weight, at least 20 % by weight or at least 25 % by weight based on the gross weight of photocurable composition.On the other hand, the amount of solvent can be at most 40 % by weight, at most 30 % by weight, at most 20 % by weight or at most 10 % by weight based on the gross weight of photocurable composition.In specific implementation, the amount of solvent can be the value between any one in the above-mentioned minimum number and maximum number in the photocurable composition, for example, the value in the scope of 5 % by weight to 40 % by weight, 10 % by weight to 30 % by weight or 15 % by weight to 20 % by weight based on the gross weight of photocurable composition.

[0133] Surfactant can comprise single surfactant compound or the mixture of surfactant.Surfactant compound can be fluorine-containing compound, and in implementation, surfactant compound can be fluorine-containing organic compound.Table 3 below includes the list of exemplary surfactant compounds that can be used in photocurable composition.This list is intended to be illustrative rather than comprehensive, and is not intended to limit the surfactant compounds that can be used.

[0134] Table 3 - Exemplary Surfactant Compounds

[0135]

[0136] Capstone TM FS-3100 is available from Chemours, Inc., Wilmington, Delaware, USA.

[0137] The surfactant may be present in an amount of up to 5.0 wt % based on the total weight of the photocurable composition. In a specific implementation, the amount of the active agent may be present in an amount of up to 3.0 wt %, up to 2.0 wt %, or up to 0.9 wt % based on the total weight of the photocurable composition.

[0138] Returns the method and Figure 3 and Figure 7 ,like Figure 7 As shown in FIG. 1 , the dispensing head 346 dispenses droplets 322 of the photocurable composition over the exposed surface of the substrate 302. During the dispensing operation, the substrate chuck 333 can be coupled to a stage that is configured to move the substrate chuck 333 (by Figure 7 ). In another implementation, the dispensing head 346 moves while the substrate chuck 333 is fixed. Thus, the substrate 302 may move, and the dispensing head 346 may be fixed or also move.

[0139] The substrate 302 may have an exposed surface having protrusions at a relatively higher height than adjacent recesses. Figure 7 In the embodiment, the exposed surface of the substrate 302 has protrusions 3022 and recesses 3024. The substrate 302 has a local area of ​​protrusions 3022 having a relatively higher surface density than the recesses 3024, and another local area of ​​recesses 3024 having a relatively higher surface density than the protrusions 3022. In the case where the protrusions 3022 occupy a relatively larger proportion of the local area, a photocurable composition with a lower surface density is dispensed, and in the case where the recesses 3024 occupy a different relatively larger proportion of the local area, a photocurable composition with a higher surface density is dispensed. In fact, the exposed surface of the substrate 302 is larger than the surface density of the recesses 3024. Figure 7The one illustrated in is significantly more complex, and is not limited to just two facades. Figure 7 The exposed surface of the substrate 302 in FIG. 1 is simplified to aid in understanding the concepts described herein.

[0140] The controller 350 or a local controller can send a signal so that the dispensing head 346, the worktable coupled to the substrate chuck 333 (when the substrate chuck 333 is coupled to the worktable), or both move in a desired direction and speed, and the dispensing head 346 dispenses droplets 322 of the photocurable composition at a desired rate so as to achieve an appropriate local surface density of the photocurable composition along the exposed surface of the substrate 302.

[0141] refer to Figure 3 , Figure 7 and Figure 8 , the stage coupled to the substrate chuck 333 can transfer the substrate 302 and the droplet 322 of the photocurable composition from the dispensing station 323 to the pre-exposure heating and photocuring station 326. The controller 350 or the local controller can send a signal for causing the stage to move the substrate chuck 333, the substrate 302, and the droplet 322 of the photocurable composition from the dispensing station 323 to the pre-exposure heating and photocuring station 326.

[0142] This processing also includes Figure 6 The photocurable composition is contacted with a cover plate at frame 224 of the present invention. Cover plate 422 can be used to assist in forming a cured layer from droplets 322 of the photocurable composition. In an implementation, cover plate 422 can be a blank with a planar bottom surface facing substrate 302 and droplets 322. Each of apparatuses 300, 400, and 501 can include a cover plate handler that can be used to move and position cover plate 422. In the same or different implementations, cover plate 422 can be held by a planarization head within pre-exposure heating and photocuring station 326.

[0143] For actinic radiation used to photocuring the photocurable composition, the cover plate 422 has a transmittance of at least 70%, at least 80%, at least 85%, or at least 90%. The cover plate 422 may include a glass-like material, silicon, an organic polymer, a siloxane polymer, a fluorocarbon polymer, sapphire, spinel, another similar material, or any combination thereof. The glass-like material may include soda-lime glass, borosilicate glass, alkali-barium silicate glass, aluminosilicate glass, quartz, fused quartz, etc. In an implementation, the actinic radiation may be ultraviolet radiation, and the glass-like material may be used for the cover plate 422. The cover plate 422 may have a thickness in the range of 30 microns to 2000 microns. The contact surface of the cover plate 422 may have a surface area of ​​at least 90% of the area of ​​the substrate 302, and may have a surface area that is the same as or larger than the substrate 302.

[0144] The contact surface of the cover plate 422 has a two-dimensional shape, including a circle, an ellipse, a rectangle (including a square), a hexagon, etc. Figure 8 In the implementation illustrated in , the contact surface is free of any depressions and protrusions and may be referred to as a blank. In an alternative implementation, the superstrate has depressions and protrusions which are then transferred into the photocurable composition.

[0145] refer to Figure 3 , Figure 8 and Fig. 9 , the controller 350 or the local controller may send a signal for moving the cover plate 422 and the droplet 322 closer to each other and into contact. The cover plate 422 may be moved, the substrate chuck 333 may be moved, or both the cover plate 422 and the substrate chuck 333 may be moved. When the cover plate 422 contacts the droplet 322 of the photocurable composition, the droplet 322 may combine to form a pre-cured layer 502 of the photocurable composition. The upper surface 512 of the pre-cured layer 502 conforms to the bottom contact surface of the cover plate 422.

[0146] This processing also includes Figure 6 Frame 226 of the present invention heats the pre-cured layer of the photocurable composition. Frame 226 can be performed when the photocurable composition is between substrate 302 and cover plate 422 and / or can be started before or during frame 224. During photocuring or subsequent baking operations, the pre-cured layer 502 or the cured layer formed by the pre-cured layer 502 can have a thickness variation after photocuring, after a subsequent baking operation, or after both photocuring and subsequent baking operations. When the pre-cured layer 502 is exposed to actinic radiation, the target temperature for pre-exposure heating can depend on the desired photocuring temperature. The desired photocuring temperature can depend on the thickness variation between the pre-cured layer 502 and its corresponding baking layer after photocuring and baking, or between the cured layer and its corresponding baking layer.

[0147] The increased photocuring temperature can allow the thickness variation between the precuring layer 502 and its corresponding baking layer or between the curing layer and its corresponding baking layer to be 0% or close to 0%. The desired photocuring temperature can depend on the materials in the photocurable composition. Among the materials in the photocurable composition, the polymerizable material has the greatest impact on the selected temperature. The photoinitiator that can include a single photoinitiator compound or a mixture of photoinitiator compounds can have a smaller impact on the selected temperature. Other materials in the photocurable composition may have no impact or insignificant impact on the temperature selected for pre-exposure heating.

[0148] Empirical data can be generated to determine the desired photocuring temperature. After photocuring and baking, the thickness of the baking layer can be thicker, thinner, or roughly the same as the thickness of the precuring layer 502 or the cured layer. A curve graph can be generated from the empirical data to determine the thickness change. The significant variables of the curve graph can include (1) a specific photocurable composition, (2) post-exposure baking temperature, (3) photocuring temperature, and (4) the dose of actinic radiation during photocuring. The data of the thickness change and the four variables can be stored in a table in the memory 352. For each line in the curve graph, three of the four variables can remain constant, while the last variable of the three or four variables changes to determine its effect on the thickness change. For example, for a specific photocurable composition, when the photocuring temperature changes, the baking temperature and dose remain constant. More details about the empirical data can be found in the examples section later in this description.

[0149] The thickness variation between the pre-cured layer 502 and its corresponding baked layer can be within the tolerance range of the target thickness variation. The target thickness variation can be 0%, and the tolerance range can be within the range of values ​​that provide good planarization performance. The tolerance range can be + / -2.0%, + / -1.0%, or + / -0.5%. For example, the production specification can have a thickness variation of 0%+ / -1.0%, so the thickness range can be in the range of -1.0% to 1.0%. For a specific combination of a specific photocurable composition and a specific baking temperature, a 0% thickness variation may not be achieved. For example, this combination can only achieve a thickness variation of -1% at most. The desired photocuring temperature corresponding to a thickness variation of -1% or close to -1% can be selected.

[0150] The empirical data may be stored in a table in memory 352 or in a database external to apparatus 300. Controller 350 may receive information about the photocurable composition, dose of actinic radiation, baking temperature, or a combination thereof to be used to form the baked layer and determine a desired photocuring temperature to use.

[0151] After determining the desired photocuring temperature, a target temperature during the pre-exposure heating period may be determined by the controller 350 or a local controller. The target temperature may be the same as or different from the desired photocuring temperature. For example, the substrate 302, pre-curing layer 502, and cover plate 422 may or may not be cooled between pre-exposure heating of the pre-curing layer 502 and photocuring of the pre-curing layer 502. The pre-exposure heating of the pre-curing layer and photocuring of the pre-curing layer may be performed in the pre-exposure heating and photocuring station 326, and the target temperature and the desired photocuring temperature may be the same. Brief Reference Figure 4, the pre-cured layer 502 can be cooled as the substrate 302, pre-cured layer 502, and superstrate 422 move from the pre-exposure heating station 425 to the photocuring station 427. The target temperature can be higher than the desired photocuring temperature so that the pre-cured layer 502 cools to the desired photocuring temperature while it is in the photocuring station 427. After reading this specification, a skilled artisan will be able to determine the target temperature for a particular set of equipment and the potential temperature variation between pre-exposure heating of the pre-cured layer 502 and photocuring of the pre-cured layer 502.

[0152] The substrate 302, the pre-cured layer 502 and the superstrate 422 are heated to a target temperature using a heating component. Fig.10 , the heating component may include a resistive heating element 622 within the substrate chuck 333 or a radiant heating element 624 positioned above the substrate chuck 333. The radiant heating element 624 may include a heating lamp, an infrared lamp, etc. Although not shown, the heating component may include an electromagnet for using induction assisted heating, a microwave generator for generating microwaves, a pump for assisting the flow of heated fluid through a channel within the substrate chuck 333, or a fan for assisting convection by flowing heated gas through the substrate 302, the pre-curing layer 502, and the cover plate 422. The heating component may have only one type of heating component (e.g., a resistive heating element, an electromagnet for induction heating, a radiant heating element, a microwave generator, a pump for flowing a heated fluid within the substrate chuck 333, or a fan for assisting convection heating) or a combination of different types of heating components (combinations of any two or more of the foregoing).

[0153] The heating component provides heat so that the substrate 302, pre-cured layer 502, and superstrate 422 reach a target temperature that is higher than the ambient temperature. The room in which the apparatus 300 is located may be at an ambient temperature of 20°C. In such a room, the heating may raise the temperature of the pre-cured layer 502 so that the pre-cured layer 502 is at 21°C or higher when exposed to actinic radiation. When the apparatus 300 is operating, the room may reach an ambient temperature of 24°C, and the heating may raise the temperature of the pre-cured layer 502 so that the pre-cured layer 502 is at 25°C or higher when exposed to actinic radiation. Depending on the ambient temperature, the target temperature may be at least 21°C, at least 25°C, at least 30°C, at least 35°C, or at least 40°C.

[0154] When the photocurable composition within the pre-cured layer 502 is exposed to a sufficiently high temperature, the photocurable composition can be polymerized in large quantities without being exposed to actinic radiation. Therefore, the target temperature should not be so high that the photocurable composition is polymerized in large quantities during the pre-exposure heating. In an implementation, the target temperature can be at most 150°C, in which case a small amount of polymerization may occur at 150°C. In another implementation, the target temperature for pre-exposure heating can be at most 100°C, at most 80°C, or at most 70°C. The target temperature for pre-exposure heating can be a value between any of the above minimum and maximum numbers, for example, a value in the range of from 21°C to 150°C, 25°C to 100°C, 30°C to 80°C, or 35°C to 70°C.

[0155] During pre-exposure heating, the controller 350 or a local controller may receive temperature data from the temperature sensor 632 or 634 and send a signal so that a heating component such as a resistive heating element 622 or a radiant heating element 624 heats the substrate 302, the pre-curing layer 502, and the superstrate 422 to a target temperature.

[0156] The method may include Figure 6 The photocurable composition is photocured at frame 228 to form a cured layer. Figure 3 , for a specific photocurable composition, memory 352 may include information about a target wavelength or target wavelength range of actinic radiation, a target dose or target dose range to be used for a photocurable composition, or other data related to photocuring a photocurable composition. Controller 350 or a local controller may use this information to determine parameters for exposing a photocurable composition to actinic radiation. Controller 350 may access previously described empirical data that may provide a desired photocuring temperature of a specific photocurable composition, a baking temperature to be used during post-exposure baking, a dose of actinic radiation to be used for photocuring a precuring layer 502, or a combination thereof. The temperature during photocuring is referred to herein as actual photocuring temperature. The actual photocuring temperature may be at or near the desired photocuring temperature. The actual photocuring temperature may be any one of the previously described target temperature and tolerance.

[0157] refer to Figure 3 , Fig.10 and Fig.11 , the controller 350 or a local controller may receive a signal or a derivative of such a signal from a temperature sensor and determine whether the temperature is at or within a tolerance (e.g., + / -5°C, + / -2°C, + / -1°C, or + / -0.5°C) of the desired light curing temperature. When the temperature is at or within a tolerance, such as Fig.11As shown in FIG. 7 , controller 350 or a local controller may send a signal causing actinic radiation source 732 to be activated.

[0158] Actinic radiation is emitted from actinic radiation source 732. At least 70% of the actinic radiation reaching superstrate 422 is transmitted through superstrate 422. The actinic radiation transmitted through superstrate 422 activates the photoinitiator within the photocurable composition in pre-cured layer 502 to assist in the polymerization of the polymerizable material within the photocurable composition. The actinic radiation may have a wavelength of at least 10 nm and less than 700 nm. The actinic radiation may be ultraviolet radiation having a wavelength in the range of 10 nm to 400 nm, and more specifically in the range of 100 nm to 360 nm. A supplier of the photocurable composition may provide a target wavelength or a target wavelength range to be used for photocuring the photocurable composition.

[0159] Energy from exposure to actinic radiation is transferred from pre-cured layer 502 ( Fig.10 ) to form a solidified layer 702 ( Fig.11 ). The cured layer 702 has an upper surface 712. The energy polymerizes the polymerizable material in bulk to form a polymer material. The polymer material can be a single polymer compound or can be a copolymer. Exposure to actinic radiation polymerizes the polymerizable material in the pre-cured layer 502 in bulk, but may not be completely polymerized. During the post-exposure baking of the cured layer 702, further polymerization may occur. The supplier of the photocurable composition can provide a target dose or target dose range to be used for the photocurable composition. Alternatively, a skilled technician can generate empirical data to determine the dose or dose range that can be used for a specific photocurable composition.

[0160] The method may also include removing superstrate 422 from cured layer 702. The photocurable composition may include an internal release agent that remains in cured layer 702 after polymerization. The internal release agent may help reduce the likelihood of damaging or removing part or all of cured layer 702 when removing superstrate 422.

[0161] The method may include Figure 6 The cured layer is baked at frame 229 to form a baked layer. During the baking operation, the material in the cured layer 702 may further polymerize, crosslink, or both. Fig.12 When baking layer 802 in the embodiment of the present invention, the baking operation can also help remove relatively volatile components (if any) from solidified layer 702. Baked layer 802 has an upper surface 812. The baking operation may or may not cause further thickness variation between solidified layer 702 and baked layer 802.

[0162] refer to Figure 3 , Fig.11 and Fig.12 , the controller 350 or the local controller may send a signal for causing the substrate transfer tool 310 to remove the substrate 302 and the cured layer 702 from the pre-exposure heating and light curing station 326 and move the substrate 302 and the cured layer 702 to the post-exposure baking station 329. The substrate transfer tool 310 may place the substrate 302 on the substrate chuck 339 within the post-exposure baking station 329.

[0163] The heating element in the post-exposure baking station 329 is used to heat the cured layer 702 ( Fig.11 ) to form a baked layer 802 ( Fig.12 ). Any of the heating components previously described with respect to the pre-exposure heating operation can be used for the baking operation. The heating component provides heat at a temperature higher than the temperature used for the pre-exposure heating operation. The baking temperature can be at least 100°C higher than the photocuring temperature. The baking temperature can be at least 100°C, at least 150°C, or at least 200°C. The baking temperature should not be so high as to cause significant decomposition or another adverse effect of the baking layer 802. The baking temperature can be at most 500°C, at most 450°C, or at most 400°C. The baking temperature can be a value between any of the above minimum and maximum numbers, for example, in the range of 100°C to 500°C, 150°C to 450°C, or 200°C to 400°C. In a specific implementation, the baking temperature can be in the range of 350°C to 400°C.

[0164] The soaking time is the time that the substrate 302 and the covering polymer layer are at the baking temperature. The soaking time needs to be sufficient to achieve the required or desired further polymerization amount, reduce the amount of volatile components in the polymer layer to the desired amount, or both. The soaking time can be at least 0.25 minutes, at least 1 minute, or at least 3 minutes. After a sufficiently long time, further exposure to the baking temperature may not be enough to improve the polymer layer (a sufficient amount of polymerization has occurred, the remaining amount of volatile components is low enough to not cause problems during subsequent processing, etc.), or may begin to cause adverse effects such as making the upper surface 812 of the baking layer 802 rough, the baking layer 802 is likely to be delaminated from the substrate 302, etc. The soaking time can be up to 60 minutes, up to 30 minutes, or up to 15 minutes. The soaking time can be a value between any one of the above minimum and maximum numbers, for example, in the range of 0.25 minutes to 60 minutes, 1 minute to 30 minutes, or 3 minutes to 15 minutes.

[0165] The baking operation may be performed using a gas. The gas may include a material that is relatively inert to the solidified layer 702 and the baked layer 802. The material may include N2, CO2, an inert gas (Ar, He, etc.) or a mixture thereof. The gas may not include an oxidizing substance, such as O2, O3, N2O, etc., or may include no more than 10 mol% or no more than 0.5 mol% of an oxidizing substance.

[0166] As shown, the post-exposure bake station 329 is configured to process a single substrate at a time. In another implementation, the post-exposure bake station 329 can be configured to process multiple substrates during the same baking operation. The post-exposure bake station 329 can include a box or another suitable substrate container, or can receive a box or another suitable substrate container, wherein the box or another suitable substrate container can hold multiple substrates. The post-exposure bake station 329 can be located within the device 300 or can be external to the device 300.

[0167] refer to Figure 3 , the controller 350 or the local controller may send a signal for causing the post-exposure bake station 329 to flow an inert gas within the post-exposure bake station 329 and control the heating components to maintain the substrate 302 and the cured layer 702 at a desired temperature during the soak time. After the soak time, the controller 350 or the local controller may send a signal for causing the substrate transfer tool 310 to remove the substrate 302 and the baked layer 802 from the post-exposure bake station 329. Before the substrate 302 and the baked layer 802 are moved back to the substrate container 321, the substrate 302 and the baked layer 802 may be moved to a cooling plate by the substrate transfer tool 310 to reduce the temperature of the substrate 302 and the baked layer 802. After the cooling is completed, the controller 350 or the local controller may send a signal for causing the substrate 302 and the baked layer 802 to move to the substrate container 321.

[0168] Mainly relative to Figure 3 These methods are described in the apparatus 300 in FIG. Figure 4 The device 400 and Figure 5 The method of the system 500 including the apparatuses 501 and 503 may be substantially the same.

[0169] refer to Figure 5 , post-exposure baking can be performed in an apparatus 503 different from the apparatus 501 that performs dispensing, pre-exposure heating, and photocuring. A person, a robot, a trolley, etc. can transfer a substrate container having a substrate and a cured layer from the apparatus 501 to the apparatus 503 so that the cured layer can be baked to form a baked layer.

[0170] Figure 4The apparatus 400 in allows important operations in the method to be performed by dedicated stations. Compared to the pre-exposure heating and photocuring station 326 that performs both pre-exposure heating and photocuring, pre-exposure heating is performed in the pre-exposure heating station 425, and photocuring is performed in the photocuring station 427. Each of the stations 425 and 427 can be optimized for their respective operations; however, processing may be more complicated. When the substrate with the heated pre-cured layer of the photocurable composition is transferred from the pre-exposure heating station 425 to the photocuring station 427, some cooling of the heated pre-cured layer may occur before photocuring is performed. The target temperature during pre-exposure heating can be higher than the desired photocuring temperature to account for cooling during transfer between stations 425 and 427. As a non-limiting example, the desired photocuring temperature can be 60°C. The target temperature can be 63°C to allow for a 3°C temperature drop between the end of the pre-exposure heating and the photocuring of the heated pre-cured layer. Process control may be more difficult.

[0171] The device 400 has a gantry-based dispensing module 440. The gantry-based design may be useful if the device has multiple dispensing stations that share the dispensing module 440. As another alternative, the dispensing module 440 may be redesigned to fit within the dispensing station 423. In another alternative, Figure 3 The distribution station 323 in can replace Figure 4 The distribution station 423 and the distribution module 440 in.

[0172] The apparatus 400 may have a fixed substrate chuck, and since a stage is not required, the design of the apparatus 400 may be simplified. Figure 3 ) and device 501( Figure 5 ) can be modified so that each station has a fixed substrate chuck.

[0173] However, with a fixed substrate chuck, the substrate transfer tool 310 can transfer the substrate, pre-cured layer, and cover plate between different substrate chucks, and the position of the cover plate relative to the substrate can shift during the transfer. With a fixed substrate chuck, the transfer operation between stations using the substrate transfer tool 310 can be slower to reduce the possibility of the cover plate shifting relative to the substrate. In another implementation, Figure 4 Any two or more of the substrate chucks 433, 435, and 437 in the embodiment may be coupled to the stage. Figure 3 The substrate chuck 333 is replaced in order to allow the movement of the substrate chuck 333, instead of Figure 4 The substrate is moved between the substrate chucks 433, 435 and 437.

[0174] Further processing options are available for Figures 3 to 5 Any one or more of the systems illustrated in . Fig.10 In the embodiment of the present invention, the substrate 302, the pre-curing layer 502 and the cover plate 422 are heated together during the pre-exposure heating. The substrate 302, the photocurable composition (as droplets 322) or the cover plate 422 can be heated separately as part of the pre-exposure heating operation. The substrate 302 can be heated before or during the distribution of the droplets 322 of the photocurable composition, the photocurable composition can be heated before the photocurable composition is distributed on the substrate 302, and the cover plate 422 can be heated before the cover plate 422 contacts the droplets 322 of the photocurable composition. Separate heating may complicate the pre-exposure heating operation. For example, the substrate 302 and the cover plate 422 with or without the droplets 322 can be heated separately before the cover plate 422 contacts the droplets 322. The temperature of the substrate 302 and the cover plate 422 can be different, even if the temperature is intended to be the same. One or both of the substrate 302 and the cover plate 422 with or without the droplets 322 can be heated to a target temperature higher than the desired photocuring temperature. After forming the pre-cured layer 502 by contacting the superstrate 422 , the combination of the substrate 302 , the pre-cured layer 502 , and the superstrate 422 may be allowed to cool to a temperature at or near a desired photocuring temperature while the pre-cured layer 502 is photocured.

[0175] When the substrate 302 and the droplet 322 are located at the dispensing station 323, the pre-exposure heating and light curing station 326 ( Figure 3 and Figure 5 ), or pre-exposure heating station 425 or light curing station 427 ( Figure 4 ), the cover plate 422 may be arranged to contact the droplet 322. The cover plate 422 may have a similar size and shape as the substrate 302. The cover plate 422 may be arranged to contact the droplet 322 using the substrate transfer tool 310.

[0176] After reading this specification, skilled technicians will understand that many system configurations and processing options are available without departing from the concepts described herein. Skilled technicians will be able to determine the specific system configuration and specific method to meet the needs or expectations of a specific application.

[0177] The above-mentioned treatment can be used to form a planarization layer or a patterned resist layer from a photocurable composition. The above-mentioned treatment can be integrated as a part of a manufacturing method for making articles. Articles can be circuit elements, optical elements, micro-electromechanical systems (MEMS), recording elements, sensors, molds, integrated circuits, etc. Integrated circuits can be solid-state memories (such as, dynamic random access memory (DRAM), static random access memory (SRAM), flash memory, and magnetoresistive memory (MRAM)), microprocessors, microcontrollers, graphics processing units, digital signal processors, field programmable gate arrays (FPGAs) or semiconductor components, power transistors, charge coupled devices (CCDs), image sensors, etc.

[0178] The method may also include an etching process for transferring an image into the substrate, the image corresponding to a pattern in one or both of the baked layer or the patterned layer below the baked layer. The substrate may further be subjected to other processes for device (article) manufacturing, including, for example, curing, oxidation, layer formation, deposition, doping, planarization, photolithography, etching, formable material removal, cutting, bonding, and packaging. The substrate may be processed to make a plurality of articles (devices), for example, the substrate may be a semiconductor wafer.

[0179] Example

[0180] The examples described below are provided to demonstrate that the thickness variation of a layer formed by a photocurable composition can be affected by the temperature of the photocurable composition during photocuring. The examples are intended to assist in understanding the concepts described herein, but are not intended to limit the scope of the invention as defined in the appended claims. In the examples, the values ​​of the thickness variation are rounded to the nearest tenth.

[0181] Table 4 below includes exemplary photocurable compositions A, B, C, and D. The values ​​in the table are parts by weight of each component in the photocurable composition.

[0182] Table 4 - Photocurable compositions used in the examples

[0183]

[0184]

[0185] 1. Thickness variation caused by photocuring that is not affected by the geometry of features within the substrate

[0186] Example 1 demonstrates that the thickness variation caused by photocuring is not significantly affected by different line / space dimensions. For all samples in Example 1, a photocurable composition D was deposited on a substrate. The photocurable composition D for some of the substrates was patterned using a template having an area with a pattern of 200nm lines and 200nm spaces and another area with a pattern of 2μm lines and 2μm spaces. The etch depth (50nm) of the template in these two areas was measured, so the initial height of the features made of the photocurable composition D was known before photocuring. For all samples in Example 1, during photocuring, the photocurable composition D was exposed to a dose of 15J / cm 2 Data were collected for photocuring temperatures ranging from 22°C to 70°C. The thickness change was determined by Equation 3 above, where T1 is the etch depth of the template and T2 is the thickness of the corresponding cured layer. Fig.13 The data are included and the thickness variation for different patterns are compared. The Y-axis is the thickness variation between the initial patterned layer and the cured layer (after exposure to actinic radiation and before post exposure bake) of the photocurable composition.

[0187] For the line corresponding to the pattern with 200 nm lines and 200 nm spaces ("Center 200 nm"), the thickness variation of the layer was approximately -0.1% when the temperature of the photocurable composition during exposure was in the range of 22° C. to 40° C. As the temperature of the photocurable composition D during photocuring increased from 40° C. to 70° C., the thickness variation of the layer increased from -0.1% to -0.6%.

[0188] For the line corresponding to the pattern having 2 μm lines and 2 μm spaces ("Center 2 μm"), the thickness variation of the layer was approximately -0.1% when the temperature of the photocurable composition during exposure was in the range of 22° C. to 30° C. As the temperature of the photocurable composition D during photocuring increased from 30° C. to 70° C., the thickness variation of the layer increased from -0.1% to -0.8%.

[0189] Fig.13 The same general trend is shown for both patterns. For the same photocuring temperature, the thickness variation is not significantly affected by the different patterns used to form lines and spaces from the photocurable composition. Therefore, when expressed as a percentage, the thickness variation is not significantly dependent on the underlying geometry of the substrate.

[0190] 2. Thickness variation caused by post-exposure baking

[0191] Example 2 demonstrates the thickness variation between the cured layer and its corresponding baked layer, and therefore, the thickness variation corresponds to the baking operation rather than the photocuring operation. The thickness variation is determined by Equation 3 above, where T1 is the thickness of the cured layer and T2 is the thickness of the corresponding baked layer. For all samples in Example 2, during photocuring, the photocurable composition D was exposed to a dose of 15 J / cm 2 The data were collected for photocuring temperatures ranging from 22°C to 70°C. One subset of data was generated at a bake temperature of 350°C and a soak time of 2 minutes, and another subset of data was generated at a bake temperature of 400°C and a soak time of 2 minutes. The bake was performed in N2 ambient temperature. For each substrate, the thickness of the cured and baked layers were measured at a set of locations across the substrate.

[0192] Fig.14 Data is included and compared for different bake temperatures. The data for both bake temperatures have a linear increase in thickness change as the photocuring temperature increases from 22°C to 50°C. For the 350°C bake, the thickness change was -0.7% at a photocuring temperature of 22°C, and 0.9% at a photocuring temperature of 50°C. For the 400°C bake, the thickness change was -1.4% at a photocuring temperature of 22°C, and 1.1% at a photocuring temperature of 50°C. For both bake temperatures, the thickness change was essentially constant at approximately 1.0% for photocuring temperatures in the range of 50°C to 70°C. For the 350°C bake, the thickness change was approximately 0.0% at a photocuring temperature of approximately 33°C. For the 400°C bake, the thickness change was approximately 0.0% at a photocuring temperature of approximately 38°C.

[0193] Fig.14 The Y axis in has a range of 3.0% (from -1.5% to 1.5%), which is roughly larger than the range of 0.9% (from 99.1% to 100.0%). Fig.13 The range of the Y axis in is 3.3 times larger. Therefore, for the photocurable composition D, the thickness change that occurs during baking is substantially greater than the thickness change that occurs during photocuring.

[0194] 3. Thickness variation between the cured layer and the corresponding baked layer for different photocurable compositions

[0195] Example 3 demonstrates the thickness variation between the cured layer and its corresponding baked layer for photocurable compositions A, B, C, and D. The thickness variation is determined by Equation 3 above, where T1 is the layer thickness of the cured layer and T2 is the thickness of the corresponding baked layer.

[0196] The photocurable composition A was dispensed over the substrate and planarized using a superstrate as a flat blank. The photocurable composition A was exposed to a dose of 1.2 J / cm2 The photocurable composition A is photocured with actinic radiation of 20 J / cm to form a cured layer. The photocurable composition B is dispensed over the substrate and planarized using a flat blank. The photocurable composition B is exposed to a dose of 20 J / cm 2 The photocurable composition B is photocured with actinic radiation of 5 J / cm to form a cured layer. The photocurable composition C is dispensed over the substrate and planarized using a flat blank. The photocurable composition C is exposed to a dose of 5 J / cm 2 The photocurable composition C was photocured with actinic radiation of 15 J / cm to form a cured layer. The photocurable composition D was dispensed over the substrate and planarized using a flat blank. The photocurable composition D was exposed to a dose of 15 J / cm 2 The photocurable composition D was photocured with actinic radiation to form a cured layer. After the photocuring, the substrate and the cured layer were baked in a N2 environment at a temperature of 350°C for a soaking time of 2 minutes to form a baked layer over the substrate. The thickness change measurement was based on the film thickness measured before and after baking.

[0197] Fig.15 Included are graphs of thickness change as a function of photocuring temperature for four photocurable compositions. Each slope of the line includes a linear portion with a positive slope and a flat portion in which the thickness change is substantially constant (thickness change does not exceed 0.2% absolute value) with further increase in photocuring temperature. The transition temperature is the photocuring temperature at which the linear portion of the line intersects the flat portion of the line. Thus, the transition temperature marks the point at which further increases in photocuring temperature will not significantly affect the thickness change.

[0198] For photocurable composition A, the linear portion extends from 22°C, where the thickness change is -4.8%, to a transition temperature of 70°C, where the thickness change is -1.5%. The flat portion of the line starts at the transition temperature of 70°C. The thickness change at a photocuring temperature of 80°C is -1.6%.

[0199] For photocurable composition B, the linear portion extends from 22° C., where the thickness change is −3.9%, to a transition temperature of 80° C., where the thickness change is −0.6%. The flat portion of the line begins at the transition temperature of 80° C. The thickness change at a photocuring temperature of 90° C. is −0.8%, and the thickness change at a photocuring temperature of 100° C. is −0.6%.

[0200] For photocurable composition C, the linear portion extends from 22° C., where the thickness change is −0.4%, to a transition temperature of 40° C., where the thickness change is 0.4%. The flat portion of the line begins at the transition temperature of 40° C. The thickness change at a photocuring temperature of 50° C. is 0.4%, and the thickness change at a photocuring temperature of 60° C. is 0.4%.

[0201] For photocurable combination D, the linear portion extends from 22°C, where the thickness change is -0.7%, to a transition temperature of 50°C, where the thickness change is 0.9%. The flat portion of the line begins at the transition temperature of 50°C. The thickness change at a photocuring temperature of 60°C is 1.0%, and the thickness change at a photocuring temperature of 70°C is 0.9%.

[0202] Photocurable compositions C and D can be processed and result in a thickness variation of 0% between the thickness of the baked layer and the thickness of the cured layer. For photocurable composition C, a thickness variation of 0% can be obtained at a photocuring temperature of 31°C, and for photocurable composition D, a thickness variation of 0% can be obtained at a photocuring temperature of 35°C.

[0203] 4. Thickness variation at different photocuring temperatures as a function of actinic radiation dose

[0204] Example 4 demonstrates the thickness variation between the cured layer and the corresponding baked layer when the photocurable composition is photocured at different photocuring temperatures. The thickness variation is determined by Equation 3 above, where T1 is the thickness of the cured layer and T2 is the thickness of the corresponding baked layer.

[0205] In Example 4, the photocurable composition B was photocured at photocuring temperatures of 22° C., 60° C., and 80° C., and the corresponding cured layers were baked at 350° C. in a N 2 environment for a soaking time of 2 minutes.

[0206] Fig.16 Data for the samples are included. For the same photocuring temperature, each line has an asymptotic rise in thickness variation as a function of dose. As the dose increases from 1 J / cm 2 Increased to 20J / cm 2 , the thickness change becomes closer to 0% thickness change. When light curing is performed at relatively high temperatures, significantly lower doses can be used. At 2.5 J / cm 2 The thickness change was -3.8% at a dose of 20 J / cm and a photocuring temperature of 60 °C. 2 The thickness change was -3.9% at a dose of 2.5 J / cm and a photocuring temperature of 22°C. 2 The thickness change was -1.6% at a dose of 15 J / cm and a photocuring temperature of 80 °C. 2The thickness change was -1.9% at a dose of 100 μm and a photocuring temperature of 60°C. Therefore, the same or better thickness change (close to 0%) can be achieved using a relatively low dose at a relatively high photocuring temperature. The data in Example 4 suggest that using a relatively high temperature allows a lower dose to be used.

[0207] Some photocurable compositions can use moderate photocuring temperatures (such as in the range of 30°C to 50°C) and achieve 0% thickness variation. Fig.15 , the photocurable compositions C and D can achieve a thickness change of 0% at photocuring temperatures of 31° C. and 35° C., respectively. Therefore, compared to the transition temperature, an excessively high photocuring temperature for the photocurable composition C or D may result in a thickness change further away from 0%.

[0208] Alternatively, the dose of actinic radiation can be reduced, which will Fig.15 The lines in (including the lines for photocurable compositions C and D) are shifted downward. When the photocuring temperature is at a transition temperature (the transition between the linear and flat portions of the line) of 40°C for photocurable composition C and 50°C for photocurable composition D, empirical data can be generated to determine the dose that produces a 0% thickness change. For photocurable compositions C and D, temperatures higher than the transition temperature will not significantly increase production throughput because further reductions in dose will result in a thickness change further away from 0%. Therefore, photocuring temperatures of 50°C and higher will waste energy and do not significantly increase the likelihood of achieving a 0% thickness change.

[0209] When a photocuring temperature higher than ambient temperature is compared to photocuring at ambient temperature, the embodiments described herein can be used to keep the thickness variation between the baked layer and the pre-cured layer or between the baked layer and the cured layer of the photocurable composition closer to 0%. Compared with a photocuring temperature that is too low or too high, a moderate photocuring temperature can allow a thickness variation of 0% to be achieved. Better dimensional stability helps to make the processing from substrate to substrate and from production batch to production batch more robust and repeatable. The inventors have found that for each material, there is a photocuring thickness variation that depends on the photocuring temperature, and there is a baking thickness variation that depends on the baking temperature. The inventors have found that one of the photocuring thickness variation and the baking thickness variation can be selected to be positive, while the other is negative, to give an optimal thickness variation that is as close to zero as possible.

[0210] Note that not all activities described in the above general description or examples are required, a portion of a specific activity may not be required, and one or more further activities may be performed in addition to the described activities. Additionally, the order in which the activities are listed is not necessarily the order in which they are performed.

[0211] Benefits, other advantages, and solutions to problems have been described above with respect to specific implementations. However, the benefits, advantages, solutions to problems, and any features that may cause any benefit, advantage, or solution to occur or become more significant are not to be construed as key, required, or essential features of any or all of the claims.

[0212] The description and illustration of the implementation described herein are intended to provide an overall understanding of the structure of various implementations. The description and illustration are not intended to be used as a detailed and comprehensive description of all elements and features of the device and system using the structure or method described herein. A separate implementation may also be provided in combination in a single implementation, and on the contrary, for the sake of brevity, the various features described in the context of a single implementation may also be provided separately or in any sub-combination. In addition, references to the values ​​described in the scope include each value in the scope. Only after reading this specification, many other implementations may be clear to a skilled person. Other implementations may be used and derived from the present disclosure, so that structural substitution, logical substitution or another change may be performed without departing from the scope of the present disclosure. Therefore, the present disclosure is considered to be illustrative and not restrictive.

Claims

1. A system comprising: a first heating component for heating the photocurable composition above the substrate; an actinic radiation source configured to emit actinic radiation having a wavelength less than 700 nm; and A controller is configured to determine a target temperature to be generated by the first heating component when the photocurable composition is exposed by the actinic radiation source to achieve a photocuring temperature of the photocurable composition, wherein the photocuring temperature is higher than an ambient temperature.

2. The system of claim 1, wherein: The system includes an apparatus, and the first heating component and the source of actinic radiation are located in a same station within the apparatus.

3. The system of claim 1, further comprising: A first substrate chuck is configured to hold the substrate while the photocurable composition is at the photocuring temperature and exposed to the actinic radiation.

4. The system of claim 3, further comprising: a second substrate chuck configured to hold the substrate while the photocurable composition is exposed to the first heating component; and A substrate transfer tool is configured to transfer the substrate having the photocurable composition between the first substrate chuck and the second substrate chuck.

5. The system of claim 1, further comprising: A dispensing head is configured to dispense the photocurable composition over the substrate.

6. The system of claim 1, further comprising: A station is configured to place a superstrate in contact with the photocurable composition covering the substrate.

7. The system of claim 1, further comprising: A second heating member is configured to heat a cured layer corresponding to the photocurable composition to form a baked layer, wherein the second heating member is configured to heat the substrate and the cured layer to a baking temperature higher than the photocuring temperature.

8. The system of claim 1, further comprising: a temperature sensor configured to generate a first signal corresponding to a temperature of the photocurable composition, The controller is further configured to receive the first signal and send a second signal for activating the actinic radiation source when the temperature is within the photocuring temperature + / - 5°C.

9. A method comprising: dispensing a photocurable composition over a substrate, wherein the photocurable composition comprises a multifunctional monomer; When the photocurable composition is at a photocuring temperature higher than the ambient temperature, photocuring the photocurable composition, wherein the photocuring of the photocurable composition forms a cured layer over the substrate; and The cured layer is baked to form a baked layer, wherein the baking is performed at a baking temperature higher than the photo-curing temperature.

10. A system comprising: a light curing station configured to form a cured layer over the substrate at a light curing temperature, wherein the light curing temperature is higher than an ambient temperature; a baking station configured to bake the solidified layer at a baking temperature to form a baked layer; and A controller is configured to determine the photocuring temperature based at least in part on the baking temperature.

11. The system of claim 10, wherein: The light curing station comprises: a heating member configured to heat the photocurable composition above the substrate to a temperature at the photocuring temperature or a temperature closer to the photocuring temperature than the ambient temperature; and An actinic radiation source configured to emit radiation having a wavelength less than 700 nm.

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