RGB lamp bead suitable for special-shaped LED display screen

Abstract

The invention belongs to the technical field of LED lamps, and particularly relates to an RGB lamp bead suitable for a special-shaped LED display screen, the RGB lamp bead comprises an LED support, LED chips and a transparent packaging body, the LED chips comprise a red LED chip, a blue LED chip and a green LED chip, the LED support comprises electrode pins and a diamond-shaped base, a lamp cup is arranged in the middle of the upper surface of the diamond-shaped base, a plurality of bonding pads are arranged on the lamp cup, and the bonding pads are arranged on the LED support. And electrode pins in one-to-one correspondence with the bonding pads are fixed on the diamond-shaped base below the bonding pads. According to the invention, the base is designed to be diamond-shaped, and the electrode pins move inwards, so that the phenomenon that the edge lamp beads are easy to fall off under the action of external force can be effectively prevented; and the edges of the lamp beads are changed from straight to inclined, so that the trapezoidal effect can be effectively reduced when the lamp beads are applied to display of a special-shaped spliced LED screen, and the display integrity is facilitated.

Description

Technical Field

[0001] The invention belongs to the technical field of LED lamps, and in particular relates to an RGB lamp bead suitable for a special-shaped LED display screen. Background Art

[0002] LED display screen is composed of small LED module panels; LED, light emitting diode (abbreviation of Light Emitting Diode), is a display method that controls semiconductor light emitting diodes. P-type semiconductors are combined with N-type semiconductors to form PN junctions. When current passes through, electrons flow from N-type semiconductors to P-type semiconductors, and holes flow from P-type semiconductors to N-type semiconductors. Electrons and holes meet and recombine near the PN junction. The recombination process releases energy in the form of photons, that is, the LED emits light; LED display screens are generally used to display various information such as text, images, videos, and video signals.

[0003] With the continuous advancement of display technology and the increasing demand for personalization by consumers, special-shaped LED displays have shown great market potential in various application scenarios due to their unique shape and flexible customization capabilities. This type of display not only breaks the limitations of traditional rectangular screens, but also brings users an unprecedented visual experience through a variety of irregular shapes such as spherical, curved, and L-shaped. However, the production and manufacturing of special-shaped screens faces many technical challenges.

[0004] like Figure 1 As shown in the figure, the traditional RGB lamp beads, as the core components of the display screen, are rectangular in shape and fixed in size, which makes them inadequate for the production of special-shaped screens. On the one hand, when rectangular lamp beads are spliced ​​into special-shaped structures, it is often difficult to ensure the uniform distribution of pixels, resulting in visual problems such as trapezoidal effect or "trapezoidal distortion", which affects the display effect. On the other hand, the corners of the rectangular lamp beads are prone to fall off after long-term use, reducing the reliability and service life of the display screen. Summary of the invention

[0005] In view of the above-mentioned deficiencies in the prior art, the present invention provides an RGB lamp bead suitable for special-shaped LED display screens to solve the above-mentioned technical problems.

[0006] The invention discloses an RGB lamp bead suitable for a special-shaped LED display screen, comprising an LED bracket, an LED chip and a transparent encapsulation body, wherein the LED chips comprise a red LED chip, a blue LED chip and a green LED chip, the LED bracket comprises an electrode pin and a diamond-shaped base, a lamp cup is provided in the middle of the upper surface of the diamond-shaped base, a plurality of solder pads are arranged on the lamp cup, electrode pins corresponding to the solder pads are fixed on the diamond-shaped base below the solder pads, the electrode pins comprise a positive pin and a negative pin, the electrode pins penetrate the diamond-shaped base and the lamp cup and are connected to the bottom of the solder pads, the LED chip is mounted on an end of the solder pad away from the electrode pin, a bonding wire is arranged between the LED chip and a solder pad with opposite polarity to the mounted solder pad; and the transparent encapsulation body is filled in the lamp cup.

[0007] A further improvement of the technical solution is that the red LED chip is fixed to the top of the corresponding pad by silver glue, and the blue LED chip and the green LED chip are fixed to the top of the same pad by transparent glue.

[0008] A further improvement of the technical solution is that the soldering pad includes a wick soldering pad and an L-shaped soldering pad arranged below the wick soldering pad, the wick soldering pad is arranged above the lamp cup, an LED chip is installed above the wick soldering pad, the top end of the L-shaped soldering pad is connected to the bottom end of the wick soldering pad, and the electrode pin is connected to the bottom end of the L-shaped soldering pad.

[0009] A further improvement of the technical solution is that the L-shaped pad adopts a QFN type pad.

[0010] A further improvement of the technical solution is that the electrode pins are fixedly mounted on the long hypotenuse side of the diamond-shaped base.

[0011] Further improvements to the technical solution include that the blue LED chip and the green LED chip are fixed to the top of the corresponding pads by transparent glue, arranged in an equilateral triangle with the red LED chip, and the electrode pins are fixedly installed in the middle and around the bottom of the diamond-shaped base to improve the earthquake resistance of the lamp beads.

[0012] A further improvement of the technical solution is that when the blue LED chip and the green LED chip are installed on the same pad, two bonding wires are arranged between the blue LED chip and the pad, one bonding wire is arranged between the blue LED chip and the pad with opposite polarity to the installed pad, and the other bonding wire is arranged between the blue LED chip and the pad with the same polarity as the installed pad; two bonding wires are arranged between the green LED chip and the pad, one bonding wire is arranged between the green LED chip and the pad with opposite polarity to the installed pad, and the other bonding wire is arranged between the green LED chip and the pad with the same polarity as the installed pad.

[0013] A further improvement of the technical solution is that the base is fixed on the electrode pin by injection molding.

[0014] A further improvement of the technical solution is that the electrode pins include 3 positive pins and 1 negative pin, and the red LED chip, the blue LED chip and the green LED chip are respectively mounted on the pads corresponding to the positive pins.

[0015] A further improvement of the technical solution is that the electrode pins include 1 positive pin and 3 negative pins, and the red LED chip, the blue LED chip and the green LED chip are respectively mounted on the pads corresponding to the negative pins.

[0016] The beneficial effects of the present invention are that, by designing the base into a diamond shape and moving the electrode pins inward, the present invention can effectively prevent the edge lamp beads from easily falling off due to the action of external forces; by designing the base into a diamond shape and changing the edges of the lamp beads from straight to oblique, when applied to special-shaped spliced ​​LED screen displays, the trapezoidal effect can be effectively reduced, thereby facilitating the integrity of the display; by designing the base into a diamond shape, the light output rate can be effectively increased, the refraction of light from the LED chip through the transparent package on the surface of the base can be reduced, and the utilization rate of light can be improved.

[0017] In addition, the invention has a reliable design principle, a simple structure and a very broad application prospect. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1 This is the structural diagram of the traditional RGB lamp strip.

[0020] Figure 2 This is the arrangement diagram of the LED chips in the common anode conventional lamp bead of the present invention.

[0021] Figure 3 This is an equilateral triangle arrangement diagram of the LED chips in the common anode lamp bead of the present invention.

[0022] Figure 4 This is the arrangement diagram of the LED chips in the common cathode conventional lamp bead of the present invention.

[0023] Figure 5 It is a structural diagram of the lamp bead belt of the present invention.

[0024] 110 is an electrode pin, 120 is a diamond-shaped base, 121 is a lamp cup, 122 is a soldering pad, 131 is a red LED chip, 132 is a blue LED chip, and 133 is a green LED chip. DETAILED DESCRIPTION

[0025] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0027] The key terms appearing in the present invention are explained below.

[0028] RGB lamp beads are a kind of multi-color LED lamp beads composed of three colors of LED lamp beads: red, green, and blue. It uses the combination of these three colors of LED chips and can mix a wide range of color spectrums by accurately controlling the brightness of each color, achieving a combination and transformation effect of multiple colors. The working principle of RGB lamp beads is based on the light-emitting principle of LED. When current passes through the LED chip, electrons and holes meet and recombine near the PN junction, releasing energy, which is emitted in the form of photons, thereby generating luminescence. By controlling the current size and frequency passing through the three color RGB LED chips, the brightness of each color can be adjusted, thereby achieving color mixing and transformation.

[0029] QFN (Quad Flat No-lead Package) type pad is a pad with a special design, which is mainly used in surface mount technology. QFN package is an emerging surface mount chip packaging technology with small pad size, small volume and plastic as sealing material. Because there is a large exposed pad in the center of the bottom that is soldered to the heat dissipation pad of the PCB, QFN has excellent electrical and thermal performance.

[0030] like Figure 2 and Figure 3As shown, the present invention provides an RGB lamp bead adapted to a special-shaped LED display screen, including an LED bracket, an LED chip and a transparent encapsulation body, wherein the LED chip includes a red LED chip, a blue LED chip and a green LED chip, the LED bracket includes an electrode pin and a diamond-shaped base, a lamp cup is provided in the middle of the upper surface of the diamond-shaped base, a plurality of pads are provided on the lamp cup, and electrode pins corresponding to the pads are fixed on the diamond-shaped base below the pads, the electrode pins include a positive pin and a negative pin, the electrode pins penetrate the diamond-shaped base and the lamp cup and are connected to the bottom of the pads, the LED chip is installed at one end of the pad away from the electrode pin, and a bonding wire is provided between the LED chip and the pad with opposite polarity to the installed pad; the transparent encapsulation body is filled in the lamp cup, and the material of the transparent encapsulation body is high temperature resistant and transparent silicone or resin or plastic. Wherein, the base is fixed on the electrode pin by injection molding.

[0031] Specifically, the pad includes a wick pad and an L-shaped pad arranged below the wick pad, the wick pad is arranged above the lamp cup, an LED chip is installed above the wick pad, the top of the L-shaped pad is connected to the bottom of the wick pad, and the electrode pin is connected to the bottom of the L-shaped pad. The L-shaped pad adopts a QFN pad.

[0032] In addition, when the blue LED chip and the green LED chip are mounted on the same solder pad, two bonding wires are arranged between the blue LED chip and the solder pad, one bonding wire is arranged between the blue LED chip and the solder pad with opposite polarity to the mounted solder pad, and the other bonding wire is arranged between the blue LED chip and the solder pad with the same polarity as the mounted solder pad; two bonding wires are arranged between the green LED chip and the solder pad, one bonding wire is arranged between the green LED chip and the solder pad with opposite polarity to the mounted solder pad, and the other bonding wire is arranged between the green LED chip and the solder pad with the same polarity as the mounted solder pad.

[0033] like Figure 2As shown, the present invention provides an RGB lamp bead adapted to a special-shaped LED display screen, comprising an LED bracket, an LED chip and a transparent package, the LED bracket comprising an electrode pin and a diamond-shaped base, the base is fixed on the electrode pin by injection molding, a lamp cup is provided in the middle of the upper surface of the diamond-shaped base, four solder pads are arranged on the lamp cup, namely, solder pad A, solder pad B, solder pad C and solder pad D, electrode pins corresponding to the solder pads are fixed on the diamond-shaped base below the solder pads, the electrode pins penetrate the diamond-shaped base and the lamp cup and are connected to the bottom of the solder pads, the electrode pins are fixedly installed on the long hypotenuse side of the diamond-shaped base (to facilitate improving the stability of the lamp bead), and the LED chip is installed at one end of the solder pad away from the electrode pin; wherein the electrode pins comprise three negative electrode pins and one positive electrode pin, and the solder pads A, B, C and D correspond to the negative electrode pins respectively. The A and B pins are connected, and the D pad is connected to the positive pin; in addition, the LED chip includes a red LED chip, a blue LED chip and a green LED chip. The red LED chip is fixed to the top of the A pad by silver glue, the cathode of the red LED chip is connected to the A pad, and the anode of the red LED chip is connected to the D pad by a gold wire (bonding wire). The blue LED chip and the green LED chip are both fixed to the top of the B pad by transparent glue, the cathode of the blue LED chip is connected to the C pad by a gold wire, the anode of the blue LED chip is connected to the D pad by a gold wire (bonding wire), the cathode of the green LED chip is connected to the C pad by a gold wire, and the anode of the green LED chip is connected to the D pad by a gold wire (bonding wire). A transparent encapsulation body is filled in the lamp cup, and the material of the transparent encapsulation body is high temperature resistant and transparent silicone or resin or plastic. The RGB lamp bead adopts a common anode connection method to form a structure such as Figure 5 The light strip shown adjusts the brightness of the lamp beads by controlling the magnitude of the current. The technology is mature and has high reliability.

[0034] like Figure 3As shown, the present invention provides an RGB lamp bead adapted to a special-shaped LED display screen, comprising an LED bracket, an LED chip and a transparent encapsulation body, the LED bracket comprising an electrode pin and a diamond-shaped base, the base being fixed on the electrode pin by injection molding, a lamp cup being provided in the middle of the upper surface of the diamond-shaped base, four solder pads being provided on the lamp cup, namely, a solder pad A, a solder pad B, a solder pad C and a solder pad D, electrode pins corresponding to the solder pads are fixed on the diamond-shaped base below the solder pads, the electrode pins penetrate the diamond-shaped base and the lamp cup and are connected to the bottom of the solder pads, and the LED chip is mounted on an end of the solder pad away from the electrode pins; wherein the electrode pins comprise three negative electrode pins and one positive electrode pin, the solder pad A, the solder pad B and the solder pad C are connected to the corresponding negative electrode pins respectively, and the solder pad D is connected to the positive electrode pin; in addition, the LED chip comprises a red LED chip, a blue LED chip and a green LED chip, and the red LED chip is fixed on At the top of the A pad, the negative pole of the red LED chip is connected to the A pad, and the positive pole of the red LED chip is connected to the D pad through a copper wire (bonding wire). The blue LED chip is fixed to the top of the B pad with transparent glue, and the negative pole of the blue LED chip is connected to the B pad through a copper wire (bonding wire). The positive pole of the blue LED chip is connected to the D pad through another copper wire (bonding wire). The green LED chip is fixed to the top of the C pad with transparent glue, and the negative pole of the green LED chip is connected to the C pad through a copper wire (bonding wire). The positive pole of the green LED chip is connected to the D pad through another copper wire (bonding wire). The blue LED chip, the green LED chip and the red LED chip are arranged in an equilateral triangle, and the electrode pins are fixedly installed in the middle and around the bottom of the diamond-shaped base (to improve the earthquake resistance of the lamp bead). The transparent encapsulation body is filled in the lamp cup, and the material of the transparent encapsulation body is high temperature resistant and transparent silicone or resin or plastic. The RGB lamp bead adopts a common anode connection method to form a Figure 5 The light strip shown adjusts the brightness of the lamp beads by controlling the magnitude of the current. The technology is mature and has high reliability.

[0035] like Figure 5As shown, the present invention provides an RGB lamp bead adapted to a special-shaped LED display screen, comprising an LED bracket, an LED chip and a transparent package, the LED bracket comprising an electrode pin and a diamond-shaped base, the base being fixed on the electrode pin by injection molding, a lamp cup being provided in the middle of the upper surface of the diamond-shaped base, four soldering pads being provided on the lamp cup, namely, soldering pad A, soldering pad B, soldering pad C and soldering pad D, electrode pins corresponding to the soldering pads being fixed on the diamond-shaped base below the soldering pads, the electrode pins passing through the diamond-shaped base and the lamp cup being connected to the bottom of the soldering pads, the LED chip being mounted on one end of the soldering pad away from the electrode pins; wherein the electrode pins comprise three positive pins and one negative pin, the soldering pad A, the soldering pad B and the soldering pad C are connected to the corresponding positive pins respectively, the soldering pad D is connected to the negative pin connected; in addition, the LED chip includes a red LED chip, a blue LED chip and a green LED chip, the red LED chip is fixed to the top of the A pad by silver glue, the positive electrode of the red LED chip is connected to the A pad, the negative electrode of the red LED chip is connected to the D pad by a gold wire (bonding wire), the blue LED chip and the green LED chip are fixed to the top of the B pad by transparent glue, the positive electrode of the blue LED chip and the positive electrode of the green LED chip are connected to the B pad (or C pad) by a gold wire (bonding wire) respectively, the negative electrode of the blue LED chip and the negative electrode of the green LED chip are connected to the D pad by a gold wire (bonding wire) respectively, and the transparent encapsulation body is filled in the lamp cup, and the material of the transparent encapsulation body is high temperature resistant and transparent silicone or resin or plastic. The RGB lamp bead adopts a common cathode connection method to form a Figure 5 The light strip shown has low power consumption, high energy efficiency and environmental and economic advantages.

[0036] The present invention designs the base in a diamond shape and moves the electrode pins inward, which can effectively prevent the edge lamp beads from easily falling off due to the action of external force; the base is designed in a diamond shape and the edges of the lamp beads are changed from straight to oblique, which can effectively reduce the trapezoidal effect when applied to special-shaped spliced ​​LED screen displays, thereby facilitating the integrity of the display; the base is designed in a diamond shape, which can effectively increase the light output rate, reduce the refraction of light from the LED chip through the transparent package on the surface of the base, and improve the utilization rate of light.

[0037] Although the present invention has been described in detail with reference to the accompanying drawings and in combination with the preferred embodiments, the present invention is not limited thereto. Without departing from the spirit and essence of the present invention, a person of ordinary skill in the art may make various equivalent modifications or substitutions to the embodiments of the present invention, and these modifications or substitutions shall be within the scope of the present invention. Any person of ordinary skill in the art may easily think of changes or substitutions within the technical scope disclosed by the present invention, and these shall be within the scope of protection of the present invention.

Claims

1. An RGB lamp bead suitable for special-shaped LED display screens, characterized in that: It includes an LED bracket, an LED chip and a transparent package. The LED chips include a red LED chip, a blue LED chip and a green LED chip. The LED bracket includes electrode pins and a diamond-shaped base. A lamp cup is opened in the middle of the upper surface of the diamond-shaped base. A plurality of soldering pads are arranged on the lamp cup. Electrode pins corresponding to the soldering pads are fixed on the diamond-shaped base below the soldering pads. The electrode pins include a positive pin and a negative pin. The electrode pins pass through the diamond-shaped base and the lamp cup and are connected to the bottom of the soldering pad. The LED chip is installed at one end of the soldering pad away from the electrode pin. A bonding wire is arranged between the LED chip and the soldering pad with opposite polarity to the installed soldering pad. The transparent package is filled in the lamp cup.

2. The RGB lamp bead adapted to a special-shaped LED display screen according to claim 1, characterized in that: The red LED chip is fixed on the top of the corresponding pad by silver glue, and the blue LED chip and the green LED chip are fixed on the top of the same pad by transparent glue.

3. The RGB lamp bead adapted to a special-shaped LED display screen according to claim 1, characterized in that: The pad includes a wick pad and an L-shaped pad arranged below the wick pad, the wick pad is arranged above the lamp cup, an LED chip is installed above the wick pad, the top of the L-shaped pad is connected to the bottom of the wick pad, and the electrode pin is connected to the bottom of the L-shaped pad.

4. The RGB lamp bead adapted to a special-shaped LED display screen according to claim 3, characterized in that: The L-shaped pad adopts QFN type pad.

5. The RGB lamp bead adapted to a special-shaped LED display screen according to claim 3, characterized in that: The electrode pins are fixedly mounted on the long beveled side of the diamond-shaped base.

6. The RGB lamp bead adapted to a special-shaped LED display screen according to claim 3, characterized in that: The blue LED chip and the green LED chip are fixed to the top of the corresponding pads by transparent glue, and are arranged in an equilateral triangle with the red LED chip. The electrode pins are fixed in the middle and around the bottom of the diamond-shaped base.

7. The RGB lamp bead adapted to a special-shaped LED display screen according to claim 1, characterized in that: When the blue LED chip and the green LED chip are mounted on the same pad, two bonding wires are arranged between the blue LED chip and the pad, one bonding wire is arranged between the blue LED chip and the pad with opposite polarity to the mounted pad, and the other bonding wire is arranged between the blue LED chip and the pad with the same polarity as the mounted pad; two bonding wires are arranged between the green LED chip and the pad, one bonding wire is arranged between the green LED chip and the pad with opposite polarity to the mounted pad, and the other bonding wire is arranged between the green LED chip and the pad with the same polarity as the mounted pad.

8. The RGB lamp bead adapted to a special-shaped LED display screen according to claim 1, characterized in that: The base is fixed on the electrode pin by injection molding.

9. The RGB lamp bead adapted to a special-shaped LED display screen according to claim 1, characterized in that: The electrode pins include three positive pins and one negative pin, and the red LED chip, the blue LED chip and the green LED chip are respectively mounted on the pads corresponding to the positive pins.

10. The RGB lamp bead adapted to a special-shaped LED display screen according to claim 1, characterized in that: The electrode pins include 1 positive pin and 3 negative pins, and the red LED chip, the blue LED chip and the green LED chip are respectively mounted on the pads corresponding to the negative pins.

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