Flip LED driving chip and detection device

Abstract

The invention belongs to the technical field of LED chips, and provides a flip LED driving chip and a detection device.The flip LED driving chip comprises an LED chip, a plurality of contact pads are fixedly arranged at the lower end of the LED chip, and convex points are fixedly arranged at the lower ends of the contact pads; the heat-conducting layer is fixedly mounted at the lower end of the LED chip, the thickness of the heat-conducting layer is smaller than that of the contact pad, a plurality of holes are formed in the lower end of the heat-conducting layer, the contact pad penetrates through the holes, and the heat-conducting material of the heat-conducting layer is ceramic; according to the invention, the LED chip is inversely welded on the PCB substrate bonding pad by using the salient points, so that the refraction and reflection loss of light rays in the packaging material can be reduced, more light rays can be directly emitted, the light extraction efficiency is improved, and compared with the traditional normal LED driving chip packaging, because a space does not need to be reserved above the chip for lead bonding, the light extraction efficiency is improved. Therefore, the packaging volume can be obviously reduced, the design of the flip LED chip allows a more compact packaging structure, and the realization of miniaturization and light weight of an LED device is facilitated.

Description

Technical Field

[0001] The invention belongs to the technical field of LED chips, in particular to a flip-chip LED driver chip and a detection device. Background Art

[0002] LED driver chip is an important electronic component used to control and manage the current and brightness of LED (light emitting diode). LED driver chip is an indispensable component in LED lighting and display technology. Its performance and quality directly affect the stability and service life of LED products.

[0003] At present, the packaging of LED driver chips mainly uses traditional packaging technology, which requires the use of conductive materials such as gold wire or silver wire, and the chip electrodes are connected to the external leads through wire bonding technology, and finally packaged with epoxy resin. However, wire bonding increases the current path, thereby increasing the generation of resistance and inductance, reducing the signal transmission speed, and secondly, it will also increase the weight and volume of LED devices. Finally, traditional packaging technology uses epoxy resin to package the LED driver chip on the PCB circuit board, but the thermal conductivity of epoxy resin is poor, which reduces the heat dissipation performance of the LED driver chip.

[0004] In addition, when producing LED driver chips, in order to improve the factory quality of LED driver chips, it is necessary to detect the LED driver chips. In the Chinese patent with the announcement number CN109060307B, a flip-chip LED chip detection device is mentioned, which includes a transport platform, a support plate is fixedly installed on one side of the top of the transport platform, a load-bearing plate is fixedly connected to the back of the support plate, and a conveying device is fixedly installed on the top of the front of the support plate, a positioning device is fixedly connected to the top of the transport platform, and the positioning device is located on the side of the conveying device, the placement platform is located on one side of the transport platform, and the inner cavity of the placement platform is fixedly connected to the top of the transport platform. A movable buckle is fixedly installed on the top, and the bottom of the movable buckle is threadedly connected to one side of the bottom of the adsorption fixing device through a fixing bolt. The bottom of the side of the placing platform is fixedly connected to one side of the vibration device through a connecting rod, and the other side of the connecting rod is fixedly connected to a movable rod, and the movable rod is movably sleeved inside the fixed plate, and a sliding sleeve is fixedly connected to the top of the fixed plate, and a pulley is movably sleeved inside the sliding sleeve, and the top of the pulley is fixedly connected to the top of the side of the connecting rod through a moving rod. The support rod is located on the back of the transport platform, and the top of the support rod is fixedly connected to a cross plate, and a carrying device is fixedly installed on the front of the cross plate.

[0005] Although the device transfers the LED chips to the placement table via a conveyor belt, and there is a certain distance between the conveyor belt and the placement table, the distance between adjacent LED chips needs to be manually adjusted during transportation. If the two chips are too close to each other, for example, they are pressed against each other, when the front LED chip is transferred to the placement table, the rear LED chip is likely to fall into the gap between the conveyor belt and the placement table because the front end cannot touch the placement table, causing damage to the LED chip.

[0006] To this end, those skilled in the art have proposed a flip-chip LED driver chip and a detection device to solve the problems raised in the background art. Summary of the invention

[0007] In order to solve the above technical problems, the present invention provides a flip-chip LED driver chip and a detection device to solve the problems in the background technology.

[0008] A flip-chip LED driver chip and a detection device, comprising:

[0009] An LED chip, wherein a plurality of contact pads are fixedly disposed at the lower end of the LED chip, and a plurality of contact pads are fixedly disposed at the lower ends of the plurality of contact pads;

[0010] A heat-conducting layer is fixedly mounted on the lower end of the LED chip, the thickness of the heat-conducting layer is less than the thickness of the contact pad, a plurality of holes are opened at the lower end of the heat-conducting layer, the contact pad passes through the holes, and the heat-conducting material of the heat-conducting layer is ceramic;

[0011] The PCB substrate is arranged under the plurality of bumps.

[0012] Preferably, a plurality of pads are fixedly provided on the upper end of the PCB substrate, and a plurality of the bumps are respectively welded to the plurality of pads.

[0013] Preferably, a plastic encapsulation colloid layer is filled between the PCB substrate and the heat conductive layer.

[0014] A method for installing a flip-chip LED driver chip comprises the following steps:

[0015] S1. Making bumps: First, prepare the LED chip, then use RDL rewiring technology and combine the PCB substrate line requirements and spacing to make several contact pads and several bumps;

[0016] S2. Install the thermal conductive layer: first, deposit a layer of thermal conductive material according to the size of the LED chip, the thickness of which should be less than the thickness of the contact pad, then use photolithography and chemical etching technology to open holes corresponding to the positions of the contact pads on the thermal conductive layer, these holes need to be aligned with the positions of the contact pads, then coat the thermal conductive layer with thermal conductive adhesive and bond it to the lower end of the LED chip. During installation, the holes opened in the thermal conductive layer pass through the contact pads respectively;

[0017] S3, flip-chip LED driver chip: first use the automated equipment to clamp the LED chip, then use the alignment equipment to align several bumps to several pads on the PCB substrate, then gently place the LED chip on the PCB substrate, and then use the heat press to heat it so that the bumps melt and form a connection with the pads;

[0018] S4, reflow soldering: put the assembled PCB substrate into the reflow soldering furnace, and then use the reflow soldering furnace to heat until the bumps and pads are melted and fused together to form a firm electrical connection, and then cool the PCB substrate to make the melted bumps and pads re-solidify to form a stable solder joint;

[0019] S5. Making plastic encapsulation colloid layer: first, place the flip-chip LED chip and PCB substrate on the workbench of the automatic injection machine, and then the automatic injection machine injects the bottom filling glue. Under the capillary action of the bottom filling glue, the bottom filling glue is filled between the thermal conductive layer and the PCB substrate, wrapping the solder joints and filling the gap between the thermal conductive layer and the PCB substrate;

[0020] S6. Curing of the plastic encapsulation colloid layer: placing the PCB substrate in a curing furnace, and then heating the PCB substrate to cure the bottom filling glue to form a plastic encapsulation colloid layer.

[0021] Preferably, the RDL rewiring technical steps in S1 are: first, determine the connection mode and layout of the LED chip that needs to be rewired according to the PCB substrate line requirements and spacing, then deposit a layer of insulating material and conductive material on the surface of the LED chip, and then use photolithography and etching processes to process the insulating material and conductive material into the required wiring path to form a wiring layer, and then use a laser process to open electrical connection holes in the wiring layer, and then fill the connection holes with conductive material, and then use tin to cover the wire material to form bumps.

[0022] Preferably, the filling conductive material is copper.

[0023] Preferably, the thermally conductive material in S2 is ceramic.

[0024] Preferably, the thermally conductive adhesive in S2 is thermally conductive silicone.

[0025] Preferably, the alignment device in S3 is a laser alignment system.

[0026] Preferably, the bottom filling glue in S is epoxy resin.

[0027] A detection device for a flip-chip LED driver chip, comprising:

[0028] chassis;

[0029] A slideway, the slideway is fixedly mounted on the front end of the base frame, and a driving chip body is arranged on the upper end of the slideway;

[0030] A driving member is installed inside the base frame and is used to drive the multiple driving chip bodies to separate and move. The driving member includes fixed plates relatively fixedly installed at both ends of the base frame, one side of the two fixed plates is rotatably installed with an eccentric wheel 1, the front ends of the two eccentric wheels 1 are fixedly installed with a driving plate, and the front ends of the two driving plates are rotatably installed with a top plate;

[0031] A detection member, used for detecting the driver chip body, the detection member comprises two detection slots relatively slidably mounted on the upper end of the rear of the chassis;

[0032] There are two limiters, which are respectively installed on one side of the two base frames and are used to limit the driving chip body;

[0033] The transfer member is installed on one side of the base frame and is used to transfer the driving chip body.

[0034] Preferably, a plurality of support columns are evenly and fixedly mounted on the upper end of the base frame, and the driving member further comprises two driving motors relatively fixedly mounted on both sides of the inside of the base frame, and the two driving motors are fixedly connected to two eccentric wheels via a coupling.

[0035] Preferably, the detection member also includes a plurality of elastic members uniformly fixedly installed at the lower end of the detection slot, a stepper motor is fixedly installed on one side of the base frame, a rotating shaft is rotatably installed inside the base frame, the output end of the stepper motor is fixedly connected to the rotating shaft through a coupling, an eccentric wheel 2 is fixed at the front end of the rotating shaft, a connecting rod is fixedly installed at the front end of the eccentric wheel 2, a top frame is installed at the upper end of the connecting rod, and the upper end of the top frame abuts against the lower end of the detection slot.

[0036] Preferably, the limiting member includes a guide groove fixedly mounted on one side of the base frame, a screw rod is rotatably mounted inside the guide groove, a movable plate is slidably mounted inside the guide groove, a threaded ring is fixedly penetrated inside the movable plate, the threaded ring is threadedly connected to the screw rod, a cover plate is fixedly mounted on one side of the movable plate, and the cover plate is located above the detection groove.

[0037] Preferably, a transmission motor is fixedly mounted on one side of the guide groove, and an output end of the transmission motor is fixedly connected to the screw rod via a coupling.

[0038] Preferably, the transfer member includes a support frame fixedly mounted on one side of the base frame, a transfer plate is rotatably mounted inside the support frame, a telescopic cylinder is fixedly mounted on the front end of the transfer plate, a connecting plate is fixedly mounted on the output end of the telescopic cylinder, and a vacuum suction cup is fixedly mounted on the lower end of the connecting plate.

[0039] Preferably, a rotating motor is fixedly mounted on the upper end of the support frame, and an output end of the rotating motor is fixedly connected to the upper end of the transfer plate via a coupling.

[0040] Compared with the prior art, the present invention has the following beneficial effects:

[0041] 1. The present invention can reduce the refraction and reflection losses of light in the packaging material by flip-chip soldering the LED chip to the pad of the PCB substrate using bumps, so that more light can be directly emitted, thereby improving the light extraction efficiency. Secondly, compared with the traditional upright LED driver chip packaging, since there is no need to reserve space above the chip for wire bonding, the package volume can be significantly reduced, so that the design of the flip-chip LED chip allows a more compact packaging structure, which is conducive to the miniaturization and lightweight of the LED device. Finally, the bumps are directly welded to the pads. Compared with the traditional upright LED packaging method, since the bumps are directly formed under the electrodes of the LED chip and directly welded to the pads on the PCB substrate, the current path is greatly shortened, thereby reducing the generation of resistance and inductance, and improving the transmission speed and quality of the signal. By shortening the current path and reducing the connection points, the influence of parasitic resistance and inductance is effectively reduced, and the stability and efficiency of the electrical connection are improved.

[0042] 2. The present invention fixes a thermally conductive layer made of ceramic material at the lower end of the LED chip, and sets a plastic encapsulation colloid layer to fill and solidify between the thermally conductive layer and the PCB substrate, thereby sealing the thermally conductive layer and the gap between the PCB substrate, filling the gap between the thermally conductive layer and the PCB substrate, providing mechanical support, and enhancing the structural stability of the LED chip. Secondly, the material of the plastic encapsulation colloid layer is epoxy resin, which has certain thermal conductivity and can dissipate certain heat for the LED chip. By cooperating with the ceramic thermally conductive layer, firstly, the ceramic material has excellent thermal conductivity. Compared with the traditional heat dissipation using only the plastic encapsulation colloid layer, under the same conditions, adding the ceramic thermally conductive layer can more effectively dissipate the heat for the LED chip, improve the heat dissipation effect of the LED chip, and avoid overheating and damage of the LED chip. Secondly, the ceramic material usually has high hardness and strength, so that adding a ceramic thermally conductive layer at the lower end of the LED chip can enhance the mechanical strength of the entire packaging structure. When subjected to external impact or vibration, the ceramic thermally conductive layer can provide better protection to prevent the LED chip from being damaged.

[0043] 3. The present invention can transfer and detect multiple driver chip bodies in an equidistant and orderly manner through the driving member. First, compared with the traditional conveyor belt to transfer the driver chip body, it can realize the precise control of the driver chip body transfer process, including the moving distance, speed, etc., so as to ensure that each driver chip body can be accurately placed in the predetermined position for detection. This accuracy is crucial for chip detection, and can avoid false detection or missed detection caused by transfer errors. Secondly, during the transmission process, it can ensure that two adjacent driver chip bodies have a certain distance, so as to avoid two driver chip bodies being too close to be moved to the detection member at the same time, causing damage to the driver chip body. Finally, with the continuous rotation of the eccentric wheel, the system can automatically and continuously transfer multiple driver chip bodies for equidistant and orderly detection. This design ensures the continuity and efficiency of the detection process and improves the overall detection efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 is a flow chart of the method of the present invention;

[0045] Figure 2 It is a schematic diagram of the structure of the present invention from a first viewing angle;

[0046] Figure 3 It is a partial structural schematic diagram of the present invention;

[0047] Figure 4 Schematic diagram of the heat-conducting layer structure of the present invention;

[0048] Figure 5 is a cross-sectional view of the present invention;

[0049] Figure 6 It is a partial structural schematic diagram of the present invention

[0050] Figure 7 It is a schematic diagram of the structure of the detection device of the present invention from a first viewing angle;

[0051] Figure 8 It is a schematic diagram of the structure of the driving member of the detection device of the present invention;

[0052] Fig. 9 It is a schematic diagram of the structure of the detection device of the present invention from a second viewing angle;

[0053] Fig.10 It is a schematic structural diagram of the detection device of the present invention from a third viewing angle;

[0054] Fig.11 The detection device of the present invention Fig.10 A partial enlarged view of

[0055] Fig.12 It is a schematic diagram of the structure of the limiter of the detection device of the present invention;

[0056] Fig.13 It is a schematic diagram of the structure of the detection device of the present invention from a fourth viewing angle.

[0057] In the figure:

[0058] 1. LED chip; 2. Contact pad; 3. Bump; 4. Heat conducting layer; 5. Hole; 6. PCB substrate; 7. Solder pad; 8. Plastic colloid layer; 9. Base frame; 10. Slide; 11. Driver chip body; 12. Support column; 13. Driver; 131. Fixing plate; 132. Driver motor; 133. Eccentric wheel 1; 134. Driver plate; 135. Top plate; 14. Detection component; 141. Detection slot; 142. Elastic Parts; 143, stepper motor; 144, rotating shaft; 145, eccentric wheel two; 146, connecting rod; 147, top frame; 15, limiter; 151, guide groove; 152, transmission motor; 153, screw rod; 154, moving plate; 155, cover plate; 16, transfer part; 161, support frame; 162, rotating motor; 163, transfer plate; 164, telescopic cylinder; 165, connecting plate; 166, vacuum suction cup parts. DETAILED DESCRIPTION

[0059] The following embodiments of the present invention are described in further detail in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0060] As attached Figure 1 To Attachment Fig.13 As shown:

[0061] Embodiment 1: The present invention provides a flip-chip LED driver chip, comprising:

[0062] LED chip 1, a plurality of contact pads 2 are fixedly disposed at the lower end of the LED chip 1, and a plurality of bumps 3 are fixedly disposed at the lower ends of the plurality of contact pads 2;

[0063] The heat-conducting layer 4 is fixedly mounted on the lower end of the LED chip 1. The thickness of the heat-conducting layer 4 is less than the thickness of the contact pad 2. A plurality of holes 5 are opened at the lower end of the heat-conducting layer 4. The contact pad 2 passes through the holes 5. The heat-conducting material of the heat-conducting layer 4 is ceramic.

[0064] The PCB substrate 6 is disposed below the plurality of bumps 3 .

[0065] A plurality of pads 7 are fixedly disposed on the upper end of the PCB substrate 6 , and a plurality of bumps 3 are respectively welded to the plurality of pads 7 .

[0066] A plastic packaging colloid layer 8 is filled between the PCB substrate 6 and the heat conducting layer 4 .

[0067] As can be seen from the above, when in use, the LED chip 1 is flip-chip soldered to the pad 7 of the PCB substrate 6 using the bump 3, which can reduce the refraction and reflection losses of light in the packaging material, so that more light can be directly emitted, thereby improving the light extraction efficiency. Secondly, compared with the traditional upright LED driver chip packaging, since there is no need to reserve space above the chip for wire bonding, the package volume can be significantly reduced, so that the design of the flip-chip LED chip 1 allows a more compact packaging structure, which is conducive to the miniaturization and lightweight of the LED device. Finally, the bump 3 is directly welded to the pad 7. Compared with the traditional upright LED packaging method, since the bump 3 is directly formed under the electrode of the LED chip 1 and is directly welded to the pad 7 on the PCB substrate 6, the current path is greatly shortened, thereby reducing the generation of resistance and inductance, and improving the signal transmission speed and quality. By shortening the current path and reducing the connection points, the influence of parasitic resistance and inductance is effectively reduced, and the stability and efficiency of the electrical connection are improved.

[0068] A thermally conductive layer 4 made of ceramic material is fixedly arranged at the lower end of the LED chip 1, and a plastic encapsulation colloid layer 8 is arranged to fill and solidify between the thermally conductive layer 4 and the PCB substrate 6, and the gap between the thermally conductive layer 4 and the PCB substrate 6 is sealed with glue, thereby filling the gap between the thermally conductive layer 4 and the PCB substrate 6, providing mechanical support, and enhancing the structural stability of the LED chip 1. Secondly, the material of the plastic encapsulation colloid layer 8 is epoxy resin, which has certain thermal conductivity and can dissipate certain heat for the LED chip 1. Through the cooperation of the ceramic thermally conductive layer 4, firstly, the ceramic material has excellent thermal conductivity. Compared with the traditional heat dissipation using only the plastic encapsulation colloid layer 8, under the same conditions, the addition of the ceramic thermally conductive layer 4 can dissipate heat for the LED chip 1 more effectively, improve the heat dissipation effect of the LED chip 1, and avoid damage to the LED chip 1 due to overheating. Secondly, the ceramic material usually has high hardness and strength, so that adding a ceramic thermally conductive layer 4 at the lower end of the LED chip 1 can enhance the mechanical strength of the entire packaging structure. When subjected to external impact or vibration, the ceramic thermally conductive layer 4 can provide better protection to prevent the LED chip 1 from being damaged.

[0069] Embodiment 2: The present invention provides a method for installing a flip-chip LED driver chip, which is characterized by comprising the following steps:

[0070] S1, making bumps 3: first prepare the LED chip 1, then use the RDL rewiring technology and combine the circuit requirements and spacing of the PCB substrate 6 to make a plurality of contact pads 2 and a plurality of bumps 3;

[0071] S2, installing the heat-conducting layer 4: first, a layer of heat-conducting material is deposited according to the size of the LED chip 1, and its thickness should be less than that of the contact pad 2. Then, holes 5 corresponding to the positions of the contact pads 2 are opened on the heat-conducting layer 4 by photolithography and chemical etching technology. These holes 5 need to be aligned with the positions of the contact pads 2. Then, the heat-conducting layer 4 is coated with a heat-conducting adhesive and bonded to the lower end of the LED chip 1. During installation, the holes 5 opened in the heat-conducting layer 4 pass through the contact pads 2 respectively.

[0072] S3, flip-chip LED driver chip: first, use the automated equipment to clamp the LED chip 1, then use the alignment equipment to align the plurality of bumps 3 to the plurality of pads 7 on the PCB substrate 6, then gently place the LED chip 1 on the PCB substrate 6, and then use the hot press to heat it, so that the bumps 3 melt and form a connection with the pads 7;

[0073] S4, reflow soldering: put the assembled PCB substrate 6 into a reflow soldering furnace, and then use the reflow soldering furnace to heat until the bumps 3 and the pads 7 are melted and fused together to form a firm electrical connection, and then cool the PCB substrate 6 to make the melted bumps 3 and pads 7 re-solidify to form a stable solder joint;

[0074] S5, making plastic encapsulation colloid layer 8: firstly, placing the flip-chip LED chip 1 and PCB substrate 6 on the workbench of the automatic injection machine, and then the automatic injection machine injects the bottom filling glue, and under the capillary action of the bottom filling glue, the bottom filling glue is filled between the thermal conductive layer 4 and the PCB substrate 6, wrapping the solder joints and filling the gap between the thermal conductive layer 4 and the PCB substrate 6;

[0075] S6 , curing the plastic encapsulation colloid layer 8 : placing the PCB substrate 6 in a curing furnace, and then heating the PCB substrate 6 to cure the bottom filling glue to form the plastic encapsulation colloid layer 8 .

[0076] The RDL rewiring technology steps in S1 are: first, determine the connection mode and layout of the LED chip 1 that needs to be rewired according to the line requirements and spacing of the PCB substrate 6, then deposit a layer of insulating material and conductive material on the surface of the LED chip 1, and then use photolithography and etching processes to process the insulating material and conductive material into the required wiring path to form a wiring layer, and then use laser technology to open electrical connection holes in the wiring layer, and then fill the connection holes with conductive material, and then use tin to cover the wire material to form bumps 3.

[0077] The filling conductive material is copper.

[0078] The thermal conductive material in S2 is ceramic.

[0079] The thermally conductive adhesive in S2 is thermally conductive silicone.

[0080] The alignment device in S3 is a laser alignment system.

[0081] The bottom filler in S5 is epoxy resin.

[0082] As can be seen from the above, by making a bump 3 at the lower end of the LED chip 1 and using the bump 3 to directly flip-chip solder the LED chip 1 to the pad 7 on the PCB substrate 6, compared with the traditional upright LED driver chip package, since there is no need to reserve space above the chip for wire bonding, the LED device is lighter and thinner, and the conductivity and heat dissipation of the product can be improved.

[0083] Embodiment 3: The present invention provides a detection device for a flip-chip LED driver chip, comprising:

[0084] Base frame 9;

[0085] The slideway 10 is fixedly mounted on the front end of the base frame 9, and a driving chip body 11 is arranged on the upper end of the slideway 10;

[0086] The driving member 13 is installed inside the base frame 9 and is used to drive the multiple driving chip bodies 11 to separate and move. The driving member 13 includes fixed plates 131 relatively fixedly installed at both ends of the base frame 9. An eccentric wheel 133 is rotatably installed on one side of the two fixed plates 131. A driving plate 134 is fixedly installed at the front end of the two eccentric wheels 133. A top plate 135 is rotatably installed at the front end of the two driving plates 134.

[0087] A detection member 14, used for detecting the driving chip body 11, the detection member 14 comprises two detection slots 141 relatively slidably mounted on the upper end of the rear portion of the base frame 9;

[0088] There are two limiting members 15, which are respectively installed on one side of the two base frames 9 and are used to limit the driving chip body 11;

[0089] The transfer member 16 is installed on one side of the base frame 9 and is used to transfer the driving chip body 11 .

[0090] A plurality of support columns 12 are evenly fixedly installed on the upper end of the base frame 9. The driving member 13 also includes two driving motors 132 relatively fixedly installed on both sides of the base frame 9. The two driving motors 132 are fixedly connected to two eccentric wheels 133 through couplings.

[0091] The detection member 14 also includes a plurality of elastic members 142 uniformly fixedly installed at the lower end of the detection slot 141, a stepper motor 143 is fixedly installed on one side of the bottom frame 9, a rotating shaft 144 is rotatably installed inside the bottom frame 9, the output end of the stepper motor 143 is fixedly connected to the rotating shaft 144 through a coupling, an eccentric wheel 145 is fixedly installed at the front end of the rotating shaft 144, a connecting rod 146 is fixedly installed at the front end of the eccentric wheel 145, a top frame 147 is installed at the upper end of the connecting rod 146, and the upper end of the top frame 147 abuts against the lower end of the detection slot 141.

[0092] The limiting member 15 includes a guide groove 151 fixedly installed on one side of the base frame 9, a screw rod 153 is rotatably installed inside the guide groove 151, a movable plate 154 is slidably installed inside the guide groove 151, a threaded ring is fixedly penetrated inside the movable plate 154, the threaded ring is threadedly connected to the screw rod 153, a cover plate 155 is fixedly installed on one side of the movable plate 154, and the cover plate 155 is located above the detection groove 141.

[0093] A transmission motor 152 is fixedly mounted on one side of the guide groove 151 , and an output end of the transmission motor 152 is fixedly connected to a lead screw 153 via a coupling.

[0094] The transfer member 16 includes a support frame 161 fixedly mounted on one side of the base frame 9, a transfer plate 163 is rotatably mounted inside the support frame 161, a telescopic cylinder 164 is fixedly mounted on the front end of the transfer plate 163, a connecting plate 165 is fixedly mounted on the output end of the telescopic cylinder 164, and a vacuum suction cup member 166 is fixedly mounted on the lower end of the connecting plate 165.

[0095] A rotating motor 162 is fixedly mounted on the upper end of the support frame 161 , and an output end of the rotating motor 162 is fixedly connected to the upper end of the transfer plate 163 via a coupling.

[0096] As can be seen from the above, when testing the LED driver chip, we first place multiple driver chip bodies 11 in an orderly manner on the slide 10 to ensure that they can be tested continuously and sequentially. After the detection process is started, the PLC controller will simultaneously activate the two drive motors 132, which in turn drive the eccentric wheel 133 to start rotating. As the eccentric wheel 133 rotates, the drive plate 134 is driven to swing accordingly. When the eccentric wheel 133 drives the drive plate 134 to rotate toward the front end of the base frame 9, the drive plate 134 will gradually lift the top plate 135. The rising action of the top plate 135 will lift the driver chip body 11 and separate it from the support column 12. As the eccentric wheel 133 continues to rotate, the drive plate 134 will change direction and rotate toward the rear end of the base frame 9. In this process, the top plate 135 will carry the driver chip body 11 to move a distance to the rear end of the base frame 9, and gradually descend, and finally place the driver chip body 11 steadily on the support column 12. When the eccentric wheel 133 rotates to the lowest point, the driving plate 134 will complete a complete swing cycle, and the top plate 135 will leave the driver chip body 11 that has just been placed. As the eccentric wheel 133 continues to rotate, the above process will be repeated to achieve equidistant and orderly transfer and detection of multiple driver chip bodies 11. This design ensures the continuity and efficiency of the detection process. When the front-end driver chip body 11 is placed in the detection member 14, the detection member 14 performs vibration detection on the driver chip body 11. Through the driver 13, multiple driver chip bodies 11 can be equidistant and orderly transferred and detected. First of all, compared with the traditional conveyor belt that transports the driver chip body 11, it can achieve precise control of the transfer process of the driver chip body 11, including the transfer of the driver chip body 11. The moving distance, speed, etc., ensure that each driver chip body 11 can be accurately placed at the predetermined position for detection. This accuracy is crucial for chip detection, and can avoid false detection or missed detection due to transfer errors. Secondly, during the transmission process, it can ensure that two adjacent driver chip bodies 11 have a certain distance, so as to avoid the two driver chip bodies 11 being too close to be moved to the detection part 14 at the same time, causing damage to the driver chip body 11. Finally, with the continuous rotation of the eccentric wheel, the system can automatically and continuously transfer multiple driver chip bodies 11 for equidistant and orderly detection. This design ensures the continuity and efficiency of the detection process and improves the overall detection efficiency.

[0097] When the front-end driving chip body 11 is placed in the two detection slots 141, the PLC controller controls the driving motor 132 to stop rotating, and starts the transmission motor 152 to drive the screw rod 153 to rotate, so that the screw rod 153 engages with the threaded ring inside the movable plate 154, thereby driving the cover plate 155 to move forward, so that the cover plate 155 is above the detection slot 141, which can prevent the driving chip body 11 from moving out of the detection slot 141 when the driving chip body 11 is being detected.

[0098] Then, the stepper motor 143 is controlled to rotate through the PLC controller, driving the rotating shaft 144 to rotate, thereby rotating the eccentric wheel 145, so that the connecting rod 146 moves up and down, and further drives the top frame 147 to reciprocate up and down, thereby reciprocatingly lifting the detection slot 141, and under the elastic force of the elastic member 142, the detection slot 141 vibrates, and the driving chip body 11 is vibrated.

[0099] After the detection is completed, the rotating motor 162 is started through the PLC controller to drive the transfer plate 163 to rotate to the top of the driver chip body 11, and the telescopic cylinder 164 is started through the PLC controller to expand, pushing the vacuum suction cup 166 down, so that the vacuum suction cup 166 starts to absorb the driver chip body 11, which is convenient for transferring and recovering the driver chip body 11 and facilitating the detection of the next driver chip body 11.

[0100] Embodiment 4

[0101] In combination with Example 1, Example 2 and Example 3, the device of the present invention is applied to actual scenarios. Currently, the LED driver chip is packaged using front packaging, and conductive materials such as gold wire or silver wire are required to connect the chip electrodes to external leads through wire bonding technology, and finally packaged with epoxy resin. However, wire bonding increases the current path, thereby increasing the generation of resistance and inductance. In addition, the LED driver chip and the PCB circuit board are packaged with epoxy resin. The thermal conductivity of epoxy resin is poor, which reduces the heat dissipation performance of the LED driver chip and easily causes overheating and damage to the LED driver chip. The LED driver chip installed by the flip-chip technology of the present device can significantly improve the overall heat dissipation performance of the LED driver chip, improve the signal transmission speed and quality, and during production, the quality of the LED driver chip is improved by using the detection device of the LED driver chip for quality detection. The factory quality of the LED driver chip can be improved.

[0102] The standard parts used in the present invention can all be purchased from the market, and the special-shaped parts can be customized according to the description and the drawings. The specific connection methods of each part adopt conventional means such as mature bolts, rivets, welding, etc. in the prior art. The machinery, parts and equipment all adopt conventional models in the prior art, and the circuit connection adopts the conventional connection method in the prior art, which will not be described in detail here. The contents not described in detail in this specification belong to the prior art known to professional and technical personnel in this field.

[0103] In the description of the present invention, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. "Multiple" means two or more, unless otherwise clearly and specifically defined.

[0104] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0105] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0106] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, unless they are contradictory.

[0107] In the drawings of the embodiments disclosed in the present invention, only the structures related to the embodiments disclosed in the present invention are involved, and other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of the present invention can be combined with each other.

[0108] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A flip-chip LED driver chip and a detection device, characterized in that: include: An LED chip (1), wherein a plurality of contact pads (2) are fixedly arranged at the lower end of the LED chip (1), and a plurality of bumps (3) are fixedly arranged at the lower ends of the plurality of contact pads (2); A heat-conducting layer (4) is fixedly mounted on the lower end of the LED chip (1); the thickness of the heat-conducting layer (4) is less than the thickness of the contact pad (2); a plurality of holes (5) are provided at the lower end of the heat-conducting layer (4); the contact pad (2) passes through the holes (5); and the heat-conducting material of the heat-conducting layer (4) is ceramic; A PCB substrate (6) is arranged below the plurality of protrusions (3).

2. A flip-chip LED driver chip as claimed in claim 1, characterized in that: A plurality of solder pads (7) are fixedly arranged on the upper end of the PCB substrate (6), and a plurality of the protrusions (3) are respectively soldered to the plurality of solder pads (7).

3. A flip-chip LED driver chip as claimed in claim 1, characterized in that: A plastic encapsulation colloid layer (8) is filled between the PCB substrate (6) and the heat conducting layer (4).

4. A detection device for a flip-chip LED driver chip, characterized in that: include: Base frame (9); A slideway (10), wherein the slideway (10) is fixedly mounted on the front end of the base frame (9), and a driving chip body (11) is disposed at the upper end of the slideway (10); A driving member (13) is installed inside the base frame (9) and is used to drive the plurality of driving chip bodies (11) to separate and move. The driving member (13) comprises fixed plates (131) relatively fixedly installed at two ends inside the base frame (9), one side of the two fixed plates (131) is rotatably installed with an eccentric wheel (133), the front ends of the two eccentric wheels (133) are fixedly installed with a driving plate (134), and the front ends of the two driving plates (134) are rotatably installed with a top plate (135); A detection member (14) for detecting the driving chip body (11), the detection member (14) comprising two detection slots (141) relatively slidably mounted on the upper end of the rear portion of the base frame (9); Two limiting members (15) are provided and are respectively installed on one side of the two base frames (9) and are used to limit the position of the driving chip body (11); A transfer member (16) is installed on one side of the base frame (9) and is used to transfer the drive chip body (11).

5. A detection device for a flip-chip LED driver chip as claimed in claim 4, characterized in that: A plurality of support columns (12) are evenly and fixedly mounted on the upper end of the base frame (9), and the driving member (13) further comprises two driving motors (132) relatively fixedly mounted on both sides of the inside of the base frame (9), and the two driving motors (132) are fixedly connected to two eccentric wheels (133) via couplings.

6. A detection device for a flip-chip LED driver chip as claimed in claim 4, characterized in that: The detection member (14) further comprises a plurality of elastic members (142) uniformly fixedly mounted at the lower end of the detection slot (141); a stepper motor (143) is fixedly mounted on one side of the interior of the base frame (9); a rotating shaft (144) is rotatably mounted inside the base frame (9); an output end of the stepper motor (143) is fixedly connected to the rotating shaft (144) via a coupling; a second eccentric wheel (145) is fixedly mounted at the front end of the rotating shaft (144); a connecting rod (146) is fixedly mounted at the front end of the second eccentric wheel (145); a top frame (147) is mounted at the upper end of the connecting rod (146); and the upper end of the top frame (147) abuts against the lower end of the detection slot (141).

7. A detection device for a flip-chip LED driver chip as claimed in claim 4, characterized in that: The limiting member (15) comprises a guide groove (151) fixedly mounted on one side of the base frame (9), a screw rod (153) being rotatably mounted inside the guide groove (151), a movable plate (154) being slidably mounted inside the guide groove (151), a threaded ring being fixedly penetrated inside the movable plate (154), the threaded ring being threadably connected to the screw rod (153), a cover plate (155) being fixedly mounted on one side of the movable plate (154), and the cover plate (155) being located above the detection groove (141).

8. A detection device for a flip-chip LED driver chip as claimed in claim 7, characterized in that: A transmission motor (152) is fixedly mounted on one side of the guide groove (151), and an output end of the transmission motor (152) is fixedly connected to a screw rod (153) via a coupling.

9. A detection device for a flip-chip LED driver chip as claimed in claim 4, characterized in that: The transfer member (16) comprises a support frame (161) fixedly mounted on one side of the base frame (9); a transfer plate (163) is rotatably mounted inside the support frame (161); a telescopic cylinder (164) is fixedly mounted on the front end of the transfer plate (163); a connecting plate (165) is fixedly mounted on the output end of the telescopic cylinder (164); and a vacuum suction cup member (166) is fixedly mounted on the lower end of the connecting plate (165).

10. A detection device for a flip-chip LED driver chip as claimed in claim 9, characterized in that: A rotating motor (162) is fixedly mounted on the upper end of the support frame (161), and an output end of the rotating motor (162) is fixedly connected to the upper end of the transfer plate (163) via a coupling.

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