Antenna and antenna package

Abstract

The invention provides an antenna and an antenna package. The antenna includes an antenna substrate, an antenna layer, a ground plane, and a first conductive feature. The antenna substrate has an upper surface and a lower surface opposite to the upper surface. The antenna layer is disposed on the upper surface of the antenna substrate. The ground layer is disposed on a lower surface of the antenna substrate. A first conductive feature is embedded in the antenna substrate proximate a first edge of the antenna layer. The first conductive feature and the ground plane are separated by a portion of the antenna substrate. The first conductive feature includes a first portion. The angle between the first part or the extension line of the first part and the upper surface of the antenna substrate is larger than 0 degree and smaller than 180 degrees. The first conductive feature may help reduce the distance between the antenna layer and the ground layer. Therefore, the parallel capacitance of the antenna is increased, and the performance of the antenna in a low-frequency band can be obviously improved, thereby improving the performance of the antenna.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to an antenna and an antenna package. Background Art

[0002] Antennas are essential components of all modern electronic devices that require frequency modulation capabilities, such as smartphones, tablets, and laptops. As communication standards evolve to provide faster data transmission rates and higher throughput, the requirements for antennas become more stringent. For example, to meet the dual-polarization diversity requirements of fifth-generation (5G) mobile communications in the FR2 (Frequency Range 2) band and MIMO (multi-input multi-output), the antenna needs to support wider bandwidth. It also needs to be able to transmit and receive independent signals with different polarizations (for example, two signals carrying two different data streams via horizontal and vertical polarizations) and have high signal isolation between these different polarizations to provide high cross-polarization discrimination (XPD).

[0003] Furthermore, since modern electronic devices need to be thin, light, and portable, and since these devices have limited space available for antennas, antennas need to be compact. Therefore, antennas need to have a high bandwidth-to-volume ratio, which represents the amount of bandwidth per unit volume (e.g., in Hz / (mm 3 ) measurement). To improve the communication performance of high-end smartphone applications, an antenna module with enhanced performance and small size is required. Summary of the invention

[0004] In view of this, the present invention provides an antenna and an antenna package to solve the above problems.

[0005] An embodiment of the present invention provides an antenna. The antenna includes an antenna substrate, an antenna layer, a ground layer and a first conductive feature. The antenna substrate has an upper surface and a lower surface opposite to the upper surface. The antenna layer is arranged on the upper surface of the antenna substrate. The ground layer is arranged on the lower surface of the antenna substrate. The first conductive feature is embedded in the antenna substrate and is close to a first edge of the antenna layer. The first conductive feature and the ground layer are separated by a portion of the antenna substrate. The first conductive feature includes a first portion. The angle between the first portion or an extension of the first portion and the upper surface of the antenna substrate is greater than 0 degrees and less than 180 degrees.

[0006] In one embodiment, the area of ​​the upper surface of the antenna layer is equal to or smaller than the area of ​​the upper surface of the antenna substrate, and the upper surface of the antenna layer is adjacent to the upper surface of the antenna substrate, so as to realize antenna layers of different sizes to meet different requirements.

[0007] In one embodiment, the first conductive feature has a first height along a first direction substantially perpendicular to the upper surface of the antenna substrate, and the first height is less than the thickness of the antenna substrate along the first direction, so that the first conductive feature does not contact the ground layer, thereby ensuring the performance of the antenna.

[0008] In one embodiment, the first conductive feature has an inner edge away from the first edge of the antenna layer, and a first lateral distance between the inner edge of the first conductive feature and the first edge of the antenna layer is less than or equal to 0.1λg, where λg is the guided wavelength of a 50Ω microstrip at a center frequency. Therefore, the first conductive feature is confined within the region, thereby ensuring that the first conductive feature can increase the parallel capacitance of the antenna as much as possible and improve communication performance.

[0009] In one embodiment, the first conductive feature has an outer edge close to the first edge of the antenna layer and opposite to the inner edge, and the width between the inner edge and the outer edge of the first conductive feature is less than or equal to 0.1λg. Therefore, the first conductive feature is confined within the region, thereby ensuring that the first conductive feature can increase the parallel capacitance of the antenna as much as possible and improve the communication performance.

[0010] In one embodiment, the first conductive feature is a single-wall structure extending continuously parallel to the first edge of the antenna layer, thereby facilitating manufacturing and improving the structural stability of the antenna.

[0011] In one embodiment, the first conductive feature is in a one-to-one correspondence with the corresponding edge of the antenna layer, thereby facilitating manufacturing.

[0012] In one embodiment, the first conductive feature comprises a plurality of discrete wall structures arranged side by side corresponding to the first edge of the antenna layer, thereby providing a different production method and improving the parallel capacitance of the antenna.

[0013] In one embodiment, the first conductive features have a many-to-one relationship with the corresponding edges of the antenna layer, thereby facilitating manufacturing.

[0014] In one embodiment, the plurality of discrete wall structures have different heights along the first direction, so as to improve the design flexibility and meet different design requirements.

[0015] In one embodiment, the first conductive feature has a strip shape, an L shape, an inverted L shape, a reversed L shape or a reversed L shape, so as to improve the design flexibility and meet different design requirements.

[0016] In one embodiment, the first conductive feature has a lateral portion close to the lower surface of the antenna substrate, and the lateral portion extends toward the central portion of the antenna substrate and is substantially parallel to the antenna layer, so as to further increase the parallel capacitance of the antenna and improve communication performance.

[0017] In one embodiment, the first conductive feature includes an integral wall structure or a composite wall structure to improve design flexibility and meet different design requirements.

[0018] In one embodiment, wherein the composite wall structure comprises:

[0019] through holes arranged in a row corresponding to a first edge of the antenna layer; and

[0020] The conductive line covers and is electrically connected to the through hole, so as to improve the design flexibility and meet different design requirements.

[0021] In one embodiment, the first conductive feature contacts the antenna layer to improve design flexibility and meet different design requirements.

[0022] In one embodiment, the first conductive feature is separated from and electrically coupled to the antenna layer, so as to improve design flexibility and meet different design requirements.

[0023] In one embodiment, the first conductive feature is electrically floating to further increase the parallel capacitance of the antenna and improve communication performance.

[0024] In one embodiment, the first conductive feature has a first height along a first direction substantially perpendicular to the upper surface of the antenna substrate, and a distance between the antenna layer and the conductive feature is smaller than the first height.

[0025] In one embodiment, further comprising:

[0026] A second conductive feature is embedded in the antenna substrate and is close to a second edge of the antenna layer, the second edge is close to a second side of the antenna layer, and the second conductive feature is electrically connected to the antenna layer to improve design flexibility and meet different design requirements.

[0027] In one embodiment, the ground layer has a protruding portion, and the protruding portion extends toward the first conductive feature, so as to further improve the parallel capacitance of the antenna, improve the communication performance, and increase the design flexibility and meet different design requirements.

[0028] An embodiment of the present invention provides an antenna package. The antenna package includes an antenna, a first substrate and a semiconductor die. The antenna includes an antenna substrate, an antenna layer, a ground layer and a first conductive feature. The antenna substrate has an upper surface and a lower surface opposite to the upper surface. The antenna layer is arranged on the upper surface of the antenna substrate. The ground layer is arranged on the lower surface of the antenna substrate. The first conductive feature is embedded in the antenna substrate and is close to the first edge of the antenna layer. The first conductive feature and the ground layer are separated by a portion of the antenna substrate. The first conductive feature includes a first portion. The angle between the first portion or the extension of the first portion and the upper surface of the antenna substrate is greater than 0 degrees and less than 180 degrees. The first substrate is mounted on the ground layer of the antenna. The semiconductor die is mounted on the first substrate.

[0029] The antenna of the present invention includes an antenna substrate, an antenna layer, a ground layer and a first conductive feature. The antenna substrate has an upper surface and a lower surface opposite to the upper surface. The antenna layer is arranged on the upper surface of the antenna substrate. The ground layer is arranged on the lower surface of the antenna substrate. The first conductive feature is embedded in the antenna substrate and is close to the first edge of the antenna layer. The first conductive feature and the ground layer are separated by a part of the antenna substrate. The first conductive feature includes a first part. The angle between the first part or the extension of the first part and the upper surface of the antenna substrate is greater than 0 degrees and less than 180 degrees. Thus, the first conductive feature can help reduce the distance between the antenna layer and the ground layer. Therefore, the parallel capacitance of the antenna is increased, and the performance of the antenna in the low frequency band can be significantly improved, thereby improving the performance of the antenna. In addition, the first conductive feature close to the antenna layer can be easily manufactured. For example, the first conductive feature can be formed in the same process step as the antenna layer, thereby saving process steps and reducing production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1A is a top view of an antenna according to some embodiments of the present invention;

[0031] Figure 1B , 1C and 1D are according to some embodiments of the present invention Figure 1A A cross-sectional view of the antenna shown taken along line AA';

[0032] Figure 2A is a top view of an antenna according to some embodiments of the present invention;

[0033] Figure 2B According to some embodiments of the present invention, Figure 2A a cross-sectional view taken along line AA' of the antenna shown;

[0034] Figure 3A is a top view of an antenna according to some embodiments of the present invention;

[0035] Figure 3B According to some embodiments of the present invention, Figure 3A a cross-sectional view taken along line BB' of the antenna shown;

[0036] Figure 4A is a top view of an antenna according to some embodiments of the present invention;

[0037] Figure 4B According to some embodiments of the present invention, Figure 4A a cross-sectional view taken along line CC' of the antenna shown;

[0038] Figure 5A is a top view of an antenna according to some embodiments of the present invention;

[0039] Figure 5B According to some embodiments of the present invention, Figure 5A a cross-sectional view taken along line CC' of the antenna shown;

[0040] Fig. 6A is a top view of an antenna according to some embodiments of the present invention;

[0041] Figure 6B According to some embodiments of the present invention, Fig. 6A a cross-sectional view taken along line CC' of the antenna shown;

[0042] Fig. 7A is a top view of an antenna according to some embodiments of the present invention;

[0043] Figure 7B According to some embodiments of the present invention, Fig. 7A a cross-sectional view taken along line CC' of the antenna shown;

[0044] Fig. 8A is a top view of an antenna according to some embodiments of the present invention;

[0045] Figure 8B According to some embodiments of the present invention, Fig. 8A a cross-sectional view taken along line CC' of the antenna shown;

[0046] Fig.9A is a top view of an antenna according to some embodiments of the present invention;

[0047] Fig. 9B According to some embodiments of the present invention, Fig.9A a cross-sectional view taken along line CC' of the antenna shown;

[0048] Fig. 10A is a top view of an antenna according to some embodiments of the present invention;

[0049] Fig. 10B According to some embodiments of the present invention, Fig. 10A a cross-sectional view taken along line CC' of the antenna shown;

[0050] Fig.11A is a top view of an antenna according to some embodiments of the present invention;

[0051] Fig. 11B According to some embodiments of the present invention, Fig.11A a cross-sectional view taken along line CC' of the antenna shown;

[0052] Fig.12 is a side view of an antenna according to some embodiments of the present invention;

[0053] Fig.13 is a side view of an antenna according to some embodiments of the present invention;

[0054] Fig.14A is a top view of an antenna according to some embodiments of the present invention;

[0055] Fig. 14B According to some embodiments of the present invention, Fig.14A a cross-sectional view taken along line AA' of the antenna shown;

[0056] Fig.15 According to some embodiments of the present invention, Figure 1A a cross-sectional view taken along line AA' of the antenna shown;

[0057] Fig.16A is a cross-sectional view of an antenna package according to some embodiments of the present invention, the antenna package including an antenna;

[0058] Fig. 16B is a cross-sectional view of an antenna package according to some embodiments of the present invention, the antenna package including an antenna;

[0059] Fig.17A is a top view of an antenna according to some embodiments of the present invention;

[0060] Fig. 17B According to some embodiments of the present invention, Fig.17A a cross-sectional view taken along line EE' of the antenna shown;

[0061] Fig. 17C According to some embodiments of the present invention, Fig.17A a cross-sectional view taken along line FF' of the antenna shown; and

[0062] Fig.18is a graph showing a comparison of return loss versus operating frequency between a conventional antenna and antennas according to some embodiments of the present invention. DETAILED DESCRIPTION

[0063] The following description is made for the purpose of illustrating the general principles of the invention and is not to be construed in a limiting sense. The scope of the invention is best determined by reference to the appended claims.

[0064] The present innovative concept will be described in full with reference to the accompanying drawings, in which exemplary embodiments of the innovative concept are shown. From the exemplary embodiments described in more detail below with reference to the accompanying drawings, the advantages and features of the present innovative concept and the methods for achieving them will become apparent. It should be noted that the innovative concept is not limited to the following exemplary embodiments and can be implemented in various forms. Therefore, these exemplary embodiments are only provided to invent the innovative concept and let those familiar with the technology know the scope of the innovative concept. In addition, the drawings shown are only schematic and non-restrictive. In the drawings, for illustrative purposes, the size of some elements may be exaggerated and not drawn to scale. The dimensions and relative dimensions do not correspond to the actual dimensions in the practice of the present invention.

[0065] In 5G millimeter-wave (mmWave) antenna packages (antenna-in-package, AiP), the area of ​​the ground layer is continuously reduced to be comparable to the antenna layer. The smaller antenna layer may cause the shunt capacitance of the antenna to decrease and increase the center frequency fc of the AiP. Therefore, the operating frequency of the conventional AiP will shift to a higher frequency band. Therefore, the operating frequency bandwidth of the conventional AiP is narrow. The performance of the conventional AiP in lower frequency bands is affected. Therefore, a new antenna and antenna package that increases shunt capacitance in a small size is needed.

[0066] Figure 1A is a top view of an antenna 500A according to some embodiments of the present invention. Figure 1B , 1C Figures 1 and 1D are shown according to some embodiments of the present invention. Figure 1A The cross-sectional view of antenna 500A in FIG. 1 shows the arrangement of embedded conductive features of antenna 500A. Figure 1A and 1BIn some embodiments shown in the figures, the antenna 500A (e.g., an antenna package) includes an antenna substrate 200A, an antenna layer 210, a ground layer 220A, and conductive features 250A (including conductive features 250A-1 and 250A-2). To illustrate the reference directions marked in the figures, directions 100 and 110 are defined as directions substantially parallel to the upper surface 200A-T of the antenna substrate 200A (e.g., the lateral direction includes the length direction and the width direction). Direction 120 is defined as a direction substantially perpendicular to the upper surface 200A-T (e.g., the vertical direction or the height direction). Direction 100 is substantially perpendicular to directions 110 and 120. Direction 110 is substantially perpendicular to directions 100 and 120. Direction 120 is substantially perpendicular to directions 100 and 110. To clearly illustrate the positions and geometric dimensions of the conductive features of the antenna, the conductive features are drawn with solid lines in the following top views (e.g., Figure 1A Conductive feature 250A in.

[0067] like Figure 1A and 1B As shown in the figure, the antenna substrate 200A has an upper surface 200A-T, a lower surface 200A-B and side surfaces 200A-S1, 200A-S2, 200A-S3, and 200A-S4. Figure 1B In the cross-sectional view shown, the side surfaces 200A-S1, 200A-S2, 200A-S3, 200A-S4 are adjacent to the upper surface 200A-T and the lower surface 200A-B. Figure 1AIn the top view shown, the relative side surfaces 200A-S1, 200A-S2 are connected between the relative side surfaces 200A-S3, 200A-S4. In some embodiments, the antenna substrate 200A can be a single-layered structure or a multi-layered structure. The antenna substrate 200A can be composed of one or more stacked (laminated) dielectric layers. In some embodiments where the antenna substrate 200A is composed of multiple dielectric layers, the dielectric layers can be made of the same or different materials and have the same or different thicknesses. In some embodiments, the antenna substrate 200A includes a core substrate and / or a coreless substrate. For example, the antenna substrate 200A may include dielectric layers stacked relatively on the core substrate. For example, the antenna substrate 200A may include dielectric layers stacked on one side of the coreless substrate. In some embodiments, the antenna substrate 200A is made of organic or inorganic materials, such as FR4 material, FR5 material, bismaleimide triazine (BT) resin material, glass, ceramic, molding compound, liquid crystal polymer, glass cloth material, epoxy resin, ferrite, silicon or other applicable materials or combinations thereof. In some embodiments, the antenna substrate 200A further includes a circuit (not shown) composed of a conductive layer and a through hole (not shown), which is formed in the dielectric substrate 200 for electrical connection.

[0068] The antenna layer 210 is disposed on the upper surface 200A-T of the antenna substrate 200A. Figure 1A and 1B In some embodiments shown in the figures, the antenna layer 210 completely covers the upper surface 200A-T of the antenna substrate 200A. Figure 1A In the top view shown, the top view area A1 of the antenna layer 210 is the same as the top view area A2 of the antenna substrate 200A. In some embodiments, the antenna layer 210 may have at least one edge 210E (including edges 210E1, 210E2, 210E3, and 210E4) close to the corresponding side of the antenna substrate 200A. Figure 1A and 1B In the cross-sectional view shown in the figure, the antenna layer 210 can have edges 210E1, 210E2, 210E3 and 210E4 close to and aligned with the corresponding sides 200A-S1, 200A-S2, 200A-S3 and 200A-S4 of the antenna substrate 200A. In some embodiments, at least one edge 210E1, 210E2, 210E3 and 210E4 is higher or lower than the corresponding side of the antenna substrate 200A to provide flexibility in antenna design.

[0069] In some embodiments, the antenna layer 210 may be a single-layer structure or a multi-layered structure. In some embodiments where the antenna layer 210 is a single-layer structure, the antenna layer 210 may be formed on the upper surface 200A-T of the antenna substrate 200A. In some embodiments where the antenna layer 210 is a multi-layered structure, the antenna layer 210 may be formed on the upper surface 200A-T of the antenna substrate 200A and in a dielectric layer (not shown) located below the upper surface 200A-T. In some embodiments, the antenna layer 210 is a broadside antenna, including a patch antenna, a dipole antenna, and a slot antenna, which means that the antenna layer 210 can radiate signals along the direction 120 alone. In some embodiments, the antenna layer 210 may be an orthographic antenna, which means that the antenna layer 210 can radiate signals along the direction 120. In some embodiments, the antenna layer 210 may be a dual-band or multi-band antenna capable of operating in at least a first frequency band and a second frequency band different from the first frequency band. For example, the first frequency band has a first frequency range, and the second frequency band has a second frequency range higher than the first range. For example, the first frequency band may be a low frequency band of 24.25-29.5 GHz, and the second frequency band may be a high frequency band of 37-43.5 GHz, 47.2-48.2 GHz, or / and 57-64 GHz. In some embodiments, antenna layer 210 may be electrically connected to circuitry (not shown) in antenna substrate 200A.

[0070] The ground layer 220A is disposed on the lower surface 200A-B of the antenna substrate 200A. Figure 1B As shown, the ground layer 220A is disposed below the antenna layer 210. In some embodiments, the ground layer 220A may also be formed between dielectric layers (not shown) of the antenna substrate 200A and separated from the antenna layer 210. In some embodiments, the ground layer 220A is exposed from the side surfaces 200A-S1 and 200A-S2 of the antenna substrate 200A. Figure 1B As shown, opposite sides 220A-E1, 220A-E2 of the ground layer 220A may be aligned with corresponding sides 200A-S1, 200A-S2 of the antenna substrate 200A. In some embodiments, the ground layer 220A is formed inside the antenna substrate 200A and is not exposed from the sides 200A-S1, 200A-S2 of the antenna substrate 200A. In some embodiments, the ground layer 220A may be isolated (or separated) from the antenna layer 210. In some embodiments, the ground layer 220A may be made of metal, including, for example, aluminum, copper, gold, silver, iron, or a combination thereof.

[0071] like Figure 1A and Figure 1BAs shown, the conductive features 250A (including conductive features 250A-1 and 250A-2) of the antenna 500A are formed in the antenna substrate 200A. The conductive features 250A-1 and 250A-2 of the antenna 500A are located near the upper surface 200A-T of the antenna substrate 200A and the antenna layer 210. In some embodiments, the conductive features 250A of the antenna 500A are formed near the corresponding edges 210E1, 210E2 of the antenna layer 210. For example, the conductive feature 250A-1 is formed in the antenna substrate 200A and is close to the corresponding edge 210E1. The conductive feature 250A-2 is formed in the antenna substrate 200A and is close to the corresponding edge 210E2. In the example shown in FIG. Figure 1A In the top view shown, the top view area A3 of the conductive feature 250A-1 (or the conductive feature 250A-2) is smaller than the top view area A1 of the antenna layer 210. Figure 1A The top view and Figure 1B In the cross-sectional view shown, the conductive features 250A may be strip-shaped. In some embodiments, each conductive feature 250A may include a first portion extending between the upper surface 200A-T and the lower surface 200A-B. In some embodiments, each conductive feature 250A may have only the first portion, for example Figure 1A and Figure 1B In some embodiments, each conductive feature 250A may further include a second portion, and the extension direction of the second portion may be different from the extension direction of the first portion, such as Fig. 10A , Fig. 10B , Fig.11A , Fig. 11B In some embodiments, each conductive feature 250A may have the same configuration, including height, width, shape, or other characteristics. Alternatively, at least two conductive features 250A may have different configurations, including variations in height, width, shape, or other characteristics.

[0072] Conductive feature 250A-2 is formed in antenna substrate 200A and near corresponding edge 210E2. For example, conductive feature 250A-1 and conductive feature 250A-2 are separated from each other. In some embodiments, conductive feature 250A-1 and conductive feature 250A-2 are formed inside antenna substrate 200A and are not exposed from corresponding side 200A-S1, 200A-S2. In some embodiments, conductive feature 250A-1 and conductive feature 250A-2 are exposed from corresponding side 200A-S1, 200A-S2.

[0073] In some embodiments, conductive feature 250A is electrically connected to antenna layer 210. For example, conductive feature 250A-1 can contact a portion of antenna layer 210 near corresponding edge 210E1. Conductive feature 250A-2 can contact a portion of antenna layer 210 near corresponding edge 210E2. In some embodiments, conductive feature 250A can be isolated from ground layer 220.

[0074] like Figure 1A and Figure 1B As shown, the conductive feature 250A is disposed between the antenna layer 210 and the ground layer 220. The conductive feature 250A and the ground layer 220A are separated by a portion of the antenna substrate 200A. Figure 1A In the top view shown, the conductive features 250A-1 and 250A-2 can extend along the corresponding edges 210E1 and 210E2. In addition, each conductive feature 250A is a single wall structure, which extends continuously and parallel to the corresponding edge 210E of the antenna layer 210. For example, the conductive feature 250A-1 can extend along the corresponding edge 210E1. In addition, the conductive feature 250A-1 is a single wall structure, which extends continuously and parallel to the corresponding edge 210E1 of the antenna layer 210. The conductive feature 250A-2 can extend along the corresponding edge 210E2. In addition, the conductive feature 250A-2 is a single wall structure, which extends continuously and parallel to the corresponding edge 210E2 of the antenna layer 210. In the example shown in FIG. Figure 1A In the top view shown, the conductive features 250A-1, 250A-2 may have a length L1 along the corresponding edges 210E1, 210E2, wherein the edges 210E1, 210E2 have a length L2. Figure 1A In the top view shown, the antenna layer 210 may be square, and the edges 210E1, 210E2, 210E3, and 210E4 may have the same length L2. In some embodiments, the length L1 may be less than or equal to the length L2.

[0075] In such Figure 1B In the cross-sectional view shown, the conductive feature 250A can extend toward the ground layer 220. In some embodiments, the conductive feature 250A can be an extension of the antenna layer 210. The conductive feature 250A can help reduce the distance between the antenna layer 210 and the ground layer 220. Therefore, the parallel capacitance of the antenna 500A is increased. The performance of the antenna in the low frequency band can be significantly improved.

[0076] like Figure 1BAs shown, the conductive feature 250A may have a height H1 along the direction 120. In some embodiments, the height H1 of the conductive feature 250A is less than the thickness T1 of the antenna substrate 200A along the direction 120 (i.e., the distance between the upper surface 200A-T and the lower surface 200A-B of the antenna substrate 200A). In this way, the conductive feature 250A does not contact the ground layer 220A, thereby ensuring that the performance of the antenna 500A in the low frequency band is better.

[0077] In such Figure 1A In the top view shown, the conductive feature 250A can be arranged in the edge region 210ER of the antenna layer 210. In some embodiments, the edge region 210ER can extend from the edge 210E into a portion of the antenna layer 210, and the extension lateral distance LD1. In some embodiments, the lateral distance LD1 can be less than or equal to 0.1λg, where λg is the guided wavelength of a 50Ω microstrip at the center frequency.

[0078] like Figure 1A and Figure 1BAs shown, the conductive feature 250A may have an inner edge 250A-E1 (including inner edges 250A-1E1 and 250A-2E1) away from the corresponding edge 210E of the antenna layer 210, and an outer edge 250A-E2 (including outer edges 250A-1E2 and 250A-2E2) close to the corresponding edge 210E of the antenna layer 210 and opposite to the inner edge 250A-E1. For example, the conductive feature 250A-1 has an inner edge 250A-1E1 away from the corresponding edge 210E of the antenna layer 210, and an outer edge 250A-1E2 close to the corresponding edge 210E of the antenna layer 210. The conductive feature 250A-2 has an inner edge 250A-2E1 away from the corresponding edge 210E of the antenna layer 210, and an outer edge 250A-2E2 close to the corresponding edge 210E of the antenna layer 210. In some embodiments, the lateral distance LD2 between the inner edge 250A-E1 of the conductive feature 250A and the corresponding edge 210E of the antenna layer 210 can be less than or equal to 0.1λg, where λg is the guided wavelength of the 50Ω microstrip at the center frequency. In some embodiments, the lateral distance LD2 can be less than or equal to the lateral distance LD1. In some embodiments, the outer edge 250A-1E2 of the conductive feature 250A-1 can be flush with or lower than the edge 210E1 of the antenna layer 210 in the direction 100. In some embodiments, the outer edge 250A-2E2 of the conductive feature 250A-2 can be flush with or lower than the edge 210E2 of the antenna layer 210 in the direction 100. In some embodiments, the outer edge 250A-1E2 of the conductive feature 250A-1 can be flush with or lower than the side 200A-S1 of the antenna substrate 200A in the direction 100. In some embodiments, outer edge 250A- 2E2 of conductive feature 250A- 2 can be flush with or lower than side 200A- S2 of antenna substrate 200A in direction 100 .

[0079] In some embodiments, conductive feature 250A may have a width W1 between inner edge 250A-E1 and outer edge 250A-E2. In some embodiments, width W1 may be less than or equal to 0.1λg, where λg is the guided wavelength of a 50Ω microstrip at the center frequency. In some embodiments, width W1 may be less than or equal to lateral distance LD1 and / or lateral distance LD2.

[0080] In some embodiments, the angle between the conductive feature 250A and the upper surface 200A-T of the antenna substrate 200A is greater than 0 degrees and less than 180 degrees. Figure 1BIn some of the embodiments shown, the angle θ between the inner edge 250A-1E1 of the conductive feature 250A-1 and the upper surface 200A-T of the antenna substrate 200A (or the angle between the inner edge 250A-2E1 of the conductive feature 250A-2 and the upper surface 200A-T of the antenna substrate 200A) can be a right angle (i.e., the angle θ is equal to 90 degrees). Figure 1C In some of the embodiments shown, the angle θ between the inner edge 250A-1E1 of the conductive feature 250A-1 and the upper surface 200A-T of the antenna substrate 200A (or the angle between the inner edge 250A-2E1 of the conductive feature 250A-2 and the upper surface 200A-T of the antenna substrate 200A) can be an obtuse angle (i.e., the angle θ is greater than 90 degrees and less than 180 degrees). Figure 1D In some of the embodiments shown, the angle θ between the inner edge 250A-1E1 of the conductive feature 250A-1 and the upper surface 200A-T of the antenna substrate 200A (or the angle between the inner edge 250A-2E1 of the conductive feature 250A-2 and the upper surface 200A-T of the antenna substrate 200A) can be an acute angle (i.e., the angle θ is greater than 0 degrees and less than 90 degrees). Thus, the conductive feature 250A in the embodiments of the present invention can have the above various angle configurations, so as to adapt to different application scenarios and usage requirements, and is easier to manufacture.

[0081] In some embodiments, the antenna layer 210 of the antenna may cover a portion of the upper surface 200A-T of the antenna substrate 200A. The antenna layer 210 of the antenna may also cover the entire upper surface 200A-T of the antenna substrate 200A. The above-mentioned manner may improve the old flexibility of the design, and the solution of the embodiment of the present invention may be used in different antenna layers, thereby having design flexibility. In some embodiments, the conductive feature 250A may be completely formed inside the antenna substrate 200A and not exposed from any side of the antenna substrate 200A. The conductive feature 250A may also have at least a portion exposed from the antenna substrate 200A. This may improve the old flexibility of the design, and the solution of the embodiment of the present invention may be used in different antenna substrates, thereby having design flexibility.

[0082] Figure 2A is a top view of antenna 500B according to some embodiments. Figure 2B is a cross-sectional view of antenna 500B along line AA' according to some embodiments, showing the arrangement of embedded conductive features of antenna 500B. For the sake of brevity, the following description is similar to that previously referred to. Figure 1A and Figure 1B The same or similar elements of the embodiments described above will not be described again. Figure 2A and Figure 2BAs shown, the antenna 500B is different from the antenna 500A in that the antenna 500B includes an antenna substrate 200B and a ground layer 220B. The antenna substrate 200B has an upper surface 200B-T, a lower surface 200B-B, and side surfaces 200B-S1, 200B-S2, 200B-S3, and 200B-S4. Figure 2B In the cross-sectional view shown, the side surfaces 200B-S1, 200B-S2, 200B-S3, and 200B-S4 are located between and adjacent to the upper surface 200B-T and the lower surface 200B-B. Figure 2A In the top view shown, the opposite side surfaces 200B-S1 and 200B-S2 are connected between the opposite side surfaces 200B-S3 and 200B-S4.

[0083] like Figure 2A and Figure 2B As shown, the antenna layer 210 of the antenna 500B partially covers the upper surface 200B-T of the antenna substrate 200B. A portion of the upper surface 200B-T of the antenna substrate 200B is exposed from the antenna layer 210 near the side surfaces 200B-S1 and 200B-S2. Figure 2A In the top view shown, the top view area A1 of the antenna layer 210 is smaller than the top view area A4 of the antenna substrate 200B. Figure 2A and Figure 2B As shown, the projections of the edges 210E1 and 210E2 of the antenna layer 210 on the upper surface 200B-T of the antenna substrate 200B can be located between the corresponding sides 200B-S1 and 200B-S2. In addition, the edges 210E3 and 210E4 of the antenna layer 210 can be close to and aligned with the corresponding sides 200B-S3 and 200B-S4. In some embodiments, the conductive features 250A-1 and the conductive features 250A-2 are formed inside the antenna substrate 200B and are not exposed from the corresponding sides 200B-S1 and 200B-S2. In some embodiments, the outer edge 250A-1E2 of the conductive feature 250A-1 can be flush with or lower than the edge 210E1 of the antenna layer 210 in the direction 100. In some embodiments, outer edge 250A-2E2 of conductive feature 250A-2 can be flush with or lower than edge 210E2 of antenna layer 210 in direction 100. In some embodiments, outer edge 250A-1E2 of conductive feature 250A-1 can be lower than side 200A-S1 of antenna substrate 200A in direction 100. In some embodiments, outer edge 250A-2E2 of conductive feature 250A-2 can be lower than side 200A-S2 of antenna substrate 200A in direction 100.

[0084] like Figure 2Aand Figure 2B As shown, the ground layer 220B of the antenna 500B is disposed on and covers the lower surface 200B-B of the antenna substrate 200B. Figure 2B As shown, the opposite edges 220B-E1, 220B-E2 of the ground layer 220B can be aligned with the corresponding sides 200B-S1, 200B-S2 of the antenna substrate 200B. In some embodiments, the projections of the edges 210E1 and 210E2 of the antenna layer 210 on the ground layer 220B can be located between the corresponding edges 220B-E1, 220B-E2.

[0085] In some embodiments, one or more conductive features may be arranged near one or more corresponding antenna layer edges. In some embodiments, the conductive features include a single wall structure that extends continuously and parallel to the corresponding antenna layer edge. The number of conductive features having a single wall structure may be less than or equal to the number of antenna layer edges. In some embodiments, the conductive features having a single wall structure may have a one-to-one relationship with the corresponding antenna layer edges. In some embodiments, the conductive features having a single wall structure have the same or different heights in a cross-sectional view along a first direction that is substantially perpendicular to the upper surface of the antenna substrate.

[0086] In some embodiments, the conductive features include discrete wall structures arranged side by side and near the corresponding edge of the antenna layer. In some embodiments, the discrete wall structures are separated from each other and arranged in a row (or arranged in a 1×m array, where m is an integer greater than or equal to one) along the corresponding edge of the antenna layer. In some embodiments, the discrete wall structures and the corresponding edge of the antenna layer can be a many-to-one relationship. In some embodiments of the conductive features including discrete wall structures, the discrete wall structures have the same or different heights along the first direction in a cross-sectional view.

[0087] Figure 3A is a top view of an antenna 500C according to some embodiments of the present invention. Figure 3B According to some embodiments of the present invention, along Figure 3A The cross-sectional view taken along line BB' of the antenna 500C shown in FIG. 5 shows the arrangement of the embedded conductive features of the antenna 500C. For the sake of simplicity, the embodiments described below are similar to those described in the previous reference. Figure 1A and Figure 1B The same or similar elements described above will not be described again. Figure 3A and Figure 3B As shown, antenna 500C differs from antenna 500A in that antenna 500C includes a conductive feature 250A-3 that is embedded in antenna substrate 200A and is proximate to a single corresponding edge 210E3 of antenna layer 210. Figure 1A and Figure 1B The conductive features 250A-1 and 250A-2 shown, the conductive feature 250A-3 may include a single-wall structure that extends continuously and parallel to the corresponding edge 210E3 of the antenna layer 210. The number of conductive features 250A-3 with a single-wall structure (i.e., one) may be less than the number of edges 210E of the antenna layer 210 (i.e., four). In some embodiments, the conductive features 250A-3 with a single-wall structure and the corresponding edge 210E3 of the antenna layer 210 may be in a one-to-one correspondence. In some embodiments, the conductive feature 250A-3 is formed inside the antenna substrate 200A and is not exposed from the corresponding side 200A-S3. In some embodiments, the conductive feature 250A-3 is exposed from the corresponding side 200A-S3. In some embodiments, the conductive features 250A-1, 250A-2, and 250A-3 may have the same or similar structure (e.g., a single-wall structure), length (e.g., length L1), width (e.g., width W1), and height (e.g., height H1).

[0088] Figure 4A is a top view of an antenna 500D according to some embodiments of the present invention. Figure 4B According to some embodiments of the present invention, along Figure 4A The cross-sectional view taken along the line CC' of the antenna 500D shown in FIG. 5 shows the arrangement of the embedded conductive features of the antenna 500D. For the sake of simplicity, the following embodiments are different from the previous reference embodiments. Figure 1A and Figure 1B The same or similar elements described above will not be described again. Figure 4A and Figure 4BAs shown, antenna 500D is different from antenna 500A in that antenna 500D includes three conductive features 250A-1, 250A-2, and 250A-3, which are embedded in antenna substrate 200A and close to three corresponding edges 210E1, 210E2, and 210E3 of antenna layer 210. The number (i.e., three) of conductive features 250A-1, 250A-2, and 250A-3 having a single-wall structure may be less than the number (i.e., four) of edges 210E of antenna layer 210. In some embodiments, conductive features 250A-1, 250A-2, and 250A-3 having a single-wall structure and corresponding edges 210E1, 210E2, and 210E3 of antenna layer 210 may be in a one-to-one correspondence. In some embodiments, the conductive features 250A-1, 250A-2, and 250A-3 are formed inside the antenna substrate 200A and are not exposed from the corresponding sides 200A-S1, 200A-S2, and 200A-S3. In some embodiments, the conductive features 250A-1, 250A-2, and 250A-3 are exposed from the corresponding sides 200A-S1, 200A-S2, and 200A-S3. In some embodiments, the conductive features 250A-1, 250A-2, and 250A-3 may have the same or similar structure (e.g., single-wall structure), geometric dimensions (e.g., shape, length L1, width W1, and height H1), and position relative to the antenna layer 210 and the antenna substrate 200A.

[0089] In some other embodiments, the antenna 500D may further include an additional conductive feature having a single-wall structure corresponding to the edge 210E4 of the antenna layer 210. Therefore, the number of conductive features (ie, four) may be the same as the number of the edge 210E of the antenna layer 210 (ie, four).

[0090] Figure 5A is a top view of an antenna 500E according to some embodiments of the present invention. Figure 5B According to some embodiments of the present invention, along Figure 5A The cross-sectional view taken along line CC' of the antenna 500E shown in FIG. 5 shows the arrangement of the embedded conductive features of the antenna 500E. The elements of the embodiments described hereinafter are similar to those previously described with reference to FIG. Figure 1A and Figure 1B For the sake of brevity, the same or similar elements described above will not be described again. Figure 5A and Figure 5B As shown, antenna 500E differs from antenna 500A in that antenna 500E includes three conductive features 250A-1, 250A-2, and 250A-3 that are embedded in antenna substrate 200A and near three corresponding edges 210E1, 210E2, and 210E3 of antenna layer 210. Figure 1A and Figure 1B The conductive features 250A-1 and 250A-2, the conductive feature 250A-3 shown may include a single-wall structure that extends continuously and parallel to the corresponding edge 210E3 of the antenna layer 210. The number of conductive features 250A-1, 250A-2, and 250A-3 having a single-wall structure (i.e., three) may be less than the number of edges 210E of the antenna layer 210 (i.e., four). In some embodiments, the conductive feature 250A-3 having a single-wall structure may be in a one-to-one relationship with the corresponding edge 210E3 of the antenna layer 210. In some embodiments, the conductive features 250A-1, 250A-2, and 250A-3 are formed inside the antenna substrate 200A and are not exposed from the corresponding sides 200A-S1, 200A-S2, and 200A-S3 of the antenna substrate 200A. In some embodiments, the conductive features 250A-1, 250A-2, and 250A-3 are exposed from the corresponding sides 200A-S1, 200A-S2, and 200A-S3 of the antenna substrate 200A. In some embodiments, the conductive features 250A-1, 250A-2, and 250A-3 may have the same or similar structure (e.g., a single-wall structure), shape, length (e.g., length L1), width (e.g., width W1), and position relative to the antenna layer 210 and the antenna substrate 200A. In some embodiments, the conductive features 250A-1 and 250A-2 have the same height H1, while the conductive feature 250A-3 has a height H2 that is different from the height H1. For example, the height H2 is greater than the height H1. That is, the conductive feature 250A-3 is closer to the ground layer 220A than the conductive features 250A-1 and 250A-2. Therefore, the parallel capacitance of the antenna 500E can be further increased, and the performance of the antenna in the low frequency band can be significantly improved.

[0091] Fig. 6A is a top view of an antenna 500F according to some embodiments of the present invention. Figure 6B According to some embodiments of the present invention, along Fig. 6A The cross-sectional view taken along line AA' of the antenna 500F shown in FIG. 1 shows the arrangement of the embedded conductive features of the antenna 500F. The elements of the embodiments described hereinafter are similar to those previously described with reference to FIG. Figure 1A , Figure 1B , Figure 4A and Figure 4B For the sake of brevity, the same or similar elements described above will not be described again. Fig. 6A and Figure 6B As shown, antenna 500F and antenna 500D ( Figure 4A and Figure 4B) is that the antenna 500F includes three conductive features 250F-1, 250F-2 and 250A-3, which are embedded in the antenna substrate 200A and close to three corresponding edges 210E1, 210E2 and 210E3 of the antenna layer 210. Similar to Figure 1A and Figure 1B As shown in the conductive features 250A-1 and 250A-2, the conductive features 250F-1, 250F-2 may include a single wall structure that extends continuously and parallel to the corresponding edges 210E1, 210E2 of the antenna layer 210. In some embodiments, the conductive feature 250A-3 has a length L1, and the conductive features 250F-1, 250F-2 both have a length L3 that is different from the length L1. For example, the length L3 is shorter than the length L1. In some embodiments, the conductive features 250F-1, 250F-2 may have different lengths, widths and / or heights. The antenna 500F includes the conductive features 250F-1, 250F-2 and 250A-3 can increase parallel capacitance and provide increased design flexibility.

[0092] Fig. 7A is a top view of an antenna 500G according to some embodiments of the present invention. Figure 7B According to some embodiments of the present invention, along Fig. 7A The cross-sectional view of the antenna 500G taken along the line CC' is shown to show the arrangement of the embedded conductive features of the antenna 500G. The components of the embodiments described hereinafter are similar to those previously described with reference to Figure 1A , 1B For the sake of brevity, the same or similar elements described in 4A, 4B, 5A and 5B are not repeated. Fig. 7A and 7B As shown, antenna 500G and antenna 500F ( Figure 5A and 5B ) is that the antenna 500G includes three conductive features 250G-1, 250G-2 and 250A-3, which are embedded in the antenna substrate 200A and close to three corresponding edges 210E1, 210E2 and 210E3 of the antenna layer 210. Similar to Figure 1A and 1BAs shown, conductive features 250A-1 and 250A-2, conductive features 250G-1, 250G-2 may include a single-wall structure that extends continuously and parallel to corresponding edges 210E1, 210E2 of antenna layer 210. In some embodiments, conductive features 250G-1, 250G-2, and 250A-3 may have the same or similar structure (e.g., single-wall structure), shape, width (e.g., width W1), and position relative to antenna layer 210 and antenna substrate 200A. In some embodiments, conductive feature 250A-3 has a length L1, while conductive features 250G-1, 250G-2 have a length L4 that is different from length L1. For example, length L4 is shorter than length L1. In some embodiments, conductive feature 250A-3 has a height H1, while conductive features 250G-1, 250G-2 have a height H4 that is different from height H1. For example, height H4 is greater than height H1. In some embodiments, conductive features 250G-1, 250G-2 may have different lengths, widths, and / or heights. Antenna 500G including conductive features 250G-1, 250G-2, and 250A-3 may increase parallel capacitance and provide increased design flexibility.

[0093] Fig. 8A is a top view of an antenna 500H according to some embodiments of the present invention. Figure 8B According to some embodiments of the present invention, along Fig. 8A The cross-sectional view of the antenna 500H taken along the line CC' is shown to show the arrangement of the embedded conductive features of the antenna 500H. The components of the embodiments described hereinafter are similar to those previously described with reference to Figure 1A , 1B For the sake of brevity, the same or similar elements described in 4A and 4B are not repeated. Fig. 8A and 8B As shown, antenna 500H and antenna 500D ( Figure 4A and 4B ) is that the antenna 500H includes three conductive features 250H-1, 250H-2, and 250H-3 composed of discrete wall structures. The conductive features 250H-1, 250H-2, and 250H-3 are embedded in the antenna substrate 200A and are close to three corresponding edges 210E1, 210E2, and 210E3 of the antenna layer 210. In some embodiments, the conductive features 250H-1, 250H-2, and 250H-3 are formed inside the antenna substrate 200A and are not exposed from the corresponding sides 200A-S1, 200A-S2, and 200A-S3 of the antenna substrate 200A. In some embodiments, the conductive features 250H-1, 250H-2, and 250H-3 are exposed from the corresponding sides 200A-S1, 200A-S2, and 200A-S3 of the antenna substrate 200A.

[0094] In some embodiments, conductive features 250H-1, 250H-2, and 250H-3 include discrete wall structures arranged side by side and proximate to corresponding edges 210E1, 210E2, and 210E3 of antenna layer 210. For example, conductive feature 250H-1 includes discrete wall structures DW-1A arranged side by side and proximate to corresponding edge 210E1 of antenna layer 210. Conductive feature 250H-2 includes discrete wall structures DW-2A arranged side by side and proximate to corresponding edge 210E2 of antenna layer 210. Conductive feature 250H-3 includes discrete wall structures DW-3A arranged side by side and proximate to corresponding edge 210E3 of antenna layer 210.

[0095] In some embodiments, the discrete wall structures of each conductive feature 250H-1, 250H-2, and 250H-3 are separated from each other and arranged in a row (or arranged in a 1×m array, where m is an integer greater than or equal to one) along the corresponding edge 210E of the antenna layer 210. For example, the discrete wall structures DW-1A of the conductive feature 250H-1 are separated from each other and arranged in a row (or arranged in a 1×m array, where m is an integer greater than or equal to one) along the corresponding edge 210E1 of the antenna layer 210. The discrete wall structures DW-2A of the conductive feature 250H-2 are separated from each other and arranged in a row (or arranged in a 1×m array, where m is an integer greater than or equal to one) along the corresponding edge 210E2 of the antenna layer 210. The discrete wall structures DW- 3A of the conductive features 250H- 3 are separated from each other and arranged in a row (or in a 1×m array, where m is an integer greater than or equal to one) along the corresponding edge 210E3 of the antenna layer 210 .

[0096] In some embodiments, the discrete wall structures DW-1A, DW-2A, DW-3A may have a many-to-one relationship with the corresponding edges 210E1, 210E2, 210E3 of the antenna layer 210. In some embodiments, the discrete wall structures DW-1A, DW-2A, DW-3A may have the same length L5, width W5, and height H5. The length L5 may be shorter than the length L1 ( Figure 1A and Figure 1B The width W5 may be the same as or different from the width W1 of the conductive feature 250A- 1 ( Figure 1A and Figure 1B In addition, the height H5 can be the same as or different from the width H1 of the conductive feature 250A- 1 ( Figure 1A and Figure 1B). In some embodiments, the conductive features 250H-1, 250H-2, and 250H-3 may have the same or similar structures (e.g., discrete wall structures), geometric dimensions (e.g., shapes, lengths L5, widths W5, and heights H5 of the discrete wall structures DW-1A, DW-2A, DW-3A), and positions relative to the antenna layer 210 and the antenna substrate 200A. In some embodiments, the discrete wall structures DW-1A, DW-2A, DW-3A may have different lengths, widths, and / or heights. The inclusion of the conductive features 250H-1, 250H-2, and 250H-3 in the antenna 500H may increase parallel capacitance and provide increased design flexibility.

[0097] Fig.9A is a top view of an antenna 500I according to some embodiments of the present invention. Fig. 9B According to some embodiments of the present invention, along Fig.9A A cross-sectional view taken along line CC' of antenna 500I shown in FIG. 5 shows the arrangement of embedded conductive features of antenna 500I. For simplicity, the following embodiments are similar to those previously described in reference 5. Figure 1A , Figure 1B , Figure 4A , Figure 4B , Fig. 8A and Figure 8B The same or similar elements described are not repeated. Fig.9A and Fig. 9B As shown, antenna 500I and antenna 500H ( Fig. 8A and Figure 8B ) is that antenna 500I includes three conductive features 250I-1, 250I-2 and 250I-3, ​​which are composed of discrete wall structures with different heights along direction 120. Fig.9A and Fig. 9B As shown, the conductive features 250I- 1 , 250I- 2 , and 250I- 3 of the antenna 500I are embedded in the antenna substrate 200A and are proximate to three corresponding edges 210E1 , 210E2 , and 210E3 of the antenna layer 210 .

[0098] In some embodiments, conductive features 250I-1, 250I-2, and 250I-3 include discrete wall structures arranged side by side and proximate to corresponding edges 210E1, 210E2, and 210E3 of antenna layer 210. For example, conductive feature 250I-1 includes discrete wall structures DW-1A and DW-1B of antenna layer 210 arranged side by side and proximate to corresponding edge 210E1. Conductive feature 250I-2 includes discrete wall structures DW-2A and DW-2B of antenna layer 210 arranged side by side and proximate to corresponding edge 210E2. Conductive feature 250I-3 includes discrete wall structures DW-3A and DW-3B of antenna layer 210 arranged side by side and proximate to corresponding edge 210E3.

[0099] In some embodiments, the discrete wall structures of each conductive feature 250I-1, 250I-2, and 250I-3 are separated from each other and arranged in a row (or in a 1×m array, where m is an integer greater than or equal to one) along the corresponding edge 210E of the antenna layer 210.

[0100] In some embodiments, the discrete wall structures DW-1A and DW-1B, DW-2A and DW-2B, DW-3A and DW-3B may have a many-to-one relationship with the corresponding edges 210E1, 210E2, 210E3 of the antenna layer 210. In some embodiments, the discrete wall structures DW-1A, DW-1B, DW-2A, DW-2B, DW-3A and DW-3B may have the same length L5 and width W5. In some embodiments, the discrete wall structures DW-1B, DW-1B and DW-3B may have a height H6 that is different from the height H5 of the discrete wall structures DW-1A, DW-1A and DW-3A. For example, the height H6 may be greater than the height H5. In some embodiments, the conductive features 250I-1, 250I-2, and 250I-3 can have the same or similar structures (e.g., discrete wall structures), geometric dimensions (e.g., shapes, lengths L5, widths W5, and heights H5, H6 of the discrete wall structures DW-1A, DW-1B, DW-2A, DW-2B, DW-3A, and DW-3B), and positions relative to the antenna layer 210 and the antenna substrate 200A. In some embodiments, the discrete wall structures DW-1A, DW-1B, DW-2A, DW-2B, DW-3A, and DW-3B can have different lengths and / or widths. The inclusion of the conductive features 250I-1, 250I-2, and 250I-3 in the antenna 500I can increase parallel capacitance and provide increased design flexibility.

[0101] In some embodiments, the conductive features may have various shapes with the same or different heights in a cross-sectional view to increase shunt capacitance and provide increased design flexibility.

[0102] Fig. 10A is a top view of an antenna 500K according to some embodiments of the present invention. Fig. 10B According to some embodiments of the present invention, along Fig. 10A The cross-sectional view of the antenna 500K taken along the line CC' is shown to show the arrangement of the embedded conductive features of the antenna 500K. The components of the embodiments described hereinafter are similar to those previously described with reference to Figure 1A , 1B For the sake of brevity, the same or similar elements described in FIG. 4A, FIG. 4B, FIG. 6A and FIG. 6B are not repeated. Fig. 10A and Fig. 10B As shown, antenna 500K and antenna 500F ( Fig. 6A and Figure 6B ) is that the antenna 500K includes three L-shaped (or reversed L-shape) conductive features 250K-1, 250K-2 and 250K-3. The conductive features 250K-1, 250K-2 and 250K-3 are embedded in the antenna substrate 200A and are close to three corresponding edges 210E1, 210E2 and 210E3 of the antenna layer 210. In some embodiments of the present invention, in a cross-sectional view, the conductive features may have an outer contour shape such as a strip shape, an L shape, an inverted L shape, a reversed L shape or a reverse inverted L shape. Of course, the conductive features may also have other shapes, such as a cone, a triangle, other polygons, etc. The strip may be an elongated strip, the L shape may be the shape of the normally written letter L, the inverted L shape may be the mirror image of the normally written letter L shape along the horizontal line, the reverse L shape may be the mirror image of the normally written letter L shape along the vertical line, and the reversed L shape may be the mirror image of the normally written letter L shape along the vertical line and then along the horizontal line.

[0103] In such Fig. 10AIn the cross-sectional view shown, the conductive features 250K-1, 250K-2, and 250K-3 are L-shaped (or inverted L-shaped). The conductive features 250K-1, 250K-2, and 250K-3 have vertical portions (or first portions) 250K-1V, 250K-2V, and 250K-3V and lateral portions 250K-1L, 250K-2L, and 250K-3L connected to the vertical portions (or first portions) 250K-1V, 250K-2V, and 250K-3V. The lateral portions 250K-1L, 250K-2L, and 250K-3L may also be referred to as second portions. The vertical portions (or first portions) 250K-1V, 250K-2V, and 250K-3V may be close to the top surface 200A-T of the antenna substrate 200 and extend along the direction 120. The lateral portions 250K-1L, 250K-2L, and 250K-3L may be close to the bottom surface 200A-B of the antenna substrate 200 and extend toward the central portion of the antenna substrate 200A. Alternatively, the vertical portions (or first portions) 250K-1V, 250K-2V, and 250K-3V are located between the antenna layer 210 and the lateral portions 250K-1L, 250K-2L, and 250K-3L, and the extension direction of the lateral portions 250K-1L, 250K-2L, and 250K-3L may be different from that of the vertical portions (or first portions) 250K-1V, 250K-2V, and 250K-3V. In some embodiments, the lateral portions 250K-1L, 250K-2L, and 250K-3L may be substantially parallel to the antenna layer 210.

[0104] In some embodiments, both conductive features 250K-1 and 250K-2 have a length L7, while conductive feature 250K-3 has a length L7' that is different from length L7. For example, length L7 is shorter than length L7'. In some embodiments, conductive features 250K-1, 250K-2, and 250K-3 have the same height H7, which is less than the thickness T1 of antenna substrate 200A. Transverse portions 250K-1L, 250K-2L, and 250K-3L have the same width W7 (also as the maximum width of conductive features 250K-1, 250K-2, and 250K-3). In some embodiments, conductive features 250K-1, 250K-2, and 250K-3 may have different lengths, widths, and / or heights. In some embodiments, width W7 is less than or equal to 0.1λg, where λg is the guided wavelength of a 50Ω microstrip at the center frequency. Antenna 500K includes conductive features 250K-1, 250K-2, and 250K-3 to increase parallel capacitance and provide increased design flexibility.

[0105] Fig.11A is a top view of an antenna 500L according to some embodiments of the present invention. Fig. 11BAccording to some embodiments of the present invention, along Fig.11A The cross-sectional view of the antenna 500L taken along the line CC' is shown to show the arrangement of the embedded conductive features of the antenna 500L. The components of the embodiments described hereinafter are similar to those previously described with reference to Figure 1A , 1B For the sake of brevity, the same or similar elements described in FIG. 4A, FIG. 4B, FIG. 6A, FIG. 6B, FIG. 10A and FIG. 10B are not repeated. Fig.11A and Fig. 11B As shown, antenna 500L and antenna 500K ( Fig. 10A and Fig. 10B ) is that antenna 500L includes three conductive features 250L-1, 250L-2 and 250L-3 having different heights.

[0106] In such Fig.11A In the cross-sectional view shown, the first conductive feature is L-shaped (or inverted L-shaped). Similar to conductive feature 250K-3, conductive features 250L-1, 250L-2 have vertical portions 250L-1V, 250L-2V and lateral portions 250L-1L, 250L-2L connected to vertical portions 250L-1V, 250L-2V. Vertical portions 250L-1V, 250L-2V can be close to the top surface 200A-T of antenna substrate 200 and extend along direction 120. Lateral portions 250L-1V, 250L-2V can be close to the bottom surface 200A-B of antenna substrate 200 and extend toward the central portion of antenna substrate 200A. In addition, lateral portions 250L-1V, 250L-2V can be substantially parallel to antenna layer 210.

[0107] In some embodiments, both conductive features 250L-1 and 250L-2 have a length L8, while conductive feature 250K-3 has a length L7' that is different from length L8. For example, length L8 is shorter than length L7'. In some embodiments, lateral portions 250L-1V and 250L-2V have the same width W8 (also serving as the maximum width W8 of conductive features 250L-1 and 250L-2). In some embodiments, conductive features 250L-1 and 250L-2 may have different lengths, widths, and / or heights. In some embodiments, for example, width W8 is less than or equal to 0.1λg, where λg is the guided wavelength of a 50Ω microstrip at the center frequency. In some embodiments, the maximum width W8 of conductive features 250L-1 and 250L-2 may be the same as or different from the maximum width W7 of conductive feature 250K-3.

[0108] In some embodiments, the conductive features 250L-1 and 250L-2 have the same height H8, which is less than the thickness T1 of the antenna substrate 200A. In addition, the height H8 of the conductive features 250L-1 and 250L-2 can be different from the height H7 of the conductive feature 250K-3. For example, the height H8 is greater than the height H7. That is, the conductive features 250L-1 and 250L-2 are closer to the ground layer 220A than the conductive feature 250K-3. Therefore, the parallel capacitance of the antenna 500L can be further increased. The antenna 500K including the conductive features 250L-1, 250L-2 and 250K-3 can also provide increased design flexibility.

[0109] It is worthwhile to appreciate that while some features are shown in some embodiments but not in other embodiments, these features may (or may not) be present in other embodiments, where possible. Fig. 10A , 10B , 11A and 11B show specific geometries of conductive features 250K-1, 250K-2, 250K-3, 250L-1 and 250L-2 of antennas 500K and 500L, but any other combination of conductive feature geometries may also be used where applicable. In addition, the geometries of conductive features 250K-1, 250K-2, 250K-3, 250L-1 and 250L-2 of antennas 500K and 500L may be implemented in conductive features of antennas 500A to 500I where applicable.

[0110] In some embodiments, the conductive features include an integrated wall structure or a composite wall structure formed by a printed circuit board (PCB) manufacturing process. Therefore, the antenna and the conductive features can be manufactured in the same manufacturing process. Therefore, the manufacturing cost can be reduced. For example, the conductive features can be formed in the same step as the antenna layer 210, so no additional manufacturing steps are required to form the conductive features, which saves manufacturing steps, thereby reducing manufacturing costs and complexity, and is conducive to large-scale production.

[0111] Fig.12 According to some embodiments of the present invention Figure 1A and 1B FIG. 5 is a side view of an antenna 500A, showing a detailed structure of an embedded conductive feature 250A-1 (or conductive feature 250A-2) of the antenna 500A. For the sake of brevity, the following embodiments are similar to those previously described with reference to FIG. Figure 1A and 1B The same or similar elements described are not repeated. Fig.12As shown, the conductive feature 250A-1 (or the conductive feature 250A-2) can be an integrated wall structure, such as a metal slug (a single piece of metal). In some embodiments, the integrated wall structure is formed by a metal slug technology of a low temperature co-fired ceramic (LTCC) printed circuit board (PCB) manufacturing process or other applicable processes.

[0112] Fig.13 According to some embodiments of the present invention Figure 1A and 1B Another side view of the antenna 500A is shown, showing another detailed structure of the embedded conductive feature 250A-1 (or conductive feature 250A-2) of the antenna 500A. For the sake of simplicity, the following embodiments are different from those previously described with reference to Figure 1A and 1B The same or similar elements described are not repeated. Fig.13 As shown, the conductive feature 250A-1 (or the conductive feature 250A-2) can be a composite wall structure, including a through hole 252 and one or more conductive lines 254. The through hole 252 is set on the ground layer 210 and passes through one or more dielectric layers. In addition, the through holes 252 can be arranged in a row through the same dielectric layer and correspond to the edge 210E1 (or edge 210E2) of the antenna layer 210. The through holes 252 can be arranged in multiple rows, passing through different dielectric layers, and corresponding to the edge 210E1 (or edge 210E2) of the antenna layer 210. The conductive line 254 is formed between the dielectric layers and extends along the corresponding edge 210E1 (or edge 210E2). In addition, the conductive line 254 covers and is electrically connected to the through holes 252 in the adjacent row. In some embodiments, the composite wall structure is formed by a buried hole technology or other applicable processes in the printed circuit board (PCB) manufacturing process.

[0113] like Fig.12 and 13 As shown, the antenna 500A and the conductive feature 250A-1 (or the conductive feature 250A-2) in the embodiment of the present invention can be manufactured during the printed circuit board (PCB) manufacturing process. The conductive feature 250A-1 (or the conductive feature 250A-2) can be formed after the antenna 500A is manufactured without an additional electroplating process. Therefore, the manufacturing cost can be reduced.

[0114] It should be understood that although some features are shown in some embodiments but not in other embodiments, these features may (or may not) be present in other embodiments whenever possible. Fig.12 and 13 The exemplary embodiment shows a specific structure of the conductive feature 250A-1 (or conductive feature 250A-2) of the antenna 500A, but any other combination of conductive feature structures may also be used when applicable. In addition, Fig.12 and 13 The structure of the conductive feature 250A- 1 (or conductive feature 250A- 2 ) of the illustrated antenna 500A may be implemented in the conductive features of antennas 500B to 5001, 500K, and 500L, where applicable.

[0115] In some embodiments, the conductive features may be disposed separately from the antenna layer (eg, separated and not in contact with each other). The conductive features and the antenna layer may be electrically coupled to each other to increase parallel capacitance and provide increased design flexibility.

[0116] Fig.14A is a top view of an antenna 500M according to some embodiments of the present invention. Fig. 14B It is along Fig.14A A cross-sectional view taken along line AA' of antenna 500M shown in FIG. 1 shows the arrangement of embedded conductive features of antenna 500M according to some embodiments of the present invention. The elements of the embodiments hereafter are similar to those previously described with reference to FIG. Figure 1A and 1B For the sake of brevity, the same or similar elements described above will not be repeated. Fig.14A and 14B As shown, antenna 500L and antenna 500A ( Figure 1A and 1B ) is that the antenna 500M includes two conductive features 250M-1 and 250M-2, which are separated from and electrically coupled to the antenna layer 210. In addition, the conductive features 250M-1 and 250M-2 can be electrically floating to further increase the parallel capacitance of the antenna and improve communication performance. The conductive features 250M-1 and 250M-2 are embedded in the antenna substrate 200A and are close to three corresponding edges 210E1 and 210E2 of the antenna layer 210. In some embodiments, the conductive features 250M-1 and 250M-2 are formed inside the antenna substrate 200A and are not exposed from the corresponding sides 200A-S1 and 200A-S2 of the antenna substrate 200A. In some embodiments, the conductive features 250M-1 and 250M-2 are exposed from the corresponding sides 200A-S1 and 200A-S2 of the antenna substrate 200A.

[0117] like Fig. 14BAs shown in the cross-sectional view in FIG. 1 , the conductive features 250M-1 and 250M-2 are inverted L-shaped (or reverse inverted L-shaped). The conductive features 250M-1 and 250M-2 have vertical portions (or first portions) 250M-1V and 250M-2V, and lateral portions (or second portions) 250M-1L and 250M-2L connected to the vertical portions (or first portions) 250M-1V and 250M-2V. Compared to the lateral portions 250M-1L and 250M-2L, the vertical portions (or first portions) 250M-1V and 250M-2V can be closer to the bottom surface 200A-B of the antenna substrate 200 and extend toward the ground layer 220A along the direction 120. Compared to the vertical portions 250M-1V and 250M-2V, the lateral portions 250M-1L and 250M-2L may be closer to the top surface 200A-T of the antenna substrate 200 and extend toward the central portion of the antenna substrate 200A. Alternatively, the lateral portions (or second portions) 250M-1L and 250M-2L may be located between the vertical portions (or first portions) 250M-1V and 250M-2V and the antenna layer 210, and the extending direction of the lateral portions 250M-1L and 250M-2L may be different from that of the vertical portions (or first portions) 250M-1V and 250M-2V. In addition, the lateral portions 250M-1L and 250M-2L (the extending direction) may be substantially parallel to the antenna layer 210.

[0118] In some embodiments, Fig.14A and 14B In the illustrated embodiment, at least one of the conductive features 250M-1 and 250M-2 may have only a vertical portion (or a first portion) without a lateral portion (or a second portion). For example, the conductive feature 250M-1 may have only a vertical portion (or a first portion) 250M-1V without a lateral portion (or a second portion) 250M-1L. This allows for more convenient manufacturing of the conductive features. In some embodiments, the conductive features having a vertical portion (or a first portion) and a lateral portion (or a second portion) may increase the coupling area and efficiency between the conductive features and the antenna layer 210, thereby further improving the performance of the antenna.

[0119] In some embodiments, conductive features 250M-1 and 250M-2 have the same length L9, which is less than length L2. In some embodiments, conductive features 250M-1 and 250M-2 have the same height H9, which is less than thickness T1 of antenna substrate 200A. Transverse portions 250M-1L and 250M-2L have the same width W9 (also as the maximum width of conductive features 250M-1 and 250M-2). In some embodiments, conductive features 250M-1 and 250M-2 can have different lengths, widths, and / or heights. In some embodiments, width W9 is less than or equal to 0.1λg, where λg is the guided wavelength of a 50Ω microstrip at the center frequency.

[0120] like Fig. 14B As shown, conductive features 250M-1 and 250M-2 are separated from antenna layer 210 by distance S1, which is generally along direction 120. In some embodiments, distance S1 is less than height H9. Antenna 500M including conductive features 250M-1 and 250M-2 can increase parallel capacitance and provide increased design flexibility.

[0121] In some embodiments, an angle θ1 between an extension line of an edge of a vertical portion (or first portion) 250M-1V of a conductive feature 250M-1 (or an extension line of an edge of a vertical portion 250M-2V of a conductive feature 250M-2) and a top surface 200A-T of the antenna substrate 200A is greater than 0 degrees and less than 180 degrees. For example, in some embodiments, Fig. 14B As shown, the angle θ1 between the extension line 250M-1VE of the edge 250M-1E1 of the vertical portion (or first portion) 250M-1V and the top surface 200A-T of the antenna substrate 200A can be a right angle (i.e., the angle θ1 is equal to 90 degrees), an obtuse angle (i.e., the angle θ1 is greater than 90 degrees and less than 180 degrees), or an acute angle (i.e., the angle θ1 is greater than 0 degrees and less than 90 degrees).

[0122] It is appreciated that while some features are shown in some embodiments but not in other embodiments, these features may (or may not) be present in other embodiments whenever possible. Fig.14A and 14B The exemplary embodiment of FIG. 5 shows a specific geometry of conductive features 250M-1 and 250M-2 of antenna 500M, but any other combination of conductive feature geometries may be used where applicable. In addition, the geometries of conductive features 250M-1 and 250M-2 of antenna 500M may be implemented in conductive features of antennas 500A to 500I wherever applicable.

[0123] In some embodiments, the ground layer of the antenna may have a protruding portion that extends toward the conductive feature to further increase shunt capacitance and provide increased design flexibility.

[0124] Fig.15 According to some embodiments of the present invention Figure 1A and 1B Another cross-sectional view taken along line AA' of antenna 500A in FIG. 5 shows the arrangement of embedded conductive features 250A and ground plane 220C of antenna 500A. In some embodiments, as shown in FIG. Figure 1A and 15 As shown, antenna 500A includes antenna substrate 200A, antenna layer 210, ground layer 220C, and conductive features 250A-1 and 250A-2.

[0125] exist Fig.15 In the cross-sectional view shown, the ground layer 220C can be U-shaped. The ground layer 220C can have a lateral portion 220CL and protrusions 220CV-1, 200CV-2 connected to opposite ends of the lateral portion 220CL. In some embodiments, the lateral portion 220CL of the ground layer 220C is disposed on the bottom surface 200A-B of the antenna substrate 200A. The protrusions 220CV-1, 200CV-2 of the ground layer 220C can extend into a portion of the antenna substrate 200A along the direction 120. In addition, the protrusions 220CV-1, 200CV-2 of the ground layer 220C can extend toward the conductive features 250A-1 and 250A-2. In some embodiments, the ground layer 220C can be a flat structure, and the protrusions 220CV-1, 200CV-2 can protrude from the flat ground layer 220C at positions corresponding to the conductive features.

[0126] In some embodiments, the protruding portions 220CV-1, 200CV-2 of the ground layer 220C may be embedded in the antenna substrate 200A and close to the three corresponding edges 210E1 and 210E2 of the antenna layer 210. In some embodiments, the protruding portions 220CV-1, 200CV-2 of the ground layer 220C may be formed inside the antenna substrate 200A and not exposed from the corresponding side surfaces 200A-S1 and 200A-S2 of the antenna substrate 200A. In some embodiments, the protruding portions 220CV-1, 200CV-2 of the ground layer 220C may be exposed from the corresponding side surfaces 200A-S1 and 200A-S2 of the antenna substrate 200A.

[0127] In some embodiments, conductive features 250A-1 and 250A-2 may completely overlap protruding portions 220CV-1, 220CV-2 in direction 120. The length (not shown) of protruding portions 220CV-1, 220CV-2 may be equal to Figure 1A The length L1 corresponding to conductive features 250A- 1 and 250A- 2 in the top view is shown.

[0128] In some embodiments, the protrusions 220CV-1, 220CV-2 of the ground layer 220C have the same height H10. The sum of the height H1 of the conductive feature 250A-1 (or the conductive feature 250A-2) and the height H10 of the corresponding protrusion 220CV-1 (or the protrusion 220CV-2) may be less than the thickness T1 of the antenna substrate 200A. If the sum of the height H1 and the height H10 is equal to the thickness T1 of the antenna substrate 200A, the conductive feature 250A may contact the ground layer 220C and affect the performance of the antenna 500A.

[0129] The protruding portions 220CV-1 and 220CV-2 of the ground layer 220C may have the same width W10. In some embodiments, the width W10 is less than or equal to 0.1λg, where λg is the guided wavelength of the 50Ω microstrip at the center frequency.

[0130] It should be noted that although some features are shown in some embodiments but not in other embodiments, these features may (or may not) be present in other embodiments. Fig.15 The exemplary embodiment shows a specific structure of the ground layer 220C of the antenna 500A, but any other combination of conductive features of the structure may also be used when applicable. Fig.15 The ground layer 220C of the antenna 500A shown in FIG. 5 may be implemented in the ground layers of the antennas 500B to 500I, and 500K to 500M, when applicable.

[0131] Fig.16A FIG. 6 is a cross-sectional view of an antenna package 600 according to some embodiments of the present invention, including an antenna 550A. For the sake of brevity, the following embodiments are similar to those previously described with reference to FIG. Figure 1A , 1B The same or similar elements described in FIGS. 1 to 15 are not described again. In some embodiments, the antenna package 600A includes an antenna 550A, a first substrate 201, and a semiconductor die 340. In some embodiments, the antenna 550A of the antenna package 600A can be composed of any of the antennas 500A, 500B, 500C, 500D, 500E, 500F, 500G, 500H, 500I, 500K, 500L, and 500M. Fig.16AIn some embodiments shown, antenna 550A may be provided by Figure 1A and 1B The antenna 500A shown is composed of: a first substrate 201 is mounted on the ground layer 220A of the antenna 550A (or the antenna 500A). In addition, a semiconductor die 340 is mounted on the first substrate 201.

[0132] In antenna 550A, antenna layer 210 is disposed on top surface 200A-T of antenna substrate 200A. Ground layer 220A is disposed on bottom surface 200A-B of antenna substrate 200A. Ground layer 220A is located between antenna substrate 200A and first substrate 201, and first substrate 201 is located between ground layer 220A and electronic module 350 (and input / output (I / O) connector 352). Conductive features 250A-1 and 250A-2 are embedded in antenna substrate 200A and are close to corresponding edges 210E1 and 210E2 of antenna layer 210. Conductive features 250A-1 and 250A-2 and ground layer 220A are separated by a portion of antenna substrate 200A. Each of conductive features 250A-1 and 250A-2 includes a first portion. In some embodiments, conductive features 250A-1 and 250A-2 may have only a first portion. An angle θ between the conductive feature 250A- 1 (ie, the conductive feature 250A- 1 or 250A- 2 ) and the top surface 200A-T of the antenna substrate 200A is greater than 0 degrees and less than 180 degrees.

[0133] like Fig.16A As shown, the first substrate 201 is mounted on the ground layer 220A and is opposite to the antenna substrate 200A. In some embodiments, the antenna substrate 200A is integrated with the first substrate 201, and the ground layer 220A is formed between the antenna substrate 200A and the first substrate 201. In some embodiments, the antenna substrate 200A and the first substrate 201 can have the same or similar materials, structures, and processes.

[0134] In some embodiments, the antenna package 600A further includes an electronic module 350 , a connection line 346 , a circuit wiring 347 of the first substrate 201 , and an input / output (I / O) connector 352 .

[0135] The electronic module 350 is mounted on the first substrate 201 and is opposite to the ground layer 220A. In some embodiments, the electronic module 350 includes a semiconductor die 340, a molding compound 344, and at least one conductive bump structure 345. The semiconductor die 340 is electrically connected to the antenna layer 210 via a connecting wire 346. In some embodiments, the connecting wire 346 is formed by circuit wiring of the antenna substrate 200A and the first substrate 201. In some embodiments, the connecting wire 346 is formed by passing through the antenna substrate 200A, the through hole 221 of the ground layer 220A, and the first substrate 201. In addition, the through hole 221 is filled with a dielectric material that is the same as or similar to the dielectric material 223 of the antenna substrate 200A and the first substrate 201. Therefore, a portion of the connecting wire 346 passing through the through hole 221 can be separated from the ground layer 220A by the dielectric material 223. Fig.16A As shown, the semiconductor die 340 is electrically connected to the connection line 346 through the conductive bump structure 345. In some embodiments, the semiconductor die 340 is, for example, a radio frequency (RF) die.

[0136] A molding compound 344 is formed on a portion of the first substrate 201 and opposite to the ground layer 220A. The molding compound 344 covers and encapsulates the semiconductor die 340, but does not cover the I / O connector 352. In some embodiments, the molding compound 344 is made of a material such as a Novolac-based resin, an epoxy-based resin, a silicon-based resin, or other suitable encapsulant. The molding compound 344 may contain a suitable filler, such as powdered SiO2. The molding compound 344 may be applied using any of a variety of molding techniques, such as compression molding, injection molding, or transfer molding.

[0137] The I / O connector 352 is mounted on the first substrate 201 and is opposite to the ground layer 220A. In addition, the I / O connector 352 is located next to the electronic module 350. In addition, the I / O connector 352 can be electrically connected to the electronic module 350 through the circuit wiring 347. In some embodiments, the connection line 346 and the circuit wiring 347 are connected to different conductive bump structures 345. In addition, the I / O connector 352 can be electrically connected to a modem (not shown) through a flexible connector (e.g., flexible printed circuits, FPCs) (not shown).

[0138] Fig. 16B FIG. 6 is a cross-sectional view of an antenna package 600B according to some embodiments of the present invention, including an antenna 550B. For the sake of brevity, the same or similar elements as those previously described with reference to FIGS. 1A, 1B to 16A will not be described again in the following embodiments. Fig. 16BAs shown, the difference between antenna package 600B and antenna package 600A is that antenna package 600B includes four antenna layers 210 and corresponding connecting wires 346. Please note that the number of antenna layers 210 is not limited to the disclosed embodiments. Antenna package 600B includes antenna 550B, first substrate 201 and semiconductor die 340. In some embodiments, antenna 550B of antenna package 600B may include antenna substrate 200B, antenna layer 210, ground layer 220B and conductive feature 250. First substrate 201 is mounted on ground layer 220B of antenna 550B. In addition, semiconductor die 340 is mounted on first substrate 201.

[0139] In antenna 550B, antenna layers 210 are disposed on and partially cover an upper surface 200B-T of an antenna substrate 200B. In addition, antenna layers 210 are separated from each other. Ground layer 220B is disposed on and completely covers a lower surface 200B-B of antenna substrate 200B. Conductive features 250 are embedded in antenna substrate 200B and near respective edges of respective antenna layers 210. The conductive feature 250 can be composed of the conductive features 250A, 250A-1, 250A-2, 250A-3, 250A-3, 250F-1, 250F-2, 250G-1, 250G-2, 250H-1, 250H-2, 250H-3, 250I-1, 250I-2, 250I-3, ​​250K-1, 250K-2, 250K-3, 250L-1, 250L-2, 250M-1, 250M-2 shown in any of the previous figures.

[0140] The semiconductor die 340 is electrically connected to different antenna layers 210 through different connection lines 346. In some embodiments, the connection lines 346 are formed through the antenna substrate 200A, the ground layer 220A of the corresponding through hole 221, and the first substrate 201. In addition, each through hole 221 is filled with a dielectric material that is the same as or similar to the dielectric material 223 of the antenna substrate 200A and the first substrate 201. Therefore, the portion of the connection line 346 passing through the corresponding through hole 221 can be separated from the ground layer 220A by the dielectric material 223. In some embodiments, different connection lines 346 are connected to different conductive bump structures 345. In some other embodiments (e.g., radar applications), different connection lines 346 are connected to the same conductive bump structure 345.

[0141] In some embodiments, the connection wires 346 and the circuit wirings 347 are connected to different conductive bump structures 345 to meet different design requirements.

[0142] Fig.17A is a top view of antenna 500N showing the arrangement of antenna layer 210A according to some embodiments of the present invention. Fig. 17BAccording to some embodiments of the present invention, Fig.17A A cross-sectional view taken along line EE' of antenna 500N is shown. Fig. 17C According to some embodiments of the present invention, Fig.17A The cross-sectional view of the antenna 500N is taken along the line F-F' shown in FIG. Figure 1A , 1B The same or similar elements described in FIGS. 16A and 16B will not be described again.

[0143] like Figures 17A-17C As shown, the antenna 500N includes an antenna layer 210A, an antenna substrate 200A, a ground layer 220A, and a conductive feature 250. In some embodiments, the antenna layer 210A is composed of four petal-like portions 210A-1, 210A-2, 210A-3, and 210A-4 separated from each other. In addition, the petal-like portions 210A-1, 210A-2, 210A-3, and 210A-4 can function together as a plurality of dipoles. It is worth noting that the antenna layer 210A can have various top view shapes, such as circular or rectangular, and is not limited to the disclosed embodiments.

[0144] In some embodiments, the conductive features 250 are arranged close to the outer edges OE1, OE2, OE3 and OE4 of the corresponding petal-shaped portions 210A-1, 210A-2, 210A-3 and 210A-4. It is worth noting that the conductive features 250 are not allowed to be arranged close to the inner edges IE1, IE2, IE3 and IE4 of the corresponding petal-shaped portions 210A-1, 210A-2, 210A-3 and 210A-4. In some embodiments, the conductive feature 250 can be composed of any combination of conductive features 250A, 250A-1, 250A-2, 250A-3, 250A-3, 250F-1, 250F-2, 250G-1, 250G-2, 250H-1, 250H-2, 250H-3, 250I-1, 250I-2, 250I-3, ​​250K-1, 250K-2, 250K-3, 250L-1, 250L-2, 250M-1, 250M-2, as shown in the previous figures.

[0145] In some embodiments, the conductive features 250 near the outer edges OE1 , OE2 , OE3 , OE4 may have the same or different structures (eg, single-walled structures or discrete-walled structures), geometric dimensions (eg, shape, length, width, or height).

[0146] In some embodiments, Fig.17A and 17BAs shown, the conductive features 250 near the outer edges OE1 and OE2 can be formed by discrete wall structures with different heights in the direction 120. For example, the conductive features 250 near the outer edge OE1 include discrete wall structures DW-1 arranged side by side. In addition, the conductive features 250 near the outer edge OE2 include discrete wall structures DW-2 arranged side by side. In some embodiments, the discrete wall structure DW-1 can have a height H10, and the discrete wall structure DW-2 can have a height H11 in the direction 120 and be less than the thickness T1 of the antenna substrate 200A. In some embodiments, the height H10 of the discrete wall structure DW-1 is different from the height H11 of the discrete wall structure DW-2. For example, the height H11 can be greater than the height H10. In some embodiments, the discrete wall structure DW-1 of the antenna layer 210A corresponding to the same petal-shaped portion 210A-1 can have different heights in the direction 120. Likewise, the discrete wall structures DW- 2 of the antenna layer 210A corresponding to the same petaloid portion 210A- 2 may have different heights in the direction 120 .

[0147] In some embodiments, Fig.17A and 17C As shown, the conductive features 250 near the outer edges OE3 and OE4 are single-wall structures that extend continuously along the corresponding outer edges OE3 and OE4. The conductive features 250 near the outer edges OE3 and OE4 can have different cross-sectional shapes. For example, Fig. 17C As shown, the conductive feature 250 near the outer edge OE3 is a reversed L-shape, having a vertical portion (or a first portion) and a lateral portion (or a second portion) connected to the vertical portion. In addition, the conductive feature 250 near the outer edge OE4 is an I-shape, having only the vertical portion (or the first portion). In some embodiments, the conductive features 250 near the outer edges OE3 and OE4 can have the same height H12 in the direction 120 and be less than the thickness T1 of the antenna substrate 200A. In some embodiments, the conductive features 250 near the outer edges OE3 and OE4 can have different heights in the direction 120.

[0148] Fig.18 1 is a graph showing a comparison between a conventional antenna (e.g., a conventional 5G millimeter wave (mmWave) antenna-in-package (AiP)) and an antenna in some embodiments of the present invention at operating frequency (Freq. (GHz)) versus return loss (RL (dB)). Fig.18In the figure, curve 1801 shows the operating frequency versus return loss of a conventional antenna, wherein the (size or area) of the ground layer is comparable to the (size or area) of the antenna layer. Curve 1802 shows the operating frequency versus return loss of antennas (including antennas 500A, 500B, 500C, 500D, 500E, 500F, 500G, 500H, 500I, 500K, 500L, 500M, and 500N) in some embodiments of the present invention. In addition, the frequency band between frequencies F1 and F3 is the frequency band of interest for the antenna. The frequency band below frequency F1 or above frequency F3 is not the frequency band of interest for the antenna. It can be seen from curve 1801 that the operating frequency of the conventional antenna is shifted to a higher frequency band (e.g., frequency F3). The performance of the conventional antenna in lower frequency bands (e.g., frequency F1 and frequency F2) is affected and does not meet the requirements specified in the specification (SPEC, specification). It can be seen from curves 1801 and 1802 that the operating frequency of the antenna (including embedded conductive features (including conductive features 250A, 250A-1, 250A-2, 250A-3, 250A-3, 250F-1, 250F-2, 250G-1, 250G-2, 250H-1, 250H-2, 250H-3, 250I-1, 250I-2, 250I-3, ​​250K-1, 250K-2, 250K-3, 250L-1, 250L-2, 250M-1, 250M-2)) in some embodiments of the present invention will be shifted to a lower frequency band (e.g., frequency F2) compared to a conventional antenna. The performance of the antenna in the lower frequency band can be significantly improved.

[0149] The present invention provides an antenna. The antenna includes an antenna substrate, an antenna layer, a ground layer and a conductive feature. The antenna layer is arranged on the upper surface of the antenna substrate. The antenna layer is close to the first edge of the first side of the antenna substrate. The ground layer is arranged on the lower surface of the antenna substrate. The conductive feature is embedded in the antenna substrate and close to the first edge of the antenna layer. The conductive feature can extend toward the ground layer and be electrically connected to the antenna layer.

[0150] The embedded conductive features can act as an extension of the antenna layer to reduce the distance between the antenna layer and the ground plane. Therefore, the parallel capacitance of the antenna is increased. The performance of the antenna in the low frequency band can be significantly improved. In addition, the antenna and the conductive features can be made during the printed circuit board (PCB) manufacturing process. The conductive features can be formed after the antenna is manufactured without an additional electroplating process. Therefore, the manufacturing cost can be reduced.

[0151] In some embodiments, the conductive feature may extend along the corresponding edge of the antenna layer. In a top view, the length of the conductive feature (e.g., length L1) may be less than or equal to the length of the corresponding edge of the antenna layer (e.g., length L2). In a cross-sectional view, the conductive feature may extend toward the ground layer. The height of the conductive feature (e.g., height H1) may be less than the thickness of the antenna substrate (e.g., thickness T1).

[0152] In the top view, the conductive feature can be disposed in the edge region of the antenna layer. In some embodiments, the lateral distance of the edge region (e.g., lateral distance LD1) is less than or equal to 0.1λg, where λg is the guided wavelength of the 50Ω microstrip at the center frequency. Accordingly, the width of the conductive feature (e.g., width W1) is less than or equal to 0.1λg.

[0153] In some embodiments, the antenna layer may fully or partially cover the upper surface of the antenna substrate.The conductive features may be formed inside the antenna substrate or exposed from corresponding sides of the antenna substrate.

[0154] In some embodiments, the conductive features include a single-wall structure that extends continuously and parallel to the corresponding edge of the antenna layer. The number of conductive features with a single-wall structure may be less than or equal to the number of edges of the antenna layer. In some embodiments, the conductive features with a single-wall structure and the corresponding edges of the antenna layer may be in a one-to-one correspondence. In some embodiments, the conductive features with a single-wall structure have the same or different heights along a first direction substantially perpendicular to the upper surface of the antenna substrate in a cross-sectional view.

[0155] In some embodiments, the conductive features include discrete wall structures arranged side by side and proximate to corresponding edges of the antenna layer. In some embodiments, the discrete wall structures are separated from each other and arranged in a row along the corresponding edge of the antenna layer. In some embodiments, the discrete wall structures and the corresponding edge of the antenna layer can be in a many-to-one relationship. In some embodiments of the conductive features including discrete wall structures, the discrete wall structures have the same or different heights along the first direction in a cross-sectional view.

[0156] In some embodiments, conductive features corresponding to the same antenna layer can have cross-sectional views of the same or different heights in various shapes (e.g., a strip shape, an L-shape, an inverted L-shape, a reversed L-shape, or a reverse inverted L-shape) to increase parallel capacitance and provide increased design flexibility.

[0157] In some embodiments, the conductive feature comprises an integral wall structure formed by a metal block technology of a low temperature co-fired ceramic (LTCC) printed circuit board (PCB) manufacturing process. In some embodiments, the conductive feature comprises a composite wall structure formed by a buried hole technology of a printed circuit board (PCB) manufacturing process.

[0158] In some embodiments, the conductive feature may be in contact with the antenna layer. In some embodiments, the conductive feature may be disposed separately from the antenna layer. The conductive feature may be electrically coupled to the antenna layer to increase parallel capacitance and provide increased design flexibility.

[0159] In some embodiments, the ground layer of the antenna may have a raised portion that extends toward the conductive feature to further increase the shunt capacitance and provide increased design flexibility.

[0160] Although the present invention has been described by way of example and according to preferred embodiments, it should be understood that the invention is not limited to the disclosed embodiments. On the contrary, it is intended to cover various modifications and similar arrangements (as are obvious to those skilled in the art). Therefore, the scope of the appended claims should be given the broadest interpretation to cover all such modifications and similar arrangements.

Claims

1. An antenna, characterized in that: include: An antenna substrate having an upper surface and a lower surface opposite to the upper surface; an antenna layer, disposed on the upper surface; a ground layer disposed on the lower surface; as well as A first conductive feature is embedded in the antenna substrate and is close to a first edge of the antenna layer, wherein the first conductive feature and the ground layer are separated by a portion of the antenna substrate, and the first conductive feature includes a first portion, wherein an angle between the first portion or an extension of the first portion and an upper surface of the antenna substrate is greater than 0 degrees and less than 180 degrees.

2. The antenna according to claim 1, characterized in that The area of ​​the upper surface of the antenna layer is equal to or smaller than the area of ​​the upper surface of the antenna substrate, and the upper surface of the antenna layer is adjacent to the upper surface of the antenna substrate.

3. The antenna according to claim 1, characterized in that The first conductive feature has a first height along a first direction substantially perpendicular to the upper surface of the antenna substrate, and the first height is less than a thickness of the antenna substrate along the first direction.

4. The antenna according to claim 1, characterized in that The first conductive feature has an inner edge away from the first edge of the antenna layer, and a first lateral distance between the inner edge of the first conductive feature and the first edge of the antenna layer is less than or equal to 0.1λg, where λg is a guided wavelength of a 50Ω microstrip at a center frequency.

5. The antenna according to claim 4, characterized in that The first conductive feature has an outer edge proximate to the first edge of the antenna layer and opposite to the inner edge, and a width between the inner edge and the outer edge of the first conductive feature is less than or equal to 0.1λg.

6. The antenna according to claim 1, characterized in that The first conductive feature is a single-walled structure extending continuously parallel to the first edge of the antenna layer.

7. The antenna according to claim 6, characterized in that The first conductive feature is in a one-to-one correspondence with a corresponding edge of the antenna layer.

8. The antenna according to claim 1, wherein: The first conductive feature includes a plurality of discrete wall structures arranged side by side corresponding to the first edge of the antenna layer.

9. The antenna according to claim 8, characterized in that The first conductive features have a many-to-one relationship with corresponding edges of the antenna layer.

10. The antenna according to claim 8, characterized in that The plurality of discrete wall structures have different heights along the first direction.

11. The antenna according to claim 1, characterized in that The first conductive feature has a stripe shape, an L shape, an inverted L shape, a reversed L shape, or an inverted L shape.

12. The antenna according to claim 1, wherein: The first conductive feature has a lateral portion proximate to the lower surface of the antenna substrate, and the lateral portion extends toward the central portion of the antenna substrate and is substantially parallel to the antenna layer.

13. The antenna according to claim 1, wherein: The first conductive feature includes a unitary wall structure or a composite wall structure.

14. The antenna according to claim 13, characterized in that The composite wall structure comprises: through holes arranged in a row corresponding to a first edge of the antenna layer; and A conductive line covers and is electrically connected to the through hole.

15. The antenna according to claim 1, wherein: The first conductive feature contacts the antenna layer.

16. The antenna according to claim 1, wherein: The first conductive feature is separate from and electrically coupled to the antenna layer.

17. The antenna according to claim 16, characterized in that The first conductive feature is electrically floating.

18. The antenna according to claim 16, characterized in that The first conductive feature has a first height along a first direction substantially perpendicular to the upper surface of the antenna substrate, and a distance between the antenna layer and the conductive feature is smaller than the first height.

19. The antenna according to claim 1, wherein: Further including: A second conductive feature is embedded in the antenna substrate and is proximate to a second edge of the antenna layer, the second edge is proximate to a second side of the antenna layer, wherein the second conductive feature is electrically connected to the antenna layer.

20. The antenna according to claim 1, wherein: The ground layer has a raised portion extending toward the first conductive feature.

21. An antenna package, characterized in that: include: The antenna according to any one of claims 1 to 20; A first substrate, mounted on the ground layer of the antenna; as well as The semiconductor crystal grain is mounted on the first substrate.

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