Electric connection structure and electronic equipment

Abstract

The invention provides an electric connection structure and electronic equipment, relates to the technical field of circuit board interconnection, and can reduce the size of a circuit board and increase the sizes of other parts around the circuit board. The electric connection structure comprises a circuit board, a first connector, a third group of terminals and a fourth group of terminals. The circuit board comprises a first group of signal wires, a second group of signal wires, a first reference ground and a second reference ground. The first reference ground is spaced apart from the second reference ground. The first connector is arranged on the circuit board, and the first connector comprises a first group of terminals and a second group of terminals. The third group of terminals are electrically connected with the first group of terminals through the first group of signal wires and the first reference ground, and the fourth group of terminals are electrically connected with the second group of terminals through the second group of signal wires and the second reference ground. The electric connection structure provided by the invention is used for circuit board interconnection.

Description

Technical Field

[0001] The present application relates to the technical field of interconnection of circuit boards, and in particular to an electrical connection structure and an electronic device. Background Art

[0002] In electronic devices such as mobile phones, tablet computers, and laptop computers, there are usually more than two circuit boards, such as a main board and a sub-board in a mobile phone. These circuit boards can be interconnected by means of an electrical connection structure composed of a flexible printed circuit (FPC) and a connector.

[0003] The signals transmitted between circuit boards may include radio frequency signals and baseband signals. The spectrum range of baseband signals is relatively wide and may include signals with the same frequency range as that of radio frequency signals, so interference between baseband signals and radio frequency signals is likely to occur. In order to solve this problem, the connector for transmitting radio frequency signals and the connector for transmitting baseband signals in electronic devices are usually independently arranged and spaced a certain distance apart to reduce crosstalk between radio frequency signals and baseband signals.

[0004] However, in this case, a large number of connectors are provided in the electronic device, the connectors occupy a large area on the circuit board, the size of the circuit board is large, and the size of other components around the circuit board is limited. Summary of the invention

[0005] The present application provides an electrical connection structure and an electronic device, which can reduce the size of a circuit board and increase the sizes of other components around the circuit board.

[0006] To achieve the above objectives, the embodiments of the present application adopt the following technical solutions:

[0007] In a first aspect, an electrical connection structure is provided, which includes a circuit board, a first connector, a third group of terminals, and a fourth group of terminals. The circuit board includes a first group of signal traces, a second group of signal traces, a first reference ground, and a second reference ground. The first reference ground faces the first group of signal traces, the second reference ground faces the second group of signal traces, and the first reference ground is spaced apart from the second reference ground. The first connector is disposed on the circuit board, and the first connector includes a first group of terminals and a second group of terminals. The third group of terminals and the fourth group of terminals are disposed on the circuit board, and the third group of terminals are electrically connected to the first group of terminals by means of the first group of signal traces and the first reference ground, and the fourth group of terminals are electrically connected to the second group of terminals by means of the second group of signal traces and the second reference ground.

[0008] In this way, the transmission of the first signal can be realized by means of the first group of terminals, the first group of signal traces, the first reference ground and the third group of terminals, and the transmission of the second signal can be realized by means of the second group of terminals, the second group of signal traces, the second reference ground and the fourth group of terminals. Since the first reference ground is separated from the second reference ground, the first signal and the second signal are not arranged in the same ground, the interference is small and the isolation is high. In addition, since the first group of terminals and the second group of terminals are located in the first connector, the first signal and the second signal are introduced into the circuit board or output from the circuit board by means of the first connector, so the number of connectors on the electrical connection structure and the external circuit board can be reduced, and the size of the electrical connection structure and the external circuit board can be reduced, so that the volume of other components (such as batteries) arranged around the electrical connection structure and the external circuit board in the electronic device can be increased.

[0009] In a possible implementation of the first aspect, the circuit board includes a first metal layer and a second metal layer that are stacked and spaced apart. The first group of signal traces is formed by at least part of the first metal layer, the first reference ground includes a first reference ground portion, the first reference ground portion is formed by at least part of the second metal layer, and the orthographic projection of at least part of the first group of signal traces on the second metal layer is located within the first reference ground portion. In this way, with the help of the first reference ground portion, at least part of the first group of signal traces can be shielded, thereby improving the anti-interference performance of the first group of signal traces.

[0010] In a possible implementation of the first aspect, when a first group of signal routing is formed by a portion of the first metal layer and a first reference ground portion is formed by a portion of the second metal layer, a second group of signal routing includes a first portion of signal routing. The first portion of signal routing is formed by another portion of the second metal layer, and the first portion of signal routing is spaced apart from the first reference ground portion. The second reference ground includes a second reference ground portion, and the second reference ground portion is formed by another portion of the first metal layer, and the second reference ground portion is spaced apart from the first group of signal routing. The orthographic projection of at least a portion of the first portion of signal routing on the first metal layer is located within the second reference ground portion. In this way, the second reference ground portion can provide a certain shielding effect on at least a portion of the first portion of signal routing, thereby improving the anti-interference performance of the first portion of signal routing.

[0011] In a possible implementation of the first aspect, the second reference ground also includes a third reference ground portion and a fourth reference ground portion, and the third reference ground portion and the fourth reference ground portion are formed by another portion of the second metal layer. The third reference ground portion and the fourth reference ground portion are both electrically connected to the second reference ground portion, and the third reference ground portion is located on one side of the first part of the signal routing, and the fourth reference ground portion is located on the other side of the first part of the signal routing. In this way, with the help of the third reference ground portion and the fourth reference ground portion, a certain shielding effect can be played on the first part of the signal routing in the plane where the second metal layer is located, thereby improving the anti-interference performance of the first part of the signal routing. At the same time, the area of ​​the second reference ground is increased, and the signal return performance is improved. On the other hand, under the premise of ensuring that the area of ​​the second reference ground remains unchanged, by arranging a part of the second reference ground on the first metal layer and another part on the second metal layer, the stacked arrangement can reduce the board area occupied by the second signal transmission component on the circuit board, which is conducive to reducing the volume of the electrical connection structure and facilitating installation in electronic equipment with limited space.

[0012] In a possible implementation of the first aspect, the circuit board also includes a third metal layer. The third metal layer is located on the side of the first metal layer facing away from the second metal layer, and the third metal layer is stacked and spaced apart from the first metal layer. The first reference ground also includes a fifth reference ground portion. The fifth reference ground portion is formed by at least a portion of the third metal layer, the fifth reference ground portion is electrically connected to the first reference ground portion, and the orthographic projection of at least a portion of the first group of signal traces on the third metal layer is located within the fifth reference ground portion. In this way, with the help of the fifth reference ground portion, at least a portion of the first group of signal traces can be shielded, further improving the anti-interference performance of the first group of signal traces.

[0013] In a possible implementation of the first aspect, when the fifth reference ground portion is formed by a portion of the third metal layer, the second group of signal routing lines further includes a second portion of signal routing lines, the second portion of signal routing lines is formed by another portion of the third metal layer, and at least a portion of the second portion of signal routing lines has an orthographic projection on the first metal layer located within the second reference ground portion. In this way, the second portion of signal routing lines can be isolated from the first portion of signal routing lines by means of the second reference ground portion to prevent interference between the two.

[0014] In a possible implementation of the first aspect, the second reference ground also includes a sixth reference ground portion and a seventh reference ground portion, and the sixth reference ground portion and the seventh reference ground portion are formed by another portion of the third metal layer. The sixth reference ground portion and the seventh reference ground portion are both electrically connected to the second reference ground portion, and the sixth reference ground portion is located on one side of the second part signal routing, and the seventh reference ground portion is located on the other side of the second part signal routing. In this way, with the help of the sixth reference ground portion and the seventh reference ground portion, a certain shielding effect can be played on the second part signal routing within the plane where the third metal layer is located, thereby improving the anti-interference performance of the second part signal routing. At the same time, the area of ​​the second reference ground is increased, and the signal return performance is improved. On the other hand, under the premise of ensuring that the area of ​​the second reference ground remains unchanged, by arranging another part of the second reference ground on the third metal layer, the stacked arrangement can reduce the board area occupied by the second signal transmission component on the circuit board, which is conducive to reducing the volume of the electrical connection structure and facilitating installation in electronic equipment with limited space.

[0015] In a possible implementation of the first aspect, the circuit board includes a first metal layer, and the first reference ground includes an eighth reference ground portion and a ninth reference ground portion. The first group of signal traces is formed by a portion of the first metal layer, and the eighth reference ground portion and the ninth reference ground portion are formed by another portion of the first metal layer. The eighth reference ground portion is located on one side of at least a portion of the first group of signal traces, and the ninth reference ground portion is located on the other side of the at least a portion of the first group of signal traces. In this way, with the help of the eighth reference ground portion and the ninth reference ground portion, at least a portion of the first group of signal traces can be shielded to a certain extent. At the same time, the eighth reference ground portion, the ninth reference ground portion, and at least a portion of the first group of signal traces located between the eighth reference ground portion and the ninth reference ground portion form a coplanar waveguide, and the coplanar waveguide has a small insertion loss, which is conducive to improving the transmission efficiency of the radio frequency signal.

[0016] Optionally, the first group of signal traces also includes a second section, the second section is a part of the first group of signal traces, the eighth reference ground section is located on one side of the second section, and the ninth reference ground section is located on the other side of the second section. In this way, the eighth reference ground section, the second section, and the ninth reference ground section can form a coplanar waveguide structure, which can reduce the insertion loss of the first group of signal traces to a certain extent and improve the transmission efficiency of the RF signal.

[0017] In a possible implementation of the first aspect, a portion of the circuit board where the second section, the eighth reference ground portion, and the ninth reference ground portion are located can be passed through the hinge mechanism. The number of metal layers in this portion of the circuit board is smaller, the circuit board is softer, and it is easier to fold.

[0018] In a possible implementation of the first aspect, the first group of terminals includes a first signal terminal and a plurality of first ground terminals. At least a portion of the plurality of first ground terminals is located between the first signal terminal and the second group of terminals. In this way, isolation is formed by at least a portion of the first ground terminals, so that crosstalk between a first signal transmitted by the first signal terminal and a second signal transmitted by the second group of terminals can be avoided.

[0019] In a possible implementation of the first aspect, the first connector further includes a fifth group of terminals, and the fifth group of terminals is located between the first group of terminals and the second group of terminals. A fifth group of pads is provided on the circuit board, and the fifth group of pads is located between the first reference ground and the second reference ground, and the fifth group of pads and the first reference ground, as well as the fifth group of pads and the second reference ground are spaced apart. The fifth group of terminals is welded on the fifth group of pads. With the aid of the fifth group of terminals, isolation can be formed to avoid mutual crosstalk between the first signal transmitted in the first group of terminals and the second signal transmitted in the second group of terminals.

[0020] In a possible implementation of the first aspect, the electrical connection structure further includes a first reinforcement member. The first reinforcement member is located on a surface of the circuit board facing away from the first connector, and the orthographic projection of the first connector on the circuit board overlaps with the orthographic projection of the first reinforcement member on the circuit board, and the first reinforcement member is an insulating member.

[0021] Specifically, the material of the first reinforcement member includes but is not limited to non-metals such as FR-4 epoxy glass cloth laminate, polycarbonate, PC+glass fiber, and ABS plastic.

[0022] In this way, the first reinforcement member can increase the structural strength of the portion of the circuit board connected to the first connector, facilitating the plugging operation. In addition, since the first reinforcement member is an insulating member, the capacitive coupling effect between the first reference ground and the first reinforcement member, and between the second reference ground and the first reinforcement member can be avoided, thereby avoiding the first reference ground from generating mutual crosstalk with the second reference ground by means of the first reinforcement member, thereby increasing the isolation between the first signal and the second signal.

[0023] In a possible implementation of the first aspect, the electrical connection structure further includes a second connector, the second connector is disposed on the circuit board, the third group of terminals is a portion of the terminals of the second connector, and the fourth group of terminals is another portion of the terminals of the second connector. In this way, the third group of terminals and the fourth group of terminals are terminals of the second connector, which is convenient for management and maintenance.

[0024] In a possible implementation of the first aspect, the first group of signal lines is used to transmit radio frequency signals, and the second group of signal lines is used to transmit baseband signals. That is, the first signal is a radio frequency signal, and the second signal is a baseband signal.

[0025] In a possible implementation manner of the first aspect, the circuit board is a flexible circuit board.

[0026] In a possible implementation of the first aspect, the circuit board includes a first circuit board portion and a second circuit board portion, one end of the first circuit board portion along its length direction is connected to one end of the second circuit board portion along its length direction, and the length direction of the first circuit board portion intersects with the length direction of the second circuit board portion. In this way, the circuit board is roughly L-shaped and can match the relative positions of the two connected circuit boards.

[0027] In a possible implementation of the first aspect, an opening is provided on the circuit board. The opening includes a first opening portion and a second opening portion, wherein the first opening portion is located at an end of the first circuit board portion facing the second circuit board portion, and the first opening portion extends along the length direction of the first circuit board portion. The second opening portion is provided at an end of the second circuit board portion facing the first circuit board portion, and is connected to the first opening portion, and the second opening portion extends along the length direction of the second circuit board portion. In this way, with the help of the opening, stress concentration can be reduced, and problems such as redundancy or tearing of the circuit board can be avoided.

[0028] In a second aspect, an electronic device is provided, the electronic device comprising a first circuit board and an electrical connection structure as described in any of the above technical solutions. A fourth connector is provided on the first circuit board. The first connector of the electrical connection structure is electrically connected to the fourth connector.

[0029] Since the electronic device provided in the present application includes the electrical connection structure as described in any of the above technical solutions, the two can solve the same technical problem and achieve the same effect.

[0030] In a possible implementation manner of the second aspect, the electronic device further includes a second circuit board, and the third group of terminals and the fourth group of terminals of the electrical connection structure are electrically connected to the second circuit board.

[0031] In a possible implementation of the second aspect, the electronic device includes a first screen, a first shell, a second shell, and a hinge mechanism. The first screen includes a first screen portion and a second screen portion connected to the first screen portion. The first screen portion is connected to the first shell, the second screen portion is connected to the second shell, and the hinge mechanism is connected between the first shell and the second shell. The second circuit board is arranged in the first shell, the first circuit board is arranged in the second shell, and the electrical connection structure passes through the hinge mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 A perspective view of an electronic device provided for some embodiments of the present application;

[0033] Figure 2for Figure 1 A three-dimensional view of the electronic device as viewed from a direction D1;

[0034] Figure 3 for Figure 1 A schematic diagram of the structure of the electronic device when the first screen is in a folded state;

[0035] Figure 4 for Figure 2 A schematic diagram of the structure of the internal components of the electronic device shown;

[0036] Figure 5a for Figure 4 A schematic diagram of an exploded structure of a first circuit board, a second circuit board and an electrical connection structure in the electronic device shown;

[0037] Figure 5b for Figure 5a A partial enlarged view of area I in the decomposed structure shown;

[0038] Figure 5c for Figure 5a A partial enlarged view of region II in the decomposed structure shown;

[0039] Figure 6a for Figure 5a The schematic diagram of the structure of the exploded structure when viewed from the direction D2;

[0040] Figure 6b for Figure 6a A partial enlarged view of the decomposed structure at region III;

[0041] Figure 6c for Figure 6a A partial enlarged view of the decomposed structure at region IV is shown;

[0042] Figure 7 for Figure 6a A schematic diagram of the specific structure of the electrical connection structure at the second connector in the exploded structure shown;

[0043] Figure 8 for Figure 7 A schematic diagram of the structure of the electrical connection structure when viewed from direction D3;

[0044] Fig. 9 for Figure 8 A top view of a first metal layer in the circuit board shown;

[0045] Fig.10 for Figure 8 A top view of the second metal layer in the circuit board shown;

[0046] Fig.11 for Figure 8 A top view of the third metal layer in the circuit board shown;

[0047] Fig.12 For simulation experiment verification Figure 7 A graph showing the variation of the isolation between the first signal and the second signal transmitted in the electrical connection structure as a function of frequency;

[0048] Fig.13 A curve diagram showing the change of isolation between the first signal and the second signal in the electrical connection structure as a function of frequency is provided for verification of the simulation experiment;

[0049] Fig.14 A schematic diagram of the structure of an electronic device provided in some further embodiments of the present application. DETAILED DESCRIPTION

[0050] In the embodiments of the present application, the terms "first", "second", "third", "fourth", "fifth", "sixth", "seventh", "eighth", "ninth", "tenth", "eleventh", and "twelfth" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined as "first", "second", "third", "fourth", "fifth", "sixth", "seventh", "eighth", "ninth", "tenth", "eleventh", and "twelfth" may explicitly or implicitly include one or more of the features.

[0051] In the embodiments of the present application, the terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0052] The embodiment of the present application provides an electronic device, which can be a user equipment (UE) or a terminal device, for example, the electronic device can be a tablet computer (portable android device, PAD), a personal digital assistant (personal digital assistant, PDA), a handheld device with a wireless communication function, a computing device, a vehicle-mounted device, a wearable device, a virtual reality (virtual reality, VR) terminal device, an augmented reality (augmented reality, AR) terminal device, a wireless terminal in industrial control (industrial control), a wireless terminal in self-driving, a wireless terminal in remote medical, a wireless terminal in smart grid (smart grid), a wireless terminal in transportation safety (transportation safety), a wireless terminal in a smart city (smart city), a wireless terminal in a smart home (smart home), and other mobile terminals or fixed terminals. In the embodiment of the present application, the form of the electronic device is not specifically limited.

[0053] See also Figure 1 , Figure 1 This is a three-dimensional diagram of an electronic device 10 provided in some embodiments of the present application. This embodiment and the following embodiments are exemplified by using the electronic device 10 as a folding screen device, which may be, for example, a folding screen mobile phone. Figure 1 In the embodiment, the folding screen device is in an unfolded state, in which the electronic device is approximately in the shape of a rectangular flat plate. Based on this, in order to facilitate the description of the embodiments below, an XYZ coordinate system is established for the electronic device 10 in the unfolded state, and the length direction of the electronic device 10 is defined as the X-axis direction, the width direction of the electronic device 10 is defined as the Y-axis direction, and the thickness direction of the electronic device 10 is defined as the Z-axis direction. It can be understood that the coordinate system setting of the electronic device 10 can be flexibly set according to actual needs, and no specific limitation is made here. In some other embodiments, when the electronic device 10 is in the unfolded state, the shape of the electronic device 10 can also be a square flat plate, a circular flat plate, an elliptical flat plate, and the like.

[0054] Please also read Figure 1 and Figure 2 , Figure 2 for Figure 1 The electronic device 10 is a three-dimensional view when viewed from a direction D1. The electronic device 10 includes a first screen 1, a supporting device 2 and a second screen 3.

[0055] Understandably, Figure 1 and Figure 2 The electronic device 10 includes some components, and the actual shape, size, position and structure of these components are not limited to the following. Figure 1 and Figure 2 In some other embodiments, the electronic device 10 may not include the first screen 1 and the second screen 3.

[0056] Please refer to Figure 1 The first screen 1 is used to display information such as images and videos. The first screen 1 can be an organic light-emitting diode (OLED) screen, a microorganic light-emitting diode (microorganic light-emitting diode) screen, or a quantum dot light-emitting diode (QLED) screen, etc.

[0057] The first screen 1 includes a display surface S1, through which a user can watch an image or video displayed by the first screen 1. The first screen 1 has a back side, which refers to a side of the first screen 1 that is away from the display surface S1.

[0058] The supporting device 2 is located at the back side of the first screen 1 and is fixed to the first screen 1. The supporting device 2 is used to support the first screen 1 and protect the internal components.

[0059] In some embodiments, the support device 2 includes a first shell 21 and a second shell 22. When the electronic device 10 is other products, the electronic device 10 may not include the second shell 22, or in addition to the first shell 21 and the second shell 22, also include a third shell, a fourth shell or a fifth shell, etc., which is not specifically limited in this application.

[0060] The first housing 21 and the second housing 22 are used to support the first screen 1. For details, please refer to Figure 1 The first screen 1 includes a first screen portion 11 and a second screen portion 12 , the first screen portion 11 is connected to the second screen portion 12 , the first screen portion 11 is connected to the first shell 21 , and the second screen portion 12 is connected to the second shell 22 .

[0061] The second screen 3 is disposed on a side of the first housing 21 that is opposite to the first screen portion 11, and the second screen 3 includes a display surface S2, and the display surface S2 of the second screen 3 is opposite to the display surface of the first screen portion 11. The display surface of the first screen portion 11 is a partial area of ​​the display surface S1 located in the first screen portion 11.

[0062] The support device 2 also includes a shaft mechanism, which is connected between the first shell 21 and the second shell 22. The first shell 21 and the second shell 22 are rotatably connected by means of the shaft mechanism, so that the first screen 1 can be moved by Figure 1 The expanded state shown collapses to the collapsed state. Figure 1 In the , the first screen 1 is in the expanded state. Figure 3 , Figure 3 for Figure 1 The schematic diagram of the structure of the electronic device 10 is shown in the state where the first screen 1 is in a folded state. In this state, the first housing 21 and the second housing 22 are protected outside the first screen 1, which can prevent the first screen 1 from being scratched, and the electronic device 10 is folded for easy carrying. At the same time, the second screen 3 is exposed, and a small screen display can be realized with the help of the second screen 3.

[0063] See also Figure 4 , Figure 4 for Figure 2 The schematic diagram of the structure of the internal components of the electronic device 10 is shown. Figure 4 In FIG. 1 , the internal components of the electronic device 10 are drawn by dotted lines. The electronic device 10 further includes a first circuit board 4 , a second circuit board 5 , an electrical connection structure 6 and an antenna module 7 .

[0064] See also Figure 4 The first circuit board 4 can be disposed in the second shell 22 , and the second circuit board 5 can be disposed in the first shell 21 .

[0065] The first circuit board 4 may be a mainboard of the electronic device 10. A rear camera module 41 may be provided on the first circuit board 4. A radio frequency (RF) transceiver module 42 may also be provided on the first circuit board 4. The RF transceiver module 42 includes but is not limited to a RF transceiver circuit and a RF transceiver chip. The RF transceiver module 42 is used to generate a RF transmission signal and process a RF reception signal.

[0066] On the basis of the above, please continue to refer to Figure 4 The electrical connection structure 6 is connected between the first circuit board 4 and the second circuit board 5, and the electrical connection structure 6 passes through the shaft mechanism. The electrical connection structure 6 can transmit the RF transmission signal generated by the RF transceiver module 42 in the first circuit board 4 to the second circuit board 5, and transmit the RF reception signal of the second circuit board 5 to the RF transceiver module 42 of the first circuit board 4.

[0067] Moreover, the electrical connection structure 6 can also transmit baseband signals. In this embodiment, the baseband signals are signals other than radio frequency signals. Specifically, the baseband signals may include control signals, video stream signals, audio electrical signals, etc. The spectrum range of these baseband signals is relatively wide, and may include signals with the same frequency range as the radio frequency signal (including radio frequency transmission signals and radio frequency reception signals). Therefore, mutual interference between the baseband signals and the radio frequency signals is likely to occur.

[0068] Please continue reading Figure 4 , the antenna module 7 may be disposed in the first housing 21. In some embodiments, the antenna module 7 may include a radiator 71 and a control circuit board 72, and the radiator 71 may be formed by at least a portion (such as a frame) of the first housing 21. The control circuit board 72 is electrically connected to the radiator 71, and the control circuit board 72 is used to switch the working frequency band or working state of the radiator 71. The control circuit board 72 is located inside the first housing 21.

[0069] The antenna module 7 is electrically connected to the second circuit board 5 to receive the above-mentioned radio frequency transmission signal and baseband signals such as antenna control signals and power supply signals from the second circuit board 5. The radiator 71 transmits the radio frequency transmission signal in the form of electromagnetic waves, and the control circuit board 72 is used to switch the working frequency band or working state of the radiator 71 according to the antenna control signal. The antenna module 7 is also used to receive electromagnetic wave signals and convert the electromagnetic wave signals into radio frequency reception signals for transmission to the second circuit board 5.

[0070] The specific structure of the electrical connection structure 6 is described below in detail.

[0071] See also Figure 5a , Figure 5a for Figure 4 A schematic diagram of an exploded structure of a first circuit board 4, a second circuit board 5 and an electrical connection structure 6 in an electronic device 10 is shown.

[0072] A fourth connector 43 may be provided on the first circuit board 4 , and a fifth connector 51 may be provided on the second circuit board 5 . The fourth connector 43 is electrically connected to the fifth connector 51 via the electrical connection structure 6 .

[0073] It is understandable that other connectors may be provided on the first circuit board 4, such as Figure 5a In the illustrated embodiment, a sixth connector 44 may be further provided on the first circuit board 4 , and a seventh connector 52 may be further provided on the second circuit board 5 . The sixth connector 44 is electrically connected to the seventh connector 52 via the electrical connection structure 6 .

[0074] The following embodiments mainly introduce the specific connection structure between the fourth connector 43 , the electrical connection structure 6 and the fifth connector 51 .

[0075] For details, please refer to Figure 5b , Figure 5b for Figure 5a The fourth connector 43 may include a seventh group of terminals A7 and an eighth group of terminals A8. Figure 5c , Figure 5c for Figure 5a In the partial enlarged view of the area II in the decomposed structure shown, the fifth connector 51 may include a ninth group of terminals A9 and a tenth group of terminals A10. The seventh group of terminals A7 is electrically connected to the ninth group of terminals A9 by means of the electrical connection structure 6 to transmit a first signal, which may be the above-mentioned radio frequency signal. The eighth group of terminals A8 is electrically connected to the tenth group of terminals A10 by means of the electrical connection structure 6 to transmit a second signal, which may be the above-mentioned baseband signal.

[0076] Of course, in other embodiments, the first signal may be a baseband signal, and the second signal may be a radio frequency signal; or, both the first signal and the second signal are radio frequency signals; or, both the first signal and the second signal are baseband signals. The following embodiments are exemplified by taking the first signal as a radio frequency signal and the second signal as a baseband signal, which cannot be regarded as a special limitation on the present application.

[0077] See also Figure 6a , Figure 6a for Figure 5a The schematic diagram of the exploded structure when viewed from the direction D2 is shown. The electrical connection structure 6 includes a circuit board 61 , a first connector 62 and a second connector 63 .

[0078] The circuit board 61 may be a soft board or a circuit board combining soft and hard. In this embodiment, the circuit board 61 is exemplified as a soft board. Specifically, the circuit board 61 may be an FPC.

[0079] The circuit board 61 can have various shapes. For example, the circuit board 61 can be S-shaped, L-shaped, straight-line shaped, etc. The shape of the circuit board 61 can be specifically designed according to the relative positions of the first circuit board 4 and the second circuit board 5 .

[0080] In some embodiments, please refer to Figure 6a , the circuit board 61 may include a first circuit board portion 611 and a second circuit board portion 612 .

[0081] The first circuit board portion 611 has a length direction, and the length direction of the first circuit board portion 611 is consistent with the extension direction of the internal signal wiring of the first circuit board portion 611. Specifically, the length direction of the first circuit board portion 611 is substantially parallel to the X-axis direction. Similarly, the second circuit board portion 612 also has a length direction, and the length direction of the second circuit board portion 612 is consistent with the extension direction of the internal signal wiring of the second circuit board portion 612. Specifically, the length direction of the second circuit board portion 612 is substantially parallel to the Y-axis direction.

[0082] On the basis of the above, one end of the length direction of the first circuit board portion 611 is connected to one end of the length direction of the second circuit board portion 612, and the length direction of the first circuit board portion 611 intersects with the length direction of the second circuit board portion 612. Here, "intersecting" means a certain angle, which can be greater than 0° and less than 180°. Optionally, the length direction of the first circuit board portion 611 can be substantially perpendicular to the length direction of the second circuit board portion 612.

[0083] In this way, the circuit board 61 is roughly L-shaped, which can match the relative positions of the first circuit board 4 and the second circuit board 5 .

[0084] On the basis of the above, since the relative positions of the first circuit board 4 and the second circuit board 5 will inevitably deviate, the position of the fourth connector 43 on the first circuit board 4 and the position of the fifth connector 51 on the second circuit board 5 will inevitably deviate. Based on this, after the electrical connection structure 6 is connected to the fourth connector 43 and the fifth connector 51, the circuit board 61 will inevitably have redundant wrinkles or tears and other problems.

[0085] In order to solve the above problems, in some embodiments, please continue to refer to Figure 6a The circuit board 61 is provided with an opening 66, and the opening 66 includes a first opening portion 66a and a second opening portion 66b. The first opening portion 66a is located at the end of the first circuit board portion 611 facing the second circuit board portion 612, and the first opening portion 66a extends substantially along the length direction of the first circuit board portion 611. The second opening portion 66b is provided at the end of the second circuit board portion 612 facing the first circuit board portion 611, and is communicated with the first opening portion 66a, and the second opening portion 66b extends along the length direction of the second circuit board portion 612.

[0086] In this way, with the help of the opening 66, stress concentration can be reduced, and problems such as redundancy or tearing of the circuit board 61 can be avoided.

[0087] Please continue reading Figure 6aThe first connector 62 and the second connector 63 are arranged on the circuit board 61, and the first connector 62 and the second connector 63 can be plug-in board-to-board (BTB) connectors. Of course, in other embodiments, the first connector 62 and the second connector 63 can also be magnetic connectors or contact connectors, which is not specifically limited in this application.

[0088] In some embodiments, please refer to Figure 6a The first connector 62 may be disposed at an end of the first circuit board portion 611 away from the second circuit board portion 612 . The second connector 63 may be disposed at an end of the second circuit board portion 612 away from the first circuit board portion 611 .

[0089] The first connector 62 is mated and connected with the fourth connector 43 , and the second connector 63 is mated and connected with the fifth connector 51 .

[0090] For details, please refer to Figure 6b , Figure 6b for Figure 6a The electrical connection structure includes a first group of terminals A1 and a second group of terminals A2, and the first group of terminals A1 and the second group of terminals A2 are arranged on the circuit board 61. For details, please refer to Figure 6a and Figure 6b The first terminal group A1 is a part of the terminals of the first connector 62, and the second terminal group A2 is another part of the terminals of the first connector 62. The first terminal group A1 is matched and connected with the seventh terminal group A7, and the second terminal group A2 is matched and connected with the eighth terminal group A8.

[0091] See also Figure 6c , Figure 6c for Figure 6a The electrical connection structure 6 further includes a third group of terminals A3 and a fourth group of terminals A4, which are disposed on the circuit board 61. In some embodiments, please refer to Figure 6a and Figure 6c The third terminal group A3 is a part of the terminals of the second connector 63, and the fourth terminal group A4 is another part of the terminals of the second connector 63. The third terminal group A3 is matched and connected with the ninth terminal group A9, and the fourth terminal group A4 is matched and connected with the tenth terminal group A10.

[0092] See also Figure 7 , Figure 7 for Figure 6aThe schematic diagram of the specific structure of the electrical connection structure 6 at the second connector 63 in the decomposed structure shown. The circuit board 61 includes a first group of signal traces 611, a second group of signal traces 612, a first reference ground GND1 and a second reference ground GND2. Figure 7 In FIG. 1 , the first reference ground GND1 and the second reference ground GND2 are filled with dots.

[0093] The first reference ground GND1 is oriented toward the first group of signal traces 611, and the second reference ground GND2 is oriented toward the second group of signal traces 612. Here, "oriented toward" should be understood as a closer distance. Specifically, the first reference ground GND1 is oriented toward the first group of signal traces 611, which means that: of the first reference ground GND1 and the second reference ground GND2, the first reference ground GND1 is closer to the first group of signal traces 611, that is, the distance between the first reference ground GND1 and the first group of signal traces 611 is smaller than the distance between the second reference ground GND2 and the first group of signal traces 611.

[0094] Similarly, the second reference ground GND2 is toward the second group of signal traces 612, which means that: between the first reference ground GND1 and the second reference ground GND2, the distance between the second reference ground GND2 and the second group of signal traces 612 is closer, that is, the distance between the second reference ground GND2 and the second group of signal traces 612 is smaller than the distance between the first reference ground GND1 and the second group of signal traces 612.

[0095] The third terminal group A3 is electrically connected to the first terminal group A1 via the first signal line 611 and the first reference ground GND1 to transmit the first signal. The fourth terminal group A4 is electrically connected to the second terminal group A2 via the second signal line 612 and the second reference ground GND2 to transmit the second signal.

[0096] For details, please refer to Figure 7 , the third group of terminals A3 may include at least one third signal terminal A31 and at least one third ground terminal A32. Figure 7 In FIG. 8 , the third signal terminal A31 is filled with hatching, and the third ground terminal A32 is filled with black solid.

[0097] Accordingly, the first group of terminals A1 may include at least one first signal terminal and at least one first ground terminal.

[0098] Please continue reading Figure 7 The first group of signal traces 611 may include at least one first signal trace 6111 .

[0099] At least one third signal terminal A31 in the third group of terminals A3 is electrically connected to at least one first signal terminal in the first group of terminals A1 by means of at least one signal 611a line in the first group of signal lines 611 to transmit the first signal; at least one third ground terminal A32 in the third group of terminals A3 is electrically connected to at least one first ground terminal in the first group of terminals A1 by means of the first reference ground GND1 to achieve signal reflux.

[0100] In some embodiments, see Figure 7 , the number of the third signal terminal A31 in the third group of terminals A3 is one. Correspondingly, the number of the first signal terminal in the first group of terminals A1 is also one. The number of the first signal trace 6111 in the first group of signal traces 611 is one. The third signal terminal A31 in the third group of terminals A3, the first signal trace 6111 in the first group of signal traces 611 and the first signal terminal in the first group of terminals A1 are connected to form a first transmission path. The first transmission path is used to transmit the above-mentioned first signal, which includes a radio frequency transmission signal and a radio frequency reception signal. Specifically, the radio frequency transmission signal and the radio frequency reception signal can be transmitted in the first transmission path using a time division duplexing (TDD) method.

[0101] Among them, TDD is a duplex mode of a communication system, which is used to separate the receiving and transmitting channels (or uplink and downlink) in mobile communication systems. In a mobile communication system with TDD mode, reception and transmission are in different time slots of the same frequency channel, i.e., carrier, and the receiving and transmitting channels are separated by guaranteed time.

[0102] In some embodiments, see Figure 7 , the number of the third grounding terminals A32 in the third terminal group A3 can be multiple, and "multiple" means two or more, for example, the number of the third grounding terminals A32 is seven. Correspondingly, the number of the first grounding terminals in the first terminal group A1 can also be multiple. In this way, the first signal can be refluxed by means of multiple third grounding terminals A32 and multiple first grounding terminals, which can improve the reflux performance of the first signal.

[0103] In some embodiments, see Figure 7 , at least a portion of the third ground terminals A32 in the third terminal group A3 may be located between the third signal terminal A31 and the fourth terminal group A4 in the third terminal group A3. Figure 7 In the illustrated embodiment, four third ground terminals A32 in the third terminal group A3 are located between the third signal terminal A31 and the fourth terminal group A4.

[0104] In this way, with the help of at least a part of the third ground terminal A32, a certain shielding effect can be achieved to avoid crosstalk between the first signal transmitted by the third signal terminal A31 and the second signal transmitted by the fourth group terminal A4.

[0105] Similarly, at least a portion of the first ground terminals in the first terminal group A1 may be located between the first signal terminal and the second terminal group A2 to avoid crosstalk between the first signal transmitted by the first signal terminal and the second signal transmitted by the second terminal group A2.

[0106] Likewise, please continue to read Figure 7 , the fourth group of terminals A4 may include at least one fourth signal terminal A41 and at least one fourth ground terminal A42. Figure 7 In FIG. 4 , the fourth signal terminal A41 is filled with hatching, and the fourth ground terminal A42 is filled with black solid.

[0107] Correspondingly, the second group of terminals A2 may include at least one second signal terminal and at least one second ground terminal. The second group of signal traces 612 may include at least one second signal trace 6121. At least one fourth signal terminal A41 in the fourth group of terminals A4 is electrically connected to at least one second signal terminal in the second group of terminals A2 by means of at least one second signal trace 6121 in the second group of signal traces 612, and at least one fourth ground terminal A42 in the fourth group of terminals A4 is electrically connected to at least one second ground terminal in the second group of terminals A2 by means of the second reference ground GND2.

[0108] exist Figure 7 In the illustrated embodiment, the number of the fourth signal terminals A41 in the fourth group of terminals A4 may be multiple, and the number of the fourth grounding terminals A42 may be multiple. Correspondingly, the number of the second signal terminals in the second group of terminals A2 may also be multiple, and the number of the second grounding terminals may also be multiple. The number of the second signal lines 6121 in the second group of signal lines 612 may be multiple. The multiple fourth signal terminals A41 in the fourth group of terminals A4 are electrically connected to the multiple second signal terminals by means of the multiple second signal lines 6121 in the second group of signal lines 612.

[0109] Based on any of the above embodiments, the first reference ground GND1 is spaced apart from the second reference ground GND2. That is, there is a certain gap between the first reference ground GND1 and the second reference ground GND2, and the first reference ground GND1 and the second reference ground GND2 are not electrically connected.

[0110] In this way, the first signal transmitted in the first group of signal lines 611 and the second signal transmitted in the second group of signal lines 612 are not arranged in common, and the isolation between the first signal and the second signal is relatively large, which can reduce crosstalk to a certain extent. At the same time, since the first group of terminals A1 and the second group of terminals A2 are located in the first connector 62, and the third group of terminals A3 and the fourth group of terminals A4 are located in the second connector 63, the first signal and the second signal are introduced into the circuit board or output from the circuit board by the first connector 62, and are output from the circuit board or introduced into the circuit board by the second connector 63, so the number of connectors on the electrical connection structure 6 and the external circuit board (the first circuit board 4 and the second circuit board 5) can be reduced, and the size of the electrical connection structure 6 and the external circuit board can be reduced, so that the volume of other components (such as batteries) arranged around the electrical connection structure and the external circuit board in the electronic device can be increased.

[0111] The structure of the circuit board 61 will be described in detail below.

[0112] For details, please refer to Figure 8 , Figure 8 for Figure 7 The schematic diagram of the structure of the electrical connection structure 6 when viewed from the direction D3. The circuit board 61 may include a first metal layer 61a, a second metal layer 61b and a third metal layer 61c.

[0113] The materials of the first metal layer 61a, the second metal layer 61b and the third metal layer 61c include but are not limited to copper and copper alloys. Copper and copper alloys have good electrical conductivity and can improve the electrical performance of the electrical connection structure 6.

[0114] The first metal layer 61a and the second metal layer 61b are stacked and spaced apart. The third metal layer 61c is located on a side of the first metal layer 61a facing away from the second metal layer 61b. The third metal layer 61c and the first metal layer 61a are stacked and spaced apart.

[0115] In some embodiments, please refer to Figure 8 A first insulating dielectric layer 61d is disposed between the first metal layer 61a and the second metal layer 61b. The material of the first insulating dielectric layer 61d includes but is not limited to polyimide (PI) and polyester film. The first metal layer 61a and the second metal layer 61b are separated by the first insulating dielectric layer 61d.

[0116] Similarly, a second insulating dielectric layer 61e is disposed between the second metal layer 61b and the third metal layer 61c, and the second metal layer 61b and the third metal layer 61c are separated by the second insulating dielectric layer 61e.

[0117] Based on the above embodiments, the first group of signal traces 611 and the first reference ground GND1 constitute a first signal transmission component, the second group of signal traces 612 and the second reference ground GND2 constitute a second signal transmission component, and the first signal transmission component and the second signal transmission component can be formed by at least part of the first metal layer 61a, the second metal layer 61b and the third metal layer 61c.

[0118] First, the specific structure of the first signal transmission component in the first metal layer 61a, the second metal layer 61b and the third metal layer 61c is introduced below.

[0119] See also Fig. 9 , Fig. 9 for Figure 8 FIG. 6 is a top view of the first metal layer 61a in the circuit board 61. The first group of signal traces 611 is formed by at least a portion of the first metal layer 61a. Fig.10 , Fig.10 for Figure 8 The top view of the second metal layer 61b in the circuit board 61 is shown. The first reference ground GND1 includes a first reference ground portion GND01, which is formed by at least a portion of the second metal layer 61b.

[0120] Based on the above, please refer to Fig. 9 and Fig.10 , at least part of the orthographic projection of the first group of signal traces 611 on the second metal layer 61b is located in the first reference ground portion GND01. That is to say, the orthographic projection of a part of the first group of signal traces 611 on the second metal layer 61b may be located in the first reference ground portion GND01, or the orthographic projection of the entire first group of signal traces 611 on the second metal layer 61b may be located in the first reference ground portion GND01.

[0121] In this way, with the help of the first reference ground portion GND01, at least a portion of the first group of signal traces 611 can be shielded, thereby improving the anti-interference performance of the first group of signal traces 611.

[0122] In the above embodiments, it is optional, please refer to Fig. 9 The first group of signal traces 611 includes a first section A, which is a part of the first group of signal traces 611. Fig. 9 and Fig.10 , the orthographic projection of the first segment A on the second metal layer 61b is located in the first reference ground portion GND01. In this way, the anti-interference performance of the first segment A can be improved to a certain extent.

[0123] In some embodiments, please refer to Fig. 9, the first reference ground GND1 may further include an eighth reference ground portion GND08 and a ninth reference ground portion GND09.

[0124] When the first group of signal traces 611 is formed by a portion of the first metal layer 61a, the eighth reference ground portion GND08 and the ninth reference ground portion GND09 are formed by another portion of the first metal layer 61a, and the eighth reference ground portion GND08 is located on one side of at least a portion of the first group of signal traces 611, and the ninth reference ground portion GND09 is located on the other side of the at least a portion of the first group of signal traces 611.

[0125] In this way, with the help of the eighth reference ground portion GND08 and the ninth reference ground portion GND09, a certain shielding effect can be achieved for at least part of the first group of signal traces 611. At the same time, the eighth reference ground portion GND08, the ninth reference ground portion GND09 and at least part of the first group of signal traces 611 located between the eighth reference ground portion GND08 and the ninth reference ground portion GND09 form a coplanar waveguide. The insertion loss of the coplanar waveguide is small, which is beneficial to improving the transmission efficiency of the radio frequency signal.

[0126] In the above embodiment, optional, please continue to refer to Fig. 9 , the first group of signal traces 611 also includes a second section B, which is a part of the first group of signal traces 611, the eighth reference ground section GND08 is located on one side of the second section B, and the ninth reference ground section GND09 is located on the other side of the second section B. In this way, the eighth reference ground section GND08, the second section B and the ninth reference ground section GND09 can form a coplanar waveguide structure, which can reduce the insertion loss of the first group of signal traces 611 to a certain extent and improve the transmission efficiency of the RF signal.

[0127] In some embodiments, the portion of the circuit board 61 where the second section B, the eighth reference ground portion GND08 and the ninth reference ground portion GND09 are located can be passed through the hinge mechanism. The number of metal layers in this portion of the circuit board is smaller, it is softer, and easier to fold.

[0128] In some embodiments, the first reference ground portion GND01, the eighth reference ground portion GND08, and the ninth reference ground portion GND09 may be electrically connected as a whole. Specifically, the first reference ground portion GND01, the eighth reference ground portion GND08, and the ninth reference ground portion GND09 may be electrically connected as a whole using a first metallized via (not shown in the figure) and other metal regions. The first metallized via may be disposed in the first insulating dielectric layer 61d.

[0129] See also Fig.11 , Fig.11 for Figure 8A top view of the third metal layer 61c in the circuit board 61 is shown. The first reference ground GND1 also includes a fifth reference ground portion GND05. The fifth reference ground portion GND05 is formed by at least a portion of the third metal layer 61c, and the fifth reference ground portion GND05 is electrically connected to the first reference ground portion GND01. Specifically, the fifth reference ground portion GND05 and the first reference ground portion GND01 can be electrically connected by means of a second metallized via (not shown in the figure) and other metal areas. Among them, the second metallized via can be set in the first insulating dielectric layer 61d and the second insulating dielectric layer 61e.

[0130] On the basis of the above, at least part of the orthographic projection of the first group of signal traces 611 on the third metal layer 61c is located in the fifth reference ground portion GND05. In other words, the orthographic projection of a part of the first group of signal traces 611 on the third metal layer 61c may be located in the fifth reference ground portion GND05, or the orthographic projection of the entire first group of signal traces 611 on the third metal layer 61c may be located in the fifth reference ground portion GND05.

[0131] In this way, with the help of the fifth reference ground portion GND05 , at least a portion of the first group of signal traces 611 can be shielded, thereby further improving the anti-interference performance of the first group of signal traces 611 .

[0132] In some embodiments, please refer to Fig.11 The fifth reference ground portion GND05 includes a first reference ground unit GND051. Fig. 9 and Fig.11 , the orthographic projection of the first segment A on the third metal layer 61c is located within the first reference ground unit GND051, and the orthographic projection of the first reference ground unit GND051 on the first metal layer 61a overlaps with the first reference ground portion GND01.

[0133] In this way, the first reference ground portion GND01 , the first segment A and the first reference ground unit GND051 form a stripline structure, which can further improve the anti-interference performance of the first segment A.

[0134] Based on the above embodiment, optional, please continue to refer to Fig.11 , the fifth reference ground portion GND05 further includes a second reference ground unit GND052. The second reference ground unit GND052 is spaced apart from the first reference ground unit GND051, and the second reference ground unit GND052 is electrically connected to the first reference ground unit GND051. Specifically, the second reference ground unit GND052 and the first reference ground unit GND051 can be electrically connected by means of other metal regions (not shown in the figure).

[0135] Based on this, please refer back to Fig. 9, the first group of signal traces 611 further includes a third segment C. In some embodiments, the third segment C is connected to an end of the second segment B away from the first segment A. The orthographic projection of the third segment C on the third metal layer 61 c is located within the second reference ground unit GND052.

[0136] In this way, the third section C and the second reference ground unit GND052 form a microstrip line structure. With the help of the second reference ground unit GND052, the third section C can be shielded, thereby improving the anti-interference performance of the third section C.

[0137] According to the introduction of the above embodiments, the first signal transmission component may have a stripline structure, a coplanar waveguide structure and a microstrip line structure at the same time, or may have two of the stripline structure, the coplanar waveguide structure and the microstrip line structure, or may have only one of the stripline structure, the coplanar waveguide structure and the microstrip line structure, and the present application does not make any specific limitations on this.

[0138] Next, the specific structure of the second signal transmission component in the first metal layer 61a, the second metal layer 61b and the third metal layer 61c is introduced below.

[0139] Please return to Fig. 9 and Fig.10 In the case where the first group of signal traces 611 is formed by a portion of the first metal layer 61a and the first reference ground portion GND01 is formed by a portion of the second metal layer 61b, please refer to Fig.10 The second group of signal traces 612 includes a first portion of signal traces 612a. The first portion of signal traces 612a is formed by another portion of the second metal layer 61b. The first portion of signal traces 612a is separated from the first reference ground portion GND01, that is, the first portion of signal traces 612a and the first reference ground portion GND01 are independent of each other and are not electrically conductive.

[0140] On the basis of the above, please refer to Fig. 9 , the second reference ground GND2 includes a second reference ground portion GND02. The second reference ground portion GND02 is formed by another portion of the first metal layer 61a.

[0141] The second reference ground portion GND02 is spaced apart from the first group of signal traces 611 , that is, the second reference ground portion GND02 and the first group of signal traces 611 are independent of each other and are not electrically connected.

[0142] Please refer to Fig. 9 and Fig.10, at least part of the orthographic projection of the first signal trace 612a on the first metal layer 61a is located in the second reference ground portion GND02. That is to say, the orthographic projection of the first signal trace 612a on the first metal layer 61a may be located in the second reference ground portion GND02 for a part, or the orthographic projection of the entire first signal trace 612a on the first metal layer 61a may be located in the second reference ground portion GND02.

[0143] In this way, the second reference ground portion GND02 can shield at least a portion of the first portion of the signal wiring 612a to a certain extent, thereby improving the anti-interference performance of the first portion of the signal wiring 612a.

[0144] In some embodiments, please refer to Fig. 9 and Fig.10 , the orthographic projection of the entire first portion of the signal wiring 612a on the first metal layer 61a is located within the second reference ground portion GND02. In this way, the entire first portion of the signal wiring 612a can be shielded by the second reference ground portion GND02, effectively improving the anti-interference performance of the first portion of the signal wiring 612a.

[0145] Based on the above embodiments, please refer to Fig.10 , the second reference ground GND2 also includes a third reference ground portion GND03 and a fourth reference ground portion GND04. The third reference ground portion GND03 and the fourth reference ground portion GND04 are formed by another portion of the second metal layer 61b. The third reference ground portion GND03 and the fourth reference ground portion GND04 are both electrically connected to the second reference ground portion GND02. Specifically, the third reference ground portion GND03 and the fourth reference ground portion GND04 can be electrically connected to the second reference ground portion GND02 by means of a third metallized via (not shown in the figure). Among them, the third metallized via can be set in the first insulating dielectric layer 61d.

[0146] On the basis of the above, the third reference ground portion GND03 is located at one side of the first portion of the signal wiring 612a, and the fourth reference ground portion GND04 is located at the other side of the first portion of the signal wiring 612a.

[0147] In this way, with the help of the third reference ground part GND03 and the fourth reference ground part GND04, the first part of the signal wiring 612a can be shielded to a certain extent in the plane where the second metal layer 61b is located, thereby improving the anti-interference performance of the first part of the signal wiring 612a. At the same time, the area of ​​the second reference ground GND2 is increased, and the signal return performance is improved. On the other hand, under the premise of ensuring that the area of ​​the second reference ground GND2 remains unchanged, by arranging a part of the second reference ground GND2 on the first metal layer 61a and another part on the second metal layer 61b, the stacked arrangement can reduce the board area occupied by the second signal transmission component on the circuit board 61, which is conducive to reducing the volume of the electrical connection structure 6 and facilitating installation in electronic equipment with limited space.

[0148] In some embodiments, see Fig.11 In the case where the fifth reference ground portion GND05 is formed by a portion of the third metal layer 61c, the second group of signal traces 612 also includes a second portion of signal traces 612b, and the second portion of signal traces 612b is formed by another portion of the third metal layer 61c. Fig. 9 and Fig.11 , the orthographic projection of at least a portion of the second signal trace 612b on the first metal layer 61a is located within the second reference ground portion GND02.

[0149] In this way, the second reference ground portion GND02 can be used to isolate the second portion of the signal wiring 612b from the first portion of the signal wiring 612a to prevent interference between the two.

[0150] Based on the above examples, please continue to refer to Fig.11 , the second reference ground GND2 also includes a sixth reference ground portion GND06 and a seventh reference ground portion GND07. The sixth reference ground portion GND06 and the seventh reference ground portion GND07 are formed by another portion of the third metal layer 61c. The sixth reference ground portion GND06 and the seventh reference ground portion GND07 are both electrically connected to the second reference ground portion GND02. Specifically, the sixth reference ground portion GND06 and the seventh reference ground portion GND07 can be electrically connected to the second reference ground portion GND02 by means of a fourth metallized via (not shown in the figure). Among them, the fourth metallized via is arranged in the second insulating dielectric layer 61e.

[0151] On the basis of the above, the sixth reference ground portion GND06 is located at one side of the second portion of the signal wiring 612b, and the seventh reference ground portion GND07 is located at the other side of the second portion of the signal wiring 612b.

[0152] In this way, with the help of the sixth reference ground part GND06 and the seventh reference ground part GND07, a certain shielding effect can be played on the second part of the signal wiring 612b in the plane where the third metal layer 61c is located, thereby improving the anti-interference performance of the second part of the signal wiring 612b. At the same time, the area of ​​the second reference ground GND2 is increased, and the signal return performance is improved. On the other hand, under the premise of ensuring that the area of ​​the second reference ground GND2 remains unchanged, by arranging another part of the second reference ground GND2 on the third metal layer 61c, the stacked arrangement can reduce the board area occupied by the second signal transmission component on the circuit board 61, which is conducive to reducing the volume of the electrical connection structure 6 and facilitating installation in electronic equipment with limited space.

[0153] According to the introduction of the above embodiments, the second signal transmission component is divided into three metal layers, and the metal layer in the middle of the three metal layers (corresponding to the first metal layer 61a) is used to set the reference ground, and the metal layers on both sides (including the second metal layer 61b and the third metal layer 61c) are used to set the signal lines. In this way, more signal lines can be set, and crosstalk between multiple signal lines can be avoided. In some other embodiments, the second signal transmission component can also be set only in one of the first metal layer 61a, the second metal layer 61b and the third metal layer 61c, or in addition to being set in the first metal layer 61a, the second metal layer 61b and the third metal layer 61c, it is also set in other metal layers, and this application does not make specific limitations on this.

[0154] On the basis of the above embodiment, the first connector 62 and the second connector 63 are both located on the side of the second metal layer 61 b ​​facing away from the first metal layer 61 a .

[0155] For details, please refer to Figure 6a A first pad set (not shown in the figure) may be provided at a position corresponding to the first connector 62 on the circuit board 61. Specifically, the first pad set may be composed of Fig.10 The second metal layer 61b is partially formed, the first pad set includes a plurality of pads, and the terminals of the first connector 62 are soldered to the first pad set.

[0156] The first pad set may include a first pad group and a second pad group, each of which includes at least one pad. Based on this, the first terminal group A1 on the first connector 62 is welded to the first pad group, and the second terminal group A2 is welded to the second pad group.

[0157] In this way, with the help of the first pad set, the first connector 62 can be electrically and fixedly connected to the circuit board 61.

[0158] Similarly, please continue to read Figure 6aA second pad set G may be provided at a position on the circuit board 61 corresponding to the second connector 63, see Fig.10 , the second pad set G can be composed of Fig.10 The second metal layer 61b is partially formed, and the second pad set G includes a plurality of pads, and the terminals of the second connector 63 are welded on the second pad set G.

[0159] Among them, see Fig.10 The second pad set G may include a third pad group G3 and a fourth pad group G4, and each of the third pad group G3 and the fourth pad group G4 includes at least one pad. Figure 7 The third group of terminals A3 on the second connector 63 are welded to the third group of pads G3, and the fourth group of terminals A4 are welded to the fourth group of pads G4.

[0160] In this way, with the help of the second pad set G, the second connector 63 can be electrically and fixedly connected to the circuit board 61.

[0161] Based on the above, please refer to Fig. 9 and Fig.10 , the two ends of the first group of signal traces 611 can be connected to the first pad in the first pad set and the third pad in the second pad set G respectively by means of the metallized vias in the second insulating dielectric layer 61e. Among them, the first pad is a pad in the first pad set for welding the first signal terminal, and the third pad is a pad in the second pad set G for welding the third signal terminal A31. This structure is simple and has a neat appearance.

[0162] Similarly, please refer to Fig.10 and Fig.11 , the two ends of the second part of the signal trace 612b in the third metal layer 61c can also be connected to the second pad in the first pad set and the fourth pad in the second pad set G respectively by means of the metallized vias in the first insulating dielectric layer 61d and the metallized vias in the second insulating dielectric layer 61e. Among them, the second pad is a pad in the first pad set for welding the second signal terminal, and the fourth pad is a pad in the second pad set G for welding the fourth signal terminal A41. This structure is simple and has a neat appearance.

[0163] Based on any of the above embodiments, please refer to Figure 6b The first connector 62 further includes a fifth group of terminals A5, which are located between the first group of terminals A1 and the second group of terminals A2. The fifth group of terminals A5 includes at least one terminal. Figure 6b In the illustrated embodiment, the number of terminals in the fifth terminal group A5 is three.

[0164] On the basis of the above embodiment, the first pad set further includes a fifth pad group, and the fifth pad group is located at a position corresponding to the fifth terminal group A5 on the circuit board 61. The fifth pad group includes at least one pad, and in some embodiments, the pads in the fifth pad group are equal to the number of terminals in the fifth terminal group A5 and correspond one to one. The fifth terminal group A5 is welded on the fifth pad group.

[0165] On the basis of the above, the fifth group of pads is located between the first reference ground GND1 and the second reference ground GND2, and the fifth group of pads is spaced apart from the first reference ground GND1, and the fifth group of pads is spaced apart from the second reference ground GND2. In other words, the fifth group of pads is independent of the first reference ground GND1 and the second reference ground GND2, and is not electrically conductive.

[0166] In this way, isolation can be formed by means of the fifth group of terminals A5 to avoid mutual crosstalk between the first signal transmitted in the first group of terminals A1 and the second signal transmitted in the second group of terminals A2.

[0167] For details, please refer to Figure 5b , the fourth connector 43 also includes an eleventh group of terminals A11. The eleventh group of terminals A11 is located between the seventh group of terminals A7 and the eighth group of terminals A8, and the eleventh group of terminals A11 is electrically connected to the reference ground layer (not shown in the figure) in the first circuit board 4. Based on this, the eleventh group of terminals A11 is connected in coordination with the fifth group of terminals A5. Thus, the fifth group of terminals A5 is connected to the reference ground of the first circuit board 4, so that the fifth group of terminals A5 can play the role of electromagnetic shielding, and can avoid the mutual crosstalk between the first signal transmitted in the first group of terminals A1 and the second signal transmitted in the second group of terminals A2.

[0168] Likewise, see Figure 6c The second connector 63 further includes a sixth terminal group A6, which is located between the third terminal group A3 and the fourth terminal group A4. The sixth terminal group A6 includes at least one terminal. Figure 6c In the illustrated embodiment, the number of terminals in the sixth terminal group A6 is three.

[0169] Based on the above examples, please refer to Fig.10 The first pad set G also includes a sixth pad group G6, which is located at a position corresponding to the sixth terminal group A6 on the circuit board 61. The sixth pad group G6 includes at least one pad, and in some embodiments, the number of pads in the sixth pad group G6 is equal to the number of terminals in the sixth terminal group A6 and corresponds one to one. The sixth terminal group A6 is soldered to the sixth pad group G6.

[0170] On the basis of the above, the sixth group of pads G6 is located between the first reference ground GND1 and the second reference ground GND2, and the sixth group of pads G6 and the first reference ground GND1 are spaced apart, as well as the sixth group of pads G6 and the second reference ground GND2. In other words, the sixth group of pads G6 is not electrically connected to the first reference ground GND1 or the second reference ground GND2.

[0171] In this way, the sixth group of pads G6 can be connected to the ground terminal in the opposite connector (that is, the fifth connector 51) to form isolation, thereby avoiding crosstalk between the first signal transmitted in the third group of terminals A3 and the second signal transmitted in the fourth group of terminals A4.

[0172] For details, please refer to Figure 5c , the fifth connector 51 also includes a twelfth group of terminals A12. The twelfth group of terminals A12 is located between the ninth group of terminals A9 and the tenth group of terminals A10, and the twelfth group of terminals A12 is electrically connected to the reference ground layer in the second circuit board 5. Based on this, the twelfth group of terminals A12 is connected in coordination with the sixth group of terminals A6. Thus, the sixth group of terminals A6 is connected to the reference ground of the second circuit board 5, so that the sixth group of terminals A6 can play the role of electromagnetic shielding, and can avoid the mutual crosstalk between the first signal transmitted in the third group of terminals A3 and the second signal transmitted in the fourth group of terminals A4.

[0173] In some embodiments, please refer back to Figure 5a The electrical connection structure 6 further includes a first reinforcement member 64. The first reinforcement member 64 is located on the surface of the circuit board 61 facing away from the first connector 62, and the orthographic projection of the first connector 62 on the circuit board 61 overlaps with the orthographic projection of the first reinforcement member 64 on the circuit board 61, and the first reinforcement member 64 is an insulating member.

[0174] Specifically, the material of the first reinforcement member 64 includes, but is not limited to, non-metallic materials such as FR-4 epoxy glass cloth laminate, polycarbonate (PC), PC+glass fiber, ABS plastic (acrylonitrile butadiene styrene plastic), etc. FR-4 is a code for a flame retardant material grade.

[0175] In this way, the structural strength of the portion of the circuit board 61 connected to the first connector 62 can be increased by means of the first reinforcement member 64, so as to facilitate the plugging operation. In addition, since the first reinforcement member 64 is an insulating member, the capacitive coupling effect between the first reference ground GND1 and the first reinforcement member 64, and between the second reference ground GND2 and the first reinforcement member 64 can be avoided, thereby avoiding the mutual crosstalk between the first reference ground GND1 and the second reference ground GND2 by means of the first reinforcement member 64, thereby increasing the isolation between the first signal and the second signal.

[0176] The first reinforcement member 64 can be bonded to the circuit board 61 by means of adhesive. The adhesive can be conductive adhesive or non-conductive adhesive. When the adhesive is conductive adhesive, the adhesive can be disposed between the circuit board 61 and the first reinforcement member 64 by means of adhesive dispensing, so as to avoid forming a whole layer of conductive adhesive, thereby avoiding mutual crosstalk between the first reference ground GND1 and the second reference ground GND2 by means of the adhesive.

[0177] Likewise, see Figure 5a The electrical connection structure 6 further includes a second reinforcing member 65. The second reinforcing member 65 is located on the surface of the circuit board 61 facing away from the second connector 63, and the orthographic projection of the second connector 63 on the circuit board 61 overlaps with the orthographic projection of the second reinforcing member 65 on the circuit board 61, and the second reinforcing member 65 is an insulating member.

[0178] In this way, the second reinforcement member 65 can increase the structural strength of the portion of the circuit board 61 connected to the second connector 63, and facilitate the plugging operation. In addition, since the second reinforcement member 65 is an insulating member, the capacitive coupling effect between the first reference ground GND1 and the second reinforcement member 65, and between the second reference ground GND2 and the second reinforcement member 65 can be avoided, thereby avoiding the first reference ground GND1 from generating mutual crosstalk with the second reference ground GND2 with the help of the second reinforcement member 65, thereby increasing the isolation between the first signal and the second signal.

[0179] In order to verify the isolation effect of the electrical connection structure 6 provided in this application on the first signal and the second signal, please refer to Fig.12 , Fig.12 For simulation experiment verification Figure 7 A curve diagram showing the variation of the isolation between the first signal and the second signal transmitted in the electrical connection structure 6 with the frequency. Fig.12, S3,1, S4,1, S5,1, S6,1, S7,1, S8,1, S9,1, S10,1, S11,1, S12,1, S13,1, S14,1, S15,1, S16,1, S17,1, S18,1, S19,1 are the isolations between the first signal transmitted by the first signal routing line 6111 in the first group of signal routing lines 611 and the second signal transmitted by the second signal routing line 6121 in the second group of signal routing lines 612. Fig.12 It can be seen that at the frequency of 1.1313 GHz, the isolation between the first signal and the second signal is between -61.471823 dB and -91.466965 dB.

[0180] As a comparative electrical connection structure, the comparative electrical connection structure is Figure 7 The structure and size of the electrical connection structure 6 shown are roughly the same, but in the comparative electrical connection structure, the first reference ground GND1 and the second reference ground GND2 are connected together, there is no fifth group of terminals A5 for isolation between the first group of terminals A1 and the second group of terminals A2, there is no sixth group of terminals A6 for isolation between the third group of terminals A3 and the fourth group of terminals A4, and the materials of the first reinforcement 64 and the second reinforcement 65 are both metal.

[0181] See also Fig.13 , Fig.13 The curve of the isolation between the first signal and the second signal in the electrical connection structure changes with frequency for simulation experiment verification. Fig.13 , S3,1, S4,1, S5,1, S6,1, S7,1, S8,1, S9,1, S10,1, S11,1, S12,1, S13,1, S14,1, S15,1, S16,1, S17,1, S18,1, S19,1 are the isolations between the first signal transmitted by the first signal routing line 6111 in the first group of signal routing lines 611 and the second signal transmitted by the second signal routing line 6121 in the second group of signal routing lines 612. Fig.13 It can be seen that at the frequency of 1.0754 GHz, the isolation between the first signal and the second signal is between -42.285563 dB and -60.823607 dB.

[0182] contrast Fig.12 and Fig.13 It can be seen from the simulation results that, compared with the comparative electrical connection structure, the isolation between the first signal and the second signal in the electrical connection structure 6 provided in the present application is improved by more than 10 dB, so the isolation effect is better and crosstalk between the two signals can be avoided.

[0183] The above embodiments are exemplified by taking the example that the first group of terminals A1 is a part of the terminals of the first connector 62, the second group of terminals A2 is another part of the terminals of the first connector 62, the third group of terminals A3 is a part of the terminals of the second connector 63, and the fourth group of terminals A4 is another part of the terminals of the second connector 63.

[0184] In some other embodiments, on the basis that the first group of terminals A1 is a part of the terminals of the first connector 62, and the second group of terminals A2 is another part of the terminals of the first connector 62, the third group of terminals A3 and the fourth group of terminals A4 may not be terminals of the second connector 63. For example, the third group of terminals A3 and the fourth group of terminals A4 are independently arranged on the circuit board 61, such as both are pads on the circuit board 61; or, the third group of terminals A3 and the fourth group of terminals A4 are terminals of two or more connectors on the circuit board 61; or, some of the terminals of the third group of terminals A3 and the fourth group of terminals A4 are terminals in the connector, and the other part of the terminals are independent of the connector, such as the other part of the terminals can be pads on the circuit board 61, and this application does not make specific limitations on this.

[0185] In this way, the first signal and the second signal are introduced into the circuit board 61 or output from the circuit board 61 by means of the first connector 62, which can also reduce the number of connectors on the electrical connection structure 6 and the external circuit board, reduce the size of the electrical connection structure 6 and the external circuit board, and thus increase the volume of other components (such as batteries) arranged around the electrical connection structure 6 and the external circuit board in the electronic device.

[0186] In addition, the above embodiments are exemplified by the fact that the third group of terminals A3 and the fourth group of terminals A4 are both connected to the second circuit board 5. In other embodiments, the third group of terminals A3 and the fourth group of terminals A4 can be respectively connected to two or more circuit boards, and the present application does not make any specific limitation on this.

[0187] Furthermore, the first connector 62 may include other groups of terminals in addition to the first group of terminals A1, the second group of terminals A2 and the fifth group of terminals A5. On this basis, the electrical connection structure 6 may include other groups of terminals in addition to the third group of terminals A3 and the fourth group of terminals A4, and the other groups of terminals are electrically connected to the other groups of terminals in the first connector 62 by means of the circuit board 61, so as to realize the transmission of other baseband signals or radio frequency signals, which is not specifically limited in the present application.

[0188] The above embodiments are embodiments in which the first circuit board 4 and the second circuit board 5 are respectively accommodated in the first housing 21 and the second housing 22. In other embodiments, the first circuit board 4 and the second circuit board 5 may also be accommodated in the same housing.

[0189] For examples, see Fig.14 , Fig.14 A schematic diagram of the structure of an electronic device 10 provided for some other embodiments of the present application. In this embodiment, the first circuit board 4 and the second circuit board 5 are both accommodated in the first housing 21. Based on this, the electrical connection structure 6 can also be connected between the first circuit board 4 and the second circuit board 5 and the control circuit board 72. Specifically, the first connector 62 of the electrical connection structure 6 is connected to the first circuit board 4, and a part of the third group of terminals A3 and the fourth group of terminals A4 of the electrical connection structure 6 are electrically connected to the control circuit board 72, thereby enabling the transmission of radio frequency signals and baseband signals between the first circuit board 4 and the control circuit board 72 with the aid of the electrical connection structure 6. Another part of the terminals of the fourth group of terminals A4 of the electrical connection structure 6 are electrically connected to the second circuit board 5, thereby enabling the transmission of baseband signals between the first circuit board 4 and the second circuit board 5 with the aid of the electrical connection structure 6.

[0190] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0191] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An electrical connection structure, characterized in that: include: A circuit board, the circuit board comprising a first group of signal traces, a second group of signal traces, a first reference ground, and a second reference ground; the first reference ground is oriented toward the first group of signal traces, the second reference ground is oriented toward the second group of signal traces, and the first reference ground is spaced apart from the second reference ground; A first connector, the first connector is disposed on the circuit board, and the first connector includes a first group of terminals and a second group of terminals; A third group of terminals and a fourth group of terminals, the third group of terminals and the fourth group of terminals are arranged on the circuit board, and the third group of terminals are electrically connected to the first group of terminals by means of the first group of signal routings and the first reference ground, and the fourth group of terminals are electrically connected to the second group of terminals by means of the second group of signal routings and the second reference ground.

2. The electrical connection structure according to claim 1, characterized in that: The circuit board comprises a first metal layer and a second metal layer which are stacked and spaced apart; The first group of signal routings is formed by at least a portion of the first metal layer, the first reference ground includes a first reference ground portion, the first reference ground portion is formed by at least a portion of the second metal layer, and the orthographic projection of at least a portion of the first group of signal routings on the second metal layer is located within the first reference ground portion.

3. The electrical connection structure according to claim 2, characterized in that: In a case where the first group of signal traces is formed by a portion of the first metal layer, and the first reference ground portion is formed by a portion of the second metal layer, The second group of signal traces includes a first portion of signal traces, the first portion of signal traces is formed by another portion of the second metal layer, the first portion of signal traces is spaced apart from the first reference ground portion, the second reference ground includes a second reference ground portion, the second reference ground portion is formed by another portion of the first metal layer, the second reference ground portion is spaced apart from the first group of signal traces; An orthographic projection of at least a portion of the first portion of the signal routing line on the first metal layer is located within the second reference ground portion.

4. The electrical connection structure according to claim 3, characterized in that: The second reference ground further includes a third reference ground portion and a fourth reference ground portion, wherein the third reference ground portion and the fourth reference ground portion are formed by another portion of the second metal layer; The third reference ground portion and the fourth reference ground portion are both electrically connected to the second reference ground portion, and the third reference ground portion is located on one side of the first portion of the signal routing, and the fourth reference ground portion is located on the other side of the first portion of the signal routing.

5. The electrical connection structure according to any one of claims 2 to 4, characterized in that: The circuit board further includes a third metal layer, the third metal layer is located on a side of the first metal layer facing away from the second metal layer, and the third metal layer is stacked and spaced apart from the first metal layer; The first reference ground also includes a fifth reference ground portion, which is formed by at least a portion of the third metal layer, the fifth reference ground portion is electrically connected to the first reference ground portion, and the orthographic projection of at least a portion of the first group of signal routing lines on the third metal layer is located within the fifth reference ground portion.

6. The electrical connection structure according to claim 5, characterized in that: In the case where the fifth reference ground portion is formed by a portion of the third metal layer, The second group of signal routings also includes a second portion of signal routings, which is formed by another portion of the third metal layer, and at least a portion of the orthographic projection of the second portion of signal routings on the first metal layer is located within the second reference ground portion.

7. The electrical connection structure according to claim 6, characterized in that: The second reference ground further includes a sixth reference ground portion and a seventh reference ground portion, wherein the sixth reference ground portion and the seventh reference ground portion are formed by another portion of the third metal layer; The sixth reference ground portion and the seventh reference ground portion are both electrically connected to the second reference ground portion, and the sixth reference ground portion is located on one side of the second portion of the signal routing, and the seventh reference ground portion is located on the other side of the second portion of the signal routing.

8. The electrical connection structure according to any one of claims 1 to 7, characterized in that: The circuit board includes a first metal layer, the first reference ground includes an eighth reference ground portion and a ninth reference ground portion; The first group of signal routings is formed by a portion of the first metal layer, the eighth reference ground portion and the ninth reference ground portion are formed by another portion of the first metal layer, the eighth reference ground portion is located on one side of at least a portion of the first group of signal routings, and the ninth reference ground portion is located on the other side of the at least a portion of the first group of signal routings.

9. The electrical connection structure according to any one of claims 1 to 8, characterized in that: The first group of terminals includes a first signal terminal and a plurality of first ground terminals; At least a portion of the plurality of first ground terminals are located between the first signal terminal and the second group of terminals.

10. The electrical connection structure according to any one of claims 1 to 9, characterized in that: The first connector further includes a fifth group of terminals, the fifth group of terminals being located between the first group of terminals and the second group of terminals; A fifth group of solder pads is provided on the circuit board, and the fifth group of solder pads is located between the first reference ground and the second reference ground, and the fifth group of solder pads and the first reference ground, as well as the fifth group of solder pads and the second reference ground are spaced apart; the fifth group of terminals is welded on the fifth group of solder pads.

11. The electrical connection structure according to any one of claims 1 to 10, characterized in that: Also includes: The first reinforcement member is located on a surface of the circuit board facing away from the first connector, and the orthographic projection of the first connector on the circuit board overlaps with the orthographic projection of the first reinforcement member on the circuit board. The first reinforcement member is an insulating member.

12. The electrical connection structure according to any one of claims 1 to 11, characterized in that: Also includes: The second connector is arranged on the circuit board, the third group of terminals is a part of the terminals of the second connector, and the fourth group of terminals is another part of the terminals of the second connector.

13. The electrical connection structure according to any one of claims 1 to 12, characterized in that: The first group of signal traces is used to transmit radio frequency signals, and the second group of signal traces is used to transmit baseband signals.

14. The electrical connection structure according to any one of claims 1 to 13, characterized in that: The circuit board is a flexible circuit board.

15. The electrical connection structure according to any one of claims 1 to 14, characterized in that: The circuit board includes a first circuit board part and a second circuit board part, one end of the first circuit board part along its own length direction is connected to one end of the second circuit board part along its own length direction, and the length direction of the first circuit board part intersects with the length direction of the second circuit board part.

16. The electrical connection structure according to claim 15, characterized in that: The circuit board is provided with an opening, the opening comprising a first opening portion and a second opening portion, the first opening portion is located at an end of the first circuit board portion facing the second circuit board portion, and the first opening portion extends along the length direction of the first circuit board portion; The second opening portion is disposed at an end portion of the second circuit board portion facing the first circuit board portion and is communicated with the first opening portion. The second opening portion extends along a length direction of the second circuit board portion.

17. An electronic device, characterized in that: include: a first circuit board, wherein a fourth connector is provided on the first circuit board; The electrical connection structure according to any one of claims 1 to 16, wherein the first connector of the electrical connection structure is electrically connected to the fourth connector of the first circuit board.

18. The electronic device according to claim 17, characterized in that: Also includes: The second circuit board, the third group of terminals and the fourth group of terminals of the electrical connection structure are electrically connected to the second circuit board.

19. The electronic device according to claim 18, characterized in that: The electronic device comprises a first screen, a first shell, a second shell and a rotating shaft mechanism; The first screen includes a first screen portion and a second screen portion connected to the first screen portion; The first screen portion is connected to the first shell, the second screen portion is connected to the second shell, and the shaft mechanism is connected between the first shell and the second shell; The second circuit board is arranged in the first shell, the first circuit board is arranged in the second shell, and the electrical connection structure passes through the rotating shaft mechanism.

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