Power conversion device

Abstract

A power conversion device includes: a plurality of rectangular parallelepiped-shaped power supply modules arranged side by side; a substrate disposed on the second surfaces of the plurality of power supply modules at intervals and electrically connected to the module terminals of each of the plurality of power supply modules; and a substrate holding member which is disposed in a gap between the substrate and the plurality of power modules, holds the substrate, and is made of an insulating resin member. The plurality of power modules are arranged side by side in a direction parallel to the third surface. The module terminal extends in a direction of the substrate after protruding from at least one of a second surface of the power module, a third surface of the power module, and a fourth surface on an opposite side to the third surface, and a portion of the module terminal extending in the direction of the substrate penetrates a through hole of the substrate holding member.

Description

Technical Field

[0001] The present application relates to a power conversion device. Background Art

[0002] Electric vehicles such as hybrid electric vehicles (HV), plug-in hybrid electric vehicles (PHV, PHEV), electric vehicles (EV) and fuel cell vehicles (FCV) are equipped with power conversion devices as components for electrification. Examples of power conversion devices include inverters that convert direct current from a battery into alternating current flowing to a motor and supply the alternating current to the motor for driving, and converters that increase the voltage of a battery. In recent years, there has been a demand for low-cost power conversion devices.

[0003] In addition, in HV, PHV, and PHEV, in addition to the engine, the power conversion device is also installed in the engine compartment. Therefore, there is a tendency to pursue a small power conversion device. In addition, in EV, a drive motor and an inverter are sometimes installed on the rear side. In order to ensure the trunk and passenger space, there is a tendency to pursue a small power conversion device.

[0004] In addition, in recent years, in order to shorten the connection harness of each power conversion device, the number of frames of each power conversion device has been reduced, and in order to achieve low cost and miniaturization, the cases where power conversion devices such as inverters are directly rigidly connected to frames such as motors, engines or transmissions are increasing. Therefore, the internal components of the power conversion device are required to meet strict vibration specifications. A structure of a power conversion device that meets strict vibration specifications is disclosed (for example, patent document 1). In the structure disclosed in patent document 1, the substrate is directly fixed to a base member serving as a heat dissipation member through a supporting member. Therefore, the vibration resistance of the substrate and the components mounted on the substrate is ensured. Prior art literature Patent Literature

[0005] Patent Document 1: Japanese Patent No. 6369355 Summary of the invention

[0006] Various layouts are conceivable for the power conversion device of the electric vehicle, such as the inverter. One of the layouts is as follows: the power modules of the UVW phases are arranged side by side on the cooler, and a substrate is provided above the plumb of the power module, and the terminals for controlling the power module extend from the power module to the substrate. In order to minimize the installation area of ​​the power module on the cooler, it is impossible to set a sufficient gap between two adjacent power modules. Since the sleeve fixing portion for fixing the substrate described in the above-mentioned patent document 1 cannot be provided on the cooler, there is a technical problem that it is difficult for the substrate and the components mounted on the substrate to meet the vibration specifications.

[0007] In the above-mentioned Patent Document 1, the substrate is fixed to the base member, so the substrate and the components mounted on the substrate can meet strict vibration specifications. However, since the substrate is directly fixed to the base member, it is necessary to fix the substrate to the portion of the base member opposite to the substrate, which makes the base member larger, and thus there is a technical problem that it is difficult to achieve miniaturization and cost reduction of the power conversion device.

[0008] Therefore, an object of the present application is to obtain a power conversion device that achieves miniaturization and cost reduction while ensuring vibration resistance.

[0009] The power conversion device disclosed in the present application includes: a plurality of rectangular power modules having semiconductor chips and arranged side by side, the power modules having a first surface, a second surface on the side opposite to the first surface, and four surfaces surrounding the first surface and the second surface, namely, a third surface, a fourth surface, a fifth surface and a sixth surface; a substrate, the substrate is arranged on the second surfaces of the plurality of power modules in a spaced manner and is electrically connected to the module terminals of each of the plurality of power modules; and a substrate holding member, the substrate holding member is arranged in the interval between the substrate and the plurality of power modules, holds the substrate, and is made of an insulating resin member, the plurality of power modules are arranged side by side in a direction parallel to the third surface, the module terminals extend in the direction of the substrate after protruding from at least one of the second surface of the power module, the third surface of the power module and the fourth surface on the side opposite to the third surface, and the portion of the module terminals extending in the direction of the substrate passes through the through hole of the substrate holding member.

[0010] According to the power conversion device disclosed in the present application, it includes: a plurality of rectangular parallelepiped power modules having semiconductor chips and arranged side by side, the power modules having a first surface, a second surface on the side opposite to the first surface, and four surfaces surrounding the first surface and the second surface; a substrate, the substrate is arranged on the second surfaces of the plurality of power modules in a spaced manner and is electrically connected to the module terminals of each of the plurality of power modules; and a substrate holding member, the substrate holding member is arranged in the space between the substrate and the plurality of power modules, holds the substrate, and is made of an insulating resin member, the plurality of power modules are arranged side by side in a direction parallel to a third surface, the module terminals extend in the direction of the substrate after protruding from at least one of the second surface of the power module, the third surface of the power module, and the fourth surface on the side opposite to the third surface, and the portion of the module terminals extending in the direction of the substrate passes through the through hole of the substrate holding member, so that the substrate is held by the substrate holding member arranged in the space between the substrate and the plurality of power modules, thereby ensuring the vibration resistance of the substrate and the components mounted on the substrate. Since there is no need to provide a gap between the power modules arranged side by side to hold the substrate, the power conversion device can be made smaller and less expensive. The module terminal passes through the through hole of the substrate holding member and is connected to the substrate, so the module terminal can be shortened, thereby making the power conversion device smaller and less expensive. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 This is an exploded perspective view schematically showing the power conversion device according to the first embodiment. Figure 2 This is a perspective view schematically showing the power conversion device according to the first embodiment. Figure 3 is Figure 2 A cross-sectional view of the power conversion device after being cut at the AA cross-sectional position. Figure 4 is Figure 2 A cross-sectional view of the power conversion device cut at the BB cross-sectional position. Figure 5 This is a perspective view showing a power module of the power conversion device according to the first embodiment. Figure 6 It is a perspective view showing a drive circuit substrate of the power conversion device according to the first embodiment. Figure 7 It is a perspective view showing a control circuit substrate of the power conversion device according to the first embodiment. Figure 8 This is a diagram showing an example of the installation state of the power conversion device according to the first embodiment. (Explanation of symbols) 1 power conversion device; 2 power module; 2a first surface; 2b second surface; 2c third surface; 2d fourth surface; 2e fifth surface; 2f sixth surface; 2g module terminal; 2h power terminal; 3 substrate; 3a control circuit substrate; 3b drive circuit substrate; 3c transformer; 3d aluminum electrolytic capacitor; 3e standby transformer; 3f adhesive; 3g through hole; 3h fixing portion; 3l fixing auxiliary portion; 4 substrate holding member; 4a through hole; 4b fixing sleeve; 4c connecting terminal; 4c1 embedded portion; 4c2 extension portion; 4d plate; 4e substrate fixing portion; 4f connecting wiring; 5 film capacitor; 6 frame; 6a configuration surface; 6b sleeve fixing portion; 7 busbar; 8AC terminal; 8a AC busbar; 9 cooler; 9a cooling surface; 9b flow path portion; 9c cover portion; 10 semiconductor chip; 11 additional substrate holding member; 11a substrate fixing portion; 11b recessed portion; 11c fixing sleeve; 12 vehicle; 13 vibration generating source. DETAILED DESCRIPTION

[0012] Hereinafter, the power conversion device according to the embodiment of the present application will be described based on the drawings. In addition, the same or corresponding components and parts are denoted by the same reference numerals in each figure for description.

[0013] Implementation Method 1 Figure 1 is an exploded perspective view showing an outline of the power conversion device 1 according to the first embodiment. Figure 2 is a perspective view showing an outline of the power conversion device 1. Figure 3 is Figure 2 A cross-sectional view of the power conversion device 1 after being cut off at the AA cutoff position, Figure 4 is Figure 2 A cross-sectional view of the power conversion device 1 cut at the BB cross-sectional position, Figure 5 is a perspective view showing a power module 2 of the power conversion device 1 according to the first embodiment. Figure 6 1 is a perspective view showing a drive circuit substrate 3 b of the power conversion device 1 . Figure 7 1 is a perspective view showing a control circuit substrate 3a of the power conversion device 1. Figure 8 1 is a diagram showing an example of the installation state of the power conversion device 1. The power conversion device 1 is a device that converts input current from DC to AC, from AC to DC, or converts input voltage to a different voltage. In this embodiment, the power conversion device 1 is described as an inverter that converts DC power through the power module 2 and outputs three-phase AC. The structure of the power conversion device 1 is not limited to this.

[0014] <Power conversion device 1> like Figure 1As shown, the power conversion device 1 includes a plurality of power modules 2, a substrate 3, and a substrate holding member 4. The power module 2 has a semiconductor chip 10 ( Figure 1 (not shown in the figure) and are arranged side by side. Figure 5 As shown, each power module 2 is in the shape of a rectangular parallelepiped having a first surface 2a, a second surface 2b opposite to the first surface 2a, and four surfaces surrounding the first surface 2a and the second surface 2b, namely, a third surface 2c, a fourth surface 2d, a fifth surface 2e, and a sixth surface 2f. Figure 1 As shown, the substrate holding member 4 is arranged on the second surface 2b of the plurality of power modules 2 in a spaced manner and is electrically connected to the module terminal 2g of each of the plurality of power modules 2. The substrate holding member 4 is arranged in the gap between the substrate 3 and the plurality of power modules 2 and holds the substrate 3. The substrate holding member 4 is composed of an insulating resin member.

[0015] The substrate 3 is not limited to one, and in the present embodiment, the power conversion device 1 has two substrates 3. The two substrates 3 are a control circuit substrate 3a and a drive circuit substrate 3b. A plurality of power modules 2 are arranged side by side in a direction parallel to the third surface 2c. In the figure, the direction parallel to the third surface 2c is set as the X direction. The module terminal 2g protrudes from at least one of the second surface 2b of the power module 2, the third surface 2c of the power module 2, and the fourth surface 2d on the opposite side of the third surface 2c, and then extends in the direction of the substrate 3. Figure 4 As shown, the portion of the module terminal 2g extending in the direction of the substrate 3 passes through the through hole 4a of the substrate holding member 4. In the present embodiment, the module terminal 2g is provided on each of the third surface 2c and the fourth surface 2d of the power module 2, and is connected to the drive circuit substrate 3b. The configuration surface of the power module 2 on which the module terminal 2g is configured, the number of the module terminals 2g, and the substrate 3 connected to the module terminals 2g are not limited thereto. In the present embodiment, the substrate 3 is held by the connection terminal 4c of the substrate holding member 4. The connection terminal 4c holding the substrate 3 will be described in detail later.

[0016] By configuring as described above, the substrate 3 is held by the substrate holding member 4 arranged at the interval between the substrate 3 and the plurality of power modules 2, so that the vibration resistance of the substrate 3 and the components mounted on the substrate 3 can be ensured. Since there is no need to provide a gap between the power modules 2 arranged side by side to hold the substrate 3, the power conversion device 1 can be miniaturized and cost-effective. Since the module terminal 2g passes through the through hole 4a of the substrate holding member 4 and is connected to the substrate 3, the module terminal 2g can be shortened, so that the power conversion device 1 can be miniaturized and cost-effective. In addition, since the module terminal 2g is shortened, the distance between the power module 2 and the drive circuit can be shortened, so that the controllability of the power module 2 can be improved.

[0017] The module terminal 2g is connected to the drive circuit substrate 3b at the through hole 3g provided on the drive circuit substrate 3b. In the present embodiment, the through hole 4a is in a funnel shape in which the opening on one side of the plurality of power modules 2 is larger than the opening on the one side of the drive circuit substrate 3b. By configuring as described above, there is no need for an additional guide component for guiding the module terminal 2g to the through hole 3g when connecting the module terminal 2g to the through hole 3g, and thus the distance between the power module 2 and the drive circuit substrate 3b can be shortened. The distance between the power module 2 and the drive circuit substrate 3b is shortened, and thus the distance between the power module 2 and the drive circuit can be shortened, and thus the controllability of the power module 2 can be improved. In addition, the height of the power conversion device 1 can be reduced, and thus the power conversion device 1 can be miniaturized.

[0018] <Cooler 9, frame 6, film capacitor 5> like Figure 1 As shown, the power conversion device 1 further includes a cooler 9, a frame 6, and a film capacitor 5. The cooler 9 has a cooling surface 9a, and the cooling surface 9a is thermally connected to the first surface 2a of the plurality of power modules 2. Figure 3 As shown in FIG. 1 , the cooler 9 has a flow path 9b through which the refrigerant flows. A cooling surface 9a is formed on a cover 9c covering the flow path 9b. For example, water or ethylene glycol liquid is used as the refrigerant. Figure 1 The device shown has a cooler 9 and a configuration surface 6a on the same side as the side where the cooling surface 9a is provided. In the present embodiment, the cooling surface 9a and the configuration surface 6a are provided on the same plane. The frame 6 is made of a metal such as aluminum by die casting. The cover 9c is, for example, a forged aluminum alloy. The film capacitor 5 is electrically connected to the plurality of power modules 2 via the bus bar 7. The film capacitor 5 is adjacent to the plurality of power modules 2 and is thermally connected to the configuration surface 6a of the frame 6. The plurality of power modules 2 and the film capacitor 5 are cooled by the cooler 9. The bus bar 7 is connected to the power terminal 2h of the power module 2, for example, by welding.

[0019] The configuration surface 6a has a sleeve fixing portion 6b, to which the fixing sleeve 4b of the substrate holding member 4 is fixed. The sleeve fixing portion 6b is provided at a portion of the configuration surface 6a other than the cooling surface 9a and the projection portion of the configuration surface 6a formed by projecting the film capacitor 5 and the busbar 7 onto the configuration surface 6a. The fixing method of the fixing sleeve 4b and the sleeve fixing portion 6b is, for example, screw fastening. By configuring as described above, the substrate holding member 4 holding the substrate 3 is fixed to a portion of the configuration surface 6a other than the cooling surface 9a and the projection portion of the configuration surface 6a formed by projecting the film capacitor 5 and the busbar 7 onto the configuration surface 6a, so that there is no need to provide the sleeve fixing portion 6b between the power modules 2 arranged side by side, the cooling surface 9a having the flow path portion 9b disposed inside, and between the power module 2 and the film capacitor 5. Since there is no need to provide the sleeve fixing portion 6b between the power modules 2 arranged side by side, the cooling surface 9a, and between the capacitor module 2 and the film capacitor 5, the power conversion device 1 can be miniaturized and cost-effective. Since the substrate 3 is held by the substrate holding member 4 , the vibration resistance of the substrate 3 and the components mounted on the substrate 3 can be ensured.

[0020] Furthermore, when viewed from a direction perpendicular to the second surfaces 2b of the plurality of power modules 2, the substrate 3 is provided at a position that does not overlap with the film capacitor 5, which is a tall component, so that extra space is eliminated, and the height of the power conversion device 1 can be reduced. In addition, the fixing portion of the substrate holding member 4 is not limited to the arrangement surface 6a of the frame 6. For example, in the case where the power module 2 is configured such that the semiconductor chip 10 is accommodated in a housing and the gel is filled inside the housing, a structure in which a sleeve fixing portion is provided on the inner side of the housing and on the side of the substrate holding member 4 may be adopted.

[0021] <Power supply module 2> The power module 2 is described below. Figure 5 In the figure, a semiconductor chip 10 is indicated by a dotted line. The number of semiconductor chips 10 in a power module 2 is not limited to one, and the power module 2 may also have a plurality of semiconductor chips 10. The power module 2 converts direct current into three-phase alternating current. In this embodiment, Figure 1 As shown, the power conversion device 1 includes three power modules 2 corresponding to each. The number of power modules 2 included in the power conversion device 1 is not limited thereto. The number of power modules 2 can be two or more than four. The first surface 2a of the power module 2 is thermally connected to the cooling surface 9a via a bonding member (not shown). The bonding member is, for example, solder.

[0022] The arrangement of the plurality of power modules 2 is such that each of the power modules 2 is arranged side by side in the same direction in the X direction which is a direction parallel to the third surface 2c. By configuring as described above, since the plurality of power modules 2 are arranged in the same direction, the power conversion device 1 can be miniaturized. In addition, when a plurality of power modules 2 are further provided, the power modules 2 may be arranged in two rows in an aligned manner.

[0023] The module terminal 2g and the power terminal 2h are made of copper with low resistivity and excellent conductivity, for example. The module terminal 2f is a terminal related to the drive of the power module 2. The power terminal 2h is a terminal related to the input and output of the power module 2. For example, one power terminal 2h is connected to a DC power supply, and the other power terminal 2h is connected to a motor as a load. In the present embodiment, one power terminal 2h is connected to a film capacitor 5 via a bus 7, and is connected to a DC power supply (not shown) via the film capacitor 5. The film capacitor 5 smoothes the power input to the power module 2.

[0024] The power module 2 is formed by transfer molding. Therefore, the semiconductor chip 10 is covered with a molding resin. By configuring as described above, the semiconductor chip 10 can be easily protected from the outside. In addition, although it is difficult to hold the substrate 3 in the power module 2 formed by transfer molding, since a substrate holding member 4 for holding the substrate 3 is provided in the present application, the vibration resistance of the substrate 3 can be improved even if the substrate 3 is not held in the power module 2. In addition, the power module 2 is not limited to a structure formed by transfer molding, but may be a structure in which the semiconductor chip 10 is housed in a housing and gel is filled in the interior of the housing. Even in a structure in which the semiconductor chip 10 is enclosed by gel, the vibration resistance of the substrate 3 can be improved.

[0025] <Substrate holding member 4> use Figure 4The structure for holding the substrate 3 in the substrate holding member 4 is described. The substrate holding member 4 has a connection terminal 4c that is mechanically connected to the substrate 3. The connection terminal 4c has: an embedded portion 4c1, the embedded portion 4c1 is embedded in the substrate holding member 4; and an extension portion 4c2, the extension portion 4c2 extends along the direction of the substrate 3 and is connected to the substrate 3. The substrate 3 is held by the substrate holding member 4 through the connection terminal 4c. The connection terminal 4c is made of metal, for example. In the present embodiment, both the control circuit substrate 3a and the drive circuit substrate 3b are connected to a plurality of connection terminals 4c and held by the substrate holding member 4. In addition, in the present embodiment, the connection terminal 4c is formed in a U-shape, the bottom of the U is the embedded portion 4c1, and the extension portion 4c2 is formed at one end and the other end of the connection terminal 4c. The control circuit substrate 3a is connected to one end of the connection terminal 4c at a portion where the control circuit substrate 3a and the substrate holding member 4 overlap when viewed from a direction perpendicular to the second surface 2b of the plurality of power modules 2. The drive circuit substrate 3b is connected to the other end of the connection terminal 4c at a portion where the drive circuit substrate 3b overlaps with the substrate holding member 4 when viewed from a direction perpendicular to the second surface 2b of the plurality of power modules 2. The substrate 3 and the connection terminal 4c are connected, for example, by soldering. The connection terminal 4c is provided on the substrate holding member 4 when the substrate holding member 4 is molded by resin, for example.

[0026] By configuring as described above, it is possible to use the connection terminal 4c as a structural member for fixing the substrate 3 to the substrate holding member 4 without using a fastening member such as a bolt. When the substrate 3 is fixed by the connection terminal 4c, the substrate 3 can be fixed with a smaller area than by bolts, and thus the power conversion device 1 can be miniaturized. In addition, when the substrate 3 is fixed by the connection terminal 4c, the substrate 3 can be fixed in a shorter time in terms of manufacturing than by bolts, and thus the assembly man-hours and the investment amount of assembly equipment during manufacturing and assembly can be reduced, thereby improving the productivity of the power conversion device 1.

[0027] The effect of the above structure is further described. In order to improve the vibration resistance of the substrate 3, it is preferred to ensure the rigidity of the substrate 3. In order to ensure the rigidity of a single substrate, it is required to improve the second moment of cross section shown by mathematical formula (1). Specifically, it is required to improve the second moment of cross section of the substrate 3 in the long side direction of the substrate 3, that is, the X direction. The calculation formula of the second moment of cross section I in the rectangular cross section of the substrate 3 is expressed in mathematical formula (1). I=b×h 3 / 12…(1) In the mathematical formula (1), the width of the rectangle is set to b, and the height is set to h. In a structure having a rectangular cross section, the second moment of cross section can be increased by increasing the width b and the height h. As a solution to increase the second moment of cross section, a method of increasing the thickness of the substrate 3 can be considered, but if the thickness of the substrate 3 is set to a generally uncirculated thickness, it will become the main reason for the increase in the cost of the substrate 3.

[0028] In order to ensure the rigidity of the substrate 3, it is required to suppress the deflection of the substrate 3. The calculation formula of the deflection δ of the center portion of the substrate 3 is expressed in Mathematical Formula (2). δ=w×l 4 / (384×E×I)…(2) In mathematical formula (2), the equally distributed load (the dead weight of the substrate 3) is set to w, the length of the beam (the length of the portion in the long side direction of the substrate 3) is set to l, the Young's modulus is set to E, and the second moment of area is set to I.

[0029] The length l of the beam depends on the size of the electrical components and the size of the circuit installed on the substrate 3, so it is difficult to reduce the length l of the beam. It is difficult to increase the second moment of section I in the above manner. Therefore, the length l of the beam and the second moment of section I in the numerical sequence (2) are limited in the structure of the present application.

[0030] In addition to increasing the thickness of the substrate 3, it is also conceivable to fix the substrate 3 to the substrate holding member 4 at multiple locations with bolts and set the substrate 3 and the substrate holding member 4 as a single rigid member to increase the second moment of area. However, if the number of fixing portions implemented by bolts is increased, it may lead to an increase in the size of the power conversion device 1, an increase in the number of assembly man-hours during manufacturing and assembly, and an increase in the investment amount of assembly equipment.

[0031] In the structure of the present application, the connection terminal 4c is provided on the substrate holding member 4 formed of resin, and the substrate 3 is fixed by the connection terminal 4c, so that the bending of the substrate 3 can be suppressed by the connection terminal 4c as a structural component. In the present embodiment, the substrate holding member 4 has a plurality of connection terminals 4c, and the plurality of connection terminals 4c are arranged side by side in the long side direction of the substrate 3, so that the bending of the substrate 3 can be further suppressed. Since the bending of the substrate 3 is suppressed, the vibration resistance of the substrate 3 and the components mounted on the substrate 3 can be improved.

[0032] In the present embodiment, the connection terminal 4c is a circuit wiring. The connection terminal 4c is made of, for example, copper having excellent conductivity. For example, the connection terminal 4c is connected to the substrate 3 by soldering, and the connection terminal 4c is used as the wiring of the circuit of the power conversion device 1. Since the connection terminal 4c can be used as the wiring of the circuit, the wiring pattern on the substrate 3 can be reduced, and thus the power conversion device 1 can be miniaturized.

[0033] In the present embodiment, the power conversion device 1 has a plurality of substrates 3, the connection terminal 4c is mechanically connected to the plurality of substrates 3, and the portion of the connection terminal 4c is a circuit wiring. In the case where the power conversion device 1 is an inverter, the substrate used for the inverter is roughly divided into two functions: a control circuit portion and a drive circuit portion. In the case where a substrate for a control circuit and a substrate for a drive circuit are prepared separately and each substrate is connected by a connector and a harness, the cost of the connector and the harness will increase. The control circuit portion and the drive circuit portion can be set on one substrate without distinguishing between the substrate for the control circuit and the substrate for the drive circuit, so as to reduce the cost of the connector and the harness. In the case where the control circuit portion and the drive circuit portion are set on one substrate, since the size of the substrate becomes larger, the substrate is arranged above the component with a high height to prevent the high electrical component (such as the film capacitor 5) from interfering with the substrate. In this case, an extra space is formed between the component with a low height (such as the power module 2) and the substrate.

[0034] In the present embodiment, the power conversion device 1 has a control circuit substrate 3a and a drive circuit substrate 3b as a plurality of substrates 3. The number of the plurality of substrates 3 is not limited to two. The control circuit substrate 3a and the drive circuit substrate 3b are mechanically and electrically connected by the connection terminal 4c provided on the substrate holding member 4, so that it is not necessary to set the substrate above the high electrical component, but the control circuit substrate 3a and the drive circuit substrate 3b are arranged in the area of ​​the low electronic component around the high electrical component. Since the control circuit substrate 3a and the drive circuit substrate 3b are arranged around the high electrical component, the redundant space around the high electrical component can be eliminated, so the power conversion device 1 can be miniaturized. In addition, there is no need for a connector and a wiring harness for connecting the substrates of both sides, so the power conversion device 1 can be miniaturized and low-cost.

[0035] In this embodiment, when viewed from a direction perpendicular to the second surfaces 2b of the plurality of power modules 2, at least a portion of the plurality of substrates 3 are arranged to overlap. Figure 1 As shown, the power conversion device 1 includes a control circuit substrate 3a and a drive circuit substrate 3b as a plurality of substrates 3. The control circuit substrate 3a and the drive circuit substrate 3b overlap except for a portion of the control circuit substrate 3a connected to the connection terminal 4c. The region where the control circuit substrate 3a and the drive circuit substrate 3b overlap is not limited thereto.

[0036] By configuring as described above, when viewed from a direction perpendicular to the second surface 2b of the plurality of power modules 2, the area occupied by the substrate 3 in the power conversion device 1 can be reduced, and thus the power conversion device 1 can be miniaturized. In addition, in the present application, an example is shown in which the power conversion device 1 includes a plurality of substrates 3, but as long as the enlargement of the power conversion device 1 can be suppressed, the substrate 3 can also be a single piece. In addition, in the present application, an example is shown in which the power conversion device 1 includes a plurality of substrates 3 and the plurality of substrates 3 are arranged in an overlapping manner, but as long as the enlargement of the power conversion device 1 can be suppressed, the plurality of substrates 3 can also be arranged side by side without overlapping when viewed from a direction perpendicular to the second surface 2b of the plurality of power modules 2.

[0037] In this embodiment, an additional substrate holding member 11 is provided between the overlapping multiple substrates, and the additional substrate holding member 11 holds at least one substrate 3. In the case where the power conversion device 1 has multiple substrates 3, it can also be as follows Figure 1 The power conversion device 1 shown is provided with an additional substrate holding member 11 between the control circuit substrate 3a and the drive circuit substrate 3b which are arranged in an overlapping manner. The additional substrate holding member 11 is made of an insulating resin member. The additional substrate holding member 11 has a substrate fixing portion 11a, and the fixing portion 3h of the control circuit substrate 3a is fixed to the substrate fixing portion 11a. In addition, in the present embodiment, the substrate holding member 4 has a substrate fixing portion 4e, and the fixing portion 3h of the drive circuit substrate 3b is fixed to the substrate fixing portion 4e. These parts may also be fixed together, and the fixing method is, for example, screw fixing.

[0038] By configuring as described above, an additional substrate holding member 11 having insulation is provided between the control circuit substrate 3a and the drive circuit substrate 3b, thereby improving the insulation between the control circuit substrate 3a and the drive circuit substrate 3b. The control circuit substrate 3a is held by the substrate fixing portion 11a of the additional substrate holding member 11 in addition to being held by the connection terminal 4c, thereby further improving the vibration resistance of the control circuit substrate 3a and the components mounted on the control circuit substrate 3a. In addition, in the present embodiment, the additional substrate holding member 11 has a fixed sleeve 11c, and the fixed sleeve 11c is fixed to the sleeve fixing portion 6b together with the fixed sleeve 4b via the fixing auxiliary portion 3i of the drive circuit substrate 3b. The fixing method is, for example, screw fastening.

[0039] In the present embodiment, the power conversion device 1 includes an AC terminal 8, wherein the AC terminal 8 has an AC busbar 8a and is electrically connected to a plurality of power modules 2 via the AC busbar 8a. The AC terminal 8 is arranged on a configuration surface 6a of the plurality of power modules 2 on the side opposite to the film capacitor 5. The AC busbar 8a is connected to the power terminal 2h of the power module 2, for example, by welding. The end of the AC busbar 8a on the side opposite to the power terminal 2h is connected to, for example, a motor (not shown). Figure 4 As shown, the substrate holding member 4 is provided at least partially between the drive circuit substrate 3b as the substrate 3 and the bus bar 7 and the AC bus bar 8a. The bus bar 7 and the AC bus bar 8a are members that generate high voltage.

[0040] By configuring as described above, the substrate holding member 4 having insulating properties is provided between the bus bar 7 and the AC bus bar 8a portion that becomes a high voltage and the drive circuit member 3b, so that the insulation between the bus bar 7 and the AC bus bar 8a portion and the drive circuit substrate 3b can be ensured by the substrate holding member 4. Since the insulation between the bus bar 7 and the AC bus bar 8a portion and the drive circuit substrate 3b is ensured, the distance between the bus bar 7 and the AC bus bar 8a portion and the drive circuit substrate 3b can be shortened. Since the distance between the bus bar 7 and the AC bus bar 8a portion and the drive circuit substrate 3b can be shortened, the power conversion device 1 can be miniaturized.

[0041] At least one of a transformer, an aluminum electrolytic capacitor, and a backup transformer as a mounting component electrically connected to the power module 2 is provided on the substrate 3. Figure 6 As shown in FIG. 1 , a transformer 3c and an aluminum electrolytic capacitor 3d are provided on the drive circuit substrate 3b. Figure 7 As shown, a backup transformer 3e is provided on the control circuit board 3a. The transformer 3c and the aluminum electrolytic capacitor 3d are provided on the side of the drive circuit board 3b opposite to the power module 2 side, and the backup transformer 3e is provided on the power module 2 side of the control circuit board 3a.

[0042] The portion of the mounting component opposite to the substrate holding member is bonded to the substrate holding member via an adhesive 3f. Figure 3 As shown in FIG. 1 , the portion of the transformer 3 c and the aluminum electrolytic capacitor 3 d facing the additional substrate holding member 11 is bonded to the additional substrate holding member 11 via an adhesive 3 f. Figure 4 As shown, the portion of the standby transformer 3 e facing the additional substrate holding member 11 is bonded to the additional substrate holding member 11 via an adhesive 3 f.

[0043] By configuring as described above, the transformer 3c, the aluminum electrolytic capacitor 3d, and the standby transformer 3e are fixed to the additional substrate holding member 11 as the substrate holding member, so that the vibration resistance of the substrate 3 and the electrical components mounted on the substrate 3 can be further ensured. The vibration resistance of the substrate 3 and the electrical components mounted on the substrate 3 is further ensured, so the power conversion device 1 disclosed in the present application can be used in a power conversion device that has strict vibration resistance requirements and is rigidly connected to an automotive motor. The so-called rigid connection refers to mechanically connecting two components without a vibration absorbing material, and is a connection that does not cause deflection at the portion where the two components are connected.

[0044] like Figure 3 As shown, in this embodiment, a recess 11b is provided in the portion of the additional substrate holding member 11 facing the transformer 3c and the aluminum electrolytic capacitor 3d, and the transformer 3c and the aluminum electrolytic capacitor 3d are bonded to the bottom of the recess 11b via an adhesive 3f. Figure 4 As shown, a recess 11b is provided at the portion of the additional substrate holding member 11 facing the standby transformer 3e, and the standby transformer 3e is bonded to the bottom of the recess 11b via an adhesive 3f. By configuring as described above, the distance between the control circuit substrate 3a and the drive circuit substrate 3b can be shortened, so the power conversion device 1 can be miniaturized.

[0045] like Figure 4 As shown, the substrate holding member 4 has a plate 4d made of metal inside. The plate 4d is provided on the substrate holding member 4 when the substrate holding member 4 is molded by resin, for example. The fixed sleeve 4b and the frame 6 of the substrate holding member 4 are made of metal, and the plate 4d, the fixed sleeve 4b and the drive circuit substrate 3b as the substrate 3 are electrically connected. The potential of the frame 6 is the ground potential, and the ground potential of the plate 4d, the fixed sleeve 4b and the drive circuit substrate 3b is the same as the potential of the frame 6. The plate 4d, the fixed sleeve 4b and the grounding member of the substrate 3 are electrically connected by using, for example, a connecting terminal 4c. It is also possible to provide a connecting wiring 4f when the substrate holding member 4 is molded by resin to connect the plate 4d and the fixed sleeve 4b so as to connect the two.

[0046] By configuring as described above, it is possible to easily set a grounding pattern required for the transformer 3c connected to the drive circuit of the drive circuit substrate 3b. In addition, the plate 4d is provided between the semiconductor chip 10 of the power module 2 and the drive circuit substrate 3b and connected to the grounding, so that the plate 4d can function as a noise shielding member that blocks the noise generated when the semiconductor chip 10 is switched. Since the plate 4d functions as a noise shielding member, there is no need to newly add a noise shielding member, so the productivity of the power conversion device 1 can be improved. In addition, compared with the resin material of the substrate holding member 4, the Young's modulus of the plate 4d is higher, so the rigidity of the substrate holding member 4 can be improved. In addition, since the rigidity of the substrate holding member 4 is improved, the vibration resistance of the substrate 3 fixed to the substrate holding member 4 and the electrical components mounted on the substrate 3 can be improved.

[0047] <Installation example of the power conversion device 1> The power conversion device 1 is, for example, a device installed in a vehicle 12. The vehicle 12 has a vibration generating source 13 such as an engine, a transmission, a motor, or an e-axle. Figure 8 As shown, the frame 6 is connected to at least one rigid body of the engine, transmission, motor, and e-axle, which are the vibration generating sources 13 in the vehicle 12. Figure 8 In the figure, the frame 6 is a portion indicated by a dotted line. If the power conversion device 1 is configured as described above, the vibration resistance of the power conversion device 1 can be ensured even if the frame 6 of the power conversion device 1 is rigidly connected to the vibration source 13 of the vehicle 12 having strict vibration resistance requirements. In addition, whether the power module 2 is a transfer molded structure or a gel-sealed structure, the vibration resistance of the power conversion device 1 can be ensured in the state where the frame 6 of the power conversion device 1 is rigidly connected to the vibration source 13 of the vehicle 12 having strict vibration resistance requirements.

[0048] As described above, the power conversion device 1 of the first embodiment includes: a plurality of rectangular power modules 2 having semiconductor chips 10 and arranged side by side, wherein the power modules 2 have a first surface 2a, a second surface 2b on the opposite side of the first surface 2a, and four surfaces surrounding the first surface 2a and the second surface 2b; a substrate 3, wherein the substrate 3 is arranged on the second surfaces 2b of the plurality of power modules 2 in a spaced manner and is electrically connected to the module terminals 2g of each of the plurality of power modules 2; and a substrate holding member 4, wherein the substrate holding member 4 is arranged at intervals between the substrate 3 and the plurality of power modules 2, and is provided for holding the substrate 3 in place. The power conversion device 1 is made of an insulating resin member, and the plurality of power modules 2 are arranged in parallel in a direction parallel to the third surface 2c. The module terminal 2g extends in the direction of the substrate 3 after protruding from at least one of the second surface 2b, the third surface 2c, and the fourth surface 2d on the opposite side of the third surface 2c, and the portion of the module terminal 2g extending in the direction of the substrate 3 passes through the through hole 4a of the substrate holding member 4. Therefore, the substrate 3 is held by the substrate holding member 4 arranged in the interval between the substrate 3 and the plurality of power modules 2, so that the vibration resistance of the substrate 3 and the components mounted on the substrate 3 can be ensured. Since there is no need to provide a gap between the power modules 2 arranged in parallel to hold the substrate 3, the power conversion device 1 can be miniaturized and cost-effective. Since the module terminal 2g passes through the through hole 4a of the substrate holding member 4 and is connected to the substrate 3, the module terminal 2g can be shortened, so that the power conversion device 1 can be miniaturized and cost-effective.

[0049] The arrangement surface 6a has a sleeve fixing portion 6b to which the fixing sleeve 4b of the substrate holding member 4 is fixed. When the sleeve fixing portion 6b is provided on a portion of the arrangement surface 6a other than the cooling surface 9a and the projection portion of the arrangement surface 6a formed by projecting the film capacitor 5 and the bus bar 7 onto the arrangement surface 6a, the substrate holding member 4 holding the substrate 3 is fixed to a portion of the arrangement surface 6a other than the cooling surface 9a and the projection portion of the arrangement surface 6a formed by projecting the film capacitor 5 and the bus bar 7 onto the arrangement surface 6a. Therefore, it is not necessary to provide the sleeve fixing portion 6b between the power modules 2 arranged side by side, the cooling surface 9a where the flow path portion 9b is provided inside, and between the power module 2 and the film capacitor 5. Since it is not necessary to provide the sleeve fixing portion 6b between the power modules 2 arranged side by side, the cooling surface 9a, and between the capacitor module 2 and the film capacitor 5, the power conversion device 1 can be miniaturized and cost-effective. The substrate 3 is held by the substrate holding member 4, so the vibration resistance of the substrate 3 and the components mounted on the substrate 3 can be ensured.

[0050] In the case where the through hole 4a is in a funnel shape in which the opening on the side of the plurality of power modules 2 is larger than the opening on the side of the drive circuit substrate 3b, there is no need for an additional guide member for guiding the module terminal 2g to the through hole 3g, so the distance between the power module 2 and the drive circuit substrate 3b can be shortened. Since the distance between the power module 2 and the drive circuit substrate 3b is shortened, the distance between the power module 2 and the drive circuit can be shortened, so the controllability of the power module 2 can be improved. In addition, the height of the power conversion device 1 can be reduced, so the power conversion device 1 can be miniaturized.

[0051] When the substrate 3 is held on the substrate holding member 4 by the connection terminal 4c, the connection terminal 4c can be used as a structural component for fixing the substrate 3 to the substrate holding member 4 without using a fastening member such as a bolt. When the substrate 3 is fixed by the connection terminal 4c compared with the bolt, the substrate 3 can be fixed with a smaller area, so the power conversion device 1 can be miniaturized. In addition, when the substrate 3 is fixed by the connection terminal 4c compared with the bolt, the substrate 3 can be fixed in a short time in terms of manufacturing, so the assembly man-hours and the investment amount of assembly equipment during manufacturing and assembly can be reduced, thereby improving the productivity of the power conversion device 1.

[0052] When the connection terminal 4 c is a circuit wiring, the connection terminal 4 c can be used as the circuit wiring, so the wiring pattern on the substrate 3 can be reduced, so that the power conversion device 1 can be miniaturized.

[0053] In the case where the power conversion device 1 has a plurality of substrates 3, the connection terminals 4c are mechanically connected to the plurality of substrates 3, and the portion of the connection terminals 4c is a circuit wiring, the substrates can be arranged not above the high electrical components, but in the region of the low electrical components around the high electrical components. Since the plurality of substrates 3 are arranged around the high electrical components, the redundant space around the high electrical components can be eliminated, and thus the power conversion device 1 can be miniaturized. In addition, since the connector and the wiring harness for connecting the substrates to connect the plurality of substrates 3 are not required, the power conversion device 1 can be miniaturized and cost-effective.

[0054] When at least a portion of the multiple substrates 3 are arranged overlappingly when viewed from a direction perpendicular to the second surfaces 2b of the multiple power modules 2, the area occupied by the substrates 3 in the power conversion device 1 can be reduced when viewed from a direction perpendicular to the second surfaces 2b of the multiple power modules 2, thereby miniaturizing the power conversion device 1.

[0055] An additional substrate holding member 11 is provided between the overlapping substrates 3. When the additional substrate holding member 11 holds at least one substrate 3, the insulation between the overlapping substrates 3 can be improved. At least one substrate 3 is held by the additional substrate holding member 11 in addition to the connection terminal 4c of the substrate holding member 4, so the vibration resistance of the at least one substrate 3 and the components mounted on the substrate 3 can be further improved.

[0056] When the substrate holding member 4 is provided at least partially between the drive circuit substrate 3b and the busbar 7 and the AC busbar 8a, the substrate holding member 4 having insulation is provided between the high voltage portion of the busbar 7 and the AC busbar 8a and the drive circuit substrate 3b, so that the insulation between the busbar 7 and the AC busbar 8a and the drive circuit substrate 3b can be ensured by the substrate holding member 4. Since the insulation between the busbar 7 and the AC busbar 8a and the drive circuit substrate 3b is ensured, the distance between the busbar 7 and the AC busbar 8a and the drive circuit substrate 3b can be shortened. Since the distance between the busbar 7 and the AC busbar 8a and the drive circuit substrate 3b can be shortened, the power conversion device 1 can be miniaturized.

[0057] When the portion of the mounting component facing the substrate holding member is bonded to the substrate holding member via the adhesive 3f, the mounting component is fixed to the substrate holding member, and thus the vibration resistance of the substrate 3 and the mounting component mounted on the substrate 3 can be further ensured. The vibration resistance of the substrate 3 and the mounting component mounted on the substrate 3 is further ensured, and thus the power conversion device 1 disclosed in the present application can be used in a power conversion device that has strict vibration resistance requirements and is rigidly connected to an automotive motor.

[0058] When the fixing sleeve 4b and the frame 6 of the substrate holding member 4 are made of metal and the plate 4d, the fixing sleeve 4b and the ground of the substrate 3 are electrically connected, the plate 4d, the fixing sleeve 4b and the ground of the substrate 3 become the same as the ground of the potential of the frame 6, so that the ground pattern required for the transformer 3c of the drive circuit connected to the substrate 3 can be easily set. In addition, the plate 4d is provided between the semiconductor chip 10 of the power module 2 and the substrate 3 and connected to the ground, so that the plate 4d can function as a noise shield to block the noise generated when the semiconductor chip 10 is switched. Since the plate 4d functions as a noise shield, there is no need to add a new noise shield, so the productivity of the power conversion device 1 can be improved. In addition, compared with the resin material of the substrate holding member 4, the Young's modulus of the plate 4d is higher, so the rigidity of the substrate holding member 4 can be improved. In addition, since the rigidity of the substrate holding member 4 is improved, the vibration resistance of the substrate 3 fixed to the substrate holding member 4 and the electrical components mounted on the substrate 3 can be improved.

[0059] When the frame 6 is rigidly connected to at least one of the engine, transmission, motor and e-axle which are the vibration generating source 13 in the vehicle 12, the vibration resistance of the power conversion device 1 can be ensured even if the frame 6 of the power conversion device 1 is rigidly connected to the vibration generating source 13 of the vehicle 12 which has strict vibration resistance requirements.

[0060] In addition, the present application describes various illustrative embodiments and examples, but the features, embodiments, and functions described in one or more embodiments are not limited to the application of specific embodiments, but can also be applied to the embodiments alone or in various combinations. Therefore, numerous modifications not shown in the examples are contemplated within the technical scope disclosed in the present specification, including, for example, modifications, additions, or omissions of at least one component, and also including extraction of at least one component and combination with components of other embodiments.

[0061] Hereinafter, each embodiment of the present disclosure will be summarized and described as a supplement. (Note 1) A power conversion device, comprising: A plurality of rectangular parallelepiped power modules having semiconductor chips and arranged side by side, the power modules having a first surface, a second surface opposite to the first surface, and four surfaces surrounding the first surface and the second surface, namely, a third surface, a fourth surface, a fifth surface, and a sixth surface; a substrate, the substrate being arranged on the second surfaces of the plurality of power modules at intervals and being electrically connected to a module terminal of each of the plurality of power modules; and a substrate holding member, which is arranged in the interval between the substrate and the plurality of power modules, holds the substrate, and is made of an insulating resin member, The plurality of power modules are arranged side by side in a direction parallel to the third surface, The module terminal protrudes from at least one of the second surface of the power module, the third surface of the power module, and the fourth surface on the opposite side of the third surface, and then extends in the direction of the substrate. The portion of the module terminal extending in the direction along the substrate passes through the through hole of the substrate holding member. (Note 2) The power conversion device as described in Supplementary Note 1, comprising: a cooler, the cooler having a cooling surface, the cooling surface being thermally connected to the first surfaces of the plurality of power modules; a frame having the cooler and having a placement surface on the same side as the side on which the cooling surface is provided; and a film capacitor, the film capacitor being electrically connected to the plurality of power modules via a bus bar, being adjacent to the plurality of power modules, and being thermally connected to the arrangement surface of the frame body, The arrangement surface has a sleeve fixing portion, to which a fixing sleeve of the substrate holding member is fixed. The sleeve fixing portion is provided on a portion of the arrangement surface excluding the cooling surface and a projection portion of the arrangement surface obtained by projecting the film capacitor and the bus bar onto the arrangement surface. (Note 3) The power conversion device as described in Supplement 1 or 2, wherein: The through holes are in a funnel shape in which the openings on one side of the power module are larger than the openings on one side of the substrate. (Note 4) A power conversion device as described in any one of Supplementary Notes 1 to 3, wherein: The substrate holding member has a connection terminal mechanically connected to the substrate, The connection terminal includes an embedded portion embedded in the substrate holding member and an extending portion extending along the direction of the substrate and connected to the substrate. The substrate is held by the substrate holding member via the connection terminals. (Note 5) The power conversion device as described in Supplementary Note 4, wherein: The connection terminal portion is a circuit wiring. (Note 6) The power conversion device as described in Supplementary Note 4, wherein: There are a plurality of substrates, The connecting terminal is mechanically connected to the plurality of substrates. The connection terminal portion is a circuit wiring. (Note 7) The power conversion device as described in Supplementary Note 6, wherein: When viewed from a direction perpendicular to the second surfaces of the plurality of power modules, at least a portion of the plurality of substrates are arranged to overlap. (Note 8) The power conversion device as described in Supplementary Note 7, wherein: An additional substrate holding member is provided between the overlapping plurality of substrates. The additional substrate holding member holds at least one of the substrates. (Note 9) A power conversion device as described in any one of Supplementary Notes 2 to 8, wherein: comprising an AC terminal, wherein the AC terminal has an AC bus bar and is electrically connected to the plurality of power modules via the AC bus bar, The substrate holding member is provided at least in a portion between the substrate and the bus bar and the AC bus bar. (Note 10) A power conversion device as described in any one of Supplementary Notes 1 to 9, wherein: At least one of a transformer, an aluminum electrolytic capacitor, and a backup transformer as a mounting component electrically connected to the power module is provided on the substrate. The portion of the mounting component facing the substrate holding member is bonded to the substrate holding member via an adhesive. (Note 11) A power conversion device as described in any one of Supplementary Notes 2 to 10, wherein: The substrate holding member has a plate made of metal inside, The fixed sleeve and the frame of the substrate holding member are made of metal, The plate, the fixed sleeve and the grounding member of the base plate are electrically connected. (Note 12) A power conversion device as described in any one of Appendix 2, 9, and 11, wherein: The frame is connected to at least one rigid body of an engine, a transmission, an electric motor and an e-axle (note: an electric vehicle drive motor system) which are vibration generating sources in the vehicle.

Claims

1. A power conversion device, characterized in that: include: A plurality of rectangular parallelepiped power modules having semiconductor chips and arranged side by side, the power modules having a first surface, a second surface opposite to the first surface, and four surfaces surrounding the first surface and the second surface, namely, a third surface, a fourth surface, a fifth surface, and a sixth surface; a substrate, the substrate being arranged on the second surfaces of the plurality of power modules in a spaced manner and being electrically connected to a module terminal of each of the plurality of power modules; as well as a substrate holding member, which is arranged in the interval between the substrate and the plurality of power modules, holds the substrate, and is made of an insulating resin member, The plurality of power modules are arranged side by side in a direction parallel to the third surface, The module terminal protrudes from at least one of the second surface of the power module, the third surface of the power module, and the fourth surface on the opposite side of the third surface, and then extends in the direction of the substrate. The portion of the module terminal extending in the direction along the substrate passes through the through hole of the substrate holding member.

2. The power conversion device according to claim 1, characterized in that: include: a cooler, the cooler having a cooling surface, the cooling surface being thermally connected to the first surfaces of the plurality of power modules; a frame having the cooler and having a placement surface on the same side as the side on which the cooling surface is provided; and a film capacitor, the film capacitor being electrically connected to the plurality of power modules via a bus bar, being adjacent to the plurality of power modules, and being thermally connected to the arrangement surface of the frame body, The arrangement surface has a sleeve fixing portion, to which a fixing sleeve of the substrate holding member is fixed. The sleeve fixing portion is provided on a portion of the arrangement surface excluding the cooling surface and a projection portion of the arrangement surface obtained by projecting the film capacitor and the bus bar onto the arrangement surface.

3. The power conversion device according to claim 1 or 2, characterized in that: The through holes are in a funnel shape in which the openings on one side of the power module are larger than the openings on one side of the substrate.

4. The power conversion device according to claim 1 or 2, characterized in that: The substrate holding member has a connection terminal mechanically connected to the substrate, The connection terminal includes an embedded portion embedded in the substrate holding member and an extending portion extending along the direction of the substrate and connected to the substrate. The substrate is held by the substrate holding member via the connection terminals.

5. The power conversion device according to claim 4, characterized in that: The connection terminal portion is a circuit wiring.

6. The power conversion device according to claim 4, characterized in that: There are a plurality of substrates, The connecting terminal is mechanically connected to the plurality of substrates. The connection terminal portion is a circuit wiring.

7. The power conversion device according to claim 6, characterized in that: When viewed from a direction perpendicular to the second surfaces of the plurality of power modules, at least a portion of the plurality of substrates are arranged to overlap.

8. The power conversion device according to claim 7, characterized in that: An additional substrate holding member is provided between the overlapping plurality of substrates. The additional substrate holding member holds at least one of the substrates.

9. The power conversion device according to claim 2, characterized in that: comprising an AC terminal, wherein the AC terminal has an AC bus bar and is electrically connected to the plurality of power modules via the AC bus bar, The substrate holding member is provided at least in a portion between the substrate and the bus bar and the AC bus bar.

10. The power conversion device according to claim 1 or 2, characterized in that: At least one of a transformer, an aluminum electrolytic capacitor, and a backup transformer as a mounting component electrically connected to the power module is provided on the substrate. The portion of the mounting component facing the substrate holding member is bonded to the substrate holding member via an adhesive.

11. The power conversion device according to claim 2, characterized in that: The substrate holding member has a plate made of metal inside, The fixed sleeve and the frame of the substrate holding member are made of metal, The plate, the fixed sleeve and the grounding member of the base plate are electrically connected.

12. The power conversion device according to any one of claims 2, 9 and 11, characterized in that: The frame is connected to at least one rigid body of an engine, a transmission, a motor, and an e-axle, which are vibration generating sources in the vehicle.

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