Manufacturing method and application of packaging carrier plate with small printing ink window structure

Abstract

The invention relates to a manufacturing method and application of a packaging carrier plate with an ink small window structure, and the method comprises the following steps: 1, providing a packaging device carrier plate which comprises a substrate and copper layers arranged on the two outer side surfaces of the substrate; covering an ink layer on the outer surface of the copper layer, and then leveling; step 2, exposure and development are carried out, a trapezoidal groove with a large outer side and a small inner side is formed in the ink layer, and an exposure device for exposure is mixed wavelength exposure equipment; 3, laser ablation is conducted, specifically, residual feet at the bottom are removed, so that a vertical windowing groove wall is formed; and fourthly, plasma cleaning is conducted. According to the method, the mixed wavelength exposure equipment is adopted, a slope small window is firstly formed in the ink layer 30, reverse cutting is avoided, ink is made into a slope shape, and then low-cost, high-quality and high-yield machining of the ink small window is achieved in a laser micro-modification mode. And the method has a wide processing window and can be used for stable production. The device is high in practicability and has relatively high popularization significance.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit boards, and in particular to a method for manufacturing a packaging carrier board with an ink small window structure and an application thereof. Background Art

[0002] There are often small ink windows on package carriers and COB boards (Chip on board, i.e. boards with chip packages on them, PCBs with bare chips directly mounted locally). With the development of high integration of technology chips, the requirements for small ink windows on package carriers and COB boards are getting higher and higher. Specifically, the requirements for small ink windows have reached the level of 60μm or 50μm ink windows under 110μm pitch design; this places extremely high demands on materials, equipment and process control. Under the current circumstances, general manufacturers choose the process of ink covering-leveling-exposure-development to open small ink windows. On the basis of this process, high-resolution inks, high-resolution UV exposure equipment, fine development equipment and matching chemicals are required to achieve this. However, the overall cost of high-resolution inks, high-resolution UV exposure equipment, fine development equipment and matching chemicals is very high, and the manufacturing and control difficulties are very large. Summary of the invention

[0003] Based on this, it is necessary to provide a method for manufacturing a packaging carrier with a small ink window structure and its application in view of the deficiencies in the prior art.

[0004] A method for manufacturing a packaging carrier with a small ink window structure, comprising the following steps:

[0005] Step 1, providing a sealing device carrier, the sealing device carrier comprising a substrate and copper layers arranged on two outer sides of the substrate; covering the outer surface of the copper layer with an ink layer, and then leveling it;

[0006] Step 2, exposure and development, exposing and developing the ink layer, forming a trapezoidal groove with a larger outer side and a smaller inner side on the ink layer, the bottom of the groove is the copper layer, and the outer bottom of the groove retains a bottom residual foot to form a slope; in addition, the exposure device used for exposure is a mixed wavelength exposure device;

[0007] Step 3: Laser ablation to remove the bottom residual foot to form a vertical window groove wall;

[0008] Step 4: Plasma cleaning: a clean ink window is formed after plasma cleaning.

[0009] Furthermore, the mixed light of the mixed exposure device is a mixture of light with an intensity of 25%-50% at a wavelength of 365nm, 50%-80% at a wavelength of 385nm, and 100% at a wavelength of 405nm, and the exposure energy is 200-220mj.

[0010] A method for cleaning micropores blocked by ink, comprising the following steps:

[0011] Step 1: Provide a sealing device carrier, which includes a substrate and a copper layer arranged on the two outer sides of the substrate; the packaging carrier is also provided with micropores, and the outer surface of the copper layer is covered with an ink layer and then flattened, and the ink is blocked in the micropores.

[0012] Step 2, exposure and development, developing the exposed product to form a trapezoidal groove with a larger outside and a smaller inside on the ink layer outside the hole, the bottom of the groove corresponds to the micropore blocked by the ink, and the exposure device used for exposure is a mixed wavelength exposure device;

[0013] Step 3: Laser ablation to remove the bottom residual foot so that the side wall of the ink window forms a vertical window groove wall;

[0014] Step 4: Secondary laser ablation, using CO2 laser ablation and CCD visual alignment, to burn and etch the micropores to remove the ink in the micropores.

[0015] Furthermore, the mixed light of the mixed exposure device is a mixture of light with an intensity of 25%-50% at a wavelength of 365nm, 50%-80% at a wavelength of 385nm, and 100% at a wavelength of 405nm, and the exposure energy is 200-220mj.

[0016] Furthermore, a hole position detection step is included between step three and step four, using an optical detection device to detect the vertical alignment accuracy of the microhole and the ink window; step four is executed after accurate alignment is detected.

[0017] Furthermore, in step 2, double-sided exposure and development are performed to form grooves at both ends of the microhole.

[0018] Furthermore, after step 2, secondary exposure and development are performed to further remove the ink in the micropores 11a, reduce the thickness of the ink in the pores, and then perform laser ablation.

[0019] In summary, the present invention uses a mixed wavelength exposure device to first open a small slope window on the ink layer to avoid reverse cutting, make the ink into a slope, and then use laser micro-modification to achieve low-cost, high-quality, and high-yield processing of the small ink window. In addition, the processing window of this method is very wide and can be stably produced. The present invention is highly practical and has a strong promotion significance. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 The present invention is a schematic flow chart of a method for manufacturing a packaging carrier with a small ink window structure and its application.

[0021] Figure 2 for Figure 1 A schematic diagram of the application process of the production method; DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0023] like Figure 1 As shown, it is a method for manufacturing a packaging carrier with a small ink window structure of the present invention and its application, which is used to open a small window on the ink layer 30 on the carrier, and specifically includes the following steps:

[0024] Step 1: providing a sealing device carrier, the sealing device carrier comprising a substrate 10 and a copper layer 20 disposed on two outer sides of the substrate 10; covering the outer surface of the copper layer 20 with an ink layer 30, and then flattening;

[0025] Step 2, exposure and development, the ink layer 30 is exposed and developed, and a groove 31 with a large outer side and a small inner side in a trapezoidal shape is formed at the position of the small window on the ink layer 30, and the bottom of the groove 31 is the copper layer 20; in this embodiment, the exposure device used for exposure is a mixed wavelength exposure device. When ordinary AUS308 ink is used, the mixed wavelength exposure is used for testing, and the parameters are set as 25%-50% intensity of 365nm wavelength; 50%-80% intensity of 385nm wavelength, 100% intensity of 405nm wavelength, and when the exposure energy is set to 200-220mj, the ink small window can reach the limit of 55μm, and the bottom residual foot 32 is retained to form a slope;

[0026] Step 3: laser ablation to remove the bottom residual foot 32 to form a vertical window opening groove wall, so that the window opening diameter can eventually form an ink small window 33 within 65 μm;

[0027] Step 4: plasma cleaning: finally, a clean ink window 33 is formed after plasma cleaning.

[0028] like Figure 2 As shown, it is a method for cleaning micropores blocked by ink of the present invention, which is an application of the method for making a packaging carrier with a small window structure using ink, and specifically includes the following steps:

[0029] Step 1: Provide a sealing device carrier, which includes a substrate 10a and a copper layer 20a arranged on both outer sides of the substrate 10a; the packaging carrier is also provided with micropores 11a, and the outer surface of the copper layer 20a is covered with an ink layer 30a and then flattened; the ink is blocked in the micropores 11a.

[0030] Step 2: Double-sided exposure and development. The exposed product is developed to form a trapezoidal groove 31a on the ink layer 30a outside the hole, which is larger on the outside and smaller on the inside. The bottom of the groove 31a corresponds to the micropore 11a blocked by the ink. In this embodiment, the exposure device used for exposure is a mixed wavelength exposure device. When using ordinary AUS308 ink, a mixed wavelength exposure test is performed. The parameters are set to 25%-50% intensity of 365nm wavelength; 50%-80% intensity of 385nm wavelength, 100% intensity of 405nm wavelength. When the exposure energy is set to 200-220mj, the ink small window can be opened to the limit of 55μm, and the bottom residual foot 32a is retained to form a slope.

[0031] Step 3: laser ablation to remove the bottom residual foot 32a to form a vertical window groove wall;

[0032] Step 4: hole position detection: use an optical detection device to detect the hole position of the microhole 11a to detect whether the microhole 11a and the ink window 33a are completely corresponding. If not, the copper layer 20a outside the hole will be exposed during the detection process, which can improve the alignment accuracy. In this embodiment, the alignment device can be a CCD visual alignment device.

[0033] Step 5: Secondary laser ablation: when the opening of the micropore 11a completely corresponds to the ink window 33a, CO2 laser ablation and CCD visual alignment are used to burn and etch the micropore 11a to clean out the ink in the micropore 11a.

[0034] In addition, when the plate is thick, double-sided etching is used. Furthermore, secondary exposure and development can be used to further remove the ink in the micropores 11a, reduce the thickness of the ink in the pores, and then ablate to improve efficiency and cleanliness.

[0035] As electronic products develop in the direction of "light, thin, and small", circuit boards are also developing in the direction of high density, microporation, and high difficulty. For some micropores that do not need to be plugged with ink, the ink will be blocked in the hole when the ink layer 30 is applied. Due to the need to meet the window size and surface appearance of the surface, and to control the ink side erosion, and simple development cannot be over-processed, the ink in the hole on the carrier cannot be removed by development. The use of a simple physical processing method of laser burning to remove the ink residue in the hole has the problem of low alignment, and it is difficult to achieve accurate removal. In the present invention, the small ink window 33a is opened first, which not only reduces the ink thickness, which is beneficial to the subsequent laser ablation, but also can be used to compare the position of the micropore 11a to ensure that accurate alignment can be achieved during subsequent laser ablation.

[0036] In summary, the present invention uses a mixed wavelength exposure device to first open a small slope window on the ink layer 30 to avoid reverse cutting, make the ink into a slope, and then use laser micro-modification to achieve low-cost, high-quality, and high-yield processing of the small ink window. In addition, the processing window of this method is very wide and can be stably produced. The present invention is highly practical and has a strong promotion significance.

[0037] The above-mentioned embodiments only express two implementation modes of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent of the present invention. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A method for manufacturing a packaging carrier with a small ink window structure, characterized in that: The steps include: Step 1, providing a sealing device carrier, the sealing device carrier comprising a substrate and copper layers arranged on two outer sides of the substrate; covering the outer surface of the copper layer with an ink layer, and then leveling it; Step 2, exposure and development, exposing and developing the ink layer, forming a trapezoidal groove with a larger outer side and a smaller inner side on the ink layer, the bottom of the groove is the copper layer, and the outer bottom of the groove retains a bottom residual foot to form a slope; in addition, the exposure device used for exposure is a mixed wavelength exposure device; Step 3: Laser ablation to remove the bottom residual foot to form a vertical window groove wall; Step 4: Plasma cleaning: a clean ink window is formed after plasma cleaning.

2. The method for manufacturing a packaging carrier with a small ink window structure as claimed in claim 1, characterized in that: The mixed light of the mixed exposure device is a mixture of 25%-50% intensity of 365nm wavelength, 50%-80% intensity of 385nm wavelength, and 100% intensity of 405nm wavelength, and the exposure energy is 200-220mj.

3. A method for cleaning micropores blocked by ink, characterized in that: The steps include: Step 1: Provide a sealing device carrier, which includes a substrate and a copper layer arranged on the two outer sides of the substrate; the packaging carrier is also provided with micropores, and the outer surface of the copper layer is covered with an ink layer and then flattened, and the ink is blocked in the micropores. Step 2, exposure and development, developing the exposed product to form a trapezoidal groove with a larger outside and a smaller inside on the ink layer outside the hole, the bottom of the groove corresponds to the micropore blocked by the ink, and the exposure device used for exposure is a mixed wavelength exposure device; Step 3: Laser ablation to remove the bottom residual foot so that the side wall of the ink window forms a vertical window groove wall; Step 4: Secondary laser ablation, using CO2 laser ablation and CCD visual alignment, to burn and etch the micropores to remove the ink in the micropores.

4. The method for cleaning micropores clogged with ink as claimed in claim 3, characterized in that: The mixed light of the mixed exposure device is a mixture of 25%-50% intensity of 365nm wavelength, 50%-80% intensity of 385nm wavelength, and 100% intensity of 405nm wavelength, and the exposure energy is 200-220mj.

5. The method for cleaning micropores clogged with ink as claimed in claim 3, characterized in that: A hole position detection step is also included between step three and step four, using an optical detection device to detect the vertical alignment accuracy of the microhole and the ink window; step four is executed after accurate alignment is detected.

6. The method for cleaning micropores clogged with ink as claimed in claim 3, characterized in that: In step 2, double-sided exposure and development are performed to form grooves at both ends of the microhole.

7. The method for cleaning micropores clogged with ink as claimed in claim 3, characterized in that: After step 2, secondary exposure and development are performed, followed by laser ablation.

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