Automatic machining method of 8CCD punching machine

Abstract

The invention discloses an automatic machining method of an 8CCD punching machine. The precise positioning CCD cameras are respectively arranged above and below the PCB, and the precise positioning CCD cameras are respectively used for identifying and positioning the upper-layer target and the lower-layer target of the PCB, so that the layer deviation problem between the upper layer and the lower layer of the PCB can be identified while the punching position of the PCB is compensated; the situation that the PCB is scrapped after the PCB with the layer deviation situation is punched is avoided, the rejection rate is effectively reduced, and therefore the overall production cost is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of automatic production and processing of circuit boards, and in particular to an automatic processing method of an 8CCD punching machine. Background Art

[0002] After completing the etching work of the inner layer of the PCB board, a PE punching machine is needed to press-fit positioning holes or rivet holes. When punching, the punching machine needs to grab the target for punching first. When punching the PCB board, since there are several targets on the PCB board, the target of the PCB board is generally positioned by a CCD camera set above, and then the PCB board is punched accordingly. However, due to the problem of misalignment of the front and back graphics during the processing of the PCB board, the existing technology cannot detect the CORE layer deviation problem in time, and can only be detected by an X-RAY target shooting machine after pressing and punching. Therefore, when the CORE layer deviation problem occurs, the entire PCB board will be scrapped. The more layers of the PCB board are superimposed, the higher the scrap rate.

[0003] Therefore, the prior art has defects and needs to be improved. Summary of the invention

[0004] The purpose of the present invention is to overcome the deficiencies of the prior art and provide an automatic processing method for an 8CCD punching machine.

[0005] The technical solution of the present invention is as follows: an automatic processing method of an 8CCD punching machine is provided, comprising the following steps:

[0006] Step 1: Place the PCB board with inner layer etching completed into the punching machine;

[0007] Step 2: Position and adjust the PCB board through the automatic pre-alignment device;

[0008] Step 3: After the positioning and adjustment of the PCB board is completed, the pre-alignment pressing plate device is started, and the pressing plate is moved downward and pressed against the PCB board;

[0009] Step 4: The automatic pre-alignment device moves the pre-alignment camera above the PCB board to capture the image positioning information of the two targets on the PCB board;

[0010] Step 5: The lower suction cup of the pre-alignment device releases the PCB board, and the mobile transport mechanism of the automatic punching device rises and adsorbs and fixes the lower surface of the PCB board, and then the PCB board is sent to the precise positioning automatic punching device through the mobile transport mechanism;

[0011] Step 6: Precisely locate the position of the PCB board, identify and locate the targets on the upper and lower surfaces of the PCB board, compensate for the deviation value, and then perform punching processing;

[0012] Step 7: After punching is completed, the upper pressing plate cylinder of the automatic punching device drives the upper pressing plate to rise, so that the upper pressing plate leaves the board surface of the PCB board;

[0013] Step 8: The discharge conveying mechanism of the discharge device adsorbs the lower surface of the PCB board from below, and then sends the PCB board out.

[0014] Furthermore, the specific steps of step 2 are:

[0015] Step 2.1: When the punching machine conveying device senses the PCB board, the stopper in front of the automatic pre-alignment device automatically rises, and the conveying device automatically conveys the PCB board to the automatic pre-alignment device after centering the PCB board;

[0016] Step 2.2: When the PCB board approaches the stopper, the transportation of the PCB board is stopped, and the lower suction cup of the automatic pre-alignment device adsorbs and positions the lower surface of the PCB board;

[0017] Step 2.3: The automatic pre-alignment device moves the positioning pins according to the input specifications and dimensions of the PCB board to adjust the pre-alignment camera to a position consistent with the specifications and dimensions of the PCB board;

[0018] Step 2.4: The automatic pre-alignment device moves the PCB to the set center position through the conveying mechanism according to the input data of the distance between the targets and the distance from the target to the edge of the PCB.

[0019] Furthermore, in the step 2.4, the conveying mechanism moves the PCB board to the center position between the light sources on both sides of the pre-alignment table of the automatic pre-alignment device.

[0020] Furthermore, the specific steps of step 6 are:

[0021] Step 6.1: Adjust the direction of the PCB board through the X, Y, and θ adjustment mechanisms so that the eight targets on the front of the PCB board are within the range of the precision positioning CCD camera;

[0022] Step 6.2: The upper pressing plate driving cylinder of the automatic punching device drives the upper pressing plate to move downward and press it against the PCB board;

[0023] Step 6.3: The automatic punching device calculates the actual compensation value according to the positions of the upper target and the lower target captured by the precision positioning CCD camera, and automatically compensates through the X, Y, and θ adjustment mechanisms. After the 8 captured target positions are centered, punching begins and the calculated compensation value is recorded in the data table.

[0024] By adopting the above scheme, the present invention provides precision positioning CCD cameras above and below the PCB board, respectively, and uses the precision positioning CCD cameras to identify and locate the upper target and the lower target of the PCB board respectively, so that the layer deviation problem between the upper and lower layers of the PCB board can be identified while compensating for the punching position of the PCB board, thereby avoiding the situation where the PCB board is scrapped due to punching processing on the PCB board with layer deviation, effectively reducing the scrap rate, and thereby reducing the overall production cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the structure of the present invention.

[0026] Figure 2 It is a bottom view of the present invention. DETAILED DESCRIPTION

[0027] The present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0028] See also Figure 1 , Figure 2 The present invention provides an automatic processing method of an 8CCD punching machine, comprising the following steps:

[0029] Step 1: Place the PCB board with inner layer etching completed into the punching machine 1.

[0030] Step 2: Use the automatic pre-alignment device 2 to position and adjust the PCB board. The specific steps are:

[0031] Step 2.1: When the conveying device of the punching machine 1 senses the PCB board, the stopper in front of the automatic pre-alignment device 2 automatically rises, and the conveying device automatically conveys the PCB board to the automatic pre-alignment device 2 after centering the PCB board.

[0032] Step 2.2: When the PCB board approaches the stopper, the transportation of the PCB board is stopped, and the lower suction cup 21 of the automatic pre-alignment device 2 adsorbs and positions the lower surface of the PCB board. The movement of the PCB board is limited by the stopper, so that the PCB board can be picked up and fixed.

[0033] Step 2.3: The automatic pre-alignment device 2 moves the positioning pin according to the input specifications and dimensions of the PCB board to adjust the pre-alignment camera 22 to a position consistent with the specifications and dimensions of the PCB board, thereby facilitating the identification of the position of the PCB board and then facilitating the pre-alignment correction of the position of the PCB board.

[0034] Step 2.4: The automatic pre-alignment device 2 uses the conveying mechanism to move the PCB board to the center position between the light sources 23 on both sides of the pre-alignment table of the automatic pre-alignment device 2 according to the input data of the distance between the targets and the distance from the target to the edge of the PCB board. The PCB board is moved to the center position between the light sources 23 on both sides, so that the light sources 23 on both sides can provide illumination for the upper surface of the PCB board, and the pre-alignment camera 22 can obtain clear and discernible image information on the surface of the PCB board, so as to realize the position recognition of the PCB board, and then facilitate the pre-alignment adjustment of the PCB board.

[0035] Step 3: After the positioning and adjustment of the PCB board is completed, the pre-alignment pressing plate device 24 is started to move the pressing plate downward and press it onto the PCB board. The pressing plate is used to press and fix the PCB board to avoid the PCB board from being offset when the pre-alignment camera 22 acquires an image of the PCB board.

[0036] Step 4: The automatic pre-alignment device 2 moves the pre-alignment camera 22 above the PCB board to capture the image positioning information of the two targets on the PCB board.

[0037] Step 5: The lower suction cup of the pre-alignment device releases the PCB board, the mobile transport mechanism of the automatic punching device rises and adsorbs and fixes the lower surface of the PCB board, and then the PCB board is sent to the precise positioning automatic punching device through the mobile transport mechanism.

[0038] Step 6: Precisely locate the position of the PCB board, identify and locate the targets on the upper and lower surfaces of the PCB board, compensate for the deviation value, and then perform punching processing. The specific steps are:

[0039] Step 6.1: Adjust the direction of the PCB board through the X, Y, θ adjustment mechanism 31 so that the 8 targets on the front of the PCB board are within the range of the precision positioning CCD camera 32.

[0040] Step 6.2: The upper pressing plate driving cylinder of the automatic punching device drives the upper pressing plate to move downward and press it onto the PCB. The upper pressing plate is used to press and fix the PCB to prevent the PCB from shifting during the punching process, which may cause the punching to be offset.

[0041] Step 6.3: The automatic punching device calculates the actual compensation value according to the positions of the upper and lower targets captured by the precision positioning CCD camera 32, and automatically compensates through the X, Y, θ adjustment mechanism 31, and starts punching after centering the 8 captured target positions, and records the calculated compensation value in the data table. The upper and lower targets are identified and located by the precision positioning CCD cameras 32 at the top and bottom, so that the layer deviation problem between the upper and lower layers of the PCB board can be identified while compensating for the punching position of the PCB board, avoiding the scrapping of the PCB board due to the punching of the PCB board with layer deviation, and effectively reducing the scrap rate.

[0042] Step 7: After punching is completed, the upper platen cylinder of the automatic punching device drives the upper platen to rise, allowing the upper platen to leave the surface of the PCB board.

[0043] Step 8: The discharge conveying mechanism of the discharge device 4 adsorbs the lower surface of the PCB board from below, and then sends the PCB board out.

[0044] The present invention provides precision positioning CCD cameras 32 above and below the PCB board, respectively, and uses the precision positioning CCD cameras 32 to identify and locate the upper target and the lower target of the PCB board, so that the layer deviation problem between the upper and lower layers of the PCB board can be identified while compensating for the punching position of the PCB board, thereby avoiding the situation where the PCB board is scrapped due to punching processing on the PCB board with layer deviation, effectively reducing the scrap rate, and thereby reducing the overall production cost.

[0045] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An automatic processing method of an 8CCD punching machine, characterized in that: The steps include: Step 1: Place the PCB board with inner layer etching completed into the punching machine; Step 2: Position and adjust the PCB board through the automatic pre-alignment device; Step 3: After the positioning and adjustment of the PCB board is completed, the pre-alignment pressing plate device is started, and the pressing plate is moved downward and pressed against the PCB board; Step 4: The automatic pre-alignment device moves the pre-alignment camera above the PCB board to capture the image positioning information of the two targets on the PCB board; Step 5: The lower suction cup of the pre-alignment device releases the PCB board, and the mobile transport mechanism of the automatic punching device rises and adsorbs and fixes the lower surface of the PCB board, and then the PCB board is sent to the precise positioning automatic punching device through the mobile transport mechanism; Step 6: Precisely locate the position of the PCB board, identify and locate the targets on the upper and lower surfaces of the PCB board, compensate for the deviation value, and then perform punching processing; Step 7: After punching is completed, the upper pressing plate cylinder of the automatic punching device drives the upper pressing plate to rise, so that the upper pressing plate leaves the board surface of the PCB board; Step 8: The discharge conveying mechanism of the discharge device adsorbs the lower surface of the PCB board from below, and then sends the PCB board out.

2. The automatic processing method of the 8CCD punching machine according to claim 1, characterized in that: The specific steps of step 2 are: Step 2.1: When the punching machine conveying device senses the PCB board, the stopper in front of the automatic pre-alignment device automatically rises, and the conveying device automatically conveys the PCB board to the automatic pre-alignment device after centering the PCB board; Step 2.2: When the PCB board approaches the stopper, the transportation of the PCB board is stopped, and the lower suction cup of the automatic pre-alignment device adsorbs and positions the lower surface of the PCB board; Step 2.3: The automatic pre-alignment device moves the positioning pins according to the input specifications and dimensions of the PCB board to adjust the pre-alignment camera to a position consistent with the specifications and dimensions of the PCB board; Step 2.4: The automatic pre-alignment device moves the PCB to the set center position through the conveying mechanism according to the input data of the distance between the targets and the distance from the target to the edge of the PCB.

3. The automatic processing method of the 8CCD punching machine according to claim 2, characterized in that: In the step 2.4, the conveying mechanism moves the PCB board to the center position between the light sources on both sides of the pre-alignment table of the automatic pre-alignment device.

4. The automatic processing method of the 8CCD punching machine according to claim 1, characterized in that: The specific steps of step 6 are: Step 6.1: Adjust the direction of the PCB board through the X, Y, and θ adjustment mechanisms so that the eight targets on the front of the PCB board are within the range of the precision positioning CCD camera; Step 6.2: The upper pressing plate driving cylinder of the automatic punching device drives the upper pressing plate to move downward and press it against the PCB board; Step 6.3: The automatic punching device calculates the actual compensation value according to the positions of the upper target and the lower target captured by the precision positioning CCD camera, and automatically compensates through the X, Y, and θ adjustment mechanisms. After the 8 captured target positions are centered, punching begins and the calculated compensation value is recorded in the data table.

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