Shielding device and electronic equipment

Abstract

The shielding device and the electronic equipment are provided to solve the problem that a shielding structure occupies the layout area of a circuit board and influences the layout of electronic devices. The shielding device is used for shielding electronic devices on a circuit board, the circuit board comprises a first face and a second face which are opposite in the first direction, and the electronic devices are arranged on the first face and / or the second face of the circuit board. The shielding device comprises a grounding part, a body and a connecting arm, the grounding part is arranged on the side surface of the circuit board, or the grounding part is arranged in a via hole in the circuit board; the body is stacked on the first face or the second face of the circuit board, the projection of the body on the circuit board in the first direction shields at least part of the electronic devices, and the body is detachably connected with the grounding part through the connecting arm. When the scheme is adopted, the body is connected with the grounding part through the connecting arm to be grounded, so that the shielded electronic device is shielded, the layout area of a circuit board is not occupied, and the layout of the electronic device on the circuit board is not influenced.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a shielding device and electronic equipment. Background Art

[0002] In the current electronic product industry, when it comes to the influence of radio frequency signals, shielding structures are usually used to achieve signal isolation of local devices to achieve the purpose of shielding interference. The existing shielding structure usually includes a shielding frame and a shielding cover. The shielding frame is directly welded on the surface of the printed circuit board (PCB), enclosing the area that needs to be shielded from interference, and then the shielding cover is fixed on the shielding frame to achieve shielding of electronic devices and areas. However, the shielding frame will occupy a certain area on the surface of the PCB, affecting the device layout of the PCB. In addition, the shielding frame easily blocks electronic devices that do not need to be shielded from interference, affecting the detection and maintenance of the device. Summary of the invention

[0003] The present application provides a shielding device and an electronic device to solve the problem that the shielding structure occupies the layout area of ​​the circuit board and affects the layout of the electronic devices.

[0004] In a first aspect, the present application provides a shielding device, which can shield electronic devices on a circuit board. The circuit board may include a first surface and a second surface opposite to each other along a first direction, and the electronic devices may be arranged on the first surface and / or the second surface of the circuit board. The shielding device may include a grounding portion, a body, and a connecting arm. The grounding portion may be arranged on the side of the circuit board, or the grounding portion may also be arranged in a via on the circuit board; the body may be stacked on the first surface or the second surface of the circuit board, and the projection of the body on the circuit board along the first direction may shield at least part of the electronic devices, and the body may be detachably connected to the grounding portion through the connecting arm.

[0005] In the technical solution provided by the present application, the body can be stacked with the circuit board to shield at least part of the electronic devices on the circuit board, and the body can be grounded by connecting the connecting arm to the grounding part to achieve shielding of the electronic devices shielded by the body, and the grounding part can be fixedly connected to the side or via of the circuit board, does not occupy the layout area of ​​the circuit board, does not affect the layout of the electronic devices on the circuit board, and can improve the layout utilization rate of the circuit board. In addition, the body can be detachably connected to the grounding part through the connecting arm to achieve flexible connection between the body and the circuit board. The connection between the body and the circuit board is a non-welding connection, and the grounding part will not shield the electronic devices on the circuit board. The body can be assembled to the circuit board after the circuit board is welded, inspected, and repaired, which will not affect the automatic optical inspection and repair of the electronic devices on the circuit board.

[0006] In a possible implementation, the grounding portion may be electrically connected to a grounding layer in the circuit board to achieve grounding, thereby grounding the body connected to the grounding portion, thereby enabling the body to have shielding performance.

[0007] In a possible implementation, the grounding portion may include a first portion and a third portion; the first portion may be fixedly connected to the first surface of the circuit board; the third portion may be fixedly connected to the side surface of the circuit board, or the third portion may be fixedly connected to the inner wall of the via hole of the circuit board, and the third portion may be connected to the first portion. In this case, the cross-sectional shape of the grounding portion along the first direction may be similar to an L-shape, so as to facilitate the connection between the connecting arm and the grounding portion.

[0008] In a possible implementation, the grounding portion may further include a second portion, the second portion may be fixedly connected to the second surface of the circuit board, and the third portion may be connected to the second portion. In this case, the cross-sectional shape of the grounding portion along the first direction may be similar to a U-shape, so as to facilitate the connection between the connecting arm and the grounding portion.

[0009] In a possible implementation, the first end of the connecting arm may be connected to the body, and the second end of the connecting arm may be provided with a buckle structure. The connecting arm is connected to the grounding portion through the buckle structure, so that the connection between the connecting arm and the grounding portion is convenient and stable.

[0010] In a possible implementation, the first end of the connecting arm can be connected to the body, and a stop protrusion is provided near the first end of the connecting arm; when the body is stacked on the first surface or the second surface of the circuit board, the stop protrusion can abut against the first surface or the second surface of the circuit board. When the stop protrusion abuts against the first surface or the second surface of the circuit board, the body is installed in place on the circuit board, so that the shielding device is installed in place on the circuit board. The stop protrusion structure is relatively simple and can relatively stably limit the installation position of the body.

[0011] In a possible implementation, there may be a plurality of connecting arms, and the plurality of connecting arms may be arranged around the body. The body is connected to the circuit board via the plurality of connecting arms, the relative position stability of the body and the circuit board is high, and the overall shielding performance of the shielding device may be improved.

[0012] In a possible implementation, the main body may include a top plate structure, and the top plate structure may be detachably connected to the grounding portion via the connecting arm to achieve shielding performance of the shielding device.

[0013] In a possible implementation, the body may include a side plate structure, which may be arranged along the first direction and may be fixedly connected to the top plate structure; the side plate structure may be detachably connected to the grounding portion via the connecting arm. The provision of the side plate structure may improve the overall shielding performance of the shielding device.

[0014] In a possible implementation, there may be multiple side plate structures, and the multiple side plate structures may be arranged around the circumference of the top plate structure, and adjacent side plate structures may be connected to each other. The arrangement of multiple side plate structures may improve the overall shielding performance of the shielding device.

[0015] In a possible implementation, the body may further include an isolation plate structure, which is fixedly connected to the top plate structure; the isolation plate structure may be located between two ends of the top plate structure along a second direction, and the second direction may be perpendicular to the first direction. The isolation plate structure may separate the top plate structure into different areas, and when the shielding device is assembled on the circuit board, it may realize separate shielding of electronic devices located in different areas of the circuit board, and may shield interference between electronic devices located in different areas of the circuit board.

[0016] In a possible implementation, there may be multiple isolation plate structures, and adjacent isolation plate structures may be arranged in parallel or at an angle. Multiple isolation plate structures may separate the top plate structure into more areas, and may implement more diverse shielding solutions.

[0017] In a possible implementation, the body may be provided with a through-hole structure; the through-hole structure may be multiple, and the multiple through-hole structures may be arranged in an array along the second direction and / or the third direction, the second direction may be perpendicular to the first direction, and the third direction may be perpendicular to the first direction and the second direction. The through-hole structure can reduce the weight of the body while meeting the shielding performance, thereby reducing the weight of the shielding device as a whole.

[0018] In a second aspect, the present application further provides an electronic device, which may include a circuit board and a shielding device as in any one of the possible implementation schemes in the first aspect above, and the shielding device may be provided on at least one side of the circuit board.

[0019] The electronic device provided by the present application can improve the layout utilization rate of the circuit board in the electronic device because the shielding device included therein does not occupy the layout area of ​​the circuit board and does not affect the layout of the electronic components on the circuit board. The main body of the shielding device can be assembled on the circuit board after the circuit board is welded, inspected, and repaired, which will not affect the automatic optical inspection and repair of the electronic components on the circuit board, so that the shielding device will not affect the welding, inspection, and repair of the electronic components on the circuit board of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a front view of a circuit board involved in an embodiment of the present application;

[0021] Figure 2 A top view of a circuit board according to an embodiment of the present application;

[0022] Figure 3 A front view of a partial structure of a shielding device provided in an embodiment of the present application;

[0023] Figure 4 A top view of a partial structure of a shielding device provided in an embodiment of the present application;

[0024] Figure 5 A front view of a shielding device provided in an embodiment of the present application;

[0025] Figure 6 A top view of a shielding device provided in an embodiment of the present application;

[0026] Figure 7 A three-dimensional diagram of a shielding device provided in an embodiment of the present application;

[0027] Figure 8 A front view of a shielding device provided in another embodiment of the present application;

[0028] Fig. 9 A top view of a circuit board according to another embodiment of the present application;

[0029] Fig.10 A top view of a shielding device provided in another embodiment of the present application;

[0030] Fig.11 A front view of a shielding device provided in another embodiment of the present application;

[0031] Fig.12 A front view of a shielding device provided in another embodiment of the present application;

[0032] Fig.13 A top view of a shielding device provided in another embodiment of the present application;

[0033] Fig.14A top view of a shielding device provided in another embodiment of the present application.

[0034] Reference numerals:

[0035] 1-circuit board; 11-via; 100-grounding part; 200-body;

[0036] 300-connecting arm; 101-first part; 102-second part; 103-third part;

[0037] 201-top plate structure; 202-side plate structure; 203-isolation plate structure; 204-through hole structure;

[0038] 301- snap-fit ​​structure; 302- stop protrusion. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical scheme and advantages of the present application clearer, the embodiments of the present application will be further described in detail below in conjunction with the accompanying drawings. However, the example implementation can be implemented in various forms and should not be construed as being limited to the implementations set forth herein. The same reference numerals in the figures represent the same or similar structures, and thus their repeated description will be omitted. The words expressing position and direction described in the embodiments of the present application are all described with reference to the accompanying drawings as examples, but changes may be made as needed, and the changes made are all included in the scope of protection of the present application. The drawings of the embodiments of the present application are only used to illustrate the relative position relationship and do not represent the true proportion.

[0040] The following description sets forth specific details to facilitate understanding of the present application, but the embodiments of the present application can be implemented in a variety of other ways different from those described herein, and those skilled in the art can make similar generalizations without violating the connotation of the embodiments of the present application. Therefore, the present application is not limited to the specific implementation methods disclosed below.

[0041] For ease of understanding, the application scenarios of the shielding device involved in the present application are first described. The shielding device provided in the embodiment of the present application is adapted to electronic devices and can be mounted on circuit boards of various electronic devices to shield the area on the circuit board, thereby shielding the electronic devices or circuits in the area. The electronic device may include, but is not limited to, a mobile phone, a tablet, a computer, or a wearable device, etc.

[0042] First refer to Figure 1 and Figure 2 , Figure 1 The figure shows a front view of a circuit board involved in an embodiment of the present application. Figure 2 FIG. 1 shows a top view of a circuit board according to an embodiment of the present application. Figure 1 The coordinate direction in the x-axis represents the first direction. Figure 1 and Figure 2 As shown, the circuit board may include a first surface and a second surface that are opposite to each other along a first direction, the first direction may be the thickness direction of the circuit board, and the first surface and the second surface of the circuit board may be respectively understood as the front and back of the circuit board. The shielding device provided in the embodiment of the present application may be shielded on the first surface of the circuit board, or the shielding device may be shielded on the second surface of the circuit board, or the first surface and the second surface of the circuit board may be respectively shielded by the shielding device, that is, at least one side of the circuit board may be shielded by the shielding device. The shielding device provided in the embodiment of the present application may include a grounding portion 100, and the grounding portion 100 may be fixedly connected to the side of the circuit board 1. In specific implementation, such as Figure 2 As shown, a plurality of grounding portions 100 may be disposed at intervals on the side of the circuit board 1 ; or, a grounding portion 100 surrounding the circuit board 1 to form a closed loop structure may be disposed on the side of the circuit board 1 .

[0043] Figure 3 A front view of a partial structure of a shielding device provided in an embodiment of the present application is shown, Figure 4 A top view of a partial structure of a shielding device provided in an embodiment of the present application is shown. Figure 5 shows a front view of the shielding device provided in an embodiment of the present application, Figure 6 A top view of a shielding device provided in an embodiment of the present application is shown. Figure 7 A three-dimensional diagram of a shielding device provided in an embodiment of the present application is shown. Figure 6 The main body is hidden in the text. Figure 3 and Figure 4 As shown, the shielding device provided in the embodiment of the present application may also include a body 200 and a connecting arm 300. In practical application, Figure 5 , Figure 6 and Figure 7 As shown, the body 200 can be stacked with the circuit board 1 along the first direction, the body 200 can cover the first surface or the second surface of the circuit board 1, and the projection of the body 200 on the circuit board 1 along the first direction can block at least part of the electronic devices on the circuit board 1. The body 200 is usually not in contact with the electronic devices to be blocked, for example, the electronic devices are first installed on the circuit board 1, and then the body 200 is installed on the circuit board 1 with the electronic devices to block the electronic devices. The body 200 can be detachably connected to the grounding portion 100 through the connecting arm 300.

[0044] In the shielding device provided in the embodiment of the present application, the main body 200 is stacked with the circuit board 1 to shield at least part of the electronic devices on the circuit board 1, and the main body 200 is connected to the grounding portion 100 through the connecting arm 300 and grounded to shield the electronic devices shielded by the main body 200, and the grounding portion 100 is fixedly connected to the side of the circuit board 1, does not occupy the layout area of ​​the circuit board 1, does not affect the layout of the electronic devices on the circuit board 1, and can improve the layout utilization rate of the circuit board 1. In addition, the main body 200 is detachably connected to the grounding portion 100 through the connecting arm 300 to achieve the connection between the main body 200 and the circuit board 1. The connection between the main body 200 and the circuit board 1 is a non-welding connection, and the grounding portion 100 will not shield the electronic devices on the circuit board 1. The main body 200 can be assembled on the circuit board 1 after the circuit board 1 is welded, inspected, and repaired, and will not affect the automatic optical inspection (AOI) and repair of the electronic devices on the circuit board 1. The main body 200 is detachably connected to the grounding portion 100 via the connecting arm 300 , which also facilitates the disassembly of the main body 200 , and is convenient for repairing or testing the circuit board 1 .

[0045] As a possible implementation, the grounding portion 100 can be electrically connected to the grounding layer (or ground layer, grounding network, ground network, etc.) in the circuit board 1, so that the grounding portion 100 has grounding performance, so that the body 200 connected to the grounding portion 100 is grounded, and then the body 200 has shielding performance. In specific implementation, the grounding portion 100 can be formed by electroplating copper. The circuit board 1 can have multiple layers (layers), such as a top layer (top layer), a middle layer (mid layer), and a bottom layer (bottom layer), and the middle layer can include multiple layers, and one of the middle layers can be the grounding layer of the circuit board 1. In addition to being electrically connected to the grounding layer in the circuit board 1, the grounding portion 100 can also be grounded in other ways, such as being electrically connected to a reference ground on the circuit board 1 or outside the circuit board 1 through a conductive member.

[0046] Refer again Figure 5 As shown, in a specific implementation, the grounding portion 100 may include a first portion 101 and a third portion 103, and the first portion 101 may be fixedly connected to the first surface of the circuit board 1. According to the above-mentioned setting position of the grounding portion 100 on the circuit board 1, in a possible implementation, the third portion 103 may be fixedly connected to the side surface of the circuit board 1. In this embodiment, the cross-sectional shape of the grounding portion 100 along the first direction may be similar to an L-shape.

[0047] In another specific implementation, the grounding portion 100 may include a second portion 102 and a third portion 103, and the second portion 102 may be fixedly connected to the second surface of the circuit board 1. According to the above-mentioned setting position of the grounding portion 100 on the circuit board 1, in a possible implementation, the third portion 103 may be fixedly connected to the side surface of the circuit board 1. In this embodiment, the cross-sectional shape of the grounding portion 100 along the first direction may be similar to an L-shape.

[0048] In another specific implementation, the grounding portion 100 may include a first portion 101, a second portion 102, and a third portion 103, wherein the first portion 101 may be fixedly connected to the first surface of the circuit board 1, and the second portion 102 may be fixedly connected to the second surface of the circuit board 1. According to the above-mentioned setting position of the grounding portion 100 on the circuit board 1, in a possible implementation, the third portion 103 may be fixedly connected to the side surface of the circuit board 1. In this embodiment, the cross-sectional shape of the grounding portion 100 along the first direction may be similar to a U-shape.

[0049] As a possible implementation, the connecting arm 300 can be a conductive member with a certain elasticity, and the connecting arm 300 can be made of metal materials such as copper and iron. The connecting arm 300 forms an electrical connection by contacting the grounding portion 100, so that the connecting arm 300 and the body 200 are grounded, thereby achieving the shielding performance of the shielding device.

[0050] In a specific implementation, the first end of the connecting arm 300 can be connected to the body 200, and the second end of the connecting arm 300 can be provided with a buckle structure 301. Specifically, the buckle structure 301 can be formed by bending the second end of the connecting arm 300. In practical applications, for example, the body 200 is stacked and arranged on the first surface of the circuit board 1, and the grounding portion 100 includes the above-mentioned first part 101, the second part 102 and the third part 103, and the first part 101, the second part 102 and the third part 103 are sequentially connected to form a U-shaped structure. When the connecting arm 300 is connected to the grounding portion 100, the buckle structure 301 of the connecting arm 300 can be buckled on the second part 102 of the grounding portion 100, or the buckle structure 301 of the connecting arm 300 can be buckled at the connection between the second part 102 and the third part 103 of the grounding portion 100, so as to realize the detachable connection between the body 200 and the circuit board 1. In this specific implementation, the overall length of the connecting arm 300 along the first direction is relatively long.

[0051] Figure 8 FIG. 2 shows a front view of a shielding device provided by another embodiment of the present application. Figure 8As shown, the buckle structure 301 of the connecting arm 300 can be buckled on the third portion 103 of the grounding portion 100 to achieve a detachable connection between the body 200 and the circuit board 1. In this specific implementation, the overall length of the connecting arm 300 along the first direction is relatively short.

[0052] In a specific implementation, the first end of the connecting arm 300 is connected to the body 200, and a stop protrusion 302 may be provided at the first end of the connecting arm 300. When the body 200 is stacked on the first surface or the second surface of the circuit board 1, the stop protrusion 302 may abut against the first surface or the second surface of the circuit board 1. For example, when the body 200 is stacked on the first surface of the circuit board 1 and the stop protrusion 302 abuts against the first surface of the circuit board 1, the body 200 is installed in place on the circuit board 1, thereby realizing that the shielding device is installed in place on the circuit board 1; specifically, at this time, the stop protrusion 302 may abut against the first part 101 of the grounding part 100, or the stop protrusion 302 may abut against the first surface of the circuit board 1 and the first part 101 of the grounding part 100 at the same time. During actual molding, the stop protrusion 302 may be stamped on the connecting arm 300.

[0053] In specific configuration, there may be multiple connecting arms 300, and multiple connecting arms 300 may be arranged around the body 200. According to actual requirements, the number of connecting arms 300 may be appropriately increased to increase the density of the connecting arms 300 so as to improve the shielding performance of the shielding device. Figure 8 The relatively short length of the connecting arm 300 shown and the Figure 5 The relatively long connecting arms 300 shown can be used alternately. Compared with using all relatively long connecting arms 300, the overall snapping force of the plurality of connecting arms 300 can be reduced, thereby facilitating assembly and disassembly of the shielding device and the circuit board 1.

[0054] As a possible implementation, the body 200 can be made of metal materials such as copper and iron. Figure 6 and Figure 8 As shown, the body 200 may include a top plate structure 201, and the top plate structure 201 may be detachably connected to the grounding portion 100 via a connecting arm 300. In a specific implementation, the size of the top plate structure 201 may be close to that of the circuit board 1. For example, when the circuit board 1 is rectangular, the top plate structure 201 is also rectangular, and the length and width of the top plate structure 201 are respectively the same as or close to the length and width of the circuit board 1. The top plate structure 201 may shield the entire circuit board 1, thereby shielding the entire circuit board 1, and thus shielding the electronic devices on the circuit board 1. At this time, a plurality of connecting arms 300 may be respectively connected to a plurality of spaced grounding portions 100 arranged on the side of the circuit board 1 or a grounding portion 100 of a closed-loop structure.

[0055] Fig. 9 The top view of the circuit board according to another embodiment of the present application is shown. As Fig. 9 shown, in addition to the above-mentioned way that the grounding part 100 is fixedly connected to the side surface of the circuit board 1, the grounding part 100 can also be arranged at other positions of the circuit board 1. For example, the grounding part 100 can be fixedly connected in the via hole 11 provided on the circuit board 1. The via hole 11 is a structure existing in the design of the circuit board 1 itself, and the design of the via hole 11 is covered within the scope of the structural design of the circuit board 1 itself. The grounding part 100 arranged in the via hole 11 existing in the circuit board 1 itself also does not occupy the layout area of the circuit board 1 and does not affect the layout of electronic devices on the circuit board 1. Specifically, the via hole 11 can be a blind hole provided on the first surface or the second surface of the circuit board 1, or a through hole communicating the first surface and the second surface of the circuit board 1. The present application does not limit this.

[0056] Combined with Figure 5 shown, in a possible implementation manner, when the grounding part 100 includes the above-mentioned first part 101 and third part 103, the third part 103 can be fixedly connected to the inner wall of the via hole 11 provided on the circuit board 1, and the third part 103 can be connected to the first part 101. At this time, the via hole 11 can be a blind hole on the first surface of the circuit board 1, or a through hole communicating the first surface and the second surface of the circuit board 1. In this embodiment, the cross-sectional shape of the grounding part 100 along the first direction can be similar to two symmetric L shapes, or similar to the shape of "儿" or "几".

[0057] In another possible implementation manner, when the grounding part 100 includes the above-mentioned second part 102 and third part 103, the third part 103 can be fixedly connected to the inner wall of the via hole 11 provided on the circuit board 1, and the third part 103 can be connected to the second part 102. At this time, the via hole 11 can be a blind hole on the second surface of the circuit board 1, or a through hole communicating the first surface and the second surface of the circuit board 1. In this embodiment, the cross-sectional shape of the grounding part 100 along the first direction can be similar to two symmetric L shapes, or similar to the shape of "儿" or "几".

[0058] In other possible implementation manners, when the grounding part 100 includes the above-mentioned first part 101, second part 102 and third part 103, the third part 103 can be fixedly connected to the inner wall of the via hole 11 provided on the circuit board 1, and the third part 103 can be respectively connected to the first part 101 and the second part 102. At this time, the via hole 11 can be a through hole communicating the first surface and the second surface of the circuit board 1. In this embodiment, the cross-sectional shape of the grounding part 100 along the first direction can be similar to two symmetric U shapes, or similar to the shape of "北".

[0059] Fig.10FIG. 2 shows a top view of a shielding device provided by another embodiment of the present application. Fig.10 As shown, in a specific implementation, the size of the top plate structure 201 can be smaller than the circuit board 1. For example, when the circuit board 1 is rectangular, the top plate structure 201 can also be rectangular, and the length and width of the top plate structure 201 are respectively smaller than the length and width of the circuit board 1. The top plate structure 201 can block a part of the area of ​​the circuit board 1 to shield the part of the area of ​​the circuit board 1, thereby shielding the electronic devices in the area. At this time, according to the area actually blocked by the top plate structure 201, there can be multiple connection situations between the multiple connecting arms 300 and the grounding part 100. For example, when the projection of the top plate structure 201 on the circuit board 1 along the first direction is close to a part of the side surface of the circuit board 1, a part of the connecting arms 300 among the multiple connecting arms 300 can be connected to the grounding part 100 on the side surface of the circuit board 1, and another part of the connecting arms 300 can be connected to the grounding part 100 in the via 11 set on the circuit board 1. Alternatively, when the projection of the top plate structure 201 on the circuit board 1 along the first direction is away from the side surfaces of the circuit board 1 , the plurality of connecting arms 300 may be respectively connected to the grounding portions 100 in the plurality of via holes 11 disposed on the circuit board 1 .

[0060] Fig.11 FIG. 2 shows a front view of a shielding device provided by another embodiment of the present application. Fig.11 As shown, the first end of the connecting arm 300 is fixedly connected to the top plate structure 201 , and the second end of the connecting arm 300 can be located outside the via hole 11 of the circuit board 1 , that is, the connecting arm 300 can pass through the via hole 11 of the circuit board 1 . Fig.12 FIG. 2 shows a front view of a shielding device provided by another embodiment of the present application. Fig.12 As shown, the second end of the connecting arm 300 may also be located in the via hole 11 of the circuit board 1 .

[0061] In a specific implementation, referring to Fig.12 As shown, the body 200 may further include a side plate structure 202, which may be arranged along a first direction and may be fixedly connected to the top plate structure 201. The top plate structure 201 may be fixedly connected to the connecting arm 300 through the side plate structure 202, and the side plate structure 202 may be detachably connected to the grounding portion 100 through the connecting arm 300. In a specific implementation, the side plate structure 202 may be arranged perpendicular to the top plate structure 201. There may be multiple side plate structures 202, and multiple side plate structures 202 may be arranged around the circumference of the top plate structure 201, and adjacent side plate structures 202 may be fixedly connected to each other, so that the multiple side plate structures 202 may form a closed loop structure.

[0062] Fig.13 FIG. 2 shows a top view of a shielding device provided by another embodiment of the present application. Fig.13 The top plate structure is hidden in the figure. Fig.13 As shown, in a specific implementation, the body may further include an isolation plate structure 203, which may be arranged along the first direction and fixedly connected to the top plate structure. The isolation plate structure 203 may be located between the two ends of the top plate structure along the second direction, and the second direction may be perpendicular to the first direction. Specifically, the second direction may be the length or width direction of the circuit board 1, for example, the second direction may be the length direction of the circuit board 1. In specific implementation, the two ends of the isolation plate structure 203 may be aligned with the edge of the top plate structure respectively, and the isolation plate structure 203 may separate the top plate structure into different areas in the second direction; the end of the isolation plate structure 203 may not be aligned with the edge of the top plate structure. The arrangement of the isolation plate structure 203 separates the top plate structure into different areas, and when the shielding device is assembled on the circuit board 1, it can realize the separate shielding of electronic devices located in different areas of the circuit board 1, and can shield the interference between electronic devices located in different areas of the circuit board 1. In actual arrangement, there may be multiple isolation plate structures 203, and adjacent isolation plate structures 203 may be arranged in parallel or at an angle, so as to separate the top plate structure into more areas, and realize more diversified shielding schemes.

[0063] Fig.14 FIG. 2 shows a top view of a shielding device provided by another embodiment of the present application. Fig.14 As shown, as a possible implementation, the body 200 may be provided with a through hole structure 204, and the through hole structure 204 may be multiple, and the multiple through hole structures 204 may be arranged in an array along the second direction and / or the third direction. The third direction may be perpendicular to the first direction and the second direction. Specifically, the second direction may be the length direction of the circuit board, and the third direction may be the width direction of the circuit board. The provision of the through hole structure 204 can reduce the weight of the body 200 while meeting the shielding performance, thereby reducing the weight of the shielding device as a whole.

[0064] The above are only specific implementation methods of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by any technician familiar with the technical field within the technical scope disclosed in the present application should be covered within the protection scope of the present application.

Claims

1. A shielding device, It is characterized in that The shielding device is used to shield electronic devices on a circuit board, the circuit board includes a first surface and a second surface opposite to each other along a first direction, the electronic devices are arranged on the first surface and / or the second surface of the circuit board, the shielding device includes a grounding portion, a body and a connecting arm, wherein: The grounding portion is arranged on a side surface of the circuit board, or the grounding portion is arranged in a via hole on the circuit board; The body is stacked on the first surface or the second surface of the circuit board, the projection of the body on the circuit board along the first direction shields at least part of the electronic device, and the body is detachably connected to the grounding portion via the connecting arm.

2. The shielding device according to claim 1, It is characterized in that The grounding portion is electrically connected to a grounding layer in the circuit board.

3. The shielding device according to claim 1 or 2, It is characterized in that The grounding portion includes a first portion and a third portion; The first part is fixedly connected to the first surface of the circuit board; The third part is fixedly connected to the side surface of the circuit board, or the third part is fixedly connected to the inner wall of the through hole of the circuit board, and the third part is connected to the first part.

4. The shielding device according to claim 3, It is characterized in that The grounding portion further includes a second portion, the second portion is fixedly connected to the second surface of the circuit board, and the third portion is connected to the second portion.

5. The shielding device according to any one of claims 1 to 4, It is characterized in that The first end of the connecting arm is connected to the body, and the second end of the connecting arm is provided with a buckle structure.

6. The shielding device according to any one of claims 1 to 5, It is characterized in that The first end of the connecting arm is connected to the body, and a stop protrusion is provided on the connecting arm near the first end; When the body is stacked on the first surface or the second surface of the circuit board, the stop protrusion abuts against the first surface or the second surface of the circuit board.

7. The shielding device according to any one of claims 1 to 6, It is characterized in that There are multiple connecting arms, and the multiple connecting arms are arranged around the main body.

8. The shielding device according to any one of claims 1 to 7, It is characterized in that The main body comprises a top plate structure, and the top plate structure is detachably connected to the grounding portion through the connecting arm.

9. The shielding device according to claim 8, It is characterized in that The body comprises a side plate structure, which is arranged along the first direction and fixedly connected to the top plate structure; The side plate structure is detachably connected to the grounding portion via the connecting arm.

10. The shielding device according to claim 9, It is characterized in that There are multiple side plate structures, and the multiple side plate structures are arranged around the circumference of the top plate structure, and adjacent side plate structures are connected to each other.

11. The shielding device according to any one of claims 8 to 10, It is characterized in that The body further includes an isolation plate structure, which is fixedly connected to the top plate structure and is located between two ends of the top plate structure along a second direction, wherein the second direction is perpendicular to the first direction.

12. The shielding device according to claim 11, It is characterized in that There are multiple isolation plate structures, and adjacent isolation plate structures are arranged in parallel or at an angle.

13. The shielding device according to any one of claims 1 to 12, It is characterized in that The body is provided with a through-hole structure; There are multiple through-hole structures, and the multiple through-hole structures are arranged in an array along the second direction and / or the third direction. The second direction is perpendicular to the first direction, and the third direction is perpendicular to the first direction and the second direction.

14. An electronic device, It is characterized in that comprising a circuit board, and a shielding device as claimed in any one of claims 1 to 13; The shielding device is disposed on at least one side of the circuit board.

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