Display panel, manufacturing method thereof and display device

Abstract

The invention discloses a display panel and a manufacturing method thereof and a display device, and belongs to the technical field of display, in particular, the display panel comprises a substrate, a light-emitting unit layer, a transparent barrier layer, a metal film layer and a packaging layer, the light-emitting unit layer is arranged on the substrate and located in a display area; the transparent barrier layer is arranged on the light-emitting unit layer and extends from the display area to the non-display area; the metal film layer is arranged in the non-display area, and the metal film layer and the transparent barrier layer are located on the same layer; the packaging layer extends from the display area to the non-display area and is arranged on the transparent barrier layer and the metal film layer; the metal film layer is arranged as the water and oxygen absorption layer, so that water and oxygen are prevented from entering from the lower part of the packaging layer, the packaging effect of the display panel is improved, and the service life of the display panel is prolonged.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] Organic light emitting diodes (OLEDs) have the advantages of surface light source, cold light, energy saving, fast response, flexibility, ultra-thinness and low cost, and their mass production technology is becoming increasingly mature. Since OLEDs have poor stability and are extremely sensitive to water and oxygen, encapsulation technology is particularly critical. The purpose of encapsulation is mainly to prevent water vapor and oxygen from entering the OLED, and cracks are easily generated during the production process of the encapsulation layer. When cracks appear on the display screen or water vapor enters from the outside, the aging speed of the OLED organic light-emitting layer device will be accelerated. Therefore, strict encapsulation must be performed to extend the life and improve stability.

[0003] However, the edge of the display panel is generally the weakest position of the package. After long-term use, water and oxygen will gradually enter the display panel from the edge of the package, causing the display panel package to fail. Summary of the invention

[0004] The purpose of the present application is to provide a display panel, a manufacturing method thereof and a display device, which prevents water and oxygen from entering from below the packaging layer by setting a metal film layer as a water and oxygen absorption layer, thereby improving the packaging effect of the display panel and extending the service life of the display panel.

[0005] The present application discloses a display panel, which includes a display area and a non-display area. The display panel also includes a base substrate, a light-emitting unit layer, a transparent barrier layer, a metal film layer and an encapsulation layer. The light-emitting unit layer is arranged on the base substrate and is located in the display area; the transparent barrier layer is arranged on the light-emitting unit layer and extends from the display area to the non-display area; the metal film layer is arranged in the non-display area and is located in the same layer as the transparent barrier layer; the encapsulation layer extends from the display area to the non-display area and is arranged on the transparent barrier layer and the metal film layer.

[0006] Optionally, the transparent barrier layer is formed by a cathode patterned material, and the metal film layer is formed by a metal magnesium or metal silver material; the metal film layer is used to deposit the metal magnesium or metal silver material on the entire surface after the transparent barrier layer is formed, and in the display area, the cathode patterned material inhibits the adhesion of the metal magnesium or metal silver material, and the metal film layer is only formed in the non-display area.

[0007] Optionally, the encapsulation layer includes a first inorganic layer, an organic encapsulation layer and a second inorganic layer; the first inorganic layer is arranged on the transparent barrier layer and the metal film layer; the organic encapsulation layer is arranged on the first inorganic layer, and the second inorganic layer is arranged on the organic encapsulation layer; the display panel also includes an encapsulation barrier layer, the encapsulation barrier layer is arranged in the non-display area, the encapsulation barrier layer is used to block the organic encapsulation layer, the first inorganic layer and the second inorganic layer extend from the encapsulation barrier layer in a direction away from the display area, and on the encapsulation barrier layer, the first inorganic layer and the second inorganic layer are in direct contact.

[0008] Optionally, the display panel further includes at least two blocking structures, which are arranged on a side of the encapsulation blocking dam close to the display area and below the first inorganic layer; a gap is arranged between the two blocking structures, and the metal film layer covers the two blocking structures and the gap.

[0009] Optionally, the metal film layer includes at least one annular notch, the annular notch divides the metal film layer into a first metal ring portion and a second metal ring portion, and the annular notch is arranged around the non-display area.

[0010] Optionally, the metal film layer also includes an annular oxidation portion, a first metal ring portion and a second metal ring portion, the first metal ring portion is arranged around the display area, the annular oxidation portion is arranged around the first metal ring portion, and the second metal ring portion is arranged around the annular oxidation portion; the annular oxidation portion is formed by oxidizing the metal film layer to form an annular oxidation portion of oxidized metal material.

[0011] Optionally, the metal film layer includes a plurality of hollow portions, the plurality of hollow portions are arranged in an array, and the metal film layer is a mesh structure.

[0012] The present application also discloses a method for manufacturing a display panel, comprising the steps of:

[0013] Providing a substrate;

[0014] Forming a light-emitting unit layer on the base substrate, wherein the light-emitting unit layer is located in a display area;

[0015] forming a transparent barrier layer on the light-emitting unit layer, wherein the transparent barrier layer extends from the display area to the non-display area;

[0016] forming a metal film layer in the non-display area, wherein the metal film layer and the transparent barrier layer are located in the same layer;

[0017] A packaging layer is formed, wherein the packaging layer extends from the display area to the non-display area and covers the transparent barrier layer and the metal film layer.

[0018] Optionally, the transparent barrier layer is formed of a cathode patterned material, and the metal film layer is formed of a metal magnesium or metal silver material; the step of forming a metal film layer in the non-display area, wherein the metal film layer and the transparent barrier layer are located in the same layer, comprises:

[0019] Depositing metal magnesium or metal silver material on the entire surface;

[0020] In the display area, the cathode patterning material inhibits the metal magnesium or metal silver material from adhering, and the metal film layer is only formed in the non-display area.

[0021] The present application also discloses a display device, comprising a driving circuit and the above-mentioned display panel, wherein the driving circuit is used to drive the display panel to display.

[0022] The present application sets a metal film layer under the encapsulation layer in the non-display area, and utilizes the metal film layer's characteristic of absorbing water and oxygen to a certain extent. When the edge encapsulation of the display panel fails or the display panel ages after long-term use, causing water and oxygen to invade the metal film layer, the metal film layer is sacrificed to absorb water and oxygen, and the metal film layer is oxidized and corroded to absorb water and oxygen, thereby preventing water and oxygen from further invading the display area. In addition, the present application sets a transparent barrier layer to prevent the light-emitting unit of the display area from being affected due to process reasons when the metal film layer is formed, thereby improving the display panel's resistance to water and oxygen, improving the encapsulation reliability of the display panel, and extending the service life of the display panel without affecting the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The included drawings are used to provide a further understanding of the embodiments of the present application, which constitute a part of the specification, are used to illustrate the implementation methods of the present application, and together with the text description, explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. In the drawings:

[0024] Figure 1 is a schematic diagram of a display panel according to a first embodiment of the present application;

[0025] Figure 2 is a schematic diagram of a second display panel of the first embodiment of the present application;

[0026] Figure 3 is a schematic diagram of a third display panel of the first embodiment of the present application;

[0027] Figure 4 is a schematic diagram of a first display panel of a second embodiment of the present application;

[0028] Figure 5 yes Figure 4 Schematic diagram of the cross section along the cutting line AA';

[0029] Figure 6 is a schematic top view of the metal film layer of the present application;

[0030] Figure 7 is a schematic diagram of a second display panel of a second embodiment of the present application;

[0031] Figure 8 is a schematic diagram of a method for manufacturing a display panel of the present application;

[0032] Fig. 9 is a schematic diagram of a display device of the present application.

[0033] Among them, 100, display panel; 101, display area; 102, non-display area; 110, base substrate; 111, drive circuit layer; 120, light-emitting unit layer; 121, light-emitting unit; 122, anode; 123, organic light-emitting layer; 124, cathode; 130, transparent barrier layer; 140, metal film layer; 141, annular notch; 142, first metal ring portion; 143, second metal ring portion; 144, annular oxidation portion; 145, hollow portion; 150, encapsulation layer; 151, first inorganic layer; 152, organic encapsulation layer; 153, second inorganic layer; 160, encapsulation barrier layer; 170, barrier structure; 171, spacer; 200, display device; 210, drive circuit. DETAILED DESCRIPTION

[0034] It should be understood that the terms used herein, the specific structures and functional details disclosed are only for describing specific embodiments and are representative, but the present application can be implemented in many alternative forms and should not be construed as being limited to only the embodiments described herein.

[0035] In the description of the present application, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating relative importance or implicitly indicating the number of technical features indicated. Therefore, unless otherwise specified, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features; "multiple" means two or more. In addition, the terms "upper", "lower", "left", "right", "vertical", "horizontal", etc. indicating orientation or positional relationships are described based on the orientation or relative positional relationships shown in the accompanying drawings, and are only for the convenience of describing the simplified description of the present application, rather than indicating that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0036] The present application is described in detail below with reference to the accompanying drawings and optional embodiments.

[0037] Figure 1 is a schematic diagram of a display panel of the first embodiment of the present application, see Figure 1 As shown, the present application discloses a display panel 100, which includes a display area 101 and a non-display area 102. The display panel 100 also includes a base substrate 110, a light-emitting unit layer 120, a transparent barrier layer 130, a metal film layer 140 and an encapsulation layer 150. The light-emitting unit layer 120 is arranged on the base substrate 110 and is located in the display area 101; the transparent barrier layer 130 is arranged on the light-emitting unit layer 120 and extends from the display area 101 to the non-display area 102; the metal film layer 140 is arranged in the non-display area 102 and is located in the same layer as the transparent barrier layer 130; the encapsulation layer 150 extends from the display area 101 to the non-display area 102, and is arranged on the transparent barrier layer 130 and the metal film layer 140.

[0038] The present application sets a metal film layer 140 below the encapsulation layer 150 of the non-display area 102, and utilizes the property of the metal film layer 140 to absorb water and oxygen to a certain extent. When the edge encapsulation of the display panel 100 fails or the display panel 100 ages after long-term use, causing water and oxygen to invade the metal film layer 140, the metal film layer 140 is sacrificed to absorb water and oxygen, and the metal film layer 140 is oxidized and corroded to absorb water and oxygen, thereby preventing water and oxygen from further invading the display area 101. In addition, the present application sets a transparent barrier layer 130 to prevent the light-emitting unit 121 of the display area 101 from being affected due to process reasons when the metal film layer 140 is formed, thereby improving the water and oxygen resistance of the display panel 100 without affecting the display panel 100, improving the encapsulation reliability of the display panel 100, and extending the service life of the display panel 100.

[0039] It can be understood that the main purpose of the metal film layer 140 set in the present application is to extend the service life of the display panel 100, that is, the packaging of the display panel 100 is intact before the display panel 100 leaves the factory, but after long-term use, a small amount of water and oxygen intrusion occurs at the edge of the display panel 100. In the actual aging test, the relationship between the amount of water and oxygen and time after long-term actual use can be determined based on the simulation situation, so as to set a certain amount of metal film layer 140 for water and oxygen absorption, thereby extending the service life of the display panel 100.

[0040] In one embodiment, the transparent barrier layer 130 can be formed by an insulating layer material, wherein the insulating layer material includes an organic insulating material or an inorganic insulating material. By forming a transparent barrier layer 130 on the light-emitting unit layer 120 in the display area 101, when the metal film layer 140 is subsequently formed, the transparent barrier layer 130 can prevent direct contact between the metal film layer 140 and the light-emitting unit 121. Since the metal film layer 140 generally needs to be deposited on the entire surface and then patterned by an etching process, the transparent barrier layer 130 in this embodiment can also prevent damage to the light-emitting unit layer 120 during the etching process of the metal film layer 140.

[0041] Among them, the light-emitting unit layer 120 generally includes a plurality of light-emitting units 121 arranged in an array, and the light-emitting unit 121 generally includes an anode 122, an organic light-emitting layer 123 and a cathode 124. The cathode 124 is arranged at the top, and the anode 122 is arranged at the bottom. The organic light-emitting layer 123 is arranged between the anode 122 and the cathode 124. The electric field generated by the anode 122 and the cathode 124 drives the organic light-emitting layer 123 to emit light. Adjacent light-emitting units 121 are separated by a pixel definition layer. The organic light-emitting layer 123 is highly sensitive to water and oxygen. Generally speaking, after completing the process of the light-emitting unit 121, it is necessary to directly form the encapsulation layer 150 to prevent the subsequent process from affecting the light-emitting unit 121. In this embodiment, although the transparent barrier layer 130 is formed on the light-emitting unit layer 120, when the metal film layer 140 is subsequently etched, it is still possible to affect the effectiveness of the light-emitting unit 121.

[0042] In another embodiment, the transparent barrier layer 130 is formed by cathode 124 patterned material, which is a cathode 124 patterned material that can be deposited on the light-emitting unit 121 by vacuum evaporation. It is a non-uniformly substituted fluorinated cyclotriphosphazene compound that has a lotus effect and inhibits the adhesion of active metals such as magnesium and silver. In this embodiment, the metal film layer 140 is formed by metal magnesium or metal silver material. The inhibition of the transparent barrier layer 130 can prevent metal magnesium or metal silver from being deposited on the transparent barrier layer 130. Specifically, after the transparent barrier layer 130 is formed, metal magnesium or metal silver material is deposited on the entire surface. In the display area 101, the cathode 124 patterned material inhibits the adhesion of the metal magnesium or metal silver material, and the metal film layer 140 is only formed in the non-display area 102.

[0043] The advantage of this embodiment is that the metal film layer 140 can be patterned by controlling the area of ​​the transparent barrier layer 130, and there is no need to remove the excess metal film layer 140 by etching. In contrast, the light-emitting unit 121 in the display area 101 can be protected from being affected by subsequent processes. Through the transparent barrier layer 130, the metal film layer 140 can be deposited on the entire surface of the display panel 100 before the encapsulation layer 150 is formed. Since the metal film layer 140 cannot adhere to the transparent barrier layer 130 in the display area 101, the metal film layer 140 is finally formed only in the non-transparent barrier layer 130 area in the non-display area 102, and the subsequent transparent barrier layer 130 will not affect the normal formation of the encapsulation layer 150.

[0044] Specifically, the metal film layer 140 in this embodiment can be arranged around the display area 101, and is annular in shape under the orthographic projection of the base substrate 110. This is mainly because when the display panel 100 is packaged intact at the factory but used for a long time, the specific position of water and oxygen intrusion cannot be determined. Relatively speaking, except for the higher intrusion risk at the corner position of the display panel 100, each edge of the display panel 100 has the same intrusion risk. Therefore, the metal film layer 140 arranged in an annular shape can prevent water vapor intrusion at a certain position as much as possible, thereby causing display defects and affecting the overall display effect.

[0045] Continue to see Figure 1 As shown, the encapsulation layer 150 includes a first inorganic layer 151, an organic encapsulation layer 152 and a second inorganic layer 153; the first inorganic layer 151 is arranged on the transparent barrier layer 130 and the metal film layer 140; the organic encapsulation layer 152 is arranged on the first inorganic layer 151, and the second inorganic layer 153 is arranged on the organic encapsulation layer 152.

[0046] In this embodiment, the encapsulation layer 150 is formed by a three-layer stack of inorganic encapsulation material and organic encapsulation material for illustration, which does not mean that the encapsulation layer 150 of the present application is limited to a three-layer stack. Relatively speaking, the encapsulation layer 150 of the present application does not limit the number of film layers.

[0047] At the edge of the display panel 100 , the organic encapsulation layer 152 no longer extends, the first inorganic layer 151 and the second inorganic layer 153 are in direct contact, and the first inorganic layer 151 and the second inorganic layer 153 continue to extend to the edge of the display panel 100 .

[0048] In this embodiment, the metal film layer 140 extends from the area of ​​the non-display area 102 having the organic encapsulation layer 152 to the area where the organic encapsulation layer 152 is not provided. On the orthographic projection of the base substrate 110, the metal film layer 140 partially overlaps with the organic encapsulation layer 152. The partial overlap here means that a part of the orthographic projection of the organic encapsulation layer 152 overlaps with the metal film layer 140, and another part does not overlap with the metal film layer 140; a part of the orthographic projection of the metal film layer 140 overlaps with the organic encapsulation layer 152, and another part does not overlap with the organic encapsulation layer 152.

[0049] In one embodiment, the side of the metal film layer 140 away from the display area 101 is covered by the first inorganic layer 151 , that is, in the direction away from the display area 101 , the length of the first inorganic layer 151 and the length of the second inorganic layer 153 exceed the metal film layer 140 .

[0050] However, the organic encapsulation layer 152 in the encapsulation layer 150 is formed by inkjet printing. On the basis of inkjet printing, the organic encapsulation layer 152 needs to be leveled, and the ink of the organic encapsulation layer 152 needs to be prevented from overflowing during the inkjet printing process. In this regard, the display panel 100 further includes an encapsulation barrier layer 160, which is disposed in the non-display area 102. The encapsulation barrier layer 160 is used to block the organic encapsulation layer 152. The first inorganic layer 151 and the second inorganic layer 153 extend from the encapsulation barrier layer 160 in a direction away from the display area 101, and on the encapsulation barrier layer 160, the first inorganic layer 151 and the second inorganic layer 153 are in direct contact.

[0051] The metal film layer 140 mentioned above can be disposed between the encapsulation barrier dam and the first inorganic layer 151 . The metal film layer 140 can mainly improve the phenomenon of water vapor and oxygen intrusion at the film layer interface below the first inorganic layer 151 .

[0052] Figure 2 is a schematic diagram of the second display panel of the first embodiment of the present application, see Figure 2 As shown, the display panel 100 in this embodiment is substantially the same as that in the previous embodiment, and the metal film layer 140 in this embodiment may also extend from below the organic encapsulation layer 152 to below the encapsulation barrier layer 160, and on the orthographic projection of the base substrate 110, the metal film layer 140 and the encapsulation barrier layer 160 are completely overlapped or partially overlapped. The side of the metal film layer 140 in this embodiment away from the display area 101 may be arranged in the same manner as that in the previous embodiment, and will not be described in detail herein.

[0053] Figure 3 is a schematic diagram of the third display panel of the first embodiment of the present application, see Figure 3 As shown, further, the display panel 100 also includes at least two blocking structures 170, and the blocking structure 170 is arranged on the side of the encapsulation blocking dam close to the display area 101 and is located below the first inorganic layer 151; a gap 171 is arranged between the two blocking structures 170, and the metal film layer 140 covers the two blocking structures 170 and the gap 171.

[0054] Generally speaking, a driving circuit layer 111 is provided on the base substrate 110, and the driving circuit layer 111 is used to drive the light-emitting units 121 in the light-emitting unit layer 120 to emit light. The driving circuit layer 111 is provided under the light-emitting unit layer 120. In the non-display area 102, the driving circuit layer 111 is provided with an extension circuit and other structures. The blocking structure 170 of this embodiment is also provided on the driving circuit layer 111 and is located under the encapsulation layer 150.

[0055] The blocking structure 170 in this embodiment protrudes from the driving circuit layer 111, so that when the metal film layer 140 is formed, the bottom of the metal film layer 140 has an uneven film structure, so that the metal film layer 140 changes with the film of the blocking structure 170, and the metal film layer 140 has a longer path. Moreover, more importantly, at the groove position of the blocking structure 170, when the metal film layer 140 is deposited, more metal film layers 140 will be accumulated, so that the thickness of the metal film layer 140 is thicker, and the ability of the metal film layer 140 to absorb water and oxygen is improved.

[0056] The number of the blocking structures 170 can be designed according to actual conditions, and the manufacturing process of the blocking structures 170 can be synchronized with the packaging barrier layer 160, but the height of the blocking structures 170 can be lower than the packaging barrier layer 160. The blocking structures 170 in this embodiment can be combined with the above-mentioned metal film layer 140 to be disposed on the packaging barrier dam or disposed under the packaging barrier dam in different implementation schemes.

[0057] In one embodiment, a groove may be provided at the position of the blocking structure 170 to form an uneven film layer structure. In the process of forming the metal film layer 140 , a metal film layer 140 with unevenness may also be formed.

[0058] It is understandable that the configuration of this embodiment is also applicable to the display panel 100 in the above embodiment, and by providing a protruding blocking structure 170 or a groove, the thickness of the metal film layer 140 is increased and the water and oxygen intrusion path is increased.

[0059] Embodiment 2:

[0060] Considering that corrosion of metal after absorbing water and oxygen is spreadable, when water and oxygen invade the encapsulation layer 150 of the display panel 100, the corrosion of the metal film layer 140 will spread accordingly. Based on this, this embodiment makes further improvements.

[0061] Figure 4 is a schematic diagram of a first display panel of a second embodiment of the present application, Figure 5 yes Figure 4 Schematic diagram of the cross section along the cutting line AA', see Figure 4-5 As shown, the present application also discloses a display panel 100, which includes a base substrate 110, a light-emitting unit layer 120, a transparent barrier layer 130, a metal film layer 140 and an encapsulation layer 150, wherein the metal film layer 140 includes at least one annular notch 141, and the annular notch 141 divides the metal film layer 140 into a first metal ring portion 142 and a second metal ring portion 143, and the annular notch 141 is arranged around the non-display area 102.

[0062] In this embodiment, the metal film layer 140 is divided into at least a first metal ring portion 142 and a second metal ring portion 143 by means of a ring-shaped notch 141. The first metal ring portion 142 is arranged in the inner circle, and the second metal ring portion 143 is arranged around the first metal ring portion 142. After the second metal ring portion 143 of the outer circle is corroded by water and oxygen, the metal corrosion needs to gradually extend along the metal to spread. For the position of the notch, the metal corrosion is difficult to extend. Therefore, the further extension of water and oxygen corrosion can be prevented. When the second metal ring portion 143 of the outer circle is not completely corroded, the first metal ring portion 142 can be protected from corrosion. For example, when there is a small amount of water and oxygen extending from a certain point, if there is no notch, the spread of metal corrosion spreads outward with the initial corrosion position as the center. Relatively speaking, when the longitudinal extension to the display area 101 and the lateral extension to the edge are consistent, the metal film layer 140 on the inner side will be corroded and spread, while the metal film layer 140 at other positions on the outer side is still intact. For example, after the annular notch 141 is provided in this embodiment, when a small amount of water and oxygen extend from a certain point, the metal corrosion of the second metal ring portion 143 will only spread horizontally, but will not spread vertically, that is, it will not spread to the first metal ring portion 142. When the amount of water and oxygen intrusion from the outside reaches the limit that the second metal ring portion 143 can absorb, the water and oxygen will be absorbed by the first metal ring portion 142. The vertical spreading direction refers to the direction toward the display area 101, and the horizontal spreading direction is perpendicular to the vertical spreading direction.

[0063] In one embodiment, the annular gap 141 may be formed by etching, that is, after the metal film layer 140 is formed in the non-display area 102 , the metal film layer 140 at the location of the annular gap 141 is removed by an etching process.

[0064] In another embodiment, by setting an extension portion of the transparent barrier layer 130 at the position of the annular notch 141, in the synchronous process of forming the transparent barrier layer 130, the extension portion of the transparent barrier layer 130 is synchronously formed at the position of the annular notch 141, and when the metal film layer 140 is formed, the metal film layer 140 is naturally no longer formed at the position of the annular notch 141.

[0065] Furthermore, the number of annular notches 141 and the width of the first metal ring portion 142 or the second metal ring portion 143 can be selected according to actual conditions. Generally speaking, the more annular notches 141 are set, the more multi-level surrounding metal film layers 140 can be formed, thereby achieving multi-level prevention of corrosion spread.

[0066] In this embodiment, when the display panel 100 is also provided with a plurality of blocking structures 170, the above-mentioned annular gap 141 can be provided corresponding to the plurality of blocking structures 170, so that a first metal ring portion 142 or a second metal ring portion 143 is formed between two blocking structures 170. On the one hand, the thickness of the metal film layer 140 formed between the two blocking structures 170 is thicker than the metal film layer 140 on the blocking structure 170, and has a better absorption effect. On the other hand, since a film layer is added to the blocking structure 170, the leveling area of ​​the organic encapsulation layer 152 will be reduced, resulting in problems with the leveling of the organic encapsulation layer 152.

[0067] Figure 6 is a schematic top view of the metal film layer of the present application, see Figure 6 As shown, the metal film layer 140 includes a plurality of hollow portions 145, and the plurality of hollow portions 145 are arranged in an array, and the metal film layer 140 is a mesh structure. In this embodiment, the metal film layer 140 can be provided with a plurality of strip-shaped metal film layers 140 arranged in a horizontal and vertical staggered manner by providing a plurality of hollow portions 145. The hollow portions 145 can also delay the occurrence of

[0068] In a specific embodiment, the hollow portion 145 is arranged on the first metal ring portion 142 or the second metal ring portion 143. By setting the first metal ring portion 142 or the second metal ring portion 143 as a mesh structure, the film layer interface between the two film layers at the position where the metal film layer 140 is set is made more complex, and has a longer water vapor and oxygen intrusion path, thereby achieving the effect of delaying water and oxygen.

[0069] Figure 7 is a schematic diagram of a second display panel of the second embodiment of the present application, see Figure 7 As shown, this embodiment provides another solution for preventing metal corrosion, specifically, by oxidizing the metal film layer 140 to achieve the effect of preventing the spread of metal corrosion.

[0070] Specifically, the metal film layer 140 also includes an annular oxidation portion 144, a first metal ring portion 142 and a second metal ring portion 143. The first metal ring portion 142 is arranged around the display area 101, the annular oxidation portion 144 is arranged around the first metal ring portion 142, and the second metal ring portion 143 is arranged around the annular oxidation portion 144; the annular oxidation portion 144 is formed by oxidizing the metal film layer 140 to form an annular oxidation portion 144 of oxidized metal material.

[0071] Figure 8 is a schematic diagram of the method for manufacturing the display panel of the present application, see Figure 8 As shown, corresponding to the above display panel, the present application also discloses a method for manufacturing a display panel, comprising the steps of:

[0072] S110: providing a substrate;

[0073] S120: forming a light-emitting unit layer on the base substrate, wherein the light-emitting unit layer is located in a display area;

[0074] S130: forming a transparent barrier layer on the light-emitting unit layer, wherein the transparent barrier layer extends from the display area to the non-display area;

[0075] S140: forming a metal film layer in the non-display area, wherein the metal film layer and the transparent barrier layer are located in the same layer;

[0076] S150: forming an encapsulation layer, wherein the encapsulation layer extends from the display area to the non-display area and covers the transparent barrier layer and the metal film layer.

[0077] The present application sets a metal film layer 140 below the encapsulation layer 150 of the non-display area 102, and utilizes the property of the metal film layer 140 to absorb water and oxygen to a certain extent. When the edge encapsulation of the display panel 100 fails or the display panel 100 ages after long-term use, causing water and oxygen to invade the metal film layer 140, the metal film layer 140 is sacrificed to absorb water and oxygen, and the metal film layer 140 is oxidized and corroded to absorb water and oxygen, thereby preventing water and oxygen from further invading the display area 101. In addition, the present application sets a transparent barrier layer 130 to prevent the light-emitting unit 121 of the display area 101 from being affected due to process reasons when the metal film layer 140 is formed, thereby improving the water and oxygen resistance of the display panel 100 without affecting the display panel 100, improving the encapsulation reliability of the display panel 100, and extending the service life of the display panel 100.

[0078] It is worth mentioning that the transparent barrier layer 130 and the metal film layer 140 are located in the same layer, which means that after the process of patterning the transparent barrier layer 130, the metal film layer 140 is formed in the area without the transparent barrier layer, so that the metal film layer 140 and the transparent barrier layer 130 are located in the same layer.

[0079] The transparent barrier layer is formed by using a cathode patterning material, and the metal film layer is formed by using a metal magnesium or metal silver material; the step S140 includes:

[0080] S141: depositing metal magnesium or metal silver material on the entire surface;

[0081] S142: In the display area, the cathode patterning material inhibits the metal magnesium or metal silver material from adhering, and the metal film layer is only formed in the non-display area.

[0082] In this embodiment, the metal film layer 140 is formed of metal magnesium or metal silver material, and the inhibition of the transparent barrier layer 130 can prevent metal magnesium or metal silver from being deposited on the transparent barrier layer 130. Specifically, after the transparent barrier layer 130 is formed, metal magnesium or metal silver material is deposited on the entire surface, and in the display area 101, the cathode 124 patterned material inhibits the adhesion of the metal magnesium or metal silver material, and the metal film layer 140 is only formed in the non-display area 102. Among them, the metal film layer 140 can be patterned by controlling the area of ​​the transparent barrier layer 130, and there is no need to remove the excess metal film layer 140 by etching. In contrast, the light-emitting unit 121 in the display area 101 can be protected from being affected by subsequent processes. Through the action of the transparent barrier layer 130, the metal film layer 140 can be deposited on the entire surface of the display panel 100 before the encapsulation layer 150 is formed. Since the metal film layer 140 cannot adhere to the transparent barrier layer 130 in the display area 101, the metal film layer 140 is finally formed only in the non-transparent barrier layer 130 area in the non-display area 102, and the subsequent transparent barrier layer 130 will not affect the normal formation of the encapsulation layer 150.

[0083] Fig. 9 is a schematic diagram of the display device of the present application, see Fig. 9 As shown, the present application further discloses a display device, the display device 200 includes a driving circuit 210 and a display panel 100100 in any of the above embodiments, the driving circuit 210 is used to drive the display panel 100100 to display.

[0084] It should be noted that the inventive concept of the present application can form a large number of embodiments, but the length of the application document is limited and it is impossible to list them one by one. Therefore, under the premise of no conflict, the embodiments or technical features described above can be arbitrarily combined to form new embodiments. After the embodiments or technical features are combined, the original technical effects will be enhanced.

[0085] The above content is a further detailed description of the present application in combination with specific optional implementation methods, and it cannot be determined that the specific implementation of the present application is limited to these descriptions. For ordinary technicians in the technical field to which the present application belongs, several simple deductions or substitutions can be made without departing from the concept of the present application, which should be deemed to fall within the scope of protection of the present application.

Claims

1. A display panel, comprising a display area and a non-display area, characterized in that: The display panel further includes: substrate substrate; A light emitting unit layer is disposed on the base substrate and located in the display area; A transparent barrier layer, disposed on the light-emitting unit layer and extending from the display area to the non-display area; a metal film layer, disposed in the non-display area and located in the same layer as the transparent barrier layer; and The encapsulation layer extends from the display area to the non-display area and is disposed on the transparent barrier layer and the metal film layer.

2. The display panel according to claim 1, characterized in that: The transparent barrier layer is formed by cathode patterning material, and the metal film layer is formed by metal magnesium or metal silver material; The metal film layer is used to deposit metal magnesium or metal silver material on the entire surface after the transparent barrier layer is formed. In the display area, the cathode patterning material inhibits the adhesion of the metal magnesium or metal silver material, and the metal film layer is only formed in the non-display area.

3. The display panel according to claim 1, characterized in that: The encapsulation layer comprises a first inorganic layer, an organic encapsulation layer and a second inorganic layer; The first inorganic layer is disposed on the transparent barrier layer and the metal film layer; the organic encapsulation layer is disposed on the first inorganic layer, and the second inorganic layer is disposed on the organic encapsulation layer; The display panel also includes an encapsulation barrier layer, which is arranged in the non-display area and is used to block the organic encapsulation layer. The first inorganic layer and the second inorganic layer extend from the encapsulation barrier layer in a direction away from the display area, and on the encapsulation barrier layer, the first inorganic layer and the second inorganic layer are in direct contact.

4. The display panel according to claim 3, characterized in that: The display panel further comprises at least two blocking structures, wherein the blocking structures are arranged on a side of the encapsulation blocking dam close to the display area and below the first inorganic layer; A gap is arranged between the two blocking structures, and the metal film layer covers the two blocking structures and the gap.

5. The display panel according to claim 1, characterized in that: The metal film layer includes at least one annular notch, which divides the metal film layer into a first metal ring portion and a second metal ring portion, and the annular notch is arranged around the non-display area.

6. The display panel according to claim 1, characterized in that: The metal film layer further comprises an annular oxidation portion, a first metal ring portion and a second metal ring portion, wherein the first metal ring portion is arranged around the display area, the annular oxidation portion is arranged around the first metal ring portion, and the second metal ring portion is arranged around the annular oxidation portion; The annular oxide portion is formed by oxidizing the metal film layer to form an annular oxide portion of oxidized metal material.

7. The display panel according to claim 1, characterized in that: The metal film layer includes a plurality of hollow parts, the plurality of hollow parts are arranged in an array, and the metal film layer is a mesh structure.

8. A method for manufacturing a display panel, characterized in that: Includes steps: Providing a substrate; Forming a light-emitting unit layer on the base substrate, wherein the light-emitting unit layer is located in a display area; forming a transparent barrier layer on the light-emitting unit layer, wherein the transparent barrier layer extends from the display area to the non-display area; forming a metal film layer in the non-display area, wherein the metal film layer and the transparent barrier layer are located in the same layer; A packaging layer is formed, wherein the packaging layer extends from the display area to the non-display area and covers the transparent barrier layer and the metal film layer.

9. The method for manufacturing a display panel according to claim 8, characterized in that: The transparent barrier layer is formed by cathode patterning material, and the metal film layer is formed by metal magnesium or metal silver material; The step of forming a metal film layer in the non-display area, wherein the metal film layer and the transparent barrier layer are located in the same layer, comprises: Depositing metal magnesium or metal silver material on the entire surface; In the display area, the cathode patterning material inhibits the metal magnesium or metal silver material from adhering, and the metal film layer is only formed in the non-display area.

10. A display device, characterized in that: It comprises a driving circuit and the display panel according to any one of claims 1 to 9, wherein the driving circuit is used to drive the display panel to display.

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