Cutting device and cutting method

Abstract

The invention provides a cutting device and a cutting method, and the cutting device comprises a bearing platform which is used for bearing a substrate, and the substrate is provided with a plurality of device regions and cutting channel regions which are connected with the adjacent device regions; the laser device is used for emitting laser to the cutting channel area of the substrate so as to cut the substrate; the calculation unit is used for calculating position coordinates of all the cutting channel areas according to the design sizes of the device area and the cutting channel areas so as to obtain cutting path coordinates; and the moving unit is used for controlling the bearing table to move along the cutting path coordinates. According to the technical scheme, the special-shaped chip in any shape can be obtained through cutting.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor integrated circuit manufacturing, and in particular to a cutting device and a cutting method. Background Art

[0002] At present, the mainstream wafer cutting methods include sawing, laser cutting, plasma cutting, stealth cutting, etc. Due to the limitation of cutting process, the shape of the chip obtained by cutting is rectangular. The corners of rectangular chips and the packaging module are prone to cracking or separation due to stress concentration. Therefore, packaging applications in the fields of MEMS devices, solar cells and optoelectronics require special-shaped (non-rectangular) chips, but the current cutting method is difficult to meet the cutting needs of special-shaped chips.

[0003] Therefore, how to cut and obtain special-shaped chips of any shape is an urgent problem to be solved. Summary of the invention

[0004] The object of the present invention is to provide a cutting device and a cutting method, so that special-shaped chips of any shape can be obtained by cutting.

[0005] To achieve the above object, the present invention provides a cutting device, comprising:

[0006] A carrier, used for carrying a substrate, wherein the substrate has a plurality of device regions and a cutting path region connecting adjacent device regions;

[0007] A laser, used for emitting laser light to a cutting path area of ​​the substrate to cut the substrate;

[0008] A calculation unit, used for calculating the position coordinates of all the cutting path areas according to the design dimensions of the device area and the cutting path area to obtain the cutting path coordinates;

[0009] The moving unit is used to control the bearing platform to move along the cutting path coordinates.

[0010] Optionally, the cutting device further comprises:

[0011] The coordinate system establishing unit is used to establish a plane rectangular coordinate system of the substrate, and the calculation unit is used to calculate the position coordinates of all the cutting road areas in the plane rectangular coordinate system.

[0012] Optionally, the device region is in a shape of a triangle, a polygon, a circle or an ellipse.

[0013] Optionally, the laser is green light or purple light, and the frequency of the laser is nanosecond, picosecond or femtosecond.

[0014] Optionally, the substrate is covered with a laser protection layer.

[0015] Optionally, the base includes a substrate and an insulating dielectric layer formed on the substrate, a metal layer is formed in the insulating dielectric layer, and the laser is used to cut the insulating dielectric layer and the metal layer in the cutting area; the cutting device also includes:

[0016] An etching unit is used for cutting the substrate in the cutting zone.

[0017] The present invention also provides a cutting method, comprising:

[0018] Providing a substrate, wherein the substrate has a plurality of device regions and a cutting path region connecting adjacent device regions;

[0019] Calculating the position coordinates of all the cutting path areas according to the design dimensions of the device area and the cutting path area to obtain the cutting path coordinates;

[0020] A laser is emitted to a cutting path region of the substrate to cut the substrate, and the substrate is controlled to move along the cutting path coordinates during the cutting process.

[0021] Optionally, before calculating the position coordinates of all the cutting street areas according to the design dimensions of the device area and the cutting street area, the cutting method further comprises:

[0022] A plane rectangular coordinate system of the substrate is established to calculate the position coordinates of all the cutting street areas in the plane rectangular coordinate system.

[0023] Optionally, the device region is in a shape of a triangle, a polygon, a circle or an ellipse.

[0024] Optionally, the laser is green light or purple light, and the frequency of the laser is nanosecond, picosecond or femtosecond.

[0025] Optionally, before emitting laser light to the cutting street area of ​​the substrate, the cutting method further comprises:

[0026] A laser protection layer is formed to cover the substrate.

[0027] Optionally, the base includes a substrate and an insulating dielectric layer formed on the substrate, a metal layer is formed in the insulating dielectric layer, and the laser is used to cut the insulating dielectric layer and the metal layer in the cutting area; the cutting method further includes:

[0028] The substrate in the cutting path region is cut using an etching process.

[0029] Compared with the prior art, the technical solution of the present invention has the following beneficial effects:

[0030] 1. The cutting device of the present invention comprises: a carrier for carrying a substrate, the substrate having a plurality of device areas and a cutting path area connecting adjacent device areas; a laser for emitting laser light to the cutting path area of ​​the substrate to cut the substrate; a calculation unit for calculating the position coordinates of all the cutting path areas according to the design dimensions of the device area and the cutting path area to obtain the cutting path coordinates; and a moving unit for controlling the carrier to move along the cutting path coordinates. This enables the cutting of any shaped chip.

[0031] 2. The cutting method of the present invention comprises: providing a substrate, the substrate having a plurality of device areas and a cutting path area connecting adjacent device areas; calculating the position coordinates of all the cutting path areas according to the design dimensions of the device areas and the cutting path areas to obtain the cutting path coordinates; emitting a laser to the cutting path area of ​​the substrate to cut the substrate, and controlling the substrate to move along the cutting path coordinates during the cutting of the substrate. This enables cutting to obtain special-shaped chips of any shape. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1a to Figure 1b is a schematic top view of a wafer including a special-shaped chip according to an embodiment of the present invention;

[0033] Figure 2 is a flow chart of a cutting method according to an embodiment of the present invention.

[0034] Among them, Figures 1 to Figure 2 The reference numerals are described as follows:

[0035] 10-substrate; 11-device area; 12-cutting path area. DETAILED DESCRIPTION

[0036] In order to make the purpose, advantages and features of the present invention more clear, the cutting device and cutting method proposed in the present invention are further described in detail below in conjunction with the accompanying drawings. It should be noted that the accompanying drawings are all in a very simplified form and are not in precise proportions, and are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention.

[0037] An embodiment of the present invention provides a cutting device, comprising: a supporting platform for supporting a substrate, the substrate having a plurality of device areas and a cutting path area connecting adjacent device areas; a laser for emitting laser light to the cutting path area of ​​the substrate to cut the substrate; a calculating unit for calculating the position coordinates of all the cutting path areas according to the design dimensions of the device area and the cutting path area to obtain the cutting path coordinates; and a moving unit for controlling the movement of the supporting platform along the cutting path coordinates.

[0038] See below Figure 1a to Figure 1bThe cutting device provided in this embodiment is introduced in detail.

[0039] The carrier (not shown) is used to carry a substrate 10, and the substrate 10 has a plurality of device regions 11 and a dicing zone 12 connecting adjacent device regions 11, and a device is obtained after dicing the dicing zone 12. The substrate 10 can be a semiconductor material or a non-semiconductor material. In the embodiment of the present application, the substrate 10 is a wafer, the device region 11 is a chip region, and the device obtained after dicing the dicing zone 12 is a chip.

[0040] The carrying platform is provided with an adsorption component or a clamping component, or both are provided, so that the substrate 10 can be fixed on the carrying platform by the adsorption component or the clamping component so that the substrate 10 can move with the carrying platform.

[0041] In one embodiment, the shape of the device area 11 can be a non-rectangular shape such as a triangle, polygon, circle or ellipse, so that after cutting, a special-shaped chip can be obtained. The polygon in the embodiment of the present application refers to a plane figure composed of five or more line segments connected end to end in sequence. Figure 1a As shown, the shape of the device region 11 is hexagonal; Figure 1b As shown, the shape of the device area 11 is circular. In other embodiments, the shape of the device area 11 may also be rectangular, so that rectangular chips are obtained after cutting.

[0042] The base 10 includes a substrate and an insulating dielectric layer formed on the substrate, wherein a metal layer is formed in the insulating dielectric layer. The type of the base 10 is not limited.

[0043] The laser (not shown) is used to emit laser light to the cutting street area 12 of the substrate 10 to cut the substrate 10 .

[0044] The carrying surface of the carrying platform faces the laser, the substrate 10 is fixed on the carrying surface of the carrying platform, and the substrate 10 is disposed between the laser and the carrying platform.

[0045] The laser emitted by the laser is used to cut the insulating medium layer and the metal layer in the cutting street area 12 to expose the substrate in the cutting street area 12 .

[0046] The laser can be green light or purple light, etc., and the frequency of the laser can be nanosecond, picosecond or femtosecond, etc. According to factors such as the material type and thickness of the insulating medium layer and the metal layer cut by the laser, the laser with a suitable wavelength and frequency is selected, and the laser with suitable parameters such as speed, pulse, power, etc. is selected.

[0047] The calculation unit is used to calculate the position coordinates of all the cutting street areas 12 according to the design dimensions of the device area 11 and the cutting street area 12 to obtain the cutting path coordinates.

[0048] In one embodiment, the position coordinates of the centers of all the cutting street areas 12 may be calculated so that the laser can emit the laser toward the center of the cutting street area 12 .

[0049] The design size refers to a size defined when the substrate 10 is designed.

[0050] The design dimensions of the device area 11 may include the side length of a triangle or polygon and the angle between adjacent sides, the radius of a circle, the major axis length and minor axis length of an ellipse, etc.; the design dimensions of the cutting road area 12 may include the width of the cutting road area 12, etc.

[0051] The cutting device further comprises: a coordinate system establishing unit for establishing a plane rectangular coordinate system of the substrate 10 , and the calculation unit is used for calculating the position coordinates of all the cutting lanes 12 in the plane rectangular coordinate system.

[0052] The horizontal axis of the plane rectangular coordinate system is the X axis, the vertical axis is the Y axis, and the intersection of the X axis and the Y axis is the coordinate origin. In one embodiment, a certain position at the center of the cutting road area 12 outside a certain device area 11 at the edge of the substrate 10 can be the coordinate origin; in another embodiment, the center of the substrate 10 can be the coordinate origin. The position of the coordinate origin is not limited.

[0053] When the shape of the device area 11 is a triangle or a polygon, the side of the device area 11 is a straight line, and the cutting road area 12 outside the device area 11 is also a straight line. The cutting road area 12 outside the device area 11 includes a horizontal cutting road area 12 parallel to the X-axis, a vertical cutting road area 12 perpendicular to the X-axis, and an inclined cutting road area 12 with an acute angle or an obtuse angle with the X-axis, so that the cutting path coordinates include the path coordinates of the horizontal straight line, the vertical straight line and the inclined straight line; when the shape of the device area 11 is a shape containing curves such as a circle or an ellipse, the cutting road area 12 outside the device area 11 is also a curve, so that the cutting path coordinates are the path coordinates of the curve.

[0054] by Figure 1aTaking the shape of the device area 11 shown as a hexagon as an example, the step of calculating the cutting path coordinates may include: taking the center of the cutting road area 12 at one of the corners of a device area 11 located at the edge of the substrate 10 as the coordinate origin; since the edge of the device area 11 and the cutting road area 12 are both straight lines, the position coordinates of the cutting path between the coordinate origin and the center of the cutting road area 12 at the corner adjacent to the coordinate origin of the device area 11 can be calculated according to the formula y=ax+b, that is, the position coordinates of the center of the cutting road area 12 corresponding to a certain edge of the device area 11 are obtained, and the position coordinates of the center of the cutting road area 12 corresponding to the other five edges of the device area 11 can be calculated and the cutting path coordinates of the device area 11 can be obtained by analogy; then, the position coordinates of the center of the cutting road area 12 outside all the device areas 11 can be calculated according to the above steps, and the cutting path coordinates of all the device areas 11 can be obtained. After determining the position of the coordinate origin, a and b in the formula y=ax+b can be calculated based on the side length of the hexagonal device area 11 and the angle between adjacent sides and the width of the cutting road area 12 .

[0055] In other embodiments, when the shape of the device area 11 is circular, in the above step of calculating the cutting path coordinates, the formula (xa)2+(yb)2=r 2 The position coordinates of the center of the cutting path area 12 outside all the device areas 11 are calculated, and then the cutting path coordinates of all the device areas 11 are obtained; wherein r is the radius of the circular device area 11, (a, b) are the coordinates of the center of the circle, and after determining the position of the coordinate origin, a and b can be calculated based on the radius of the circular device area 11 and the width of the cutting path area 12.

[0056] In other embodiments, when the shape of the device area 11 is an ellipse, in the above-mentioned step of calculating the cutting path coordinates, the position coordinates of the center of the cutting road area 12 outside all the device areas 11 can be calculated according to the standard equation or non-standard equation corresponding to the ellipse, and then the cutting path coordinates of all the device areas 11 are obtained; wherein, the formula corresponding to the ellipse is related to the major axis length, minor axis length and center coordinates of the ellipse, and the center coordinates of the ellipse can be calculated based on the major axis length, minor axis length and width of the cutting road area 12.

[0057] Therefore, for the device regions 11 of different shapes, the position coordinates of all the cutting road regions 12 can be calculated according to the design sizes of the device region 11 and the cutting road region 12 using formulas corresponding to different shapes to obtain the cutting path coordinates.

[0058] The moving unit is used to control the movement of the carrier along the cutting path coordinates. The moving unit can also be used to control the movement of the laser along the cutting path coordinates, that is, the laser cutting can be achieved by controlling the movement of the carrier or the laser, or by controlling the movement of the carrier and the laser at the same time. Preferably, the moving unit is used to control the movement of the carrier along the cutting path coordinates, and the laser remains fixed; or, the moving unit is used to control the movement of the laser along the cutting path coordinates, and the carrier remains fixed.

[0059] During the laser cutting, the support platform and / or the laser moves from the coordinate origin along the cutting path coordinates, so that the laser completes the cutting of the insulating medium layer and the metal layer in all the cutting path areas 12 .

[0060] When the shape of the device area 11 is a triangle or a polygon, during the cutting process, the support platform and / or the laser moves along the cutting path coordinates of a horizontal straight line, a vertical straight line, and an inclined straight line; when the shape of the device area 11 is a shape containing curves such as a circle or an ellipse, during the cutting process, the support platform and / or the laser moves along the cutting path coordinates of the curve.

[0061] Preferably, the substrate 10 is covered with a laser protection layer (not shown).

[0062] The material of the laser protection layer may be a water-soluble resin with high viscosity. The laser protection layer is coated on the substrate 10 by spin coating. The laser protection layer covers the device area 11 and the cutting road area 12 .

[0063] The laser protection layer is used to protect the device area 11 during laser cutting to prevent slag generated by laser cutting from adhering to the device area 11; and the laser protection layer can also protect the device area 11 from being etched when an etching unit is used to cut the substrate of the cutting area 12 later.

[0064] It should be noted that when the laser is cutting the cutting street area 12 , the laser protection layer on the cutting street area 12 is vaporized under the action of the laser.

[0065] The cutting device further comprises: an etching unit for cutting the substrate in the cutting zone 12 to obtain a device. The etching unit may be dry etching (eg plasma etching) or wet etching.

[0066] After the etching unit cuts the substrate in the cutting street area 12 , the laser protection layer is cleaned and removed.

[0067] From the above content, it can be known that the calculation unit calculates the position coordinates of all the cutting path areas 12 according to the design dimensions of the device area 11 and the cutting path area 12 to obtain the cutting path coordinates; the moving unit controls the carrier to move along the cutting path coordinates, so that the carrier moves according to the position coordinates of the cutting path area 12 to realize the laser cutting of all the cutting path areas 12 without considering the cutting shape, that is, the carrier can move along the cutting path coordinates of horizontal and vertical lines, and can also move along the cutting path coordinates of inclined lines and curves, so as to meet the cutting requirements of special-shaped chips of any shape, and can cut and obtain special-shaped chips of any shape; and, by first using the laser to cut the insulating medium layer and the metal layer of the cutting path area 12, and then etching and cutting the substrate of the cutting path area 12, the cutting path area 12 can normally set the metal layer as a test structure, etc., to avoid affecting the test of the substrate 10, etc., and this cutting method can also avoid defects such as edge collapse and cracks.

[0068] In summary, the cutting device of the present invention comprises: a carrier for carrying a substrate, the substrate having a plurality of device areas and a cutting path area connecting adjacent device areas; a laser for emitting laser light to the cutting path area of ​​the substrate to cut the substrate; a calculation unit for calculating the position coordinates of all the cutting path areas according to the design dimensions of the device area and the cutting path area to obtain the cutting path coordinates; and a moving unit for controlling the carrier to move along the cutting path coordinates. The cutting device of the present invention can cut and obtain special-shaped chips of any shape.

[0069] An embodiment of the present invention provides a cutting method. Figure 2 , the cutting method comprises:

[0070] Step S1, providing a substrate, wherein the substrate has a plurality of device regions and a cutting path region connecting adjacent device regions;

[0071] Step S2, calculating the position coordinates of all the cutting path areas according to the design dimensions of the device area and the cutting path area to obtain the cutting path coordinates;

[0072] Step S3, emitting laser light to the cutting path area of ​​the substrate to cut the substrate, and controlling the substrate to move along the cutting path coordinates during the process of cutting the substrate.

[0073] See below Figure 1a to Figure 1b The cutting method is described in detail.

[0074] According to step S1, a substrate 10 is provided, wherein the substrate 10 has a plurality of device regions 11 and a dicing zone region 12 connecting adjacent device regions 11, and a device is obtained after dicing the dicing zone region 12. The substrate 10 may be a semiconductor material or a non-semiconductor material. In the embodiment of the present application, the substrate 10 is a wafer, the device region 11 is a chip region, and the device obtained after dicing the dicing zone region 12 is a chip.

[0075] In one embodiment, the shape of the device area 11 can be a non-rectangular shape such as a triangle, polygon, circle or ellipse, so that after cutting, a special-shaped chip can be obtained. The polygon in the embodiment of the present application refers to a plane figure composed of five or more line segments connected end to end in sequence. Figure 1a As shown, the shape of the device region 11 is hexagonal; Figure 1b As shown, the shape of the device area 11 is circular. In other embodiments, the shape of the device area 11 may also be rectangular, so that rectangular chips are obtained after cutting.

[0076] The base 10 includes a substrate and an insulating dielectric layer formed on the substrate, wherein a metal layer is formed in the insulating dielectric layer. The type of the base 10 is not limited.

[0077] Step S2 : calculating the position coordinates of all the cutting path regions 12 according to the design dimensions of the device region 11 and the cutting path region 12 to obtain the cutting path coordinates.

[0078] In one embodiment, the position coordinates of the centers of all the cutting street areas 12 may be calculated so that laser light can be emitted to the centers of the cutting street areas 12 subsequently.

[0079] The design size refers to a size defined when the substrate 10 is designed.

[0080] The design dimensions of the device area 11 may include the side length of a triangle or polygon and the angle between adjacent sides, the radius of a circle, the major axis length and minor axis length of an ellipse, etc.; the design dimensions of the cutting road area 12 may include the width of the cutting road area 12, etc.

[0081] Before calculating the position coordinates of all the cutting street areas 12 according to the design dimensions of the device area 11 and the cutting street area 12, the cutting method further includes: establishing a plane rectangular coordinate system of the substrate 10 to calculate the position coordinates of all the cutting street areas 12 in the plane rectangular coordinate system.

[0082] The horizontal axis of the plane rectangular coordinate system is the X axis, the vertical axis is the Y axis, and the intersection of the X axis and the Y axis is the coordinate origin. In one embodiment, a certain position at the center of the cutting road area 12 outside a certain device area 11 at the edge of the substrate 10 can be the coordinate origin; in another embodiment, the center of the substrate 10 can be the coordinate origin. The position of the coordinate origin is not limited.

[0083] When the shape of the device area 11 is a triangle or a polygon, the side of the device area 11 is a straight line, and the cutting road area 12 outside the device area 11 is also a straight line. The cutting road area 12 outside the device area 11 includes a horizontal cutting road area 12 parallel to the X-axis, a vertical cutting road area 12 perpendicular to the X-axis, and an inclined cutting road area 12 with an acute angle or an obtuse angle with the X-axis, so that the cutting path coordinates include the path coordinates of the horizontal straight line, the vertical straight line and the inclined straight line; when the shape of the device area 11 is a shape containing curves such as a circle or an ellipse, the cutting road area 12 outside the device area 11 is also a curve, so that the cutting path coordinates are the path coordinates of the curve.

[0084] by Figure 1a Taking the shape of the device area 11 shown as a hexagon as an example, the step of calculating the cutting path coordinates may include: taking the center of the cutting road area 12 at one of the corners of a device area 11 located at the edge of the substrate 10 as the coordinate origin; since the edge of the device area 11 and the cutting road area 12 are both straight lines, the position coordinates of the cutting path between the coordinate origin and the center of the cutting road area 12 at the corner adjacent to the coordinate origin of the device area 11 can be calculated according to the formula y=ax+b, that is, the position coordinates of the center of the cutting road area 12 corresponding to a certain edge of the device area 11 are obtained, and the position coordinates of the center of the cutting road area 12 corresponding to the other five edges of the device area 11 can be calculated and the cutting path coordinates of the device area 11 can be obtained by analogy; then, the position coordinates of the center of the cutting road area 12 outside all the device areas 11 can be calculated according to the above steps, and the cutting path coordinates of all the device areas 11 can be obtained. After determining the position of the coordinate origin, a and b in the formula y=ax+b can be calculated based on the side length of the hexagonal device area 11 and the angle between adjacent sides and the width of the cutting road area 12 .

[0085] In other embodiments, when the shape of the device area 11 is circular, in the above step of calculating the cutting path coordinates, the formula (xa)2+(yb)2=r 2The position coordinates of the center of the cutting path area 12 outside all the device areas 11 are calculated, and then the cutting path coordinates of all the device areas 11 are obtained; wherein r is the radius of the circular device area 11, (a, b) are the coordinates of the center of the circle, and after determining the position of the coordinate origin, a and b can be calculated based on the radius of the circular device area 11 and the width of the cutting path area 12.

[0086] In other embodiments, when the shape of the device area 11 is an ellipse, in the above-mentioned step of calculating the cutting path coordinates, the position coordinates of the center of the cutting road area 12 outside all the device areas 11 can be calculated according to the standard equation or non-standard equation corresponding to the ellipse, and then the cutting path coordinates of all the device areas 11 are obtained; wherein, the formula corresponding to the ellipse is related to the major axis length, minor axis length and center coordinates of the ellipse, and the center coordinates of the ellipse can be calculated based on the major axis length, minor axis length and width of the cutting road area 12.

[0087] Therefore, for the device regions 11 of different shapes, the position coordinates of all the cutting road regions 12 can be calculated according to the design sizes of the device region 11 and the cutting road region 12 using formulas corresponding to different shapes to obtain the cutting path coordinates.

[0088] Step S3 , emitting laser light to the cutting path region 12 of the substrate 10 to cut the substrate 10 , and controlling the substrate 10 to move along the cutting path coordinates during the process of cutting the substrate 10 .

[0089] That is, the laser cutting can be achieved by controlling the movement of the substrate 10, or by controlling the movement of the laser, or by controlling the movement of the substrate 10 and the laser at the same time. Preferably, the substrate 10 is controlled to move, and the laser is kept fixed; or, the laser is controlled to move, and the substrate 10 is kept fixed.

[0090] The laser is used to cut the insulating medium layer and the metal layer in the scribe line area 12 to expose the substrate in the scribe line area 12 .

[0091] During the laser cutting, the substrate 10 and / or the laser moves from the coordinate origin along the cutting path coordinates, so that the laser completes the cutting of the insulating medium layer and the metal layer in all the cutting path areas 12 .

[0092] When the shape of the device area 11 is a triangle or a polygon, during the cutting process, the support platform and / or the laser moves along the cutting path coordinates of a horizontal straight line, a vertical straight line, and an inclined straight line; when the shape of the device area 11 is a shape containing curves such as a circle or an ellipse, during the cutting process, the support platform and / or the laser moves along the cutting path coordinates of the curve.

[0093] The laser can be green light or purple light, etc., and the frequency of the laser can be nanosecond, picosecond or femtosecond, etc. According to factors such as the material type and thickness of the insulating medium layer and the metal layer cut by the laser, the laser with a suitable wavelength and frequency is selected, and the laser with suitable parameters such as speed, pulse, power, etc. is selected.

[0094] Preferably, before emitting laser light to the cutting street area 12 of the substrate 10 , the cutting method further comprises: forming a laser protection layer (not shown) covering the substrate 10 .

[0095] The material of the laser protection layer may be a water-soluble resin with high viscosity. The laser protection layer is coated on the substrate 10 by spin coating. The laser protection layer covers the device area 11 and the cutting road area 12 .

[0096] The laser protection layer is used to protect the device area 11 during laser cutting to prevent slag generated by laser cutting from adhering to the device area 11; and the laser protection layer can also protect the device area 11 from being etched when the substrate of the cutting area 12 is subsequently cut using an etching process.

[0097] It should be noted that when the laser is cutting the cutting street area 12 , the laser protection layer on the cutting street area 12 is vaporized under the action of the laser.

[0098] The cutting method further comprises: cutting the substrate in the cutting zone 12 by an etching process, thereby obtaining a device. The etching process may be dry etching (eg plasma etching) or wet etching.

[0099] After the substrate in the cutting street area 12 is cut by an etching process, the laser protection layer is cleaned and removed.

[0100] As can be seen from the above content, by calculating the position coordinates of all the cutting path areas 12 according to the design dimensions of the device area 11 and the cutting path area 12, the cutting path coordinates are obtained; and in the process of cutting the substrate 10, the substrate 10 is controlled to move along the cutting path coordinates, so that the substrate 10 moves according to the position coordinates of the cutting path area 12 to realize the laser cutting of all the cutting path areas 12, without considering the cutting shape, that is, the substrate 10 can move along the cutting path coordinates of horizontal straight lines and vertical straight lines, and can also move along the cutting path coordinates of inclined straight lines and curves, so that the cutting requirements of special-shaped chips of any shape can be met, and special-shaped chips of any shape can be cut and obtained; and, by first using the laser to cut the insulating medium layer and the metal layer of the cutting path area 12, and then etching and cutting the substrate of the cutting path area 12, the cutting path area 12 can normally set the metal layer as a test structure, etc., to avoid affecting the test of the substrate 10, etc., and this cutting method can also avoid defects such as edge collapse and cracks.

[0101] In summary, the cutting method of the present invention comprises: providing a substrate, the substrate having a plurality of device areas and a cutting path area connecting adjacent device areas; calculating the position coordinates of all the cutting path areas according to the design dimensions of the device areas and the cutting path areas to obtain the cutting path coordinates; emitting a laser to the cutting path area of ​​the substrate to cut the substrate, and controlling the substrate to move along the cutting path coordinates during the process of cutting the substrate. The cutting method of the present invention can cut and obtain special-shaped chips of any shape.

[0102] The above description is only a description of the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention. Any changes or modifications made by a person skilled in the art in the field of the present invention based on the above disclosure shall fall within the scope of protection of the claims.

Claims

1. A cutting device, It is characterized in that include: A carrier, used for carrying a substrate, wherein the substrate has a plurality of device regions and a cutting path region connecting adjacent device regions; A laser, used for emitting laser light to a cutting path area of ​​the substrate to cut the substrate; A calculation unit, used for calculating the position coordinates of all the cutting path areas according to the design dimensions of the device area and the cutting path area to obtain the cutting path coordinates; The moving unit is used to control the bearing platform to move along the cutting path coordinates.

2. The cutting device according to claim 1, It is characterized in that The cutting device also includes: The coordinate system establishing unit is used to establish a plane rectangular coordinate system of the substrate, and the calculation unit is used to calculate the position coordinates of all the cutting road areas in the plane rectangular coordinate system.

3. The cutting device according to claim 1, It is characterized in that The device region is in the shape of a triangle, a polygon, a circle or an ellipse.

4. The cutting device according to claim 1, It is characterized in that The laser is green light or purple light, and the frequency of the laser is nanosecond, picosecond or femtosecond.

5. The cutting device according to claim 1, It is characterized in that The substrate is covered with a laser protection layer.

6. The cutting device according to claim 1, It is characterized in that The base comprises a substrate and an insulating dielectric layer formed on the substrate, a metal layer is formed in the insulating dielectric layer, and the laser is used to cut the insulating dielectric layer and the metal layer in the cutting area; the cutting device also comprises: An etching unit is used for cutting the substrate in the cutting zone.

7. A cutting method, It is characterized in that include: Providing a substrate, wherein the substrate has a plurality of device regions and a cutting path region connecting adjacent device regions; Calculating the position coordinates of all the cutting path areas according to the design dimensions of the device area and the cutting path area to obtain the cutting path coordinates; A laser is emitted to a cutting path region of the substrate to cut the substrate, and the substrate is controlled to move along the cutting path coordinates during the cutting process.

8. The cutting method according to claim 7, It is characterized in that Before calculating the position coordinates of all the cutting street areas according to the design dimensions of the device area and the cutting street area, the cutting method further comprises: A plane rectangular coordinate system of the substrate is established to calculate the position coordinates of all the cutting street areas in the plane rectangular coordinate system.

9. The cutting method according to claim 7, It is characterized in that The device region is in the shape of a triangle, a polygon, a circle or an ellipse.

10. The cutting method according to claim 7, It is characterized in that The laser is green light or purple light, and the frequency of the laser is nanosecond, picosecond or femtosecond.

11. The cutting method according to claim 7, It is characterized in that Before emitting laser light to the cutting street area of ​​the substrate, the cutting method further comprises: A laser protection layer is formed to cover the substrate.

12. The cutting method according to claim 7, It is characterized in that The base comprises a substrate and an insulating dielectric layer formed on the substrate, a metal layer is formed in the insulating dielectric layer, and the laser is used to cut the insulating dielectric layer and the metal layer in the cutting area; the cutting method further comprises: The substrate in the cutting path region is cut using an etching process.

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