Intelligent grinding and polishing control method and system

Abstract

The invention provides an intelligent grinding and polishing control method and system, and belongs to the technical field of grinding and polishing control. The method comprises the steps that the target single-time machining amount and the total machining frequency are determined according to the total machining allowance of a current machining face and the type of a current abrasive; the first temperature of the current grinding material, the second temperature of the current machining face, the working face shape information of the current grinding material, the surface shape information of the current machining face and the current machining frequency are detected; determining the contact area of the current grinding material and the current machining surface according to the working surface shape information and the surface shape information; and during accurate grinding, whether cooling liquid for grinding and polishing is provided or not is judged according to the current machining times, the first temperature, the second temperature and accumulated machining heat, and the accumulated machining heat is calculated according to the target single-time machining amount and the contact area. According to the intelligent grinding and polishing control method and system, starting of wet grinding can be more accurately controlled, and the control accuracy is improved.

Description

Technical Field

[0001] The present application relates to the field of grinding and polishing control technology, and in particular to an intelligent grinding and polishing control method and system. Background Art

[0002] For the surface processing of some complex workpieces, it is necessary to divide it into rough processing and fine processing. For example, for parts such as blade disks that have multiple types of complex surfaces to be processed, when they are automatically ground and polished, they will be divided into two stages of processing: rough grinding and fine grinding / polishing. In the rough grinding stage, the main purpose is to remove the excess high points of each processing surface and reduce the roughness. For example, the excess high points of the flow path surface and the blade root fillet are removed, and the roughness of the blade surface is reduced. In the fine grinding / polishing stage, the roughness of each processing surface will be further processed so that each processing surface can obtain the target roughness.

[0003] In order to reduce the adverse effects of processing heat on the product, such as shape and size deformation, surface blackening and modification, the prior art controls the introduction of cooling grinding fluid to the processing position, thereby improving the processing conditions, extending the life of the abrasive, and improving production efficiency and product quality. Generally, the time for introducing the grinding fluid is controlled according to the temperature of the current processing surface or the abrasive currently in use, that is, when the temperature of the processing surface and / or the abrasive is too high, the grinding fluid is introduced to play a cooling role. However, this control method considers relatively single factors and cannot accurately reflect the processing heat, so the control accuracy is low. Summary of the invention

[0004] An object of the first aspect of the present invention is to provide an intelligent grinding and polishing control method that can improve the accuracy of coolant control for grinding and polishing.

[0005] Another object of the present invention is to make the timing of wet mill start-up more precise.

[0006] A further object of the present invention is to more accurately derive the accumulated processing heat.

[0007] Another object of the present invention is to make the control method more consistent with the temperature variation characteristics of the processing process.

[0008] An object of the second aspect of the present invention is to provide an intelligent grinding and polishing control system for executing the above-mentioned intelligent grinding and polishing control method.

[0009] In particular, the present application proposes an intelligent grinding and polishing control method, comprising:

[0010] Determine the target single processing amount and total processing times according to the total processing allowance of the current processing surface and the type of current abrasive;

[0011] Detecting the first temperature of the current abrasive, the second temperature of the current processing surface, the working surface shape information of the current abrasive, the surface shape information of the current processing surface, and the current processing times;

[0012] Determining a contact area between the current abrasive and the current processing surface according to the working surface shape information and the surface shape information;

[0013] During fine grinding, whether to provide grinding and polishing coolant is determined based on the current number of processing times, the first temperature, the second temperature and the accumulated processing heat, wherein the accumulated processing heat is calculated based on the target single processing amount and the contact area.

[0014] Further, the step of determining whether to provide a grinding and polishing coolant according to the current number of processing times, the first temperature, the second temperature and the accumulated processing heat comprises:

[0015] When the current processing number is greater than or equal to a first preset value, if the first temperature is greater than a first temperature threshold or the second temperature is greater than a second temperature threshold or the accumulated processing heat is greater than a first heat threshold, coolant for grinding and polishing is provided.

[0016] Furthermore, the cumulative processing heat is calculated according to the following formula:

[0017]

[0018] Among them, Q is the cumulative processing heat, M is the target single processing amount, S is the contact area, fi is the attenuation coefficient, i is the current processing number, and n is the total processing number.

[0019] Furthermore, the attenuation coefficient is determined according to an actual single processing amount and the roughness of the current processing surface.

[0020] Furthermore, the attenuation coefficient is determined according to the following formula:

[0021]

[0022] Among them, k1 and k2 are preset weight coefficients, R i-1 is the actual roughness after the i-1th processing, R' i is the target roughness of the i-th processing, D i-1 is the actual single processing amount of the i-1th processing, D is the target single processing amount, m is a negative integer less than -1, and n is a positive integer greater than 1.

[0023] Further, the step of determining whether to provide a grinding and polishing coolant according to the current number of processing times, the first temperature, the second temperature and the accumulated processing heat comprises:

[0024] When the current processing times are less than a first preset value, if the first temperature is greater than a third temperature threshold or the second temperature is greater than a fourth temperature threshold or the accumulated processing heat is greater than a second heat threshold, a grinding and polishing coolant is provided.

[0025] Furthermore, the accumulated processing heat is the product of the target single processing amount, the contact area and the current processing times.

[0026] Furthermore, the intelligent grinding and polishing control method also includes:

[0027] Provide grinding and polishing coolant during rough grinding.

[0028] In particular, an embodiment of the present invention further provides an intelligent grinding and polishing control system for executing any of the intelligent grinding and polishing control methods described above, wherein the intelligent grinding and polishing control system comprises the following steps:

[0029] A processing mode determination unit is used to determine a target single processing amount and a total number of processing times according to a total processing allowance of a current processing surface and a type of a current abrasive;

[0030] A temperature detection unit, used to detect a first temperature of a current abrasive and a second temperature of a current processing surface;

[0031] An abrasive and processing surface information acquisition unit, used to acquire the working surface shape information of the current abrasive and the surface shape information of the current processing surface;

[0032] a control unit, configured to determine the contact area between the current abrasive and the current processing surface according to the working surface shape information and the surface shape information, and to determine whether to provide a grinding and polishing coolant according to the current processing times, the first temperature, the second temperature and the accumulated processing heat during fine grinding, wherein the accumulated processing heat is calculated according to the target single processing amount and the contact area;

[0033] The coolant circulation device is used to start when the coolant for grinding and polishing needs to be provided.

[0034] Furthermore, the abrasive and processing surface information collection unit is a visual inspection device.

[0035] According to a first aspect of the present invention, an intelligent grinding and polishing control method is provided. In the fine grinding stage, the intelligent grinding and polishing control method determines whether to provide grinding and polishing coolant according to the current number of processing times, the first temperature of the current abrasive, the second temperature of the current processing surface and the accumulated processing heat, that is, determines whether to adopt dry grinding or wet grinding process. In addition to considering the temperature factors of the abrasive and the processing surface, this method for determining dry grinding or wet grinding also makes a comprehensive judgment based on the current number of processing times and the accumulated processing heat, so that it can be determined in stages whether to provide grinding and polishing coolant according to the accumulated heat, thereby more accurately controlling the start of wet grinding and improving the accuracy of control.

[0036] Furthermore, an attenuation coefficient is introduced in the calculation of the cumulative processing heat. This is because as the number of processing times increases, the roughness of the current processing surface becomes closer and closer to the target roughness, so the processing heat gradually decays. Therefore, as the number of processing times increases, the corresponding attenuation coefficient can be set to gradually decrease, so that the calculated cumulative processing heat is more accurate, and the timing of controlling the start of wet grinding is more accurate.

[0037] Furthermore, the present invention also provides a formula for determining the attenuation coefficient, which includes multiple terms of the ratio of the actual roughness of the last processing to the roughness of this time and multiple terms of the actual single processing amount of the last processing and the target single processing amount of this time. Therefore, it can reflect the difference between the actual roughness and the target roughness, and the nonlinear influence of the difference between the actual single processing amount of the last processing and the target single processing amount of this time on the cumulative processing heat, thereby more accurately deriving the cumulative processing heat.

[0038] Furthermore, a weight coefficient is set in the calculation formula of the attenuation coefficient of the intelligent grinding and polishing control method, so that the weight coefficient can be set according to the control target, making the formula more flexible and adjustable according to actual conditions. In some embodiments, the weight coefficient can also be determined by simulation or experiment, so that the accumulated processing heat can be obtained more accurately.

[0039] Furthermore, the intelligent grinding and polishing control method also considers the influence of the current number of processing times when judging whether to provide cooling liquid for grinding and polishing. When the current number of processing times is less than the first preset value, the cumulative processing heat is the product of the target single processing amount and the current number of processing times, that is, no attenuation coefficient is introduced. This is because in the early stage of processing, there is often a large difference between the actual processing amount and the target processing amount. At this time, a simple processing heat calculation method can be used to quickly calculate the cumulative processing heat. And because the temperature of the current processing surface and the current abrasive will rise rapidly in the early stage of processing, the temperature threshold should be set different from when the current number of processing times is greater than or equal to the first preset value, so as to be more in line with the temperature change characteristics of the processing process.

[0040] Furthermore, the intelligent grinding and polishing control method also distinguishes between the rough grinding stage and the fine grinding stage. The purpose of rough grinding is usually to remove a large amount of excess, so the excess removal in the rough grinding stage is large and the corresponding processing heat generated is high. Therefore, using wet grinding in the rough grinding stage can avoid a large amount of heat accumulation. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1 A flow chart of an intelligent grinding and polishing control method according to an embodiment of the present invention is shown;

[0042] Figure 2 A flow chart of an intelligent grinding and polishing control method according to another embodiment of the present invention is shown;

[0043] Figure 3 It shows a connection block diagram of an intelligent grinding and polishing control system according to an embodiment of the present invention;

[0044] Reference numerals:

[0045] 100-intelligent grinding and polishing control system, 10-processing mode determination unit, 20-temperature detection unit, 30-abrasive and processing surface information acquisition unit, 40-control unit, 50-cooling liquid circulation device. DETAILED DESCRIPTION

[0046] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0047] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it may be directly on the other component or there may also be a central component. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may be a central component at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the specification of this application are for illustrative purposes only and do not represent the only implementation method.

[0048] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0049] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first feature is directly in contact with the second feature, or the first feature and the second feature are in contact indirectly through an intermediate medium. Moreover, a first feature being “above”, “above”, or “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, or “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0050] Unless otherwise defined, all technical and scientific terms used in the specification of this application have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used in the specification of this application includes any and all combinations of one or more related listed items.

[0051] Figure 1 FIG. 2 shows a flow chart of an intelligent grinding and polishing control method according to an embodiment of the present invention. Figure 1 As shown, in one embodiment of the present invention, the intelligent grinding and polishing control method includes:

[0052] Step S100, determining a target single processing amount and a total processing number according to a total processing allowance of a current processing surface and a type of a current abrasive;

[0053] Step S200, detecting the first temperature of the current abrasive, the second temperature of the current processing surface, the working surface shape information of the current abrasive, the surface shape information of the current processing surface, and the current processing times;

[0054] Step S300, determining the contact area between the current abrasive and the current processing surface according to the working surface shape information and the surface shape information;

[0055] Step S400, during fine grinding, whether to provide grinding and polishing coolant is determined based on the current number of processing times, the first temperature, the second temperature and the accumulated processing heat, wherein the accumulated processing heat is calculated based on the target single processing amount and the contact area.

[0056] For blade disk parts, the processing surfaces in step S100 include flow path surface, blade root fillet, blade back profile, blade basin profile, air inlet edge, exhaust edge and wheel disc end face, etc. Different processing surfaces may require different grinding and polishing tools and abrasive types. For example, a slender rod sanding machine is required for processing flow path surface and profile, a cylindrical grinding head is required for grinding and polishing of the air inlet edge, and a small roughly conical grinding and polishing head is required for blade root fillet. After the processing surface is determined, the corresponding grinding and polishing tools and abrasive types are determined, and the corresponding processing parameters are also determined. Specifically, the single processing amount and the total number of processing times are set according to the total processing allowance of the current processing surface.

[0057] In step S200, two temperature sensors can be used to detect the first temperature of the abrasive and the second temperature of the current processing surface. The working surface shape information of the current abrasive and the surface shape information of the current processing surface can be collected by a visual detection device. The current processing times can be accumulated by a counter.

[0058] In step S300, since the shapes of the surfaces to be processed of the parts to be processed are different, the shapes of the abrasives are also different. Therefore, when grinding and polishing a specific surface to be processed, the contact area between the abrasive and the surface to be processed is different. The contact area between the two can be obtained in advance based on the simulation, and then the corresponding contact area can be extracted when the current processing surface is identified.

[0059] The intelligent grinding and polishing control method in this embodiment determines whether to provide grinding and polishing coolant during the fine grinding stage based on the current number of processing times, the first temperature of the current abrasive, the second temperature of the current processing surface and the accumulated processing heat, that is, determines whether to adopt dry grinding or wet grinding process. This method of determining dry grinding or wet grinding not only considers the temperature factors of the abrasive and the processing surface, but also makes a comprehensive judgment based on the current number of processing times and the accumulated processing heat. Therefore, it is possible to determine whether to provide grinding and polishing coolant in stages based on the accumulated heat, thereby more accurately controlling the start of wet grinding and improving the accuracy of control.

[0060] Figure 2 A flow chart of an intelligent grinding and polishing control method according to another embodiment of the present invention is shown. In one embodiment, the following steps are further included between step S200 and step S300:

[0061] Step S220, determining whether the current abrasive is suitable for wet grinding, if so, proceeding to step S240, otherwise, proceeding to step S260;

[0062] Step S240, determining whether the current processing stage is in the fine grinding stage, if so, proceeding to step S300, otherwise proceeding to step S280;

[0063] Step S260, not providing cooling liquid for grinding and polishing, and controlling grinding and polishing working parameters according to temperature;

[0064] Step S280, providing a coolant for grinding and polishing;

[0065] After step S300, the following steps are also included:

[0066] Step S420, determining whether the current processing times is greater than or equal to a first preset value, if yes, proceeding to step S430, otherwise proceeding to step S440;

[0067] Step S430, determining whether the following conditions are met at the same time: the first temperature T1 is less than or equal to the first temperature threshold T 10 The second temperature T2 is less than or equal to the second temperature threshold T 20 , and the accumulated processing heat Q a Less than or equal to the first heat threshold Q s1 If yes, proceed to step S432, otherwise proceed to step S434;

[0068] Step S432, not providing cooling liquid for grinding and polishing;

[0069] Step S434, providing a coolant for grinding and polishing;

[0070] Step S440, determining whether the following conditions are met at the same time: the first temperature T1 is less than or equal to the third temperature threshold T 30 The second temperature T2 is less than or equal to the fourth temperature threshold T 40 , and the accumulated processing heat Q a Less than or equal to the second heat threshold Q s2 If yes, proceed to step S442, otherwise proceed to step S444;

[0071] Step S442, not providing cooling liquid for grinding and polishing;

[0072] Step S444, providing a coolant for grinding and polishing;

[0073] Step S450, providing cooling liquid for grinding and polishing.

[0074] In this embodiment, the temperature in step S260 refers to the first temperature of the current abrasive and / or the second temperature of the current processing surface. For example, it is determined whether the first temperature and the second temperature exceed the corresponding threshold values. When one of the two temperatures exceeds its corresponding threshold value, or both temperatures exceed their corresponding threshold values, the grinding and polishing working parameters are controlled to make corresponding changes, that is, the corresponding dry grinding program, and the grinding and polishing working parameters here refer to the grinding and polishing line speed and feed speed.

[0075] The accumulated processing heat in step S430 is calculated according to the following formula (1):

[0076]

[0077] Among them, Q is the cumulative processing heat, M is the target single processing amount, S is the contact area, fi is the attenuation coefficient, i is the current processing number, and n is the total processing number. The attenuation coefficient fi here can be set based on experience or determined based on the actual single processing amount and the roughness of the current processing surface.

[0078] This embodiment provides a related formula (2) for determining the attenuation coefficient according to the actual single processing amount and the roughness of the current processing surface:

[0079]

[0080] Among them, k1 and k2 are preset weight coefficients, R i-1 is the actual roughness after the i-1th processing, R' i is the target roughness of the i-th processing, D i-1 is the actual single processing amount of the i-1th processing, D is the target single processing amount, m is a negative integer less than -1, and n is a positive integer greater than 1. In one embodiment, the sum of k1 and k2 is 1, for example, both are taken as 0.5, or are taken as 0.4 and 0.6 respectively, m can be a value between -4 and -2, and n can be a value between 2 and 4.

[0081] In step S440 , the accumulated processing heat is the product of the target single processing amount, the contact area and the current processing times.

[0082] In the calculation of the cumulative processing heat in this embodiment, an attenuation coefficient is introduced. This is because as the number of processing times increases, the roughness of the current processing surface gets closer and closer to the target roughness, so the processing heat gradually decays. Therefore, as the number of processing times increases, the corresponding attenuation coefficient can be set to gradually decrease, so that the calculated cumulative processing heat is more accurate, and the timing of controlling the start of wet grinding is more accurate.

[0083] Furthermore, the present embodiment also provides a formula for determining the attenuation coefficient, which includes multiple terms of the ratio of the actual roughness of the last processing to the roughness of this time and multiple terms of the ratio of the current target single processing amount to the actual single processing amount of the last processing. Therefore, it can reflect the nonlinear influence of the difference between the actual roughness and the target roughness, and the difference between the actual single processing amount of the last processing and the target single processing amount of this processing on the cumulative processing heat, thereby more accurately deriving the cumulative processing heat.

[0084] Furthermore, a weight coefficient is set in the calculation formula of the attenuation coefficient of this embodiment, so that the weight coefficient can be set according to the control target, making the formula more flexible and adjustable according to actual conditions. In some embodiments, the weight coefficient can also be determined by simulation or experiment, so that the accumulated processing heat can be obtained more accurately.

[0085] This embodiment also considers the influence of the current number of processing times when judging whether to provide coolant for grinding and polishing. When the current number of processing times is less than the first preset value, the cumulative processing heat is the product of the target single processing amount and the current number of processing times, that is, no attenuation coefficient is introduced. This is because in the early stage of processing, there is often a large difference between the actual processing amount and the target processing amount. At this time, a simple processing heat calculation method can be used to quickly calculate the cumulative processing heat. And because the temperature of the current processing surface and the current abrasive will rise rapidly in the early stage of processing, the temperature threshold should be set differently from when the current number of processing times is greater than or equal to the first preset value, so as to be more in line with the temperature change characteristics of the processing process.

[0086] This embodiment also distinguishes between a coarse grinding stage and a fine grinding stage. Coarse grinding is usually intended to remove a large amount of excess, so the excess removed in the coarse grinding stage is large and the corresponding processing heat generated is high. Therefore, using wet grinding in the coarse grinding stage can avoid a large amount of heat accumulation.

[0087] This embodiment also determines whether the current abrasive is suitable for wet grinding at the beginning of control. This is because the currently available abrasive may have dry grinding limitations, that is, the abrasive has good other applicability but can only be used in a dry environment. At this time, this type of abrasive is selected to adapt to the dry grinding program, and the grinding and polishing working parameters are adjusted by monitoring the temperature during the processing to control the processing heat, so as to reduce the impact of the processing heat.

[0088] Figure 3 FIG. 1 shows a connection block diagram of an intelligent grinding and polishing control system 100 according to an embodiment of the present invention. Figure 3 As shown, the present invention also provides an intelligent grinding and polishing control system 100, which is used to execute the intelligent grinding and polishing control method in any of the above embodiments. In one embodiment, the intelligent grinding and polishing control system 100 includes a processing mode determination unit 10, a temperature detection unit 20, an abrasive and processing surface information collection unit 30, a control unit 40 and a coolant circulation device 50. The processing mode determination unit 10 is used to determine the target single processing amount and the total number of processing times according to the total processing allowance of the current processing surface and the type of the current abrasive. The temperature detection unit 20 is used to detect the first temperature of the current abrasive and the second temperature of the current processing surface. The abrasive and processing surface information collection unit 30 is used to collect the working surface shape information of the current abrasive and the surface shape information of the current processing surface. The control unit 40 is used to determine the contact area between the current abrasive and the current processing surface according to the working surface shape information and the surface shape information, and judge whether to provide grinding and polishing coolant according to the current processing times, the first temperature, the second temperature and the accumulated processing heat during fine grinding, wherein the accumulated processing heat is calculated according to the target single processing amount and the contact area. The coolant circulation device 50 is used to start when it is necessary to provide grinding and polishing coolant.

[0089] The processing method determination unit 10 in this embodiment needs to obtain the total processing allowance of the current processing surface in real time, for example, obtaining the total processing allowance of the current processing surface from the abrasive and processing surface information acquisition unit 30. In one embodiment, the abrasive and processing surface information acquisition unit 30 is a visual inspection device.

[0090] In a further embodiment, the control unit 40 is further configured to execute the intelligent grinding and polishing control method in any of the above embodiments.

[0091] The intelligent grinding and polishing control system 100 of this embodiment determines whether to provide grinding and polishing coolant during the fine grinding stage according to the current number of processing times, the first temperature of the current abrasive, the second temperature of the current processing surface and the accumulated processing heat, that is, determines whether to adopt dry grinding or wet grinding process. This method of determining dry grinding or wet grinding not only considers the temperature factors of the abrasive and the processing surface, but also makes a comprehensive judgment based on the current number of processing times and the accumulated processing heat. Therefore, it is possible to determine whether to provide grinding and polishing coolant in stages according to the accumulated heat, thereby more accurately controlling the start of wet grinding and improving the accuracy of control.

[0092] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. An intelligent grinding and polishing control method, characterized in that: include: Determine the target single processing amount and total processing times according to the total processing allowance of the current processing surface and the type of current abrasive; Detecting the first temperature of the current abrasive, the second temperature of the current processing surface, the working surface shape information of the current abrasive, the surface shape information of the current processing surface, and the current processing times; Determining a contact area between the current abrasive and the current processing surface according to the working surface shape information and the surface shape information; During fine grinding, whether to provide grinding and polishing coolant is determined based on the current number of processing times, the first temperature, the second temperature and the accumulated processing heat, wherein the accumulated processing heat is calculated based on the target single processing amount and the contact area.

2. The intelligent grinding and polishing control method according to claim 1 is characterized in that: The step of determining whether to provide grinding and polishing coolant according to the current processing times, the first temperature, the second temperature and the accumulated processing heat comprises: When the current processing number is greater than or equal to a first preset value, if the first temperature is greater than a first temperature threshold or the second temperature is greater than a second temperature threshold or the accumulated processing heat is greater than a first heat threshold, coolant for grinding and polishing is provided.

3. The intelligent grinding and polishing control method according to claim 2 is characterized in that: The cumulative processing heat is calculated according to the following formula: Among them, Q is the cumulative processing heat, M is the target single processing amount, S is the contact area, fi is the attenuation coefficient, i is the current processing number, and n is the total processing number.

4. The intelligent grinding and polishing control method according to claim 3 is characterized in that: The attenuation coefficient is determined according to the actual single processing amount and the roughness of the current processing surface.

5. The intelligent grinding and polishing control method according to claim 4 is characterized in that: The attenuation coefficient is determined according to the following formula: Among them, k1 and k2 are preset weight coefficients, R i-1 is the actual roughness after the i-1th processing, R' i is the target roughness of the i-th processing, D i-1 is the actual single processing amount of the i-1th processing, D is the target single processing amount, m is a negative integer less than -1, and n is a positive integer greater than 1.

6. The intelligent grinding and polishing control method according to any one of claims 1 to 5, characterized in that: The step of determining whether to provide grinding and polishing coolant according to the current processing times, the first temperature, the second temperature and the accumulated processing heat comprises: When the current processing times are less than a first preset value, if the first temperature is greater than a third temperature threshold or the second temperature is greater than a fourth temperature threshold or the accumulated processing heat is greater than a second heat threshold, a grinding and polishing coolant is provided.

7. The intelligent grinding and polishing control method according to claim 6, characterized in that: The accumulated processing heat is the product of the target single processing amount, the contact area and the current processing times.

8. The intelligent grinding and polishing control method according to claim 1, characterized in that: Also includes: Provide grinding and polishing coolant during rough grinding.

9. An intelligent grinding and polishing control system, used to execute the intelligent grinding and polishing control method according to any one of claims 1 to 8, characterized in that: The system comprises: A processing mode determination unit is used to determine a target single processing amount and a total number of processing times according to a total processing allowance of a current processing surface and a type of a current abrasive; A temperature detection unit, used to detect a first temperature of a current abrasive and a second temperature of a current processing surface; An abrasive and processing surface information acquisition unit, used to acquire the working surface shape information of the current abrasive and the surface shape information of the current processing surface; a control unit, configured to determine the contact area between the current abrasive and the current processing surface according to the working surface shape information and the surface shape information, and to determine whether to provide a grinding and polishing coolant according to the current processing times, the first temperature, the second temperature and the accumulated processing heat during fine grinding, wherein the accumulated processing heat is calculated according to the target single processing amount and the contact area; The coolant circulation device is used to start when the coolant for grinding and polishing needs to be provided.

10. The intelligent grinding and polishing control system according to claim 9, characterized in that: The abrasive and processing surface information collection unit is a visual detection device.

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