Method for mould pressing by matching solid colloid with release film and glue injection system thereof

Abstract

The invention discloses a method for mould pressing by matching solid colloid with a release film and a glue injection system thereof. The glue injection system is adopted to heat and liquefy the solid colloid and then inject the solid colloid into a glue injection area of the release film. The glue injection system comprises a glue injection pipe, a glue injection push rod, a glue injection push plug and a heating assembly, and the heating assembly wraps the pipe wall of the glue injection pipe; the glue injection push plug is fixed to the first end of the glue injection push rod, the glue injection push plug is matched with and slidably located in the glue injection pipe, and the second end of the glue injection push rod is located outside the glue injection pipe. A glue injection opening is formed in one end, far away from the glue injection push rod, of the glue injection pipe. The solid glue is reinjected after being heated and melted, so that the problem of time limitation of on-line glue preparation is solved, and the operation is more convenient; the problem that solid glue cannot be used during mold pressing of the release film is solved; and the consistency of large-batch components can be realized.

Description

Technical Field

[0001] The invention relates to the technical field of LED packaging, and in particular to a molding method using a solid colloid in combination with a release film and a glue injection system thereof. Background Art

[0002] LED packaging refers to the packaging of light-emitting chips. The function of LED packaging is to provide sufficient protection for the chips to prevent them from failing due to long-term exposure to the air or mechanical damage, so as to improve the stability of the chips. In addition, they must be able to transmit light and have high requirements for the concentration and light spot of light.

[0003] COB (Chip on Board) display technology is a new display technology in the LED field. Compared with the traditional POB (Package on Board) display technology, it effectively optimizes the industrial process, saves the installation and transportation costs of lamp beads, and can further reduce the LED spacing. In terms of display effect, it also changes from point lighting of lamp beads to surface lighting effects similar to glass-based panels such as LCD and OLED, making it have the advantages of high reliability, good heat dissipation, material saving, simple process and high pixel density.

[0004] The COB module is mainly composed of three parts, namely the light-emitting layer after packaging on the front, the substrate in the middle, and the driver IC, interface and other electronic materials on the back. The process of assembling the light-emitting layer with the plate, driver IC, etc. into the final product is called packaging. In the current packaging process, a glue layer is coated around the light-emitting element to isolate the air and prevent the LED from being oxidized; secondly, to prevent direct contact with the LED during use or movement to avoid collision damage.

[0005] At present, in order to ensure the consistency of appearance during COB module molding, the release film molding method is mostly adopted. Liquid glue is injected onto the release film through a glue injection needle, and a complete module is formed after the mold is closed. This glue injection method can only be used with liquid glue at present. The main defect of liquid glue is that it needs to be divided into two components, A and B, and the glue preparation operation must be carried out before use, which has strict restrictions on the operation time. Secondly, when liquid glue is used on site, the operation volume is limited, generally not exceeding 500g. If diffusion powder / black powder needs to be added to the glue to prepare black colloid, the proportion of each component in different batches of glue will fluctuate, and the resulting blackness will be different. There will be color differences between the finished products. In order to ensure the consistency of the appearance of the liquid glue, transparent glue is usually used for packaging before black film is applied. This solution will bring about the appearance problem of bright lines on the edge of the film, and it adds a process, which is more expensive.

[0006] Based on this, the existing technology still needs to be improved. Summary of the invention

[0007] To solve the above technical problems, the embodiments of the present invention propose a method for molding a release film using a solid colloid and a glue injection system thereof, so as to solve the technical problem in the prior art that the ratio of colloid components in different batches fluctuates, resulting in poor consistency of the obtained products.

[0008] In order to solve the above technical problems, some embodiments of the present invention disclose a method for molding using a solid colloid in combination with a release film, wherein a glue injection system is used to heat and liquefy the solid colloid and then inject it into a glue injection area of ​​the release film.

[0009] In some embodiments, the solid colloid is a powdered colloid material.

[0010] In some embodiments, the heating temperature for liquefaction is 100-150°C.

[0011] In some embodiments, the glue injection system includes a glue injection tube, a glue injection push rod, a glue injection push plug and a heating component, wherein: The heating component is coated on the outside of the wall of the injection tube; The glue injection push plug is fixed to the first end of the glue injection push rod, the glue injection push plug is adapted and slidably located in the glue injection tube, and the second end of the glue injection push rod is located outside the glue injection tube; A glue injection port is arranged at one end of the glue injection tube away from the glue injection push rod.

[0012] In some embodiments, the glue injection tube includes a non-stick inner layer and a rigid tube body, and the non-stick inner layer is coated on the inner wall of the rigid tube body; The glue-injected push plug is frictionally connected with the non-stick inner layer; The heating component comprises a heating wire wrapping layer, and the heating wire wrapping layer is wrapped outside the rigid tube body.

[0013] In some embodiments, the solid colloid includes an epoxy resin and a hardener; Alternatively, the solid colloid includes an epoxy resin, a hardener, and silicon dioxide; Alternatively, the solid colloid includes epoxy resin, hardener, silica and carbon powder.

[0014] In some embodiments, the preparation of the solid colloid comprises: After mixing the components uniformly according to the proportion, heat at 115-125°C for 4-6 minutes to solidify to obtain a rubber cake; The rubber cake is crushed into powder with a particle size of 90-110 microns in a crusher.

[0015] In some embodiments, the hardener is an anhydride hardener, and the addition ratio of the hardener to the epoxy resin is 1:(0.95-1.05) by mass ratio; When silica is added, the amount of silica added is 4.5%-5.5% of the total weight of the hardener and the epoxy resin, and the particle size of the silica is 1.35-1.65 microns.

[0016] In some embodiments, the non-stick inner layer is a Teflon coating, the rigid tube body is a heat-conducting steel tube body, and the glue injection push plug is a ceramic push plug.

[0017] On the other hand, some embodiments of the present invention further disclose a glue injection system for module molding, which includes a glue injection tube, a glue injection push rod, a glue injection push plug and a heating component, wherein: The heating component is coated on the outside of the wall of the injection tube; The glue injection push plug is fixed to the first end of the glue injection push rod, the glue injection push plug is adapted and slidably located in the glue injection tube, and the second end of the glue injection push rod is located outside the glue injection tube; A glue injection port is arranged at one end of the glue injection tube away from the glue injection push rod; Wherein, the injection tube contains powdered colloid material; The heating element is used to liquefy the powdered colloidal material.

[0018] By adopting the above technical solution, the present invention has at least the following beneficial effects: The present invention provides a method for molding using a solid colloid in combination with a release film and a glue injection system thereof. The solid glue is heated and melted and then re-injected, thereby solving the time limit for configuring glue online and making the operation more convenient; the problem that solid glue cannot be used for molding release films is solved; large-scale component consistency can be achieved, solving the problem of serious color difference when using black glue in the current release film molding method, and improving the ink color consistency; at the same time, compared with the current method of molding and then sticking the film, the problem of curling and bright lines caused by sticking the film is solved, and the appearance quality is improved; compared with the COB method of the prior art that uses transparent colloid and then sticks black film, the production cost is reduced and the production process is reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 A schematic diagram of the structure of a glue injection system disclosed in some embodiments of the present invention; Figure 2 A state diagram of a solid colloid combined with a release film during molding according to some embodiments of the present invention.

[0021] Description of reference numerals: 1. Glue injection system; 2. Glue injection area; 3. Module material placement area; 4. Release film; 11. Glue injection tube; 12. Glue injection push rod; 13. Glue injection push plug; 14. Heating component; 111. Non-stick inner layer; 112. Rigid tube body; 113. Glue injection port. DETAILED DESCRIPTION

[0022] The following is a further detailed description of the embodiments of the present disclosure in conjunction with the accompanying drawings and examples. The detailed description of the following embodiments and the accompanying drawings are used to exemplarily illustrate the principles of the present disclosure, but cannot be used to limit the scope of the present disclosure. The present disclosure can be implemented in many different forms and is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

[0023] The present disclosure provides these embodiments to make the present disclosure thorough and complete, and to fully express the scope of the present disclosure to those skilled in the art. It should be noted that unless otherwise specifically stated, the relative arrangement of the parts and steps, the composition of the materials, the numerical expressions and the numerical values ​​set forth in these embodiments should be interpreted as being merely exemplary, and not as limiting.

[0024] It should be noted that, in the description of the present disclosure, unless otherwise specified, the meaning of "multiple" is greater than or equal to two; the terms "upper", "lower", "left", "right", "inner", "outer", etc., indicating the orientation or positional relationship, are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present disclosure. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0025] In addition, the words "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different parts. "Vertical" does not mean vertical in the strict sense, but is within the tolerance range. "Parallel" does not mean parallel in the strict sense, but is within the tolerance range. "Include" or "comprising" and similar words mean that the elements before the word include the elements listed after the word, and do not exclude the possibility of including other elements.

[0026] It should also be noted that in the description of the present disclosure, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to the specific circumstances. When a specific device is described as being located between a first device and a second device, there may or may not be an intermediate device between the specific device and the first device or the second device.

[0027] All terms used in the present disclosure have the same meanings as those understood by those of ordinary skill in the art to which the present disclosure belongs, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries, for example, should be interpreted as having meanings consistent with their meanings in the context of the relevant technology, and should not be interpreted in an idealized or extremely formal sense, unless explicitly defined as such herein.

[0028] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered part of the specification.

[0029] like Figure 1 , Figure 2 As shown, some embodiments of the present invention disclose a method for molding using solid colloid with release film, wherein a glue injection system 1 is used to heat and liquefy the solid colloid and then inject it into the glue injection area 2 of the release film 4. This embodiment introduces the glue injection system 1, heats and melts the solid colloid before injection and then re-injects it. Compared with the prior art of directly configuring glue on site, this embodiment solves the technical problems of small single configuration amount of glue configured online and strict restrictions on the use time of the configured glue, and is more convenient to operate; solves the problem that solid glue cannot be used for molding the release film 4; and can achieve large-scale component consistency and increase product stability.

[0030] In order to convert the solid colloid from solid to liquid in a short time, the solid colloid is preferably selected as a powdered colloid material. The powdered colloid material is not only convenient to load into the injection system 1, but also the powdered alternating material can be quickly liquefied after being heated, so as to facilitate the rapid completion of injection. When the powdered solid colloid is heated and liquefied, the heating temperature for heating and liquefaction can generally be 100-150°C.

[0031] In the above embodiment, the glue injection system 1 is mainly used for filling solid colloid, heating and melting solid colloid, and squeezing the melted liquid colloid to a predetermined position. It may include a glue injection tube 11, a glue injection push rod 12, a glue injection push plug 13 and a heating component 14, wherein the heating component 14 is coated on the outside of the tube wall of the glue injection tube 11, and is used to heat the solid colloid filled inside the tube wall. Generally, a switch of the heating component 14 can be installed on the tube wall to turn on or off the heating component 14; the glue injection push plug 13 is fixed to the first end of the glue injection push rod 12, and the glue injection push plug 13 is adapted and slidably located in the glue injection tube 11, and the second end of the glue injection push rod 12 is located outside the glue injection tube 11; the glue injection port 113 is provided at one end of the glue injection tube 11 away from the glue injection push rod 12 When filling the solid colloid, hold the second end of the injection push rod 12 by hand or use a mechanical clamp and apply force to pull it outward until the injection push rod 12 leaves the injection tube 11. Then, after filling the injection tube 11 with a suitable amount of solid colloid, insert the injection plug 13 from the non-injection end of the injection tube 11 into the injection tube 11, and then turn on the heating component 14 for heating. After the solid colloid melts into a liquid, the injection action is performed. Generally, the injection port 113 can be provided with an injection channel with a diameter smaller than the injection tube 11 and a certain length, and the end of the injection channel is inserted above the injection area 2 for injection.

[0032] In order to prevent the melted liquid colloid from adhering to the inner wall of the injection tube 11, the injection tube 11 may include a non-stick inner layer 111 and a rigid tube body 112, wherein the non-stick inner layer 111 is coated on the inner wall of the rigid tube body 112; the injection plug 13 is frictionally connected to the non-stick inner layer 111; the heating assembly 14 includes a heating wire wrapping layer, which is wrapped around the outside of the rigid tube body 112. The rigid tube body 112 is generally made of a material with a certain rigidity and good heat exchange performance. For example, the non-stick inner layer 111 may be a Teflon coating, the rigid tube body 112 may be a heat-conducting steel tube body, and the injection plug 13 may be a ceramic push plug.

[0033] In some embodiments, the solid colloid includes an epoxy resin and a hardener, and the hardener can be an anhydride hardener; the epoxy resin can be a conventionally used AB component epoxy liquid glue, and generally, the mass ratio of the epoxy resin to the hardener can be selected to be about 1:1.

[0034] In some embodiments, the solid colloid includes epoxy resin, hardener, and silica. The added amounts of epoxy resin and hardener are the same as described in the previous embodiments, preferably 1:1; the added amount of silica is 4.5%-5.5% of the total weight of the hardener and epoxy resin, preferably 5% of spherical silica particles, and the particle size of silica can be 1.35-1.65 microns, preferably 1.5 microns, which plays a role in optimizing the optical effect and is conducive to re-melting.

[0035] In some embodiments, the solid colloid includes epoxy resin, hardener, silicon dioxide and carbon powder. The proportion of carbon powder added can be added according to the process requirements. For example, 0.1% of the total mass of epoxy resin and hardener can be added to increase the blackness and make the product have a high contrast. The addition of carbon powder allows the colloid to directly form black, avoiding the current process of adding an extra layer of black film to the transparent colloid after molding; solving the abnormal appearance effect caused by the black film; also solving the problem of serious color difference when using black glue in the current release film 4 molding method, and improving the consistency of ink color; at the same time, compared with the current method of molding and then sticking the film, it solves the problem of curling and bright lines caused by the film, and improves the appearance quality; compared with the current COB method of using transparent colloid and then sticking black film, it reduces production costs and reduces production processes.

[0036] Some embodiments of the present invention disclose a method for molding using a solid colloid in combination with a release film. Based on the above embodiments, the preparation of the solid colloid includes: After mixing the components uniformly according to the proportion, heat at 115-125°C for 4-6 minutes to solidify to obtain a rubber cake; The rubber cake is crushed into powder with a particle size of 90-110 microns in a crusher.

[0037] The components of the solid colloid can be configured according to the components disclosed in the above embodiments.

[0038] Some embodiments of the present invention further disclose a glue injection system 1 for module molding, which can be used in the aforementioned method of molding using a solid colloid with a release film 4, comprising a glue injection tube 11, a glue injection push rod 12, a glue injection push plug 13 and a heating component 14, wherein the heating component 14 is coated on the outside of the tube wall of the glue injection tube 11; the glue injection push plug 13 is fixed to the first end of the glue injection push rod 12, the glue injection push plug 13 is adapted and slidably located in the glue injection tube 11, and the second end of the glue injection push rod 12 is located outside the glue injection tube 11; a glue injection port 113 is provided at one end of the glue injection tube 11 away from the glue injection push rod 12; The glue injection tube 11 contains powdered colloid material; the heating component 14 is used to liquefy the powdered colloid material.

[0039] The method of using solid colloid and release film molding disclosed in the embodiment of the present invention innovatively makes the injection system 1 into a steel pipe structure with heating function, such as Figure 1As shown, heat-conducting steel can be used as the shell (rigid tube 112), and the outer periphery of the shell is coated with a heating wire (heating component 14), so that the glue injection system 1 has a heating function, and the heating temperature is generally between 100 and 150°C. The inside of the glue injection tube 11 can use a Teflon coating as a non-stick inner layer 111 to form a non-stick effect, which is convenient for cleaning the hose after use; in order to ensure the efficiency of the solid glue being converted into a liquid, the solid colloid is made into a powder to facilitate rapid liquefaction; diffusion powder / black powder can also be added to the solid glue to form a black colloid. Since the solid glue can be mass-produced in the same batch, such as 500kg of glue is prepared at one time, due to the large proportion, the fluctuation of the proportions between the various components in the glue is relatively small, and different batches of glue will not cause product quality to decline due to color difference; secondly, the solid glue does not need to be configured on site, and there is no operation time requirement, so the production requirements are relatively low, avoiding the impact of excessive operation time on quality.

[0040] like Figure 2 As shown, when in use, the release film mold matched with the glue injection system 1 includes an upper mold and a lower mold. The module material is fixed in the module material placement area 3 of the upper mold, and the middle part of the lower mold is the glue injection area 2, and the glue is injected above the release film 4; after the glue injection and mold closing, the vacuum system of the mold is started to vacuum the glue injected into the mold cavity to discharge the bubbles in the glue; after the predetermined time is reached, the mold is opened and the finished product is taken out; because black glue pressing is used, the finished product does not need to be processed with film, and can be used directly after cutting.

[0041] To sum up, the method of using solid colloid in combination with release film molding and the glue injection system thereof disclosed in the embodiments of the present invention, the solid glue does not need to be configured on site and has no operation time requirement, has low requirements for production, avoids the influence of excessive operation time on quality, solves the operation time limitation of small configuration amount on AB glue line, and is more convenient to operate; solves the problem that solid glue cannot be used for release film molding; solves the problem of serious color difference when using black glue in the current release film molding method, and improves the consistency of ink color; at the same time, compared with the current method of molding and then sticking the film, it solves the problem of curling and bright lines caused by sticking the film, and improves the appearance quality; compared with the current COB method of using transparent colloid and then sticking black film, it reduces production costs and reduces production processes.

[0042] So far, various embodiments of the present disclosure have been described in detail. In order to avoid obscuring the concept of the present disclosure, some details known in the art are not described. Based on the above description, those skilled in the art can fully understand how to implement the technical solution disclosed here.

[0043] Although some specific embodiments of the present disclosure have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present disclosure. It should be understood by those skilled in the art that the above embodiments may be modified or some technical features may be replaced by equivalents without departing from the scope and spirit of the present disclosure. In particular, the various technical features mentioned in the various embodiments may be combined in any manner as long as there is no structural conflict.

Claims

1. A method for molding using a solid colloid and a release film, characterized in that: A glue injection system (1) is used to heat and liquefy a solid colloid and then inject it into a glue injection area (2) of a release film (4).

2. The method for molding using a solid colloid and a release film according to claim 1, characterized in that: The solid colloid is a powdery colloid material.

3. The method for molding using a solid colloid and a release film according to claim 1 or 2, characterized in that: The heating temperature for the heating liquefaction is 100-150°C.

4. The method for molding using a solid colloid and a release film according to claim 1, characterized in that: The glue injection system (1) comprises a glue injection tube (11), a glue injection push rod (12), a glue injection push plug (13) and a heating component (14), wherein: The heating component (14) is coated on the outside of the tube wall of the glue injection tube (11); The glue injection push plug (13) is fixed to the first end of the glue injection push rod (12), the glue injection push plug (13) is adapted and slidably located in the glue injection tube (11), and the second end of the glue injection push rod (12) is located outside the glue injection tube (11); A glue injection port (113) is provided at one end of the glue injection tube (11) away from the glue injection push rod (12).

5. The method for molding using a solid colloid and a release film according to claim 4, characterized in that: The glue injection tube (11) comprises a non-stick inner layer (111) and a rigid tube body (112), wherein the non-stick inner layer (111) is coated on the inner wall of the rigid tube body (112); The glue injection push plug (13) is frictionally connected to the non-stick inner layer (111); The heating component (14) comprises a heating wire wrapping layer, and the heating wire wrapping layer is wrapped around the outside of the rigid tube body (112).

6. The method for molding using a solid colloid and a release film according to claim 5, characterized in that: The solid colloid comprises epoxy resin and hardener; Alternatively, the solid colloid includes epoxy resin, hardener, and silicon dioxide; Alternatively, the solid colloid comprises epoxy resin, hardener, silicon dioxide and carbon powder.

7. The method for molding using a solid colloid and a release film according to claim 6, characterized in that: The preparation of the solid colloid comprises: After mixing the components uniformly according to the proportion, heat at 115-125°C for 4-6 minutes to solidify to obtain a rubber cake; The rubber cake is crushed into powder with a particle size of 90-110 microns in a crusher.

8. The method for molding using a solid colloid and a release film according to claim 7, characterized in that: The hardener is an anhydride hardener, and the addition ratio of the hardener to the epoxy resin is 1: (0.95-1.05) by mass ratio; When silicon dioxide is added, the amount of silicon dioxide added is 4.5%-5.5% of the total weight of the hardener and the epoxy resin, and the particle size of the silicon dioxide is 1.35-1.65 microns.

9. The method for molding using a solid colloid and a release film according to claim 5, characterized in that: The non-stick inner layer (111) is a Teflon coating, the rigid tube body (112) is a heat-conducting steel tube body, and the glue injection push plug (13) is a ceramic push plug.

10. A glue injection system for module molding, characterized in that: It comprises a glue injection tube (11), a glue injection push rod (12), a glue injection push plug (13) and a heating component (14), wherein: The heating component (14) is coated on the outside of the tube wall of the glue injection tube (11); The glue injection push plug (13) is fixed to the first end of the glue injection push rod (12), the glue injection push plug (13) is adapted and slidably located in the glue injection tube (11), and the second end of the glue injection push rod (12) is located outside the glue injection tube (11); A glue injection port (113) is provided at one end of the glue injection tube (11) away from the glue injection push rod (12); Wherein, the injection tube (11) contains a powdered colloid material; The heating component (14) is used to liquefy the powdered colloid material.

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