Preparation method of flexible sensor and testing device
By using conductive mixed solutions with high conductivity and excellent adsorption in the preparation of flexible sensors, the complex and cost problems of traditional methods are solved, the stability and production efficiency of the sensor are improved, and its application capabilities in complex environments are enhanced. .
Patent Information
- Application Number
- CN202411099883.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-12
- Publication Date
- 2024-12-13
AI Technical Summary
The traditional flexible sensor preparation method is complex and costly. The conductive materials have shortcomings in conductivity, stability and adhesion, which limits their application in complex environments.
The first polymer solution and the second polymer solution were prepared in proportion and stirred to form a conductive mixed solution with high conductivity and excellent adsorption, uniformly applied to the compound substrate, and a conductive path was formed by drying treatment and electrode bonding. , simplify the preparation process and improve production efficiency and stability.
It significantly improves the conductivity and stability of flexible sensors, simplifies the preparation process, and enhances its application compatibility in complex environments.
Smart Images
Figure CN119119552A_ABST
Abstract
Description
Technical Field
[0001] The embodiments of the present application relate to, but are not limited to, the field of flexible sensor preparation and application, and in particular, to a flexible sensor preparation method and testing device. Background Art
[0002] In the prior art, the preparation of flexible sensors faces many challenges. Traditional methods often rely on complex process flows and expensive materials, resulting in low production efficiency and high costs. At the same time, traditional conductive materials have deficiencies in conductivity, stability, and adhesion to substrate materials, which limits the application of flexible sensors in complex environments. Specifically, traditional conductive solutions have large fluctuations in conductivity and are easily affected by external factors such as temperature and humidity, resulting in unstable performance of flexible sensors during use. In addition, these materials often have poor adhesion, making it difficult to achieve uniform and firm coating on a variety of substrate materials, affecting the overall performance and service life of the sensor. Summary of the invention
[0003] The following is a summary of the subject matter described in detail herein. This summary is not intended to limit the scope of the claims.
[0004] The embodiments of the present application provide a method for preparing a flexible sensor and a testing device, which can prepare a conductive mixed solution with high conductivity and excellent adsorption. This not only simplifies the preparation process of the flexible sensor and improves production efficiency, but also greatly enhances the stability of the sensor.
[0005] In a first aspect, an embodiment of the present application provides a method for preparing a flexible sensor, comprising:
[0006] Obtaining a first polymer solution and a second polymer solution;
[0007] The first polymer solution and the second polymer solution are mixed in proportion and stirred to obtain a conductive mixed solution;
[0008] Obtaining a compound substrate, and evenly applying a conductive mixed solution on the compound substrate to obtain a target substrate;
[0009] After the target substrate is dried, electrodes are bonded to two ends of the target substrate to form a conductive path, thereby obtaining a flexible sensor.
[0010] In combination with the first aspect, in an embodiment of the present application, the first polymer solution and the second polymer solution are prepared in proportion and then stirred to obtain a conductive mixed solution, including: preparing the first polymer solution and the second polymer solution in a ratio of 1:1; stirring for 1 hour; ending the stirring when it is determined that the polymer of the first polymer solution is uniformly dispersed in the second polymer solution; the first polymer solution is a PBFDO solution.
[0011] In combination with the first aspect, in an embodiment of the present application, the drying the target substrate comprises: placing the target substrate in a vacuum drying oven at 60° C. for a drying treatment for 1 hour.
[0012] In combination with the first aspect, in an embodiment of the present application, bonding electrodes to both ends of the target substrate to form a conductive path includes: using conductive silver paste to bond electrodes made of carbon fiber to the surface of the target substrate to form a conductive path.
[0013] In combination with the first aspect, in an embodiment of the present application, after obtaining the conductive mixed solution, the method further includes: filtering the conductive mixed solution.
[0014] In combination with the first aspect, in an embodiment of the present application, after obtaining the compound substrate, the method further includes: cleaning and drying the compound substrate.
[0015] In combination with the first aspect, in an embodiment of the present application, after obtaining the flexible sensor, it also includes: testing the conductive performance of the flexible sensor to obtain a test result; when the test result does not meet the preset requirements, identifying the area on the flexible sensor where the performance is lower than the preset performance value according to the test result, and adjusting the conductive path structure of the area on the flexible sensor where the performance is lower than the preset performance value.
[0016] In combination with the first aspect, in an embodiment of the present application, the preparation material of the compound substrate is one of polyethylene, polydimethylsiloxane, polyethylene terephthalate, polyimide and polyurethane.
[0017] In combination with the first aspect, in an embodiment of the present application, after the target substrate is dried, the preparation method further includes: testing the dried target substrate, and when the test result shows that the surface of the target substrate is uneven, polishing the target substrate.
[0018] In the second aspect, an embodiment of the present application provides a testing device, comprising: a flexible sensor prepared by the flexible sensor preparation method as described above, and a motion data processing module; wherein the flexible sensor is connected to the motion data processing module; the flexible sensor is used to obtain an analog signal of the change in sensor resistance according to the degree of arm bending; the motion data processing module is used to receive the analog signal, convert the analog signal into a digital signal, and display the digital signal.
[0019] A method for preparing a flexible sensor provided in an embodiment of the present application comprises first obtaining a first polymer solution and a second polymer solution. Subsequently, the first polymer solution and the second polymer solution are mixed in proportion and stirred to obtain a conductive mixed solution. After obtaining the compound substrate, the conductive mixed solution is evenly applied to the compound substrate to obtain a target substrate. Since the conductive mixed solution obtained by mixing the first polymer solution and the second polymer solution has high conductivity and excellent adsorption, the conductive mixed solution can not only fit tightly on the compound substrate to form a uniformly distributed target substrate, but also effectively improve the performance and stability of the sensor. After successfully preparing the target substrate, the target substrate is dried, and the electrodes are bonded to both ends of the target substrate to form a conductive path to obtain a flexible sensor. The conductive mixed solution in the embodiment of the present application, by virtue of its efficient conductivity and adsorption performance, not only simplifies the preparation process of the flexible sensor, improves production efficiency, but also greatly enhances the stability and compatibility of the sensor. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 is a flow chart of a method for preparing a flexible sensor provided in an embodiment of the present application;
[0021] Figure 2 is a schematic diagram of a process in which the testing device provided in an embodiment of the present application is applied to testing arm bending;
[0022] Figure 3 It is a schematic diagram of the change in resistance indication of the arm bending test provided in an embodiment of the present application. DETAILED DESCRIPTION
[0023] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.
[0024] It should be noted that, although the logical order is shown in the flowchart, in some cases, the steps shown or described can be performed in a different order from that in the flowchart. The terms "first", "second", etc. in the specification, claims and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions that the present invention can be implemented, so they have no technical substantive significance. Any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the effects that the present invention can produce and the purposes that can be achieved, should still fall within the scope of the technical content disclosed by the present invention. At the same time, the terms such as "upper", "lower", "left", "right", "middle" and "one" quoted in this specification are only for the convenience of narration, and are not used to limit the scope of the implementation of the present invention. The change or adjustment of the relative relationship should also be regarded as the scope of the implementation of the present invention without substantially changing the technical content.
[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein are only for the purpose of describing the embodiments of this application and are not intended to limit this application.
[0026] Traditional sensor preparation methods often rely on complex process flows and expensive materials, resulting in low production efficiency and high costs. At the same time, traditional conductive materials have deficiencies in conductivity, stability, and adhesion to substrate materials, which limits the application of flexible sensors in complex environments. Specifically, traditional conductive solutions have large fluctuations in conductivity and are easily affected by external factors such as temperature and humidity, resulting in unstable performance of flexible sensors during use. In addition, these materials often have poor adhesion, making it difficult to achieve uniform and firm coating on a variety of substrate materials, affecting the overall performance and service life of the sensor. .
[0027] In view of this, a method for preparing a flexible sensor and a testing device provided in an embodiment of the present application, the method first obtains a first polymer solution and a second polymer solution. Subsequently, the first polymer solution and the second polymer solution are mixed in proportion and stirred to obtain a conductive mixed solution. After obtaining the compound substrate, the conductive mixed solution is evenly applied to the compound substrate to obtain a target substrate. Since the conductive mixed solution obtained by mixing the first polymer solution and the second polymer solution has high conductivity and excellent adsorption, the conductive mixed solution can not only fit tightly on the compound substrate to form a uniformly distributed target substrate, but also effectively improve the performance and stability of the sensor. After successfully preparing the target substrate, the target substrate is dried, and the electrodes are bonded to both ends of the target substrate to form a conductive path to obtain a flexible sensor. The conductive mixed solution in the embodiment of the present application, by virtue of its excellent conductivity and adsorption properties, not only simplifies the preparation process of the flexible sensor, improves production efficiency, but also greatly enhances the stability and compatibility of the sensor.
[0028] The embodiments of the present application are further described below in conjunction with the accompanying drawings.
[0029] like Figure 1 As shown, Figure 1 1 is a flow chart of a method for preparing a flexible sensor provided in an embodiment of the present application. The method for preparing a flexible sensor includes but is not limited to steps 110 to 140.
[0030] Step 110: Obtain a first polymer solution and a second polymer solution, wherein the first polymer solution is conductive;
[0031] Step 120: The first polymer solution and the second polymer solution are mixed in proportion and stirred to obtain a conductive mixed solution;
[0032] Step 130: obtaining a compound substrate, and evenly applying a conductive mixed solution on the compound substrate to obtain a target substrate;
[0033] Step 140: After drying the target substrate, electrodes are bonded to two ends of the target substrate to form a conductive path, thereby obtaining a flexible sensor.
[0034] Steps 110 to 140 are described in detail below.
[0035] In a feasible embodiment, in step 110, the first polymer solution refers to a polymer solution with high conductivity, high adhesion, and not easy to react with air, such as polyaniline (PANI) solution, polypyrrole (PPy) solution, and polyphenylene furan dione (PBFDO) solution. The second polymer solution refers to an organic solvent that can dissolve the polymer in the first polymer solution, such as N,N-dimethylformamide (DMF) and dimethyl sulfoxide (DMSO) solvents. It is worth noting that in the process of obtaining the first polymer solution and the second polymer solution, the operating procedures must be strictly followed to avoid solution contamination or deterioration.
[0036] In a feasible embodiment, in step 120, the first polymer solution and the second polymer solution are first accurately measured according to a preset ratio. The selection of the ratio can be based on experimental data or theoretical calculations to ensure that the mixed solution has optimal conductivity and adhesion. Subsequently, the mixed solution is fully stirred using a suitable stirring device until the solution is uniform and there is no obvious stratification. It is worth noting that the stirring speed and time should be controlled during the stirring process to avoid generating too many bubbles or introducing impurities.
[0037] In a feasible embodiment, in the process of stirring the first polymer solution and the second polymer solution after preparing them in proportion, the first polymer solution and the second polymer solution can be prepared in a ratio of 1:1 and then stirred for 1 hour. The stirring is terminated when it is determined that the polymer of the first polymer solution is uniformly dispersed in the second polymer solution, thereby obtaining a conductive mixed solution.
[0038] In a feasible embodiment, the first polymer solution may be a PBFDO solution, and the second polymer solution may be a DMSO solvent. When executing step 120, the PBFDO solution and the DMSO solvent may be prepared in a ratio of 1:1, and then the prepared mixed solution may be stirred using a magnetic stirrer until the polymer in the PBFDO solution is evenly dispersed in the DMSO solvent, that is, until the mixed solution is uniform and has no obvious stratification, thereby obtaining a mixed solution with high efficiency conductivity and excellent adsorption.
[0039] In a feasible embodiment, functional additives such as conductive nanoparticles (such as silver nanowires, carbon nanotubes, etc.), ionic liquids or other conductive fillers may be added to the mixed solution. These additives can significantly improve the conductivity of the mixed solution.
[0040] In a feasible embodiment, after the conductive mixed solution is prepared, the conductive mixed solution may be further filtered to remove insoluble matter, impurities or particles in the solution to improve the purity of the solution.
[0041] Prevent these impurities from adversely affecting conductive properties in subsequent applications.
[0042] In a feasible embodiment, in step 130, the compound substrate refers to a material layer used to support and fix the sensor element, which has good flexibility, ductility and bendability to meet the special needs of flexible sensors. It is worth noting that the selection of the compound substrate does not chemically react with the conductive mixed solution. The compound substrate can be prepared based on a polymer substrate, and the polymer substrate includes polyethylene, polydimethylsiloxane (PDMS), polyvinyl alcohol (PVA), polyester (PET), polyimide (PI), polyethylene naphthalate (PEN), polyethylene terephthalate, polyimide and polyurethane. These materials not only have good flexibility, but also can resist the influence of the external environment to a certain extent, such as temperature, humidity, etc.
[0043] In a feasible embodiment, the compound substrate may be a polyethylene film prepared based on polyethylene.
[0044] In a feasible embodiment, when applying the conductive mixed solution on the compound substrate, appropriate tools (such as an applicator, a spray gun, etc.) can be used to ensure that the solution is evenly distributed on the substrate. During the application process, the application speed and thickness should be controlled to avoid problems such as missing coating, uneven thickness or bubbles.
[0045] In a feasible embodiment, before the conductive mixed solution is evenly applied to the compound substrate, the compound substrate can be cleaned and dried first, so as to ensure that the surface of the substrate is clean, free of impurities, and in a suitable state to accept the attachment of the conductive mixed solution, thereby improving the adhesion and uniformity of the conductive mixed solution.
[0046] In a feasible embodiment, in step 140, the drying process is a key step to solidify the conductive mixed solution on the substrate and form a stable structure. The temperature and time need to be controlled during the drying process to ensure that the solvent in the solution is completely volatilized and does not damage the substrate or the conductive layer. After the drying is completed, the electrode bonding operation can be performed. The selection of the electrode can be based on its conductivity, mechanical strength, and adhesion to the conductive layer. During the bonding process, it should be ensured that the electrodes are in close contact with both ends of the target substrate and are accurately positioned to form a smooth conductive path.
[0047] In a feasible embodiment, after the target substrate is dried, the dried target substrate may be inspected. When the inspection result shows that the surface of the target substrate is uneven, the target substrate is polished.
[0048] In a feasible embodiment, after a conductive mixed solution (a conductive mixed solution of PBFDO solution and DMSO solvent) is coated on a polyethylene film, the target substrate can be placed in a vacuum drying oven at 60°C for 1 hour for drying, and then the electrode made of carbon fiber can be bonded to the surface of the target substrate using conductive silver paste to form a conductive path.
[0049] In a feasible embodiment, after the flexible sensor is prepared, in order to ensure that its performance meets the established standards, a series of rigorous performance verifications can be performed on the flexible sensor. For example, the conductive properties of the flexible sensor are fully tested to quantify its conductive efficiency and obtain detailed test results. If the test results show that any area fails to meet the preset performance requirements, the specific areas on the flexible sensor whose performance is lower than the preset standard can be further accurately located based on the test results. Subsequently, targeted optimization measures are taken for these specific areas, and the conductive path structure is adjusted to restore or improve the performance of the area to the preset level, thereby ensuring that the overall performance of the entire flexible sensor system reaches the optimal state.
[0050] The embodiment of the present application describes in detail a method for preparing a flexible sensor. First, a first polymer solution and a second polymer solution of specific properties are obtained, and then the mixture is mixed by precisely controlling the ratio, and the mixture is stirred sufficiently to ensure that the two are fully fused, thereby obtaining a conductive mixed solution with high conductivity and excellent adsorption performance. Next, a suitable compound substrate is selected as the substrate material, and the conductive mixed solution is evenly and meticulously applied to the substrate to ensure the formation of a uniformly distributed and tightly combined target conductive layer. This process benefits from the excellent adsorption of the conductive mixed solution, so that the conductive layer can fit tightly to the surface of the substrate without gaps or shedding, laying a solid foundation for the performance of subsequent flexible sensors. Furthermore, the target substrate coated with the conductive mixed solution is dried to remove excess solvent, promote the curing and stabilization of the conductive layer, and ensure the integrity and durability of the sensor structure. After drying, the electrodes are bonded to both ends of the target substrate to build a stable conductive path, thereby completing the preparation of the flexible sensor. The core of the embodiment of the present application lies in the conductive mixed solution, which not only simplifies the preparation process of the flexible sensor and greatly improves the production efficiency, but also significantly enhances the overall performance, stability and compatibility of the sensor with various application environments through its excellent conductivity and adsorption properties.
[0051] In a feasible embodiment, a mixed solution with high conductivity prepared by mixing PBFDO solution and DMSO solvent in a ratio of 1:1 can also be used to build a simple test circuit. Specifically, the mixed solution is first put into a blank marker pen, and then the marker pen containing the mixed solution is used to draw a horizontal line on the paper. After painting, it is placed in a vacuum drying oven at 60°C for 10 minutes for drying. After drying, the area with the solution on the paper is cut out to act as a conductor, and then an electrical conductor is used to contact the two ends of the conductor, so that the mixed solution can be connected to the circuit in the form of a "conductor". Furthermore, by closing the switch in the test circuit, the conductivity of the circuit can be observed.
[0052] In addition, the present application embodiment also provides a test device based on a flexible sensor, which integrates the flexible sensor described in the above embodiment and integrates the motion data processing module. In this design, the flexible sensor can keenly capture the changes in the degree of arm bending and generate corresponding resistance change analog signals in real time. Subsequently, these analog signals are efficiently transmitted to the motion data processing module, which can accurately convert analog signals into quantifiable digital signals (i.e. resistance values) and intuitively display these values on the display interface.
[0053] like Figure 2 As shown, when the test device is used to test the arm bending process, the user only needs to simply stick the flexible sensor to the surface of the arm and connect it to the electrode interface of the motion data processing module through a wire to start the test process. Figure 3 The resistance reading changes during the test: as the arm bends naturally, the resistance value detected by the sensor shows a significant upward trend; and when the arm is straightened again, the resistance value automatically returns to the initial baseline value. Figure 3 In the experiment, when the arm is naturally bent, the resistance value is about 375Ω, and when the arm is straightened, the resistance value returns to the initial value of about 355Ω. This process not only intuitively reflects the direct impact of arm bending on sensor resistance, but also provides a reliable basis for accurately evaluating the degree of arm bending through the regular changes in resistance values.
[0054] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A method for preparing a flexible sensor, characterized in that: include: Obtain a first polymer solution and a second polymer solution, wherein the first polymer solution has conductivity; The first polymer solution and the second polymer solution are mixed in proportion and stirred to obtain a conductive mixed solution; Obtaining a compound substrate, and evenly applying a conductive mixed solution on the compound substrate to obtain a target substrate; After the target substrate is dried, electrodes are bonded to two ends of the target substrate to form a conductive path, thereby obtaining a flexible sensor.
2. The method for preparing a flexible sensor according to claim 1, characterized in that: The first polymer solution and the second polymer solution are mixed in proportion and then stirred to obtain a conductive mixed solution, including: mixing the first polymer solution and the second polymer solution in a ratio of 1:1; stirring for 1 hour; and ending the stirring when it is determined that the polymer of the first polymer solution is uniformly dispersed in the second polymer solution; the first polymer solution is a PBFDO solution.
3. The method for preparing a flexible sensor according to claim 1, characterized in that: The drying the target substrate comprises: placing the target substrate in a vacuum drying oven at 60° C. for a drying time of 1 hour.
4. The method for preparing a flexible sensor according to claim 1, characterized in that: The step of bonding electrodes to both ends of the target substrate to form a conductive path comprises: bonding electrodes made of carbon fibers to the surface of the target substrate using conductive silver paste to form a conductive path.
5. The method for preparing a flexible sensor according to claim 1, characterized in that: After obtaining the conductive mixed solution, the method further includes: filtering the conductive mixed solution.
6. The method for preparing a flexible sensor according to claim 1, characterized in that: After obtaining the compound substrate, the method further includes: cleaning and drying the compound substrate.
7. The method for preparing a flexible sensor according to claim 1, characterized in that: After obtaining the flexible sensor, it also includes: testing the conductive performance of the flexible sensor to obtain a test result; when the test result does not meet the preset requirements, identifying the area on the flexible sensor whose performance is lower than the preset performance value according to the test result, and adjusting the conductive path structure of the area on the flexible sensor whose performance is lower than the preset performance value.
8. The method for preparing a flexible sensor according to claim 1, characterized in that: The compound substrate is prepared from one of polyethylene, polydimethylsiloxane, polyethylene terephthalate, polyimide and polyurethane.
9. The method for preparing a flexible sensor according to claim 1, characterized in that: After the target substrate is dried, the preparation method further comprises: testing the dried target substrate, and when the test result shows that the surface of the target substrate is uneven, polishing the target substrate.
10. A testing device based on a flexible sensor, characterized in that: It comprises a flexible sensor prepared by the method for preparing a flexible sensor according to any one of claims 1 to 9 and a motion data processing module; wherein the flexible sensor is connected to the motion data processing module; the flexible sensor is used to obtain an analog signal of a change in sensor resistance according to the degree of arm bending; the motion data processing module is used to receive the analog signal, convert the analog signal into a digital signal, and display the digital signal.