Printing ink composition as well as preparation method and application thereof
By adding hollow silica microspheres modified by silane coupling agent to the ink composition, the problems of high dielectric constant and poor barrier effect in OLED device packaging are solved, and lower dielectric constant and more ideal application performance are achieved .
Patent Information
- Application Number
- CN202411168819.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-23
- Publication Date
- 2024-12-13
AI Technical Summary
OLED devices are prone to aging when exposed to the environment, resulting in a decrease in luminous efficiency and service life. The existing thin film packaging methods have problems with poor film formation and interface matching, especially the poor blocking effect of inorganic films on water vapor and oxygen.
Add hollow silica microspheres with specific content and types of silane coupling agent surface modified by specific content and types to reduce the dielectric constant of the ink, and prepare film packaging through inkjet printing process .
The dielectric constant of the ink composition is significantly reduced, the dispersion performance and stability of viscosity, surface tension and light transmittance are improved, and a more ideal OLED device packaging effect is achieved.
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Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of new materials, and in particular to an ink composition and a preparation method and application thereof. Background Art
[0002] OLED (Organic Light-Emitting Diode) is an organic light-emitting diode. Unlike traditional LCD displays, it does not require a backlight and uses a very thin layer of organic material and a glass substrate (or flexible organic substrate). When current passes through, these organic materials will emit light. However, OLED organic materials are extremely sensitive to moisture and oxygen. Oxygen accelerates the photodegradation of organic materials, and moisture causes oxidation of the metal electrode layer, which together accelerate the failure process of OLED devices. Therefore, long-term or short-term exposure to the environment will cause serious aging of OLED devices, greatly affecting the luminous efficiency and service life of OLED devices. Device packaging becomes a crucial step in the manufacturing process. At present, growing a single or multi-layer thin film on the prepared OLED device substrate to achieve a water vapor barrier effect is a more common method.
[0003] However, the thin film encapsulation research for OLED device encapsulation usually adopts the method of organic-inorganic composite thin film. When inorganic thin film is used alone, although it can effectively block water vapor and oxygen, its film forming property and interface matching property are poor and defects are easily formed; when organic thin film is used alone, due to its large free volume and large average degree of freedom of chain segments, its water vapor and oxygen blocking effect is poor, but it has good flexibility, good film forming property and high flatness; when organic-inorganic composite thin film is used, the organic thin film can cover the defects of inorganic thin film, and at the same time, the high barrier property of inorganic film to water vapor and oxygen and the good surface morphology of organic film are utilized. Therefore, the method of alternating organic and inorganic film film formation can obtain more satisfactory effect. Specifically, for the effective encapsulation of the inorganic layer, it is necessary to deposit the thin film by DC or AC reactive sputtering in a vacuum chamber, and the deposition of the organic layer can adopt non-vacuum methods, including gravure printing, spray coating and inkjet printing.
[0004] Among them, the ink composition can be used as an organic layer material for thin film encapsulation, and the thin film can be prepared by inkjet printing. Since low dielectric materials can be used to isolate and buffer circuit elements in OLED devices, reduce interference and coupling between circuits, reduce signal attenuation and interference, and improve the stability of OLED devices, reducing the dielectric constant of organic layer materials has certain research significance. Summary of the invention
[0005] The present invention provides an ink composition, a preparation method and an application thereof. Hollow silica microspheres surface-modified with a specific content and type of silane coupling agent are added to an ink composition mainly composed of acrylate monomers, thereby achieving a significant reduction in the dielectric constant of the ink composition.
[0006] In a first aspect, the present invention first provides an ink composition, comprising: a polymerizable monomer mainly composed of an acrylate monomer and hollow silica microspheres surface-modified with a silane coupling agent; The grafting amount of the silane coupling agent with acryloxy group on the modified hollow silica microspheres is 0.1% to 7%.
[0007] Optionally, the grafting amount of the silane coupling agent with an acryloxy group on the modified hollow silica microspheres can be 0.1%, 0.7%, 0.8%, 1%, 1.5%, 2%, 2.5%, 3%, 3.5%, 4%, 4.5%, 5%, 5.5%, 6%, 6.5%, 7%, etc., and of course, it can also be other values within the above range, which is not limited here. Preferably, it is 0.7% to 7%.
[0008] The present invention has found in experiments that when hollow silica microspheres are added to the ink composition of the present invention, the dielectric constant can be reduced only under specific conditions. After analysis, it is found that during the preparation process of the hollow silica microspheres, microstructures such as mesopores that are not conducive to the reduction of the dielectric constant are easily generated. In order to overcome this defect, the present invention proposes to use a silane coupling agent with an acryloxy group to modify the surface of the hollow silica microspheres. It is unexpectedly found that when the content of the silane coupling agent is controlled in the range of 0.1% to 7%, the hollow silica microspheres after surface modification not only obtain better dispersion performance in the system, but also compared with other types of surfactants, the ink composition obtained by the method of the present invention has a lower dielectric constant when used, and can also stabilize the viscosity, surface tension and transmittance of the ink composition within a reasonable range, thereby achieving a more ideal application.
[0009] According to the ink composition provided by the present invention, the silane coupling agent includes: 3-(methacryloxy)propyltrimethoxysilane, 3-(acryloxy)propyltrimethoxysilane, methacryloxypropyltris(trimethylsiloxy)silane, 3-(acryloxy)propyltrimonosilane or 1,3-bis(3-methacryloxypropyl)tetrakis(trimethylsiloxy)disiloxane, or a combination of two or more thereof.
[0010] According to the ink composition provided by the present invention, the average particle size of the modified hollow silica microspheres is 10-500 nm.
[0011] According to the ink composition provided by the present invention, the method for preparing the modified hollow silica microspheres comprises: dispersing the hollow silica microspheres in an organic solvent, and adding the silane coupling agent and the polymerization inhibitor, and reacting to obtain the modified hollow silica microspheres.
[0012] Preferably, the polymerization inhibitor includes phenolic polymerization inhibitor and quinone polymerization inhibitor, the phenolic polymerization inhibitor includes one or more of hydroquinone, p-hydroxyanisole and 2,6-di-tert-butyl-p-cresol; the quinone polymerization inhibitor includes one or more of p-benzoquinone, methylhydroquinone and tetrachlorobenzoquinone.
[0013] Preferably, the added amount of the silane coupling agent is 1% to 10% of the mass of the hollow silica microspheres.
[0014] Preferably, the organic solvent comprises cyclohexane.
[0015] Preferably, the reaction temperature is 50-90° C., and the reaction time is 8-12 h.
[0016] Preferably, the method for preparing the hollow silica microspheres comprises: mixing polystyrene emulsion, ethanol, water and tetraethyl orthosilicate, reacting under alkaline conditions, and then washing and calcining; wherein the purpose of the calcination is to remove the polystyrene to form a hollow structure; Preferably, the reaction temperature under alkaline conditions is 30-60° C., the reaction time is 10-14 h, and the pH value is 8-12.
[0017] Preferably, the calcination temperature is 550-700° C. and the calcination time is 3-6 hours.
[0018] Preferably, the method for preparing the polystyrene emulsion comprises: mixing styrene, azobisisobutyronitrile (AIBN) and water and reacting the mixture under an inert atmosphere.
[0019] Preferably, the reaction temperature under an inert atmosphere is 50-90° C. and the reaction time is 10-14 h; Preferably, the inert atmosphere comprises nitrogen.
[0020] According to the ink composition provided by the present invention, the polymerizable monomer includes an acrylate monomer, and the acrylate monomer includes one or more of a monofunctional acrylate monomer, a difunctional acrylate monomer, and a multifunctional acrylate monomer, wherein the monofunctional acrylate monomer includes one or more of isobornyl methacrylate, isobornyl acrylate, isodecyl methacrylate, isodecyl acrylate, n-octyl methacrylate, n-octyl acrylate, lauryl methacrylate, lauryl acrylate, tridecyl acrylate, tridecyl methacrylate, tetradecyl methacrylate, and tetradecyl acrylate; The difunctional acrylate monomers include one or more of 1,6-hexanediol dimethacrylate, 1,6-hexanediol diacrylate, neopentyl glycol dimethacrylate, neopentyl glycol diacrylate, tricyclodecane dimethanol diacrylate, tricyclodecane dimethanol dimethacrylate, dodecyl dimethacrylate, and dodecyl diacrylate; the multifunctional acrylate monomers include one or more of trimethylolpropane trimethacrylate, trimethylolpropane triacrylate, pentaerythritol tetramethacrylate, pentaerythritol tetraacrylate, dipentaerythritol hexamethacrylate, and dipentaerythritol hexaacrylate. It should be noted here that the acrylate monomers include acrylate monomers and / or alkyl acrylate monomers, and do not specifically refer to acrylate monomers. It is particularly preferred that the acrylate monomers include acrylate monomers and / or methacrylate monomers.
[0021] According to the ink composition provided by the present invention, the polymerizable monomers include: monofunctional acrylic acid ester monomers accounting for 20% to 90% of the total mass of the polymerizable monomers, and the specific monofunctional acrylic acid ester monomers are preferably monofunctional alkyl acrylic acid ester monomers and / or monofunctional alkyl methacrylates, and the alkyl chain length of the monofunctional alkyl acrylic acid ester monomers and / or monofunctional alkyl methacrylates is greater than or equal to 10. It should be noted that the monofunctional alkyl acrylic acid ester monomer refers to an alkyl acrylic acid ester obtained by reacting an acrylic compound with an alkyl alcohol without other groups. Further preferably, the monofunctional acrylic acid ester monomers account for 30% to 85% of the total mass of the polymerizable monomers.
[0022] And / or, the polymerizable monomers include: difunctional acrylate monomers accounting for 5% to 70% of the total mass of the polymerizable monomers and multifunctional acrylate monomers accounting for 0% to 25% of the total mass of the polymerizable monomers. Further preferably, the difunctional acrylate monomers account for 10% to 70% of the total mass of the polymerizable monomers.
[0023] It has been found in experiments that the longer the alkyl chain segment in the selected polymerizable monomer is, the lower the dielectric constant of the resulting composition will be when used.
[0024] When the polymerizable monomers of different functional monomers in the present invention are used in combination, they can be used to adjust the curing properties of the ink.
[0025] The ink composition provided by the present invention further includes an auxiliary agent, and the auxiliary agent includes one or a combination of two or more of a dispersant, a leveling agent, an antioxidant or a defoaming agent.
[0026] Preferably, the photoinitiator includes: a cleavage-type initiator and / or a hydrogen abstraction-type initiator.
[0027] Further preferably, the cleavage initiator includes one or a combination of two or more of benzoin and its derivatives, benzil derivatives, dialkoxyacetophenone, α-hydroxyalkylphenone, α-aminoalkylphenone or acylphosphine oxide.
[0028] Further preferably, the cleavage-type initiator includes one or a combination of two or more of 2-hydroxy-2-methyl-1-phenylpropanone (photoinitiator 1173), 2-dimethylamino-2-benzyl-1-[4-(4-morpholinyl)phenyl]-1-butanone (photoinitiator 910), 2-methyl-2-(4-morpholinyl)-1-[4-(methylthio)phenyl]-1-propanone (photoinitiator 907), 1-hydroxycyclohexylphenyl ketone (photoinitiator 184), diphenyl (2,4,6-trimethylbenzoyl)phosphine oxide (TPO) or ethyl 2,4,6-trimethylbenzoylphenylphosphonate (TPO-L).
[0029] Preferably, the hydrogen abstraction initiator comprises benzophenone compounds and / or heterocyclic aromatic ketone compounds.
[0030] More preferably, the hydrogen abstraction initiator includes one or a combination of two or more of benzophenone (BP), 4-methylbenzophenone or 2,4,6-trimethylbenzophenone.
[0031] The ink composition provided by the present invention comprises, by mass percentage: Polymerizable monomer 45%~90%; Photoinitiator 0.5%~5%; Modified hollow silica microspheres 5%~50%; Additives 0~3%.
[0032] In a second aspect, the present invention also provides a method for preparing the ink composition as described above, wherein a polymerizable monomer, a photoinitiator and modified hollow silica microspheres are uniformly mixed. It should be noted that the mixing conditions are mixing at a temperature of 10 to 40° C. and a pressure of 0.5 to 1.5 standard atmospheres, and more preferably, the mixing conditions are normal temperature and pressure (25° C. and one standard atmosphere).
[0033] In a third aspect, the present invention also provides use of the ink composition described above in OLED device encapsulation.
[0034] The present invention provides a low dielectric constant ink composition, a preparation method and an application thereof, which achieves a significant reduction in the dielectric constant of the ink composition by adding hollow silica microspheres with a specific content and type of silane coupling agent surface modified to the ink composition mainly composed of acrylate monomers. DETAILED DESCRIPTION
[0035] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be described clearly and completely below. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0036] If no specific techniques or conditions are specified in the examples, the techniques or conditions described in the literature in the field or the product instructions are used. If no manufacturer is specified for the reagents or instruments used, they are all conventional products that can be purchased through regular channels.
[0037] Preparation Example 1 Modified hollow silica microspheres with an average particle size of 20 nm
[0038] A method for preparing hollow silica microspheres surface-modified with a silane coupling agent, comprising the following steps: (1) Mix 5 g of styrene and 0.05 g of AIBN, then add 50 mL of deionized water, disperse evenly by ultrasonic treatment for 180 min, and react at 70 °C for 12 h under a nitrogen atmosphere to obtain a polystyrene emulsion; (2) Add 20 mL of ethanol, 50 mL of deionized water and 10 g of tetraethyl orthosilicate to the polystyrene emulsion, stir at room temperature for 10 minutes, add ammonia water to adjust the pH of the solution to 8-13, and react at 50°C for 12 hours; centrifuge and filter the reaction product, then wash it with deionized water and ethanol three times respectively, and dry it at 60°C; (3) calcining the obtained solid at 600° C. in a muffle furnace to remove the polystyrene template and obtain hollow silica microspheres; (4) The hollow silica microspheres are dispersed in cyclohexane, 5% 3-(methacryloyloxy)propyltrimethoxysilane and 200 ppm p-hydroxyanisole are added, and the mixture is reacted at 70° C. for 10 h to graft the silane coupling agent onto the surface of the hollow silica microspheres.
[0039] The obtained hollow silica microspheres modified by silane coupling agent have an average particle size of 20 nm and a grafting amount of 3%.
[0040] Preparation Example 2 Modified hollow silica microspheres with an average particle size of 200 nm
[0041] It is basically the same as Preparation Example 1, except that the ultrasonic mixing time is 60 minutes and the average particle size is 200 nm.
[0042] Preparation Example 3 Modified hollow silica microspheres with an average particle size of 500 nm
[0043] It is basically the same as Preparation Example 1, except that the ultrasonic mixing time is 30 minutes and the average particle size is 500 nm.
[0044] Preparation Example 4 Modified hollow silica with an average particle size of 10 nm
[0045] It is basically the same as Preparation Example 2, except that the ultrasonic mixing time is 240 min and the average particle size is 10 nm.
[0046] Preparation Example 5 The content of silane coupling agent is 1%
[0047] The method is basically the same as Preparation Example 2, except that 1% 3-(methacryloyloxy)propyltrimethoxysilane is added to obtain hollow silica microspheres modified with a silane coupling agent with a grafting amount of 0.7%.
[0048] Preparation Example 6 The content of silane coupling agent is 10%
[0049] The method is basically the same as Preparation Example 2, except that 10% of methacryloxypropyl tris(trimethylsiloxy)silane is added to obtain hollow silica microspheres modified with a silane coupling agent having a grafting amount of 7%.
[0050] Preparation Example 7 The content of silane coupling agent is 5%
[0051] The method is basically the same as Preparation Example 2, except that 5% 1,3-bis(3-methacryloxypropyl)tetrakis(trimethylsiloxy)disiloxane is added to obtain hollow silica microspheres modified with a silane coupling agent having a grafting amount of 4%.
[0052] Preparation Example 8 The content of silane coupling agent is 5%
[0053] The method is basically the same as Preparation Example 7, except that 5% of γ-glycidyloxypropyltrimethoxysilane is added to obtain hollow silica microspheres modified with a silane coupling agent having a grafting amount of 4%.
[0054] Preparation Example 9 The content of silane coupling agent is 15%
[0055] The method is basically the same as Preparation Example 2, except that 15% 3-(methacryloyloxy)propyltrimethoxysilane is added to obtain hollow silica microspheres modified with a silane coupling agent having a grafting amount of 9%.
[0056] Preparation Example 10 The content of silane coupling agent is 0%
[0057] The method is basically the same as Preparation Example 2, except that no silane coupling agent is added to obtain hollow silica microspheres not modified by silane coupling agent.
[0058] Example 1
[0059] A low dielectric constant ink composition, the components of which are shown in Table 1 below: Table 1
[0060] The above components are mixed uniformly at room temperature and pressure to obtain a low dielectric constant ink composition.
[0061] Example 2
[0062] A low dielectric constant ink composition, the components of which are shown in Table 2 below: Table 2
[0063] Example 3
[0064] A low dielectric constant ink composition, the components of which are shown in Table 3 below: Table 3
[0065] Example 4
[0066] A low dielectric constant ink composition, the components of which are shown in Table 4 below: Table 4
[0067] Example 5
[0068] It is basically the same as Example 2, except that the modified hollow silica microspheres are replaced by the modified hollow silica microspheres with a particle size of 500 nm obtained in Preparation Example 3.
[0069] Example 6
[0070] It is basically the same as Example 2, except that the modified hollow silica microspheres are replaced by the modified hollow silica microspheres with a particle size of 20 nm obtained in Preparation Example 1.
[0071] Example 7
[0072] It is basically the same as Example 2, except that the modified hollow silica microspheres are replaced by the modified hollow silica microspheres with a particle size of 10 nm obtained in Preparation Example 4.
[0073] Example 8
[0074] It is basically the same as Example 2, except that the modified hollow silica microspheres are replaced by the hollow silica microspheres prepared in Preparation Example 5.
[0075] Example 9
[0076] It is basically the same as Example 2, except that the modified hollow silica microspheres are replaced by the hollow silica microspheres prepared in Preparation Example 6.
[0077] Example 10
[0078] It is basically the same as Example 2, except that the modified hollow silica microspheres are replaced by the hollow silica microspheres prepared in Preparation Example 7.
[0079] Embodiment 11
[0080] A low dielectric constant ink composition is substantially the same as that of Example 2, except that the difference is shown in Table 5 below: Table 5
[0081] Example 12
[0082] A low dielectric constant ink composition, the components of which are shown in Table 6 below: Table 6
[0083] Embodiment 13
[0084] A low dielectric constant ink composition, the components of which are shown in Table 7 below: Table 7
[0085] Comparative Example 1
[0086] A low dielectric constant ink composition, the components of which are shown in Table 8 below: Table 8
[0087] Comparative Example 2
[0088] It is basically the same as Example 2, except that the modified hollow silica microspheres are replaced by the modified hollow silica microspheres prepared in Preparation Example 9.
[0089] Comparative Example 3
[0090] It is basically the same as Example 2, except that the modified hollow silica microspheres are replaced by the modified hollow silica microspheres prepared in Preparation Example 10.
[0091] Comparative Example 4
[0092] It is basically the same as Example 2, except that the modified hollow silica microspheres are replaced by the modified hollow silica microspheres prepared in Preparation Example 8.
[0093] Test Case
[0094] The dielectric constants of the ink compositions obtained in the examples and comparative examples were tested according to GB / T 1409-2006.
[0095] 1. Relative dielectric constant: Refer to GBT 1409-2006 for the recommended method for measuring the dielectric constant and dielectric loss factor of electrical insulating materials at power frequency, audio frequency, and high frequency (including meter-wave wavelength).
[0096] 2. Viscosity: Refer to ASTM D2196-1999 Test method for determining the rheological properties of non-Newtonian materials using a rotational (Brookfield) viscometer.
[0097] 3. Surface tension: Surface tension is measured according to the natural rubber latex ring method of GB / T18396-2008.
[0098] 4. Light transmittance: refer to GB / T 2410-2008 Determination of light transmittance and haze of transparent plastics.
[0099] The test results are shown in Table 9 below: Table 9
[0100] It can be seen from the experimental results in Table 9 that the ink composition of the present invention has good inkjet printing performance, a viscosity range of 15-25 cP, and a surface tension range of 25-35 mN.m -1, the transmittance is positively correlated with the brightness of the OLED device. It can be seen from the experimental results of Example 1 and Comparative Example 1, and Example 2 and Comparative Examples 3-4 that adding the modified hollow silica microspheres modified by the silane coupling agent with an acryloxy group to the ink composition can effectively reduce the dielectric constant of the ink composition. Further, it can be seen from the experimental results of Example 2 and Comparative Example 2 that the grafting amount of the silane coupling agent with an acryloxy group will affect the surface tension of the ink composition. Therefore, the grafting amount of the silane coupling agent with an acryloxy group is limited to a reasonable range value, while ensuring that the dielectric constant of the ink composition can be effectively reduced, the ink composition can maintain a more suitable surface tension to achieve better application.
[0101] It can be seen from the above data that the various properties of the ink composition prepared by the present invention meet the basic requirements of OLED device packaging and its packaging process, and has great potential for application in this field.
[0102] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims
1. An ink composition, characterized in that: The invention comprises a polymerizable monomer, a photoinitiator and modified hollow silica microspheres; the modified hollow silica microspheres are obtained by modifying hollow silica microspheres with a silane coupling agent, the silane coupling agent comprises a silane coupling agent with an acryloxy group, and the grafting amount of the silane coupling agent with an acryloxy group on the modified hollow silica microspheres is 0.1% to 7%.
2. The ink composition according to claim 1, characterized in that: The silane coupling agent includes: 3-(methacryloxy)propyltrimethoxysilane, 3-(acryloxy)propyltrimethoxysilane, methacryloxypropyltri(trimethylsiloxy)silane, 3-(acryloxy)propyltriethoxysilane or 1,3-bis(3-methacryloxypropyl)tetrakis(trimethylsiloxy)disiloxane, or a combination of two or more thereof.
3. The ink composition according to claim 1 or 2, characterized in that: The average particle size of the modified hollow silica microspheres is 10-500 nm.
4. The ink composition according to any one of claims 1 to 3, characterized in that: The method for preparing the modified hollow silica microspheres comprises: dispersing the hollow silica microspheres in an organic solvent, adding the silane coupling agent and the polymerization inhibitor, and reacting to obtain the modified hollow silica microspheres; Preferably, the polymerization inhibitor includes phenolic polymerization inhibitor and quinone polymerization inhibitor; the phenolic polymerization inhibitor includes one or more of hydroquinone, p-hydroxyanisole and 2,6-di-tert-butyl-p-cresol; the quinone polymerization inhibitor includes one or more of p-benzoquinone, methylhydroquinone and tetrachlorobenzoquinone; Preferably, the added amount of the silane coupling agent is 1% to 10% of the mass of the hollow silica microspheres.
5. The ink composition according to any one of claims 1 to 4, characterized in that: The polymerizable monomers include acrylate monomers, and the acrylate monomers include one or more of monofunctional acrylate monomers, difunctional acrylate monomers, and multifunctional acrylate monomers; wherein the monofunctional acrylate monomers include one or more of isobornyl methacrylate, isobornyl acrylate, isodecyl methacrylate, isodecyl acrylate, n-octyl methacrylate, n-octyl acrylate, lauryl methacrylate, lauryl acrylate, tridecyl acrylate, tridecyl methacrylate, tetradecyl methacrylate, and tetradecyl acrylate; the difunctional acrylate monomers include one or more of isobornyl methacrylate, isobornyl acrylate, isodecyl methacrylate, isodecyl acrylate, n-octyl methacrylate, n-octyl acrylate, lauryl methacrylate, lauryl acrylate, tridecyl acrylate, tridecyl methacrylate, tetradecyl methacrylate, and tetradecyl acrylate; The monomers include one or more of 1,6-hexanediol dimethacrylate, 1,6-hexanediol diacrylate, neopentyl glycol dimethacrylate, neopentyl glycol diacrylate, tricyclodecane dimethanol diacrylate, tricyclodecane dimethanol dimethacrylate, dodecyl dimethacrylate, and dodecyl diacrylate; the multifunctional acrylate monomers include one or more of trimethylolpropane trimethacrylate, trimethylolpropane triacrylate, pentaerythritol tetramethacrylate, pentaerythritol tetraacrylate, dipentaerythritol hexamethacrylate, and dipentaerythritol hexaacrylate.
6. The ink composition according to any one of claims 1 to 5, characterized in that: The polymerizable monomers include: monofunctional acrylate monomers accounting for 20% to 90% of the total mass of the polymerizable monomers; And / or, the polymerizable monomers include: a difunctional acrylate monomer accounting for 5% to 70% of the total mass of the polymerizable monomers and a multifunctional acrylate monomer accounting for 0% to 25% of the total mass of the polymerizable monomers.
7. The ink composition according to any one of claims 1 to 6, characterized in that: The invention also includes auxiliary agents, which include one or a combination of two or more of a dispersant, a leveling agent, an antioxidant or a defoaming agent.
8. The ink composition according to any one of claims 1 to 7, characterized in that: Calculated by mass percentage, including: Polymerizable monomer 45%~90%; Photoinitiator 0.5%~5%; Modified hollow silica microspheres 5%~50%; Additives 0~3%.
9. The method for preparing the ink composition according to any one of claims 1 to 8, characterized in that: The polymerizable monomer, the photoinitiator and the modified hollow silica microspheres are mixed uniformly.
10. Use of the ink composition according to any one of claims 1 to 8 in OLED device packaging.
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