Special testing device for detecting resistance of miniature semiconductor chip

Abstract

The invention relates to the technical field of semiconductor detection, and discloses a special testing device for detecting the resistance of a miniature semiconductor chip, which comprises a four-probe tester and a power switch, the power switch is arranged on the outer wall of the four-probe tester, and the top of the four-probe tester is fixedly connected with a test board. A four-probe probe is arranged on the outer wall of the four-probe tester in an inserted mode, a position adjustment pretreatment assembly used for stably adjusting movement of the sliding block is arranged above the four-probe tester, and a sleeving isolation antifouling assembly used for conducting protection adjustment treatment on the four-probe probe is arranged above the four-probe tester; through adjustment, the influence of distance and force factors caused by manual operation on the tip end of the four-probe probe is avoided, meanwhile, the outer wall on the side face of a semiconductor sheet can be preprocessed and clamped and positioned, protection measures are taken for the four-probe probe in the non-detection stage, and the accuracy of data in the testing process is guaranteed.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor detection, in particular to a special testing device for detecting resistance of micro-semiconductor wafers. Background Art

[0002] Micro semiconductor cooling chip, also known as micro semiconductor cooling chip or thermoelectric cooling chip, is a device that uses the thermoelectric effect of semiconductor materials to achieve cooling function. Resistance is one of the important electrical parameters of micro semiconductor chips, and its value directly affects the working state and performance of the device. By testing the resistance, it can be evaluated whether the micro semiconductor chip meets the design requirements, thereby ensuring that the device has stable performance within the normal working range;

[0003] In real life, when testing the resistance of micro-semiconductor wafers, a special instrument, a four-probe tester, is often used. The four-probe method is used to squeeze the surface of the semiconductor wafer to test the resistance value. However, the existing instrument can only adjust the distance between the four-probe probe and the semiconductor wafer by rotating the knob and moving the slider up and down. During the manual adjustment process, due to the human factor of manual operation, the distance and strength of each adjustment may be different, which will affect the consistency and stability of the product. If it falls off accidentally, the four-probe probe will impact and squeeze the semiconductor wafer under the action of gravity, causing damage to the semiconductor and affecting subsequent detection;

[0004] In addition, the probe of the four-probe tester is the component that directly contacts the surface of the semiconductor wafer to be tested. If the probe is contaminated or damaged, it will directly affect the accuracy of the test. When the four-probe tester is in an idle and untested state, it is suspended above the instrument and will inevitably be affected by dust particles. If it adheres to the outer wall, the pollutants in the test environment during the subsequent test will cause poor contact or test errors.

[0005] Therefore, a special testing device for detecting the resistance of micro-semiconductor wafers is proposed. Summary of the invention

[0006] The purpose of the present invention is to provide a special testing device for detecting the resistance of micro-semiconductor wafers to solve the problems raised in the above background technology.

[0007] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a special test device for detecting resistance of micro-semiconductor wafers, comprising a four-probe tester and a power switch, wherein the power switch is mounted on the outer wall of the four-probe tester, the top of the four-probe tester is fixedly connected to a test bench, the upper surface of the test bench is fixedly connected to a vertical pole, a slider is slidably connected to the outer wall of the vertical pole, a four-probe probe is plugged and arranged on the outer wall of the four-probe tester, one end of the four-probe probe away from the four-probe tester is fixedly connected to the slider, a button is threadedly connected to the middle part of the slider, a position adjustment pretreatment component for adjusting the movement stability of the slider is arranged above the four-probe tester, and a sleeve isolation and anti-fouling component for protecting and adjusting the four-probe probe is arranged above the four-probe tester, wherein:

[0008] The position adjustment pretreatment component includes a lifting rack, which is slidably connected to the outer wall of the test bench, and a connecting rod is fixedly connected to the end of the lifting rack away from the four-probe tester, and the connecting rod is fixedly connected to the slider at one end away from the lifting rack, and the connecting rod is slidably connected to the middle part of the test bench, and a transmission gear is rotatably connected to the middle part of the test bench, and the transmission gear is meshed with the lifting rack. Groove frames are rotatably connected to both sides of the rear of the test bench, and T-shaped plates are slidably connected to the inner walls of the groove frames on both sides, and connecting springs are arranged inside the groove frames on both sides.

[0009] Preferably, one end of the connecting spring is fixedly connected to the T-shaped plate, the other end of the connecting spring is fixedly connected to the groove frame, and a reciprocating screw is fixedly connected to the middle part of the transmission gear, and the reciprocating screw is rotatably connected to the top of the four-probe tester.

[0010] Preferably, the outer wall of the reciprocating screw is threadedly connected to a roller, the top of the four-probe tester is fixedly connected to a guide rod, the guide rod and the reciprocating screw are symmetrically arranged around the center of the vertical rod, and the roller is slidably connected to the outer wall of the guide rod on the side away from the reciprocating screw.

[0011] Preferably, a rectangular hole is opened in the middle of the test bench, a bidirectional screw is rotatably connected inside the rectangular hole, arc blocks are threadedly connected on both sides of the outer wall of the bidirectional screw, the front end of the bidirectional screw and the end of the reciprocating screw away from the transmission gear are fixedly connected with pulleys, and the pulleys on both sides are connected by a connecting belt.

[0012] Preferably, the isolation and anti-fouling component includes an I-shaped plate, which is rotatably connected to the top of the four-probe tester, and the bottom of the I-shaped plate is fixedly connected to a receiving strip, and the inner wall of the receiving strip is fixedly connected to an electric telescopic rod, and the telescopic rod end of the electric telescopic rod is fixedly connected to a special-shaped block, and the special-shaped block is slidably connected to the bottom of the I-shaped plate, and the middle part of the I-shaped plate is fixedly connected to a connecting sleeve, and the inner wall of the connecting sleeve is slidably connected to a lifting rod, and the middle part of the lifting rod close to the I-shaped plate is rotatably connected to a guide pulley, and the guide pulley is slidably connected to the bottom of the special-shaped block.

[0013] Preferably, a return spring is sleeved on the outer wall of the lifting rod, one end of the return spring is fixedly connected to the lifting rod, and the other end of the return spring is fixedly connected to the connecting sleeve.

[0014] Preferably, a limiting groove is provided in the middle part of one side of the lifting rod close to the guide rod, the bottom of the receiving strip is fixedly connected to the limiting rod, the limiting rod and the limiting groove are slidably connected, and the end of the lifting rod away from the I-shaped plate is fixedly connected to a sheath, and the sheath is arranged on the outside of the four-probe probe.

[0015] Preferably, an arc-shaped groove is provided at the top of the four-probe tester next to the test bench, a guide ball is fixedly connected to the bottom of the receiving strip, the outer wall of the guide ball is slidably connected to the inner wall of the arc-shaped groove, and a magnetic plate is fixedly connected to the top of the arc-shaped groove on the side away from the test bench.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. In the process of adjusting the vertical position of the slider by toggling the hand, the slider is buffered and supported while moving, and a lifting rack is set to move synchronously with the slider. In the process of the four-probe probe contacting the semiconductor wafer downward, the lifting rack can move downward, and the T-shaped plate is squeezed to the inside of the groove frame through the connecting springs on both sides to ensure the stability of the slider driving the four-probe probe to move and adjust, avoiding the influence caused by the difference in distance and hand strength. At the same time, with the movement of the lifting rack, the transmission gear meshing with it can be driven to rotate, and then the reciprocating screw fixedly connected to the transmission gear can be driven to rotate, and with the cooperation of the guide rod, before testing the semiconductor wafer, the roller is moved back and forth on the outer wall of the semiconductor wafer to be tested, and the particulate impurities on the surface are processed to reduce pollution and wear, and ensure the reliability of the test data. At the same time, with the rotation of the reciprocating screw, with the cooperation of the pulley group, the bidirectional screw can also be driven to rotate inside the rectangular hole at the same time, so as to realize the relative or opposite movement of the arc blocks on both sides, and the adjustment is made according to the size of the semiconductor wafer placed on the test bench, and it is positioned to ensure the stability in the subsequent test process;

[0018] 2. By setting protective measures on the outer wall of the four-probe probe, after the semiconductor wafer test is completed, the power switch is used to control the power off of the magnetic suction plate, so that the iron guide ball adsorbed thereon can be separated, and the I-shaped plate is rotated by hand and guided by the guide ball to slide inside the arc groove, and the I-shaped plate is rotated 90 degrees clockwise from the longitudinal direction to the transverse direction, and the electric telescopic rod is extended to allow the guide pulley to slide from the bottom horizontal plane of the special-shaped block to the inclined plane, thereby reducing the downward pressure on the reset spring, so that the lifting rod can move upward a certain distance, and with the assistance of the limit groove and the limit rod, the lifting rod can drive the sheath It moves stably in the vertical direction. With the adjustment of the distance in the vertical direction, the sheath can be set on the outside of the four-probe probe to protect it. Correspondingly, when the semiconductor wafer is to be tested, after the power switch is turned on, the electric telescopic rod can be controlled to retract by an electrical signal, and the guide pulley is adjusted to slide from the upper surface of the special-shaped block to its bottom, and the reset spring is compressed downward to move the lifting rod downward, so that the sheath is separated from the four-probe probe, and the magnetic suction plate is energized accordingly, so that the guide ball and the magnetic suction plate are attracted to each other, and the arc groove drives the sheath to rotate counterclockwise by 90 degrees and return to a position close to the magnetic suction plate, so as not to affect the detection of semiconductor wafers;

[0019] 3. By providing buffer support and stable adjustment to the four-probe probe during the adjustment process, it is ensured that the tip of the four-probe probe can contact the semiconductor wafer at an appropriate moving speed and distance, reducing the influence of distance and force factors caused by manual operation, ensuring the integrity of the semiconductor wafer during the detection and testing process and avoiding damage. At the same time, it can complete the pretreatment of the outer wall on the side of the semiconductor wafer and clamp and position it, further and better improve the defects of interference factors in the detection and testing process, and take protective measures for the four-probe probe in the stage before detection to avoid being suspended in the air and being contaminated by dust particles, avoid poor contact caused by subsequent detection, and ensure the accuracy of the test process data. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a three-dimensional schematic diagram of the overall device of the present invention;

[0021] Figure 2 It is a rear view schematic diagram of the overall device of the present invention;

[0022] Figure 3 For the present invention Figure 2 The enlarged schematic diagram of point A in the middle;

[0023] Figure 4 It is a side view schematic diagram of the overall device of the present invention;

[0024] Figure 5 For the present invention Figure 4The enlarged schematic diagram of point B in the middle;

[0025] Figure 6 It is a front view schematic diagram of the present invention;

[0026] Figure 7 It is a top view schematic diagram of the overall device of the present invention;

[0027] Figure 8 It is a vertical cross-sectional schematic diagram of a four-probe probe of the present invention;

[0028] Fig. 9 For the present invention Figure 8 The enlarged schematic diagram of the center C;

[0029] Fig.10 For the present invention Figure 8 Enlarged schematic diagram of point D in the middle.

[0030] In the figure:

[0031] 1. Four-probe tester; 2. Power switch; 3. Test bench; 4. Vertical pole; 5. Four-probe probe; 6. Slider; 7. Button;

[0032] The position adjustment pretreatment component includes: 81, lifting rack; 82, connecting rod; 83, transmission gear; 84, groove frame; 85, T-shaped plate; 86, connecting spring; 87, reciprocating screw rod; 88, guide rod; 89, roller; 810, pulley; 811, connecting belt; 812, rectangular hole; 813, bidirectional screw rod; 814, arc block;

[0033] The isolation and anti-fouling components include: 91, I-shaped plate; 92, electric telescopic rod; 93, special-shaped block; 94, receiving slats; 95, connecting sleeve; 96, lifting rod; 97, guide pulley; 98, reset spring; 99, limit groove; 910, limit rod; 911, sheath; 912, arc groove; 913, guide ball; 914, magnetic plate. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] See also Figures 1 to 10, is an embodiment provided by the present invention: a special test device for detecting resistance of micro-semiconductor wafers, comprising a four-probe tester 1 and a power switch 2, the power switch 2 is installed on the outer wall of the four-probe tester 1, the top of the four-probe tester 1 is fixedly connected with a test bench 3, the upper surface of the test bench 3 is fixedly connected with a vertical pole 4, the outer wall of the vertical pole 4 is slidably connected with a slider 6, a four-probe probe 5 is plugged and arranged on the outer wall of the four-probe tester 1, one end of the four-probe probe 5 away from the four-probe tester 1 is fixedly connected with the slider 6, the middle part of the slider 6 is threadedly connected with a lever 7, a position adjustment pretreatment component for adjusting the movement stability of the slider 6 is arranged above the four-probe tester 1, and a sleeve isolation and anti-fouling component for protecting and adjusting the four-probe probe 5 is arranged above the four-probe tester 1, wherein:

[0036] The position adjustment pretreatment component includes a lifting rack 81, which is slidably connected to the outer wall of the test bench 3, and the end of the lifting rack 81 away from the four-probe tester 1 is fixedly connected to a connecting rod 82, and the end of the connecting rod 82 away from the lifting rack 81 is fixedly connected to the slider 6, and the connecting rod 82 is slidably connected to the middle part of the test bench 3, and the middle part of the test bench 3 is rotatably connected to a transmission gear 83, and the transmission gear 83 is meshed with the lifting rack 81. Groove frames 84 are rotatably connected to both sides of the rear of the test bench 3, and T-shaped plates 85 are slidably connected to the inner walls of the groove frames 84 on both sides. Connecting springs 86 are arranged inside the groove frames 84 on both sides, and one end of the connecting spring 86 is fixedly connected to the T-shaped plate 85, and the other end of the connecting spring 86 is fixedly connected to the groove frame 84. A reciprocating screw rod 87 is fixedly connected to the middle part of the transmission gear 83, and the reciprocating screw rod 87 is rotatably connected to the top of the four-probe tester 1;

[0037] Wherein: the inner wall of the transverse section of the groove frame 84 corresponds to and matches the T-shaped plate 85;

[0038] Better: place the semiconductor wafer to be tested at the top center of the test bench 3, rotate the paddle button 7 counterclockwise to remove it, and manually adjust the position of the slider 6 by moving it downward. The lifting rack 81 is connected to the slider 6 through the connecting rod 82, so that it can move synchronously with the slider 6. During the downward movement of the lifting rack 81, the connecting spring 86 inside the groove frame 84 can be squeezed downward by the T-shaped plate 85, so that the slider 6 can be buffered and supported during the adjustment process, avoiding damage to the semiconductor wafer directly below due to improper manual operation. At the same time, as the lifting rack 81 moves, it can drive the transmission gear 83 meshing with it to rotate on the rear side of the test bench 3, and further drive the reciprocating screw 87 fixedly connected to the transmission gear 83 to rotate above the four-probe tester 1.

[0039] The outer wall of the reciprocating screw 87 is threadedly connected with a roller 89, and the top of the four-probe tester 1 is fixedly connected with a guide rod 88. The guide rod 88 and the reciprocating screw 87 are symmetrically arranged with the center of the vertical rod 4. The roller 89 is slidably connected to the outer wall of the guide rod 88 on the side away from the reciprocating screw 87. A rectangular hole 812 is opened in the middle of the test bench 3. A bidirectional screw 813 is rotatably connected inside the rectangular hole 812. Both sides of the outer wall of the bidirectional screw 813 are threadedly connected with arc blocks 814. The front end of the bidirectional screw 813 and the end of the reciprocating screw 87 away from the transmission gear 83 are fixedly connected with pulleys 810, and the pulleys 810 on both sides are connected by a connecting belt 811.

[0040] Wherein: the material of the roller 89 is polyethylene film, with pre-cutting lines, the edge of the roller 89 is easy to peel off, the bottom of the roller 89 is set to correspond to the thickness of the semiconductor film, the outer walls of the two are in contact, the rectangular hole 812 and the center line of the vertical rod 4 are located on the same straight line, the two sides of the two-way screw 813 have opposite thread directions, and the inner wall of the arc block 814 is provided with multiple semi-cylinders, and the material is rubber;

[0041] Preferably: with the rotation of the reciprocating screw 87, the roller 89 threadedly connected to its outer wall can move toward the front side of the four-probe tester 1 with the cooperation of the guide rod 88, and slide on the surface of the semiconductor wafer to be tested. Correspondingly, when the semiconductor wafer is tested, the slider 6 is restored to its original position, and the lifting rack 81 moves upward synchronously, thereby driving the transmission gear 83 to rotate in the opposite direction, and then driving the reciprocating screw 87 to synchronously adjust the rotation direction, so that the roller 89 moves toward the rear side of the four-probe tester 1, and slides on the surface of the semiconductor wafer to be tested, so that during the adjustment process, the roller 89 can go back and forth to remove the dust or particles adhered to the outer wall of the semiconductor wafer, so as to keep the outer wall of the semiconductor wafer test clean. To avoid affecting the accuracy of the test data, as the reciprocating screw 87 rotates, the pulley 810 fixedly connected to one end away from the transmission gear 83 rotates, and with the assistance of the connecting belt 811, the pulley 810 on the other side is driven to rotate synchronously, and then the bidirectional screw 813 fixedly connected to the pulley 810 on this side can be driven to rotate inside the rectangular hole 812. At the same time, with the limit cooperation of the rectangular hole 812, the relative distance of the arc block 814 threaded on both sides of the outer wall of the bidirectional screw 813 can be adjusted, and the size of the semiconductor wafer placed on the test bench 3 can be adjusted to clamp and position it, ensuring that the four-probe probe 5 avoids sliding and deviation when contacting the semiconductor wafer for testing, thereby ensuring the stability of the detection process.

[0042] The sleeve isolation and anti-fouling component includes an I-shaped plate 91, which is rotatably connected to the top of the four-probe tester 1, and the bottom of the I-shaped plate 91 is fixedly connected to a receiving plate strip 94, and the inner wall of the receiving plate strip 94 is fixedly connected to an electric telescopic rod 92, and the telescopic rod end of the electric telescopic rod 92 is fixedly connected to a special-shaped block 93, and the special-shaped block 93 is slidably connected to the bottom of the I-shaped plate 91, and the middle part of the I-shaped plate 91 is fixedly connected to a connecting sleeve 95, and the inner wall of the connecting sleeve 95 is slidably connected to a lifting rod 96, and the middle part of the lifting rod 96 close to the I-shaped plate 91 is rotatably connected to a guide pulley 97, which guides The guide pulley 97 is slidably connected to the bottom of the special-shaped block 93, and a reset spring 98 is sleeved on the outer wall of the lifting rod 96. One end of the reset spring 98 is fixedly connected to the lifting rod 96, and the other end of the reset spring 98 is fixedly connected to the connecting sleeve 95. A limiting groove 99 is provided in the middle of one side of the lifting rod 96 close to the guide rod 88, and a limiting rod 910 is fixedly connected to the bottom of the receiving strip 94. The limiting rod 910 is slidably connected to the limiting groove 99. The end of the lifting rod 96 away from the I-shaped plate 91 is fixedly connected to a sheath 911, and the sheath 911 is sleeved on the outside of the four-probe probe 5;

[0043] Wherein: the receiving strip 94 is set to be L-shaped, the bottom of the special-shaped block 93 is set from left to right to horizontal to inclined upward, the movement trajectory of the guide pulley 97 corresponds to the bottom of the special-shaped block 93, the limiting groove 99 and the limiting rod 910 are matched with each other, and the center point of the sheath 911 and the center point of the four-probe probe 5 are located on the same vertical straight line;

[0044] Better: Before preparing for the semiconductor manufacturing test operation, the power switch 2 controls the electric telescopic rod 92 to operate and extend, thereby driving the special-shaped block 93 to slide to the right on the outer wall of the I-shaped plate 91, so that the guide pulley 97 slides from the inclined surface to the horizontal plane from high to low along the bottom of the special-shaped block 93, and then the lifting rod 96 can be moved downward by squeezing the reset spring 98 downward, so that the sheath 911 can be separated from the outer wall of the four-probe probe 5, and the setting of the limit groove 99 and the limit rod 910 can guide the stable movement of the lifting rod 96 and the sheath 911.

[0045] The top of the four-probe tester 1 is located beside the test bench 3 and is provided with an arc-shaped groove 912. A guide ball 913 is fixedly connected to the bottom of the receiving strip 94. The outer wall of the guide ball 913 is slidably connected to the inner wall of the arc-shaped groove 912. A magnetic attraction plate 914 is fixedly connected to the top of the arc-shaped groove 912 away from the test bench 3.

[0046] Wherein: the arc groove 912 is set to be one quarter of the annular groove, and the material of the guide ball 913 is selected from metal iron;

[0047] Better: Since the probes of the four-probe tester 1 establish electrical contact with the object to be tested on a microscopic scale, the probes are usually very small and sharp, which makes them vulnerable to damage. Any excessive force or improper use may cause damage or failure of the probes. Therefore, the installation and removal of the probe protection sleeves need to be more delicate. Through the limit setting of the arc groove 912, the deviation during the movement adjustment is reduced when the metal guide ball 913 and the magnetic suction plate 914 are attracted and moved. The installation and removal design of the probe protection sleeves are consistent with the four-probe tester 1 and the semiconductor wafer resistance measurement. The start and end synchronization of the test operation is relatively more accurate and convenient, so that the sheath 911 can be attached to or separated from the probe more accurately. When the sheath 911 is separated from the outer wall of the four-probe probe 5, it is located directly below it at a distance. At the same time, the power switch 2 controls the magnetic plate 914 to be energized, and the guide ball 913 and the magnetic plate 914 are attracted to each other, and the guide ball 913 slides inside the arc groove 912, thereby driving the whole to rotate ninety degrees counterclockwise and move to the side close to the magnetic plate 914, keeping it standing vertically on the top of the four-probe tester 1.

[0048] The above implementation works as follows:

[0049] The initialization steps are as follows:

[0050] Place the semiconductor wafer to be tested at the top center of the test bench 3, turn on the power switch 2, preheat the four-probe tester 1, prepare the computer and related software, check the test bench 3 and adjust the appropriate current and voltage gears to get ready. At the same time, the power switch 2 controls the electric telescopic rod 92 to operate and extend, so that the special-shaped block 93 can slide to the right on the outer wall of the I-shaped plate 91, so that the guide pulley 97 slides from the inclined surface to the horizontal plane along the bottom of the special-shaped block 93 from high to low, and then the lifting rod 96 can be moved downward by squeezing the reset spring 98 downward, so that the sheath 911 can be separated from the outer wall of the four-probe probe 5. The setting of the limit groove 99 and the limit rod 910 can guide the stable movement of the lifting rod 96 and the sheath 911. After the sheath 911 is separated from the outer wall of the four-probe probe 5, it is located directly below it at a distance. At the same time, the power switch 2 controls the magnetic suction plate 914 to be energized, and the guide ball 913 and the magnetic suction plate 914 are attracted to each other and close to each other. The guide ball 913 slides inside the arc groove 912, thereby driving the whole to rotate ninety degrees counterclockwise and move to the side close to the magnetic suction plate 914, maintaining the state of standing vertically on the top of the four-probe tester 1, which will not affect the subsequent process of testing the resistance data of semiconductor wafers;

[0051] The working steps are as follows:

[0052] like Figure 1 - Figure 4As shown, rotate the paddle button 7 counterclockwise to remove it, and manually adjust the position of the slider 6 by dialing it downward. The lifting rack 81 is connected to the slider 6 through the connecting rod 82, so that it can move synchronously with the slider 6. During the downward movement of the lifting rack 81, the connecting spring 86 inside the groove frame 84 can be pressed downward by the T-shaped plate 85, so that the slider 6 can be buffered and supported during the adjustment process, avoiding damage to the semiconductor wafer directly below due to improper manual operation. After adjusting the four-probe probe 5 to a suitable distance from the semiconductor wafer, the paddle button 7 is screwed into the inside of the slider 6 to lock it in place. At the same time, as the lifting rack 81 moves, it can drive the transmission gear 83 meshing with it to rotate on the rear side of the test bench 3, and further drive the reciprocating screw rod 87 fixedly connected to the transmission gear 83. Rotate above the four-probe tester 1, and with the rotation of the reciprocating screw 87, the roller 89 threadedly connected to its outer wall can be moved to the front side of the four-probe tester 1 with the cooperation of the guide rod 88, and slide on the surface to be tested of the semiconductor wafer. Correspondingly, when the slide block 6 is restored to its original position after the semiconductor wafer is tested, the lifting rack 81 moves upward synchronously, thereby driving the transmission gear 83 to rotate in the opposite direction, and then driving the reciprocating screw 87 to synchronously adjust the rotation direction, so that the roller 89 moves toward the rear side of the four-probe tester 1, and slides on the surface to be tested of the semiconductor wafer, thereby achieving the roller 89 to remove dust or particles adhered to the outer wall of the semiconductor wafer back and forth during the adjustment process, so as to keep the outer wall of the semiconductor wafer test clean and avoid affecting the accuracy of the test data;

[0053] like Figure 6 - Figure 8 and Fig.10 As shown, with the rotation of the reciprocating screw 87, the pulley 810 fixedly connected to one end away from the transmission gear 83 rotates, and with the assistance of the connecting belt 811, the pulley 810 on the other side is driven to rotate synchronously, thereby being able to drive the bidirectional screw 813 fixedly connected to the pulley 810 on this side to rotate inside the rectangular hole 812, and at the same time, under the limit cooperation of the rectangular hole 812, the relative distance of the arc block 814 threadedly connected to the outer wall of the bidirectional screw 813 on both sides can be adjusted, and the size of the semiconductor wafer placed on the test bench 3 can be adjusted to clamp and position it, so as to ensure that the four-probe probe 5 avoids sliding and offset when contacting the semiconductor wafer for testing, thereby ensuring the stability of the detection process;

[0054] like Figure 5 - Fig. 9As shown, finally, after the semiconductor manufacturing test is completed, the power switch 2 is used to control the power off of the magnetic suction plate 914, so that the adsorption of the magnetic suction plate 914 and the guide ball 913 is eliminated, and the inspector can manually turn the I-shaped plate 91 to drive the overall structure to rotate ninety degrees clockwise along the arc groove 912 to maintain a horizontal state. At the same time, the power switch 2 controls the electric telescopic rod 92 to operate and retract, driving the special-shaped block 93 to slide to the left at the bottom of the I-shaped plate 91, and the guide pulley 97 can move a certain distance upward in the vertical direction along the bottom of the special-shaped block 93, and the reset spring 98 moves upward accordingly, so that the lifting rod 96 can drive the sheath 911 to adjust a certain distance upward and be mounted on the outer wall of the four-probe probe 5. The setting of the limit groove 99 and the limit rod 910 can play a guiding and anti-deviating role for the adjustment of the lifting rod 96 and the sheath 911 in the vertical direction, so that the sheath 911 can be accurately docked and mounted on the outside of the four-probe probe 5 to protect it.

[0055] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0056] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A special test device for detecting resistance of micro semiconductor chips, characterized in that: The invention comprises a four-probe tester (1) and a power switch (2), wherein the power switch (2) is mounted on the outer wall of the four-probe tester (1), the top of the four-probe tester (1) is fixedly connected to a test bench (3), the upper surface of the test bench (3) is fixedly connected to a vertical pole (4), a slider (6) is slidably connected to the outer wall of the vertical pole (4), a four-probe probe (5) is inserted and arranged on the outer wall of the four-probe tester (1), one end of the four-probe probe (5) away from the four-probe tester (1) is fixedly connected to the slider (6), a knob (7) is threadedly connected to the middle part of the slider (6), a position adjustment pretreatment component for adjusting the movement stability of the slider (6) is arranged above the four-probe tester (1), and a sleeve isolation anti-fouling component for performing protective adjustment treatment on the four-probe probe (5) is arranged above the four-probe tester (1), wherein: The position adjustment pretreatment component comprises a lifting rack (81), the lifting rack (81) is slidably connected to the outer wall of the test bench (3), the end of the lifting rack (81) away from the four-probe tester (1) is fixedly connected to a connecting rod (82), the end of the connecting rod (82) away from the lifting rack (81) is fixedly connected to the slider (6), the connecting rod (82) is slidably connected to the middle part of the test bench (3), the middle part of the test bench (3) is rotatably connected to a transmission gear (83), the transmission gear (83) and the lifting rack (81) are meshingly connected, the rear sides of the test bench (3) are rotatably connected to groove frames (84), the inner walls of the groove frames (84) on both sides are slidably connected to T-shaped plates (85), and the interiors of the groove frames (84) on both sides are provided with connecting springs (86).

2. A special test device for detecting resistance of micro semiconductor chips according to claim 1, characterized in that: One end of the connecting spring (86) is fixedly connected to the T-shaped plate (85), and the other end of the connecting spring (86) is fixedly connected to the groove frame (84). A reciprocating screw rod (87) is fixedly connected to the middle of the transmission gear (83), and the reciprocating screw rod (87) is rotatably connected to the top of the four-probe tester (1).

3. A special test device for detecting resistance of micro semiconductor chips according to claim 2, characterized in that: The outer wall of the reciprocating screw rod (87) is threadedly connected to a roller (89), and the top of the four-probe tester (1) is fixedly connected to a guide rod (88), the guide rod (88) and the reciprocating screw rod (87) are symmetrically arranged around the center of the vertical rod (4), and the roller (89) is slidably connected to the outer wall of the guide rod (88) on a side away from the reciprocating screw rod (87).

4. A special test device for detecting resistance of micro semiconductor chips according to claim 3, characterized in that: A rectangular hole (812) is provided in the middle of the test bench (3), a bidirectional screw rod (813) is rotatably connected inside the rectangular hole (812), arc blocks (814) are threadedly connected on both sides of the outer wall of the bidirectional screw rod (813), a front end of the bidirectional screw rod (813) and an end of the reciprocating screw rod (87) away from the transmission gear (83) are fixedly connected with pulleys (810), and the pulleys (810) on both sides are connected via a connecting belt (811).

5. A special test device for detecting resistance of micro semiconductor wafers according to claim 4, characterized in that: The sleeve isolation and anti-fouling component comprises an I-shaped plate (91), the I-shaped plate (91) is rotatably connected to the top of the four-probe tester (1), the bottom of the I-shaped plate (91) is fixedly connected to a receiving plate strip (94), the inner wall of the receiving plate strip (94) is fixedly connected to an electric telescopic rod (92), the telescopic rod end of the electric telescopic rod (92) is fixedly connected to a special-shaped block (93), the special-shaped block (93) is slidably connected to the bottom of the I-shaped plate (91), the middle of the I-shaped plate (91) is fixedly connected to a connecting sleeve (95), the inner wall of the connecting sleeve (95) is slidably connected to a lifting rod (96), the lifting rod (96) is rotatably connected to a guide pulley (97) at the middle of one end close to the I-shaped plate (91), and the guide pulley (97) is slidably connected to the bottom of the special-shaped block (93).

6. A special test device for detecting resistance of micro semiconductor wafers according to claim 5, characterized in that: A return spring (98) is sleeved on the outer wall of the lifting rod (96); one end of the return spring (98) is fixedly connected to the lifting rod (96), and the other end of the return spring (98) is fixedly connected to the connecting sleeve (95).

7. A special test device for detecting resistance of micro semiconductor wafers according to claim 6, characterized in that: A limiting groove (99) is provided in the middle of one side of the lifting rod (96) close to the guide rod (88); the bottom of the receiving strip (94) is fixedly connected to a limiting rod (910); the limiting rod (910) is slidably connected to the limiting groove (99); one end of the lifting rod (96) away from the I-shaped plate (91) is fixedly connected to a sheath (911); the sheath (911) is sleeved on the outside of the four-probe probe (5).

8. A special test device for detecting resistance of micro semiconductor wafers according to claim 7, characterized in that: The top of the four-probe tester (1) is located next to the test bench (3) and is provided with an arc groove (912); the bottom of the receiving strip (94) is fixedly connected with a guide ball (913); the outer wall of the guide ball (913) is slidably connected to the inner wall of the arc groove (912); and the top of the arc groove (912) is fixedly connected to a side away from the test bench (3) with a magnetic attraction plate (914).

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