General power-up and control system and method for radio frequency BGA packaging product

Abstract

The invention discloses a general power-up and control system and method for a radio frequency BGA packaging product, and the system comprises an upper computer which is configured to generate a low-frequency control signal and a power supply control signal; the low-frequency parallel port controller is configured to receive a low-frequency control signal output by the upper computer and transmit the low-frequency control signal to a radio frequency performance test clamp for testing a radio frequency BGA packaging product through a universal power-on control line, so that signal control of any path is realized; the array type electromagnetic relay switch is configured to receive a power supply control signal output by the upper computer; and the PXI case is configured to be connected to a power supply, receive a power supply control signal transmitted by the array type electromagnetic relay switch, transmit the power supply control signal to the radio frequency performance test clamp through a universal power-up control line, and realize power-up of any path through on-off control of the array type electromagnetic relay switch. According to the invention, control and power supply unified management of different types of radio frequency BGA packaging products can be realized.

Description

Technical Field

[0001] The present invention relates to the field of microwave and millimeter wave testing technology, and in particular to a universal power-on and control system and method for radio frequency BGA packaging products. Background Art

[0002] With the emergence of BGA (Ball Grid Array) packaging, how to accurately test this non-standard interface product has become a new challenge. The performance test of any microwave product involves power-on, control, RF performance and other parts. Among them, the RF elastic connection test of RF BGA packaged products has been studied more, but the research on its power-on and control has not been reported. At present, when powering on and controlling RF BGA packaged products, the following method is usually used: a low-frequency connector is installed on the BGA product RF performance test fixture, and a one-to-one dedicated power-on control line is made for each product according to the distribution of the control and power-on interfaces in the low-frequency connector, and the unused power-on and control interfaces in the connector are left floating. The other end of the dedicated power-on control line is connected to the host computer and the external power supply to realize product power-on and control.

[0003] However, with the widespread application of BGA packaging, the types of RF BGA packaging products have become more diverse, and the position distribution, quantity, and voltage parameter values ​​of power-on and control in the low-frequency interface are different. Each product needs to make a dedicated power-on control line. Every time a test product is changed, the power-on control line needs to be replaced, and the test fixture, power supply, and host computer need to be reconnected and reconnected, and the test instrument parameters need to be manually set. Hundreds of dedicated power-on wires are difficult to manage and costly; frequent disconnection and wiring are time-consuming, labor-intensive, inefficient, and prone to errors; manual instrument parameter setting is prone to errors and inefficient. Summary of the invention

[0004] In view of the problems of poor universality, high cost, low efficiency, easy errors, etc. encountered in the power-on and control of various types of RF BGA packaged products, the present invention proposes a universal power-on and control system and method for RF BGA packaged products, which can realize the control and unified power supply management of different types of RF BGA packaged products, and has the advantages of universality, high efficiency, low cost, high compatibility, etc.

[0005] The technical solution adopted by the present invention is as follows:

[0006] A universal power-on and control system for radio frequency BGA packaging products, comprising:

[0007] The host computer is configured to generate a low-frequency control signal and a power control signal;

[0008] The low-frequency parallel port controller is configured to receive the low-frequency control signal output by the host computer and transmit it to the RF performance test fixture for testing RF BGA packaged products through a universal power-on control line to realize signal control of any path;

[0009] The array electromagnetic relay switch is configured to receive a power control signal output by a host computer;

[0010] The PXI chassis is configured to be connected to a power supply and receive a power control signal transmitted by an array electromagnetic relay switch, and transmit the signal to a radio frequency performance test fixture through a universal power-on control line, so as to realize power-on of any path through the on-off control of the array electromagnetic relay switch.

[0011] Furthermore, the universal power-on control line is connected to the low-frequency connector of the radio frequency performance test fixture, thereby achieving full coverage connection of the power supply and control interface in the low-frequency connector.

[0012] Furthermore, the array electromagnetic relay switch realizes power supply at any position in the power supply area by controlling the on or off of any power supply path.

[0013] Furthermore, the array type electromagnetic relay switch realizes program-controlled switching of different power supply paths through a multi-path transmission selection device that controls on and off the voltage.

[0014] Furthermore, when the RF BGA packaged product is switched, there is no need to replace the universal power-on control line. The power-on control path is selected to be turned on according to the power-on parameter value, quantity and interface position, as well as the control parameter value, quantity and interface position, so as to realize product control power-on.

[0015] A universal power-on and control method for radio frequency BGA packaged products, comprising:

[0016] Determine the low-frequency control area and power area of ​​RF BGA packaged products, as well as the control and power core wire distribution of the low-frequency connector on the RF performance test fixture;

[0017] Make a universal power-on control line to lead out all the control interfaces of the RF BGA packaged products and connect them to the low-frequency parallel port controller; and lead out all the power interfaces of the RF BGA packaged products and connect them to the power supply through an array electromagnetic relay switch;

[0018] Determine the matrix quantity of the array electromagnetic relay switch, and connect it to the host computer through the chassis control line to enable the array electromagnetic relay switch to receive the power control signal;

[0019] The host computer sends power control signals through the power control software to achieve power control and power on; the host computer sends low-frequency control signals through the test software, and realizes the high and low level control combination of the low-frequency control interface through the low-frequency parallel port controller and the universal power-on control line.

[0020] Furthermore, the universal power-on control line is connected to the low-frequency connector of the radio frequency performance test fixture, thereby achieving full coverage connection of the power supply and control interface in the low-frequency connector.

[0021] Furthermore, the array electromagnetic relay switch realizes power supply at any position in the power supply area by controlling the on or off of any power supply path.

[0022] Furthermore, the array type electromagnetic relay switch realizes program-controlled switching of different power supply paths through a multi-path transmission selection device that controls on and off the voltage.

[0023] Furthermore, when the RF BGA packaged product is switched, there is no need to replace the universal power-on control line. The power-on control path is selected to be turned on according to the power-on parameter value, quantity and interface position, as well as the control parameter value, quantity and interface position, so as to realize product control power-on.

[0024] The beneficial effects of the present invention are:

[0025] 1) The power-on and control area interfaces of RF BGA packaged products are fully covered and led out. One set of universal power-on control lines replaces hundreds of dedicated power-on control lines, eliminating the need for frequent line changes, high efficiency, low cost, and simple management;

[0026] 2) Control and power-on to achieve arbitrary path switching, which is universal;

[0027] 3) The wiring interface between the host computer and the power supply does not require frequent disconnection and wiring. The instrument parameters are automatically switched and set. The control and power-on of different products are automatically switched, which is safe, reliable and efficient.

[0028] 4) The low-frequency parallel port controller realizes the connection of any control signal, and the data is transmitted synchronously with fast transmission speed;

[0029] 5) The array electromagnetic relay switch controls the on or off of any power supply path, realizing power supply at any location in the power supply area, which is safe and reliable. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 A block diagram of a general power-on and control system for RF BGA packaging products;

[0031] Figure 2 This is a schematic diagram of the distribution of the universal power-on and control standard interfaces for typical RF BGA package products;

[0032] Figure 3 This is a schematic diagram of the low-frequency connector of the RF performance test fixture;

[0033] Figure 4 This is the schematic diagram of the array electromagnetic relay switch. DETAILED DESCRIPTION

[0034] In order to have a clearer understanding of the technical features, purposes and effects of the present invention, the specific implementation methods of the present invention are now described. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention, that is, the embodiments described are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present invention.

[0035] Example 1

[0036] like Figure 1 As shown, this embodiment provides a universal power-on and control system for RF BGA packaged products, including a host computer, a low-frequency parallel port controller, an array electromagnetic relay switch, and a PXI chassis. The host computer is configured to generate a low-frequency control signal and a power control signal; the low-frequency parallel port controller is configured to receive the low-frequency control signal output by the host computer, and transmit it to the RF performance test fixture for testing RF BGA packaged products through a universal power-on control line, so as to realize signal control of any path; the array electromagnetic relay switch is configured to receive the power control signal output by the host computer; the PXI chassis is configured to access the power supply and receive the power control signal transmitted by the array electromagnetic relay switch, and transmit it to the RF performance test fixture through the universal power-on control line, so as to realize power-on of any path through the on-off control of the array electromagnetic relay switch.

[0037] In this embodiment, the low-frequency parallel port controller can realize the connection of any control signal and achieve rapid synchronous data transmission; a universal power-on control line is used to lead out all low-frequency interface control and power-on interfaces, making control and power-on universal.

[0038] Preferably, the universal power-on control line is connected to the low-frequency connector of the radio frequency performance test fixture to achieve full coverage connection of the power supply and control interface in the low-frequency connector.

[0039] Preferably, the array electromagnetic relay switch realizes power supply at any position in the power supply area by controlling the on or off of any power supply path.

[0040] Preferably, the array-type electromagnetic relay switch realizes program-controlled switching of different power supply paths through a multi-path transmission selection device that controls on and off the voltage.

[0041] Preferably, when the RF BGA packaged product is switched, there is no need to replace the universal power-on control line. The power-on control path is selected according to the power-on parameter value, quantity and interface position, as well as the control parameter value, quantity and interface position to achieve product control power-on.

[0042] Example 2

[0043] This embodiment is based on embodiment 1:

[0044] This embodiment provides a universal power-on and control method for a radio frequency BGA packaged product, including:

[0045] Determine the low-frequency control area and power area of ​​RF BGA packaged products, as well as the control and power core wire distribution of the low-frequency connector on the RF performance test fixture;

[0046] Make a universal power-on control line to lead out all the control interfaces of the RF BGA packaged products and connect them to the low-frequency parallel port controller; and lead out all the power interfaces of the RF BGA packaged products and connect them to the power supply through an array electromagnetic relay switch;

[0047] Determine the matrix quantity of the array electromagnetic relay switch, and connect it to the host computer through the chassis control line to enable the array electromagnetic relay switch to receive the power control signal;

[0048] The host computer sends power control signals through the power control software to achieve power control and power on; the host computer sends low-frequency control signals through the test software, and realizes the high and low level control combination of the low-frequency control interface through the low-frequency parallel port controller and the universal power-on control line.

[0049] Specifically, the general power-on and control method of this embodiment can be implemented by the following steps:

[0050] 1) If Figure 2 As shown, the standards for determining the low-frequency control area and power supply area of ​​RF BGA package products, there are 144 groups of low-frequency control (expandable) and 72 groups of power-on (expandable);

[0051] 2) If Figure 3 As shown, determine the distribution of control and power core wires on the 37-core low-frequency connector (part) on the RF performance test fixture of the RF BGA packaged product;

[0052] 3) Make a universal power-on control line to ensure that all 144 control interfaces are led out and connected to the low-frequency parallel port controller, and ensure that all 72 power interfaces are led out and connected to the power supply through an array electromagnetic relay switch;

[0053] 4) The number of array electromagnetic relay switch matrices is 11×10 (expandable), 11 is the total number of power supply interfaces (expandable), and 10 is the number of external power supplies (expandable);

[0054] 5) Place the array electromagnetic relay switch into the PXI chassis and connect it to the host computer through the chassis control line to enable the array electromagnetic relay switch to receive control commands;

[0055] 6) Assume that RF BGA package product 1 requires the 1st, 2nd and 3rd low frequency control interfaces, and the 27th (+V1), 28th (+V2) and 29th (-V3) power control interfaces. The host computer selects external power supply 1, external power supply 2 and external power supply 3 from the 10 external power supplies according to the power control software, and sends a power control command through the host computer to turn on the external power supply and set +V1 / +V2 / -V3 respectively. Figure 4 The middle array electromagnetic relay chooses to open the switches 27 → external power supply 1, 28 → external power supply 2, 29 → external power supply 3 to realize power control and power on; the upper computer sends low-frequency control commands through the test software, and realizes the control combination of high and low levels of the 1st, 2nd and 3rd low-frequency control interfaces through the low-frequency parallel port controller and the universal power-on control line (direct connection).

[0056] Similarly, when switching to another RF BGA packaged product, there is no need to replace the power-on control line. By selecting the power-on control path to be turned on according to the power-on parameter value, quantity, interface position, and control quantity and interface position, the product control power-on can be successfully achieved.

[0057] It should be noted that, in this embodiment, the number of cores of the low-frequency connector, the type of low-frequency parallel port controller, the type of switch, the number of matrix switches, etc. can all be flexibly changed according to actual needs.

[0058] It should be noted that, for the aforementioned method embodiments, for the sake of simplicity of description, they are expressed as a series of action combinations, but those skilled in the art should be aware that the present application is not limited by the order of the actions described, because according to the present application, certain steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily required by the present application.

Claims

1. A universal power-on and control system for RF BGA packaging products. It is characterized in that include: The host computer is configured to generate a low-frequency control signal and a power control signal; The low-frequency parallel port controller is configured to receive the low-frequency control signal output by the host computer and transmit it to the RF performance test fixture for testing RF BGA packaged products through a universal power-on control line to realize signal control of any path; The array electromagnetic relay switch is configured to receive a power control signal output by a host computer; The PXI chassis is configured to be connected to a power supply and receive a power control signal transmitted by an array electromagnetic relay switch, and transmit the signal to a radio frequency performance test fixture through a universal power-on control line, so as to realize power-on of any path through the on-off control of the array electromagnetic relay switch.

2. A universal power-on and control system for a radio frequency BGA packaged product according to claim 1, It is characterized in that The universal power-on control line is connected to the low-frequency connector of the radio frequency performance test fixture, thereby achieving full coverage connection between the power supply and the control interface in the low-frequency connector.

3. A universal power-on and control system for a radio frequency BGA packaged product according to claim 1, It is characterized in that The array type electromagnetic relay switch realizes power supply at any position in the power supply area by controlling the conduction or disconnection of any power supply path.

4. A universal power-on and control system for a radio frequency BGA packaged product according to claim 1, It is characterized in that The array type electromagnetic relay switch realizes program-controlled switching of different power supply paths through a multi-path transmission selection device that controls on and off the voltage.

5. A universal power-on and control system for a radio frequency BGA packaged product according to claim 1, It is characterized in that When switching RF BGA packaged products, there is no need to replace the universal power-on control line. The power-on control path is selected according to the power-on parameter value, quantity and interface position, as well as the control parameter value, quantity and interface position to achieve product control power-on.

6. A universal power-on and control method for RF BGA packaging products, It is characterized in that include: Determine the low-frequency control area and power area of ​​RF BGA packaged products, as well as the control and power core wire distribution of the low-frequency connector on the RF performance test fixture; Make a universal power-on control line to lead out all the control interfaces of the RF BGA packaged products and connect them to the low-frequency parallel port controller; and lead out all the power interfaces of the RF BGA packaged products and connect them to the power supply through an array electromagnetic relay switch; Determine the matrix quantity of the array electromagnetic relay switch, and connect it to the host computer through the chassis control line to enable the array electromagnetic relay switch to receive the power control signal; The host computer sends power control signals through the power control software to achieve power control and power on; the host computer sends low-frequency control signals through the test software, and realizes the high and low level control combination of the low-frequency control interface through the low-frequency parallel port controller and the universal power-on control line.

7. A universal power-on and control method for a radio frequency BGA packaged product according to claim 6, It is characterized in that The universal power-on control line is connected to the low-frequency connector of the radio frequency performance test fixture, thereby achieving full coverage connection between the power supply and the control interface in the low-frequency connector.

8. A universal power-on and control method for a radio frequency BGA packaged product according to claim 6, It is characterized in that The array type electromagnetic relay switch realizes power supply at any position in the power supply area by controlling the conduction or disconnection of any power supply path.

9. A universal power-on and control method for a radio frequency BGA packaged product according to claim 6, It is characterized in that The array type electromagnetic relay switch realizes program-controlled switching of different power supply paths through a multi-path transmission selection device that controls on and off the voltage.

10. A universal power-on and control method for a radio frequency BGA packaged product according to claim 6, It is characterized in that When switching RF BGA packaged products, there is no need to replace the universal power-on control line. The power-on control path is selected according to the power-on parameter value, quantity and interface position, as well as the control parameter value, quantity and interface position to achieve product control power-on.

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