Method for testing reliability of electronic component in cooling liquid

Abstract

The invention relates to the technical field of electronic component cooling, and discloses a reliability test method and system for an electronic component in a cooling liquid, and the method comprises the steps: configuring the cooling liquid of the electronic component, analyzing the compatibility relation between the cooling liquid and the electronic component, and deploying a test device for the electronic component and the cooling liquid. Setting execution conditions of the test device; analyzing the thermal stress of the temperature gradient on the surface of the electronic component, monitoring the electrical performance parameters of the gathering point under the temperature gradient in real time, analyzing the performance change of the electrical performance parameters under the thermal stress, and performing trend analysis on the performance change; the performance degradation degree of the electronic component under the thermal stress is evaluated, the failure mode of the electronic component under the thermal stress is identified, the risk level of the failure mode is evaluated, and the service life of the electronic component in the cooling liquid is evaluated; and the reliability of the electronic component in the cooling liquid is tested. According to the invention, the stability of the reliability experiment of the electronic component in the cooling liquid can be improved.

Description

Technical Field

[0001] The invention relates to the technical field of electronic component cooling, and in particular to a reliability test method and system for electronic components in a cooling liquid. Background Art

[0002] The reliability of electronic components in coolant refers to the ability of electronic components to continue to work stably and maintain their performance indicators in a liquid cooling environment without failure or performance degradation. By evaluating the reliability of electronic components in coolant, the thermal stress that the components are subjected to under liquid cooling conditions can be checked to ensure that they can remain stable during temperature changes. With the development of technologies such as big data and cloud computing, the heat dissipation requirements of electronic components are becoming increasingly higher.

[0003] Existing reliability tests for electronic components in coolant mainly use a thermal shock test method. In this method, the coolant contacts the electronic components through a heat exchanger to achieve efficient and rapid temperature changes. However, rapid temperature changes may cause thermal stress to be concentrated in specific parts of the electronic components, such as the internal solder joints of the electronic components, causing damage to the structure of the electronic components, and thus leading to failure of the reliability test of the electronic components in the coolant. Summary of the invention

[0004] The present invention provides a reliability test method and system for electronic components in a coolant, the main purpose of which is to improve the stability of the reliability experiment of the electronic components in the coolant.

[0005] To achieve the above object, the present invention provides a reliability test method for electronic components in a coolant, comprising:

[0006] Performing an initial electrical performance test on the electronic components to be tested to obtain initial electrical performance data, configuring a coolant for the electronic components, analyzing the compatibility relationship between the coolant and the electronic components, and deploying a test device for the electronic components and the coolant based on the compatibility relationship, and setting execution conditions for the test device after the electronic components and the coolant are placed in the test device;

[0007] Under the execution conditions, a temperature gradient of the coolant is set, the thermal stress of the temperature gradient on the surface of the electronic component is analyzed, and the gathering point of the thermal stress on the surface of the electronic component is identified, and the electrical performance parameters of the gathering point under the temperature gradient are monitored in real time, and based on the initial electrical performance data, the performance change of the electrical performance parameters under the thermal stress is analyzed, and the trend analysis of the performance change is performed to obtain the trend analysis result;

[0008] Based on the trend analysis result, evaluating the degree of performance degradation of the electronic components under the thermal stress, and based on the degree of performance degradation, identifying the failure mode of the electronic components under the thermal stress, evaluating the risk level of the failure mode, and based on the degree of performance degradation and the risk level, evaluating the service life of the electronic components in the coolant;

[0009] Based on the trend analysis results and the service life, the reliability of the electronic components in the coolant is tested.

[0010] Optionally, performing an initial electrical performance test on the electronic components to be tested to obtain initial electrical performance data includes:

[0011] Analyzing the attribute items of the electronic components;

[0012] Based on the attribute items, identifying the inspected parameters of the electronic components, and setting the inspection equipment of the inspected parameters;

[0013] Based on the detection equipment, an initial electrical performance test is performed on the electronic components to be cooled to obtain initial electrical performance data.

[0014] Optionally, the analyzing the compatibility relationship between the coolant and the electronic components includes:

[0015] Performing immersion compatibility treatment on the electronic components and the coolant to obtain an immersion compatibility result;

[0016] Detecting the surface state of the electronic component under the immersion compatibility result, and evaluating the abnormal effect of the coolant on the surface state;

[0017] Analyzing the rheological factor of the coolant between the electronic components and evaluating the effect of the rheological factor on the heat dissipation of the electronic components;

[0018] Based on the abnormal effect and the heat dissipation influence, the compatibility relationship between the coolant and the electronic components is analyzed.

[0019] Optionally, analyzing the thermal stress of the temperature gradient on the surface of the electronic component includes:

[0020] Collecting temperature gradient data of the electronic components and extracting temperature distribution in the temperature gradient data;

[0021] Calculating the thermal expansion of the electronic component under the temperature gradient;

[0022] Analyzing thermal deformation of the electronic component based on the temperature distribution and the thermal expansion;

[0023] Based on the thermal deformation, the thermal stress of the temperature gradient on the surface of the electronic component is analyzed.

[0024] Optionally, the calculation of the thermal expansion of the electronic component under the temperature gradient can be implemented using the following formula:

[0025]

[0026] Wherein, ΔL represents the thermal expansion of the electronic components under the temperature gradient, n represents the number of segments of the electronic components under different temperature gradients, and L 0i represents the initial length of the i-th section of the electronic component under the initial temperature gradient, A i is the thermal expansion coefficient of the ith section of the electronic component, t i represents the final temperature of the i-th section of the electronic component, t i-1 Indicates the initial temperature of the i-1th segment of the electronic component.

[0027] Optionally, analyzing the performance change of the electrical performance parameter under the thermal stress based on the initial electrical performance data includes:

[0028] Based on the initial electrical performance data, setting a standard threshold value of the electrical performance parameter under the thermal stress;

[0029] Constructing a trend model of the electrical performance parameter under the thermal stress, and importing the standard threshold value after the trend model;

[0030] Based on the trend model, after comparing the standard threshold with the deviation data of the electrical performance parameter, the deviation rate of the deviation data is calculated, and according to the deviation rate, the performance change of the electrical performance parameter under the thermal stress is analyzed.

[0031] Optionally, the trend model construction of the electrical performance parameter under the thermal stress can be obtained through a linear trend model, and the deviation rate calculation of the deviation data can be implemented using the following formula:

[0032]

[0033] Among them, R represents the deviation rate corresponding to the electrical performance parameters, A i represents the measured value of the i-th electrical performance parameter among the electrical performance parameters corresponding to the deviation data, S represents the standard threshold value of the electrical performance parameter corresponding to the deviation data, and n represents the number of electrical performance parameters corresponding to the deviation data.

[0034] Optionally, the evaluating, based on the trend analysis result, the degree of performance degradation of the electronic component under the thermal stress includes:

[0035] Simulating the effect of temperature changes on the electronic components in the coolant;

[0036] Collecting performance data of the electronic components under the effect simulation, and performing time series analysis on the performance data to obtain time series analysis results;

[0037] Based on the performance parameters under the time series analysis results, the degree of performance degradation of the electronic components under the thermal stress is analyzed.

[0038] Optionally, evaluating the risk level of the failure mode includes:

[0039] Analyze the performance risk corresponding to the failure mode; evaluate the probability of occurrence of the failure mode;

[0040] Performing a detectability assessment on the failure mode to obtain a detectability assessment conclusion;

[0041] Calculating a risk priority number of the failure mode according to the performance risk, the occurrence probability and the detectability assessment conclusion;

[0042] Based on the risk priority number, a risk level of the failure mode is evaluated.

[0043] In order to solve the above problems, the present invention also provides a reliability test system for electronic components in a coolant, the system comprising:

[0044] An execution condition setting module is used to perform an initial electrical performance test on the electronic components to be tested, obtain initial electrical performance data, configure a coolant for the electronic components, analyze the compatibility relationship between the coolant and the electronic components, and based on the compatibility relationship, deploy a test device for the electronic components and the coolant, and after the electronic components and the coolant are placed in the test device, set the execution conditions of the test device;

[0045] A trend analysis module, used to set the temperature gradient of the coolant under the execution condition, analyze the thermal stress of the temperature gradient on the surface of the electronic component, identify the gathering point of the thermal stress on the surface of the electronic component, monitor the electrical performance parameters of the gathering point under the temperature gradient in real time, analyze the performance change of the electrical performance parameters under the thermal stress based on the initial electrical performance data, perform trend analysis on the performance change, and obtain trend analysis results;

[0046] A service life evaluation module, used to evaluate the performance degradation degree of the electronic components under the thermal stress based on the trend analysis result, and to identify the failure mode of the electronic components under the thermal stress based on the performance degradation degree, evaluate the risk level of the failure mode, and evaluate the service life of the electronic components in the coolant based on the performance degradation degree and the risk level;

[0047] The reliability experiment module is used to test the reliability of the electronic components in the coolant based on the trend analysis results and the service life.

[0048] The embodiment of the present invention performs an initial electrical performance test on the electronic components to be tested to obtain initial electrical performance data, which can be used to compare performance changes during the test and analyze the performance degradation of the electronic components under different conditions. Optionally, the embodiment of the present invention sets the environmental parameters of the cooling device after the electronic components and the coolant are placed in the cooling device to test the long-term stability of the electronic components under various environments. The embodiment of the present invention sets the temperature gradient of the coolant under the execution conditions to evaluate the thermal stress distribution of the electronic components at different temperatures. The embodiment of the present invention analyzes the thermal stress of the temperature gradient on the surface of the electronic components to timely detect overheating of the electronic components and avoid sudden shutdown or damage of the equipment. The embodiment of the present invention monitors the electrical performance parameters of the gathering point under the temperature gradient in real time to understand the performance of the electronic components at different temperatures, which helps to optimize the design and ensure the best performance within the operating temperature range. Finally, the embodiment of the present invention tests the reliability of the electronic components in the coolant based on the trend analysis results and the service life, which can confirm the performance stability of the electronic components when working in the coolant for a long time, which helps to identify and prioritize high-risk failure modes and reduce the potential recall risk and brand reputation loss of the product in the market. Therefore, the present invention can improve the stability of reliability experiments of electronic components in coolant. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] Figure 1 A schematic flow chart of a reliability test method for electronic components in a coolant provided by an embodiment of the present invention;

[0050] Figure 2 A functional module diagram of a reliability test system for electronic components in a coolant provided by an embodiment of the present invention;

[0051] Figure 3 A schematic diagram of the structure of an electronic device of a reliability test system for electronic components in a coolant provided by an embodiment of the present invention;

[0052] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0053] It should be understood that the specific embodiments described herein are only used to explain the present invention, and are not used to limit the present invention.

[0054] The embodiment of the present application provides a reliability test method for electronic components in coolant. The execution subject of the reliability test method for electronic components in coolant includes but is not limited to at least one of the electronic devices such as a server, a terminal, etc. that can be configured to execute the method provided by the embodiment of the present application. In other words, the reliability test method for electronic components in coolant can be executed by software or hardware installed in a terminal device or a server device, and the software can be a blockchain platform. The server includes but is not limited to: a single server, a server cluster, a cloud server or a cloud server cluster, etc. The server can be an independent server, or it can be a cloud server that provides cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communications, middleware services, domain name services, security services, content delivery networks (Content Delivery Network, CDN), and basic cloud computing services such as big data and artificial intelligence platforms.

[0055] Reference Figure 1 FIG. 1 is a flow chart of a reliability test method for electronic components in a coolant provided by an embodiment of the present invention. In this embodiment, the reliability test method for electronic components in a coolant includes:

[0056] S1. Perform an initial electrical performance test on the electronic components to be tested to obtain initial electrical performance data, configure a coolant for the electronic components, analyze the compatibility relationship between the coolant and the electronic components, and based on the compatibility relationship, deploy a test device for the electronic components and the coolant. After the electronic components and the coolant are placed in the test device, set the execution conditions of the test device.

[0057] The embodiment of the present invention performs an initial electrical performance test on the electronic components to be tested to obtain initial electrical performance data, which can be used to compare performance changes during the test and analyze the performance degradation of the electronic components under different conditions. The electronic components refer to physical components used to control current or voltage and perform specific functions in electronic circuits, such as diodes and resistors. The initial electrical performance data refers to various electrical parameters and characteristic index data obtained by testing the components before the test.

[0058] As an embodiment of the present invention, the initial electrical performance test is performed on the electronic components to be tested to obtain initial electrical performance data, including:

[0059] Analyzing the attribute items of the electronic components;

[0060] Based on the attribute items, identifying the inspected parameters of the electronic components, and setting the inspection equipment of the inspected parameters;

[0061] Based on the detection equipment, an initial electrical performance test is performed on the electronic components to be cooled to obtain initial electrical performance data.

[0062] Among them, the attribute item refers to the characteristic category of the electronic component, the tested parameter refers to the characteristic parameter of the electronic component that needs to be tested, and the detection equipment refers to the equipment for detecting the attribute item of the electronic component, such as an inductor and capacitor meter.

[0063] Optionally, the attribute item analysis of the electronic component may be implemented by using an online database, and the identification of the inspected parameters of the electronic component may be obtained by testing the electrical performance requirements of the electronic component.

[0064] Furthermore, the embodiments of the present invention can reduce the heat emitted by the electronic components and extend the service life of the electronic components by configuring the coolant for the electronic components. The coolant refers to a liquid medium used to cool and control the heat generated by electronic equipment during operation.

[0065] Optionally, the coolant for the electronic components can be obtained from industrial chemicals, such as fluorinated liquid.

[0066] Furthermore, the embodiment of the present invention can protect the electronic components from chemical corrosion by analyzing the compatibility relationship between the coolant and the electronic components. The compatibility relationship refers to the compatibility relationship between the coolant and the electronic components in terms of physical and chemical properties, such as chemical stability and conductivity.

[0067] As an embodiment of the present invention, the analyzing the compatibility relationship between the coolant and the electronic components includes:

[0068] Performing immersion compatibility treatment on the electronic components and the coolant to obtain an immersion compatibility result;

[0069] Detecting the surface state of the electronic component under the immersion compatibility result, and evaluating the abnormal effect of the coolant on the surface state;

[0070] Analyzing the rheological factor of the coolant between the electronic components and evaluating the effect of the rheological factor on the heat dissipation of the electronic components;

[0071] Based on the abnormal effect and the heat dissipation influence, the compatibility relationship between the coolant and the electronic components is analyzed.

[0072] Among them, the immersion compatibility result refers to the result produced after immersing the electronic components in the coolant for compatibility, the surface state refers to the surface change state of the electronic components after immersion, the abnormal effect refers to the effect of the electronic components deviating from the expected state when immersed in the coolant, the rheological factor refers to the factor affecting the fluidity of the coolant, and the heat dissipation effect refers to the effect of the rheological factor on the ability of the coolant to transfer heat between the electronic components.

[0073] Optionally, the surface state detection of the electronic components under the immersion compatibility results can be obtained by microscopic equipment, such as a microscope, the evaluation of the abnormal effect of the coolant on the surface state can be achieved by chemical analysis methods, such as wet chemical testing, and the evaluation of the effect of the rheological factor on the heat dissipation of the electronic components can be determined by rheometer measurement.

[0074] Furthermore, the embodiment of the present invention can provide a closed and controllable environment to study the interaction between the coolant and the electronic components by deploying the test device of the electronic components and the coolant based on the compatibility relationship, and the test device refers to equipment used to perform specific tests or experiments.

[0075] Optionally, based on the compatibility relationship, the test device deployment of the electronic components and the coolant can be obtained through an immersion cooling test device, such as an immersion cooling cabinet.

[0076] The embodiment of the present invention can test the long-term stability of electronic components in various environments by setting the environmental parameters of the cooling device after the electronic components and the coolant are placed in the cooling device. The environmental parameters refer to external condition parameters that affect the normal operation and performance of the electronic components, such as temperature and humidity parameters.

[0077] Optionally, after the electronic components and the coolant are placed in the cooling device, the environmental parameter settings of the cooling device can be obtained by controlling the cooling device according to test requirements.

[0078] S2. Under the execution conditions, set the temperature gradient of the coolant, analyze the thermal stress of the temperature gradient on the surface of the electronic component, identify the gathering points of the thermal stress on the surface of the electronic component, monitor the electrical performance parameters of the gathering points under the temperature gradient in real time, analyze the performance changes of the electrical performance parameters under the thermal stress based on the initial electrical performance data, perform trend analysis on the performance changes, and obtain trend analysis results.

[0079] The embodiment of the present invention can evaluate the thermal stress distribution of electronic components at different temperatures by setting the temperature gradient of the coolant under the execution conditions, wherein the temperature gradient refers to the amount of temperature change at different levels on the surface of the electronic components.

[0080] Optionally, under the execution condition, the temperature gradient setting of the coolant can be obtained by a temperature sensor.

[0081] Furthermore, the embodiments of the present invention can timely detect overheating of electronic components by analyzing the thermal stress caused by the temperature gradient on the surface of the electronic components, thereby avoiding sudden shutdown or damage of the equipment. The thermal stress refers to the thermal stress caused by the temperature gradient that may cause deformation or damage to the electronic components.

[0082] As an embodiment of the present invention, the analyzing the thermal stress of the temperature gradient on the surface of the electronic component includes:

[0083] Collecting temperature gradient data of the electronic components and extracting temperature distribution in the temperature gradient data;

[0084] Calculating the thermal expansion of the electronic component under the temperature gradient;

[0085] Analyzing thermal deformation of the electronic component based on the temperature distribution and the thermal expansion;

[0086] Based on the thermal deformation, the thermal stress of the temperature gradient on the surface of the electronic component is analyzed.

[0087] Among them, the temperature gradient data refers to the temperature change data measured at different positions on the electronic components, the temperature distribution refers to the concentrated temperature distribution at different positions on the electronic components, the thermal expansion refers to the amount by which the size (usually length, area or volume) of the electronic components increases as the temperature rises when the electronic components are heated, and the thermal deformation refers to the change in the physical shape or size of the electronic component materials due to temperature changes.

[0088] Optionally, the calculation of the thermal expansion of the electronic component under the temperature gradient can be implemented using the following formula:

[0089]

[0090] Wherein, ΔL represents the thermal expansion of the electronic components under the temperature gradient, n represents the number of segments of the electronic components under different temperature gradients, and L 0i represents the initial length of the i-th section of the electronic component under the initial temperature gradient, A i is the thermal expansion coefficient of the ith section of the electronic component, t irepresents the final temperature of the i-th section of the electronic component, t i-1 Indicates the initial temperature of the i-1th segment of the electronic component.

[0091] Optionally, based on the temperature distribution data and the thermal expansion amount, the thermal deformation analysis of the electronic component can be implemented using finite element analysis software.

[0092] Furthermore, the embodiments of the present invention can predict potential failure points on the surface of electronic components by identifying the accumulation points of the thermal stress on the surface of the electronic components, thereby preventing the components from failing due to overheating or thermal fatigue. The accumulation points refer to high stress areas formed by thermal stress on the surface or inside of the electronic components.

[0093] Optionally, the identification of the accumulation points of the thermal stress on the surface of the electronic component can be obtained through thermal imaging analysis.

[0094] Furthermore, the embodiments of the present invention can understand the performance of electronic components at different temperatures by real-time monitoring of the electrical performance parameters of the aggregation point under the temperature gradient, which helps to optimize the design and ensure the best performance within the operating temperature range. The electrical performance parameters refer to quantities that measure the electrical characteristics of electronic components under specific working conditions.

[0095] Optionally, the real-time monitoring of the electrical performance parameters of the gathering point under the temperature gradient can be achieved by using high-precision electrical performance measuring equipment, such as a multimeter and an oscilloscope.

[0096] Furthermore, the embodiments of the present invention can predict the reliability of electronic components and identify performance degradation or failure modes of electronic components that may be caused by thermal stress by analyzing the performance changes of the electrical performance parameters under the thermal stress based on the initial electrical performance data. The performance changes refer to the dynamic changes of the electrical performance parameters of the electronic components when they are affected by thermal stress.

[0097] As an embodiment of the present invention, analyzing the performance change of the electrical performance parameter under the thermal stress based on the initial electrical performance data includes:

[0098] Based on the initial electrical performance data, setting a standard threshold value of the electrical performance parameter under the thermal stress;

[0099] Construct a trend model of the electrical performance parameters under the thermal stress and import the standard threshold value In the trend After the potential model;

[0100] Based on the trend model, after comparing the standard threshold with the deviation data of the electrical performance parameter, the deviation rate of the deviation data is calculated, and according to the deviation rate, the performance change of the electrical performance parameter under the thermal stress is analyzed.

[0101] Among them, the standard threshold refers to the preset performance standard used to evaluate whether the components meet the design and safety requirements, the trend model refers to the mathematical model that describes the change of electrical performance parameters with thermal stress, the deviation data refers to the difference data between the actual measurement value and the standard threshold, and the deviation rate refers to the ratio of the difference between the actual measurement value and the standard threshold.

[0102] Optionally, the trend model construction of the electrical performance parameter under the thermal stress can be obtained through a linear trend model, and the deviation rate calculation of the deviation data can be implemented using the following formula:

[0103]

[0104] Among them, R represents the deviation rate corresponding to the electrical performance parameters, A i represents the measured value of the i-th electrical performance parameter among the electrical performance parameters corresponding to the deviation data, S represents the standard threshold value of the electrical performance parameter corresponding to the deviation data, and n represents the number of electrical performance parameters corresponding to the deviation data.

[0105] Furthermore, the embodiment of the present invention performs trend analysis on the performance changes to obtain trend analysis results, thereby predicting potential failure points and taking preventive measures in advance to avoid sudden failure of equipment. The trend analysis results refer to the overall trend results showing the changes in electrical performance parameters with temperature.

[0106] Optionally, the trend analysis of the performance change can be obtained by trend line fitting, such as linear trend and periodic trend.

[0107] S3. Based on the trend analysis results, the degree of performance degradation of the electronic components under the thermal stress is evaluated, and based on the degree of performance degradation, the failure mode of the electronic components under the thermal stress is identified, and the risk level of the failure mode is evaluated; based on the degree of performance degradation and the risk level, the service life of the electronic components in the coolant is evaluated.

[0108] The embodiment of the present invention can predict the reliability of electronic components under long-term use or in high-temperature environments by evaluating the degree of performance degradation of the electronic components under the thermal stress based on the trend analysis results, which is helpful to predict the service life of electronic components. The degree of performance degradation refers to the degree of reduction of the electrical performance parameters of the electronic components relative to the initial state or standard performance after being affected by thermal stress or other environmental factors.

[0109] As an embodiment of the present invention, the evaluating the degree of performance degradation of the electronic component under the thermal stress based on the trend analysis result includes:

[0110] Simulating the effect of temperature changes on the electronic components in the coolant;

[0111] Collecting performance data of the electronic components under the effect simulation, and performing time series analysis on the performance data to obtain time series analysis results;

[0112] Based on the performance parameters under the time series analysis results, the degree of performance degradation of the electronic components under the thermal stress is analyzed.

[0113] Among them, the effect simulation refers to the simulation of the possible impact of temperature changes on electronic components in the coolant, the performance data refers to the quantitative data on the performance of electronic components collected in the simulation, such as resistance and capacitance values, the time series analysis results refer to the conclusions or data obtained after the time series analysis is completed, including trend lines, predicted values, periodic components, etc., the performance parameters refer to indicator parameters that describe the performance of electronic components, such as inductance and breakdown voltage, and the degree of performance degradation refers to the trend of the performance of electronic components gradually decreasing over time.

[0114] Optionally, the simulation of the effect of temperature change of the electronic components in the coolant can be obtained by controlling a cooling device where the electronic components and the coolant are located, and the analysis of the degree of performance degradation corresponding to the performance parameters at different times can be achieved using a performance benchmark test.

[0115] Furthermore, the embodiments of the present invention can guide the design team to improve the structure of electronic components, enhance their durability and reliability in high temperature environments, and extend the effective service life of electronic components in thermal stress environments by identifying the failure mode of the electronic components under the thermal stress based on the degree of performance degradation. The failure mode refers to the specific manifestation of the partial or complete loss of function of the electronic components due to some reason during operation.

[0116] Optionally, the failure mode identification of the electronic component under the thermal stress based on the degree of performance degradation can be determined by microscopic analysis techniques, such as EDS and X-ray diffraction.

[0117] The embodiment of the present invention can improve the reliability of electronic components by evaluating the risk level of the failure mode to ensure that no major damage is caused when a failure occurs. The risk level refers to the risk level obtained after evaluating the possible failure modes of electronic components in the coolant.

[0118] As an embodiment of the present invention, the step of evaluating the risk level of the failure mode includes:

[0119] Analyze the performance risk corresponding to the failure mode; evaluate the probability of occurrence of the failure mode;

[0120] Performing a detectability assessment on the failure mode to obtain a detectability assessment conclusion;

[0121] Calculating a risk priority number of the failure mode according to the performance risk, the occurrence probability and the detectability assessment conclusion;

[0122] Based on the risk priority number, a risk level of the failure mode is evaluated.

[0123] Among them, the performance risk refers to the potential threat to the performance of electronic components that may be caused by the failure mode, the occurrence probability refers to the possibility of the failure mode occurring, the detectability assessment conclusion refers to the ability of existing detection methods to detect failures before or when failures occur, and the risk priority number refers to a calculated result value that combines the performance risk, occurrence probability and detectability of the failure mode.

[0124] Optionally, the performance risk analysis corresponding to the failure mode can be obtained through fault tree analysis, the occurrence probability evaluation of the failure mode can be implemented using a probability model, the failure mode detectability evaluation can be obtained through analysis of existing detection methods, and the risk priority number of the failure mode is implemented using the product of the performance risk, the occurrence probability and the detectability evaluation conclusion.

[0125] Furthermore, the embodiments of the present invention can predict the reliability of components in a specific coolant environment and prevent sudden failures due to performance degradation by evaluating the service life of the electronic components in the coolant based on the degree of performance degradation and the risk level. The service life refers to the time from the beginning of use of the electronic components in a specific coolant environment to the time when the electronic components cannot work normally due to significant performance degradation or reaching an unacceptable risk level.

[0126] Optionally, the service life evaluation of the electronic components in the coolant based on the degree of performance degradation and the risk level can be obtained by combining risk assessment with a reliability model.

[0127] S4. Based on the trend analysis result and the service life, the reliability of the electronic components in the coolant is tested.

[0128] The embodiment of the present invention tests the reliability of the electronic components in the coolant based on the trend analysis results and the service life, thereby confirming the performance stability of the electronic components when working in the coolant for a long time, helping to identify and prioritize high-risk failure modes, and reducing potential product recall risks and brand reputation losses in the market.

[0129] The embodiment of the present invention performs an initial electrical performance test on the electronic components to be tested to obtain initial electrical performance data, which can be used to compare performance changes during the test and analyze the performance degradation of the electronic components under different conditions. Optionally, the embodiment of the present invention sets the environmental parameters of the cooling device after the electronic components and the coolant are placed in the cooling device to test the long-term stability of the electronic components under various environments. The embodiment of the present invention sets the temperature gradient of the coolant under the execution conditions to evaluate the thermal stress distribution of the electronic components at different temperatures. The embodiment of the present invention analyzes the thermal stress of the temperature gradient on the surface of the electronic components to timely detect overheating of the electronic components and avoid sudden shutdown or damage of the equipment. The embodiment of the present invention monitors the electrical performance parameters of the gathering point under the temperature gradient in real time to understand the performance of the electronic components at different temperatures, which helps to optimize the design and ensure the best performance within the operating temperature range. Finally, the embodiment of the present invention tests the reliability of the electronic components in the coolant based on the trend analysis results and the service life, which can confirm the performance stability of the electronic components when working in the coolant for a long time, which helps to identify and prioritize high-risk failure modes and reduce the potential recall risk and brand reputation loss of the product in the market. Therefore, the present invention can improve the stability of reliability experiments of electronic components in coolant.

[0130] like Figure 2 , which is a functional module diagram of a reliability test system for electronic components in coolant provided by an embodiment of the present invention.

[0131] The electronic component reliability test system 200 in coolant of the present invention can be installed in an electronic device. According to the functions to be implemented, the electronic component reliability test system 200 in coolant can include an execution condition setting module 201, a trend analysis module 202, a service life evaluation module 203 and a reliability experiment module 204. The module of the present invention can also be called a unit, which refers to a series of computer program segments that can be executed by an electronic device processor and can complete fixed functions, which are stored in the memory of the electronic device.

[0132] In this embodiment, the functions of each module / unit are as follows:

[0133] The execution condition setting module 201 is used to perform an initial electrical performance test on the electronic components to be tested, obtain initial electrical performance data, configure the coolant of the electronic components, analyze the compatibility relationship between the coolant and the electronic components, and based on the compatibility relationship, deploy the test device of the electronic components and the coolant, and after the electronic components and the coolant are placed in the test device, set the execution conditions of the test device;

[0134] The trend analysis module 202 is used to set the temperature gradient of the coolant under the execution condition, analyze the thermal stress of the temperature gradient on the surface of the electronic component, identify the gathering point of the thermal stress on the surface of the electronic component, monitor the electrical performance parameters of the gathering point under the temperature gradient in real time, analyze the performance change of the electrical performance parameters under the thermal stress based on the initial electrical performance data, perform trend analysis on the performance change, and obtain trend analysis results;

[0135] The service life evaluation module 203 is used to evaluate the performance degradation degree of the electronic components under the thermal stress based on the trend analysis result, and identify the failure mode of the electronic components under the thermal stress based on the performance degradation degree, evaluate the risk level of the failure mode, and evaluate the service life of the electronic components in the coolant based on the performance degradation degree and the risk level;

[0136] The reliability test module 204 is used to test the reliability of the electronic components in the coolant based on the trend analysis results and the service life. In detail, each module described in the electronic component reliability test system 200 in the embodiment of the present invention adopts the same technical means as the electronic component reliability test method in the coolant described in the accompanying drawings when used, and can produce the same technical effect, which will not be repeated here.

[0137] An embodiment of the present invention provides an electronic device for implementing a reliability test method of electronic components in a cooling liquid.

[0138] See also Figure 3 As shown, the electronic device may include a processor 30, a memory 31, a communication bus 32 and a communication interface 33, and may also include a computer program stored in the memory 31 and executable on the processor 30, such as a reliability test method program for electronic components in coolant.

[0139] In some embodiments, the processor may be composed of an integrated circuit, for example, a single packaged integrated circuit, or a plurality of packaged integrated circuits with the same or different functions, including one or more central processing units (CPUs), microprocessors, digital processing chips, graphics processors, and combinations of various control chips. The processor is the control core (Control Unit) of the electronic device, and uses various interfaces and lines to connect the various components of the entire electronic device, and executes or executes the programs or modules stored in the memory (for example, executing the reliability test program of electronic components in coolant, etc.), and calls the data stored in the memory to execute various functions of the electronic device and process data.

[0140] The memory includes at least one type of readable storage medium, and the readable storage medium includes flash memory, mobile hard disk, multimedia card, card-type memory (for example: SD or DX memory, etc.), magnetic memory, disk, optical disk, etc. The memory may be an internal storage unit of an electronic device in some embodiments, such as a mobile hard disk of the electronic device. The memory may also be an external storage device of an electronic device in other embodiments, such as a plug-in mobile hard disk, a smart memory card (Smart Media Card, SMC), a secure digital (Secure Digital, SD) card, a flash card (Flash Card), etc. equipped on the electronic device. Further, the memory may also include both an internal storage unit of the electronic device and an external storage device. The memory may be used not only to store application software and various types of data installed in the electronic device, such as codes based on reliability test procedures of electronic components in coolant, etc., but also to temporarily store data that has been output or is to be output.

[0141] The communication bus may be a Peripheral Component Interconnect (PCI) bus or an Extended Industry Standard Architecture (EISA) bus, etc. The bus may be divided into an address bus, a data bus, a control bus, etc. The bus is configured to realize connection and communication between the memory and at least one processor, etc.

[0142] The communication interface is used for communication between the above-mentioned electronic device and other devices, including a network interface and a user interface. Optionally, the network interface may include a wired interface and / or a wireless interface (such as a WI-FI interface, a Bluetooth interface, etc.), which is generally used to establish a communication connection between the electronic device and other electronic devices. The user interface may be a display (Display), an input unit (such as a keyboard (Keyboard)), and optionally, the user interface may also be a standard wired interface, a wireless interface. Optionally, in some embodiments, the display may be an LED display, a liquid crystal display, a touch-sensitive liquid crystal display, and an OLED (Organic Light-Emitting Diode, organic light-emitting diode) touch device, etc. Among them, the display may also be appropriately referred to as a display screen or a display unit, which is used to display information processed in the electronic device and to display a visual user interface.

[0143] For example, although not shown, the electronic device may also include a power source (such as a battery) for supplying power to each component. Preferably, the power source may be logically connected to the at least one processor through a power management system, so that the power management system can realize functions such as charging management, discharging management, and power consumption management. The power source may also include any components such as one or more DC or AC power sources, recharging systems, power failure detection circuits, power converters or inverters, and power status indicators. The electronic device may also include a variety of sensors, Bluetooth modules, Wi-Fi modules, etc., which will not be repeated here.

[0144] It should be understood that the embodiment is for illustration only and the scope of the patent application is not limited to this structure.

[0145] The reliability test program of electronic components in coolant stored in the memory of the electronic device is a combination of multiple instructions, and when running in the processor, it can achieve:

[0146] Performing an initial electrical performance test on the electronic components to be tested to obtain initial electrical performance data, configuring a coolant for the electronic components, analyzing the compatibility relationship between the coolant and the electronic components, and deploying a test device for the electronic components and the coolant based on the compatibility relationship, and setting execution conditions for the test device after the electronic components and the coolant are placed in the test device;

[0147] Under the execution conditions, a temperature gradient of the coolant is set, the thermal stress of the temperature gradient on the surface of the electronic component is analyzed, and the gathering point of the thermal stress on the surface of the electronic component is identified, and the electrical performance parameters of the gathering point under the temperature gradient are monitored in real time, and based on the initial electrical performance data, the performance change of the electrical performance parameters under the thermal stress is analyzed, and the trend analysis of the performance change is performed to obtain the trend analysis result;

[0148] Based on the trend analysis result, evaluating the degree of performance degradation of the electronic components under the thermal stress, and based on the degree of performance degradation, identifying the failure mode of the electronic components under the thermal stress, evaluating the risk level of the failure mode, and based on the degree of performance degradation and the risk level, evaluating the service life of the electronic components in the coolant;

[0149] Based on the trend analysis results and the service life, the reliability of the electronic components in the coolant is tested.

[0150] Specifically, the specific implementation method of the processor for the above instructions can refer to the description of the relevant steps in the corresponding embodiment of the accompanying drawings, which will not be repeated here.

[0151] Furthermore, if the module / unit integrated in the electronic device is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. The computer-readable storage medium can be volatile or non-volatile. For example, the computer-readable medium may include: any entity or system capable of carrying the computer program code, a recording medium, a USB flash drive, a mobile hard disk, a magnetic disk, an optical disk, a computer memory, and a read-only memory (ROM).

[0152] The present invention further provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor of an electronic device, the computer program can implement:

[0153] Performing an initial electrical performance test on the electronic components to be tested to obtain initial electrical performance data, configuring a coolant for the electronic components, analyzing the compatibility relationship between the coolant and the electronic components, and deploying a test device for the electronic components and the coolant based on the compatibility relationship, and setting execution conditions for the test device after the electronic components and the coolant are placed in the test device;

[0154] Under the execution conditions, a temperature gradient of the coolant is set, the thermal stress of the temperature gradient on the surface of the electronic component is analyzed, and the gathering point of the thermal stress on the surface of the electronic component is identified, and the electrical performance parameters of the gathering point under the temperature gradient are monitored in real time, and based on the initial electrical performance data, the performance change of the electrical performance parameters under the thermal stress is analyzed, and the trend analysis of the performance change is performed to obtain the trend analysis result;

[0155] Based on the trend analysis result, evaluating the degree of performance degradation of the electronic components under the thermal stress, and based on the degree of performance degradation, identifying the failure mode of the electronic components under the thermal stress, evaluating the risk level of the failure mode, and based on the degree of performance degradation and the risk level, evaluating the service life of the electronic components in the coolant;

[0156] Based on the trend analysis results and the service life, the reliability of the electronic components in the coolant is tested.

[0157] In the several embodiments provided by the present invention, it should be understood that the disclosed devices, systems and methods can be implemented in other ways. For example, the system embodiments described above are only schematic, for example, the division of the modules is only a logical function division, and there may be other division methods in actual implementation.

[0158] The modules described as separate components may or may not be physically separated, and the components shown as modules may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0159] In addition, each functional module in each embodiment of the present invention may be integrated into one processing unit, each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of hardware plus software functional modules.

[0160] It is obvious to those skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention.

[0161] Therefore, no matter from which point of view, the embodiments should be regarded as illustrative and non-restrictive, and the scope of the present invention is limited by the appended claims rather than the above description, so it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present invention. Any attached figure mark in the claims should not be regarded as limiting the claims involved.

[0162] The embodiments of the present application can acquire and process relevant data based on artificial intelligence technology. Among them, artificial intelligence (AI) is the theory, method, technology and application system that uses digital computers or machines controlled by digital computers to simulate, extend and expand human intelligence, perceive the environment, acquire knowledge and use knowledge to obtain the best results.

[0163] In addition, it is clear that the word "comprising" does not exclude other units or steps, and the singular does not exclude the plural. Multiple units or systems stated in a system claim can also be implemented by one unit or system through software or hardware. The words first, second, etc. are used to indicate names, and do not indicate any particular order.

[0164] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solution of the present invention can be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the present invention.

Claims

1. A reliability test method for electronic components in a coolant, characterized in that: The method comprises: Performing an initial electrical performance test on the electronic components to be tested to obtain initial electrical performance data, configuring a coolant for the electronic components, analyzing the compatibility relationship between the coolant and the electronic components, and deploying a test device for the electronic components and the coolant based on the compatibility relationship, and setting execution conditions for the test device after the electronic components and the coolant are placed in the test device; Under the execution conditions, a temperature gradient of the coolant is set, the thermal stress of the temperature gradient on the surface of the electronic component is analyzed, and the gathering point of the thermal stress on the surface of the electronic component is identified, and the electrical performance parameters of the gathering point under the temperature gradient are monitored in real time, and based on the initial electrical performance data, the performance change of the electrical performance parameters under the thermal stress is analyzed, and the trend analysis of the performance change is performed to obtain the trend analysis result; Based on the trend analysis result, evaluating the degree of performance degradation of the electronic components under the thermal stress, and based on the degree of performance degradation, identifying the failure mode of the electronic components under the thermal stress, evaluating the risk level of the failure mode, and based on the degree of performance degradation and the risk level, evaluating the service life of the electronic components in the coolant; Based on the trend analysis results and the service life, the reliability of the electronic components in the coolant is tested.

2. The reliability test method of electronic components in coolant according to claim 1, characterized in that: The initial electrical performance test of the electronic components to be tested is performed to obtain initial electrical performance data, including: Analyzing the attribute items of the electronic components; Based on the attribute items, identifying the inspected parameters of the electronic components, and setting the inspection equipment of the inspected parameters; Based on the detection equipment, an initial electrical performance test is performed on the electronic components to be cooled to obtain initial electrical performance data.

3. The reliability test method of electronic components in coolant according to claim 1, characterized in that: The analyzing the compatibility relationship between the coolant and the electronic components includes: Performing immersion compatibility treatment on the electronic components and the coolant to obtain an immersion compatibility result; Detecting the surface state of the electronic component under the immersion compatibility result, and evaluating the abnormal effect of the coolant on the surface state; Analyzing the rheological factor of the coolant between the electronic components and evaluating the effect of the rheological factor on the heat dissipation of the electronic components; Based on the abnormal effect and the heat dissipation influence, the compatibility relationship between the coolant and the electronic components is analyzed.

4. The reliability test method of electronic components in coolant according to claim 1, characterized in that: The analyzing the thermal stress of the temperature gradient on the surface of the electronic component includes: Collecting temperature gradient data of the electronic components and extracting temperature distribution in the temperature gradient data; Calculating the thermal expansion of the electronic component under the temperature gradient; Analyzing thermal deformation of the electronic component based on the temperature distribution and the thermal expansion; Based on the thermal deformation, the thermal stress of the temperature gradient on the surface of the electronic component is analyzed.

5. The reliability test method of electronic components in coolant according to claim 4, characterized in that: The calculation of the thermal expansion of the electronic components under the temperature gradient can be achieved using the following formula: Wherein, ΔL represents the thermal expansion of the electronic components under the temperature gradient, n represents the number of segments of the electronic components under different temperature gradients, and L 0i represents the initial length of the i-th section of the electronic component under the initial temperature gradient, A i is the thermal expansion coefficient of the ith section of the electronic component, t i represents the final temperature of the i-th section of the electronic component, t i-1 Indicates the initial temperature of the i-1th segment of the electronic component.

6. The reliability test method of electronic components in coolant according to claim 1, characterized in that: The analyzing, based on the initial electrical performance data, the performance change of the electrical performance parameter under the thermal stress comprises: Based on the initial electrical performance data, setting a standard threshold value of the electrical performance parameter under the thermal stress; Constructing a trend model of the electrical performance parameter under the thermal stress, and importing the standard threshold value after the trend model; Based on the trend model, after comparing the standard threshold with the deviation data of the electrical performance parameter, the deviation rate of the deviation data is calculated, and according to the deviation rate, the performance change of the electrical performance parameter under the thermal stress is analyzed.

7. The reliability test method of electronic components in coolant according to claim 6, characterized in that: The trend model construction of the electrical performance parameter under the thermal stress can be obtained by a linear trend model, and the deviation rate calculation of the deviation data can be implemented by the following formula: Among them, R represents the deviation rate corresponding to the electrical performance parameters, A i represents the measured value of the i-th electrical performance parameter among the electrical performance parameters corresponding to the deviation data, S represents the standard threshold value of the electrical performance parameter corresponding to the deviation data, and n represents the number of electrical performance parameters corresponding to the deviation data.

8. The reliability test method of electronic components in coolant according to claim 1, characterized in that: The evaluating, based on the trend analysis result, the degree of performance degradation of the electronic component under the thermal stress comprises: Simulating the effect of temperature changes on the electronic components in the coolant; Collecting performance data of the electronic components under the effect simulation, and performing time series analysis on the performance data to obtain time series analysis results; Based on the performance parameters under the time series analysis results, the degree of performance degradation of the electronic components under the thermal stress is analyzed.

9. The reliability test method of electronic components in coolant according to claim 1, characterized in that: The step of evaluating the risk level of the failure mode includes: Analyze the performance risk corresponding to the failure mode; evaluate the probability of occurrence of the failure mode; Performing a detectability assessment on the failure mode to obtain a detectability assessment conclusion; Calculating a risk priority number of the failure mode according to the performance risk, the occurrence probability and the detectability assessment conclusion; Based on the risk priority number, a risk level of the failure mode is evaluated.

10. A reliability test system for electronic components in coolant, characterized in that: Used to perform the reliability test method of electronic components in coolant as claimed in any one of claims 1 to 9, the system comprising: An execution condition setting module is used to perform an initial electrical performance test on the electronic components to be tested, obtain initial electrical performance data, configure a coolant for the electronic components, analyze the compatibility relationship between the coolant and the electronic components, and based on the compatibility relationship, deploy a test device for the electronic components and the coolant, and after the electronic components and the coolant are placed in the test device, set the execution conditions of the test device; A trend analysis module, used to set the temperature gradient of the coolant under the execution condition, analyze the thermal stress of the temperature gradient on the surface of the electronic component, identify the gathering point of the thermal stress on the surface of the electronic component, monitor the electrical performance parameters of the gathering point under the temperature gradient in real time, analyze the performance change of the electrical performance parameters under the thermal stress based on the initial electrical performance data, perform trend analysis on the performance change, and obtain trend analysis results; A service life evaluation module, used to evaluate the performance degradation degree of the electronic components under the thermal stress based on the trend analysis result, and to identify the failure mode of the electronic components under the thermal stress based on the performance degradation degree, evaluate the risk level of the failure mode, and evaluate the service life of the electronic components in the coolant based on the performance degradation degree and the risk level; The reliability experiment module is used to test the reliability of the electronic components in the coolant based on the trend analysis results and the service life.

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