Copper bar optimization design method based on cost function
Through the copper flare optimization design method based on cost function, the cost control problem in the automotive electric drive system is solved, and the cost is quickly found, which shortens the development cycle and reduces the cost, and simplifies the design verification process.
Patent Information
- Application Number
- CN202411005402.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-25
- Publication Date
- 2024-12-13
AI Technical Summary
The existing automotive electric drive systems have difficulties in product cost control, which is difficult to meet the needs of rapid development. The low-cost solutions have a large workload, making it difficult to quickly find the optimal cost design.
The copper flask optimization design method based on cost function is adopted, and the thermal calculation fast model and cost function are established, and the Latin hypercube sampling method is used for optimization and iterative calculations to find a design solution that meets thermal design performance and is cost-optimized.
It achieves rapid evaluation of product performance, shortens product development cycle, reduces development and product costs, finds the best cost solution, and simplifies design and verification work.
Smart Images

Figure CN119129175A_ABST
Abstract
Description
Technical Field
[0001] The invention belongs to the technical field of copper busbar optimization design, and in particular relates to a copper busbar optimization design method based on a cost function. Background Art
[0002] Existing automotive electric drive systems have increasingly stringent requirements for product cost control. In order to gain cost advantages, the current approach is to verify the feasibility of a design through multiple rounds of simulations or experiments, and then select the solution with the lowest cost from multiple designs. However, the workload of obtaining a low-cost solution is large, which makes it difficult to meet the needs of rapid development.
[0003] Therefore, further improvements are made to the above problems. Summary of the invention
[0004] The main purpose of the present invention is to provide a copper busbar optimization design method based on cost function. This invention directly takes cost as the optimization target, parameters the structure of the design scheme, and solves the cost-optimal design through the optimization algorithm under the condition of ensuring that the product thermal design performance is met. The invention can not only quickly evaluate product performance, but also quickly find the cost-optimal design through the optimization design method. The present invention greatly shortens the product development cycle and finds the cost-optimal solution at the same time, reducing development and product costs.
[0005] To achieve the above object, the present invention provides a copper busbar optimization design method based on a cost function, wherein the copper busbar comprises a bare copper busbar, a plastic-coated busbar and a plastic-coated rib, and comprises the following steps:
[0006] Step S1: Establish a fast thermal calculation model for the copper busbar, and list the following thermal calculation equation based on thermal balance, thereby quickly calculating the temperature of the bare copper busbar and the plastic-wrapped busbar. The thermal calculation equation is:
[0007] h0[(l cu -l0)*2*(B cu +H cu +4*H pl )-N rib *D rib *H rib ](T pl -T w )+λ pl (T pl -T rib )(N rib l rib D rib ) / H rib =λ pl (T cu -T pl )(l cu -l0)*2*(B cu +Hcu ) / H p1
[0008] I 2 *ρ*l cu / B cu / H cu =λ pl (T cu -T pl )(l cu -l0)*2*(B cu +H cu ) / H pl +h0l0*2*(B cu +H cu )(T cu -T w )
[0009]
[0010] Among them, h0 is the heat transfer coefficient, I is the current, l uc is the total length of the bare copper busbar, l0 is the length of the copper busbar terminal, B uc H is the width of bare copper bar cu H is the thickness of bare copper bar, pl is the plastic coating thickness, D rib H is the width of the plastic-coated reinforcement. rib Height of plastic coated reinforcement, l rib is the length of the plastic-coated reinforcement, N rib is the number of plastic-coated bars, T w is the ambient temperature, T cu is the temperature of the bare copper bar, T pl is the packaging temperature, T rib is the plastic-coated reinforcement temperature;
[0011] Step S2: Create a cost function for the copper busbar based on the raw material and process costs. The total cost includes the bare copper busbar cost C cu and packaging cost C pl , and other process costs C others , the cost function is:
[0012] C total =C cu +C pl +C others ;
[0013] Step S3: Optimize the design and use the Latin hypercube sampling method to perform optimization iterative calculations. First, the design parameter range needs to be given according to the design space, including the maximum and minimum values of the bare copper busbar width B. cu_max , B cu_min , the maximum and minimum value of bare copper busbar thickness H cu_max, H cu_min , the maximum and minimum value of plastic coating thickness H pl_max , H pl_min , the maximum and minimum width of the plastic-coated reinforcement is D rib_max , D rib_min , the maximum and minimum values of the plastic-coated reinforcement height H rib_max , H rib_min ; Then set the sampling number, and obtain the parameter B by sampling using the Latin hypercube sampling method cu , H cu , H pl , D rib , H rib Sample space, perform temperature calculation in step S1, with temperature limit T limit As a constraint condition, the samples whose copper busbar temperature exceeds the temperature limit are screened; the remaining samples are then cost-calculated according to step S2 to find the sample with the lowest cost, and a solution that meets the thermal design requirements and has the best cost can be obtained.
[0014] As a further preferred technical solution of the above technical solution, the parameter range includes the maximum and minimum values of the bare copper bus width B cu_max , B cu_min , the maximum and minimum value of bare copper busbar thickness H cu_max , H cu_min , the maximum and minimum value of plastic coating thickness H pl_max , H pl_min , the maximum and minimum width of the plastic-coated reinforcement is D rib_max , D rib_min , the maximum and minimum values of the plastic-coated reinforcement height H rib_max , H rib_min .
[0015] As a further preferred technical solution of the above technical solution, the plastic coating is installed on the bare copper busbar and the plastic coating ribs are installed on the plastic coating.
[0016] To achieve the above objectives, the present invention also provides an electronic device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the program, the steps of the copper busbar optimization design method based on the cost function are implemented.
[0017] To achieve the above objectives, the present invention further provides a non-transitory computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the steps of the copper busbar optimization design method based on the cost function.
[0018] The beneficial effects of the present invention are:
[0019] 1. The present invention directly takes the cost function as the optimization target, provides a relatively simple cost prediction method for product design, and reduces product cost.
[0020] 2. The cost prediction of the present invention occurs in the early stage of design, avoiding a lot of design and verification work, saving time and development costs.
[0021] 3. The present invention also includes a thermal calculation tool to verify the thermal characteristics of the product and reduce the risk of thermal failure of the product. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Figure 1 The present invention is a flow chart of a copper busbar optimization design method based on a cost function.
[0023] Figure 2 It is a schematic diagram of the structure of the existing copper busbar.
[0024] Figure 3 for Figure 2 Simplified structural diagram.
[0025] The reference numerals include: 1. bare copper busbar; 2. plastic coated; 3. plastic coated rib. DETAILED DESCRIPTION
[0026] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are only examples, and those skilled in the art can think of other obvious variations. The basic principles of the present invention defined in the following description can be applied to other embodiments, variations, improvements, equivalents, and other technical solutions that do not deviate from the spirit and scope of the present invention.
[0027] In the preferred embodiment of the present invention, those skilled in the art should note that the copper busbars and the like involved in the present invention may be regarded as prior art.
[0028] Preferred embodiments.
[0029] Common copper busbar structure models such as Figure 2 As shown, the copper busbar is composed of a bare copper busbar 1 and an external plastic coating 2, and a plastic coating rib 3 is designed on the plastic coating.
[0030] In order to quickly calculate the copper busbar temperature, the copper busbar is simplified as follows: Figure 3 Thermal calculation model, where 1 is bare copper busbar, 2 is plastic coated, and 3 is plastic coated rib.
[0031] like Figure 1-3 As shown, the present invention discloses a copper busbar optimization design method based on a cost function, wherein the copper busbar comprises a bare copper busbar 1, a plastic-coated busbar 2 and a plastic-coated rib 3, and comprises the following steps:
[0032] Step S1: Establish a fast thermal calculation model for the copper busbar, and list the following thermal calculation equation based on thermal balance, thereby quickly calculating the temperature of the bare copper busbar and the plastic-wrapped busbar. The thermal calculation equation is:
[0033] h0[(l cu -l0)*2*(B cu +H cu +4*H pl )-N rib *D rib *H rib ](T pl -T w )+λ pl (T pl -T rib )(N rib l rib D rib ) / H rib =λ pl (T cu -T pl )(l cu -l0)*2*(B cu +H cu ) / H p1
[0034] I 2 *ρ*l cu / B cu / H cu =λ pl (T cu -T pl )(l cu -l0)*2*(B cu +H cu ) / H pl +h0l0*2*(B cu +H cu )(T cu -T w )
[0035]
[0036] Among them, h0 is the heat transfer coefficient, I is the current, l cu is the total length of the bare copper busbar, l0 is the length of the copper busbar terminal (referring to the copper busbar part not wrapped in plastic), B cu H is the width of bare copper bar cu H is the thickness of bare copper bar, pl is the plastic coating thickness, D rib H is the width of the plastic-coated reinforcement. rib Height of plastic coated reinforcement, l rib is the length of the plastic-coated reinforcement, N rib is the number of plastic-coated bars, T w is the ambient temperature, T cu is the temperature of the bare copper bar, T plis the packaging temperature, T rib is the plastic-coated reinforcement temperature;
[0037] Step S2: Create a cost function for the copper busbar based on the raw material and process costs. The total cost includes the bare copper busbar cost C cu and packaging cost C pl , and other process costs C others , the cost function is:
[0038] C totat =C cu +C pl +C others ;
[0039] Step S3: Optimize the design and use the Latin hypercube sampling method to perform optimization iterative calculations. First, the design parameter range needs to be given according to the design space, including the maximum and minimum values of the bare copper busbar width B. cu_max , B cu_min , the maximum and minimum value of bare copper busbar thickness H cu_max , H cu_min , the maximum and minimum value of plastic coating thickness H pl_max , H pl_min , the maximum and minimum width of the plastic-coated reinforcement is D rib_max , D rib_min , the maximum and minimum values of the plastic-coated reinforcement height H rib_max , H rib_min ; Then set the sampling number, and obtain the parameter B by sampling using the Latin hypercube sampling method cu , H cu , H pl , D rib , H rib Sample space, perform temperature calculation in step S1, with temperature limit T limit As a constraint condition, the samples whose copper busbar temperature exceeds the temperature limit are screened; the remaining samples are then cost-calculated according to step S2 to find the sample with the lowest cost, and a solution that meets the thermal design requirements and has the best cost can be obtained.
[0040] Specifically, the parameter range includes the maximum and minimum values of the bare copper busbar width B cu_max , B cu_min , the maximum and minimum value of bare copper busbar thickness H cu_max , H cu_min , the maximum and minimum value of plastic coating thickness H pl_max , H pl_min , the maximum and minimum width of the plastic-coated reinforcement is D rib_max , D rib_min , the maximum and minimum values of the plastic-coated reinforcement height H rib_max , H rib_min .
[0041] More specifically, the plastic overmolding is installed on the bare copper busbar and the plastic overmolding rib is installed on the plastic overmolding.
[0042] The present invention discloses an electronic device, comprising a memory, a processor and a computer program stored in the memory and executable on the processor. When the processor executes the program, the steps of the copper busbar optimization design method based on the cost function are implemented.
[0043] The present invention also discloses a non-transitory computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the steps of the copper busbar optimization design method based on the cost function are implemented.
[0044] It is worth mentioning that the technical features such as copper busbars involved in the patent application of this invention should be regarded as prior art. The specific structure, working principle and possible control method and spatial layout method of these technical features can be selected according to the conventional selection in the field, and should not be regarded as the inventive point of this patent. This patent will not be further elaborated.
[0045] For those skilled in the art, it is still possible to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. A copper busbar optimization design method based on cost function, the copper busbar includes a bare copper busbar, a plastic-coated busbar and a plastic-coated rib, characterized in that: The following steps are involved: Step S1: Establish a fast thermal calculation model for the copper busbar, and list the following thermal calculation equation based on thermal balance, thereby quickly calculating the temperature of the bare copper busbar and the plastic-wrapped busbar. The thermal calculation equation is: h0[(l cu -l0)*2*(B cu +H cu +4*H p1 )-N rib *D rib *H ib ](T pl -T w )+λ pl (T pl -T rib )(N rib l rib D rib ) / H rib =λ pl (T cu -T pl )(l cu -l0)*2*(B cu +H cu ) / H pl I 2 *ρ*l cu / B cu / H cu =λ pl (T cu -T pl )(l cu -l0)*2*(B cu +H cu ) / H pl +h0l0*2*(B cu +H cu )(T cu -T w ) Among them, h0 is the heat transfer coefficient, I is the current, l cu is the total length of the bare copper busbar, l0 is the length of the copper busbar terminal, B cu H is the width of bare copper bar cu H is the thickness of bare copper bar, pl is the plastic coating thickness, D rib H is the width of the plastic-coated reinforcement. rib Height of plastic coated reinforcement, l rib is the length of the plastic-coated reinforcement, N rib is the number of plastic-coated bars, T w is the ambient temperature, T cu is the temperature of the bare copper bar, T pl is the packaging temperature, T rib is the plastic-coated reinforcement temperature; Step S2: Create a cost function for the copper busbar based on the raw material and process costs. The total cost includes the bare copper busbar cost C cu and packaging cost C pl , and other process costs C others , the cost function is: C total =C cu +C pl +C others ; Step S3: Optimize the design and use the Latin hypercube sampling method to perform optimization iterative calculations. First, the design parameter range needs to be given according to the design space, including the maximum and minimum values of the bare copper busbar width B. cu_max , B cu_min , the maximum and minimum values of bare copper busbar thickness H cu_max , H cu_min , the maximum and minimum value of the plastic coating thickness H pl_max , H pl_min , the maximum and minimum width of the plastic-coated reinforcement is D rib_max , D rib_min , the maximum and minimum values of the plastic-coated reinforcement height H rib_max , H rib_min ; Then set the sampling number, and obtain the parameter B by sampling using the Latin hypercube sampling method cu , H cu , H pl , D rib , H rib Sample space, perform temperature calculation in step S1, with temperature limit T limit As a constraint condition, samples whose copper busbar temperature exceeds the temperature limit are screened; then the remaining samples are subjected to cost calculation according to step S2 to find the sample with the lowest cost, thereby obtaining a solution that meets the thermal design requirements and has the best cost.
2. The copper busbar optimization design method based on cost function according to claim 1 is characterized in that: The parameter range includes the maximum and minimum values of the bare copper busbar width B cu_max , B cu_min , the maximum and minimum values of bare copper busbar thickness H cu_max , H cu_min , the maximum and minimum value of the plastic coating thickness H pl_max , H pl_min , the maximum and minimum width of the plastic-coated reinforcement is D rib_max , D rib_min , the maximum and minimum values of the plastic-coated reinforcement height H rib_max , H rib_min .
3. The copper busbar optimization design method based on cost function according to claim 2 is characterized in that: The plastic coating is installed on the bare copper busbar and the plastic coating ribs are installed on the plastic coating.
4. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the program, the steps of the copper busbar optimization design method based on the cost function as described in any one of claims 1 to 3 are implemented.
5. A non-transitory computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the copper busbar optimization design method based on the cost function as claimed in any one of claims 1 to 3 are implemented.
