Structure customization unit of vehicle gauge chip and circuit design method of vehicle gauge chip

Abstract

The invention is applicable to the technical field of vehicle gauge chip design, and provides a structure customization unit of a vehicle gauge chip, a plurality of structure customization units are respectively arranged in a design circuit of the vehicle gauge chip in the form of a single preset fixed structure, each structure customization unit comprises a plurality of registers and a logic gate device, and in each preset fixed structure, a logic gate device is arranged in each register. The distance between the registers is a preset value, the number of the registers is a preset number, and the number of the structure customization units is determined based on the preset redundancy coverage rate of the vehicle gauge chip. A plurality of registers and a logic gate device form a structure customization unit in a preset fixed structure, and the structure customization unit is arranged in the design circuit of the vehicle gauge chip, so that the redundancy of the design circuit of the vehicle gauge chip can be improved, and meanwhile, the efficiency of designing the function safety requirement of the vehicle gauge chip is also improved.

Description

Technical Field

[0001] The present application belongs to the technical field of automotive chip design, and in particular, relates to a structural customization unit of an automotive chip and a circuit design method of an automotive chip. Background Art

[0002] The design of automotive chips stems from the automotive industry's continuous pursuit of intelligence, safety and reliability. With the increasing richness and complexity of automotive electronic system functions, such as the popularization of advanced driver assistance systems and autonomous driving technologies, automotive chips need to meet higher performance and functional requirements. At the same time, the automotive industry's attention to functional safety and data security is also increasing, which has promoted the continuous optimization and innovation of automotive chip design in terms of safety.

[0003] In the design of relevant automotive chips, in order to meet the functional safety requirements of automotive chips, separate design is required during the back-end implementation, making the implementation of the functional safety requirements of automotive chips more complicated. Summary of the invention

[0004] The embodiments of the present application provide a structural customization unit for an automotive chip, a circuit design method for an automotive chip, a design circuit, a vehicle controller device and a vehicle, which can solve the problem that in order to meet the functional safety requirements of automotive chips, separate design is required during back-end implementation, making the implementation of the functional safety requirements of automotive chips more complicated.

[0005] In the first aspect, an embodiment of the present application provides a structural customization unit for an automotive-standard chip, wherein a plurality of the structural customization units are each arranged in the form of a single predetermined fixed structure in the design circuit of the automotive-standard chip, and the structural customization unit includes: a plurality of registers and a logic gate device, wherein the distance between each register in the predetermined fixed structure is a predetermined value, and the number of registers is a predetermined number, wherein the number of the structural customization units is determined based on a preset redundant coverage rate of the automotive-standard chip.

[0006] In a possible implementation manner of the first aspect, the pre-customized fixed structure is further pre-configured with a substrate contact unit, and the substrate contact unit is respectively configured at the input end and the output end of each register.

[0007] Optionally, in another possible implementation of the first aspect, the above-mentioned predetermined value is determined based on the minimum spacing corresponding to multiple preset conditions and the final failure rate of the design circuit of the automotive-grade chip, wherein the final failure rate is determined based on the process influence coefficient of the design circuit of the automotive-grade chip, the preset design redundancy and the baseline failure rate of the design circuit of the automotive-grade chip.

[0008] Optionally, in another possible implementation manner of the first aspect, the predetermined value is greater than or equal to two manufacturing process unit distances.

[0009] Optionally, in another possible implementation of the first aspect, the predetermined number is greater than or equal to two.

[0010] Optionally, in another possible implementation of the first aspect, the predetermined values ​​corresponding to the multiple structural customization units in the above-mentioned design circuit are respectively the same or different, and / or the predetermined quantities corresponding to the multiple structural customization units are respectively the same or different.

[0011] In the second aspect, an embodiment of the present application provides a circuit design method for an automotive-grade chip, including: determining a preset redundant coverage rate of the circuit based on the front-end requirements of the circuit to be designed; determining the number and configuration positions of structural customization units in combination with the preset redundant coverage rate; retrieving at least one customized structural customization unit from a pre-stored library of structural customization unit customization, and configuring the retrieved structural customization unit on the circuit according to the number and the configuration position to obtain a designed circuit.

[0012] On the third aspect, an embodiment of the present application provides a design circuit, which is used for automotive-grade chips. The design circuit includes a main board and multiple structural customization units fixed on the main board. Each of the multiple structural customization units is arranged on the main board in the form of a single pre-customized fixed structure.

[0013] In a fourth aspect, an embodiment of the present application provides a vehicle controller device, which includes a controller body and a vehicle-standard chip configured in the controller body, and the vehicle-standard chip is configured with the above-mentioned design circuit.

[0014] In a fifth aspect, an embodiment of the present application provides a vehicle, which includes a vehicle body and the above-mentioned vehicle controller device built into the vehicle body, and the vehicle controller device is communicatively connected with mechanical components in the vehicle body.

[0015] In the technical solution of the present application, by forming a structural customization unit with multiple registers and a logic gate device in a predetermined fixed structure and arranging it in the design circuit of the automotive chip, the redundancy of the design circuit of the automotive chip can be improved, and the efficiency of the design of functional safety requirements of the automotive chip can also be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0017] Figure 1 This is a circuit diagram of a structural customization unit of a vehicle-grade chip provided in an embodiment of the present application;

[0018] Figure 2 It is a flowchart of a method for determining a predetermined value of a structure customization unit provided in an embodiment of the present application;

[0019] Figure 3 is a circuit diagram of a structural customization unit of a vehicle-grade chip provided in another embodiment of the present application;

[0020] Figure 4 This is a layout diagram of a structural customization unit of a vehicle-grade chip provided in an embodiment of the present application;

[0021] Figure 5 It is a flowchart of a circuit design method for a vehicle-grade chip provided in an embodiment of the present application;

[0022] Figure 6 This is a safety design flow chart of the clock CRG in the automotive chip design circuit provided by an embodiment of the present application;

[0023] Description of reference numerals:

[0024] Redundant circuit unit-100, register 110, register 120, logic gate device 130, buffer circuit 140, register 150;

[0025] Redundant circuit unit 400 , register 410 , logic gate device 420 , substrate contact unit 430 . DETAILED DESCRIPTION

[0026] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present application. However, it should be clear to those skilled in the art that the present application may also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present application.

[0027] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, wholes, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or combinations thereof.

[0028] It should also be understood that the term “and / or” used in the specification and appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0029] As used in the specification and appended claims of this application, the term "if" can be interpreted as "when" or "uponce" or "in response to determining" or "in response to detecting", depending on the context. Similarly, the phrase "if it is determined" or "if [described condition or event] is detected" can be interpreted as meaning "uponce it is determined" or "in response to determining" or "uponce [described condition or event] is detected" or "in response to detecting [described condition or event]", depending on the context.

[0030] In addition, in the description of the present application specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0031] References to "one embodiment" or "some embodiments" etc. described in the specification of this application mean that one or more embodiments of the present application include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, the statements "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0032] In order to meet the functional safety requirements, currently automotive chips generally need to perform corresponding designs in the front-end part of chip design, which leads to the problem of high design complexity of automotive chips. Based on this, the present application proposes a structural customization unit for automotive chips, so that in the back-end implementation process of chip design, the structural customization unit provided by the present application can be directly added to the design circuit of the automotive chip, thereby realizing the functional safety requirements of the automotive chips, and at the same time simplifying the design complexity of the functional safety requirements of the automotive chips to the greatest extent.

[0033] The following is a detailed description of a structural customization unit of a vehicle-grade chip, a circuit design method of a vehicle-grade chip, a designed circuit, a vehicle control device and a vehicle provided in the present application with reference to the accompanying drawings.

[0034] The automotive chips in this application refer to chips that are designed and manufactured specifically for automotive applications and meet the stringent automotive industry standards. Such chips need to maintain stable and reliable performance in harsh environments such as extreme temperature ranges, high vibration, high voltage, high humidity, EMI, etc., and usually pass the inspection of automotive industry quality standards such as the AEC-Q series certification. At present, such chips are widely used in various vehicle subsystems such as engine control, braking systems, safety systems, in-vehicle entertainment information systems, ADAS, etc.

[0035] The structural customization unit of the automotive chip provided in the present application includes a plurality of registers and a logic gate device. Each of the plurality of structural customization units is arranged in the design circuit of the automotive chip in the form of a single predetermined fixed structure, in which the distance between each register is a predetermined value and the number of registers is a predetermined number. The number of structural customization units is determined based on the preset redundancy coverage of the automotive chip.

[0036] Below through Figure 1 A circuit diagram of a structural customization unit of a vehicle-grade chip provided in one embodiment of the present application is shown to illustrate the internal structure of the structural customization unit.

[0037] like Figure 1 As shown, the structure customized unit cell 100 includes: a register 110, a register 120 and a logic gate device 130; the Q port of the register 110 is connected to the A2 port of the logic gate device 130, and the Q port of the register 120 is connected to the A1 port of the logic gate device 130.

[0038] The register 110 may refer to a basic storage unit in computers and digital circuits for temporarily storing data. They are composed of a set of flip-flops (usually D flip-flops) and can store one or more bits of information. The main function of the register is to receive, store and output data, and update its content according to the control signal.

[0039] In the embodiments of the present application, Figure 1 The circuit diagram shown includes two registers, namely register 110 and register 120, each of which plays a role in improving the redundancy of the input signal. After the structure customization unit 100 receives the input signal, it transmits the input signal to the D port of the register 110 and the D port of the register 120 respectively. After the register 110 and the register 120 receive and store the input signal, they output the input signal to the A2 port and the A1 port of the logic gate device 130 through their respective Q ports. After comparing the input signals sent by the register 110 and the register 120, the logic gate device 130 outputs the signal comparison result through the Z port of the logic gate device.

[0040] The logic gate device 130 is a digital logic circuit used to implement the error detection and fault tolerance functions in the structure customization unit 100. Its main function is to receive and compare the signals output by the register 110 and the register 120 and output the comparison result.

[0041] In the embodiments of the present application, Figure 1 As shown, the logic gate device 130 is an XOR gate circuit. After the redundant circuit unit 100 receives the input signal, the input signal is transmitted to the D port of the register 110 and the D port of the register 120 respectively. After the register 110 and the register 120 receive and store the input signal, the input signal is output to the A2 port and the A1 port of the logic gate device 130 through their respective Q ports. After the logic gate device 130 compares the input signals sent by the register 110 and the register 120, if the input signals sent by the register 110 and the register 120 are the same, the input signal is output through the Z port of the logic gate device 130. If the input signals sent by the register 110 and the register 120 are different, an error signal is output.

[0042] As another possible implementation, the logic gate device 130 may also be a majority voter, which includes more than two triggers and an XOR gate circuit. Generally, when the number of registers in the structure customization unit is more than two, the logic gate device is a majority voter.

[0043] For example, the logic gate device 130 is a majority voter, and the structure customization unit includes three registers, which are respectively connected in parallel to the input ports of the logic gate device. When the structure customization unit receives the input signal, it transmits the input signal to the input ports of the three registers at the same time. After the three registers receive and store the input signal, they send the input signal to the logic gate device for comparison. If at least two input signals are the same, the logic gate device outputs the input signal corresponding to at least two identical input signals.

[0044] The structural customization units provided in the present application are each arranged in the design circuit of the automotive chip in the form of a single predetermined customized fixed structure, wherein the distance between each register in the predetermined customized fixed structure is a predetermined value, and the number of registers is a predetermined number.

[0045] It should be noted that the pre-customized fixed structure is a layout form pre-customized by the structure customization unit. When the distance between each register in a structure customization unit is a predetermined value and the number of registers in the structure customization unit is a predetermined number, the above-mentioned structure customization unit can be confirmed to meet the pre-customized fixed structure.

[0046] For example, Figure 1As shown, the predetermined customized fixed structure adopted by the structure customization unit 100 provided in one embodiment of the present application is a predetermined customized fixed structure of a dual redundant structure DMR. The register 110, the register 120 and the logic gate device 130 together constitute the structure customization unit of the DMR, the distance between the register 110 and the register 120 is a predetermined value, the number of registers is a predetermined number, and the predetermined number is two.

[0047] It should be noted that in the pre-customized fixed structure, the number of registers is a predetermined number, and the predetermined number is greater than or equal to two. The preset number of registers in the structure customization unit of this application is determined according to the ASIL level corresponding to the automotive chip design circuit. For example, when the ASIL level corresponding to the automotive chip design circuit is D, because the functional safety level is the highest at this time, the number of registers in the structure customization unit can be four; when the ASIL level corresponding to the automotive chip design circuit is C, because the functional safety level is higher at this time, the number of registers in the structure customization unit can be three; when the ASIL level corresponding to the automotive chip design circuit is B, the functional safety level is lower at this time, so the number of registers in the structure customization unit can be two, and this application does not limit this.

[0048] It should be noted that in the pre-customized fixed structure, the distance between each register is a predetermined value, and the predetermined value is greater than or equal to two manufacturing process unit distances. Among them, the manufacturing process unit distance may refer to the height of a standard cell. A standard cell is a pre-designed circuit module with specific functions, such as a basic logic gate, a trigger, etc. These standard cells are arranged in rows and columns during the layout of the integrated circuit. For example, assuming that the height of a standard cell is H, then the distance between two manufacturing process units is expressed as 2H, that is, the height of two rows of standard cells, then the distance between each register can be 2H or 3H, and this application does not limit this.

[0049] It should be noted that the distance between each register is a predetermined value, and the predetermined value is greater than or equal to the distance of two manufacturing process units. This is to ensure that there is enough physical space between different parts in the chip to reduce possible interference and cross-coupling during layout and routing. Logic gate devices are not affected because they have no direct relationship with the spacing between registers, but other logic units can enter between the various registers of the structure customization unit as long as their layout and routing do not violate the minimum spacing requirements between registers. This can make more efficient use of chip space and achieve higher integration while ensuring functional safety.

[0050] In addition, it should be noted that the predetermined value in this application is at least two manufacturing process unit distances, which are generally preset based on the reference values ​​in the preparation process of various functional electronic components in the design circuit of the currently commonly used automotive chip. However, when the preparation process of various functional electronic components in the design circuit of the automotive chip adopts the current relatively new preparation process, due to the lack of reference values, the predetermined value of the automotive chip needs to be recalculated.

[0051] Figure 2 A flow chart of a method for determining a predetermined value of a structure customization unit provided in an embodiment of the present application is shown.

[0052] like Figure 2 As shown, the method for determining the predetermined value of the structure customization unit includes the following steps:

[0053] Step 201, determining the final failure rate of the design circuit of the automotive chip according to the process influence coefficient of the design circuit of the automotive chip, the preset design redundancy and the baseline failure rate of the design circuit of the automotive chip.

[0054] The process influence coefficient may refer to a parameter reflecting the influence of process parameters on the system failure rate during the manufacturing process.

[0055] Among them, design redundancy can refer to the degree to which system reliability is improved through redundant design. For example, 99% design redundancy means that only 1% system failure rate needs to be considered. It should be noted that the determination of design redundancy can be preset according to ASIL level requirements.

[0056] The benchmark failure rate may refer to the failure rate of the system under normal working conditions. The benchmark failure rate of the design circuit of the automotive chip is determined based on the chip failure rate, package failure rate and electrical overstress failure rate of the design circuit of the automotive chip.

[0057] It should be noted that the determination of the baseline failure rate of the design circuit of the automotive chip can be calculated according to the IOS26262 standard. The IOS26262 standard provides a method for calculating the failure rate (FIT) of semiconductor devices, including the consideration of factors such as temperature and mechanical stress under different environments and usage conditions. The failure rate calculation formula is:

[0058] λ=(λ die +λ package +λ overstress )×10 -9

[0059] Among them, λ represents the baseline failure rate of the design circuit of the automotive chip, λ die represents the chip failure rate, λ packagerepresents the package failure rate, λ overstress Represents the electrical overstress failure rate. Among them, the chip failure rate can be expressed as:

[0060]

[0061] This section describes the internal failure rate of the chip, taking into account technical parameters, number of transistors, temperature factors, etc. The formula includes the baseline failure rate (λ1 and λ2), temperature correction factor, operating time, etc.

[0062] The package failure rate can be expressed as:

[0063]

[0064] This section deals with package-related failure rates, including thermal expansion, temperature cycling, etc. The calculation of package failure rate takes into account the coefficient of thermal expansion, temperature cycling factor, and temperature variation.

[0065] The electrical overstress failure rate can be expressed as:

[0066] λ overstress =Π1×λ EOS

[0067] This section takes into account the failure rate caused by electrical overstress, mainly including temperature cycle factors and electrical overstress reference values.

[0068] In the embodiment of the present application, the final failure rate of the design circuit of the automotive chip can be determined based on the process influence coefficient of the design circuit of the automotive chip, the preset design redundancy and the baseline failure rate of the design circuit of the automotive chip. In this way, the reliability of the design circuit of the automotive chip under specific process conditions can be accurately evaluated, thereby optimizing the design and improving the overall stability and fault tolerance of the circuit.

[0069] Furthermore, in a possible implementation of the embodiment of the present application, the above step 201 may include:

[0070] Determine the actual process failure rate corresponding to the design circuit of the automotive chip based on the process influence coefficient and the benchmark failure rate;

[0071] The final failure rate of the design circuit of the automotive chip is determined based on the failure rate of the actual process corresponding to the design circuit of the automotive chip and the preset design redundancy.

[0072] In the embodiment of the present application, after determining the baseline failure rate of the automotive chip design circuit, combined with the process influence coefficient, the failure rate of the actual process corresponding to the automotive chip design circuit can be determined, that is:

[0073] λ system=β×λ baseline

[0074] where λ system represents the failure rate of the actual process corresponding to the automotive chip design circuit, β represents the process influence coefficient, and λ baseline Represents the benchmark failure rate of automotive chip design circuits.

[0075] After determining the actual process failure rate corresponding to the automotive chip design circuit, combined with the preset design redundancy, the final failure rate of the automotive chip design circuit is determined:

[0076] λ redundant =(1-Y)×λ system

[0077] Among them, λ redundant represents the final failure rate of the automotive chip design circuit, Y represents the preset design redundancy, and λ system It indicates the failure rate of the actual process corresponding to the automotive chip design circuit.

[0078] In the embodiment of the present application, the failure rate of the actual process corresponding to the automotive chip design circuit is determined based on the process influence coefficient and the benchmark failure rate, and then the final failure rate of the automotive chip design circuit is determined based on the failure rate of the actual process corresponding to the automotive chip design circuit and the preset design redundancy. Thus, by accurately evaluating the process conditions and redundant design, the reliability and stability of the circuit can be optimized and the fault tolerance of the system can be improved.

[0079] Step 202, when the final failure rate of the designed circuit of the automotive chip is less than a preset threshold, a predetermined value is determined according to the minimum spacing corresponding to a plurality of preset conditions.

[0080] It should be noted that the final failure rate of the automotive chip design circuit is compared with the failure rate threshold required by the system design. If the final failure rate is less than the threshold, it means that the final failure rate meets the system design requirements, and the predetermined value is further determined. As another possible implementation method, if the final failure rate is greater than or equal to the threshold, it means that the final failure rate does not meet the system design requirements, and the automotive chip design circuit needs to be adjusted, such as increasing the number of registers in the structure customization unit or improving the process.

[0081] Furthermore, in a possible implementation of the embodiment of the present application, the above step 202 may include:

[0082] Determine a maximum value from minimum intervals corresponding to a plurality of preset conditions;

[0083] The minimum distance corresponding to the maximum value is determined as a predetermined value.

[0084] Among them, the preset conditions may include conditions such as temperature management, mechanical stress, and electrical isolation. Under the temperature management condition, ensure that there is enough heat dissipation space between the registers to prevent overheating. Thermal simulation tools (such as ANSYS Icepak) are usually required to analyze the heat conduction and heat dissipation between different modules. For example, the thermal simulation results may indicate that the minimum heat dissipation spacing is 10 mm. Under the mechanical stress condition, consider the vibration and impact of the module in actual operation. Mechanical simulation (such as ANSYS Mechanical) is required to determine the physical spacing between modules to ensure structural strength and stability. For example, the mechanical simulation results may indicate that the minimum physical spacing is 5 mm. Under the electrical isolation condition, ensure electrical isolation according to the voltage and current requirements of the system. Electrical simulation tools (such as Cadence or Mentor Graphics) are required for analysis to prevent signal crosstalk and electromagnetic interference (EMI). For example, the electrical simulation results may indicate that the minimum electrical isolation spacing is 7 mm. Finally, the results of thermal simulation, mechanical simulation, and electrical simulation are comprehensively considered, and the maximum value is taken as the predetermined value.

[0085] In the embodiment of the present application, when the final failure rate of the circuit designed for the automotive chip is less than the preset threshold, the predetermined value is determined according to the minimum spacing corresponding to multiple preset conditions. This ensures that the automotive chip has high reliability and stability in various working environments, avoids failures caused by environmental changes, and furthermore, the predetermined value can be determined more accurately.

[0086] The method for determining the preset value of the structure customization unit provided in the present application first determines the final failure rate of the automotive chip design circuit based on the process influence coefficient of the automotive chip design circuit, the preset design redundancy and the baseline failure rate of the automotive chip design circuit, and then when the final failure rate of the automotive chip design circuit is less than the preset threshold, the preset value is determined according to the minimum spacing corresponding to multiple preset conditions. This ensures the high reliability and stability of the automotive chip design circuit under different environmental conditions, reduces failures caused by environmental changes, and improves the safety and durability of the automotive chip. Furthermore, by determining the preset value, the structural customization unit can better meet the functional safety requirements of the automotive chip, and also improves the efficiency of the functional safety design of the automotive chip.

[0087] The number of structural customization units provided in this application is determined based on the preset redundant coverage of the automotive chip, and the preset redundant coverage is determined according to the design circuit of the automotive chip. For example, when the functional safety level corresponding to the design circuit of the automotive chip is ASIL D (highest safety level), the preset redundant coverage of the design circuit of the automotive chip is 98%, then the number of corresponding structural customization units needs to be 100; when the functional safety level corresponding to the design circuit of the automotive chip is ASIL C (higher safety level), the preset redundant coverage of the design circuit of the automotive chip is 85%, then the number of corresponding structural customization units needs to be 80. This application does not limit this. In addition, it should also be noted that the predetermined values ​​corresponding to the multiple structural customization units in the design circuit of this application are the same or different, and / or the predetermined numbers corresponding to the multiple structural customization units are the same or different. That is, multiple structure customization units in the same design circuit are not necessarily the same pre-customized fixed structure. For example, the design circuit corresponding to the autonomous driving system includes functional sensor circuits, control circuits and display circuits. The autonomous driving system is ASIL D (highest safety level), but in the autonomous driving system, the safety requirements of different module circuits may be different: if the sensor circuit fails, the system may not be able to correctly judge the distance and speed ahead, leading to serious traffic accidents. Therefore, the sensor circuit is classified as ASIL D. Failure of the control circuit may lead to incorrect acceleration or deceleration decisions, which may also lead to serious accidents. Therefore, the control circuit is also classified as ASIL D. If the display circuit fails, the driver may not be able to see the current system status, but this does not directly lead to vehicle control failure, because the autonomous driving system is still running, so the safety risk of the display circuit is low and may be classified as ASILB. Accordingly, the number of registers in the structure customization unit of the sensor circuit and the control circuit can be three, and the number of registers in the structure customization unit of the display circuit can be two.

[0088] In circuit design, design tools usually automatically handle signal connections, so that the signal may be connected to a default main register. Therefore, in order to avoid connecting the structure customization unit to the wrong place, in another embodiment, Figure 3 The circuit diagram of the structural customization unit of the automotive chip shown in the figure, the structural customization unit can be externally connected to the DFT verification circuit, connected to the I port of the buffer circuit 140 through the Q port of the register 110, the Z port of the buffer circuit 140 is connected to the D port of the register 150, and the Q port of the register 150 is then connected to the DFT verification circuit.

[0089] The buffer circuit 140 is used to enhance the signal strength.

[0090] The register 150 is used to store and send signals.

[0091] In the embodiments of the present application, Figure 3 As shown, the logic gate device 130 can be an XOR gate circuit. After the redundant circuit unit 100 receives the input signal, the input signal is transmitted to the D port of the register 110 and the D port of the register 120 respectively. After the register 110 and the register 120 receive and store the input signal, the input signal is output to the A2 port and the A1 port of the logic gate device 130 through their respective Q ports. After the logic gate device 130 compares the input signals sent by the register 110 and the register 120, if the input signals sent by the register 110 and the register 120 are the same, the input signal is output through the Z port of the logic gate device 130. If the input signals sent by the register 110 and the register 120 are different, an error signal is output. In addition, after the register 110 receives and stores the input signal, it also outputs the input signal to the I port of the buffer circuit 140 through the Q port to enhance the signal strength of the input signal. Then the buffer circuit 140 inputs the input signal to the D port of the register 150 through its own Z port. After the register 150 receives and stores the input signal, it inputs the input signal to the DFT verification circuit through the Q port.

[0092] As other possible implementation methods, the structure customization unit can select an external CLOCK circuit or FUCTION circuit according to various other requirements, and this application does not limit this.

[0093] Figure 4 A layout diagram of a structural customization unit of an automotive-grade chip provided in an embodiment of the present application is shown.

[0094] like Figure 4 As shown, the structure customization unit 400 includes: multiple registers 410, logic gate devices 420 and multiple substrate contact units 430, each register 410 is connected to the input end of the logic gate device 420 in parallel, a substrate contact unit 430 is set at both ends of each register 410, and the spacing between each register 410 is a predetermined value, which is at least two manufacturing process unit distances.

[0095] Among them, the substrate contact unit 430 may refer to a physical unit used to eliminate the latch effect of the chip, and reduce the parasitic resistance of the substrate by applying a bias voltage to the substrate at a fixed spacing, so that the transistor voltage cannot meet the conduction requirements, thereby cutting off the positive feedback loop of the latch effect. The substrate contact unit has only two connection relationships: nWell is connected to VDD (power supply), and pSub is connected to VSS (ground), wherein nWell is an n-type well, which is the positive electrode socket of the substrate contact unit, and it needs to be connected to VDD to ensure that the substrate contact unit has sufficient positive voltage, and pSub is a p-type substrate, which is the grounding socket of the substrate contact unit, and it needs to be connected to VSS to ensure that the substrate contact unit has a stable ground voltage. By connecting the nWell of the substrate contact unit to VDD and the pSub to VSS, the substrate contact unit can be ensured to operate stably. It should also be noted that the substrate contact unit has no input pins and output pins, and has no internal logic functions.

[0096] In the embodiment of the present application, a substrate contact unit is provided at both ends of each register for the purpose of preventing the occurrence of a latch effect, which is an undesirable phenomenon that occurs in an integrated circuit and is caused by incorrect voltage or current conditions, ultimately resulting in a short circuit and damage to the chip. By adding a substrate contact unit at each end of the register, additional protection can be provided to absorb voltage and current that may cause abnormalities in the register, thereby ensuring stable operation of the chip.

[0097] After the structural customization unit is proposed in this application, it is also necessary to add the structural customization unit to the design circuit of the automotive-grade chip. Therefore, this application also provides a circuit design method for an automotive-grade chip.

[0098] Figure 5 A flow chart of a circuit design method for an automotive-grade chip provided in one embodiment of the present application is shown.

[0099] like Figure 5 As shown, the circuit design method of the automotive chip includes the following steps:

[0100] Step 501, obtaining failure index parameters of each functional electronic component in the current circuit to be designed, and determining a plurality of first functional electronic components according to the failure index parameters of each functional electronic component, wherein the first functional electronic component is a functional electronic component whose failure index parameter is greater than a first preset threshold value;

[0101] Step 502, performing a fault technical analysis on a plurality of first functional electronic components to determine coverage of critical paths of the plurality of first functional electronic components;

[0102] Step 503, retrieve at least one customized structural customization unit from the structural customization unit customization pre-stored library, add it to the critical path of the first functional electronic component whose coverage of multiple critical paths is lower than the preset redundant coverage, and obtain the designed circuit. The preset redundant coverage is determined according to the front-end requirements corresponding to the current circuit to be designed.

[0103] In one embodiment, in order to determine each configuration position (critical path) in the circuit to be designed of the automotive chip and add a structural customization unit at each configuration position to obtain the designed circuit, while enhancing the functional safety requirements of the automotive chip, firstly, the preset redundancy coverage of the circuit is determined based on the front-end requirements of the current circuit to be designed, wherein the front-end requirements may refer to functional safety requirements, which is not limited in this application, and then the failure index parameters of each functional electronic component in the circuit to be designed of the automotive chip may be analyzed by the FMEDA algorithm, including single-point failure rate, latent failure rate and random failure rate, wherein the single-point failure rate may be generated according to the following formula:

[0104]

[0105] Where SR,HW represents the safety-related hardware components, λ SPF represents the single point failure rate, λ RF represents the residual failure rate, and λ represents the total failure rate of the component.

[0106] The formula for latent failure rate can be expressed as:

[0107]

[0108] Among them, λ MPF,L represents the potential multi-point failure rate, λ SPF represents the single point failure rate, λ RF Represents the residual failure rate.

[0109] The random failure rate can be expressed as:

[0110] PMHF=∑λ SPF +∑λ RF ∑0.5×λ sm,DPF,latent ×T Lifetime

[0111] Among them, λ SPF represents the single point failure rate, λ RF represents the residual failure rate, λ sm,DPF,latent represents the potential multi-point failure rate, T Lifetime Indicates the life cycle of the product.

[0112] Then, according to the failure indicator parameters corresponding to each functional electronic component, the functional electronic components whose failure indicator parameters are greater than the first preset threshold value are determined, that is, the functional electronic components with a higher failure rate, and then the fault technical analysis (fault tree analysis, Monte Carlo model simulation or fault injection simulation, etc.) of the modules with higher failure rates is performed to obtain the coverage of the critical paths in the functional electronic components with higher failure rates. If the coverage of the acquired critical path is lower than the preset redundant coverage, the above-mentioned critical path is determined as the configuration position of the structural customization unit, and the structural customization unit is added at the configuration position, so as to finally obtain the design circuit of the automotive chip.

[0113] Exemplarily, the structure customization unit provided in this application will be added to functional electronic components in automotive chip design circuits that require data fault tolerance, including but not limited to CRG / special operation unit / cache. For example, in one embodiment, Figure 6 The safety design flow chart of the clock CRG in the automotive chip design circuit shown in the figure describes the safety process of the clock CRG design in the automotive chip design circuit, which is used to ensure that the system meets the requirements of the ASIL level. The specific process steps are as follows: The first step is to decentralize the safety ASIL level. In the design stage, the ASIL level that the system needs to achieve is first determined. This is an initial step to define the system safety requirements. The second step is to conduct hazard analysis and risk assessment to identify potential hazards and risks and assess their possible impact on the system. The third step is to conduct functional safety design. Based on the results of hazard analysis and risk assessment, functional safety design is carried out to determine the required safety functions and measures. The requirements for external interrupts or resets will be considered here. The fourth step is to conduct system development, including the safety splitting of hardware and software to ensure that each part of the system meets the safety requirements. The fifth step is to define the safety of the CRG, define the safety of the CRG part, and subdivide the specific functional requirements of the CRG, including clock gating, clock switching, reset synchronization, etc. The sixth step is to transfer the CRG design and subsystem safety definition. The CRG design and subsystem safety definition are transferred to ensure the consistency and safety of the design of each part. Finally, a structural customization unit is added to improve the fault tolerance and reliability of the system. Among them, clock gating, clock switching, and reset synchronization are the core functional modules of the clock CRG, which are used to control the opening and closing of the clock signal, switch between different clock sources, and synchronize the reset signal. At the same time, specific checks and IO operations are required during the design process to ensure the correctness and security of all functional modules.

[0114] Furthermore, in order to implement the above embodiments, the present application also proposes a design circuit.

[0115] The design circuit proposed in this application is used for automotive-grade chips. The design circuit includes a main board and multiple structural customization units fixed on the main board. The multiple structural customization units are each arranged on the main board in the form of a single pre-customized fixed structure.

[0116] Furthermore, in order to implement the above embodiments, the present application also proposes a vehicle controller device.

[0117] The vehicle controller device proposed in this application includes a controller body and a vehicle-standard chip configured in the controller body, and the vehicle-standard chip is configured with the design circuit proposed in the above embodiment. For example, the above vehicle controller device can be an advanced driver assistance system controller, a window lift controller, and an air conditioning temperature controller.

[0118] Furthermore, in order to implement the above embodiments, the present application also proposes a vehicle.

[0119] The vehicle proposed in the present application includes a vehicle body and a vehicle controller device proposed in the above embodiment built into the vehicle body, and the vehicle controller device is communicatively connected with mechanical components in the vehicle body. For example, the above vehicle can be a new energy vehicle, a hybrid vehicle, a fuel vehicle, etc.

[0120] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0121] Those of ordinary skill in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0122] In the embodiments provided in the present application, it should be understood that the disclosed devices / terminal equipment and methods can be implemented in other ways. For example, the device / terminal equipment embodiments described above are only schematic. For example, the division of the modules or units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0123] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0124] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A structural customization unit for automotive chip, characterized in that: Each of the multiple structural customization units is arranged in the design circuit of the automotive-standard chip in the form of a single predetermined customized fixed structure. The structural customization unit includes: multiple registers and a logic gate device. In the predetermined customized fixed structure, the distance between each register is a predetermined value, and the number of registers is a predetermined number. The number of the structural customization units is determined based on the preset redundant coverage rate of the automotive-standard chip.

2. The structure customization unit according to claim 1, characterized in that: The pre-customized fixed structure is further pre-configured with a substrate contact unit, and the substrate contact unit is respectively configured at the input end and the output end of each register.

3. The structure customization unit according to claim 1, characterized in that: The predetermined value is determined based on the minimum spacing corresponding to multiple preset conditions and the final failure rate of the design circuit of the automotive-grade chip, wherein the final failure rate is determined based on the process influence coefficient of the design circuit of the automotive-grade chip, the preset design redundancy and the baseline failure rate of the design circuit of the automotive-grade chip.

4. The structure customization unit according to claim 2, characterized in that: The predetermined value is greater than or equal to two manufacturing process unit distances.

5. The structure customization unit according to claim 1, characterized in that: The predetermined number is greater than or equal to two.

6. The structure customization unit according to claim 1, characterized in that: The predetermined values ​​corresponding to the plurality of structure customization units in the designed circuit are respectively the same or different, and / or the predetermined quantities corresponding to the plurality of structure customization units are respectively the same or different.

7. A circuit design method for an automotive chip, characterized in that: include: Determining a preset redundancy coverage of the circuit based on the front-end requirements of the circuit to be currently designed; Determine the number and configuration positions of the structure customization units in combination with the preset redundancy coverage rate; At least one customized structure customization unit is retrieved from a structure customization unit customization pre-stored library, and the retrieved structure customization unit is configured on the circuit according to the quantity and the configuration position to obtain a designed circuit.

8. A design circuit, the design circuit is used for a vehicle-grade chip, characterized in that: The designed circuit includes a main board and a plurality of structure customization units fixed on the main board, wherein each of the plurality of structure customization units is arranged on the main board in the form of a single pre-customized fixed structure.

9. A vehicle controller device, characterized in that: It comprises a controller body and a vehicle-standard chip arranged in the controller body, and the vehicle-standard chip is configured with the design circuit as claimed in claim 8.

10. A vehicle, characterized in that: The vehicle controller device comprises a vehicle body and a vehicle controller device as claimed in claim 9 built into the vehicle body, wherein the vehicle controller device is communicatively connected with mechanical components in the vehicle body.

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