Fault tracing method, device and equipment based on ironmaking process and medium

Abstract

The invention relates to the technical field of data processing, in particular to a fault tracing method, device and equipment based on an iron making process and a medium, and the method comprises the steps that when a product abnormal signal is received, the abnormal type is determined based on the product abnormal signal, and abnormal information is determined according to the abnormal type, and the abnormal information comprises abnormal equipment and an abnormal process; obtaining first equipment function information of the abnormal equipment and second equipment function information corresponding to all second equipment, wherein the second equipment is non-abnormal equipment; determining associated second equipment associated with the abnormal equipment based on the first equipment function information and second equipment function information corresponding to all the second equipment; obtaining association degrees corresponding to the abnormal process and all the associated second devices, and determining a target associated second device based on all the association degrees; and determining the abnormal equipment and all target associated second equipment as fault source equipment. According to the invention, the accuracy of the traceability result can be effectively improved.

Description

Technical Field

[0001] The present application relates to the field of data processing technology, and in particular to a fault tracing method, device, equipment and medium based on an ironmaking process. Background Art

[0002] In the development in recent years, the iron-making industry has gradually become an important pillar of the global economy. The iron-making process requires multiple processes such as raw material preparation, iron-making and iron-tapping. Therefore, the corresponding iron-making system includes multiple equipment such as blast furnaces, converters and steam turbines. Different production processes and production equipment affect each other, and product quality is closely related to each production node and production equipment. When a problem occurs in a certain equipment node, it may affect the entire production system. It can be seen that accurate tracing of faults in the iron-making process and timely resolution have an important impact on product quality.

[0003] In the related art, when a product has a problem, the type of product problem is determined, and the target abnormal equipment corresponding to the problem type is determined based on the correspondence between the product problem type and the abnormal equipment. For example, when fatigue cracks occur in finished iron materials, the blast furnace can be determined to be an abnormal equipment based on the above correspondence. At this time, the blast furnace is inspected and maintained. However, the production equipment in the ironmaking system is interrelated and influences each other. Therefore, determining a single faulty equipment based only on the problem type may lead to an incorrect judgment due to fewer considerations. It can be seen that the accuracy of the fault tracing results of the related art is low. Summary of the invention

[0004] In order to improve the accuracy of traceability results, the present invention provides a fault tracing method, device, equipment and medium based on an ironmaking process.

[0005] In a first aspect, the present application provides a fault tracing method based on an ironmaking process, which adopts the following technical solution:

[0006] A fault tracing method based on an ironmaking process, comprising:

[0007] When a product abnormality signal is received, determining an abnormality type based on the product abnormality signal, and determining abnormality information according to the abnormality type, the abnormality information including: abnormal equipment and abnormal process;

[0008] Acquire the first device function information of the abnormal device and the second device function information corresponding to all the second devices, where the second devices are non-abnormal devices;

[0009] Determine, based on the first device function information and the second device function information corresponding to all the second devices, an associated second device associated with the abnormal device;

[0010] Obtaining the correlation degree corresponding to each of the abnormal process and all the associated second devices, and determining the target associated second device based on all the correlation degrees;

[0011] The abnormal device and all the targets are associated with a second device to be determined as a fault source device.

[0012] In a preferred example, the present application may be further configured as follows: the first device function information includes: a first device function attribute and a first sequence value; the second device function information includes: a second device function attribute and a second sequence value; and the determining, based on the first device function information and the second device function information corresponding to each of all the second devices, an associated second device associated with the abnormal device includes:

[0013] Determine, based on the first device function attribute and the second device function attributes corresponding to all the second devices respectively, the first association values ​​corresponding to the abnormal device and all the second devices respectively;

[0014] Determine, based on the first sequence value and the second sequence values ​​corresponding to all the second devices respectively, the second association values ​​corresponding to the abnormal device and all the second devices respectively;

[0015] Determine a comprehensive association value corresponding to each of the abnormal device and all of the second devices based on the first association value corresponding to each of the abnormal device and all of the second devices and the second association value corresponding to each of the abnormal device and all of the second devices;

[0016] Based on all the comprehensive association values ​​and a preset comprehensive association value threshold, an associated second device associated with the abnormal device is determined.

[0017] In a preferred embodiment, the present application may be further configured to determine, based on the first device function attribute and each of the second device function attributes, a first association value between the abnormal device and each of the second devices, including:

[0018] Determining a functional similarity value between the abnormal device and each of the second devices based on the first functional attribute and each of the second functional attributes;

[0019] Based on the first functional attribute and each of the second functional attributes, determining a functional matching value between the abnormal device and each of the second devices;

[0020] Based on the function similarity value and the function matching value, a first association value corresponding to the abnormal device and each of the second devices is determined.

[0021] In a preferred example, the present application may be further configured as follows: after determining the associated second device associated with the abnormal device based on the first device function information and the second device function information corresponding to all the second devices, the associated second device may further include:

[0022] Acquire a first date and a second date corresponding to each of the associated second devices, wherein the first date is the last maintenance date of each of the associated second devices, and the second date is the current date;

[0023] Determining a date difference based on the first date and the second date;

[0024] Obtaining a fault matrix of each of the associated second devices on the first date, and determining a fault probability of each of the associated second devices according to the fault matrix and the date difference,

[0025] Wherein, the fault matrix is ​​determined based on the device status information of the associated second device;

[0026] Determining an initial associated second device from all the associated second devices based on the failure probability corresponding to each of the associated second devices;

[0027] Accordingly, the step of obtaining the correlation degree corresponding to the abnormal process and all the associated second devices includes:

[0028] The correlation degrees corresponding to the abnormal process and all the initially associated second devices are obtained.

[0029] In a preferred embodiment, the present application may be further configured to determine the fault matrix based on the device status information of the associated second device, including:

[0030] Obtaining the equipment status corresponding to each of the third dates in the last maintenance cycle, wherein the last maintenance cycle is the last maintenance cycle corresponding to the maintenance cycle in which the second date is located;

[0031] Mapping all the third dates and all the device states corresponding to the third dates into fault elements;

[0032] A fault sequence is generated based on all the third dates and all the fault elements, and the fault matrix is ​​generated according to the fault elements and the fault sequence.

[0033] In a preferred embodiment of the present application, the fault element may be further configured as follows: the fault element includes a first fault element corresponding to a normal state and a second fault element corresponding to a fault state; and generating the fault matrix according to the fault elements and the fault sequence includes:

[0034] generating a plurality of fault element groups based on the first fault element and the second fault element;

[0035] For each of the fault element groups, determining an associated fault element group corresponding to the fault element group;

[0036] Determining a first quantity value of each of the faulty element groups and a second quantity value of the corresponding associated faulty element group based on the fault sequence;

[0037] The fault matrix is ​​generated according to the first quantity value and the second quantity value.

[0038] In a preferred embodiment, the present application may be further configured as follows: after associating the abnormal device and all the targets with a second device and determining the device as a fault source device, the configuration further includes:

[0039] For each of the fault source devices, obtain a plurality of operation data, a maintenance time period and a device identifier corresponding to the fault source device;

[0040] Determine the abnormality level of the fault source device based on all the operation data;

[0041] Acquire some maintenance personnel information corresponding to the fault source equipment, wherein the maintenance personnel information includes: idle time period and repairable fault level;

[0042] Determine a target maintenance personnel based on the abnormality level, the waiting maintenance period, the idle period and the repairable fault level, and have the target maintenance personnel repair the fault source equipment;

[0043] A maintenance signal is generated based on the device identification, and the maintenance signal is sent to the target maintenance personnel side device.

[0044] In a second aspect, the present application provides a fault tracing device based on an ironmaking process, which adopts the following technical solution:

[0045] A fault tracing device based on an ironmaking process, comprising:

[0046] An abnormal information determination module is used to determine the abnormal type based on the product abnormal signal when receiving the product abnormal signal, and determine the abnormal information according to the abnormal type, wherein the abnormal information includes: abnormal equipment and abnormal process;

[0047] A first acquisition module, configured to acquire first device function information of the abnormal device and second device function information corresponding to all second devices, wherein the second devices are non-abnormal devices;

[0048] an associated second device determining module, configured to determine an associated second device associated with the abnormal device based on the first device function information and the second device function information corresponding to each of all the second devices;

[0049] A second acquisition module is used to acquire the correlation degree corresponding to the abnormal process and all the associated second devices, and determine the target associated second device based on all the correlation degrees;

[0050] The fault source device determination module is used to associate the abnormal device and all the target second devices to determine them as fault source devices.

[0051] In a third aspect, the present application provides an electronic device, which adopts the following technical solution:

[0052] at least one processor;

[0053] Memory;

[0054] At least one application, wherein at least one application is stored therein and configured to be executed by at least one processor, and the at least one application is configured to: execute the fault tracing method based on the ironmaking process as described in any one of the first aspects.

[0055] In a fourth aspect, the present application provides a computer-readable storage medium, which adopts the following technical solution:

[0056] A computer-readable storage medium having a computer program stored thereon, which, when executed in a computer, causes the computer to execute the fault tracing method based on an ironmaking process as described in any one of the first aspects.

[0057] In summary, this application includes the following beneficial technical effects:

[0058] When a product abnormality signal is received, the abnormal device is determined according to the abnormality type to achieve the initial screening of the faulty device according to the abnormality type; in actual production, the devices cooperate with each other to produce together, and the functions of the abnormal device and the associated device are similar or complementary, so a more accurate associated second device can be determined according to the first device function information and the second device function information; then the correlation between the abnormal process and the associated second device is obtained, and the target associated second device is determined according to the correlation, so as to screen the associated second device again from the process perspective. Different processes require different equipment, that is, the correlation between different processes and equipment is also different, so the target associated second device is determined from the process dimension to effectively improve the accuracy of the target associated second device; then the accurate abnormal device and the target associated second device are determined as the fault source device; compared with the related art that directly determines the faulty device according to the abnormality type, the present application determines the accurate target associated second device from the perspective of the overall ironmaking and the correlation on the basis of determining the abnormal device, and then determines the accurate target associated second device and the abnormal device as the fault source device, so as to achieve the purpose of accurate tracing, realize the technical effect of improving the accuracy of the traceability result, and solve the technical problem of poor accuracy of the traceability result in the related art. BRIEF DESCRIPTION OF THE DRAWINGS

[0059] Figure 1 An interactive diagram of a fault tracing scenario based on an ironmaking process is provided in an embodiment of the present application.

[0060] Figure 2 A flow chart of a fault tracing method based on an ironmaking process provided in an embodiment of the present application.

[0061] Figure 3 A schematic structural diagram of a fault tracing device based on an ironmaking process provided in an embodiment of the present application.

[0062] Figure 4 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0063] The following is combined with Figure 1 To Attachment Figure 4 This application is described in further detail.

[0064] After reading this specification, those skilled in the art may make non-creative modifications to this embodiment as needed, but such modifications are protected by patent law as long as they are within the scope of the claims of this application.

[0065] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0066] In addition, the term "and / or" in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article, unless otherwise specified, generally means that the associated objects before and after are in an "or" relationship.

[0067] The embodiments of the present application are further described in detail below in conjunction with the drawings in the specification.

[0068] like Figure 1 As shown is an interactive schematic diagram of a fault tracing scenario based on the ironmaking process provided in an embodiment of the present application. When the quality inspector finds that there is a problem with the product, the device on the quality inspector side generates a product abnormality signal and sends it to the electronic device. When the electronic device receives the product abnormality signal, the electronic device determines the abnormal information and obtains the first device function and the second device function from the data storage device. By analyzing the first device function and the second device function, the fault source device is determined.

[0069] The embodiment of the present application provides a fault tracing method based on the ironmaking process, which is executed by an electronic device, such as Figure 2 As shown, the method includes step S101, step S102, step S103, step S104 and step S105, wherein:

[0070] Step S101: when a product abnormality signal is received, the abnormality type is determined based on the product abnormality signal, and abnormality information is determined according to the abnormality type, wherein the abnormality information includes abnormal equipment and abnormal process.

[0071] Specifically, the abnormal type can be multiple types such as chemical composition abnormality or inclusion abnormality, which are not limited in the embodiments of the present application; the product abnormal signal can be in text form, such as: pig iron has chemical composition abnormality. The abnormal information corresponding to the abnormal type can be determined according to the preset correspondence between the abnormal type and the abnormal information, and the above correspondence is set by the technicians based on their work experience; the abnormal process characterizes the process of non-standard operation or process in the process of refining pig iron; it can be understood that in actual production, different equipment or process abnormalities will cause different problems in the product, that is, different abnormal types, so more accurate abnormal information can be obtained according to the abnormal type.

[0072] Step S102: Acquire the first device function information of the abnormal device and the second device function information corresponding to all second devices, where the second device is a non-abnormal device.

[0073] Specifically, the second device is all devices except abnormal devices; the first device function information and the second device function information can be obtained from the device function information library, the first device function information includes: the first device function attribute and the first sequence value, and the second device function information includes: the second device function attribute and the second sequence value. The first sequence value corresponding to the first device function is determined according to the layout sequence corresponding to the abnormal device, and the second sequence value corresponding to the second device function is determined according to the layout sequence corresponding to the second device. It can be understood that when the layout sequences corresponding to the device functions are adjacent, the probability of mutual influence is greater, so it can be considered from the device sequence dimension; in the embodiment of the present application, the device function attribute is used to describe in detail the specific operation content of the device in production, and the above-mentioned device function attribute is the first device function attribute or the second device function attribute.

[0074] Step S103: Determine an associated second device associated with the abnormal device based on the first device function information and the second device function information corresponding to all the second devices.

[0075] Specifically, based on the first device function information and the second device function information corresponding to all the second devices, determining the associated second device associated with the abnormal device includes:

[0076] Determine, based on the first device function attribute and the second device function attributes corresponding to all the second devices, first association values ​​corresponding to the abnormal device and all the second devices respectively;

[0077] Determine, based on the first sequence value and the second sequence values ​​corresponding to all the second devices, second association values ​​corresponding to the abnormal device and all the second devices respectively;

[0078] Determine a comprehensive association value corresponding to each of the abnormal device and all the second devices based on the first association value corresponding to each of the abnormal device and all the second devices and the second association value corresponding to each of the abnormal device and all the second devices;

[0079] Based on all the comprehensive association values ​​and the preset comprehensive association value threshold, an associated second device associated with the abnormal device is determined.

[0080] Specifically, the specific process of determining the first association value corresponding to the abnormal device and all the second devices according to the functional attributes of the first device and the functional attributes of the second devices corresponding to all the second devices can refer to the following embodiments. The process of determining the second association value includes: calculating the sequence value difference between the first sequence value and each second sequence value, and determining the second association value corresponding to the sequence value difference according to the correspondence between the preset difference and the association value. In the embodiment of the present application, the larger the sequence value difference, the smaller the second association value. When the correlation between the second device and the abnormal device is smaller, the second association value is smaller, that is, when the second device is abnormal, the probability of the abnormal device being abnormal is smaller, or, the probability of the abnormal device being abnormal at the same time as the abnormal device is abnormal is smaller. The specific process of determining the comprehensive association value includes: obtaining a first weight value corresponding to the first association value and a second weight value corresponding to the second association value, and then calculating the comprehensive association value according to the calculation formula, the calculation formula is: comprehensive association value = first weight value * first association value + second weight value * second association value; then comparing the comprehensive association value corresponding to each second device with the preset comprehensive association value threshold, and determining the second device corresponding to the comprehensive association value greater than the preset comprehensive association value threshold as the associated second device, wherein the first weight value, the second weight value and the preset comprehensive association value threshold are all preset by the technician. It can be understood that when a certain device is abnormal, it may cause other devices to be abnormal, and when other devices are abnormal, it may also cause the device to be abnormal, so it is necessary to determine the associated devices of the abnormal device, and then comprehensively repair the abnormal device and the associated devices to effectively improve the maintenance effect. Considering the two dimensions of equipment functional attributes and layout order can obtain a more comprehensive and objective association value result, and different dimensions have different importance to the comprehensive association value, so introducing weight values ​​can obtain a more accurate comprehensive association value.

[0081] Based on the above embodiment, in the ironmaking process, due to the different functions of the equipment, each device needs to cooperate with each other, and thus a more accurate first association value can be obtained according to the first device function attribute and the second device function attribute; the first sequence value and the second sequence value are obtained, and when a certain device is abnormal, the probability of abnormality of its adjacent devices is greater, and thus a more accurate second association value can be obtained according to the first sequence value and the second sequence value.

[0082] Further, based on the first device function attribute and each second device function attribute, determining a first association value between the abnormal device and each second device includes:

[0083] Determining a functional similarity value between the abnormal device and each second device based on the first functional attribute and each second functional attribute;

[0084] Determining a function matching value between the abnormal device and each second device based on the first function attribute and each second function attribute;

[0085] Based on the function similarity value and the function matching value, a first association value corresponding to the abnormal device and each second device is determined.

[0086] Specifically, when the first functional attribute is more similar to the second functional attribute, the probability that the abnormal device corresponding to the functional attribute of the first device and the second device corresponding to the functional attribute of the second device are abnormal at the same time is higher, and the functional similarity value is also higher. For example, the hot blast furnace and the electric furnace in the ironmaking system have functional attributes of providing high-temperature heat sources; the functional attributes corresponding to the vibrating screen and the drum screen are screening. The similarity of the first functional attribute and the second functional attribute can be determined by the semantic similarity algorithm, and the similarity is determined as the functional similarity value. The embodiment of the present application does not limit the specific process of determining the similarity by the semantic similarity algorithm. The specific process of determining the functional matching value includes: determining the target matching second functional attribute corresponding to the first functional attribute based on the preset corresponding relationship and the first functional attribute. When the second functional attribute of the second device is the same as the target matching second functional attribute, the corresponding functional matching value is determined to be the preset first matching value, that is, indicating that the second device corresponding to the second functional attribute is complementary to the abnormal device, otherwise, the corresponding functional matching value is determined to be the preset second matching value; in the embodiment of the present application, the preset corresponding relationship includes multiple first functional attributes and their corresponding matching second functional attributes, the preset first matching value is 100, and the preset second matching value is 0. The specific process of determining the first association value includes: obtaining a third weight value corresponding to the functional similarity value and a fourth weight value corresponding to the functional matching value, and then determining the first association value according to a calculation formula, the calculation formula is: first association value = functional similarity value * third weight value + functional matching value * fourth weight value, the third weight value and the fourth weight value are both set by technical personnel based on work experience.

[0087] Based on the above embodiment, a first functional attribute corresponding to the first device function and a second functional attribute corresponding to the second device function are obtained. The functional attributes are used to describe the specific operation of the equipment in detail. Therefore, a more accurate functional similarity value and a more accurate functional matching value can be determined based on the first functional attribute and the second functional attribute. In the ironmaking process, functionally similar devices have a greater probability of simultaneously experiencing abnormalities. When a certain device is abnormal, the device with complementary functions is more likely to be affected and has a greater probability of abnormality. Therefore, the first associated value is determined from two dimensions, namely, the functional similarity dimension and the functional matching dimension, to effectively improve the accuracy of determining the first associated value.

[0088] Step S104: Obtain the correlation degrees corresponding to the abnormal process and all associated second devices, and determine the target associated second device according to the correlation degrees.

[0089] Specifically, the correlation degree can be obtained from a preset correlation information library. In the ironmaking process, each ironmaking process corresponds to multiple equipment, and the correlation degree between the same process and different equipment is different; when the equipment is abnormal, the corresponding process has a greater probability of abnormality, so the equipment can be accurately verified from the abnormal process dimension. The process of determining the target associated second device includes: comparing the correlation degrees corresponding to all associated second devices with the preset correlation threshold, and determining the associated second device corresponding to the correlation degree greater than the preset correlation threshold as the target associated second device. The preset correlation threshold is set by the technician based on work experience. It can be understood that the target associated second device is determined according to the correlation degree between the abnormal process equipment, which realizes the verification of the associated second device from the abnormal process dimension, so as to effectively improve the accuracy of the determination of the target associated second device. In the embodiment of the present application, the target associated second device can be one or more.

[0090] Step S105: associate the abnormal device and all targets with the second device and determine them as the fault source device.

[0091] Specifically, the abnormal device and the target-associated second device are determined to be fault source devices. Further, a maintenance signal can be generated based on the fault source device to promptly repair the fault source device.

[0092] It can be understood that in the embodiment of the present application, the layout order of equipment = physical order, the equipment attributes = specific operation content of the equipment = logical order. It is assumed that the ironmaking process of the ironmaking plant includes three processes ABC, which correspond to three equipment a, b, and c respectively. In the production process (i.e., the logical order), process A is performed first, then process B, and finally process C; however, the equipment sequence numbers corresponding to the layout order (i.e., the physical order) are not necessarily adjacent, and the equipment sequence numbers corresponding to a, b, and c may be 9, 1, and 5 respectively. Therefore, the layout order of the equipment and the functional attributes of the equipment are essentially different; the abnormal process and the production process (i.e., the functional attributes of the equipment) are essentially the same, but when determining the target-associated second equipment based on the abnormal process, the abnormal process has a greater impact, which is equivalent to when determining the target-associated second equipment, the existence of abnormal production processes in multiple production processes has a greater impact on determining the target-associated second equipment.

[0093] Based on the above embodiment, when a product abnormality signal is received, the abnormal device is determined according to the abnormality type to achieve the initial screening of the faulty device according to the abnormality type; in actual production, the devices cooperate with each other to produce together, and the device functions corresponding to the abnormal device and the associated device are similar or complementary, so a more accurate associated second device can be determined according to the first device function and the second device function; then the correlation between the abnormal process and the associated second device is obtained, and the target associated second device is determined according to the correlation, so as to screen the associated second device again from the process perspective. Different processes require different equipment, that is, the correlation between different processes and equipment is also different, so the target associated second device is determined from the process dimension to effectively improve the accuracy of the target associated second device; then the accurate abnormal device and the target associated second device are determined as the fault source device; compared with the related art that directly determines the faulty device according to the abnormality type, the present application determines the accurate target associated second device from the perspective of the overall ironmaking and the correlation on the basis of determining the abnormal device, and then determines the accurate target associated second device and the abnormal device as the fault source device, so as to achieve the purpose of accurate tracing, achieve the technical effect of improving the accuracy of the traceability result, and solve the technical problem of poor accuracy of the traceability result in the related art.

[0094] Further, in the embodiment of the present application, after determining the associated second device associated with the abnormal device based on the first device function information and the second device function information corresponding to all the second devices, the method further includes:

[0095] Obtain a first date and a second date corresponding to each associated second device, where the first date is the last maintenance date of each associated second device, and the second date is the current date;

[0096] Based on the first date and the second date, determining a date difference;

[0097] Obtaining a fault matrix of each associated second device on the first date, and determining a fault probability of each associated second device according to the fault matrix and the date difference,

[0098] Wherein, the fault matrix is ​​determined based on device status information associated with the second device;

[0099] Determining an initial associated second device from all associated second devices based on the failure probability corresponding to each associated second device;

[0100] Accordingly, obtaining the correlation degree corresponding to the abnormal process and all the associated second devices respectively includes:

[0101] The correlation degrees corresponding to the abnormal process and all the initially associated second devices are obtained.

[0102] Specifically, the first date and the second date can be obtained from the electronic clock, wherein the second date is the current date, and the first date is the end date of the previous maintenance cycle of the maintenance cycle in which the second date is located. For example, if the second date is March 11, 2024, and the second date is within the second maintenance cycle (the second maintenance cycle is February 5, 2024-April 25, 2024), then the first date is within the first maintenance cycle. When the first maintenance cycle is January 2, 2024-February 4, 2024, the first date is February 4, 2024; the date difference can be determined according to the calculation formula, Δt=t1-t2, Δt is the date difference, t1 is the first date, and t2 is the second date; the acquisition of the fault matrix associated with the second device on the first date can refer to the following embodiment. Determining the fault probability of the associated second device according to the fault matrix and the date difference includes: first: calculating the second fault matrix (i.e., the fault matrix associated with the second device at the first date), the date difference and the fault matrix calculation formula to obtain the second fault matrix (i.e., the fault matrix corresponding to the second device associated with the second date), the calculation formula is: Among them, P0 is the first fault matrix (the fault matrix associated with the second device on the first date), the order of P0 is 1, P Δt is the second fault matrix (the fault matrix associated with the second device at the current date), P Δt The order of is Δt, is the third fault matrix (the fault matrix of the associated second device on the day before the current date), The order is Δt-1. Second: obtain the device status of the second device associated with the first date, and determine the fault probability according to the device status and the second fault matrix; in the embodiment of the present application, the second fault matrix includes four values, namely, the first fault probability, the second fault probability, the third fault probability and the fourth fault probability. For example, when When P 00 is the first failure probability, P 01 is the second failure probability, P 10 is the third failure probability, P 11 is the fourth fault probability, “0” indicates that the device is in a normal state, “1” indicates that the device is in a fault state, P 00 represents the probability that the second device status associated with the first date is normal and the second device status associated with the second date is normal, P 01 is the probability that the second device status associated with the first date is normal and the second device status associated with the second date is faulty, P 10 P is the probability that the second device status associated with the first date is a device failure and the second device status associated with the second date is a normal device; 11is the probability that the second device status associated with the first date is device failure, and the second device status associated with the second date is device failure; therefore, when the second device status associated with the first date is normal, the above failure probability is P 01 , when the second device status associated with the first date is device failure, the above failure probability is P 11 It is understandable that as the date changes, the values ​​in the fault matrix also change, so there are multiple fault matrices.

[0103] Based on the above embodiment, the fault matrix of the associated second device, the first date and the second date are obtained, and the date difference is determined, that is, the probability of the associated second device failure changes with the change of the date difference, that is, the failure probability of the associated second device is random, and thus the failure matrix in the Markov chain is used to determine the failure probability of the associated second device to effectively improve the accuracy of determining the failure probability; on the basis of obtaining the accurate failure probability, the initial associated second device is determined by comprehensively considering the failure probabilities corresponding to all maintenance cycles to effectively improve the accuracy of determining the initial associated second device.

[0104] Further, in the embodiment of the present application, determining the fault matrix based on the device status information associated with the second device includes:

[0105] Obtain the equipment status corresponding to each of the third dates in the last maintenance cycle, where the last maintenance cycle is the last maintenance cycle corresponding to the maintenance cycle in which the second date is located;

[0106] Mapping all third dates and all equipment states corresponding to the third dates into fault elements;

[0107] generating a fault sequence based on all third dates and all fault elements, and generating a fault matrix based on the fault elements and the fault sequence;

[0108] The fault element includes a first fault element corresponding to a normal state and a second fault element corresponding to a fault state, and a fault matrix is ​​generated according to the fault element and the fault sequence, including:

[0109] Based on the first fault element and the second fault element, generating a plurality of fault element groups;

[0110] For each fault element group, determining an associated fault element group corresponding to the fault element group;

[0111] Determining a first quantity value of each faulty element group and a second quantity value of each corresponding associated faulty element group based on the fault sequence;

[0112] A fault matrix is ​​generated based on the first quantity value and the second quantity value.

[0113] Specifically, the third date is a date within the previous maintenance cycle. For example, taking the previous maintenance cycle of January 28 to February 4 as an example, the third date is January 28, January 29, January 30, January 31, February 1, February 2, February 3, and February 4. The fault element includes a first fault element corresponding to a normal state and a second fault element corresponding to a fault state. The first fault element is 0, and the second fault element is 1. If within the above maintenance cycle of January 28 to February 4, the device states of the associated second device are: normal equipment on January 28, faulty equipment on January 29, faulty equipment on January 30, faulty equipment on January 31, normal equipment on February 1, faulty equipment on February 2, normal equipment on February 3, and normal equipment on February 4, then the corresponding fault sequence is 01110100. The process of generating a fault element group based on the first fault element and the second fault element includes: combining the first fault element and the second fault element in pairs to generate four fault element groups, namely, the first fault element group 00, the second fault element group 01, the third fault element group 10 and the fourth fault element group 11; the first value and the second value in the fault element group both represent the device status of the associated second device; the associated fault element group can be determined based on the first value in the fault element group. For example, taking the above-mentioned first fault element group as an example, the first value in the first fault element group is 0, then when the first value in a certain fault element group is 0, the fault element group is the associated fault element group of the first fault element group, that is, the second fault element group is the associated fault element group of the first fault element group. Taking the above-mentioned fault sequence as an example: the first quantity value C of the first fault element group 00 00 =1, C represents that the frequency of occurrence of "00" is 1, and the second quantity value C of the corresponding associated fault element group (i.e., the second fault element group 01) 01 =2, indicating that the frequency of occurrence of "01" is 2; the first quantity value C of the third fault element group 10 10 =2, indicating that the frequency of occurrence of "10" is 2, and the second quantity value C of the corresponding associated fault element group (the fourth fault element group 11) 11 =2, indicating that the frequency of occurrence of "11" is 1; the process of generating the first fault matrix (i.e., the fault matrix associated with the second device on the first date) includes: generating the first matrix element according to all the first quantity values ​​and the second quantity values, i.e. Then, based on all the first matrix elements, a first fault matrix is ​​generated, that is, a fault matrix associated with the second device at the first date, that is, a fault matrix

[0114] Based on the above embodiment, all third dates and their corresponding equipment states are mapped to fault elements to facilitate quick identification and understanding of different equipment states on different dates; then a fault sequence is generated based on the date and the fault elements, and a fault matrix is ​​generated based on the fault elements and the fault sequence, so as to effectively improve the efficiency of generating the fault matrix.

[0115] Furthermore, in the embodiment of the present application, after associating the abnormal device and all targets with the second device and determining the device as the fault source device, the method further includes:

[0116] For each fault source device, obtain multiple operation data, maintenance time period and device identification corresponding to the fault source device;

[0117] Determine the abnormality level of the fault source equipment based on all operating data;

[0118] Acquire some maintenance personnel information corresponding to the fault source equipment, the maintenance personnel information including: idle time period and repairable fault level;

[0119] Based on the abnormality level, maintenance period, idle period and repairable fault level, the target maintenance personnel are determined, and the target maintenance personnel repair the fault source equipment;

[0120] A maintenance signal is generated based on the device identification, and the maintenance signal is sent to the target maintenance personnel side device.

[0121] Specifically, the operation data, the waiting maintenance period, the equipment identification and the maintenance personnel information can be obtained from the fault source equipment data information library. The waiting maintenance period is determined based on the current time and the preset maintenance interval duration. The preset maintenance interval duration is set by the technician based on work experience; the repairable fault level indicates that the maintenance personnel can handle the fault corresponding to the fault level. When the repairable fault level of the maintenance personnel is less than the fault level, the maintenance personnel cannot solve the fault of the fault source equipment. In the embodiment of the present application, the operation data can be the production efficiency data, pressure data, temperature data or energy consumption data of the fault source equipment; the process of determining the abnormal level according to the operation data includes: calculating the data difference between the current operation data and the preset operation data; determining the abnormal level of the fault source equipment according to the corresponding relationship between the preset data difference and the abnormal level and the average data difference. The process of determining the target maintenance personnel includes: matching the abnormal level with the repairable fault level, determining that the repairable fault level is not less than the initial maintenance personnel corresponding to the abnormal level, matching the idle time period of the initial maintenance personnel with the waiting maintenance period, and determining the target maintenance personnel, wherein the waiting maintenance period is within the idle time period of the target maintenance personnel. It can be understood that by determining the target maintenance personnel through the abnormality level and the maintenance period, the target maintenance personnel can repair the fault source equipment in time; the maintenance signal can be in the form of text or voice signal to remind the maintenance personnel.

[0122] Based on the above embodiment, the equipment operation data, the maintenance period and the equipment identification are obtained, and the abnormality level is determined according to the operation data, so that maintenance personnel can be selected in a targeted manner from the abnormality level dimension to avoid the phenomenon of incomplete maintenance by maintenance personnel; and the target maintenance personnel are determined according to the abnormality level, maintenance period, idle period and repairable fault level to ensure that the target maintenance personnel can repair the fault source equipment in time, thereby effectively improving the maintenance efficiency and avoiding secondary maintenance.

[0123] The above embodiment introduces a fault tracing method based on the ironmaking process from the perspective of the method flow, and the following embodiment introduces a fault tracing device based on the ironmaking process from the perspective of a virtual module or a virtual unit. For details, please refer to the following embodiment.

[0124] The present application embodiment provides a fault tracing device based on the ironmaking process, such as Figure 3 As shown, the fault tracing device based on the ironmaking process may specifically include:

[0125] The abnormal information determination module 201 is used to determine the abnormal type based on the product abnormal signal when receiving the product abnormal signal, and determine the abnormal information according to the abnormal type, and the abnormal information includes: abnormal equipment and abnormal process;

[0126] A first acquisition module 202 is used to acquire first device function information of an abnormal device and second device function information corresponding to all second devices, where the second device is a non-abnormal device;

[0127] An associated second device determining module 203, configured to determine an associated second device associated with the abnormal device based on the first device function information and the second device function information corresponding to all the second devices;

[0128] The second acquisition module 204 is used to acquire the correlation degrees corresponding to the abnormal process and all the associated second devices, and determine the target associated second device based on all the correlation degrees;

[0129] The fault source device determination module 205 is used to associate the abnormal device and all targets with the second device and determine them as the fault source device.

[0130] In a possible implementation manner of the embodiment of the present application, the first device function information includes: a first device function attribute and a first sequence value, the second device function information includes: a second device function attribute and a second sequence value, and the associated second device determination module 203 determines the associated second device associated with the abnormal device based on the first device function information and the second device function information corresponding to all the second devices, for:

[0131] Determine, based on the first device function attribute and the second device function attributes corresponding to all the second devices, first association values ​​corresponding to the abnormal device and all the second devices respectively;

[0132] Determine, based on the first sequence value and the second sequence values ​​corresponding to all the second devices, second association values ​​corresponding to the abnormal device and all the second devices respectively;

[0133] Determine a comprehensive association value corresponding to each of the abnormal device and all the second devices based on the first association value corresponding to each of the abnormal device and all the second devices and the second association value corresponding to each of the abnormal device and all the second devices;

[0134] Based on all the comprehensive association values ​​and the preset comprehensive association value threshold, an associated second device associated with the abnormal device is determined.

[0135] In a possible implementation of the embodiment of the present application, when the associated second device determination module 203 determines the first association value between the abnormal device and each second device based on the first device function attribute and each second device function attribute, it is used to:

[0136] Determining a functional similarity value between the abnormal device and each second device based on the first functional attribute and each second functional attribute;

[0137] Determining a function matching value between the abnormal device and each second device based on the first function attribute and each second function attribute;

[0138] Based on the function similarity value and the function matching value, a first association value corresponding to the abnormal device and each second device is determined.

[0139] A possible implementation of the embodiment of the present application is a fault tracing device based on an ironmaking process, further comprising:

[0140] The initial association second device determination module is used to:

[0141] Obtain a first date and a second date corresponding to each associated second device, where the first date is the last maintenance date of each associated second device, and the second date is the current date;

[0142] Based on the first date and the second date, determining a date difference;

[0143] Obtaining a fault matrix of each associated second device on the first date, and determining a fault probability of each associated second device according to the fault matrix and the date difference,

[0144] Wherein, the fault matrix is ​​determined based on device status information associated with the second device;

[0145] Determining an initial associated second device from all associated second devices based on a failure probability corresponding to each associated second device;

[0146] Accordingly, when the second acquisition module 204 acquires the correlation degrees corresponding to the abnormal process and all the associated second devices, it is used to:

[0147] The correlation degrees corresponding to the abnormal process and all the initially associated second devices are obtained.

[0148] In a possible implementation manner of the embodiment of the present application, when the initial associated second device determination module determines the fault matrix based on the device state information of the associated second device, it is used to:

[0149] Obtain the equipment status corresponding to each of the third dates in the last maintenance cycle, where the last maintenance cycle is the last maintenance cycle corresponding to the maintenance cycle in which the second date is located;

[0150] Mapping all third dates and all equipment states corresponding to the third dates into fault elements;

[0151] A fault sequence is generated based on all third dates and all fault elements, and a fault matrix is ​​generated based on the fault elements and the fault sequence.

[0152] In a possible implementation manner of the embodiment of the present application, the fault element includes a first fault element corresponding to a normal state and a second fault element corresponding to a fault state, and the initial association second device determination module is used to generate a fault matrix according to the fault element and the fault sequence when executing:

[0153] Based on the first fault element and the second fault element, generating a plurality of fault element groups;

[0154] For each fault element group, determining an associated fault element group corresponding to the fault element group;

[0155] Determining a first quantity value for each faulty element group and a corresponding second quantity value for the associated faulty element group based on the fault sequence;

[0156] A fault matrix is ​​generated based on the first quantity value and the second quantity value.

[0157] A possible implementation of the embodiment of the present application is a fault tracing device based on an ironmaking process, further comprising:

[0158] Maintenance signal generation module for:

[0159] For each fault source device, obtain multiple operation data, maintenance time period and device identification corresponding to the fault source device;

[0160] Determine the abnormality level of the fault source equipment based on all operating data;

[0161] Acquire some maintenance personnel information corresponding to the fault source equipment, the maintenance personnel information including: idle time period and repairable fault level;

[0162] Based on the abnormality level, maintenance period, idle period and repairable fault level, the target maintenance personnel are determined, and the target maintenance personnel repair the fault source equipment;

[0163] A maintenance signal is generated based on the device identification, and the maintenance signal is sent to the target maintenance personnel side device.

[0164] Technicians in the relevant field can clearly understand that, for the convenience and simplicity of description, the specific working process of the fault tracing device based on the ironmaking process described above can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here.

[0165] An electronic device is provided in an embodiment of the present application, such as Figure 4 As shown, Figure 4 The electronic device shown includes: a processor 301 and a memory 303. The processor 301 and the memory 303 are connected, such as through a bus 302. Optionally, the electronic device may further include a transceiver 304. It should be noted that in actual applications, the transceiver 304 is not limited to one, and the structure of the electronic device does not constitute a limitation on the embodiments of the present application.

[0166] The processor 301 may be a CPU (Central Processing Unit), a general-purpose processor, a DSP (Digital Signal Processor), an ASIC (Application Specific Integrated Circuit), an FPGA (Field Programmable Gate Array) or other programmable logic devices, transistor logic devices, hardware components or any combination thereof. It may implement or execute various exemplary logic blocks, modules and circuits described in conjunction with the disclosure of this application. The processor 301 may also be a combination that implements computing functions, such as a combination of one or more microprocessors, a combination of a DSP and a microprocessor, etc.

[0167] The bus 302 may include a path to transmit information between the above components. The bus 302 may be a PCI (Peripheral Component Interconnect) bus or an EISA (Extended Industry Standard Architecture) bus. The bus 302 may be divided into an address bus, a data bus, a control bus, etc. For ease of representation, Figure 4 Only one thick line is used in the diagram, but it does not mean that there is only one bus or only one type of bus.

[0168] The memory 303 can be a ROM (Read Only Memory) or other types of static storage devices that can store static information and instructions, a RAM (Random Access Memory) or other types of dynamic storage devices that can store information and instructions, or an EEPROM (Electrically Erasable Programmable Read Only Memory), a CD-ROM (Compact Disc Read Only Memory) or other optical disk storage, optical disk storage (including compressed optical disk, laser disk, optical disk, digital versatile disk, Blu-ray disk, etc.), a magnetic disk storage medium or other magnetic storage device, or any other medium that can be used to carry or store the desired program code in the form of instructions or data structures and can be accessed by a computer, but is not limited to these.

[0169] The memory 303 is used to store the application code for executing the solution of the present application, and the execution is controlled by the processor 301. The processor 301 is used to execute the application code stored in the memory 303 to implement the contents shown in the above method embodiment.

[0170] The electronic devices include, but are not limited to, mobile terminals such as mobile phones, laptop computers, digital broadcast receivers, PDAs (personal digital assistants), PADs (tablet computers), PMPs (portable multimedia players), vehicle-mounted terminals (such as vehicle-mounted navigation terminals), and fixed terminals such as digital TVs, desktop computers, etc. It can also be a server, etc. Figure 4 The electronic device shown is merely an example and should not bring any limitation to the functions and scope of use of the embodiments of the present application.

[0171] The above are only some implementation methods of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications should also be regarded as the scope of protection of the present application.

[0172] The present application embodiment provides a computer-readable storage medium, on which a computer program is stored, and when it is run on a computer, the computer can execute the corresponding content in the aforementioned method embodiment. It should be understood that although the various steps in the flowchart of the accompanying drawings are displayed in sequence according to the instructions of the arrows, these steps are not necessarily executed in sequence in the order indicated by the arrows. Unless clearly stated in this article, the execution of these steps is not strictly limited in order, and it can be executed in other orders. Moreover, at least a part of the steps in the flowchart of the accompanying drawings may include multiple sub-steps or multiple stages, and these sub-steps or stages are not necessarily executed at the same time, but can be executed at different times, and their execution order is not necessarily carried out in sequence, but can be executed in turn or alternately with other steps or at least a part of the sub-steps or stages of other steps.

[0173] The above description is only a partial implementation method of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications should also be regarded as the scope of protection of the present application.

Claims

1. A fault tracing method based on an ironmaking process, comprising: When a product abnormality signal is received, determining an abnormality type based on the product abnormality signal, and determining abnormality information according to the abnormality type, the abnormality information including: abnormal equipment and abnormal process; Acquire the first device function information of the abnormal device and the second device function information corresponding to all the second devices, where the second devices are non-abnormal devices; Determine, based on the first device function information and the second device function information corresponding to each of all the second devices, an associated second device associated with the abnormal device; Obtaining the correlation degree corresponding to each of the abnormal process and all the associated second devices, and determining the target associated second device based on all the correlation degrees; The abnormal device and all the targets are associated with a second device to be determined as a fault source device.

2. The fault tracing method based on the ironmaking process according to claim 1 is characterized in that: The first device function information includes: a first device function attribute and a first sequence value, and the second device function information includes: a second device function attribute and a second sequence value, The determining, based on the first device function information and the second device function information corresponding to all the second devices, an associated second device associated with the abnormal device includes: Determine, based on the first device function attribute and the second device function attributes corresponding to all the second devices respectively, the first association values ​​corresponding to the abnormal device and all the second devices respectively; Determine, based on the first sequence value and the second sequence values ​​corresponding to all the second devices respectively, the second association values ​​corresponding to the abnormal device and all the second devices respectively; Determine a comprehensive association value corresponding to each of the abnormal device and all of the second devices based on the first association value corresponding to each of the abnormal device and all of the second devices and the second association value corresponding to each of the abnormal device and all of the second devices; Based on all the comprehensive association values ​​and a preset comprehensive association value threshold, an associated second device associated with the abnormal device is determined.

3. The fault tracing method based on the ironmaking process according to claim 2 is characterized in that: Determining a first association value between the abnormal device and each of the second devices based on the first device function attribute and each of the second device function attributes includes: Determining a functional similarity value between the abnormal device and each of the second devices based on the first functional attribute and each of the second functional attributes; Based on the first functional attribute and each of the second functional attributes, determining a functional matching value between the abnormal device and each of the second devices; Based on the function similarity value and the function matching value, a first association value corresponding to the abnormal device and each of the second devices is determined.

4. The fault tracing method based on the ironmaking process according to claim 1 is characterized in that: After determining the associated second device associated with the abnormal device based on the first device function information and the second device function information corresponding to all the second devices, the method further includes: Acquire a first date and a second date corresponding to each of the associated second devices, wherein the first date is the last maintenance date of each of the associated second devices, and the second date is the current date; Determining a date difference based on the first date and the second date; Obtaining a fault matrix of each of the associated second devices on the first date, and determining a fault probability of each of the associated second devices according to the fault matrix and the date difference, Wherein, the fault matrix is ​​determined based on the device status information of the associated second device; Determining an initial associated second device from all the associated second devices based on the failure probability corresponding to each of the associated second devices; Accordingly, the step of obtaining the correlation degree corresponding to the abnormal process and all the associated second devices includes: The correlation degrees corresponding to the abnormal process and all the initially associated second devices are obtained.

5. The fault tracing method based on the ironmaking process according to claim 4 is characterized in that: Determining the fault matrix based on the device status information of the associated second device includes: Obtaining the equipment status corresponding to each of the third dates in the last maintenance cycle, wherein the last maintenance cycle is the last maintenance cycle corresponding to the maintenance cycle in which the second date is located; Mapping all the third dates and all the device states corresponding to the third dates into fault elements; A fault sequence is generated based on all the third dates and all the fault elements, and the fault matrix is ​​generated according to the fault elements and the fault sequence.

6. The fault tracing method based on the ironmaking process according to claim 5 is characterized in that: The fault element includes a first fault element corresponding to a normal state and a second fault element corresponding to a fault state. The generating the fault matrix according to the fault elements and the fault sequence comprises: generating a plurality of fault element groups based on the first fault element and the second fault element; For each of the fault element groups, determining an associated fault element group corresponding to the fault element group; Determining a first quantity value of each of the faulty element groups and a second quantity value of the corresponding associated faulty element group based on the fault sequence; The fault matrix is ​​generated according to the first quantity value and the second quantity value.

7. The fault tracing method based on the ironmaking process according to claim 1 is characterized in that: After associating the abnormal device and all the targets with a second device and determining them as fault source devices, the method further includes: For each of the fault source devices, obtain a plurality of operation data, a maintenance time period and a device identifier corresponding to the fault source device; Determine the abnormality level of the fault source device based on all the operation data; Acquire some maintenance personnel information corresponding to the fault source equipment, wherein the maintenance personnel information includes: idle time period and repairable fault level; Determine a target maintenance personnel based on the abnormality level, the waiting maintenance period, the idle period and the repairable fault level, and have the target maintenance personnel repair the fault source equipment; A maintenance signal is generated based on the device identification, and the maintenance signal is sent to the target maintenance personnel side device.

8. A fault tracing device based on the ironmaking process, characterized in that: include: An abnormal information determination module is used to determine the abnormal type based on the product abnormal signal when receiving the product abnormal signal, and determine the abnormal information according to the abnormal type, wherein the abnormal information includes: abnormal equipment and abnormal process; A first acquisition module, configured to acquire first device function information of the abnormal device and second device function information corresponding to all second devices, wherein the second devices are non-abnormal devices; an associated second device determining module, configured to determine an associated second device associated with the abnormal device based on the first device function information and the second device function information corresponding to each of all the second devices; A second acquisition module is used to acquire the correlation degree corresponding to the abnormal process and all the associated second devices, and determine the target associated second device based on all the correlation degrees; The fault source device determination module is used to associate the abnormal device and all the target second devices to determine them as fault source devices.

9. An electronic device, characterized in that: include: at least one processor; Memory; At least one application, wherein the at least one application is stored in a memory and configured to be executed by at least one processor, and the at least one application is configured to: execute the fault tracing method based on the ironmaking process as described in any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that: A computer program is stored thereon, and when the computer program is executed in a computer, the computer is caused to execute the fault tracing method based on the ironmaking process as described in any one of claims 1 to 7.

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