A method, system and medium for feedback and compensation of positioning error of wafer inspection platform

Abstract

The present application provides a method, system and medium for positioning error feedback and compensation of a wafer detection station. The method includes: monitoring the actual positioning information of the target wafer detection station, extracting the actual positioning characteristic data, processing in combination with the standard positioning characteristic data, obtaining the positioning error index, obtaining the mechanical structure characteristic data and sensor characteristic data of the target wafer detection station, processing to obtain the detection station design error index, obtaining the working condition characteristic data, processing to obtain the working condition error correction coefficient, and processing in combination with the positioning error index and the detection station design error index to obtain the positioning error compensation index, performing positioning error compensation on the target wafer detection station according to the positioning error compensation index, obtaining the corresponding positioning error statistical data, processing to obtain the error compensation effect index, and judging the error compensation effect and making corresponding adjustments accordingly, thereby realizing the positioning error feedback and compensation technology of the wafer detection station.

Description

Technical Field

[0001] The present application relates to the field of wafer inspection technology, and in particular to a positioning error feedback and compensation method, system and medium for a wafer inspection platform. Background Art

[0002] In the semiconductor manufacturing process, wafer inspection is a crucial link, and the positioning accuracy of the wafer inspection table directly affects the accuracy and reliability of the inspection results.

[0003] However, due to the instability of the mechanical structure, errors in the control system and the influence of external environmental factors, positioning errors often occur in the wafer inspection platform during operation, which will seriously affect the accuracy and reliability of wafer inspection.

[0004] In view of the above problems, effective technical solutions are urgently needed. Summary of the invention

[0005] The purpose of the present application is to provide a positioning error feedback and compensation method, system and medium for a wafer inspection station. The method can extract actual positioning characteristic data based on the actual positioning information of the monitored target wafer inspection station, and process it in combination with standard positioning characteristic data to obtain a positioning error index, obtain mechanical structure characteristic data and sensor characteristic data of the target wafer inspection station, process it to obtain a design error index of the inspection station, obtain working condition characteristic data, process it to obtain a working condition error correction coefficient, and process it in combination with the positioning error index and the design error index of the inspection station to obtain a positioning error compensation index, perform positioning error compensation on the target wafer inspection station according to the positioning error compensation index, obtain corresponding positioning error statistical data, process it to obtain an error compensation effect index, judge the error compensation effect based on it and make corresponding adjustments, so as to realize the technology of positioning error feedback and compensation of the wafer inspection station.

[0006] The present application also provides a positioning error feedback and compensation method for a wafer inspection platform, comprising the following steps:

[0007] Monitor the actual positioning information of the target wafer inspection station and extract multiple sets of actual positioning characteristic data;

[0008] Acquire standard positioning characteristic data, and process it in combination with the actual positioning characteristic data to obtain a positioning error index;

[0009] Acquire the mechanical structure characteristic data and sensor characteristic data of the target wafer inspection platform, and process to obtain the inspection platform design error index;

[0010] Acquire the working condition characteristic data of the target wafer inspection station, and process to obtain the working condition error correction coefficient;

[0011] Processing is performed according to the positioning error index, the detection platform design error index and the working condition error correction coefficient to obtain a positioning error compensation index, and positioning error compensation is performed on the target wafer detection platform according to the positioning error compensation index;

[0012] Acquire multiple sets of position information after compensation, extract corresponding positioning error statistical data, process to obtain error compensation effect index, judge the error compensation effect according to the error compensation effect index and make corresponding adjustments.

[0013] Optionally, in the positioning error feedback and compensation method of the wafer inspection platform described in the present application, the actual positioning information of the monitoring target wafer inspection platform and extracting multiple groups of actual positioning characteristic data include:

[0014] Monitor the actual positioning information of the target wafer inspection platform, including plane coordinate position information, height information and angle information;

[0015] A plurality of groups of actual positioning characteristic data are extracted according to the plane coordinate position information, height information and angle information, including actual position data, actual height data and actual angle data.

[0016] Optionally, in the positioning error feedback and compensation method of the wafer inspection platform described in the present application, the step of acquiring the standard positioning characteristic data and processing the data in combination with the actual positioning characteristic data to obtain the positioning error index includes:

[0017] Acquire standard positioning characteristic data corresponding to the actual position data, actual height data and actual angle data, including standard position data, standard height data and standard angle data;

[0018] The standard position data, standard height data and standard angle data are combined with the actual position data, actual height data and actual angle data and processed through a preset positioning error evaluation model to obtain a positioning error amount index.

[0019] Optionally, in the positioning error feedback and compensation method of the wafer inspection platform described in the present application, the step of acquiring the mechanical structure characteristic data and the sensor characteristic data of the target wafer inspection platform and processing to obtain the inspection platform design error index includes:

[0020] Acquiring mechanical structure characteristic data and sensor characteristic data of the target wafer inspection platform;

[0021] The mechanical structure characteristic data includes guide rail straightness data, table surface flatness data and transmission system accuracy data;

[0022] The sensor characteristic data includes position sensor resolution data and force sensor sensitivity data;

[0023] The guide rail straightness data, table surface flatness data and transmission system accuracy data are processed in combination with the position sensor resolution data and force sensor sensitivity data to obtain a test bench design error index.

[0024] Optionally, in the positioning error feedback and compensation method of the wafer inspection station described in the present application, the processing is performed according to the positioning error index, the inspection station design error index and the working condition error correction coefficient to obtain the positioning error compensation index, and the positioning error compensation of the target wafer inspection station is performed according to the positioning error compensation index, including:

[0025] The positioning error compensation index is obtained by processing the positioning error index, the detection platform design error index and the working condition error correction coefficient through a preset positioning error compensation model;

[0026] The positioning error of the target wafer inspection station is compensated according to the positioning error compensation amount index.

[0027] Optionally, in the positioning error feedback and compensation method of the wafer inspection table described in the present application, the multiple sets of position information after compensation are obtained, and the corresponding positioning error statistical data are extracted, and the error compensation effect index is obtained by processing, and the error compensation effect is judged according to the error compensation effect index and adjusted accordingly, including:

[0028] Acquire multiple sets of position information of the target wafer inspection station after compensation, and extract corresponding positioning error statistical data;

[0029] The positioning error statistical data includes position error maximum value data, position error standard deviation data, angle error maximum value data, angle error standard deviation data, height error maximum value data and height error standard deviation data;

[0030] Processing is performed according to the positioning error statistical data to obtain an error compensation effect index;

[0031] Comparing the obtained error compensation effect index with a preset obtained error compensation effect threshold to obtain a comparison result;

[0032] The error compensation effect is judged according to the comparison result and corresponding adjustments are made.

[0033] In a second aspect, the present application provides a positioning error feedback and compensation system for a wafer inspection platform, the system comprising: a memory and a processor, the memory comprising a program of a positioning error feedback and compensation method for a wafer inspection platform, and the program of the positioning error feedback and compensation method for a wafer inspection platform is executed by the processor to implement the following steps:

[0034] Monitor the actual positioning information of the target wafer inspection station and extract multiple sets of actual positioning characteristic data;

[0035] Acquire standard positioning characteristic data, and process it in combination with the actual positioning characteristic data to obtain a positioning error index;

[0036] Acquire the mechanical structure characteristic data and sensor characteristic data of the target wafer inspection platform, and process to obtain the inspection platform design error index;

[0037] Acquire the working condition characteristic data of the target wafer inspection station, and process to obtain the working condition error correction coefficient;

[0038] Processing is performed according to the positioning error index, the detection platform design error index and the working condition error correction coefficient to obtain a positioning error compensation index, and positioning error compensation is performed on the target wafer detection platform according to the positioning error compensation index;

[0039] Acquire multiple sets of position information after compensation, extract corresponding positioning error statistical data, process to obtain error compensation effect index, judge the error compensation effect according to the error compensation effect index and make corresponding adjustments.

[0040] Optionally, in the positioning error feedback and compensation system of the wafer inspection platform described in the present application, the actual positioning information of the monitoring target wafer inspection platform and extracting multiple groups of actual positioning characteristic data include:

[0041] Monitor the actual positioning information of the target wafer inspection platform, including plane coordinate position information, height information and angle information;

[0042] A plurality of groups of actual positioning characteristic data are extracted according to the plane coordinate position information, height information and angle information, including actual position data, actual height data and actual angle data.

[0043] Optionally, in the positioning error feedback and compensation system of the wafer inspection platform described in the present application, the step of acquiring the standard positioning characteristic data and processing the data in combination with the actual positioning characteristic data to obtain the positioning error index includes:

[0044] Acquire standard positioning characteristic data corresponding to the actual position data, actual height data and actual angle data, including standard position data, standard height data and standard angle data;

[0045] The standard position data, standard height data and standard angle data are combined with the actual position data, actual height data and actual angle data and processed through a preset positioning error evaluation model to obtain a positioning error amount index.

[0046] In the third aspect, the present application also provides a computer-readable storage medium, which stores a positioning error feedback and compensation method program for a wafer inspection platform. When the positioning error feedback and compensation method program for a wafer inspection platform is executed by a processor, the steps of the positioning error feedback and compensation method for a wafer inspection platform as described in any one of the above items are implemented.

[0047] It can be seen from the above that the positioning error feedback and compensation method, system and medium of the wafer inspection station disclosed in the present invention monitor the actual positioning information of the target wafer inspection station, and extract multiple groups of actual positioning characteristic data, obtain standard positioning characteristic data, and process them in combination with the actual positioning characteristic data to obtain a positioning error index, obtain the mechanical structure characteristic data and sensor characteristic data of the target wafer inspection station, process to obtain the inspection station design error index, obtain the working condition characteristic data of the target wafer inspection station, process to obtain the working condition error correction coefficient, process according to the positioning error index, the inspection station design error index and the working condition error correction coefficient to obtain the positioning error compensation index, and compensate for the positioning error of the target wafer inspection station according to the positioning error compensation index, obtain multiple groups of position information after compensation, and extract corresponding positioning error statistical data, process to obtain an error compensation effect index, judge the error compensation effect according to the error compensation effect index and make corresponding adjustments, thereby realizing the positioning error feedback and compensation technology of the wafer inspection station.

[0048] Other features and advantages of the present application will be described in the following description, and partly become apparent from the description, or understood by practicing the embodiments of the present application. The purpose and other advantages of the present application can be realized and obtained by the structures specifically pointed out in the written description and the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0050] Figure 1 A flow chart of a positioning error feedback and compensation method for a wafer inspection platform provided in an embodiment of the present application;

[0051] Figure 2 A flow chart of extracting multiple groups of actual positioning characteristic data of a positioning error feedback and compensation method of a wafer inspection platform provided in an embodiment of the present application;

[0052] Figure 3A flow chart of obtaining a positioning error index in a positioning error feedback and compensation method for a wafer inspection platform provided in an embodiment of the present application;

[0053] Figure 4 A flow chart of obtaining a design error index of a wafer inspection platform in a positioning error feedback and compensation method for a wafer inspection platform provided in an embodiment of the present application. DETAILED DESCRIPTION

[0054] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application claimed for protection, but merely represents the selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present application.

[0055] It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. At the same time, in the description of this application, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0056] Please refer to Figure 1 , Figure 1 The present invention is a flowchart of a method for feedback and compensation of positioning errors of a wafer inspection station in some embodiments of the present invention. The method for feedback and compensation of positioning errors of a wafer inspection station is used in terminal devices, such as computers, mobile phone terminals, etc. The method for feedback and compensation of positioning errors of a wafer inspection station comprises the following steps:

[0057] S11, monitoring actual positioning information of the target wafer inspection station, and extracting multiple sets of actual positioning characteristic data;

[0058] S12, acquiring standard positioning characteristic data, and processing the data in combination with the actual positioning characteristic data to obtain a positioning error index;

[0059] S13, acquiring the mechanical structure characteristic data and sensor characteristic data of the target wafer inspection platform, and processing to obtain the inspection platform design error index;

[0060] S14, acquiring the working condition characteristic data of the target wafer inspection station, and processing to obtain the working condition error correction coefficient;

[0061] S15, performing processing according to the positioning error index, the detection platform design error index and the working condition error correction coefficient to obtain a positioning error compensation index, and performing positioning error compensation on the target wafer detection platform according to the positioning error compensation index;

[0062] S16, obtaining multiple sets of position information after compensation, and extracting corresponding positioning error statistical data, processing to obtain an error compensation effect index, judging the error compensation effect according to the error compensation effect index and making corresponding adjustments.

[0063] It should be noted that the positioning accuracy of the wafer inspection table directly affects the accuracy and reliability of the inspection results. However, due to the instability of the mechanical structure, errors in the control system and the influence of external environmental factors, the wafer inspection table often has positioning errors during operation, which will seriously affect the accuracy and reliability of wafer inspection. Therefore, an effective positioning error feedback and compensation method is needed to improve the positioning accuracy of the wafer inspection table. In order to solve the above problems, the technology of the present application provides a positioning error feedback and compensation method for a wafer inspection table. In this embodiment, the actual positioning information of the target wafer inspection table is firstly monitored, and multiple groups of actual positioning characteristic data are extracted to obtain standard positioning characteristic data, which are then processed in combination with the actual positioning characteristic data to obtain positioning error information. Differential index, obtain the mechanical structure characteristic data and sensor characteristic data of the target wafer inspection station, process to obtain the inspection station design error index, obtain the working condition characteristic data of the target wafer inspection station, process to obtain the working condition error correction coefficient, process according to the positioning error index, the inspection station design error index and the working condition error correction coefficient, obtain the positioning error compensation index, and perform positioning error compensation on the target wafer inspection station according to the positioning error compensation index, obtain multiple sets of position information after compensation, and extract the corresponding positioning error statistical data, process to obtain the error compensation effect index, judge the error compensation effect according to the error compensation effect index and make corresponding adjustments, thereby realizing the positioning error feedback and compensation technology of the wafer inspection station.

[0064] Please refer to Figure 2 , Figure 2 The present invention is a flowchart of extracting multiple sets of actual positioning characteristic data of the positioning error feedback and compensation method of the wafer inspection platform in some embodiments of the present application. According to the embodiment of the present invention, the actual positioning information of the monitoring target wafer inspection platform and extracting multiple sets of actual positioning characteristic data include:

[0065] S21, monitoring the actual positioning information of the target wafer inspection station, including plane coordinate position information, height information and angle information;

[0066] S22. Extracting multiple groups of actual positioning characteristic data according to the plane coordinate position information, height information and angle information, including actual position data, actual height data and actual angle data.

[0067] It should be noted that in order to provide accurate feedback on the positioning of the wafer inspection platform in the future, it is necessary to monitor the actual positioning information of the wafer inspection platform in real time, including plane coordinate position information, height information and angle information, and then extract multiple sets of actual positioning characteristic data based on the above information, including actual position, actual height and actual angle data.

[0068] Please refer to Figure 3 , Figure 3 The present invention is a flowchart of obtaining a positioning error index of a positioning error feedback and compensation method of a wafer inspection platform in some embodiments of the present application. According to an embodiment of the present invention, the acquisition of standard positioning characteristic data and processing in combination with the actual positioning characteristic data to obtain a positioning error index include:

[0069] S31, obtaining standard positioning characteristic data corresponding to the actual position data, the actual height data and the actual angle data, including standard position data, standard height data and standard angle data;

[0070] S32. Processing the standard position data, standard height data and standard angle data in combination with the actual position data, actual height data and actual angle data through a preset positioning error evaluation model to obtain a positioning error index.

[0071] It should be noted that after obtaining the actual positioning characteristic data of the wafer inspection table, the standard data corresponding to these data must be found, including the corresponding standard position, standard height and standard angle data, and then the positioning error index is obtained by processing the corresponding actual positioning characteristic data and the standard positioning characteristic data through the calculation formula of the preset positioning error evaluation model;

[0072] The calculation formula of the positioning error index is:

[0073] ;

[0074] in, is the positioning error index, , , They are standard position data, standard height data and standard angle data. , , are respectively the actual position data, actual height data and actual angle data corresponding to the i-th group in the n groups of actual positioning characteristic data, is the preset characteristic coefficient (the characteristic coefficient is obtained by querying the preset positioning error compensation database).

[0075] Please refer to Figure 4 , Figure 4 The present invention is a flowchart of obtaining a detection platform design error index of a positioning error feedback and compensation method of a wafer detection platform in some embodiments of the present application. According to an embodiment of the present invention, the mechanical structure characteristic data and sensor characteristic data of the target wafer detection platform are obtained, and the detection platform design error index is obtained by processing, including:

[0076] S41, acquiring mechanical structure characteristic data and sensor characteristic data of the target wafer inspection platform;

[0077] S42, the mechanical structure characteristic data includes guide rail straightness data, table surface flatness data and transmission system accuracy data;

[0078] S43, the sensor characteristic data includes position sensor resolution data and force sensor sensitivity data;

[0079] S44, processing the guide rail straightness data, table surface flatness data and transmission system accuracy data in combination with the position sensor resolution data and force sensor sensitivity data to obtain a test bench design error index.

[0080] It should be noted that the mechanical structure characteristics and sensor characteristics of the wafer inspection table have a great influence on its positioning error. In order to accurately compensate for the positioning error, it is necessary to first understand the design error of the inspection table itself. Therefore, it is necessary to obtain the mechanical structure characteristic data and sensor characteristic data of the wafer inspection table, wherein the mechanical structure characteristic data includes the guide rail straightness, table surface flatness and transmission system accuracy data, and the sensor characteristic data includes the position sensor resolution and force sensor sensitivity data. Then, the above data are processed to obtain the inspection table design error index;

[0081] The calculation formula of the design error index of the test bench is:

[0082] ;

[0083] in, Design error index for the test bench, , , They are the guide rail straightness data, table surface flatness data, and transmission system accuracy data. , They are the position sensor resolution data and the force sensor sensitivity data. , , , , is the preset characteristic coefficient (the characteristic coefficient is obtained by querying the preset positioning error compensation database).

[0084] According to an embodiment of the present invention, the processing is performed according to the positioning error index, the detection platform design error index and the working condition error correction coefficient to obtain a positioning error compensation index, and positioning error compensation is performed on the target wafer detection platform according to the positioning error compensation index, including:

[0085] The positioning error compensation index is obtained by processing the positioning error index, the detection platform design error index and the working condition error correction coefficient through a preset positioning error compensation model;

[0086] The positioning error of the target wafer inspection station is compensated according to the positioning error compensation amount index.

[0087] It should be noted that the positioning error index, the test bench design error index and the working condition error correction coefficient obtained by processing are processed through the calculation formula of the preset positioning error compensation model to obtain the positioning error compensation index, and then the positioning error of the wafer test bench is compensated according to the index to obtain the compensated wafer test bench;

[0088] The calculation formula of the positioning error compensation index is:

[0089] ;

[0090] in, is the positioning error compensation index, , , They are positioning error index, test bench design error index, and working condition error correction coefficient. , is the preset characteristic coefficient (the characteristic coefficient is obtained by querying the preset positioning error compensation database).

[0091] According to an embodiment of the present invention, the method of obtaining multiple sets of position information after compensation, extracting corresponding positioning error statistical data, processing to obtain an error compensation effect index, and judging the error compensation effect according to the error compensation effect index and making corresponding adjustments includes:

[0092] Acquire multiple sets of position information of the target wafer inspection station after compensation, and extract corresponding positioning error statistical data;

[0093] The positioning error statistical data includes position error maximum value data, position error standard deviation data, angle error maximum value data, angle error standard deviation data, height error maximum value data and height error standard deviation data;

[0094] Processing is performed according to the positioning error statistical data to obtain an error compensation effect index;

[0095] Comparing the obtained error compensation effect index with a preset obtained error compensation effect threshold to obtain a comparison result;

[0096] The error compensation effect is judged according to the comparison result and corresponding adjustments are made.

[0097] It should be noted that in order to understand the compensation effect more comprehensively and accurately, first obtain multiple sets of position information of the compensated wafer inspection table, and extract the corresponding positioning error statistical data, including the maximum position error, the position error standard deviation, the maximum angle error, the angle error standard deviation, the maximum height error and the height error standard deviation data, and then process the above data to obtain the error compensation effect index, and then compare the index with the preset value. If the index value does not reach the preset value, it means that the compensation effect is not ideal, and corresponding adjustments and re-compensation are required;

[0098] Wherein, the calculation formula of the error compensation effect index is:

[0099] ;

[0100] in, is the error compensation effect index, , , , , , They are the maximum position error data, the position error standard deviation data, the angle error maximum data, the angle error standard deviation data, the height error maximum data, and the height error standard deviation data. , , is the preset characteristic coefficient (the characteristic coefficient is obtained by querying the preset positioning error compensation database).

[0101] According to an embodiment of the present invention, it also includes:

[0102] Acquiring the working condition characteristic data of the target wafer inspection station and processing to obtain the working condition error correction coefficient specifically includes:

[0103] Acquiring operating condition characteristic data of the target wafer inspection station, including operating temperature data and inspection station vibration data;

[0104] Processing the working temperature data and the test bench vibration data to obtain a working condition error correction coefficient;

[0105] The calculation formula of the working condition error correction coefficient is:

[0106] ;

[0107] in, is the working condition error correction coefficient, , They are working temperature data and test bench vibration data. , is the preset characteristic coefficient (the characteristic coefficient is obtained by querying the preset positioning error compensation database).

[0108] It should be noted that, on the other hand, the working conditions of the wafer inspection platform will also affect the positioning error. The working condition characteristic data include working temperature data and inspection platform vibration data. The working condition error correction coefficient is obtained by processing the above data to prepare for subsequent calculation and compensation.

[0109] According to an embodiment of the present invention, it also includes:

[0110] Real-time monitoring of the working monitoring information of the wafer inspection station, and extraction of real-time working environment characteristic data, including real-time temperature data, real-time humidity data and real-time cleanliness data;

[0111] Processing the real-time temperature data, the real-time humidity data, and the real-time cleanliness data to obtain a working environment compliance index;

[0112] Comparing the working environment compliance index with a preset working environment compliance threshold to obtain a comparison result;

[0113] If the comparison result is not within the preset value range, adjusting the real-time working environment characteristic data accordingly;

[0114] The calculation formula of the working environment compliance index is:

[0115] ;

[0116] in, is the working environment compliance index, , , They are real-time temperature data, real-time humidity data, and real-time cleanliness data. is the preset characteristic coefficient (the characteristic coefficient is obtained by querying the preset positioning error compensation database).

[0117] It should be noted that in order to minimize the positioning error of the wafer inspection station, it is necessary to provide a good working environment for its working area, including suitable temperature and humidity and cleanliness that meets the requirements. Therefore, it is necessary to monitor the working environment information of the wafer inspection station in real time and extract real-time working environment characteristic data, including real-time temperature, real-time humidity and real-time cleanliness data. Then, the above data is processed to obtain the working environment compliance index, and the index is compared with the preset value. According to the comparison results, it is judged whether the working environment meets the requirements. If not, these working environment characteristic data are adjusted accordingly.

[0118] In a second aspect, the present invention further discloses a positioning error feedback and compensation system for a wafer inspection platform, comprising a memory and a processor, wherein the memory comprises a positioning error feedback and compensation method program for the wafer inspection platform, and when the positioning error feedback and compensation method program for the wafer inspection platform is executed by the processor, the following steps are implemented:

[0119] Monitor the actual positioning information of the target wafer inspection station and extract multiple sets of actual positioning characteristic data;

[0120] Acquire standard positioning characteristic data, and process it in combination with the actual positioning characteristic data to obtain a positioning error index;

[0121] Acquire the mechanical structure characteristic data and sensor characteristic data of the target wafer inspection platform, and process to obtain the inspection platform design error index;

[0122] Acquire the working condition characteristic data of the target wafer inspection station, and process to obtain the working condition error correction coefficient;

[0123] Processing is performed according to the positioning error index, the detection platform design error index and the working condition error correction coefficient to obtain a positioning error compensation index, and positioning error compensation is performed on the target wafer detection platform according to the positioning error compensation index;

[0124] Acquire multiple sets of position information after compensation, extract corresponding positioning error statistical data, process to obtain error compensation effect index, judge the error compensation effect according to the error compensation effect index and make corresponding adjustments.

[0125] It should be noted that the positioning accuracy of the wafer inspection table directly affects the accuracy and reliability of the inspection results. However, due to the instability of the mechanical structure, errors in the control system and the influence of external environmental factors, the wafer inspection table often has positioning errors during operation, which will seriously affect the accuracy and reliability of wafer inspection. Therefore, an effective positioning error feedback and compensation method is needed to improve the positioning accuracy of the wafer inspection table. In order to solve the above problems, the technology of the present application provides a positioning error feedback and compensation method for a wafer inspection table. In this embodiment, the actual positioning information of the target wafer inspection table is firstly monitored, and multiple groups of actual positioning characteristic data are extracted to obtain standard positioning characteristic data, which are then processed in combination with the actual positioning characteristic data to obtain positioning error information. Differential index, obtain the mechanical structure characteristic data and sensor characteristic data of the target wafer inspection station, process to obtain the inspection station design error index, obtain the working condition characteristic data of the target wafer inspection station, process to obtain the working condition error correction coefficient, process according to the positioning error index, the inspection station design error index and the working condition error correction coefficient, obtain the positioning error compensation index, and perform positioning error compensation on the target wafer inspection station according to the positioning error compensation index, obtain multiple sets of position information after compensation, and extract the corresponding positioning error statistical data, process to obtain the error compensation effect index, judge the error compensation effect according to the error compensation effect index and make corresponding adjustments, thereby realizing the positioning error feedback and compensation technology of the wafer inspection station.

[0126] According to an embodiment of the present invention, the actual positioning information of the target wafer inspection station is monitored and multiple groups of actual positioning characteristic data are extracted, including:

[0127] Monitor the actual positioning information of the target wafer inspection platform, including plane coordinate position information, height information and angle information;

[0128] A plurality of groups of actual positioning characteristic data are extracted according to the plane coordinate position information, height information and angle information, including actual position data, actual height data and actual angle data.

[0129] It should be noted that in order to provide accurate feedback on the positioning of the wafer inspection platform in the future, it is necessary to monitor the actual positioning information of the wafer inspection platform in real time, including plane coordinate position information, height information and angle information, and then extract multiple sets of actual positioning characteristic data based on the above information, including actual position, actual height and actual angle data.

[0130] According to an embodiment of the present invention, the step of acquiring standard positioning characteristic data and processing the data in combination with the actual positioning characteristic data to obtain a positioning error index includes:

[0131] Acquire standard positioning characteristic data corresponding to the actual position data, actual height data and actual angle data, including standard position data, standard height data and standard angle data;

[0132] The standard position data, standard height data and standard angle data are combined with the actual position data, actual height data and actual angle data and processed through a preset positioning error evaluation model to obtain a positioning error amount index.

[0133] It should be noted that after obtaining the actual positioning characteristic data of the wafer inspection table, the standard data corresponding to these data must be found, including the corresponding standard position, standard height and standard angle data, and then the positioning error index is obtained by processing the corresponding actual positioning characteristic data and the standard positioning characteristic data through the calculation formula of the preset positioning error evaluation model;

[0134] The calculation formula of the positioning error index is:

[0135] ;

[0136] in, is the positioning error index, , , They are standard position data, standard height data and standard angle data. , , are respectively the actual position data, actual height data and actual angle data corresponding to the i-th group in the n groups of actual positioning characteristic data, is the preset characteristic coefficient (the characteristic coefficient is obtained by querying the preset positioning error compensation database).

[0137] According to an embodiment of the present invention, the step of acquiring the mechanical structure characteristic data and the sensor characteristic data of the target wafer inspection platform and processing to obtain the inspection platform design error index includes:

[0138] Acquiring mechanical structure characteristic data and sensor characteristic data of the target wafer inspection platform;

[0139] The mechanical structure characteristic data includes guide rail straightness data, table surface flatness data and transmission system accuracy data;

[0140] The sensor characteristic data includes position sensor resolution data and force sensor sensitivity data;

[0141] The guide rail straightness data, table surface flatness data and transmission system accuracy data are processed in combination with the position sensor resolution data and force sensor sensitivity data to obtain a test bench design error index.

[0142] It should be noted that the mechanical structure characteristics and sensor characteristics of the wafer inspection table have a great influence on its positioning error. In order to accurately compensate for the positioning error, it is necessary to first understand the design error of the inspection table itself. Therefore, it is necessary to obtain the mechanical structure characteristic data and sensor characteristic data of the wafer inspection table, wherein the mechanical structure characteristic data includes the guide rail straightness, table surface flatness and transmission system accuracy data, and the sensor characteristic data includes the position sensor resolution and force sensor sensitivity data. Then, the above data are processed to obtain the inspection table design error index;

[0143] The calculation formula of the design error index of the test bench is:

[0144] ;

[0145] in, Design error index for the test bench, , , They are the guide rail straightness data, table surface flatness data, and transmission system accuracy data. , They are the position sensor resolution data and the force sensor sensitivity data. , , , , is the preset characteristic coefficient (the characteristic coefficient is obtained by querying the preset positioning error compensation database).

[0146] According to an embodiment of the present invention, the processing is performed according to the positioning error index, the detection platform design error index and the working condition error correction coefficient to obtain a positioning error compensation index, and positioning error compensation is performed on the target wafer detection platform according to the positioning error compensation index, including:

[0147] The positioning error compensation index is obtained by processing the positioning error index, the detection platform design error index and the working condition error correction coefficient through a preset positioning error compensation model;

[0148] The positioning error of the target wafer inspection station is compensated according to the positioning error compensation amount index.

[0149] It should be noted that the positioning error index, the test bench design error index and the working condition error correction coefficient obtained by processing are processed through the calculation formula of the preset positioning error compensation model to obtain the positioning error compensation index, and then the positioning error of the wafer test bench is compensated according to the index to obtain the compensated wafer test bench;

[0150] The calculation formula of the positioning error compensation index is:

[0151] ;

[0152] in, is the positioning error compensation index, , , They are positioning error index, test bench design error index, and working condition error correction coefficient. , is the preset characteristic coefficient (the characteristic coefficient is obtained by querying the preset positioning error compensation database).

[0153] According to an embodiment of the present invention, the method of obtaining multiple sets of position information after compensation, extracting corresponding positioning error statistical data, processing to obtain an error compensation effect index, and judging the error compensation effect according to the error compensation effect index and making corresponding adjustments includes:

[0154] Acquire multiple sets of position information of the target wafer inspection station after compensation, and extract corresponding positioning error statistical data;

[0155] The positioning error statistical data includes position error maximum value data, position error standard deviation data, angle error maximum value data, angle error standard deviation data, height error maximum value data and height error standard deviation data;

[0156] Processing is performed according to the positioning error statistical data to obtain an error compensation effect index;

[0157] Comparing the obtained error compensation effect index with a preset obtained error compensation effect threshold to obtain a comparison result;

[0158] The error compensation effect is judged according to the comparison result and corresponding adjustments are made.

[0159] It should be noted that in order to understand the compensation effect more comprehensively and accurately, first obtain multiple sets of position information of the compensated wafer inspection table, and extract the corresponding positioning error statistical data, including the maximum position error, the position error standard deviation, the maximum angle error, the angle error standard deviation, the maximum height error and the height error standard deviation data, and then process the above data to obtain the error compensation effect index, and then compare the index with the preset value. If the index value does not reach the preset value, it means that the compensation effect is not ideal, and corresponding adjustments and re-compensation are required;

[0160] Wherein, the calculation formula of the error compensation effect index is:

[0161] ;

[0162] in, is the error compensation effect index, , , , , , They are the maximum position error data, the position error standard deviation data, the angle error maximum data, the angle error standard deviation data, the height error maximum data, and the height error standard deviation data. , , is the preset characteristic coefficient (the characteristic coefficient is obtained by querying the preset positioning error compensation database).

[0163] According to an embodiment of the present invention, it also includes:

[0164] Acquiring the working condition characteristic data of the target wafer inspection station and processing to obtain the working condition error correction coefficient specifically includes:

[0165] Acquiring operating condition characteristic data of the target wafer inspection station, including operating temperature data and inspection station vibration data;

[0166] Processing the working temperature data and the test bench vibration data to obtain a working condition error correction coefficient;

[0167] The calculation formula of the working condition error correction coefficient is:

[0168] ;

[0169] in, is the working condition error correction coefficient, , They are working temperature data and test bench vibration data. , is the preset characteristic coefficient (the characteristic coefficient is obtained by querying the preset positioning error compensation database).

[0170] It should be noted that, on the other hand, the working conditions of the wafer inspection platform will also affect the positioning error. The working condition characteristic data include working temperature data and inspection platform vibration data. The working condition error correction coefficient is obtained by processing the above data to prepare for subsequent calculation and compensation.

[0171] According to an embodiment of the present invention, it also includes:

[0172] Real-time monitoring of the working monitoring information of the wafer inspection station, and extraction of real-time working environment characteristic data, including real-time temperature data, real-time humidity data and real-time cleanliness data;

[0173] Processing the real-time temperature data, the real-time humidity data, and the real-time cleanliness data to obtain a working environment compliance index;

[0174] Comparing the working environment compliance index with a preset working environment compliance threshold to obtain a comparison result;

[0175] If the comparison result is not within the preset value range, adjusting the real-time working environment characteristic data accordingly;

[0176] The calculation formula of the working environment compliance index is:

[0177] ;

[0178] in, is the working environment compliance index, , , They are real-time temperature data, real-time humidity data, and real-time cleanliness data. is the preset characteristic coefficient (the characteristic coefficient is obtained by querying the preset positioning error compensation database).

[0179] It should be noted that in order to minimize the positioning error of the wafer inspection station, it is necessary to provide a good working environment for its working area, including suitable temperature and humidity and cleanliness that meets the requirements. Therefore, it is necessary to monitor the working environment information of the wafer inspection station in real time and extract real-time working environment characteristic data, including real-time temperature, real-time humidity and real-time cleanliness data. Then, the above data is processed to obtain the working environment compliance index, and the index is compared with the preset value. According to the comparison results, it is judged whether the working environment meets the requirements. If not, these working environment characteristic data are adjusted accordingly.

[0180] A third aspect of the present invention provides a readable storage medium, which stores a positioning error feedback and compensation method program for a wafer inspection platform. When the positioning error feedback and compensation method program for a wafer inspection platform is executed by a processor, the steps of the positioning error feedback and compensation method for a wafer inspection platform as described in any one of the above items are implemented.

[0181] The present invention discloses a positioning error feedback and compensation method, system and medium for a wafer inspection station. The method monitors the actual positioning information of a target wafer inspection station, extracts multiple groups of actual positioning characteristic data, obtains standard positioning characteristic data, processes the data in combination with the actual positioning characteristic data, obtains a positioning error index, obtains mechanical structure characteristic data and sensor characteristic data of the target wafer inspection station, processes the data to obtain a design error index of the inspection station, obtains working condition characteristic data of the target wafer inspection station, processes the data to obtain a working condition error correction coefficient, processes the data according to the positioning error index, the design error index of the inspection station and the working condition error correction coefficient, obtains a positioning error compensation index, performs positioning error compensation on the target wafer inspection station according to the positioning error compensation index, obtains multiple groups of position information after compensation, extracts corresponding positioning error statistical data, processes the data to obtain an error compensation effect index, judges the error compensation effect according to the error compensation effect index and makes corresponding adjustments, thereby realizing the positioning error feedback and compensation technology for the wafer inspection station.

[0182] In the several embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. The device embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation, such as: multiple units or components can be combined, or can be integrated into another system, or some features can be ignored or not executed. In addition, the coupling, direct coupling, or communication connection between the components shown or discussed can be through some interfaces, and the indirect coupling or communication connection of the devices or units can be electrical, mechanical or other forms.

[0183] The units described above as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units; they may be located in one place or distributed on multiple network units; some or all of the units may be selected according to actual needs to achieve the purpose of the present embodiment.

[0184] In addition, all functional units in the embodiments of the present invention may be integrated into one processing unit, or each unit may be separately used as a unit, or two or more units may be integrated into one unit; the above-mentioned integrated units may be implemented in the form of hardware or in the form of hardware plus software functional units.

[0185] Those skilled in the art can understand that: all or part of the steps of implementing the above method embodiments can be completed by hardware related to program instructions, the aforementioned program can be stored in a readable storage medium, and when the program is executed, it executes the steps of the above method embodiments; and the aforementioned storage medium includes: mobile storage devices, read-only memories (ROM, Read-Only Memory), random access memories (RAM, Random Access Memory), disks or optical disks, and other media that can store program codes.

[0186] Alternatively, if the above-mentioned integrated unit of the present invention is implemented in the form of a software function module and sold or used as an independent product, it can also be stored in a readable storage medium. Based on this understanding, the technical solution of the embodiment of the present invention can be essentially or partly reflected in the form of a software product that contributes to the prior art. The software product is stored in a storage medium and includes several instructions for a computer device (which can be a personal computer, server, or network device, etc.) to execute all or part of the methods described in each embodiment of the present invention. The aforementioned storage medium includes: various media that can store program codes, such as mobile storage devices, ROM, RAM, magnetic disks or optical disks.

Claims

1. A positioning error feedback and compensation method for a wafer inspection platform, characterized in that: The following steps are involved: Monitor the actual positioning information of the target wafer inspection station and extract multiple sets of actual positioning characteristic data; Acquire standard positioning characteristic data, and process it in combination with the actual positioning characteristic data to obtain a positioning error index; Acquire the mechanical structure characteristic data and sensor characteristic data of the target wafer inspection platform, and process to obtain the inspection platform design error index; Acquire the working condition characteristic data of the target wafer inspection station, and process to obtain the working condition error correction coefficient; Processing is performed according to the positioning error index, the detection platform design error index and the working condition error correction coefficient to obtain a positioning error compensation index, and positioning error compensation is performed on the target wafer detection platform according to the positioning error compensation index; Acquire multiple sets of position information after compensation, extract corresponding positioning error statistical data, process to obtain error compensation effect index, judge the error compensation effect according to the error compensation effect index and make corresponding adjustments.

2. The positioning error feedback and compensation method of the wafer inspection platform according to claim 1, characterized in that: The actual positioning information of the monitoring target wafer inspection station and extracting multiple groups of actual positioning characteristic data include: Monitor the actual positioning information of the target wafer inspection platform, including plane coordinate position information, height information and angle information; A plurality of groups of actual positioning characteristic data are extracted according to the plane coordinate position information, height information and angle information, including actual position data, actual height data and actual angle data.

3. The positioning error feedback and compensation method of the wafer inspection platform according to claim 2, characterized in that: The acquiring of standard positioning characteristic data and processing in combination with the actual positioning characteristic data to obtain a positioning error index includes: Acquire standard positioning characteristic data corresponding to the actual position data, actual height data and actual angle data, including standard position data, standard height data and standard angle data; The standard position data, standard height data and standard angle data are combined with the actual position data, actual height data and actual angle data and processed through a preset positioning error evaluation model to obtain a positioning error amount index.

4. The positioning error feedback and compensation method of the wafer inspection platform according to claim 3, characterized in that: The step of acquiring the mechanical structure characteristic data and the sensor characteristic data of the target wafer inspection platform and processing to obtain the inspection platform design error index includes: Acquiring mechanical structure characteristic data and sensor characteristic data of the target wafer inspection platform; The mechanical structure characteristic data includes guide rail straightness data, table surface flatness data and transmission system accuracy data; The sensor characteristic data includes position sensor resolution data and force sensor sensitivity data; The guide rail straightness data, table surface flatness data and transmission system accuracy data are processed in combination with the position sensor resolution data and force sensor sensitivity data to obtain a test bench design error index.

5. The positioning error feedback and compensation method of the wafer inspection platform according to claim 4, characterized in that: The processing is performed according to the positioning error index, the detection platform design error index and the working condition error correction coefficient to obtain the positioning error compensation index, and the positioning error compensation is performed on the target wafer detection platform according to the positioning error compensation index, including: The positioning error compensation index is obtained by processing the positioning error index, the detection platform design error index and the working condition error correction coefficient through a preset positioning error compensation model; The positioning error of the target wafer inspection station is compensated according to the positioning error compensation amount index.

6. The positioning error feedback and compensation method of the wafer inspection platform according to claim 5, characterized in that: The method of obtaining multiple sets of position information after compensation, extracting corresponding positioning error statistical data, processing to obtain an error compensation effect index, and judging the error compensation effect according to the error compensation effect index and making corresponding adjustments includes: Acquire multiple sets of position information of the target wafer inspection station after compensation, and extract corresponding positioning error statistical data; The positioning error statistical data includes position error maximum value data, position error standard deviation data, angle error maximum value data, angle error standard deviation data, height error maximum value data and height error standard deviation data; Processing is performed according to the positioning error statistical data to obtain an error compensation effect index; Comparing the obtained error compensation effect index with a preset obtained error compensation effect threshold to obtain a comparison result; The error compensation effect is judged according to the comparison result and corresponding adjustments are made.

7. A positioning error feedback and compensation system for a wafer inspection platform, characterized in that: The system includes: a memory and a processor, wherein the memory includes a program of a positioning error feedback and compensation method of a wafer detection platform, and when the program of the positioning error feedback and compensation method of the wafer detection platform is executed by the processor, the following steps are implemented: Monitor the actual positioning information of the target wafer inspection station and extract multiple sets of actual positioning characteristic data; Acquire standard positioning characteristic data, and process it in combination with the actual positioning characteristic data to obtain a positioning error index; Acquire the mechanical structure characteristic data and sensor characteristic data of the target wafer inspection platform, and process to obtain the inspection platform design error index; Acquire the working condition characteristic data of the target wafer inspection station, and process to obtain the working condition error correction coefficient; Processing is performed according to the positioning error index, the detection platform design error index and the working condition error correction coefficient to obtain a positioning error compensation index, and positioning error compensation is performed on the target wafer detection platform according to the positioning error compensation index; Acquire multiple sets of position information after compensation, extract corresponding positioning error statistical data, process to obtain error compensation effect index, judge the error compensation effect according to the error compensation effect index and make corresponding adjustments.

8. The positioning error feedback and compensation system of the wafer inspection platform according to claim 7, characterized in that: The actual positioning information of the monitoring target wafer inspection station and extracting multiple groups of actual positioning characteristic data include: Monitor the actual positioning information of the target wafer inspection platform, including plane coordinate position information, height information and angle information; A plurality of groups of actual positioning characteristic data are extracted according to the plane coordinate position information, height information and angle information, including actual position data, actual height data and actual angle data.

9. The positioning error feedback and compensation system of the wafer inspection platform according to claim 8, characterized in that: The acquiring of standard positioning characteristic data and processing in combination with the actual positioning characteristic data to obtain a positioning error index includes: Acquire standard positioning characteristic data corresponding to the actual position data, actual height data and actual angle data, including standard position data, standard height data and standard angle data; The standard position data, standard height data and standard angle data are combined with the actual position data, actual height data and actual angle data and processed through a preset positioning error evaluation model to obtain a positioning error amount index.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium includes a positioning error feedback and compensation method program for a wafer inspection platform. When the positioning error feedback and compensation method program for a wafer inspection platform is executed by a processor, the steps of the positioning error feedback and compensation method for a wafer inspection platform as described in any one of claims 1 to 6 are implemented.

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