Semiconductor package device

By using the meshing connection between the lower bevel gear and the side bevel gear and the threaded connection of the threaded screw in the semiconductor packaging device, the adhesive spray head is driven to uniformly apply glue, and the adaptive clamping of the packaging plate is achieved through the electric suction cup and auxiliary gear system. , solves the problems of unstable clamping of the packaging plate and uneven thermal solidification, and improves packaging efficiency and stability.

CN119133014AInactive Publication Date: 2024-12-13廖克成
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Patent Information

Application Number
CN202411222835.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-09-02
Publication Date
2024-12-13
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

The existing semiconductor packaging devices have problems of unstable clamping of the packaging plate and uneven thermal solidification, which affects the packaging effect and efficiency.

Method used

A semiconductor packaging device was designed, using the meshing connection between the lower bevel gear and the side bevel gear, and the threaded connection between the threaded screw and the sliding plate, which drove the glue spray head to uniformly apply glue, and the packaging plate was realized through the electric suction cup and auxiliary gear system. Adaptive clamping and thermal airflow ensure stable thermal solidity of the package housing.

Benefits of technology

The uniformity of glue coating and the stability of the packaging board are improved, ensuring the thermal stability of the packaging shell and the overall packaging efficiency.

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Abstract

The invention belongs to the technical field of semiconductor packaging, and discloses a semiconductor packaging device which comprises a sliding frame, the top end of the bottom of the sliding frame is fixedly connected with an adjusting motor, the output end of the adjusting motor penetrates through the sliding frame and is fixedly connected with a rotating disc, and the bottom end of the rotating disc is fixedly connected with an adjusting electric push rod. The output end of the adjusting electric push rod is fixedly connected with a main frame, the outer side of the upper end of the main frame is fixedly connected with a reset spring rod, the other end of the reset spring rod is fixedly connected with an L-shaped frame, the inner side surface of the L-shaped frame is slidably connected with a connecting rack, the bottom end of the main frame is slidably connected with a sliding plate, and the inner side surface of the sliding plate is rotatably connected with an adjusting gear. And the outer side surface of the adjusting gear is in engaged connection with the bottom end of the connecting rack, a hot air spray head is fixedly connected to the end, away from the sliding plate, of the adjusting gear, and a gluing spray head is fixedly connected to the bottom end of the middle of the sliding plate.
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Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor packaging, and in particular relates to a semiconductor packaging device. Background Art

[0002] Semiconductor packaging is the process of protecting integrated circuit chips so that they can be used on circuit boards and isolated from the external environment. The main purpose of packaging is to protect the chips from physical damage and chemical corrosion, while providing the necessary electrical connections. Packaging also helps to dissipate heat, ensuring that the chip maintains an appropriate temperature during operation. Existing semiconductor packaging requires steps such as patching, wire bonding, and gluing. The gluing step requires injecting packaging materials (usually plastic) between the chip and the lead frame to form a packaging shell. During the use of existing semiconductor packaging devices, there is an unstable clamping of the packaging board, which affects the overall packaging effect, and it is difficult to clamp multiple groups of packaging boards, affecting the processing efficiency. At the same time, during the gluing process, there is often a situation where the packaging material is not evenly thermally cured, affecting the packaging speed and effect. Summary of the invention

[0003] The present invention aims to solve the problems of unstable clamping and uneven thermal curing of the packaging plate in the prior art and proposes the following technical solutions:

[0004] A semiconductor packaging device comprises a slide, wherein an adjusting motor is fixedly connected to the top of the bottom of the slide, an output end of the adjusting motor passes through the slide and is fixedly connected to a rotating disk, the bottom end of the rotating disk is fixedly connected to an adjusting electric push rod, the output end of the adjusting electric push rod is fixedly connected to a main frame, a reset spring rod is fixedly connected to the outer side of the upper end of the main frame, the other end of the reset spring rod is fixedly connected to an L-shaped frame, the inner surface of the L-shaped frame is slidably connected to a connecting rack, the bottom end of the main frame is slidably connected to a sliding plate, the inner surface of the sliding plate is rotatably connected to an adjusting gear, the outer surface of the adjusting gear is meshed with the bottom end of the connecting rack, the upper end of the adjusting gear away from the sliding plate is fixedly connected to a hot air nozzle, and the middle bottom end of the sliding plate is fixedly connected to a glue coating nozzle.

[0005] As a preferred embodiment of the above technical solution, a driving motor is fixedly connected to the top middle part of the main frame, a lower bevel gear is fixedly connected to the output end of the driving motor, the outer surface of the lower bevel gear is meshingly connected to the side bevel gear, a threaded screw is fixedly connected to one end of the side bevel gear away from the lower bevel gear, the outer surfaces of both ends of the threaded screw are rotatably connected to the inner surface of the main frame, and the outer surface of the threaded screw is threadedly connected to the inner surface of the sliding plate.

[0006] As a preferred embodiment of the above technical solution, the inner surfaces of both ends of the sliding plate on one side are threadedly connected with guide threaded rods, both ends of the guide threaded rods are fixedly connected with cams, the outer surface of the cams abuts against the inner surface of the L-shaped frame, the middle bottom end of the main frame is fixedly connected with a base frame, and the bottom end of the base frame is fixedly connected with a positioning camera.

[0007] As a preferred embodiment of the above technical solution, the outer surface of the bottom end of the slide is slidably connected to a transverse guide rail, the outer surfaces of both ends of the transverse guide rail are slidably connected to lateral guide rails, the outer surfaces of the lateral guide rails are fixedly connected to a box body, the inner surface of the box body is slidably connected to a sliding drawer, and the front end of the sliding drawer is fixedly connected to a handle.

[0008] As a preferred embodiment of the above technical solution, an auxiliary electric push rod is fixedly connected to the top bottom of the handle, the output end of the auxiliary electric push rod is fixedly connected to the rear frame, the rear end of the rear frame is fixedly connected to the auxiliary motor, the output end of the auxiliary motor is fixedly connected to the U-shaped frame, the inner surface of the U-shaped frame is fixedly connected to a lateral electric push rod, the output end of the lateral electric push rod is fixedly connected to a connecting block, another lateral electric push rod is fixedly connected to the opposite surfaces of the left and right connecting blocks, and the output end of the lateral electric push rod is fixedly connected to a clamping assembly.

[0009] As a preferred embodiment of the above technical solution, the clamping assembly includes a positioning block, the upper and lower ends of the positioning block are fixedly connected with electric suction cups, the outer surface of the positioning block is fixedly connected with a guide frame, the end of the guide frame away from the positioning block is fixedly connected with a limiting plate, the outer surface of the guide frame is slidably connected with a sliding side plate, the opposite ends of the upper and lower sliding side plates are fixedly connected with an auxiliary rack, the outer surface of the auxiliary rack is meshingly connected with an auxiliary gear, the outer surface of the auxiliary gear is rotatably connected to the inner surface of the positioning block, and the end of the auxiliary gear away from the positioning block is fixedly connected to a limiting bevel gear.

[0010] As a preferred embodiment of the above technical solution, the upper and lower ends of the positioning block are fixedly connected to a fixing frame, the inner surfaces of the upper and lower fixing frames are rotatably connected to a threaded sleeve, an end of the threaded sleeve close to the positioning block is fixedly connected to an auxiliary bevel gear, the outer surface of the auxiliary bevel gear is meshingly connected to the outer surface of the limiting bevel gear, and an end of the fixed frame away from the positioning block is fixedly connected to a spring connecting rod, the upper end of the spring connecting rod is fixedly connected to a T-shaped threaded piece, and the outer surface of the bottom end of the T-shaped threaded piece is threadedly connected to the inner surface of the threaded sleeve.

[0011] As a preferred embodiment of the above technical solution, the inner surfaces of the upper and lower ends of the limit plate are rotatably connected to a rotating arm, the other end of the rotating arm is rotatably connected to the limit frame, the outer surface of the limit frame is slidably connected to the outer surface of the sliding side plate, and one end of the limit frame close to the positioning block is fixedly connected to a shock absorber, and the other end of the shock absorber is fixedly connected to a flexible push plate.

[0012] As a preferred embodiment of the above technical solution, a display screen is fixedly connected to the front inclined surface of the box body, and an end of the sliding side plate close to the positioning block and an outer side of the positioning block are both made of magnetic material with opposite magnetic poles.

[0013] The beneficial effects of the present invention are:

[0014] By providing a meshing connection between the lower bevel gear and the side bevel gear and a threaded connection between the threaded screw and the sliding plate, the glue spray heads on both sides can be driven to evenly apply glue between the chip and the lead frame, thereby improving the overall efficiency. The cam is driven to rotate by the threaded connection between the sliding plate and the guide threaded rod when the sliding plate moves left and right, thereby improving the reciprocating motion of the connecting rack driven by the cam, and then driving the adjusting gear to rotate back and forth, thereby performing hot blowing at different angles on the glue spraying place, thereby ensuring the thermal curing stability of the package shell;

[0015] The edge of the packaging plate is abutted and fixed through the output end of the electric suction cup to preliminarily fix the packaging plate. When the packaging plate is placed, the packaging plate squeezes the T-shaped threaded piece. Under the threaded transmission of the T-shaped threaded piece and the threaded sleeve, the auxiliary bevel gear is meshed with the limiting bevel gear, thereby driving the auxiliary gear to rotate, and then the sliding side plate is driven to move left and right through the meshing transmission of the auxiliary rack and the auxiliary gear, which can adaptively clamp the packaging plate and improve the overall stability and functionality. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 Shown is a perspective view of a semiconductor packaging device;

[0017] Figure 2 Shown is a schematic diagram of the internal structure of a semiconductor packaging device;

[0018] Figure 3 Shown is a partial connection schematic diagram of a semiconductor packaging device;

[0019] Figure 4 Shown is a perspective view of the clamping assembly;

[0020] Figure 5 It shows Figure 4 A local enlarged schematic diagram of the middle A;

[0021] Figure 6 Shown is a partial connection schematic diagram of a semiconductor packaging device;

[0022] Figure 7 Shown is a partially enlarged schematic diagram of a semiconductor packaging device from another viewing angle;

[0023] Figure 8 It shows Figure 7 A local enlarged schematic diagram of point B in the middle.

[0024] In the figure: 1. Slide; 2. Adjustment motor; 3. Adjustment electric push rod; 4. Main frame; 5. Reset spring rod; 6. L-shaped frame; 7. Connecting rack; 8. Sliding plate; 9. Adjustment gear; 10. Hot air nozzle; 11. Gluing nozzle; 12. Driving motor; 13. Lower bevel gear; 14. Side bevel gear; 15. Threaded screw; 16. Guide threaded rod; 17. Cam; 18. Bottom frame; 19. Positioning camera; 20. Horizontal guide rail; 21. Lateral guide rail; 22. Box; 23. Sliding drawer; 24. Handle; 25. Auxiliary electric push rod; 26. Rear frame; 27. Auxiliary motor; 28 , U-shaped frame; 29, lateral electric push rod; 30, connecting block; 31, clamping assembly; 3101, positioning block; 3102, electric suction cup; 3103, guide frame; 3104, limit plate; 3105, sliding side plate; 3106, auxiliary rack; 3107, auxiliary gear; 3108, limit bevel gear; 3109, fixed frame; 3110, threaded sleeve; 3111, auxiliary bevel gear; 3112, spring connecting rod; 3113, T-shaped threaded part; 3114, rotating arm; 3115, limit frame; 3116, shock absorber; 3117, flexible push plate; 32, display screen. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solution and advantages of the embodiments of the present invention more clear, the technical solution of the present invention will be clearly and completely described below in conjunction with the embodiments.

[0026] Embodiment 1: The present invention provides a semiconductor packaging device, such as Figure 1-Figure 8As shown, it includes a slide 1, the top of the bottom of the slide 1 is fixedly connected with an adjusting motor 2, the output end of the adjusting motor 2 passes through the slide 1 and is fixedly connected with a rotating disk, the bottom end of the rotating disk is fixedly connected with an adjusting electric push rod 3, the output end of the adjusting electric push rod 3 is fixedly connected with a main frame 4, the outer side of the upper end of the main frame 4 is fixedly connected with a reset spring rod 5, the other end of the reset spring rod 5 is fixedly connected with an L-shaped frame 6, the inner surface of the L-shaped frame 6 is slidably connected with a connecting rack 7, the bottom end of the main frame 4 is slidably connected with a sliding plate 8, the inner surface of the sliding plate 8 is rotatably connected with an adjusting gear 9, the outer surface of the adjusting gear 9 is meshed with the bottom end of the connecting rack 7, the upper end of the adjusting gear 9 away from the sliding plate 8 is fixedly connected with a hot air nozzle 10, the middle bottom end of the sliding plate 8 A glue spray nozzle 11 is fixedly connected, a driving motor 12 is fixedly connected to the top middle part of the main frame 4, a lower bevel gear 13 is fixedly connected to the output end of the driving motor 12, the outer surface of the lower bevel gear 13 is meshedly connected to the side bevel gear 14, a threaded screw 15 is fixedly connected to the end of the side bevel gear 14 away from the lower bevel gear 13, the outer surfaces of both ends of the threaded screw 15 are rotatably connected to the inner surface of the main frame 4, the outer surface of the threaded screw 15 is threadedly connected to the inner surface of the sliding plate 8, the inner surfaces of both ends of the sliding plate 8 on one side are threadedly connected to the guide threaded rod 16, the two ends of the guide threaded rod 16 are fixedly connected to the cam 17, the outer surface of the cam 17 abuts against the inner surface of the L-shaped frame 6, the middle bottom end of the main frame 4 is fixedly connected to the base frame 18, the base frame 1 The bottom end of the slide 8 is fixedly connected with a positioning camera 19, which is convenient for positioning the chip and the lead frame. The outer surface of the bottom end of the slide 1 is slidably connected with a transverse guide rail 20, and the outer surfaces of both ends of the transverse guide rail 20 are slidably connected with lateral guide rails 21. The outer surface of the lateral guide rail 21 is fixedly connected with a box 22, and the inner surface of the box 22 is slidably connected with a sliding drawer 23. The front end of the sliding drawer 23 is fixedly connected with a handle 24, and the bottom top of the handle 24 is fixedly connected with an auxiliary electric push rod 25. The output end of the auxiliary electric push rod 25 is fixedly connected with a rear frame 26, and the rear end of the rear frame 26 is fixedly connected with an auxiliary motor 27. The output end of the auxiliary motor 27 is fixedly connected with a U-shaped frame 28. At the same time, through the rear frame 26 and the U-shaped frame 28, it can be loaded in one time. , to install and fix the two packaging boards, improve the overall packaging efficiency and stability, the inner surface of the U-shaped frame 28 is fixedly connected with a lateral electric push rod 29, the output end of the lateral electric push rod 29 is fixedly connected with a connecting block 30, and the opposite surface of the left and right connecting blocks 30 is fixedly connected with another lateral electric push rod 29, and the output end of the lateral electric push rod 29 is fixedly connected with a clamping assembly 31. Through the meshing connection between the lower bevel gear 13 and the side bevel gear 14 and the threaded connection between the threaded screw 15 and the sliding plate 8, the glue spray heads 11 on both sides can be driven to evenly apply glue between the chip and the lead frame, thereby improving the overall efficiency, and the cam 17 is driven to rotate when the sliding plate 8 moves left and right and the threaded connection between the sliding plate 8 and the guide threaded rod 16,Thus, the cam 17 drives the connecting rack 7 to reciprocate, and then drives the adjusting gear 9 to rotate back and forth, so as to perform hot air blowing at different angles on the glue spraying area to ensure the thermal curing stability of the packaging shell.

[0027] like Figure 1-Figure 8As shown, the clamping assembly 31 includes a positioning block 3101, the upper and lower ends of the positioning block 3101 are fixedly connected with an electric suction cup 3102, the outer surface of the positioning block 3101 is fixedly connected with a guide frame 3103, the end of the guide frame 3103 away from the positioning block 3101 is fixedly connected with a limiting plate 3104, the outer surface of the guide frame 3103 is slidably connected with a sliding side plate 3105, the opposite ends of the upper and lower sliding side plates 3105 are fixedly connected with an auxiliary rack 3106, the outer surface of the auxiliary rack 3106 is meshed with an auxiliary gear 3107, the outer surface of the auxiliary gear 3107 is rotatably connected to the inner surface of the positioning block 3101, and the end of the auxiliary gear 3107 away from the positioning block 3101 is fixedly connected with a limiting plate 3104. A limited bevel gear 3108 is fixedly connected, and the upper and lower ends of the positioning block 3101 are fixedly connected with a fixing frame 3109. The inner surfaces of the upper and lower fixing frames 3109 are rotatably connected with a threaded sleeve 3110. An end of the threaded sleeve 3110 close to the positioning block 3101 is fixedly connected with an auxiliary bevel gear 3111. The outer surface of the auxiliary bevel gear 3111 is meshed with the outer surface of the limited bevel gear 3108. An end of the fixing frame 3109 away from the positioning block 3101 is fixedly connected with a spring connecting rod 3112. The upper end of the spring connecting rod 3112 is fixedly connected with a T-shaped threaded member 3113. The outer surface of the bottom end of the T-shaped threaded member 3113 is threadedly connected with the inner surface of the threaded sleeve 3110. The limiting plate The inner surfaces of the upper and lower ends of 3104 are rotatably connected with a rotating arm 3114, and the other end of the rotating arm 3114 is rotatably connected to a limiting frame 3115. The outer surface of the limiting frame 3115 is slidably connected to the outer surface of the sliding side plate 3105. One end of the limiting frame 3115 close to the positioning block 3101 is fixedly connected with a shock absorber 3116, and the other end of the shock absorber 3116 is fixedly connected with a flexible push plate 3117. The front end inclined surface of the box body 22 is fixedly connected with a display screen 32, which is convenient for overall control and improves overall reliability. The end of the sliding side plate 3105 close to the positioning block 3101 and the outer side of the positioning block 3101 are made of magnetic material, and the magnetic poles are opposite, which can be used on the flexible push plate 3117 to seal. When the plate is installed and clamped, it is ensured that the flexible push plate 3117 does not rebound, thereby improving the reliability and stability of the clamping. The edge of the packaging plate is abutted and fixed by the output end of the electric suction cup 3102, and the packaging plate is preliminarily fixed. When the packaging plate is placed, the packaging plate squeezes the T-shaped threaded member 3113. Under the threaded transmission of the T-shaped threaded member 3113 and the threaded sleeve 3110, the auxiliary bevel gear 3111 is meshed with the limiting bevel gear 3108, thereby driving the auxiliary gear 3107 to rotate, and then the sliding side plate 3105 is driven to move left and right through the meshing transmission of the auxiliary rack 3106 and the auxiliary gear 3107, so that the packaging plate can be adaptively clamped, thereby improving the overall stability and functionality.

[0028] Working principle: when in use, pull out the sliding drawer 23, start the lateral electric push rod 29 to pre-adjust the position of the positioning block 3101, place the corners of the packaging board on the upper ends of the electric suction cup 3102 and the flexible push plate 3117, and use the output end of the electric suction cup 3102 to abut and fix the edge of the packaging board to preliminarily fix the packaging board. When placing the packaging board, the packaging board squeezes the T-shaped threaded piece 3113. Under the threaded transmission of the T-shaped threaded piece 3113 and the threaded sleeve 3110, the auxiliary bevel gear 3111 is meshed with the limiting bevel gear 3108, thereby driving the auxiliary gear 3107 to rotate, and then the sliding side plate 3105 is driven to move left and right through the meshing transmission of the auxiliary rack 3106 and the auxiliary gear 3107, so as to adaptively clamp the packaging board and improve the overall stability and functionality. At the same time, through the rear frame 26 and the U-shaped frame 28, two packaging boards can be installed in one loading. Fixation improves the overall packaging efficiency and stability. The chip and lead frame are positioned by positioning the positioning camera 19. The lateral guide rail 21 and the transverse guide rail 20 are started to drive the glue spray head 11 to the required gluing position. The adjusting motor 2 is started to adjust the overall angle of the main frame 4 to improve the overall stability and functionality. The meshing connection between the lower bevel gear 13 and the side bevel gear 14 and the threaded connection between the threaded screw 15 and the sliding plate 8 can drive the glue spray heads 11 on both sides to evenly apply glue between the chip and the lead frame to improve the overall efficiency. The cam 17 is driven to rotate when the sliding plate 8 moves left and right and the threaded connection between the sliding plate 8 and the guide threaded rod 16, thereby improving the cam 17 driving the connecting rack 7 to reciprocate, and then driving the adjusting gear 9 to rotate back and forth, and starting the hot air spray head 10 to perform hot blowing at different angles on the glue spraying area to ensure the thermal curing stability of the packaging shell. The above steps are repeated multiple times to complete the packaging.

[0029] The above embodiments are only used to illustrate the technical solutions of the present invention, but not to limit them.

Claims

1. A semiconductor packaging device, characterized in that: The invention comprises a slide frame (1), wherein the top of the bottom of the slide frame (1) is fixedly connected to an adjusting motor (2), the output end of the adjusting motor (2) passes through the slide frame (1) and is fixedly connected to a rotating disk, the bottom end of the rotating disk is fixedly connected to an adjusting electric push rod (3), the output end of the adjusting electric push rod (3) is fixedly connected to a main frame (4), the outer side of the upper end of the main frame (4) is fixedly connected to a return spring rod (5), the other end of the return spring rod (5) is fixedly connected to an L-shaped frame (6), and the The inner surface of the L-shaped frame (6) is slidably connected to a connecting rack (7), the bottom end of the main frame (4) is slidably connected to a sliding plate (8), the inner surface of the sliding plate (8) is rotatably connected to an adjusting gear (9), the outer surface of the adjusting gear (9) is meshingly connected to the bottom end of the connecting rack (7), the upper end of the adjusting gear (9) away from the sliding plate (8) is fixedly connected to a hot air nozzle (10), and the middle bottom end of the sliding plate (8) is fixedly connected to a glue spray nozzle (11).

2. The semiconductor packaging device according to claim 1, wherein: A driving motor (12) is fixedly connected to the top of the middle part of the main frame (4), and a lower bevel gear (13) is fixedly connected to the output end of the driving motor (12). The outer surface of the lower bevel gear (13) is meshingly connected to a side bevel gear (14), and a threaded screw (15) is fixedly connected to one end of the side bevel gear (14) away from the lower bevel gear (13). The outer surfaces of both ends of the threaded screw (15) are rotatably connected to the inner surface of the main frame (4), and the outer surface of the threaded screw (15) is threadedly connected to the inner surface of the sliding plate (8).

3. The semiconductor packaging device according to claim 2, wherein: The inner surfaces of both ends of the sliding plate (8) on one side are threadedly connected to guide threaded rods (16), and the two ends of the guide threaded rod (16) are fixedly connected to cams (17), and the outer surface of the cam (17) abuts against the inner surface of the L-shaped frame (6). The middle bottom end of the main frame (4) is fixedly connected to a base frame (18), and the bottom end of the base frame (18) is fixedly connected to a positioning camera (19).

4. The semiconductor packaging device according to claim 2, wherein: The outer surface of the bottom end of the slide (1) is slidably connected to a transverse guide rail (20), the outer surfaces of both ends of the transverse guide rail (20) are slidably connected to lateral guide rails (21), the outer surface of the lateral guide rail (21) is fixedly connected to a box body (22), the inner surface of the box body (22) is slidably connected to a sliding drawer (23), and the front end of the sliding drawer (23) is fixedly connected to a handle (24).

5. The semiconductor packaging device according to claim 4, wherein: The top of the bottom of the handle (24) is fixedly connected to an auxiliary electric push rod (25), the output end of the auxiliary electric push rod (25) is fixedly connected to a rear frame (26), the rear end of the rear frame (26) is fixedly connected to an auxiliary motor (27), the output end of the auxiliary motor (27) is fixedly connected to a U-shaped frame (28), the inner surface of the U-shaped frame (28) is fixedly connected to a lateral electric push rod (29), the output end of the lateral electric push rod (29) is fixedly connected to a connecting block (30), the opposite surfaces of the left and right connecting blocks (30) are fixedly connected to another lateral electric push rod (29), and the output end of the lateral electric push rod (29) is fixedly connected to a clamping assembly (31).

6. The semiconductor packaging device according to claim 5, wherein: The clamping assembly (31) comprises a positioning block (3101), the upper and lower ends of the positioning block (3101) are fixedly connected with electric suction cups (3102), the outer surface of the positioning block (3101) is fixedly connected with a guide frame (3103), one end of the guide frame (3103) away from the positioning block (3101) is fixedly connected with a limiting plate (3104), the outer surface of the guide frame (3103) is slidably connected with a sliding side plate (3105), the upper and lower opposite ends of the sliding side plates (3105) are fixedly connected with an auxiliary rack (3106), the outer surface of the auxiliary rack (3106) is meshedly connected with an auxiliary gear (3107), the outer surface of the auxiliary gear (3107) is rotatably connected to the inner surface of the positioning block (3101), and the end of the auxiliary gear (3107) away from the positioning block (3101) is fixedly connected with a limiting bevel gear (3108).

7. The semiconductor packaging device according to claim 6, wherein: The upper and lower ends of the positioning block (3101) are fixedly connected to a fixing frame (3109), and the inner surfaces of the upper and lower fixing frames (3109) are rotatably connected to a threaded sleeve (3110). An end of the threaded sleeve (3110) close to the positioning block (3101) is fixedly connected to an auxiliary bevel gear (3111), and the outer surface of the auxiliary bevel gear (3111) is meshingly connected to the outer surface of the limiting bevel gear (3108). An end of the fixing frame (3109) away from the positioning block (3101) is fixedly connected to a spring connecting rod (3112), and the upper end of the spring connecting rod (3112) is fixedly connected to a T-shaped threaded member (3113), and the outer surface of the bottom end of the T-shaped threaded member (3113) is threadedly connected to the inner surface of the threaded sleeve (3110).

8. The semiconductor packaging device according to claim 6, wherein: The inner surfaces of the upper and lower ends of the limit plate (3104) are rotatably connected to a rotating arm (3114), and the other end of the rotating arm (3114) is rotatably connected to a limit frame (3115), and the outer surface of the limit frame (3115) is slidably connected to the outer surface of the sliding side plate (3105), and one end of the limit frame (3115) close to the positioning block (3101) is fixedly connected to a shock absorber (3116), and the other end of the shock absorber (3116) is fixedly connected to a flexible push plate (3117).

9. The semiconductor packaging device according to claim 6, wherein: The front inclined surface of the box body (22) is fixedly connected with a display screen (32); the end of the sliding side plate (3105) close to the positioning block (3101) and the outer side of the positioning block (3101) are both made of magnetic material and have opposite magnetic poles.

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