Semiconductor device surface processing pre-oxidation treatment device

Abstract

The invention discloses a semiconductor device surface processing pre-oxidation treatment device, and belongs to the field of semiconductor device processing. The semiconductor device surface processing pre-oxidation treatment device comprises a box body, a fixing frame is arranged in the box body, a pressing plate is fixed to the fixing frame in a bolt connection mode, and a semiconductor device can be tightly pressed on the fixing frame; a second spraying assembly and a first spraying assembly are respectively arranged above and below the fixed frame and are used for spraying hydrogen peroxide to the two side surfaces of the semiconductor device; a rotating shaft is arranged at one end of the fixing frame, a sliding block capable of sliding in a reciprocating mode is arranged on the inner side wall of the box body, the rotating shaft is rotationally connected with the sliding block, a first gear is fixed to the rotating shaft, and a rack meshed with the first gear is fixed to the box body, so that the fixing frame is driven to turn over in a reciprocating mode to execute spin-drying operation. And redundant hydrogen peroxide can be thrown into the box body, so that concentrated recycling is facilitated.

Description

Technical Field

[0001] The invention belongs to the field of semiconductor device processing, and in particular relates to a semiconductor device surface processing pre-oxidation treatment device. Background Art

[0002] Semiconductor devices are electronic devices with conductivity between good conductors and insulators. They use the special electrical properties of semiconductor materials to complete specific functions. They can be used to generate, control, receive, transform, amplify signals and perform energy conversion. The semiconductor materials of semiconductor devices are silicon, germanium or gallium arsenide, and they can be used as rectifiers, oscillators, light emitters, amplifiers, photometers and other equipment.

[0003] In the prior art, it is necessary to perform a pre-oxidation test on the outer surface shell of a processed and formed semiconductor device. During the pre-oxidation treatment, it is necessary to first spray hydrogen peroxide on the surface of the semiconductor device and then perform a drying treatment. Direct drying after spraying hydrogen peroxide will cause a waste of hydrogen peroxide. Therefore, a semiconductor device surface processing pre-oxidation treatment device is proposed. Summary of the invention

[0004] In view of the deficiencies in the prior art, the purpose of the present invention is to provide a semiconductor device surface processing pre-oxidation treatment device to solve the problems in the prior art.

[0005] The purpose of the present invention can be achieved through the following technical solutions:

[0006] A semiconductor device surface processing pre-oxidation treatment device comprises a box body, a fixed frame is arranged in the box body, a pressing plate is fixed on the fixed frame by bolt connection, and the semiconductor device can be pressed on the fixed frame; a second spraying assembly and a first spraying assembly are respectively arranged above and below the fixed frame to spray hydrogen peroxide on both sides of the semiconductor device;

[0007] A rotating shaft is provided at one end of the fixed frame, and a sliding block capable of reciprocating sliding is provided on the inner wall of the box body. The rotating shaft is rotatably connected to the sliding block, a first gear is fixed on the rotating shaft, and a rack meshing with the first gear is fixed on the box body, thereby driving the fixed frame to flip back and forth to perform a spin-drying operation, and can spin excess hydrogen peroxide into the box body for convenient centralized recycling.

[0008] Furthermore, the slider is slidably connected to the box body, a rotatable first screw rod is arranged on the box body, the first screw rod passes through the slider and is threadedly connected to the slider; the thread lead angle of the first screw rod is smaller than the equivalent friction angle.

[0009] Furthermore, a support plate is fixed on the outside of the box body, and the second spray assembly includes a second mounting plate slidably connected to the support plate, a plurality of second spray pipes are arranged on the second mounting plate, and a spray head is arranged on the second spray pipe; a second screw rod capable of rotation is arranged on the support plate, and the second screw rod passes through the second mounting plate and is threadedly connected thereto;

[0010] A connecting plate is arranged above the box body, an upper cover is arranged below the connecting plate, a first fixing plate is arranged on one side of the connecting plate, the first fixing plate is slidably connected to the support plate, the second screw rod passes through the first fixing plate and is threadedly connected thereto, and the upper cover can be moved to the upper end of the box body and seal the upper end of the box body.

[0011] Furthermore, the thread lead angle of the second screw is smaller than the equivalent friction angle.

[0012] Furthermore, two guide rods are provided at the upper end of the upper cover, which penetrate the connecting plate in the vertical direction and are slidably connected thereto, and a frustum is provided at the upper end of the guide rod, the diameter of the frustum is larger than the diameter of the guide rod, and a first spring is sleeved on the guide rod, and the two ends of the first spring are respectively fixed to the upper cover and the connecting plate, and under the elastic force of the first spring, the frustum is tightly attached to the upper end surface of the connecting plate.

[0013] Furthermore, a first inclined surface is provided on one side of the upper cover, and a second inclined surface is provided on one side of the upper end of the box body. When the upper cover approaches the box body, the first inclined surface contacts the second inclined surface, and the upper cover rises to squeeze the first spring, so that the upper cover is tightly attached to the upper end of the box body under the elastic force of the first spring.

[0014] Furthermore, a second gear is fixed on the first screw rod, and a locking assembly is arranged on the outer side of the box body. The locking assembly includes a fixing frame fixed on the outer side of the box body, a sliding rod is slidably connected to the fixing frame, a clamping block is arranged at one end of the sliding rod, and a second fixing plate is arranged at the other end. A second spring is sleeved on the sliding rod, and the two ends of the second spring are fixedly connected with the fixing frame and the second fixing plate respectively. Under the pulling force of the second spring, one end of the sliding rod is tightly attached to the outer side of the box body, and at this time, the clamping block is engaged with two adjacent teeth of the second gear.

[0015] Furthermore, a blocking rod is fixed to the upper end of the sliding rod, and a push rod is provided on one side of the connecting plate. When the upper cover approaches the upper end of the box body, the push rod can contact the blocking rod and drive the blocking block to overcome the pulling force of the second spring and slide in the direction away from the second gear; and when the upper cover just reaches the upper end of the box body and completely blocks the upper end of the box body, the blocking block just leaves the second gear.

[0016] Furthermore, the first spray assembly includes a first mounting plate fixed on the outside of the box body, and a plurality of first spray pipes are arranged on the first mounting plate. The first spray pipes penetrate the side wall of the box body and enter the interior of the box body. A nozzle is arranged at the end of the first spray pipe, and under the action of a pump, the lower surface of the semiconductor device can be sprayed.

[0017] Beneficial effects of the present invention:

[0018] 1. The semiconductor device is fixed by arranging a fixing component in the box, and a second spraying component and a first spraying component are respectively arranged on the upper and lower sides of the fixing component to spray hydrogen peroxide on both sides of the semiconductor device; and a fixing frame that can be flipped back and forth is arranged in the fixing component to perform a spin-drying operation, and the excess hydrogen peroxide can be thrown into the box for centralized recycling.

[0019] 2. An upper cover assembly is provided at the upper end of the box to shield and seal the upper end of the box, and a locking assembly is provided to control the timing of the spin drying, so as to ensure that only when the upper end of the box is completely shielded by the upper cover, the slider can slide back and forth to perform the spin drying action, thereby avoiding the waste of hydrogen peroxide being thrown out of the box. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0021] Figure 1 It is a schematic diagram of the overall structure of the pre-oxidation treatment device of the present invention;

[0022] Figure 2 It is a schematic diagram of the box structure of the present invention;

[0023] Figure 3 It is a schematic diagram of the internal structure of the box of the present invention;

[0024] Figure 4 is a schematic structural diagram of a first spray assembly of the present invention;

[0025] Figure 5 is a schematic structural diagram of a second spray assembly of the present invention;

[0026] Figure 6 It is a schematic diagram of the structure of the fixing assembly of the present invention;

[0027] Figure 7 It is a schematic diagram of the structure of the upper cover assembly of the present invention;

[0028] Figure 8 It is a schematic diagram of the upper cover structure of the present invention;

[0029] Fig. 9 It is a schematic diagram of the structure of the clamping assembly of the present invention. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] like Figures 1 to 3 As shown, a semiconductor device surface processing pre-oxidation treatment device comprises a box body 1, the upper end of the box body 1 is open, and the semiconductor device is pre-oxidized in the box body 1; a fixing component 4 is arranged in the box body 1 to fix the semiconductor device, and a first spraying component 2 and a second spraying component 3 are arranged below and above the fixing component 4 respectively to spray hydrogen peroxide on the lower surface and the upper surface of the semiconductor device;

[0032] like Figure 4 As shown, the first spray assembly 2 includes a first mounting plate 21 fixed to the outside of the box body 1, and a plurality of first spray pipes 22 are arranged on the first mounting plate 21. The first spray pipes 22 penetrate the side wall of the box body 1 and enter the inside of the box body 1. A nozzle is arranged at the end of the first spray pipe 22, and under the action of a pump, the lower surface of the semiconductor device can be sprayed;

[0033] like Figure 5 As shown, the second spray assembly 3 includes a second mounting plate 31, on which a plurality of second spray pipes 33 are arranged. The second spray pipes 33 are provided with spray heads, which can spray hydrogen peroxide on the upper surface of the semiconductor device under the action of a pump.

[0034] like Figure 6 As shown, the fixing assembly 4 includes a fixing frame 41, and a pressing plate 42 is fixed to the fixing frame 41 by bolt connection, and the pressing plate 42 can press the semiconductor device onto the fixing frame 41;

[0035] A rotating shaft 43 is provided at one end of the fixed frame 41, and a slider 44 capable of reciprocating sliding is provided on the inner side wall of the box body 1. The rotating shaft 43 is rotatably connected to the slider 44. A first gear 45 is fixed on the rotating shaft 43, and a rack 46 is fixed on the box body 1. The rack 46 and the first gear 45 are meshed with each other, and the length direction of the rack 46 is parallel to the sliding direction of the slider 44. When the slider 44 reciprocates, it can drive the pair of frames 41 to reciprocate around the rotating shaft 43, so as to spin dry the semiconductor device sprayed with hydrogen peroxide, and spray the excess hydrogen peroxide in the box body 1 for convenient recycling;

[0036] It is worth mentioning that the initial position of the fixing frame 41 is located in the middle of the box body 1 , and at this time, the first spray assembly 2 and the second spray assembly 3 can be aligned with the lower surface and the upper surface of the semiconductor device respectively.

[0037] In this embodiment, the slider 44 is slidably connected to the box body 1, and a first screw rod 47 is rotatably connected to the box body 1. The first screw rod 47 passes through the slider 44 and is threadedly connected thereto. A motor is arranged on the outside of the box body 1 to drive the first screw rod 47 to rotate reciprocally, thereby driving the slider 44 to slide reciprocally. Moreover, the thread lead angle of the first screw rod 47 is smaller than the equivalent friction angle (i.e., it has self-locking properties) to ensure that the fixed frame 41 remains stable after the flipping position is adjusted.

[0038] Of course, the method of driving the slider 43 to slide back and forth includes but is not limited to the first screw rod 47 and other structures in this embodiment. In some embodiments, the slider 43 can also be directly driven to slide back and forth by setting a linear driving component such as a cylinder and a telescopic rod on the outside of the box body 1.

[0039] An upper cover assembly 7 is provided at the upper end of the box body 1, and the upper cover assembly 7 can cover the upper end of the box body 1 to prevent the hydrogen peroxide from being thrown out of the box body 1 and causing waste during the spin-drying operation;

[0040] A support plate 5 is fixed to the outside of the box body 1, and the second mounting plate 31 is slidably connected to the support plate 5. A rotatable second screw rod 6 is arranged on the second mounting plate 31, and the second screw rod 6 penetrates the second mounting plate 41 and is threadedly connected thereto. By controlling the rotation of the second screw rod 6, the second mounting plate 31 can be controlled to slide, so that the second spraying assembly 3 can be moved away from the top of the box body 1, so as to facilitate the upper cover assembly 7 to cover the top of the box body 1, and prevent the upper cover assembly 7 from colliding with the second spraying assembly 3;

[0041] Furthermore, the second screw rod 6 has a self-locking property, that is, the thread lead angle of the second screw rod 6 is smaller than the equivalent friction angle, so as to ensure that the second mounting bracket 31 and the upper cover assembly 7 remain stable after position adjustment.

[0042] like Figure 7 and Figure 8 As shown, the upper cover assembly 7 includes a connecting plate 71, an upper cover 72 is arranged below the connecting plate 71, a first fixing plate 711 is arranged on one side of the connecting plate 71, the first fixing plate 711 is slidably connected to the support plate 5, the second screw rod 6 passes through the first fixing plate 711 and is threadedly connected thereto, when the second screw rod 6 rotates, it can drive the upper cover assembly 7 and the second spray assembly to slide at the same time, and can enable the upper cover 72 to move to the upper end of the box body 1 for covering, while preventing the upper cover assembly 7 from colliding with the second spray assembly 3.

[0043] In this embodiment, two guide rods 721 are provided at the upper end of the upper cover 72. The guide rods 721 penetrate the connecting plate 71 in the vertical direction and are slidably connected thereto. A round table 722 is provided at the upper end of the guide rods 721. The diameter of the round table 722 is larger than the diameter of the guide rods 721. A first spring 73 is sleeved on the guide rods 721. The two ends of the first spring 73 are respectively fixed to the upper cover 72 and the connecting plate 71. Under the elastic force of the first spring 73, the round table 722 is tightly attached to the upper end surface of the connecting plate 72, and an elastic connection between the connecting plate 71 and the upper cover 72 is realized.

[0044] A first inclined surface 723 is provided on one side of the upper cover 72. Figure 2 As shown, a second inclined surface 11 is provided on one side of the upper end of the box body 1. When the upper cover 72 approaches the box body 1, the first inclined surface 723 can contact the second inclined surface 11 and move the upper cover 72 upward to squeeze the first spring 73, so that the upper cover 72 is tightly attached to the upper end surface of the box body 1 under the elastic force of the first spring 73, thereby improving the shielding and blocking effect on the upper end of the box body 1.

[0045] It is worth mentioning that when the fixing assembly 4 performs a spin-drying operation on the semiconductor device, if the upper cover 72 fails to block the upper end of the box body 1, part of the hydrogen peroxide will be thrown out of the box body 1 and cause waste; for this reason, in this embodiment, by providing a clamping assembly 8 on the outer side of the box body 1, the sliding timing of the slider 44 is limited, thereby controlling the spin-drying timing, ensuring that the slider 44 can slide back and forth to perform the spin-drying action only when the upper end of the box body 1 is completely blocked by the upper cover 72;

[0046] A second gear 48 is fixed to the first screw rod 47, and the engaging assembly 8 can engage with the second gear 48 to limit the rotation of the first screw rod 47, thereby limiting the sliding of the slider 44;

[0047] like Fig. 9 As shown, the engaging assembly 8 includes a fixing frame 81 fixed to the outside of the box body 1, a sliding rod 82 is arranged on the fixing frame 81, the sliding rod 82 penetrates the fixing frame 81 and is slidably connected thereto, a clamping block 83 is arranged at one end of the sliding rod 82, and a second fixing plate 84 is arranged at the other end, a second spring 85 is sleeved on the sliding rod 82, and the two ends of the second spring 85 are respectively fixedly connected with the fixing frame 81 and the second fixing plate 84, under the pulling force of the second spring 85, one end of the sliding rod 82 is tightly attached to the outside of the box body 1, and at this time, the clamping block 83 is clamped between two adjacent teeth of the second gear 48, thereby limiting the reciprocating sliding of the slider 44;

[0048] A blocking rod 86 is fixed to the upper end of the sliding rod 82, and a push rod 712 is provided on one side of the connecting plate 71. When the upper cover 72 approaches the upper end of the box body 1, the push rod 712 can contact the blocking rod 86 and drive the block 83 to overcome the pulling force of the second spring 85 and slide in the direction away from the second gear 48; and, when the upper cover 72 just reaches the upper end of the box body 1 and completely blocks the upper end of the box body 1, the block 83 just leaves the second gear 48. At this time, the spin-drying action of the semiconductor device is released and the spin-drying operation can be performed; thereby ensuring that when the fixed frame 41 is flipped back and forth (performing the spin-drying action), the upper end of the box body 1 is completely blocked.

[0049] Working principle:

[0050] The semiconductor device is fixed by setting a fixing component 4 in the box 1, and the second spraying component 3 and the first spraying component 2 are respectively set on the upper and lower sides of the fixing component 4 to spray hydrogen peroxide on the two sides of the semiconductor device; and the fixing frame 41 that can be flipped back and forth is set in the fixing component 4 to perform the spin-drying operation, and the excess hydrogen peroxide can be thrown into the box 1 for convenient centralized recycling. The upper cover component 7 is set at the upper end of the box 1 to block and close the upper end of the box 1, and the clamping component 8 is set to control the spin-drying time, ensuring that only when the upper end of the box 1 is completely blocked by the upper cover 72, the slider 44 can slide back and forth to perform the spin-drying action, avoiding the hydrogen peroxide being thrown out of the box 1 and causing waste.

[0051] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0052] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments, and the above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, and these changes and improvements all fall within the scope of the present invention to be protected.

Claims

1. A semiconductor device surface processing pre-oxidation treatment device, comprising a housing (1), characterized in that: A fixed frame (41) is arranged inside the box body (1), and a pressing plate (42) is fixed to the fixed frame (41) by means of bolt connection, and can press the semiconductor device onto the fixed frame (41); a second spraying assembly (3) and a first spraying assembly (2) are arranged above and below the fixed frame (41), respectively, to spray hydrogen peroxide on two sides of the semiconductor device; A rotating shaft (43) is provided at one end of the fixed frame (41); a sliding block (44) capable of reciprocating sliding is provided on the inner side wall of the box body (1); the rotating shaft (43) and the sliding block (44) are rotatably connected; a first gear (45) is fixed on the rotating shaft (43); and a rack (46) meshing with the first gear (45) is fixed on the box body (1).

2. The semiconductor device surface processing pre-oxidation treatment device according to claim 1, characterized in that: The slider (44) is slidably connected to the box body (1); a rotatable first screw rod (47) is arranged on the box body (1); the first screw rod (47) passes through the slider (44) and is threadedly connected to the slider; the thread lead angle of the first screw rod (47) is smaller than the equivalent friction angle.

3. The semiconductor device surface processing pre-oxidation treatment device according to claim 2, characterized in that: A support plate (5) is fixed on the outside of the box body (1); the second spray assembly (3) comprises a second mounting plate (31) slidably connected to the support plate (5); a plurality of second spray pipes (32) are arranged on the second mounting plate (31); and a spray head is arranged on the second spray pipe (32); a second screw rod (6) capable of rotation is arranged on the support plate (5); the second screw rod (6) passes through the second mounting plate (31) and is threadedly connected thereto; A connecting plate (71) is arranged above the box body (1), an upper cover (72) is arranged below the connecting plate (71), a first fixing plate (711) is arranged on one side of the connecting plate (71), the first fixing plate (711) is slidably connected to the support plate (5), the second screw rod (6) passes through the first fixing plate (711) and is threadedly connected thereto, and the upper cover (72) can be moved to the upper end of the box body (1) and seal the upper end of the box body (1).

4. The semiconductor device surface processing pre-oxidation treatment device according to claim 3, characterized in that: The thread lead angle of the second screw rod (6) is smaller than the equivalent friction angle.

5. The semiconductor device surface processing pre-oxidation treatment device according to claim 3, characterized in that: Two guide rods (721) are arranged at the upper end of the upper cover (72). The guide rods (721) penetrate the connecting plate (71) in the vertical direction and are slidably connected thereto. A round table (722) is arranged at the upper end of the guide rod (721). The diameter of the round table (722) is larger than the diameter of the guide rod (721). A first spring (73) is sleeved on the guide rod (721). Two ends of the first spring (73) are respectively fixed to the upper cover (72) and the connecting plate (71). Under the elastic force of the first spring (73), the round table (722) is tightly attached to the upper end surface of the connecting plate (72).

6. The semiconductor device surface processing pre-oxidation treatment device according to claim 5, characterized in that: A first inclined surface (723) is provided on one side of the upper cover (72), and a second inclined surface (11) is provided on one side of the upper end of the box body (1); when the upper cover (72) approaches the box body (1), the first inclined surface (723) contacts the second inclined surface (11), and the upper cover (72) is lifted up to press the first spring (73), so that the upper cover (72) is tightly attached to the upper end of the box body (1) under the elastic force of the first spring (73).

7. The semiconductor device surface processing pre-oxidation treatment device according to claim 3, characterized in that: A second gear (48) is fixed on the first screw rod (47), and a clamping assembly (8) is arranged on the outer side of the box body (1). The clamping assembly (8) comprises a fixing frame (81) fixed on the outer side of the box body (1), a sliding rod (82) is slidably connected to the fixing frame (81), a clamping block (83) is arranged at one end of the sliding rod (82), and a second fixing plate (84) is arranged at the other end, a second spring (85) is sleeved on the sliding rod (82), and the two ends of the second spring (85) are respectively fixedly connected with the fixing frame (81) and the second fixing plate (84), under the pulling force of the second spring (85), one end of the sliding rod (82) is tightly attached to the outer side of the box body (1), and at this time, the clamping block (83) is clamped between two adjacent teeth of the second gear (48).

8. The semiconductor device surface processing pre-oxidation treatment device according to claim 7, characterized in that: A stop rod (86) is fixed to the upper end of the sliding rod (82), and a push rod (712) is provided on one side of the connecting plate (71). When the upper cover (72) approaches the upper end of the box body (1), the push rod (712) can contact the stop rod (86) and drive the block (83) to overcome the pulling force of the second spring (85) and slide in a direction away from the second gear (48); and when the upper cover (72) just reaches the upper end of the box body (1) and completely blocks and shields the upper end of the box body (1), the block (83) just leaves the second gear (48).

9. The semiconductor device surface processing pre-oxidation treatment device according to claim 1, characterized in that: The first spray assembly (2) comprises a first mounting plate (21) fixed on the outside of the box body (1), a plurality of first spray pipes (22) are arranged on the first mounting plate (21), the first spray pipes (22) penetrate the side wall of the box body (1) and enter the interior of the box body (1), a nozzle is arranged at the end of the first spray pipe (21), and under the action of a pump, a spray operation can be performed on the lower surface of the semiconductor device.

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