Lead clamping mechanism of semiconductor bonding equipment

Abstract

The invention discloses a semiconductor bonding equipment lead wire clamping mechanism which is characterized in that a clamping adjusting device is arranged in a clamping body and comprises two fixed keys arranged on the inner wall of the clamping body, a first connecting rod hinged to the fixed keys and a movable key connected with the connecting rod; the second connecting rods are connected with the movable keys, the second connecting rods are connected with the clamping arms, a movable rod is connected between the two first connecting rods in a sliding mode, and an electroactive polymer module which can be contracted after being electrified is connected between the two movable keys; the high-sensitivity clamping of the chip is realized by adopting the electroactive polymer module; compared with the prior art, the chip is clamped through the coarse adjustment clamping arm and the fine adjustment clamping arm of the electroactive polymer module, the clamping sensitivity is higher, and the response is faster.

Description

Technical Field

[0001] The invention relates to a lead clamping mechanism for semiconductor bonding equipment, in particular to a lead clamping mechanism for semiconductor bonding equipment. Background Art

[0002] The wire clamping mechanisms in semiconductor bonding equipment are key components to ensure a smooth wire bonding process. These mechanisms are primarily responsible for securing and clamping the wires during the bonding process to ensure that the wires are positioned and oriented accurately, thus ensuring proper connection and performance between electronic components and circuit boards.

[0003] In the semiconductor bonding process, the main functions of the lead clamping mechanism include:

[0004] Wire Fixing: Ensuring that the wire does not move or twist during the bonding process is essential for achieving precise connections.

[0005] Precise clamping: The clamping of the lead needs to be precisely controlled to ensure that the clamping force is moderate so as not to damage the lead, and to ensure that the lead can be stably maintained in the desired position.

[0006] Fast response: With the enhancement of chip functions and the increase in the number of leads, the lead clamping mechanism needs to have the ability to respond quickly to cope with the increasingly faster bonding speed requirements.

[0007] The key points in the design of the lead clamping mechanism are mainly the driving mode and the clamping structure;

[0008] The driving mode has an important influence on its performance. Common driving modes include solenoid valve drive, voice coil motor drive, giant magnetostrictive drive, piezoelectric ceramic drive, etc.

[0009] The clamping structure usually includes a pair of jaws and a driver that provides displacement and force. The design of the jaws needs to take into account the size and material of the lead to ensure stable and accurate clamping.

[0010] Nowadays, all equipment uses pneumatic pistons to clamp and release the wires, but the response speed and sensitivity are somewhat lacking, which greatly limits the production efficiency of wire bonding equipment. Summary of the invention

[0011] The invention overcomes the shortcomings of the prior art and provides a lead clamping mechanism for semiconductor bonding equipment.

[0012] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: a lead clamping mechanism for semiconductor bonding equipment, comprising: a clamping body 1, a clamping arm 2 connected to the clamping body 1, a gold wire clamper 3 symmetrically connected between the clamping arms 2, and a clamping adjustment device 4 arranged in the clamping body 1; the clamping adjustment device 4 is connected to the clamping arm 2;

[0013] The clamping adjustment device 4 includes two fixed keys 41 arranged on the inner wall of the clamping body 1, two first connecting rods 42 hinged to the two fixed keys 41, two movable keys 43 connected to the two first connecting rods 42, two second connecting rods 44 connected to the two movable keys 43, and an adjustment screw 45 threadedly connected to the top of the clamping body 1; the second connecting rod 44 is connected to the clamping arm 2, a movable rod 46 is slidably connected between the two first connecting rods 42, and an electroactive polymer module 47 is connected between the two movable keys 43; the movable rod 46 is threadedly connected to the adjusting screw 45, and the electroactive polymer module 47 is connected to an external power supply.

[0014] In a preferred embodiment of the present invention, two of the first connecting rods 42 are symmetrically provided with sliding grooves in the length direction, and the movable rod 46 slides in the sliding grooves.

[0015] In a preferred embodiment of the present invention, the length of the movable rod 46 is shorter than the length of the first connecting rod 42 .

[0016] In a preferred embodiment of the present invention, the clamping arm 2 is provided with a detachable structure, and the detachable structure includes: a main arm connected to the clamping adjustment device 4, and a secondary arm threadedly connected to the main arm through screws.

[0017] In a preferred embodiment of the present invention, the manufacturing process of the electroactive polymer module 47 includes:

[0018] S1. Mix butyl acrylate, high electroactive monomer, initiator, first network crosslinker and second network crosslinker in appropriate proportion in a suitable amount of solvent to ensure that all components are fully dissolved to form a uniform premixed solution;

[0019] S2. Under the protection of inert gas, the premixed solution is stirred and deoxygenated for 15 minutes;

[0020] S3, aggregation to build IPN;

[0021] S5, vulcanizing the treated IPN polymer at 160° C. for 1-2 hours;

[0022] S5 , pre-stretching the vulcanized IPN material to obtain an electroactive polymer module 47 .

[0023] In a preferred embodiment of the present invention, the ratio is: 200:30-80:1:10:20:600.

[0024] In a preferred embodiment of the present invention, in step S3, the aggregation and construction of the IPN includes:

[0025] S31, heating the premixed solution to about 65° C. and maintaining the temperature for 1.5 hours to form a first polymer network;

[0026] After the first stage polymerization is completed, the second network crosslinking agent is added to the reaction system and stirring is continued to ensure uniform mixing;

[0027] S32, raising the temperature to 70°C and continuing the reaction for 2 hours to form an interpenetrating network structure.

[0028] In a preferred embodiment of the present invention, the highly electroactive monomer is a redox-active monomer; the initiator is benzoyl peroxide; the solvent is ethanol; the first network crosslinking agent is divinylbenzene, and the second network crosslinking agent is methylenebisacrylamide.

[0029] In a preferred embodiment of the present invention, the inert gas is nitrogen.

[0030] In a preferred embodiment of the present invention, the pre-stretching process includes:

[0031] S51, heating the vulcanized IPN material to 80° C.;

[0032] S52, then using a clamp to fix one end of the IPN material, and gradually stretching the other end to a stretching ratio of 150%-250% by a mechanical device;

[0033] S53, maintain the stretching state for 30 minutes;

[0034] S54, cooling the material to room temperature and fixing the shape, completing the pre-stretching process.

[0035] In a preferred embodiment of the present invention,

[0036] The present invention solves the defects existing in the background technology and has the following beneficial effects:

[0037] (1) A clamping adjustment device is arranged in the clamping body, the clamping adjustment device includes two fixed keys arranged on the inner wall of the clamping body, a first connecting rod hinged to the fixed keys, a movable key connected to the connecting rod, a second connecting rod connected to the movable key, the second connecting rod is connected to the clamping arm, a movable rod is slidably connected between the two first connecting rods, and an electroactive polymer module that can be contracted when powered is connected between the two movable keys; the electroactive polymer module is used to achieve high-sensitivity clamping of the chip; compared with the prior art, the clamping of the chip is completed by coarsely adjusting the clamping arm and finely adjusting the clamping arm using the electroactive polymer module, and the clamping sensitivity is higher and the response is faster.

[0038] (2) The manufacturing process of the electroactive polymer module adopts butyl acrylate, high electroactive monomer, initiator, first network crosslinker and second network crosslinker to mix them in a proper amount of solvent in a proportion; the sensitivity of the electroactive polymer module is improved; compared with the existing technology, the electroactive polymer module has higher sensitivity and more precise control.

[0039] (3) By manufacturing an interpenetrating network structure in the preparation process and then combining the interpenetrating network structure with a pre-stretching treatment preparation method, the sensitivity of the prepared electroactive polymer module is further improved; compared with the existing technology, the electroactive polymer module has higher sensitivity.

[0040] (4) By optimizing the pre-stretching ratio, the formed polymer molecular chains are forced to align along the stretching direction, increasing the interaction between the molecular chains, so that the molecular chains can respond more effectively to the electric field force under the action of the electric field; compared with the existing technology, it has higher sensitivity and more precise control BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the embodiment 1 of the present invention or the technical solution in the prior art, the drawings required to be used in the embodiment 1 or the prior art description are briefly introduced below. Obviously, the drawings in the following description are only some embodiments 1 recorded in the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work.

[0042] Figure 1 is a three-dimensional structural diagram of a preferred embodiment 1 of the present invention;

[0043] Figure 2 is a cross-sectional view of a preferred embodiment 1 of the present invention;

[0044] In the figure: 1. Clamping body; 2. Clamping arm; 3. Gold wire clamp; 4. Clamping adjustment device; 41. Fixed key; 42. First connecting rod; 43. Movable key; 44. Second connecting rod; 45. Adjusting screw; 46. Movable rod; 47. Electroactive polymer module. DETAILED DESCRIPTION

[0045] The technical solution in Example 1 of the present invention will be clearly and completely described below in conjunction with the drawings in Example 1 of the present invention. Obviously, the described Example 1 is only a part of Example 1 of the present invention, rather than all of Example 1. Based on Example 1 of the present invention, all other Examples 1 obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0046] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein. Therefore, the protection scope of the present invention is not limited to the specific embodiment 1 disclosed below.

[0047] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the scope of protection of the present application. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the invention, unless otherwise specified, "multiple" means two or more.

[0048] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood by specific circumstances.

[0049] like Figure 1 , Figure 2 As shown, a lead clamping mechanism for a semiconductor bonding device comprises:

[0050] A clamping body 1, a clamping arm 2 connected to the clamping body 1, a gold wire clamp 3 symmetrically connected between the clamping arms 2, and a clamping adjustment device 4 arranged in the clamping body 1; the clamping adjustment device 4 is connected to the clamping arm 2;

[0051] The clamping adjustment device 4 includes two fixed keys 41 arranged on the inner wall of the clamping body 1, two first connecting rods 42 hinged to the two fixed keys 41, two movable keys 43 connected to the two first connecting rods 42, two second connecting rods 44 connected to the two movable keys 43, and an adjustment screw 45 threadedly connected to the top of the clamping body 1; the second connecting rod 44 is connected to the clamping arm 2, a movable rod 46 is slidably connected between the two first connecting rods 42, and an electroactive polymer module 47 is connected between the two movable keys 43; the movable rod 46 is threadedly connected to the adjusting screw 45, and the electroactive polymer module 47 is connected to an external power supply.

[0052] Furthermore, the two first connecting rods 42 are symmetrically provided with sliding grooves in the length direction, and the movable rod 46 slides in the sliding grooves; further, the length of the movable rod 46 is shorter than that of the first connecting rod 42.

[0053] The movable rod 46 slides in the slide groove. Since the length of the movable rod 46 is smaller than the length of the first connecting rod 42 , the two connected clamping arms 2 are brought closer to each other, thereby achieving the effect of coarse adjustment of the clamping arms 2 .

[0054] Furthermore, the electroactive polymer module 47 can be connected to an external power source, and the electroactive polymer module 47 can shrink when the power source is turned on, thereby further refining the clamping operation; by coarse adjustment of the clamping arm 2 and fine adjustment of the clamping arm 2, precise clamping of the chip can be achieved.

[0055] Furthermore, the clamping arm 2 is provided with a detachable structure, and the detachable structure includes a main arm connected to the clamping adjustment device 4, and a sub-arm threadedly connected to the main arm through screws.

[0056] Specifically, because the two clamping arms 2 are connected to the clamping body 1, and the clamping adjustment device 4 is connected to the two clamping arms 2, the force of the clamping adjustment device 4 during adjustment is greater than the force connecting the clamping arms 2 and the clamping body 1, and force can be applied to the two clamping arms 2 so that the two clamping arms 2 can achieve clamping and loosening operations.

[0057] Furthermore, the manufacturing process of the electroactive polymer module 47 includes:

[0058] S1, mixing butyl acrylate, high electroactive monomer, initiator, first network crosslinking agent and second network crosslinking agent in a suitable amount of solvent in proportion to form a uniform premixed solution;

[0059] S2. Under the protection of inert gas, the premixed solution is stirred and deoxygenated for 15 minutes;

[0060] S3, aggregation to build IPN;

[0061] S4, vulcanizing the treated IPN polymer at 160° C. for 1-2 h;

[0062] S5. Pre-stretching the vulcanized IPN material.

[0063] Going further, the ratio is: 200:30-80:1:10:20:600.

[0064] Furthermore, the inert gas is nitrogen.

[0065] Specifically, the highly electroactive monomer is poly(3,4-ethylenedioxythiophene) (PEDOT) or polypyrrole (PPy), which can undergo a valence change during an electrochemical process, thereby exhibiting electroactivity;

[0066] The initiator is benzoyl peroxide; it is used to start the polymerization reaction, generate free radicals or ions, and thus initiate the polymerization of monomer molecules;

[0067] The solvent was ethanol with a concentration of 0.5 mol / L;

[0068] The first network crosslinking agent is divinylbenzene, and the second network crosslinking agent is methylenebisacrylamide;

[0069] Specifically, in step S3, the aggregation and construction of IPN includes:

[0070] S31, heating the premixed solution to about 65° C. and maintaining the temperature for 1.5 hours to form a first polymer network;

[0071] After the first stage polymerization is completed, the second network crosslinking agent is added to the reaction system and stirring is continued to ensure uniform mixing;

[0072] S32, raising the temperature to 70°C and continuing the reaction for 2 hours to form an interpenetrating network structure.

[0073] Furthermore, in step S5, a proper amount of vulcanization accelerator may be added during the vulcanization treatment to optimize the vulcanization effect.

[0074] More specifically, the pre-stretching process includes:

[0075] S51, heating the vulcanized IPN material to 80° C.;

[0076] S52, then use a special clamp to fix one end of the IPN material, and gradually stretch the other end to a stretching ratio of 150%-250% through a mechanical device;

[0077] S53, maintain the stretched state for 30 minutes;

[0078] S54, cooling the material to room temperature and fixing the shape, completing the pre-stretching process.

[0079] Embodiment 1:

[0080] S1, mixing butyl acrylate, poly (3,4-ethylenedioxythiophene), initiator, first network crosslinker, second network crosslinker and ethanol in a ratio of 200:60:1:10:20:600, the concentration of ethanol is 0.5 mol / L, ensuring that all components are fully dissolved to form a uniform premixed solution;

[0081] S2. Under the protection of inert gas, the premixed solution is stirred and deoxygenated for 15 minutes;

[0082] S31, heating the premixed solution to about 65° C. and maintaining the temperature for 1.5 hours to form a first polymer network;

[0083] After the first stage polymerization is completed, the second network crosslinking agent is added to the reaction system and stirring is continued to ensure uniform mixing;

[0084] S32, raising the temperature to 70°C and continuing the reaction for 2 hours to form an interpenetrating network structure.

[0085] S4, vulcanizing the treated IPN polymer at 160° C. for 1 h;

[0086] S5. Pre-stretching treatment of IPN material after vulcanization:

[0087] S51, heating the vulcanized IPN material to 80° C.;

[0088] S52, then use a special clamp to fix one end of the IPN material, and gradually stretch the other end to a stretching ratio of 200% through a mechanical device;

[0089] S53, maintain the stretched state for 30 minutes;

[0090] S54, cooling the material to room temperature and fixing the shape, completing the pre-stretching process.

[0091] Comparative Example 1: Based on Example 1, the difference is that butyl acrylate, poly (3,4-ethylenedioxythiophene), initiator, first network crosslinking agent and second network crosslinking agent are mixed in a suitable amount of solvent in a ratio of 200:30:1:10:20:600.

[0092] Comparative Example 2: Based on Example 1, the difference is that butyl acrylate, poly(3,4-ethylenedioxythiophene), initiator, first network crosslinking agent and second network crosslinking agent are mixed in a proper amount of solvent at a ratio of 200:45:1:10:20:600;

[0093] Comparative Example 3: Based on Example 1, the difference is that the other end is gradually stretched to a stretching ratio of 170% by a mechanical device.

[0094] Comparative Example 4: Based on Example 1, the difference is that the other end is gradually stretched to a stretching ratio of 225% by a mechanical device.

[0095] Specifically, for the electrical sensitivity of the test material, a direct test method is used: a force sensor is installed between the two gold wire clamps 3, and a control signal is sent to pass a voltage of 3V into the electroactive polymer module 47, so that the clamping arm 2 clamps the chip, and the force value data output by the force sensor is recorded; at the same time, a clear control signal trigger point is set, and a high-precision timer is used to record the time difference from the control signal being sent to the clamping mechanism starting to act; the direct test method is tested four times to verify the accuracy of the results;

[0096] Force value data = 0.5N-0.66N: stable clamping;

[0097] The force value data is less than 0.5N: unstable, the chip is easy to fall;

[0098] The force value is greater than 0.66N: the chip is easily damaged by excessive force;

[0099]

[0100]

[0101] According to the data in Table 1, it can be concluded that, compared with Comparative Examples 1 and 2, the force data of the electroactive polymer module 47 formed in the experimental example is more accurate and has the shortest time difference; this indicates that the force data of the electroactive polymer module 47 using the proportion of Example 1 is more stable and has high precision and higher sensitivity; the reason is that: the conjugated system in the molecular structure generated by the electroactive polymer module 47 formed in Example 1 has more active free movement of electrons on the polymer chain, and can generate a larger electric field driving force and is more stable under a smaller voltage change, and the conductivity and electroactivity are more obvious, so that the electroactive polymer module 47 finally formed has higher sensitivity; while too high poly(3,4-ethylenedioxythiophene) will cause the electrons to move freely on the polymer chain more actively, resulting in poor stability; while too low poly(3,4-ethylenedioxythiophene) will cause the electrons to move freely on the polymer chain too little, and the sensitivity is not high enough.

[0102] According to the data in Table 1, it can be concluded that, compared with Comparative Examples 3 and 4, the force data of the electroactive polymer module 47 formed in the experimental example is more accurate and the time difference is the shortest; this indicates that the force data of the electroactive polymer module 47 using the proportion of Example 1 is more stable and has high precision and higher sensitivity; the reason is that: using a lower stretching ratio leads to a decrease in the microstructure and conductive channel strength of the formed IPN material, thereby resulting in a decrease in performance and electrical sensitivity; using an excessively high stretching ratio, the macromolecular chains or fibers inside the material are arranged too compactly along the stretching direction, resulting in uneven length of the formed electroactive polymer module 47 and poor clamping stability.

[0103] In summary, the electroactive polymer module 47 made in Example 1 with a ratio of 200:60:1:10:20:600 and a stretching ratio of 200% has more stable force data and higher accuracy; at the same time, the response time is the shortest at this ratio; and the accuracy of the results is verified by testing four times, and it is concluded that the electroactive polymer module 47 at this ratio has the highest electrical sensitivity and is the most stable.

[0104] When the present invention is used, by rotating the adjusting screw 45, the movable rod 46 threadedly connected to the adjusting screw 45 slides downward on the connecting rod, so that the two clamping arms 2 connected to the connecting rod are brought close to each other to achieve coarse adjustment clamping, and then the electroactive polymer module 47 is energized, the electroactive polymer module 47 shrinks, and the clamping arm 2 is further contracted to achieve fine adjustment clamping of the clamping arm 2, and this clamping arm is used to clamp the chip.

[0105] The above is based on the ideal embodiment 1 of the present invention. Through the above description, relevant personnel can make various changes and modifications without departing from the technical concept of this invention. The technical scope of this invention is not limited to the content in the specification, and the technical scope must be determined according to the scope of the claims.

Claims

1. A lead clamping mechanism for semiconductor bonding equipment, characterized in that: include: A clamping body (1), a clamping arm (2) connected to the clamping body (1), a gold wire clamp (3) symmetrically connected between the clamping arms (2), and a clamping adjustment device (4) arranged in the clamping body (1); the clamping adjustment device (4) is connected to the clamping arm (2); The clamping adjustment device (4) comprises two fixed keys (41) arranged on the inner wall of the clamping body (1), two first connecting rods (42) hinged to the two fixed keys (41), two movable keys (43) connected to the two first connecting rods (42), two second connecting rods (44) connected to the two movable keys (43), and an adjustment screw (45) threadedly connected to the top of the clamping body (1); the second connecting rod (44) is connected to the clamping arm (2), a movable rod (46) is slidably connected between the two first connecting rods (42), and an electroactive polymer module (47) is connected between the two movable keys (43); the movable rod (46) is threadedly connected to the adjustment screw (45), and the electroactive polymer module (47) is connected to an external power supply.

2. A lead clamping mechanism for semiconductor bonding equipment according to claim 1, characterized in that: The two first connecting rods (42) are symmetrically provided with sliding grooves in the length direction, and the movable rod (46) slides in the sliding grooves.

3. The lead clamping mechanism of a semiconductor bonding device according to claim 1, characterized in that: The length of the movable rod (46) is shorter than the length of the first connecting rod (42).

4. The lead clamping mechanism of a semiconductor bonding device according to claim 1, characterized in that: The clamping arm (2) is provided with a detachable structure, and the detachable structure comprises: a main arm connected to the clamping adjustment device (4), and a secondary arm threadedly connected to the main arm via screws.

5. The lead clamping mechanism of a semiconductor bonding device according to claim 1, characterized in that: The electroactive polymer module (47) manufacturing process comprises: S1. Mix butyl acrylate, high electroactive monomer, initiator, first network crosslinker and second network crosslinker in appropriate proportion in a suitable amount of solvent to ensure that all components are fully dissolved to form a uniform premixed solution; S2. Under the protection of inert gas, the premixed solution is stirred and deoxygenated for 15 minutes; S3, aggregation to build IPN; S5, vulcanizing the treated IPN polymer at 160° C. for 1-2 hours; S5, pre-stretching the vulcanized IPN material to obtain an electroactive polymer module (47).

6. A lead clamping mechanism for semiconductor bonding equipment according to claim 5, characterized in that: The ratio is: 200:30-80:1:10:20:

600.

7. The lead clamping mechanism of semiconductor bonding equipment according to claim 5, characterized in that: In step S3, the aggregation and construction of IPN includes: S31, heating the premixed solution to about 65° C. and maintaining the temperature for 1.5 hours to form a first polymer network; After the first stage polymerization is completed, the second network crosslinking agent is added to the reaction system and stirring is continued to ensure uniform mixing; S32, raising the temperature to 70°C and continuing the reaction for 2 hours to form an interpenetrating network structure.

8. The lead clamping mechanism of semiconductor bonding equipment according to claim 5, characterized in that: The highly electroactive monomer is a redox-active monomer; the initiator is benzoyl peroxide; the solvent is ethanol; the first network crosslinking agent is divinylbenzene, and the second network crosslinking agent is methylenebisacrylamide.

9. A lead clamping mechanism for semiconductor bonding equipment according to claim 8, characterized in that: The inert gas is nitrogen.

10. The lead clamping mechanism of semiconductor bonding equipment according to claim 5, characterized in that: Pre-stretching treatment includes: S51, heating the vulcanized IPN material to 80° C.; S52, then using a clamp to fix one end of the IPN material, and gradually stretching the other end to a stretching ratio of 150%-250% by a mechanical device; S53, maintain the stretching state for 30 minutes; S54, cooling the material to room temperature and fixing the shape, completing the pre-stretching process.

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