Light-emitting substrate, display device and preparation method of light-emitting substrate

Abstract

The invention provides a light-emitting substrate, a display device and a preparation method of the light-emitting substrate. According to the embodiment of the invention, the isolation structure is higher than the light-emitting device and is arranged on the side edge of the light-emitting device, so that light emitted by the light-emitting device to the side direction can be shielded, light interference between the light-emitting devices can be avoided, and the halo degree can be reduced; furthermore, a recess is formed between the first end part and the second end part of one side, far away from the substrate, of the isolation structure, so that the contact surface between the isolation structure and the packaging layer is a non-single plane, a blocking region is formed on the side edge of the light-emitting device, and the water vapor prevention capability of the packaging layer is improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a light-emitting substrate, a display device, and a method for preparing the light-emitting substrate. Background Art

[0002] At present, the Mini LED (Mini Light-Emitting Diode) light-emitting substrate is encapsulated with silicone coating after the light-emitting device is solidified to protect the light-emitting device. The use of light-transmitting material encapsulation can improve the utilization rate of light at a large viewing angle, but it will also aggravate the halo problem, while filling with non-light-transmitting material will cause the light-emitting device to lose brightness when viewed from the front.

[0003] In addition, when silicone is directly used for coating and filling, water vapor can easily penetrate the interface between the encapsulation layer and the reflective layer, causing the light-emitting device to fail. Summary of the invention

[0004] The main technical problem solved by the present application is to provide a light-emitting substrate, a display device and a method for preparing the light-emitting substrate, so as to solve the problems of halo appearing on the light-emitting substrate and failure of the light-emitting device in the prior art.

[0005] In order to solve the above technical problems, the first technical solution provided by the present application is: to provide a light-emitting substrate, which includes:

[0006] substrate;

[0007] A plurality of light emitting devices are arranged at intervals on one side of the substrate;

[0008] An isolation structure, arranged at a side of the light emitting device to shield the light emitted laterally by the light emitting device;

[0009] an encapsulation layer, covering the light-emitting device and the isolation structure;

[0010] Wherein, the isolation structure has a first end and a second end on a side away from the substrate, and a recess is formed between the first end and the second end;

[0011] The first end has a first height relative to the substrate, the second end has a second height relative to the substrate, and the light emitting device has a third height relative to the substrate;

[0012] The third height is smaller than the first height and larger than the second height.

[0013] Wherein, in the isolation structure, the second end is arranged on a side of the first end close to the light emitting device, and the first end is arranged in contact with a surface of a side of the adjacent light emitting device close to each other.

[0014] Wherein, in a direction perpendicular to the plane of the substrate, the cross section of the recess is rectangular, V-shaped or U-shaped.

[0015] Wherein, the isolation structure includes light absorbing material.

[0016] in,

[0017] The isolation structure also includes light reflecting particles;

[0018] and / or,

[0019] The isolation structure also includes dry particles.

[0020] Wherein, the light emitting device comprises an inorganic light emitting diode.

[0021] In order to solve the above technical problem, the second technical solution provided in the present application is: to provide a display device, which includes the above-mentioned light-emitting substrate.

[0022] In order to solve the above technical problems, the third technical solution provided by the present application is: to provide a method for preparing a light-emitting substrate, which is used to prepare the above-mentioned light-emitting substrate; wherein, the method comprises:

[0023] Step 1: forming a plurality of light emitting devices spaced apart on one side of the substrate,

[0024] Step 2: forming an isolation structure on the side of the light-emitting device to block the light emitted laterally by the light-emitting device; wherein the isolation structure has a first end and a second end on a side away from the substrate, and a recess is formed between the first end and the second end; the first end has a first height relative to the substrate, the second end has a second height relative to the substrate, and the light-emitting device has a third height relative to the substrate; the third height is less than the first height and greater than the second height;

[0025] Step three: performing a sealing process on the light emitting device and the isolation structure to form a packaging layer.

[0026] Wherein, between the step 1 and the step 2, it also includes:

[0027] A mask plate is arranged on the light emitting surface of the light emitting device; the mask plate includes a hollow portion and a shielding portion located on the side of the hollow portion, a groove is provided on the side of the shielding portion close to the light emitting device, the groove includes a first groove and a second groove connected to each other, and the second groove is arranged on the bottom wall of the first groove; wherein the bottom wall of the first groove is arranged in contact with the light emitting surface, and the side wall of the first groove is arranged in contact with part of the side of the light emitting device.

[0028] Wherein, the mask plate comprises an elastic material; the mask plate comprises an initial state and a deformed state; in the initial state, the mask plate comprises the first groove; in the deformed state, the mask plate further comprises the second groove;

[0029] The step of arranging a mask plate on the light emitting surface of the light emitting device comprises:

[0030] The mask plate in an initial state is arranged on the light emitting surface of the light emitting device, and the bottom wall of the first groove is arranged in contact with the light emitting surface, and a gap is provided between the side wall of the first groove and the light emitting device;

[0031] Applying a force causes the mask plate in an initial state to be transformed into a deformed state, thereby forming the second groove.

[0032] Beneficial effects of the present application: Different from the prior art, the present application provides a light-emitting substrate, a display device and a method for preparing a light-emitting substrate, wherein the light-emitting substrate comprises a substrate, a plurality of light-emitting devices, an isolation structure and an encapsulation layer. Among them, the isolation structure has a first end and a second end on a side away from the substrate, and a depression is formed between the first end and the second end. The first end has a first height relative to the substrate, the second end has a second height relative to the substrate, and the light-emitting device has a third height relative to the substrate. The third height is less than the first height and greater than the second height. The isolation structure is arranged on the side of the light-emitting device to block the light emitted laterally by the light-emitting device. The encapsulation layer covers the light-emitting device and the isolation structure. In the embodiment of the present application, the isolation structure is arranged higher than the light-emitting device and arranged on the side of the light-emitting device, which is conducive to blocking the light emitted laterally by the light-emitting device, avoiding light interference between the light-emitting devices, and reducing the degree of halo; further, a depression is formed between the first end and the second end on the side of the isolation structure away from the substrate, so that the contact surface between the isolation structure and the encapsulation layer is not a single plane, thereby forming a barrier area on the side of the light-emitting device, which is conducive to improving the water vapor resistance of the encapsulation layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0034] Figure 1 is a structural schematic diagram of the first embodiment of the light-emitting substrate provided by the present application;

[0035] Figure 2 yes Figure 1 A schematic diagram of the enlarged structure at A in the middle;

[0036] Figure 3 is a structural schematic diagram of a second embodiment of a light-emitting substrate provided by the present application;

[0037] Figure 4 is a structural schematic diagram of a third embodiment of a light-emitting substrate provided by the present application;

[0038] Figure 5 is a structural schematic diagram of a fourth embodiment of a light-emitting substrate provided by the present application;

[0039] Figure 6 is a structural schematic diagram of a fifth embodiment of a light-emitting substrate provided by the present application;

[0040] Figure 7 is a structural schematic diagram of a sixth embodiment of a light-emitting substrate provided by the present application;

[0041] Figure 8 yes Figure 7 A schematic diagram of the enlarged structure at B in the middle;

[0042] Fig. 9 It is a schematic diagram of the process of the first embodiment of the light-emitting substrate provided by the present application;

[0043] Fig.10 yes Fig. 9 A schematic diagram of the structure corresponding to steps S100 to S300;

[0044] Fig.11 It is a schematic diagram of the process of the second embodiment of the light-emitting substrate provided by the present application;

[0045] Fig.12 yes Fig.11 A structural schematic diagram corresponding to step S400;

[0046] Fig.13 is a schematic diagram of a top view of a mask plate according to an embodiment of the present application;

[0047] Fig.14 It is a schematic diagram of a top view of a mask plate and a light-emitting device according to an embodiment of the present application;

[0048] Fig.15 It is a structural schematic diagram of a first embodiment of a mask plate and a light-emitting device provided by the present application;

[0049] Fig.16 It is a structural schematic diagram of a second embodiment of a mask plate and a light-emitting device provided by the present application;

[0050] Fig.17 It is a structural schematic diagram of a third embodiment of a mask plate and a light-emitting device provided by the present application;

[0051] Fig.18is a structural schematic diagram of a fourth embodiment of a mask plate and a light-emitting device provided by the present application;

[0052] Fig.19 It is a flowchart of an implementation method of step S400 provided by this application;

[0053] Fig. 20 yes Fig.19 Schematic diagram of the structure corresponding to steps S410 and S420.

[0054] Description of Figure Numbers:

[0055] 100. Light-emitting substrate; 10. Substrate; 20. Light-emitting device; 21. Light-emitting surface; 22. Side; 30. Isolation structure; 31. First end; 32. Second end; 33. Recess; 40. Encapsulation layer; 50. Driving layer; 60. Mask plate; 61. Shielding portion; 610. Groove; 611. First groove; 612. Second groove; 62. Hollow portion; 63. Connecting portion; 631. Ring body; 632. Branch; h1. First height; h2. Second height; h3. Third height; H. Height; L. Distance; φ. Emission angle; 70. Light-emitting particles; 200. Display device. DETAILED DESCRIPTION

[0056] The scheme of the embodiment of the present application is described in detail below in conjunction with the drawings of the specification.

[0057] In the following description, for the purpose of explanation rather than limitation, specific details such as specific system structures, interfaces, and technologies are provided to facilitate a thorough understanding of the present application.

[0058] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0059] The terms "first", "second", "third" in this application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second", "third" can expressly or implicitly include at least one of the features. In the description of this application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In the embodiments of this application, all directional indications (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the steps or units listed, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices.

[0060] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0061] See also Figure 1 and Figure 2 , Figure 1 is a structural schematic diagram of the first embodiment of the light-emitting substrate provided by the present application, Figure 2 yes Figure 1 Schematic diagram of the enlarged structure at point A in the middle.

[0062] The present application provides a light-emitting substrate 100. The light-emitting substrate 100 includes a substrate 10, a plurality of light-emitting devices 20, an isolation structure 30, and an encapsulation layer 40. The isolation structure 30 is disposed on the side 22 of the light-emitting device 20 to block the light emitted laterally by the light-emitting device 20. The isolation structure 30 has a first end 31 and a second end 32 on a side away from the substrate 10, and a recess 33 is formed between the first end 31 and the second end 32. The first end 31 has a first height h1 relative to the substrate 10, the second end 32 has a second height h2 relative to the substrate 10, and the light-emitting device 20 has a third height h3 relative to the substrate 10. The third height h3 is less than the first height h1 and greater than the second height h2. The encapsulation layer 40 covers the light-emitting device 20 and the isolation structure 30.

[0063] In the embodiment of the present application, the isolation structure 30 is arranged higher than the light-emitting device 20 and is arranged on the side 22 of the light-emitting device 20, which is beneficial to shielding the light emitted laterally by the light-emitting device 20, avoiding light interference between the light-emitting devices 20, and helping to reduce the degree of halo; further, a recess 33 is formed between the first end 31 and the second end 32 of the isolation structure 30 on the side away from the substrate 10, so that the contact surface between the isolation structure 30 and the encapsulation layer 40 is not a single plane, thereby forming a barrier area on the side 22 of the light-emitting device 20, which is beneficial to improve the water vapor resistance of the encapsulation layer 40.

[0064] The substrate 10 may be a PCB (Printed circuit board) or a glass substrate. The material and preparation process of the substrate 10 are not limited here and can be selected according to actual needs.

[0065] The light emitting device 20 includes an inorganic light emitting diode (LED).

[0066] Specifically, the light emitting device 20 is a Mini LED (mini light emitting diode).

[0067] The light emitting device 20 has a light emitting surface 21 , and the light emitting surface 21 of the light emitting device 20 faces a side away from the substrate 10 .

[0068] There is no restriction on the arrangement of the light emitting devices 20 on the substrate 10, and it can be selected according to actual needs.

[0069] In this embodiment, the light emitting devices 20 are arranged in an array.

[0070] The isolation structure 30 is arranged on the side 22 of the light-emitting device 20. It can be understood that the light-emitting device 20 is arranged around the light-emitting device 20, so that multiple isolation structures 30 are arranged around the light-emitting device 20 to block the light emitted laterally by the light-emitting device 20, thereby avoiding light interference between the light-emitting devices 20.

[0071] The entire isolation structure 30 is an integrally formed structure, that is, the first end 31 and the second end 32 in the isolation structure 30 are an integrally formed structure. In other words, the first end 31 and the second end 32 do not need to be completed in multiple steps, which can simplify the preparation process.

[0072] The third height h3 is less than the first height h1, so that the first end 31 is arranged higher than the light emitting device 20 to reduce the halo. The third height h3 is greater than the second height h2, so as to prevent the isolation structure 30 from covering the light emitting surface 21 of the light emitting device 20 during the preparation of the isolation structure 30.

[0073] That is to say, the second height h2 is smaller than the first height h1, so that a recess 33 can be formed between the first end 31 and the second end 32, thereby forming a barrier area around the light-emitting device 20, which is beneficial to prevent water vapor from directly entering the light-emitting device 20 along the interface between the packaging layer 40 and the isolation structure 30.

[0074] Here, there is no limitation on the specific values ​​of the first height h1, the second height h2 and the third height h3, which can be selected according to actual needs.

[0075] According to the height H of the first end 31 relative to the light emitting device 20 and the distance L from the center of the light emitting device 20 to the first end 31, and based on the trigonometric function relationship, the emission angle φ of the light of the light emitting device 20 can be determined, that is, tanφ=L / H. In other words, the emission angle φ of the light emitting device can be adjusted according to this formula.

[0076] See also Figures 1 to 6 , Figure 3 is a structural schematic diagram of a second embodiment of a light-emitting substrate provided by the present application, Figure 4 is a structural schematic diagram of the third embodiment of the light-emitting substrate provided by the present application, Figure 5 is a structural schematic diagram of a fourth embodiment of a light-emitting substrate provided in the present application, Figure 6 It is a structural schematic diagram of the fifth embodiment of the light-emitting substrate provided in the present application.

[0077] Further, in a direction perpendicular to the plane of the substrate 10 , the cross section of the recess 33 is rectangular, V-shaped or U-shaped.

[0078] Specifically, the sides of the first end portion 31 and the second end portion 32 that are close to each other may be arranged in contact with each other, or may be arranged with a gap.

[0079] When the first end 31 and the second end 32 are arranged at intervals with respect to the sides close to each other, the cross section of the recess 33 is rectangular in the direction perpendicular to the plane of the substrate 10 (see Figure 1 ) or U-shaped (see Figure 3 and Figure 4 ). The U-shape may be a regular shape or an irregular shape.

[0080] When the first end portion 31 and the second end portion 32 are arranged in contact with each other, the cross section of the recess 33 is V-shaped in a direction perpendicular to the plane of the substrate 10 (see FIG. Figure 5 and Figure 6 ).

[0081] It should be understood that, in the direction perpendicular to the plane of the substrate 10 , the cross section of the recess 33 may also be other shapes.

[0082] Further, in the isolation structure 30 , the second end portion 32 is disposed on a side of the first end portion 31 close to the light emitting device 20 , and the first end portion 31 is disposed in contact with a surface of a side of the adjacent light emitting device 20 close to each other.

[0083] That is, disposing the second end 32 on the side of the first end 31 close to the light emitting device 20 is beneficial to preventing water vapor from directly entering the light emitting device 20 along the interface between the encapsulation layer 40 and the isolation structure 30 and causing the light emitting device 20 to fail.

[0084] The isolation structure 30 includes a light absorbing material for absorbing light emitted laterally by the light emitting device 20 to avoid light interference between the light emitting devices 20 .

[0085] The light-absorbing material may be ink or other black materials. There is no limitation on the light-absorbing material and the material may be selected according to actual needs.

[0086] In this embodiment, the light absorbing material is ink.

[0087] The encapsulation layer 40 is a transparent structure, so that the encapsulation layer 40 protects the entire light emitting device 20 without causing attenuation of the light emitted directly from the light emitting device 20 .

[0088] The material of the packaging layer 40 is not limited here and can be selected according to actual needs.

[0089] See also Figure 7 and Figure 8 , Figure 7 is a structural schematic diagram of a sixth embodiment of a light-emitting substrate provided in the present application, Figure 8 yes Figure 7 Schematic diagram of the enlarged structure at point B in the middle.

[0090] In some embodiments, the isolation structure 30 further includes light-reflective particles 70 ; and / or, the isolation structure 30 further includes dry particles.

[0091] When the isolation structure 30 further includes light-reflecting particles 70, the light-reflecting particles 70 can reflect the light emitted by the light-emitting device 20 in the side direction into light emitted in the front view direction of the light-emitting device 20, that is, the light-reflecting particles 70 can, to a certain extent, convert the light of a large viewing angle into light emitted from a visible angle, so as to improve the utilization rate of the light emitted by the light-emitting device 20. The light-reflecting particles 70 are spherical structures, so as to better reflect the light emitted by the light-emitting device 20 in the side direction into light emitted in the front view direction of the light-emitting device 20. Figure 8As shown in the reflected light path, the wide-viewing angle light (light emitted laterally by the light-emitting device 20) generally can be emitted from the visible angle (the front view angle of the light-emitting device 20) after being emitted to the upper part of the light-reflecting particle 70 and reflected at the interface, while the light emitted to the lower part of the light-reflecting particle 70 can no longer be emitted from the isolation structure 30 and is absorbed after one or more reflections.

[0092] When the isolation structure 30 further includes dry particles, the water vapor resistance of the light-emitting substrate 100 can be improved, and the light-emitting device 20 can be better prevented from failing.

[0093] The light emitting substrate 100 further includes a driving layer 50, which is used to drive the light emitting device 20 to emit light. The driving layer 50 is disposed between the substrate 10 and the light emitting device 20.

[0094] In this embodiment, the isolation structure 30 is disposed on the side of the driving layer 50 away from the substrate 10 , and the number of reflective layers is reduced, thereby saving costs.

[0095] The present application provides a display device 200. The display device 200 includes the light emitting substrate 100 of the above embodiment.

[0096] In some embodiments, the display device 200 further includes a liquid crystal display panel, and the light emitting substrate 100 is used to provide a backlight source for the liquid crystal display panel.

[0097] In some other embodiments, the display device 200 is a self-luminous display device, for example, the display device 200 is an LED display device.

[0098] The present application provides a method for preparing a light-emitting substrate 100 , which is used to prepare the light-emitting substrate 100 in the above embodiment.

[0099] See also Figure 1 , Fig. 9 and Fig.10 , Fig. 9 is a schematic diagram of the process of the first embodiment of the light-emitting substrate provided by the present application, Fig.10 yes Fig. 9 Schematic diagram of the structure corresponding to steps S100 to S300.

[0100] In some embodiments, the specific steps of the method for preparing the light-emitting substrate 100 are as follows:

[0101] S100: forming a plurality of light emitting devices spaced apart from each other on one side of a substrate.

[0102] Specifically, a plurality of light emitting devices 20 are formed on one side of the substrate 10 and are arranged at intervals.

[0103] A substrate 10 is provided, and a driving circuit is prepared on the substrate 10 to form a driving layer 50 . The light emitting device 20 is transferred to the substrate 10 , and the driving layer 50 is electrically connected to the light emitting device 20 .

[0104] There is no limitation on the preparation method of the substrate 10 , the driving layer 50 and the light emitting device 20 , and the transfer method of the light emitting device 20 , which can be selected according to actual needs.

[0105] S200: An isolation structure is formed on the side of the light-emitting device to block the light emitted laterally by the light-emitting device; wherein the isolation structure has a first end and a second end on a side away from the substrate, and a recess is formed between the first end and the second end; the first end has a first height relative to the substrate, the second end has a second height relative to the substrate, and the light-emitting device has a third height relative to the substrate; the third height is less than the first height and greater than the second height.

[0106] Specifically, an isolation structure 30 is formed on the side 22 of the light emitting device 20 to block the light emitted laterally by the light emitting device 20. The isolation structure 30 has a first end 31 and a second end 32 on a side away from the substrate 10, and a recess 33 is formed between the first end 31 and the second end 32. The first end 31 has a first height h1 relative to the substrate 10, the second end 32 has a second height h2 relative to the substrate 10, and the light emitting device 20 has a third height h3 relative to the substrate 10. The third height h3 is less than the first height h1 and greater than the second height h2.

[0107] On the premise of protecting the light emitting surface 21 of the light emitting device 20 , the isolation structure 30 can be prepared by deposition, silk screen printing, inkjet printing, etc. to prevent the isolation structure 30 from blocking the light emitting surface 21 and affecting the light emitting effect.

[0108] S300: performing a sealing process on the light emitting device and the isolation structure to form a packaging layer.

[0109] Specifically, the light emitting device 20 and the isolation structure 30 are sealed with glue to form the encapsulation layer 40 .

[0110] An encapsulation layer 40 is prepared on a side of the light emitting device 20 away from the substrate 10 , and the encapsulation layer 40 covers the light emitting device 20 and the isolation structure 30 .

[0111] See also Figure 1 , Figures 11 to 18 , Fig.11 is a schematic diagram of the process of the second embodiment of the light-emitting substrate provided by the present application, Fig.12 yes Fig.11 The structural diagram corresponding to step S400 is as follows, Fig.13 is a schematic diagram of a top view of a mask plate according to an embodiment of the present application. Fig.14is a schematic diagram of a top view of a mask plate and a light-emitting device according to an embodiment of the present application. Fig.15 is a structural schematic diagram of a first embodiment of a mask plate and a light-emitting device provided by the present application, Fig.16 is a structural schematic diagram of a second embodiment of a mask plate and a light-emitting device provided by the present application, Fig.17 is a structural schematic diagram of a third embodiment of a mask plate and a light-emitting device provided in the present application, Fig.18 It is a structural schematic diagram of the fourth embodiment of the mask plate and the light-emitting device provided in the present application.

[0112] In one embodiment, the following steps are further included between step S100 and step S200:

[0113] S400: A mask plate is arranged on the light emitting surface of the light emitting device; the mask plate comprises a hollow portion and a shielding portion located on the side of the hollow portion, a groove is provided on the side of the shielding portion close to the light emitting device, the groove comprises a first groove and a second groove connected to each other, and the second groove is arranged on the bottom wall of the first groove; wherein the bottom wall of the first groove is arranged in contact with the light emitting surface, and the side wall of the first groove is arranged in contact with part of the side of the light emitting device.

[0114] Specifically, a mask plate 60 is disposed on the light emitting surface 21 of the light emitting device 20. The mask plate 60 includes a hollow portion 62 and a shielding portion 61 located on the side of the hollow portion 62. A groove 610 is provided on the side of the shielding portion 61 close to the light emitting device 20. The groove 610 includes a first groove 611 and a second groove 612 that are connected to each other. The second groove 612 is disposed on the bottom wall of the first groove 611. The bottom wall of the first groove 611 is disposed in contact with the light emitting surface 21, and the side wall of the first groove 611 is disposed in contact with a portion of the side edge 22 of the light emitting device 20.

[0115] The shielding portion 61 of the mask plate 60 is disposed in one-to-one correspondence with the light emitting device 20 . The shielding portion 61 covers the light emitting device 20 , and the orthographic projection area of ​​the shielding portion 61 on the substrate 10 is larger than the orthographic projection area of ​​the light emitting device 20 on the substrate 10 .

[0116] The mask plate 60 also includes a connecting portion 63, which is used to connect adjacent shielding portions 61. The structure of the connecting portion 63 is not limited here and is selected according to actual needs. The shielding portions 61 are connected by the connecting portion 63, so that the area corresponding to the side of the light-emitting device 20 can be set corresponding to the hollow portion 62, so that the isolation structure 30 can be set on the side of the light-emitting device 20 through the hollow portion 62, so that adjacent light-emitting devices 20 cannot be directly connected to avoid crosstalk of light.

[0117] In this embodiment, the connecting portion 63 includes an annular body 631 and a branch 632 disposed outside the annular body 631. The annular body 631 is connected to the shielding portion 61 through the branch 632.

[0118] The shielding portion 61 covers the light emitting surface 21 of the light emitting device 20 so that the bottom wall of the second groove 612 is in contact with the light emitting surface 21. The thickness of the shielding portion 61 is less than the thickness of the light emitting device 20 so that the side wall of the second groove 612 is in contact with part of the side edge 22 of the light emitting device 20, rather than in contact with the entire surface of the side edge 22 of the light emitting device 20. The design method of setting the bottom wall of the first groove 611 in contact with the light emitting surface 21 and the side wall of the first groove 611 in contact with part of the side edge 22 of the light emitting device 20 can prevent the material for preparing the isolation structure 30 from being in contact with the light emitting surface 21 of the light emitting device 20 in the subsequent process of preparing the isolation structure 30, thereby attenuating the light emitted from the light emitting device 20 in the direct view.

[0119] The shielding portion 61 is disposed in a one-to-one correspondence with the first groove 611 , and the first groove 611 is disposed in a one-to-one correspondence with the second groove 612 .

[0120] In this embodiment, the isolation structure 30 is prepared by silk screen printing. The mask plate 60 is used as a silk screen printing plate. The material for preparing the isolation structure 30 is filled into the side 22 of the light emitting device 20 through the hollow portion 62 of the mask plate 60. In the direction perpendicular to the substrate 10, the cross section of the shielding portion 61 is rectangular, and the cross sections of the first groove 611 and the second groove 612 are both rectangular. The side wall surface of the first groove 611 is a plane.

[0121] In other embodiments, in the direction perpendicular to the substrate 10, the cross section of the shielding portion 61 may be a trapezoid (see Fig.15 and Fig.17 ) or other graphics (see Fig.18 ), the cross section of the first groove 611 may be a trapezoid (see Fig.16 and Fig.17 ) or other shapes. The sidewall surface of the first groove 611 may be a curved surface (see Fig.18 ).

[0122] See also Figure 1 , Fig.19 and Fig. 20 , Fig.19 is a flowchart of an implementation method of step S400 provided by this application, Fig. 20 yes Fig.19 Schematic diagram of the structure corresponding to steps S410 and S420.

[0123] In one embodiment, the mask plate 60 includes an elastic material. The mask plate 60 includes an initial state and a deformed state. In the initial state, the mask plate 60 includes a first groove 611. In the deformed state, the mask plate 60 also includes a second groove 612. Step S300: The step of arranging the mask plate 60 on the light emitting surface 21 of the light emitting device 20 specifically includes:

[0124] S410: Disposing a mask plate in an initial state on the light emitting surface of the light emitting device, and disposing the bottom wall of the first groove in contact with the light emitting surface, with a gap between the side wall of the first groove and the light emitting device.

[0125] Specifically, the mask plate 60 in the initial state is disposed on the light emitting surface 21 of the light emitting device 20 , and the bottom wall of the first groove 611 is disposed in contact with the light emitting surface 21 , and a gap is provided between the side wall of the first groove 611 and the light emitting device 20 .

[0126] The groove 610 in the mask plate 60 in the initial state includes only the first groove 611, but does not include the second groove 612. The orthographic projection area of ​​the first groove 611 on the substrate 10 is larger than the orthographic projection area of ​​the light-emitting device 20 on the substrate 10, and the bottom wall of the second groove 612 covers the light-emitting surface 21 of the light-emitting device 20. A gap is provided between the side wall of the first groove 611 and the light-emitting device 20, so that in the subsequent process of preparing the isolation structure 30, the side surface of the isolation structure 30 away from the substrate 10 is not a single plane.

[0127] S420: applying a force to transform the mask plate in the initial state into a deformed state, and forming a second groove.

[0128] Specifically, a force is applied to transform the mask plate 60 in the initial state into a deformed state, and form the second groove 612 .

[0129] A force is applied to the substrate 10 and / or the mask plate 60, so that the mask plate 60 in the initial state is elastically deformed in a direction perpendicular to the substrate 10. At this time, the deformation of the mask plate 60 in the initial state is transformed into a deformed state, and a second groove 612 is formed on the bottom wall of the first groove 611, so that the second groove 612 covers an end of the light-emitting device 20 away from the substrate 10. That is, the bottom wall of the second groove 612 is arranged in contact with the light-emitting surface 21 of the light-emitting device 20, and the side wall of the second groove 612 is arranged in contact with a part of the side edge 22 of the light-emitting device 20.

[0130] Setting the mask plate 60 as an elastic structure not only allows the light-emitting device 20 to be in close contact with the mask plate 60, but also prevents the material for preparing the isolation structure 30 from contacting the light-emitting surface 21 of the light-emitting device 20 through the gap at the interface between the mask plate 60 and the light-emitting device 20, thereby affecting the light-emitting effect of the light-emitting device 20; it is also beneficial to make the surface of the side of the prepared isolation structure 30 away from the substrate 10 a non-single plane, which can better improve the water vapor resistance of the light-emitting substrate 100; secondly, compared with setting the second groove 612 by etching or the like, it can also simplify the preparation process.

[0131] The material for preparing the isolation structure 30 is filled into the side edge 22 of the light emitting device 20 through the hollow portion 62 of the mask plate 60 and cured to form the isolation structure 30. The curing method may be high temperature or ultraviolet irradiation.

[0132] The surface of the first end 31 of the isolation structure 30 away from the substrate 10 is lower than the surface of the mask plate 60 away from the substrate 10, and higher than the surface of the light emitting device 20 away from the substrate 10; or the surface of the first end 31 of the isolation structure 30 away from the substrate 10 is flush with the surface of the mask plate 60 away from the substrate 10. This design avoids the isolation structure 30 blocking the mask plate 60, thereby facilitating the removal of the mask plate 60; secondly, it can also make the first end 31 higher than the light emitting device 20, preventing light interference between the light emitting devices 20.

[0133] In this embodiment, the surface of the first end portion 31 of the isolation structure 30 away from the substrate 10 is flush with the surface of the mask plate 60 away from the substrate 10 .

[0134] In another embodiment, the mask plate 60 may not be an elastic structure. That is, the mask plate 60 includes a first groove 611 and a second groove 612 , and the second groove 612 of the mask plate 60 is directly covered on the light emitting surface 21 of the light emitting device 20 .

[0135] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0136] The above are only implementation methods of the present application, and are not intended to limit the patent protection scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A light-emitting substrate, characterized in that: include: substrate; A plurality of light emitting devices are arranged at intervals on one side of the substrate; An isolation structure, arranged at a side of the light emitting device to shield the light emitted laterally by the light emitting device; an encapsulation layer, covering the light-emitting device and the isolation structure; Wherein, the isolation structure has a first end and a second end on a side away from the substrate, and a recess is formed between the first end and the second end; The first end has a first height relative to the substrate, the second end has a second height relative to the substrate, and the light emitting device has a third height relative to the substrate; The third height is smaller than the first height and larger than the second height.

2. The light-emitting substrate according to claim 1, characterized in that: In the isolation structure, the second end portion is disposed on a side of the first end portion close to the light emitting device, and the first end portion is disposed in contact with a surface of a side of the adjacent light emitting device close to each other.

3. The light-emitting substrate according to claim 1, characterized in that: In a direction perpendicular to the plane of the substrate, the cross section of the recess is rectangular, V-shaped or U-shaped.

4. The light-emitting substrate according to claim 1, characterized in that: The isolation structure includes a light absorbing material.

5. The light-emitting substrate according to claim 4, characterized in that: The isolation structure also includes light reflecting particles; and / or, The isolation structure also includes dry particles.

6. The light-emitting substrate according to claim 1, characterized in that: The light emitting device includes an inorganic light emitting diode.

7. A display device, characterized in that: A light-emitting substrate comprising the light-emitting substrate according to any one of claims 1 to 6.

8. A method for preparing a light-emitting substrate, used for preparing the light-emitting substrate according to any one of claims 1 to 6; characterized in that: include: Step 1: forming a plurality of light emitting devices spaced apart on one side of the substrate, Step 2: forming an isolation structure on the side of the light-emitting device to block the light emitted laterally by the light-emitting device; wherein the isolation structure has a first end and a second end on a side away from the substrate, and a recess is formed between the first end and the second end; the first end has a first height relative to the substrate, the second end has a second height relative to the substrate, and the light-emitting device has a third height relative to the substrate; the third height is less than the first height and greater than the second height; Step three: performing a sealing process on the light emitting device and the isolation structure to form a packaging layer.

9. The method for preparing a light-emitting substrate according to claim 8, characterized in that: Between step 1 and step 2, the method further includes: A mask plate is arranged on the light emitting surface of the light emitting device; the mask plate includes a hollow portion and a shielding portion located on the side of the hollow portion, a groove is provided on the side of the shielding portion close to the light emitting device, the groove includes a first groove and a second groove connected to each other, and the second groove is arranged on the bottom wall of the first groove; wherein the bottom wall of the first groove is arranged in contact with the light emitting surface, and the side wall of the first groove is arranged in contact with part of the side of the light emitting device.

10. The method for preparing a light-emitting substrate according to claim 9, characterized in that: The mask plate comprises an elastic material; the mask plate comprises an initial state and a deformed state; In an initial state, the mask plate includes the first groove; In the deformed state, the mask plate further includes the second groove; The step of arranging a mask plate on the light emitting surface of the light emitting device comprises: The mask plate in an initial state is arranged on the light emitting surface of the light emitting device, and the bottom wall of the first groove is arranged in contact with the light emitting surface, and a gap is provided between the side wall of the first groove and the light emitting device; Applying a force causes the mask plate in an initial state to be transformed into a deformed state, thereby forming the second groove.

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