Micro-LED display device

Abstract

The invention discloses a Micro-LED display device which comprises a substrate and a layer series combination arranged on the main surface of the substrate, the layer series combination is divided into a display area and a peripheral area when observed in the direction perpendicular to the main surface, the display area comprises a plurality of functional layers arranged in a preset mode, a plurality of display pixels are formed, and the peripheral area comprises a plurality of functional layers arranged in the preset mode. The Micro-LED display device comprises a display area and a peripheral area, the peripheral area is arranged on the periphery of the display area in a surrounding mode and is formed by continuation of a part of functional layers in the display area, the Micro-LED display device further comprises an isolating ring, the isolating ring is embedded in the peripheral area and is synchronously formed along with the other part of functional layers in the display area, the isolating ring is arranged on the periphery of the display area in a surrounding mode, and a preset interval is kept between the isolating ring and the display area. Through the method, the reliability and the yield of the Micro-LED display equipment can be improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor light emitting diode technology, and in particular to Micro-LED display devices. Background Art

[0002] LED (Light Emitting Diode) is a semiconductor component that can convert electrical energy into visible light. It is a modern lighting source that is widely used in indication, display, decoration, backlight, general lighting and city night scenes.

[0003] At present, in the preparation process of Micro-LED substrates, cutting grooves are usually used to connect the various Micro-LED substrates together, and then the cutting grooves are cut to separate the various Micro-LED substrates. In addition, the boundaries of a single Micro-LED substrate are also only structures with cutting grooves or scribe lines. Therefore, in various links such as the preparation process and product use of the Micro-LED substrate, the Micro-LED substrate is easily disturbed by environmental factors such as external moisture or impurities, and is also easily damaged due to the generation of mechanical stress during the preparation and use process, thereby causing the Micro-LED substrate to fail in function. Summary of the invention

[0004] The embodiments of the present application provide a Micro-LED display device, which can improve the reliability and yield rate of the Micro-LED display device.

[0005] In the first aspect, the embodiment of the present application provides a Micro-LED display device, which includes a substrate and a layer combination arranged on the main surface of the substrate, wherein the layer combination is divided into a display area and a peripheral area when observed in a direction perpendicular to the main surface, the display area includes a plurality of functional layers arranged in a predetermined manner and forming a plurality of display pixels, the peripheral area is arranged around the periphery of the display area and is formed by a part of the functional layers in the display area, wherein the Micro-LED display device also includes an isolation ring, which is embedded in the peripheral area and is formed synchronously with another part of the functional layers in the display area, the isolation ring is arranged around the periphery of the display area and maintains a predetermined interval with the display area. Through the above method, the present application can improve the product reliability and yield rate of the Micro-LED display device.

[0006] In some embodiments, the isolation ring includes at least two stacked sub-isolation layers, and the at least two sub-isolation layers are formed synchronously with at least two functional layers in the display area.

[0007] In some embodiments, the peripheral region is formed continuously from the dielectric layer in the display region, and the isolation ring is formed synchronously with the conductive layer in the display region.

[0008] In some embodiments, the peripheral region is formed continuously from a portion of the dielectric layer in the display region, and the isolation ring is formed synchronously with another portion of the dielectric layer in the display region.

[0009] In some embodiments, the isolation ring forms a closed conductive path surrounding the display area.

[0010] In some embodiments, the isolation ring is electrically connected to a preset reference potential.

[0011] In some embodiments, the display device includes a pad located in the peripheral area, and the isolation ring is disposed around the display area and the periphery of the pad.

[0012] In some embodiments, the number of the isolation rings is at least two, the at least two isolation rings are nested with each other, and are both disposed around the periphery of the display area, and the functional layer formed synchronously with the at least two isolation rings is at least partially different.

[0013] In some embodiments, one of the at least two isolation rings is a conductive ring and the other is a dielectric ring.

[0014] In some embodiments, when viewed in a direction perpendicular to the main surface, the corner position of the isolation ring presents an arc-shaped or obtuse angle transition.

[0015] The beneficial effects of the present application are as follows: Different from the prior art, the Micro-LED display device described in the present application is provided with a display area and a peripheral area, a functional layer for forming a plurality of display pixels is provided in the display area, the peripheral area is arranged around the periphery of the display area, and the Micro-LED display device is also provided with an isolation ring, which is arranged in the peripheral area to surround the display area and is spaced from the display area. The isolation ring is arranged in the peripheral area outside the display area, so that the isolation ring can block environmental interference factors such as external moisture or impurities for the display area, and can further play a role in isolating and protecting the display area, so that the display area is not easily polluted and damaged due to environmental interference factors. On the other hand, the isolation ring is arranged at the periphery of the display area, which can also relieve the mechanical stress in the display area and the peripheral area during the preparation and use of the Micro-Micro-LED display device, so that the Micro-LED display device is not easily deformed and damaged due to mechanical stress, thereby improving the reliability and yield of the Micro-LED display device. Moreover, the isolation ring is formed synchronously with another part of the functional layer in the display area, which can facilitate the formation of the isolation ring and improve the preparation efficiency and yield of the Micro-LED display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a structural schematic diagram of an embodiment of the Micro-LED display device of the present application;

[0017] Figure 2 is a schematic diagram of the structure when viewed along the stacking direction in one implementation of an embodiment of a Micro-LED display device of the present application;

[0018] Figure 3 1 is a schematic diagram of the structure when observed along the stacking direction in another implementation manner of the Micro-LED display device embodiment of the present application. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0020] The inventor of the present application has found that, in the process of preparing the Micro-LED substrate, the cutting grooves are usually used to connect the various Micro-LED substrates together, and then the cutting grooves are cut to separate the various Micro-LED substrates. In addition, the boundaries of a single Micro-LED substrate are also only structures with cutting grooves or scribe lines. Therefore, in the preparation process of the Micro-LED substrate and the use of the product, the Micro-LED substrate is easily disturbed by environmental factors such as external moisture or impurities, and is also easily damaged due to the generation of mechanical stress during the preparation and use process, thereby causing the Micro-LED substrate to fail in function. In order to solve the above problems, the present application proposes the following embodiments.

[0021] The following is an exemplary description of the structure of the Micro-LED display device in the Micro-LED display device embodiment of the present application.

[0022] The Micro-LED display device 1 refers to a device that can form a plurality of display pixels 101 inside to generate light, and the light generated can be emitted from one side of the Micro-LED display device 1 to illuminate or display various information such as text, images, etc. For example, the Micro-LED display device 1 can be a device such as an LED display chip, an LED digital car light chip, a digital light strip chip, or an AR / VR / MR chip.

[0023] In some embodiments, Figure 1As shown, the Micro-LED display device 1 may include a substrate 10 and a layer system combination 20 disposed on a main surface of the substrate 10 .

[0024] The substrate 10 is used to place the supporting layer combination 20, and a plurality of switching devices and circuit structures may be arranged on the main surface of the substrate 10 to connect with the circuit structure in the layer combination 20 and to supply power to the circuit structure in the layer combination 20.

[0025] In some embodiments, the substrate 10 may be a CMOS (Complementary Metal Oxide Semiconductor) substrate, and may be provided with related circuits, multiple electrodes, multiple switching devices, etc., to provide a driving current for the circuit structure of the corresponding layer combination 20 .

[0026] Of course, in other embodiments, the substrate 10 may also be made of sapphire, silicon, gallium nitride, aluminum nitride, etc. During the preparation of the Micro-LED display device 1, the layer assembly 20 may be gradually grown on the main surface of the substrate 10. Alternatively, the layer assembly 20 may also be transferred to the substrate 10 to form the Micro-LED display device 1, thereby facilitating the use of the Micro-LED display device 1. The material of the substrate 10 is not specifically limited in this embodiment.

[0027] When viewed along a direction perpendicular to the main surface, the layer assembly 20 can be divided into a display area 210 and a peripheral area 220. The display area 210 includes a plurality of functional layers 211 arranged in a predetermined manner and forms a plurality of display pixels. The peripheral area 220 is disposed around the periphery of the display area 210 and is formed by a portion of the functional layers 211 in the display area 210. As an example, the direction perpendicular to the main surface can be as follows: Figure 1 As shown by the direction of arrow A. As an example, the direction perpendicular to the main surface may also be the stacking direction of the layer assembly 20 and the substrate 10.

[0028] Among them, the multiple functional layers 211 arranged in a predetermined manner may be a light-emitting epitaxial layer 2111 and a conductive layer 2112, etc. The conductive layer 2112 can be electrically connected to the substrate 10 and the light-emitting epitaxial layer 2111 respectively, and the substrate 10 can provide a driving current to the light-emitting epitaxial layer 2111 through the conductive layer 2112. The light-emitting epitaxial layer 2111 is used to recombine electrons and holes to emit light, thereby converting electrical energy into light energy, and forming one or more display pixels, so that the display area 210 can realize the display function.

[0029] As an example, the light-emitting epitaxial layer 2111 can be formed by doping semiconductor materials such as AlN, AlGaN, GaN, InGaN, AlInGaN, GaAs, GaP, GaInN, GaAsP, AlGaAs or AlGaInP. The conductive layer 2112 can be made of metal copper, aluminum, silver, titanium, tungsten or other conductive materials.

[0030] In some embodiments, Figure 1 As shown, another part of the functional layer 211 of the display area 210 may also include a dielectric layer 2113, which may be filled in the gaps between other functional layers 211 to fix other devices or encapsulate the display area 210. The peripheral area 220 may be formed by the dielectric layer 2113 in the display area 210.

[0031] As an example, the dielectric layer 2113 can be made of silicon dioxide, silicon nitride or other insulating materials.

[0032] As an example, the dielectric layer 2113 may extend toward the periphery of the display area 210 and into the peripheral area 220 along a direction perpendicular to the stacking direction, so as to fill or encapsulate a portion of the component gaps in the peripheral area 220 .

[0033] In some embodiments, Figure 1 As shown, the dielectric layer 2113 may include multiple sub-dielectric layers 2114 , which may be stacked along the stacking direction of the substrate 10 and the layer combination 20 , and other functional layers 211 of the display area 210 may be disposed in the sub-dielectric layers 2114 .

[0034] During the preparation of the Micro-LED display device 1, each sub-dielectric layer 2114 can be formed synchronously with the corresponding other functional layers 211. In other words, a sub-dielectric layer 2114 can be set first, and then the corresponding functional layer 211 (for example, a conductive layer 2112) can be added to the sub-dielectric layer 2114, and then a new sub-dielectric layer 2114 can be added on the sub-dielectric layer 2114, and the corresponding functional layer 211 (for example, other conductive or light-emitting epitaxial layer 2111) can be added on the newly added sub-dielectric layer 2114. Alternatively, in some embodiments, the corresponding functional layer 211 can be set first, and then a new sub-dielectric layer 2114 can be added to fill and fix the corresponding functional layer 211.

[0035] Such an arrangement enables the Micro-LED display device 1 to be formed in a layer-by-layer manner, so as to facilitate the formation of the functional layer 211 in the display area 210 , and can reduce the difficulty of preparing the Micro-LED display device 1 , thereby improving the yield rate of the Micro-LED display device 1 .

[0036] In some embodiments, Figure 1 As shown, the conductive layer 2112 may correspond to the light-emitting epitaxial layer 2111 , and the light-emitting epitaxial layer 2111 is electrically connected to the substrate 10 through the conductive layer 2112 in each sub-dielectric layer 2114 .

[0037] In some embodiments, Figure 1 As shown, the Micro-LED display device 1 may further include an isolation ring 30, which may be embedded in the peripheral area 220 and may be formed synchronously with another portion of the functional layer 211 in the display area 210. The isolation ring 30 may be disposed around the periphery of the display area 210 and maintain a predetermined interval with the display area 210.

[0038] Specifically, when observing the isolation ring 30 and the display area 210 along the stacking direction, the isolation ring 30 can be arranged to surround the display area 210, so that in the direction perpendicular to the stacking direction, the isolation ring 30 separates the display area 210 from the outside world, so as to isolate external interference factors such as impurities, moisture or impurities, so that the display area 210 is not easily contaminated and damaged by environmental interference factors. In addition, the isolation ring 30 is arranged in the peripheral area 220 and is located at the periphery of the display area 210. During the preparation and use of the Micro-LED display device 1, when the display area 210 is subjected to force and generates mechanical stress, the display area 210 will transmit the stress to the peripheral area 220, and the isolation ring 30 in the peripheral area 220 can further relieve the stress, so that the Micro-LED display device 1 is not easily deformed and damaged due to mechanical stress, thereby improving the reliability and yield rate of the Micro-LED display device 1.

[0039] Moreover, the setting in which the isolation ring 30 is formed synchronously with another part of the functional layer 211 in the display area 210 can facilitate the formation of the isolation ring 30, reduce the difficulty of preparing the isolation ring 30, and improve the preparation efficiency and yield of the Micro-LED display device 1.

[0040] In some embodiments, Figure 1 As shown, the isolation ring 30 may include at least two stacked sub-isolation layers 310 , and the at least two sub-isolation layers 310 may be formed simultaneously with the at least two functional layers 211 in the display area 210 .

[0041] As an example, Figure 1As shown, at least two functional layers 211 in the display area 210 can both be conductive layers 2112 that connect the light-emitting epitaxial layer 2111 and the substrate 10. The synchronous formation of the sub-isolation layer 310 and the conductive layer 2112 means that when the conductive layer 2112 is set in the sub-dielectric layer 2114, the corresponding sub-isolation layer 310 is also set in the sub-dielectric layer 2114 together with the conductive layer 2112. Then, multiple sub-dielectric layers 2114 are stacked, and the conductive layer 2112 and the sub-isolation layer 310 set in the sub-dielectric layer 2114 are also correspondingly formed and stacked. Finally, the stacked multiple sub-isolation layers 310 form the isolation ring 30, and the stacked multiple sub-dielectric layers 2114 form the dielectric layer 2113.

[0042] Such a configuration can further facilitate the addition of the sub-isolation layer 310 into the dielectric layer 2113 and form the isolation ring 30, and can also add the sub-isolation layer 310 while adding and forming the conductive layer 2112, thereby reducing the preparation time of the Micro-LED display device 1 to improve the preparation efficiency of the Micro-LED display device 1, and can also reduce the difficulty of preparing the isolation ring 30, thereby improving the preparation efficiency and yield of the Micro-LED display device 1.

[0043] Moreover, by adding a sub-isolation layer 310 in each sub-dielectric layer 2114, the display area 210 corresponding to each sub-dielectric layer 2114 can be surrounded by the sub-isolation layer 310. The sub-isolation layer 310 can play a blocking and protective role for the display area 210 in each corresponding sub-dielectric layer 2114, thereby strengthening the role of the isolation ring 30 and further improving the reliability and yield rate of the Micro-LED display device 1.

[0044] Of course, in other ways, the functional layer 211 in the display area 210 can be added to the dielectric layer 2113 by punching or etching the dielectric layer 2113 after the dielectric layer 2113 is formed. The isolation ring 30 can also be formed simultaneously with part of the functional layer 211 in the display area 210, and then punched and added to the dielectric layer 2113 after the dielectric layer 2113 is formed. The present application does not specifically limit the arrangement of the isolation ring 30.

[0045] In some embodiments, the peripheral region 220 may be formed continuously from the dielectric layer 2113 in the display region 210 , and the isolation ring 30 is formed simultaneously with the conductive layer 2112 in the display region 210 .

[0046] The isolation ring 30 may be formed of a conductive material, that is, the isolation ring 30 may be a conductive ring. The isolation ring 30 may be made of metal copper, aluminum, silver, titanium, tungsten or other conductive materials. The conductive isolation ring 30 may be separated from the conductive layer 2112 of the display area 210 by an insulating dielectric layer 2113.

[0047] In some embodiments, Figure 1 As shown, the isolation ring 30 may also include at least two sub-isolation layers 310 configured to be conductive, and the at least two sub-isolation layers 310 and the corresponding conductive layer 2112 are synchronously formed in the dielectric layer 2113. Such a configuration can not only improve the manufacturing efficiency of the Micro-LED display device 1, but also reduce the difficulty of manufacturing the Micro-LED display device 1, and can also improve the safety of the Micro-LED display device 1 during manufacturing, so that the isolation ring 30 and the conductive layer 2112 are not prone to contact short circuit during manufacturing, thereby improving the reliability and yield rate of the Micro-LED display device 1.

[0048] In some embodiments, Figure 1 as well as Figure 2 As shown, the isolation ring 30 can form a closed conductive path surrounding the display area 210. The isolation ring 30 can be electrically connected to the circuit structure in the substrate 10, and the circuit structure in the substrate 10 can supply power to the isolation ring 30, so that the isolation ring 30 surrounding the display area 210 can have a certain electrical property, thereby forming a closed conductive path.

[0049] During the preparation of the Micro-LED display device 1, especially when the electrical elements in the display area 210 are formed, some charges or static electricity will be free on the surface of the display area 210 away from the substrate 10. Therefore, the isolation ring 30 is set as a closed conductive path surrounding the display area 210, so that the isolation ring 30 can attract the free charges, electrical impurities or static electricity at the periphery of the display area 210, thereby guiding the free charges, static electricity or electrical impurities to a safe area away from the display area 210, thereby reducing the occurrence of damage to the display area 210 caused by the accumulation of charges, static electricity or electrical impurities, or the occurrence of structural defects caused by the pollution of the display area 210, thereby improving the reliability and yield of the Micro-LED display device 1.

[0050] In some embodiments, the isolation ring 30 may be electrically connected to a preset reference potential. The isolation ring 30 may be electrically connected to the preset reference potential by being connected to the substrate 10, so that the substrate 10 may be set in advance, or the preset reference potential may be adjusted by controlling the current in the substrate 10.

[0051] As an example, the substrate 10 can be configured in advance so that the isolation ring 30 is electrically connected to the substrate 10 and then connected to a preset reference potential, and the charges, static electricity or electrical impurities on the surfaces of the peripheral area 220 and the display area 210 facing away from the substrate 10 are adsorbed by the isolation ring 30 and can be guided to the substrate 10 through the isolation ring 30, thereby reducing the situation in which the charges, static electricity or electrical impurities accumulate in the display area 210 and cause damage or contamination to the display area 210.

[0052] As an example, the isolation ring 30 can be grounded through the substrate 10, so that the Micro-LED display device 1 can shield electrical interference outside the display area 210 as much as possible during the preparation or use process.

[0053] Of course, in other embodiments, the isolation ring 30 may be electrically connected to the reference potential in other ways. For example, a circuit may be provided on a side of the peripheral region 220 facing away from the substrate 10 so that the isolation ring 30 is grounded.

[0054] In some embodiments, the isolation ring 30 may also be made of an insulating material, that is, the isolation ring 30 may be a dielectric ring. Moreover, the isolation ring 30 and the dielectric layer 2113 may be made of different materials. For example, the dielectric layer 2113 may be silicon dioxide, and the isolation ring 30 may be made of other insulating materials such as silicon nitride.

[0055] Such a configuration allows the isolation ring 30 to isolate environmental interference factors such as moisture, water or dust at the periphery of the display area 210, thereby protecting the display area 210 and reducing corrosion damage or short circuit of the display area 210, thereby improving the reliability and yield of the Micro-LED display device 1.

[0056] In some embodiments, the peripheral region 220 may be formed by continuing from a portion of the dielectric layer 2113 in the display region 210 , and the isolation ring 30 may be formed simultaneously with another portion of the dielectric layer 2113 in the display region 210 .

[0057] The display area 210 may include at least two different dielectric layers 2113. As an example, Figure 1 As shown, the display area 210 may include a first dielectric layer 2115 and a second dielectric layer 2116, wherein the first dielectric layer 2115 and the second dielectric layer 2116 may extend to the periphery of the display area 210 to form a peripheral area 220, and the first dielectric layer 2115 and the second dielectric layer 2116 may be stacked. The material of the isolation ring 30 may be consistent with the material in the second dielectric layer 2116, for example, both may be made of silicon dioxide, or the two may be different insulating materials.

[0058] Such a configuration allows the isolation ring 30 to be easily added into the dielectric layer 2113 of the peripheral area 220 when the isolation ring 30 is made of dielectric material, thereby improving the manufacturing efficiency of the Micro-LED display device 1 and reducing the difficulty of manufacturing the Micro-LED display device 1 .

[0059] In some embodiments, Figure 1 As shown, the Micro-LED display device 1 may be provided with a cutting groove 40 in the peripheral area 220 of the peripheral area 220. Since during the preparation of the Micro-LED display device 1, several Micro-LED display devices 1 are usually prepared together on one substrate 10, and the cutting groove 40 is provided between the several Micro-LED display devices 1, after the preparation of other areas of the Micro-LED display device 1 is completed, the several Micro-LED display devices 1 can be separated by cutting the cutting groove 40.

[0060] Specifically, during the process of cutting the cutting grooves 40 of several Micro-LED display devices 1, the Micro-LED display device 1 will undergo internal changes due to the force, generating mechanical stress, which can easily cause the layer assembly 20 in the Micro-LED display device 1 to deform. The provision of the isolation ring 30 can disperse and relieve the mechanical stress during the cutting process, thereby making the layer assembly 20 less likely to deform and damage, thereby improving the reliability and yield rate of the Micro-LED display device 1.

[0061] In some embodiments, Figure 1 As shown, the Micro-LED display device 1 may further include a pad 50 located in the peripheral area 220 , and an isolation ring 30 is disposed around the display area 210 and the periphery of the pad 50 .

[0062] As an example, one end of the pad 50 can be electrically connected to the substrate 10, and the other end can be exposed to the surface of the peripheral area 220 facing away from the substrate 10. The external circuit can supply power to the substrate 10 through the pad 50, and then supply power to the display area 210 and the isolation ring 30 through the substrate 10.

[0063] By arranging the isolation ring 30 at the periphery of the display area 210 and the pad 50, the isolation ring 30 can isolate and protect the display area 210 and the pad 50, and can also improve the reliability of the pad 50. Moreover, the conductive isolation ring 30 can absorb the charge, static electricity and electrical impurities near the display area 210 and the pad 50 to the outside of the periphery, so as to reduce the influence of the charge, static electricity and electrical impurities on the display area 210 and the pad 50.

[0064] In some embodiments, there may be at least two isolation rings 30. The at least two isolation rings 30 may be nested with each other and both are disposed around the periphery of the display area 210, and the functional layer 211 formed synchronously with the at least two isolation rings 30 is at least partially different.

[0065] For example, in some embodiments, one of the at least two isolation rings 30 may be a conductive ring and the other may be a dielectric ring. The conductive ring is formed simultaneously with the conductive layer 2112 in the display area 210, and the dielectric ring is formed simultaneously with the dielectric filling material in the display area 210.

[0066] Such a configuration can facilitate the preparation of the Micro-LED display device 1, reduce the occurrence of the disorder of the positions of the conductive ring and the dielectric ring, thereby reducing the difficulty of preparing the Micro-LED display device 1 and improving the yield rate. In addition, the number of the isolation rings 30 is at least two, which can further enhance the isolation and blocking effect of the isolation rings 30 in the peripheral area 220. In addition, the simultaneous provision of the conductive ring and the dielectric ring can protect the display area 210 in terms of electrical isolation and physical isolation, thereby further ensuring the reliability and yield rate of the Micro-LED display device 1.

[0067] In some other embodiments, the number of the isolation rings 30 may be three, one of the isolation rings 30 is a dielectric ring, and two of the isolation rings 30 are conductive rings.

[0068] Among them, a conductive ring can be arranged between the pad 50 and the display area 210 to separate the pad 50 from the display area 210, so as to absorb the charge, static electricity or electrical impurities between the pad 50 and the display area 210, so as to prevent too many charge electrons from gathering between the pad 50 and the display area 210, thereby preventing the pad 50 and the display area 210 from being electrically connected through free charge electrons and causing a short circuit. Another conductive ring and a dielectric ring are nested with each other and can be arranged in the peripheral area 220 of the pad 50 to block interference factors such as moisture, water and electrical impurities at the outermost periphery of the Micro-LED display device 1, thereby improving the reliability and yield rate of the Micro-LED display device 1.

[0069] Of course, in other embodiments, the number of isolation rings 30 may also be one, four, five, etc., which will not be specifically listed one by one in this embodiment.

[0070] In some embodiments, when viewed in a direction perpendicular to the main surface, the corner position of the isolation ring 30 may present an arc-shaped or obtuse angle transition.

[0071] For example, as an example, Figure 2 As shown, the corner position of the isolation ring 30 can be in an arc shape.

[0072] Or, as an example, Figure 3 As shown, the angled position of the isolation ring 30 may present an obtuse angle transition.

[0073] Since the conductive isolation ring 30 is prone to generate some free charges during the preparation process, if the corner position of the isolation ring 30 is set at a right angle or an acute angle, the free charges will gather at the corner position. Therefore, by setting the corner position to present an arc or obtuse angle transition, the free charges can be reduced from gathering at the corner position, thereby improving the safety and reliability of the isolation ring 30 in the preparation process. Moreover, compared with a right angle or an acute angle, an obtuse angle transition is easier to form and prepare, which can reduce the difficulty of preparing the isolation ring 30. Compared with a right angle or an acute angle, the arc transition angle can greatly reduce the free charge accumulation, so the arc transition design can further improve safety and reliability.

[0074] Of course, the corner position of the isolation ring 30 can also be in the form of a right angle or an acute angle, which will not be listed in detail one by one in this application.

[0075] In summary, the Micro-LED display device 1 described in the present application is provided with a display area 210 and a peripheral area 220, a functional layer 211 for forming a plurality of display pixels is provided in the display area 210, the peripheral area 220 is arranged around the periphery of the display area 210, and the Micro-LED display device 1 is further provided with an isolation ring 30, which is arranged in the peripheral area 220 to surround the display area 210 and is spaced from the display area 210. The isolation ring 30 is arranged in the peripheral area 220 outside the display area 210, so that the isolation ring 30 can block environmental interference factors such as external moisture or impurities for the display area 210, and can further play a role in isolating and protecting the display area 210, so that the display area 210 is not easily contaminated and damaged due to environmental interference factors. On the other hand, the isolation ring 30 is disposed at the periphery of the display area 210, and can also relieve the mechanical stress in the display area 210 and the peripheral area 220 during the preparation and use of the Micro-LED display device 1, so that the Micro-LED display device 1 is not easily deformed and damaged due to mechanical stress, thereby improving the reliability and yield of the Micro-LED display device 1. Moreover, the isolation ring 30 is formed synchronously with another part of the functional layer 211 in the display area 210, which can facilitate the formation of the isolation ring 30 and improve the preparation efficiency and yield of the Micro-LED display device 1.

[0076] The above descriptions are merely embodiments of the present application and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A Micro-LED display device, characterized in that: The Micro-LED display device includes a substrate and a layer combination arranged on the main surface of the substrate, wherein the layer combination is divided into a display area and a peripheral area when observed in a direction perpendicular to the main surface, the display area includes a plurality of functional layers arranged in a predetermined manner and forms a plurality of display pixels, the peripheral area is arranged around the periphery of the display area and is formed by a portion of the functional layers in the display area, wherein the Micro-LED display device also includes an isolation ring, which is embedded in the peripheral area and is formed synchronously with another portion of the functional layers in the display area, and the isolation ring is arranged around the periphery of the display area and maintains a predetermined interval with the display area.

2. The Micro-LED display device according to claim 1, characterized in that: The isolation ring includes at least two sub-isolation layers which are stacked and formed synchronously with at least two functional layers in the display area.

3. The Micro-LED display device according to claim 1, characterized in that: The peripheral area is formed continuously from the dielectric layer in the display area, and the isolation ring is formed synchronously with the conductive layer in the display area.

4. The Micro-LED display device according to claim 1, characterized in that: The peripheral area is formed by continuing from a portion of the dielectric layer in the display area, and the isolation ring is formed synchronously with another portion of the dielectric layer in the display area.

5. The Micro-LED display device according to claim 1, characterized in that: The isolation ring forms a closed conductive path surrounding the display area.

6. The Micro-LED display device according to claim 5, characterized in that: The isolation ring is electrically connected to a preset reference potential.

7. The Micro-LED display device according to claim 1, characterized in that: The Micro-LED display device includes a pad located in the peripheral area, and the isolation ring is arranged around the display area and the periphery of the pad.

8. The Micro-LED display device according to claim 1, characterized in that: The number of the isolation rings is at least two, the at least two isolation rings are nested with each other, and are both arranged around the periphery of the display area, and the functional layer formed synchronously with the at least two isolation rings is at least partially different.

9. The Micro-LED display device according to claim 8, characterized in that: One of the at least two isolation rings is a conductive ring, and the other is a dielectric ring.

10. The Micro-LED display device according to claim 1, characterized in that: When observed in a direction perpendicular to the main surface, the corner position of the isolation ring presents an arc-shaped or obtuse angle transition.

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