Fine overtemperature protection device and method applied to phased array transmitter

Abstract

The invention discloses a refined overtemperature protection device and method applied to a phased array transmitter, and relates to the field of logic control, and the device comprises a system control module, a T / R array control module, and a T / R array. The system control module is connected with the PC end through a serial port bus, and the T / R array control module is connected with the system control module through a CAN bus; the T / R array is connected with the T / R array control module through a TTL bus; the invention further provides an overtemperature protection method. According to the invention, the working state of the system is intelligently switched in the temperature change process of the T / R assembly by designing refined overtemperature protection logic and adopting a mode of stepped degradation of the performance of the phased array system, and the maximum efficiency of the phased array system can be exerted while overtemperature protection is carried out; meanwhile, power can be cut off in time before the temperature of the T / R assembly exceeds the maximum junction temperature, and huge losses caused by poor heat dissipation conditions in the product research, development and use processes are effectively avoided.

Description

Technical Field

[0001] The present invention relates to the field of logic control, and in particular to a refined over-temperature protection device and method applied to a phased array transmitter. Background Art

[0002] The statements in this section merely provide background information related to the present disclosure and may not constitute prior art.

[0003] In view of the improvement of hardware and software capabilities at home and abroad, phased array technology has developed rapidly, and new T / R components have emerged. With the rapid development of semiconductor technology, the high current density and increased thermal effects inside the T / R components will bring about significant temperature rise, which will not only cause the performance and stability of the RF circuit to decline, but also affect its reliability and life.

[0004] Generally speaking, heat dissipation is faster when the ambient temperature is low, and slower when the ambient temperature is high. According to the Arrhenius model, for every 10°C increase in ambient temperature, the failure rate of the circuit increases by an order of magnitude, which is the famous "10°C rule". For every 2°C increase in the temperature of a component or circuit, its reliability decreases by about 10%. When the temperature rises by 50°C, the life of the device is only 1 / 6 of that when the temperature rises by 25°C. The above rules also apply to RF circuits, which means that temperature is the primary factor affecting the performance and reliability of RF circuits.

[0005] The specific effects of high temperature are as follows: High temperature can cause circuit aging, oxidation, chemical changes, thermal diffusion, EM, melting, gasification deformation, etc. When the chip is working under high temperature for a long time, the ohmic contact will degrade and metal ions will migrate in different media, which will lead to the decline of chip performance. With the decline of performance, the chip operating temperature will continue to rise, which will induce further decline of chip performance. In such a vicious cycle, chip failure is likely to occur.

[0006] The existing T / R components are limited by the integration space and only the temperature monitoring circuit is designed. The temperature monitoring process is as follows: Figure 2 As shown in the figure, the system is in an open-loop monitoring state and no closed-loop over-temperature protection circuit is implemented. The T / R array control module collects the temperature information of the T / R through the TTL bus, and transmits the temperature information to the system control module through the CAN bus, and finally realizes the monitoring of the temperature of the T / R array through the serial bus. The temperature monitoring system queries the temperature of the T / R component according to a 10s cycle, and can only obtain the quasi-real-time temperature of the T / R component. The system only reports over-temperature for this temperature information, and the response is slow, which cannot meet the real-time performance of the system for over-temperature protection of the T / R component. In actual use, if the cooling system is not effective or the cooling system is not turned on, it will cause irreversible failures to the T / R array and even the entire system. Summary of the invention

[0007] The purpose of the present invention is to provide a refined over-temperature protection device and method for phased array transmitters, in view of the fact that the existing T / R components and systems only have the function of temperature monitoring, the power of the T / R components will decrease when the temperature is over, and when the maximum junction temperature is exceeded, the T / R will be irreversibly burned. In combination with the hardware conditions of the existing T / R components and systems, an over-temperature control circuit is designed to accurately control the power off of the T / R components when the heat dissipation is poor. When the system turns off different proportions of T / R components, the function of step-by-step degradation can be achieved. When 10% of the T / R components are turned off for transmission, the system equivalent radiated power decreases by 19%, and when 50% of the T / R components are turned off for transmission, the system equivalent radiated power decreases by 75%; when 50% of the T / R components are turned off for reception, the system sensitivity decreases by 3dB. When the number of over-temperature T / R components exceeds 50%, the system equivalent radiated power decreases by more than 75%, which cannot meet the use requirements. The system power supply is completely turned off to achieve the best combination of system temperature protection and system working efficiency.

[0008] The technical solution of the present invention is as follows:

[0009] A refined over-temperature protection device applied to a phased array transmitter, comprising:

[0010] System control module, T / R array control module, T / R array;

[0011] The system control module is connected to the PC via the serial bus to report the temperature of the T / R components;

[0012] The T / R array control module is connected to the system control module via the CAN bus, and is used to receive the T / R array switch electrical command issued by the system control module and report the T / R array temperature;

[0013] The T / R array is connected to the T / R array control module via a TTL bus. The T / R array control module controls the switch power of the T / R array according to the received T / R array switch power command. The temperature of the T / R component is reported to the PC through the T / R array control module and the system control module.

[0014] Furthermore, the T / R array control module is composed of an MCU and an FPGA. The MCU is connected to the system control module via a CAN bus, and the MCU is connected to the FPGA via an SPI bus. The FPGA transmits a power-on control signal S[1…m] via a TTL bus to control the power on and off of the T channels of m T / R components. The FPGA can also power on and off the entire system. When the transmitting channel of the T / R component is powered off, the receiving channel and the temperature sensor can work normally.

[0015] Furthermore, the system control module is PowerPC, which refreshes the temperature T[1…m] of m T / R components in real time every 500ms through the CAN bus to meet the real-time requirements of temperature acquisition, and comprehensively judges the temperature of the T / R components, and sets different working states of the T / R components according to the temperature judgment threshold.

[0016] Furthermore, the FPGA collects the operating temperature of the T / R component in real time through the temperature sensor inside the T / R component and determines the temperature status.

[0017] A refined over-temperature protection method for a phased array transmitter, based on the above-mentioned refined over-temperature protection device for a phased array transmitter, comprises:

[0018] The temperature of the T / R components is comprehensively judged, and different working states of the T / R components are set according to the temperature judgment threshold, thereby realizing refined over-temperature control of the transmitting channel and the receiving channel.

[0019] Furthermore, to reduce false alarms of abnormal temperature, the FPGA first filters abnormal acquisition values ​​according to the characteristics of the sensor. If the temperature is continuously acquired and the FPGA pin is not connected to the TR component temperature sensor or the TR component power supply is abnormal, the temperature value is considered to be an abnormal value and is filtered;

[0020] If the temperature collected by the FPGA continues to exceed the temperature and the system does not issue a channel power-off command, the FPGA will actively shut down the channel and report the abnormal status to the system to protect the hardware.

[0021] Furthermore, when the temperature of the T / R component is lower than the alarm threshold T0, the system operates normally; when the temperature of the T / R component is higher than the alarm threshold T0, an alarm prompt is reported and the system maintains normal operating status; when the temperature of the T / R component is higher than the over-temperature threshold T1, the power supply of the transmitting channel of the over-temperature T / R component is turned off. At this time, the system transmitting function is degraded, but the receiving function is not degraded, and a degradation prompt is reported; when the T / R component continues to rise and the temperature is higher than the over-temperature threshold T2, the T / R component exceeding the temperature threshold T2 is completely powered off. At this time, the system transmitting function and the receiving function are both degraded, and a prompt of another reduction is reported; when the number of T / R components that are completely powered off due to over-temperature is greater than 50%, the system control module reports a power-off prompt and completely shuts down the power supply of the phased array system.

[0022] Furthermore, before the power supply of the phased array system is completely shut down, the over-temperature protection device can automatically determine and restore the power supply of the T / R components as the temperature of the T / R components continues to drop; when the system function is degraded, the temperature of all remaining T / R components decreases and is less than T1, the over-temperature protection device automatically restores the power supply of the shut down T / R components, and the power supply of the transmitting channel remains in the power-off state; as the temperature continues to drop and the temperature of the T / R components is less than T0, the power supply of the transmitting channel of the T / R components is restored.

[0023] Furthermore, the setting of the temperature threshold includes:

[0024] T0 is selected as the starting point of temperature at which the reliability of the T / R component decreases;

[0025] According to the relationship between temperature and reliability, T1 and T2 are determined in sequence with T0 as the reference.

[0026] Furthermore, the relationship between temperature and reliability is as follows:

[0027] R(T)=0.948^(T-T0), T≥T0

[0028] in:

[0029] R(T) stands for reliability.

[0030] Compared with the prior art, the present invention has the following beneficial effects:

[0031] 1) The over-temperature protection control device of the present invention, by designing a refined over-temperature protection logic and adopting a phased array system performance step-down method, intelligently switches the system working state during the temperature change of the T / R component, and can maximize the efficiency of the phased array system while providing over-temperature protection.

[0032] 2) In view of the temperature-sensitive characteristics of highly integrated, miniaturized, and high-power T / R components, the present invention can cut off power in time before the temperature of the T / R components exceeds the maximum junction temperature, effectively avoiding huge losses caused by poor heat dissipation conditions during product development and use. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 This is the schematic diagram of the over-temperature protection control device;

[0034] Figure 2 This is the existing temperature monitoring schematic diagram;

[0035] Figure 3 The simulation results of temperature distribution of T / R components;

[0036] Figure 4 This is a schematic diagram of the temperature monitoring layout of the T / R components;

[0037] Figure 5 Automatic judgment process for over-temperature protection device;

[0038] Figure 6 This is a trend chart of T / R component temperature and reliability changes. DETAILED DESCRIPTION

[0039] It should be noted that relational terms such as "first" and "second" are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0040] The features and performance of the present invention are further described in detail below in conjunction with the embodiments.

[0041] Embodiment 1

[0042] A refined over-temperature protection device applied to phased array transmitters. In view of the high integration and high power characteristics of phased array T / R components, when the heat dissipation conditions are poor, it can maximize the system performance while protecting the T / R component hardware. The working principle of the over-temperature protection control device is as follows: Figure 1 As shown, specifically including:

[0043] System control module, T / R array control module, T / R array;

[0044] The system control module is connected to the PC via the serial bus to report the temperature of the T / R components;

[0045] The T / R array control module is connected to the system control module via the CAN bus, and is used to receive the T / R array switch electrical command issued by the system control module and report the T / R array temperature;

[0046] The T / R array is connected to the T / R array control module via a TTL bus. The T / R array control module controls the switch power of the T / R array according to the received T / R array switch power command. The temperature of the T / R component is reported to the PC through the T / R array control module and the system control module.

[0047] In this embodiment, specifically, the T / R array control module is mainly composed of an MCU and an FPGA. The MCU is connected to the system control module via a CAN bus, and the MCU is connected to the FPGA via an SPI bus. The FPGA transmits a power-on control signal S[1…m] via a TTL bus to control the power on and off of the T channels of m T / R components. The FPGA can also power on and off the entire system. When the transmitting channel of the T / R component is powered off, the receiving channel and the temperature sensor can work normally.

[0048] In this embodiment, specifically, the system control module is PowerPC, which refreshes the temperature T[1…m] of m T / R components in real time every 500 ms through the CAN bus to meet the real-time requirements of temperature acquisition, and comprehensively judges the temperature of the T / R components, and sets different working states of the T / R components according to the temperature judgment threshold.

[0049] The simulation results of temperature distribution of T / R components are shown in Figure 3 As shown in the figure, since the system uses liquid cooling, the temperature difference between the temperature near the temperature sensor and the temperature of the T / R component amplifier chip is no more than 5°C, indicating that the temperature sensor can reliably feedback the temperature of the T / R component. In order to eliminate the influence of factors such as T / R component layout and heat dissipation flow, the corresponding over-temperature protection program is executed only when the temperature of at least 3 T / R components exceeds the judgment threshold. The schematic diagram of the temperature monitoring layout of m T / R components inside the rack is shown in Figure 4 As shown in the figure, when judging over-temperature, the average temperature of the three T / R components with the highest temperature is selected for comprehensive judgment to achieve refined over-temperature management.

[0050] In this embodiment, specifically, the FPGA collects the operating temperature of the T / R component in real time through the temperature sensor inside the T / R component and determines the temperature state.

[0051] Based on the above-mentioned refined over-temperature protection device applied to a phased array transmitter, this embodiment further proposes a refined over-temperature protection method applied to a phased array transmitter, which specifically includes:

[0052] The temperature of the T / R components is comprehensively judged, and different working states of the T / R components are set according to the temperature judgment threshold, thereby realizing refined over-temperature control of the transmitting channel and the receiving channel.

[0053] In this embodiment, specifically, to reduce false alarms of abnormal temperature, the FPGA first filters abnormal acquisition values ​​according to the characteristics of the sensor. If the temperature is continuously acquired and the FPGA pin is not connected to the TR component temperature sensor or the TR component power supply is abnormal, the temperature value is considered to be an abnormal value and is filtered;

[0054] If the temperature collected by the FPGA continues to exceed the temperature and the system does not issue a channel power-off command, the FPGA will actively shut down the channel and report the abnormal status to the system to protect the hardware.

[0055] In this embodiment, specifically, the automatic judgment process of the over-temperature protection device is as follows: Figure 5As shown, when the temperature of the T / R component is less than the alarm threshold T0, the system works normally; when the temperature of the T / R component is greater than the alarm threshold T0, an alarm prompt is reported and the system maintains a normal working state; when the temperature of the T / R component is greater than the over-temperature threshold T1, the power supply of the transmitting channel of the over-temperature T / R component is turned off. At this time, the system transmission function is degraded, and the detection and reception function is not degraded, and a degradation prompt is reported; when the T / R component continues to rise and the temperature is greater than the over-temperature threshold T2, the T / R component exceeding the temperature threshold T2 is completely powered off. At this time, the system transmission function and the detection and reception function are both degraded, and a further reduction prompt is reported; when the number of T / R components that are completely powered off due to over-temperature is greater than 50%, the system control module reports a power-off prompt and completely shuts down the power supply of the phased array system.

[0056] In this embodiment, specifically, before the power supply of the phased array system is completely shut down, the over-temperature protection device can automatically determine and restore the power supply of the T / R components as the temperature of the T / R components continues to drop; when the system function is degraded, the temperature of all remaining T / R components decreases and is less than T1, the over-temperature protection device automatically restores the power supply of the shut down T / R components, and the power supply of the transmitting channel remains in the power-off state; as the temperature continues to drop, when the temperature of the T / R components is less than T0, the power supply of the transmitting channel of the T / R components is restored.

[0057] In this embodiment, specifically, according to the Arrhenius model, for every 2°C increase in the temperature of a component or circuit, its reliability R(T) decreases by about 10%. Considering the hardware design characteristics of the T / R component, it is proposed to select T0=60°C as the starting point of the temperature at which the reliability of the T / R component decreases, and the simplified relationship between temperature and reliability is shown in (Formula 1). Substituting T0=60°C into (Formula 1), (Formula 2) is obtained:

[0058] R(T)=0.948^(T-T0), T≥T0 (Formula 1)

[0059] R(T)=0.948^(T-60), T≥60℃ (Formula 2)

[0060] According to (Equation 2), the general trend of the temperature and reliability of the T / R component is as follows: Figure 6 As shown in the figure, taking the reliability at 60℃ as the reference point, the reliability at 65℃ becomes 76.84%, the reliability at 70℃ becomes 59.05%, and the reliability at 80℃ becomes 34.87%. Corresponding to the trend of decreasing temperature and reliability, and combining the high temperature resistance characteristics of the phased array system hardware, the system heat distribution, the system heat dissipation capacity and other conditions, this system can set the temperature alarm threshold to 65℃, the first level performance degradation threshold to 70℃, and the second level performance degradation threshold to 80℃.

[0061] Embodiment 2

[0062] In a certain type of equipment, the over-temperature protection control device and method proposed in Example 1 are used, which can not only maximize the performance of the phased array, but also achieve the effect of protecting the T / R component hardware and system hardware, and effectively solve the problem that high-integration, high-cost T / R components are prone to over-temperature damage in phased array applications. The following results and implementation examples further illustrate the present invention.

[0063] The transceiver phased array is composed of 64 four-channel T / R components. The temperature characteristics of the T / R components and the design of the heat dissipation system are combined to select the optimal over-temperature threshold, the alarm threshold is 65°C, and the two-level over-temperature degradation thresholds are 70°C and 80°C respectively. When the system works at the performance degradation threshold, when the temperature of the T / R component exceeds 70°C, the transmission of the corresponding channel is turned off, and the receiving channel is kept working; when the temperature of the T / R component exceeds 80°C, the power supply of the over-temperature T / R component is turned off, and when the number of T / R components that shut down the power supply due to over-temperature exceeds 32 (50%), the power supply of the entire phased array system is turned off, so as to maximize the system performance while ensuring the safety of the hardware. Compared with the system without over-temperature protection control device, the losses caused by poor or failed heat dissipation system can be effectively avoided during use. The examples of the present invention have played the role of over-temperature protection many times, achieving the effect of the invention.

[0064] The above-mentioned embodiments only express the specific implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the protection scope of the present application. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the technical solution concept of the present application, and these all belong to the protection scope of the present application.

[0065] This background section is provided to generally present the context of the invention, and the work of the presently named inventors, the work to the extent described in this background section, and aspects of this section that did not constitute prior art at the time of application are neither explicitly nor implicitly admitted to be prior art to the present invention.

Claims

1. A refined over-temperature protection device for a phased array transmitter, characterized in that: include: System control module, T / R array control module, T / R array; The system control module is connected to the PC via the serial bus to report the temperature of the T / R components; The T / R array control module is connected to the system control module via the CAN bus, and is used to receive the T / R array switch electrical command issued by the system control module and report the T / R array temperature; The T / R array is connected to the T / R array control module via a TTL bus. The T / R array control module controls the switch power of the T / R array according to the received T / R array switch power command. The temperature of the T / R component is reported to the PC through the T / R array control module and the system control module.

2. According to claim 1, a refined over-temperature protection device for a phased array transmitter is characterized in that: The T / R array control module consists of an MCU and an FPGA. The MCU is connected to the system control module via the CAN bus, and the MCU is connected to the FPGA via the SPI bus. The FPGA transmits the power-on control signal S[1…m] via the TTL bus to control the power on and off of the T channels of the m T / R components. The FPGA can also power on and off the entire system. When the transmitting channel of the T / R component is powered off, the receiving channel and the temperature sensor can work normally.

3. The refined over-temperature protection device for a phased array transmitter according to claim 2 is characterized in that: The system control module is PowerPC, which refreshes the temperature T[1…m] of m T / R components in real time every 500ms through the CAN bus to meet the real-time requirements of temperature acquisition, and comprehensively judges the temperature of the T / R components, and sets different working states of the T / R components according to the temperature judgment threshold.

4. The refined over-temperature protection device for a phased array transmitter according to claim 3 is characterized in that: The FPGA collects the operating temperature of the T / R component in real time through the temperature sensor inside the T / R component and determines the temperature status.

5. A refined over-temperature protection method for a phased array transmitter, characterized in that: A refined over-temperature protection device applied to a phased array transmitter according to any one of claims 1 to 4, comprising: The temperature of the T / R components is comprehensively judged, and different working states of the T / R components are set according to the temperature judgment threshold, thereby realizing refined over-temperature control of the transmitting channel and the receiving channel.

6. The refined over-temperature protection method for phased array transmitter according to claim 5, characterized in that: To reduce false alarms of abnormal temperature, the FPGA first filters abnormal acquisition values ​​according to the characteristics of the sensor. If the temperature is continuously acquired and the FPGA pin is not connected to the TR component temperature sensor or the TR component power supply is abnormal, the temperature value is considered to be an abnormal value and is filtered out. If the temperature collected by the FPGA continues to exceed the temperature and the system does not issue a channel power-off command, the FPGA will actively shut down the channel and report the abnormal status to the system to protect the hardware.

7. The refined over-temperature protection method for a phased array transmitter according to claim 5, characterized in that: When the temperature of the T / R component is lower than the alarm threshold T0, the system operates normally; when the temperature of the T / R component is higher than the alarm threshold T0, an alarm prompt is reported and the system maintains normal operating status; when the temperature of the T / R component is higher than the over-temperature threshold T1, the power supply of the transmitting channel of the over-temperature T / R component is turned off. At this time, the system transmitting function is degraded, but the receiving function is not degraded, and a degradation prompt is reported; when the T / R component continues to rise and the temperature is higher than the over-temperature threshold T2, the T / R component exceeding the temperature threshold T2 is completely powered off. At this time, the system transmitting function and the receiving function are both degraded, and a further reduction prompt is reported; when the number of T / R components that are completely powered off due to over-temperature is greater than 50%, the system control module reports a power-off prompt and completely shuts down the power supply of the phased array system.

8. The refined over-temperature protection method for phased array transmitter according to claim 7, characterized in that: Before the power of the phased array system is completely shut down, the over-temperature protection device can automatically determine and restore the power supply of the T / R components as the temperature of the T / R components continues to drop; when the system function is degraded, the temperature of all remaining T / R components decreases and is less than T1, the over-temperature protection device automatically restores the power supply of the shut down T / R components, and the power supply of the transmitting channel remains in the power-off state; as the temperature continues to drop and the temperature of the T / R components is less than T0, the power supply of the transmitting channel of the T / R components is restored.

9. The refined over-temperature protection method for phased array transmitter according to claim 1, characterized in that: Temperature threshold settings, including: T0 is selected as the starting point of temperature at which the reliability of the T / R component decreases; According to the relationship between temperature and reliability, T1 and T2 are determined in sequence with T0 as the reference.

10. The refined over-temperature protection method for phased array transmitter according to claim 9, characterized in that: The relationship between temperature and reliability is as follows: R(T)=0.948^(T-T0), T≥T0where: R(T) stands for reliability.

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