Camera module and electronic device

Abstract

The application discloses a camera module and electronic equipment, and relates to the field of electronic equipment. A camera module comprises a support assembly and a camera. The support assembly comprises a fence and a heat-conducting medium. The fence encloses an installation space, and the camera is arranged in the installation space. The heat-conducting medium is arranged on the fence and can be distributed along the surrounding direction of the fence. The fence has a heat-absorbing area and a heat-dissipating area. The camera has a heat source part. The heat-conducting medium is used for cooperating with the heat-absorbing area and the heat source part to absorb heat generated by the heat source part. The heat-conducting medium is also used for transporting the heat to the heat-dissipating area to dissipate the heat. The embodiment of the application can solve the problem of poor heat dissipation effect of the current camera module.

Description

Technical Field

[0001] This application belongs to the field of electronic equipment technology, specifically relating to a camera module and electronic equipment. Background Technology

[0002] In electronic devices (such as mobile phones), due to limited space and the need to control the overall height of the camera module, camera modules (such as periscope cameras) are often fixed and positioned using separate brackets. However, some brackets have poor thermal conductivity, causing the heat generated in the chip area of ​​the camera module to be unable to dissipate quickly, which can easily lead to junction temperature risks and even damage to the camera module. Summary of the Invention

[0003] The purpose of this application is to provide a camera module and electronic device that can solve problems such as poor heat dissipation in current camera modules.

[0004] To solve the above-mentioned technical problems, this application is implemented as follows:

[0005] This application provides a camera module, including: a bracket assembly and a camera;

[0006] The bracket assembly includes a enclosure and a heat-conducting medium. The enclosure forms an installation space, the camera is installed in the installation space, and the heat-conducting medium is installed on the enclosure and can be distributed along the surrounding direction of the enclosure.

[0007] The enclosure has a heat absorption area and a heat dissipation area, the camera has a heat source, and the heat-conducting medium is used to cooperate with the heat source in the heat absorption area to absorb the heat generated by the heat source. The heat-conducting medium is also used to transport the heat to the heat dissipation area to dissipate the heat.

[0008] This application also provides an electronic device, including: the above-mentioned camera module, wherein the camera module is a periscope camera module.

[0009] In this embodiment, the installation space enclosed by the enclosure can accommodate the camera; a heat-conducting medium is provided on the enclosure and can be distributed along the enclosure's surrounding direction. In this way, the heat absorbed by the camera's heat source in the heat-absorbing area of ​​the enclosure can be transferred to the heat dissipation area of ​​the enclosure, and finally the heat is dissipated outward through the heat dissipation area, thereby achieving the heat dissipation and cooling effect on the camera. This alleviates the problem of heat accumulation inside the camera due to poor heat dissipation of the bracket assembly, which may cause the risk of overheating. Therefore, it can effectively prevent the camera from being damaged due to excessive temperature. Attached Figure Description

[0010] Figure 1This is a first assembly diagram of the camera module disclosed in the embodiments of this application;

[0011] Figure 2 This is a second assembly diagram of the camera module disclosed in the embodiments of this application;

[0012] Figure 3 This is a disassembly diagram of the camera module disclosed in the embodiments of this application;

[0013] Figure 4 This is a schematic diagram of the structure of the support assembly disclosed in the embodiments of this application;

[0014] Figure 5 This is a partial cross-sectional schematic diagram of the bracket assembly and camera disclosed in the embodiments of this application;

[0015] Figure 6 This is a schematic diagram of the structure of the first enclosure disclosed in an embodiment of this application;

[0016] Figure 7 This is a schematic diagram of the structure of the second enclosure disclosed in an embodiment of this application;

[0017] Figure 8 This is a disassembly diagram of another form of camera module disclosed in the embodiments of this application;

[0018] Figure 9 This is a flowchart illustrating the assembly process of the camera module disclosed in an embodiment of this application.

[0019] Explanation of reference numerals in the attached figures:

[0020] 10-Support assembly;

[0021] 11-Enclosure; 111-First enclosure; 1111-Groove; 1112-First protrusion; 1113-Notch; 112-Second enclosure; 1121-Inlet; 1122-Second protrusion; P-Installation space; Q-Accommodation channel; M-Heat absorption area; N-Heat dissipation area;

[0022] 12-Heat-conducting medium; 121-Heat-conducting liquid; 122-Metal wire;

[0023] 20 - Camera; 21 - Heat source section. Detailed Implementation

[0024] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0025] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0026] The embodiments of this application will be described in detail below with reference to the accompanying drawings and specific examples and application scenarios.

[0027] refer to Figures 1 to 9 This application discloses a camera module, which includes a bracket assembly 10 and a camera 20.

[0028] The bracket assembly 10 is a basic mounting component that can provide a mounting base for the camera 20. In addition, the bracket assembly 10 can also dissipate heat for the camera 20 to prevent the camera 20 from overheating during operation.

[0029] The camera 20 may have a heat source 21, which may be a chip or the like. During operation, the heat source 21 generates heat, causing the camera 20 to heat up. In this embodiment, the bracket assembly 10 can absorb the heat from the heat source 21 and dissipate it outwards, thereby achieving a heat dissipation and cooling effect on the camera 20.

[0030] The bracket assembly 10 includes a enclosure 11, which can be used to install and fix the camera 20 to ensure the stability of the camera 20. In some embodiments, the enclosure 11 can form an installation space P, in which the camera is disposed, such as... Figures 1 to 4 As shown. For example, the installation space P can be the space enclosed by the groove, or the space enclosed by the ring, or of course, other forms, which are not specifically limited here.

[0031] In some embodiments, the camera 20 can be a periscope camera, and the enclosure 11 can be set around the camera 20 to serve as a fixed installation. For example, the camera 20 can be rectangular, cylindrical, etc., and correspondingly, the enclosure 11 can be a rectangular ring structure or a circular ring structure to adapt to the shape of the camera 20.

[0032] Considering that the camera 20 generates heat and dissipates heat outward during operation, in order to prevent the enclosure 11 from obstructing the heat dissipation, in this embodiment of the application, the enclosure 11 can have a heat transfer function. In this way, the enclosure 11 can receive the heat dissipated by the camera 20 and transfer the heat outward, thereby playing a certain role in heat dissipation and cooling of the camera 20.

[0033] In some embodiments, the enclosure 11 can be made of metal. Metal has high strength and good thermal conductivity, which ensures both the stability of the camera 20 installation and effective heat dissipation for the camera 20. For example, the metal material can be aluminum alloy, and the processing technology used can be die casting or powder metallurgy.

[0034] However, different application environments require redesigning the enclosure 11 and even the entire support assembly 10, which in turn requires redesigning the molds for the enclosure 11 and even the entire support assembly 10, resulting in relatively high manufacturing costs. Furthermore, the metal enclosure 11 is relatively heavy, which may increase the weight of electronic devices and affect the user experience.

[0035] Based on the above, the enclosure 11 can also be made of non-metallic materials. Compared with metal enclosure 11, it can reduce the manufacturing difficulty and reduce the weight and cost.

[0036] Non-metallic materials can include plastics, etc., and of course, other types are also possible, but no specific limitations are made here.

[0037] In addition, the fence 11 can be formed by injection molding to improve molding efficiency and also to improve the overall strength of the fence 11.

[0038] However, the thermal conductivity of some non-metallic enclosures 11 is weaker than that of metallic enclosures 11, making it difficult for the heat generated by the camera 20 to be transferred and dissipated through the non-metallic enclosures 11. This can easily lead to overheating. If the heat is not dissipated for a long time, it can cause the camera 20 to overheat and be damaged.

[0039] Based on the above, in this embodiment of the application, the heat-conducting medium 12 is disposed on the enclosure 11 and can be distributed along the surrounding direction of the enclosure 11 to transfer heat through the heat-conducting medium 12. Exemplarily, the heat-conducting medium 12 can be disposed inside the enclosure 11 so that the enclosure 11 surrounds the heat-conducting medium 12; of course, it can also be disposed on the surface of the enclosure 11 so as to directly contact the camera 20, which is beneficial to improving the heat conduction efficiency.

[0040] like Figure 1 and Figure 2As shown, the enclosure 11 may have a heat absorption area M and a heat dissipation area N. The heat absorption area M is used to absorb the heat emitted by the camera 20, and the heat dissipation area N is used to dissipate the heat outward. In addition, the heat absorption area M and the heat dissipation area N may be spaced a certain distance apart to reduce mutual interference between them.

[0041] The heat absorption zone M can be located close to the heat source 21 of the camera 20, such as in contact with the heat source 21 or at a small distance, so that the heat from the heat source 21 can be efficiently transferred to the heat absorption zone M; the heat dissipation zone N is located away from the heat source 21 in order to dissipate heat and prevent the dissipated heat from affecting the heat source 21.

[0042] Taking into account factors such as cost, weight, and manufacturing complexity of the enclosure 11 and the entire support assembly 10, a non-metallic material can be used for the enclosure 11. In order to achieve efficient heat transfer between the heat absorption area M and the heat dissipation area N, a heat-conducting medium 12 is located between the heat absorption area M and the heat dissipation area N to transfer heat between them. In this way, the heat-conducting medium 12 can effectively alleviate the problem of the relatively weak thermal conductivity of the non-metallic material enclosure 11 itself, so that the heat absorbed by the heat absorption area M can be quickly and efficiently transferred to the heat dissipation area N, and finally the heat is dissipated through the heat dissipation area N. Therefore, the heat dissipation and cooling effect of the camera 20 can be achieved.

[0043] Based on the above configuration, the heat-conducting medium 12 in this embodiment is used to cooperate with the heat-absorbing zone M and the heat source 21 to absorb the heat generated by the heat source 21, and to transfer the heat to the heat dissipation zone N to dissipate the heat.

[0044] In this embodiment, the installation space P enclosed by the enclosure 11 of the bracket assembly 10 can accommodate the camera 20. Furthermore, the heat-conducting medium 12 is disposed on the enclosure 11 and can be distributed along the surrounding direction of the enclosure 11. Thus, the heat absorbed by the heat source part 21 of the camera 20 in the heat-absorbing area of ​​the enclosure 11 can be transferred through the heat-conducting medium 12, so that the heat is transferred to the heat dissipation area N of the enclosure 11, and finally the heat is dissipated outward through the heat dissipation area N, thereby achieving the heat dissipation and cooling effect of the camera 20. This alleviates the problem of heat accumulation in the camera 20 due to poor heat dissipation effect of the bracket assembly 10, which may cause the risk of overheating. Therefore, it can effectively prevent the camera 20 from being damaged due to excessive temperature.

[0045] refer to Figure 5 In some embodiments, the enclosure 11 may be provided with a receiving channel Q, which extends along the circumferential direction of the enclosure 11. The heat-conducting medium 12 is disposed in the receiving channel Q for transferring heat between the heat-absorbing zone M and the heat-dissipating zone N. Based on this arrangement, the heat-conducting medium 12 can be contained through the receiving channel Q, and it can also play a certain protective role.

[0046] It should be noted that the receiving channel Q can be a closed channel to completely enclose the heat-conducting medium 12, or it can be a channel with open side walls so that a part of the heat-conducting medium 12 can be exposed and in direct contact with the camera 20.

[0047] In other embodiments, the heat-conducting medium 12 may also be disposed on the side wall of the enclosure 11 facing the installation space P, so that the heat-conducting medium 12 can be in complete contact with the camera 20, which can help improve the heat dissipation effect to a certain extent.

[0048] refer to Figures 3 to 8 In some embodiments, the enclosure 11 may include a first enclosure 111 and a second enclosure 112, with the second enclosure 112 surrounding the outside of the first enclosure 111. The first enclosure 111 and the second enclosure 112 are connected and form a receiving channel Q to receive the heat-conducting medium 12. In this configuration, the heat-conducting medium 12 can be enclosed within the receiving channel Q by the first enclosure 111 and the second enclosure 112, thus providing a certain degree of protection for the heat-conducting medium 12 and isolating it from the external environment to prevent the external environment from affecting the heat conduction effect of the heat-conducting medium 12.

[0049] Optionally, the connection between the first enclosure 111 and the second enclosure 112 can be a fixed connection or a detachable connection. Fixed connections include bonding, welding, riveting, etc., while detachable connections include insertion, snap-fit, sliding, etc. In some more specific embodiments, the first enclosure 111 and the second enclosure 112 can be fixed using ultrasonic welding.

[0050] refer to Figure 3 and Figure 8 In some embodiments, the surface of the first enclosure 111 facing the second enclosure 112 may be provided with a groove 1111. The groove 1111 extends from the heat absorption zone M to the heat dissipation zone N. The surface of the second enclosure 112 facing the first enclosure 111 is sealed at the opening of the groove 1111 of the first enclosure 111. In this way, the groove 1111 with the opening sealed can form a receiving channel Q. The heat-conducting medium 12 is disposed in the groove 1111 so that the heat absorbed by the heat absorption zone M can be transferred to the heat dissipation zone N for dissipation through the heat-conducting medium 12.

[0051] In other embodiments, the surface of the second enclosure 112 facing the first enclosure 111 may be provided with a groove 1111. The groove 1111 extends from the heat absorption zone M to the heat dissipation zone N. The surface of the first enclosure 111 facing the second enclosure 112 is sealed at the opening of the groove 1111 of the second enclosure 112. In this way, the groove 1111 with the opening sealed can form a receiving channel Q. The heat-conducting medium 12 is disposed in the groove 1111 so that the heat absorbed by the heat absorption zone M can be transferred to the heat dissipation zone N for dissipation through the heat-conducting medium 12.

[0052] In some embodiments, grooves 1111 are provided on the surface of the first enclosure 111 facing the second enclosure 112 and on the surface of the second enclosure 112 facing the first enclosure 111. Both grooves 1111 extend from the heat absorption zone M to the heat dissipation zone N and are arranged opposite to each other. The opening of the groove 1111 of the first enclosure 111 and the opening of the groove 1111 of the second enclosure 112 interlock to form a receiving channel Q. The heat-conducting medium 12 is disposed between the two grooves 1111 so that the heat absorbed by the heat absorption zone M can be transferred to the heat dissipation zone N for dissipation through the heat-conducting medium 12.

[0053] In all three cases described above, a heat-conducting medium 12 can be installed inside the enclosure 11, and heat can be transferred between the heat absorption area M and the heat dissipation area N of the enclosure 11 through the heat-conducting medium 12. This allows the heat generated by the heat source 21 to be transferred and dissipated through the heat-conducting medium 12, thereby preventing the camera 20 from overheating.

[0054] Furthermore, the extension direction of the aforementioned groove 1111 from the heat absorption zone M to the heat dissipation zone N is not limited to one direction, but can be adaptively configured according to the shape of the enclosure 11 and the shape of the heat source section 21. For example, the groove 1111 can extend from the heat absorption zone M to the heat dissipation zone N in a straight line direction, or it can extend from the heat absorption zone M to the heat dissipation zone N in a curved direction, such as an arc or a broken line.

[0055] refer to Figure 3 In some embodiments, the heat-conducting medium 12 can be a heat-conducting liquid 121, such that the trench 1111 is filled with the heat-conducting liquid 121, and the heat-conducting liquid 121 can flow in the trench 1111. The heat-conducting liquid 121 can be a liquid such as deionized water, methanol, acetone, or ethanol, or other liquids, which are not specifically limited here.

[0056] In addition, the groove 1111 can be a capillary groove, and the heat-conducting liquid 121 can form a capillary effect in the capillary groove to facilitate the flow of the heat-conducting liquid 121 in the capillary groove.

[0057] Based on the above, the thermally conductive medium 12 is used to transform from liquid to gas when absorbing heat, and flows from the heat-absorbing zone M to the heat-dissipating zone N via capillary grooves. Specifically, when the heat-absorbing zone M absorbs heat, the thermally conductive medium 12 near the heat-absorbing zone M in the capillary groove transforms from liquid to gas after being heated; that is, the thermally conductive liquid 121 evaporates into gas upon heating. As gas is continuously generated in the area near the heat-absorbing zone M in the capillary groove, the pressure in that area increases, causing the gas to flow along the capillary groove from the heat-absorbing zone M to the heat-dissipating zone N. At the same time, during the process of the thermally conductive medium 12 transforming from liquid to gas, it absorbs heat, and with the flow of gas, it transfers heat from the heat-absorbing zone M to the heat-dissipating zone N, thereby achieving a cooling effect on the heat source 21 and alleviating the problem of excessively high temperature of the camera 20.

[0058] In addition, the thermally conductive medium 12 is also used to transform from gas to liquid when releasing heat, and then flows back from the heat dissipation zone N to the heat absorption zone M via capillary grooves. Specifically: when the gas flows to the heat dissipation zone N and encounters cooling, it transforms from gas to liquid in the heat dissipation zone N and releases heat, thereby achieving heat dissipation; the thermally conductive liquid 121 formed by the condensation of the gas flows back from the heat dissipation zone N to the heat absorption zone M under the capillary action of the capillary grooves, replenishing the heat absorption zone M with thermally conductive liquid 121. In this way, as the thermally conductive liquid 121 transforms from liquid to gas to absorb heat and from gas to liquid to release heat, the heat transfer between the heat absorption zone M and the heat dissipation zone N is realized, as well as the heat dissipation from the heat dissipation zone N. Therefore, the camera 20 achieves an autonomous heat dissipation effect, resulting in a better cooling effect.

[0059] In other embodiments, the thermally conductive medium 12 may also be a metal wire 122, such as Figure 8 As shown, the metal wire 122 is disposed inside the enclosure 11, or at least partially exposed outside the enclosure 11. Specifically, the enclosure 11 may have an inner surface facing the installation space P and an outer surface facing away from the installation space P, and the metal wire 122 may be disposed between the inner surface and the outer surface, or the metal wire 122 may be disposed on the inner surface.

[0060] In some more specific embodiments, the metal wire 122 can be threaded through the receiving channel Q and extend from the heat absorption zone M to the heat dissipation zone N. Based on this, the heat absorbed by the heat absorption zone M can be quickly and efficiently transferred to the heat dissipation zone N via the metal wire 122, so that the heat can be dissipated in the heat dissipation zone N. Of course, the thermally conductive medium 12 can also be in the form of graphite strips, etc., as long as it can transfer heat; the specific form is not limited.

[0061] In this embodiment of the application, in order to accelerate the heat dissipation efficiency in the heat dissipation area N, the heat dissipation area N can be brought into contact with the cold source of the electronic device, such as a heat sink or other structure. Of course, the heat dissipation area N can also be exposed to the external environment, or a fan can be used to blow gas into the heat dissipation area N to improve the heat dissipation efficiency.

[0062] To further improve the cooling effect on the camera 20, the area of ​​the heat-conducting medium 12 can be increased to increase the heat transfer area between the heat-conducting medium 12 and the heat source part 21, thereby improving the heat absorption efficiency and thus improving the cooling effect.

[0063] In some embodiments, multiple layers of the thermal conductive medium 12 can be arranged on the enclosure 11. The area of ​​the heat absorption zone M covered by the multiple layers of thermal conductive medium 12 is increased, thereby increasing the heat transfer area between the thermal conductive medium 12 and the heat source part 21. In this way, heat can be transferred from the heat absorption zone M to the heat dissipation zone N through the multiple layers of thermal conductive medium 12, thereby improving the heat transfer efficiency and thus improving the cooling effect on the camera 20.

[0064] Accordingly, the enclosure 11 can be provided with multiple receiving channels Q, which are stacked along the extension direction of the center line of the enclosure 22. Each layer of receiving channel Q contains a heat-conducting medium 12 that can be distributed along the circumferential direction of the enclosure 11. Based on this, the heat dissipation efficiency can be improved by providing multiple layers of heat-conducting medium 12.

[0065] Furthermore, the first enclosure plate 111 and the second enclosure plate 112 form a multi-layer accommodating channel Q, and each layer of accommodating channel Q is provided with a heat-conducting medium 12. In this way, the multi-layer accommodating channel Q can accommodate the multi-layer heat-conducting medium 12 to prevent mutual interference between the multi-layer heat-conducting medium 12 and affect the heat transfer efficiency.

[0066] refer to Figures 1 to 3 and Figure 6 In some more specific embodiments, the surface of the first enclosure 111 facing the second enclosure 112 may be provided with multiple layers of grooves 1111, each layer of grooves 1111 extending from the heat absorption zone M to the heat dissipation zone N. The surface of the second enclosure 112 facing the first enclosure 111 is sealed at the opening of the multiple layers of grooves 1111 of the first enclosure 111 to form multiple layers of receiving channels Q.

[0067] In other embodiments, the surface of the second enclosure 112 facing the first enclosure 111 may be provided with multiple layers of grooves 1111, each layer of grooves 1111 extending from the heat absorption zone M to the heat dissipation zone N. The surface of the first enclosure 111 facing the second enclosure 112 is sealed at the opening of the multiple layers of grooves 1111 of the second enclosure 112 to form multiple layers of receiving channels Q.

[0068] In some embodiments, the surface of the first enclosure 111 facing the second enclosure 112 and the surface of the second enclosure 112 facing the first enclosure 111 are both provided with multiple layers of grooves 1111. Each layer of grooves 1111 extends from the heat absorption zone M to the heat dissipation zone N and is arranged opposite to each other. The openings of the multiple layers of grooves 1111 of the first enclosure 111 and the openings of the multiple layers of grooves 1111 of the second enclosure 112 are respectively engaged to form multiple layers of receiving channels Q.

[0069] To facilitate the input of the heat transfer medium 12 into the receiving channel Q, the side wall of the enclosure 11 may be provided with an openable and closable input port 1121. Each layer of receiving channel Q has a channel notch 1113 connected to the input port 1121. In this way, the heat transfer medium 12 can be input into each layer of receiving channel Q through the input port and the notch 1113.

[0070] Of course, to prevent the heat transfer medium 12 from leaving the receiving channel Q via the inlet 1121, in this embodiment, a sealing material can be provided at the inlet 1121 to seal the inlet 1121 and prevent the heat transfer medium 12 from leaving the receiving channel Q. The sealing material can be sealant, or it can be a plug, etc.

[0071] refer to Figure 5 In some embodiments, the first enclosure 111 may have a first protrusion 1112 at one end along the center line of the enclosure 11. The first protrusion 1112 protrudes from the outer surface of the first enclosure 111 and extends along the circumferential direction of the enclosure. Correspondingly, the second enclosure 112 has a second protrusion 1122 at one end along the center line. The second protrusion 1122 protrudes from the inner half of the second enclosure 112 and extends along the circumferential direction of the enclosure 11.

[0072] When the first enclosure 111 and the second enclosure 112 are connected, the other end of the first enclosure 111 away from the first protrusion 1112 is sealed to the end face of the second protrusion 1122 adjacent to the inner half of the second enclosure 112, and the other end of the second enclosure 112 away from the second protrusion 1122 is sealed to the end face of the first protrusion 1112 adjacent to the outer plate surface of the first enclosure 111.

[0073] Based on the above settings, while ensuring the firmness, reliability and sealing of the connection between the first enclosure 111 and the second enclosure 112, it is beneficial to reduce the volume of the entire enclosure 11, thereby reducing the space occupied by the camera module in the electronic device and alleviating the problem of limited space.

[0074] In some more specific embodiments, the cross-section of the first enclosure 111 can be L-shaped, and the cross-section of the second enclosure 112 can also be L-shaped. In this case, the surface of the first enclosure 111 facing the second enclosure 112 can form a stepped surface, and the surface of the second enclosure 112 facing the first enclosure 111 can form a stepped surface. In this way, when the first enclosure 111 and the second enclosure 112 are connected, they can be interlocked. That is, the long side of the first enclosure 111 is close to the long side of the second enclosure 112, the end face of the long side of the first enclosure 111 is connected to the end face of the short side of the second enclosure 112, and the end face of the short side of the second enclosure 112 is connected to the end face of the long side of the second enclosure 112. This can reduce the volume of the entire enclosure 11, thereby reducing the space occupied by the camera module in the electronic device and helping to alleviate the problem of limited space.

[0075] To ensure the sealing of the cavity, ultrasonic welding can be used to fix the contact area of ​​the first enclosure 111 and the second enclosure 112 to ensure the sealing of the cavity, prevent dust and other substances from entering the cavity, and prevent the heat-conducting liquid 121 from leaking out.

[0076] Based on the aforementioned bracket assembly 10, this application embodiment also discloses an electronic device, which includes the aforementioned camera module, wherein the camera module is a periscope camera module.

[0077] In summary, the embodiments of this application provide a bracket assembly 10 with an independent heat dissipation function. It can reduce the weight of the bracket assembly 10 and reduce manufacturing costs by combining a non-metallic enclosure 11 with a heat-conducting medium 12, while ensuring good heat dissipation.

[0078] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A camera module, characterized in that, include: The bracket assembly (10) and the camera (20); The bracket assembly (10) includes a enclosure (11) and a heat-conducting medium (12). The enclosure (11) forms an installation space (P). The camera (20) is located in the installation space (P). The heat-conducting medium (12) is located on the enclosure (11) and can be distributed along the surrounding direction of the enclosure (11). The enclosure (11) has a heat absorption area (M) and a heat dissipation area (N), the camera (20) has a heat source (21), and the heat-conducting medium (12) is used to cooperate with the heat source (21) in the heat absorption area (M) to absorb the heat generated by the heat source (21). The heat-conducting medium (12) is also used to transport the heat to the heat dissipation area (N) to dissipate the heat. The enclosure (11) is provided with multiple receiving channels (Q), and the multiple receiving channels (Q) are stacked along the center line direction of the enclosure (11). Each layer of the receiving channel (Q) is provided with the heat-conducting medium (12) that can be distributed along the circumferential direction of the enclosure (11). The heat-conducting medium (12) is used to transfer heat between the heat absorption area (M) and the heat dissipation area (N). The side wall of the enclosure (11) is provided with an openable and closable inlet (1121). Each layer of the receiving channel (Q) is connected to the inlet (1121) through a notch (1113). A sealing material is provided at the inlet (1121) to block the inlet (1121) and prevent the heat-conducting medium (12) from leaving the receiving channel (Q). The enclosure (11) includes a first enclosure panel (111) and a second enclosure panel (112). The second enclosure panel (112) is arranged around the outside of the first enclosure panel (111). The first enclosure panel (111) has a first protrusion (1112) at one end along the center line of the enclosure (11). The first protrusion (1112) protrudes from the outer surface of the first enclosure panel (111) and extends along the circumferential direction of the enclosure (11). The second enclosure (112) has a second protrusion (1122) at one end along the center line. The second protrusion (1122) protrudes from the inner surface of the second enclosure (112) and extends along the circumferential direction of the enclosure (11). The other end of the first enclosure (111) away from the first protrusion (1112) is sealed to the end face of the second protrusion (1122) adjacent to the inner plate surface of the second enclosure (112); The other end of the second enclosure (112) away from the second protrusion (1122) is sealed to the end face of the first protrusion (1112) adjacent to the outer surface of the first enclosure (111).

2. The camera module according to claim 1, characterized in that, The first enclosure (111) faces the surface of the second enclosure (112), and / or the second enclosure (112) faces the surface of the first enclosure (111) and has a groove (1111) extending from the heat absorption area (M) to the heat dissipation area (N). In the first enclosure (111) and the second enclosure (112), the surface of one of them is sealed to the opening of the groove (1111) of the other, or the openings of the grooves (1111) of both are interlocked to form the receiving channel (Q).

3. The camera module according to claim 2, characterized in that, The groove (1111) is a capillary groove, and the heat-conducting medium (12) is a heat-conducting liquid (121). The thermally conductive medium (12) is used to change from liquid to gas when absorbing heat, and flows from the heat-absorbing zone (M) to the heat-dissipating zone (N) via the capillary grooves; The thermally conductive medium (12) is used to change from gas to liquid when heat is released, and flows back from the heat dissipation zone (N) to the heat absorption zone (M) via the capillary grooves.

4. The camera module according to claim 1 or 2, characterized in that, The heat-conducting medium (12) is a metal wire (122); The enclosure (11) has an inner surface facing the installation space (P) and an outer surface facing away from the installation space (P), and the wire (122) is disposed between the inner surface and the outer surface, or the wire (122) is disposed on the inner surface.

5. The camera module according to claim 1, characterized in that, The material of the enclosure (11) is a non-metallic material, including plastic or plastic; And / or, the enclosure (11) is formed by injection molding.

6. An electronic device, characterized in that, include: The camera module according to any one of claims 1 to 5, wherein the camera module is a periscope camera module.

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