Circuit board punching method

Abstract

The invention discloses a circuit board punching method which comprises the following control steps that a circuit board is flatly placed and fixed to a base, then punching coordinate information of the circuit board is input on a control mechanism, a first laser-beam punching machine is driven by a moving mechanism to move to the position above the circuit board punching position, and a second laser-beam punching machine is driven to move to the position above the circuit board punching position; the first laser-beam drilling machine emits laser to penetrate through a first copper layer located at the top of the circuit board and then penetrate through a middle layer to form a first hole, the second laser-beam drilling machine is driven by the moving mechanism to move to the position above the drilling position of the circuit board, and the second laser-beam drilling machine emits laser to penetrate through a second copper layer located at the bottom of the circuit board to form a second hole. The inner diameter of the first hole is larger than that of the second hole, then the first laser-beam drilling machine and the second laser-beam drilling machine are reset, and drilling of the circuit board is completed. The punching device is simple in structure, high in automation degree and high in punching precision.

Description

Technical Field

[0001] The invention relates to a circuit board processing method, in particular to a circuit board punching method. Background Art

[0002] At present, the processing of punching holes in circuit boards mainly adopts mechanical drilling processing. Since the drill bit is a consumable item, the processing cost of this processing method is relatively high. If laser drilling is used, the current existing technology uses a single laser punching machine, which is prone to poor bonding force at the bottom of the hole, which can easily lead to stratification at the bottom of the hole and insufficient reliability. The use of a dual laser punching machine can easily cause difficulties in the upper and lower alignment of the laser punching machine, and it is easy to cause the waistline to be misaligned during the punching process. The above problems affect the processing and production of circuit boards and are not conducive to large-scale promotion. Summary of the invention

[0003] In order to overcome the above defects, the present invention provides a circuit board punching method, which has the advantages of simple structure, high degree of automation and high punching accuracy.

[0004] The technical solution adopted by the present invention to solve the technical problem is: a circuit board punching method, the control steps are as follows:

[0005] S1. Lay the circuit board flat and fix it on the base, and then input the punching coordinate information of the circuit board on the control mechanism.

[0006] S2. The first laser puncher is driven by the moving mechanism to move above the punching position of the circuit board. The first laser puncher emits laser to penetrate the first copper layer at the top of the circuit board and then penetrates the middle layer to form a first hole.

[0007] S3. The second laser puncher is driven by the moving mechanism to move above the punching position of the circuit board. The second laser puncher emits a laser to penetrate the second copper layer at the bottom of the circuit board to form a second hole. The inner diameter of the first hole is larger than the inner diameter of the second hole. Then the first laser puncher and the second laser puncher are reset to complete the punching of the circuit board.

[0008] Optionally, the moving mechanism is a gantry mechanism, and the first laser puncher and the second laser puncher are fixed to the moving end of the gantry mechanism and are located above the circuit board.

[0009] Optionally, a camera is also included, and the camera is fixed to the moving end of the gantry mechanism and is located above the circuit board, and the camera can take a picture of the circuit board.

[0010] Optionally, the first laser puncher, the second laser puncher, the camera and the gantry mechanism are electrically connected to a control mechanism.

[0011] Optionally, the inner wall on one side of the first hole and the inner wall on one side of the second hole overlap in a top projection plane.

[0012] As an option, the second laser punching machine can be positioned through the first hole.

[0013] Optionally, the first laser punching machine and the second laser punching machine are both carbon dioxide laser punching machines.

[0014] The beneficial technical effect of the present invention is: when the circuit board punching method is used, the first hole is first punched on the circuit board by the first laser punching machine, and the first hole penetrates the first copper layer and the middle layer, and then the second laser punching machine punches the second hole in the remaining second copper layer. Since the first laser punching machine and the second laser punching machine are both located above the circuit board, the positioning process of the laser punching machine is simplified, the step of aligning the two laser punching machines up and down is omitted, the positioning accuracy of the laser punching machine is improved, and the problem of waistline misalignment of the punched hole due to the inaccurate up and down alignment of the two laser punching machines is avoided. In addition, since the inner diameter of the first hole is larger than the inner diameter of the second hole, the part of the second copper layer protruding from the first hole in the top projection surface can form a tip effect, which can effectively stimulate the filling of the blind hole. Since the entire punching process is fully automated, the degree of automation is also high. It has the advantages of simple structure, high degree of automation and high punching accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a flow chart of the circuit board punching method of the present invention;

[0016] Figure 2 is a side cross-sectional view of the circuit board of the present invention after punching is completed;

[0017] Figure 3 It is a top view of the circuit board of the present invention after the punching is completed;

[0018] in:

[0019] 1. First copper layer; 2. Middle layer; 3. Second copper layer. DETAILED DESCRIPTION

[0020] In order to more clearly understand the technical means of the present invention and implement it according to the contents of the specification, the specific implementation methods of the present invention are further described in detail below in conjunction with the drawings and examples. The following examples are used to illustrate the present invention but are not used to limit the scope of the present invention.

[0021] This specific embodiment records in detail the circuit board punching method described in this application, such as Figure 1-Figure 3 As shown, the control steps of the circuit board punching method are as follows:

[0022] S1. Lay the circuit board flat and fix it on the base, and then input the punching coordinate information of the circuit board on the control mechanism.

[0023] S2. The first laser puncher is driven by the moving mechanism to move above the punching position of the circuit board. The first laser puncher emits laser to penetrate the first copper layer 1 located on the top of the circuit board and then penetrates the middle layer 2 to form a first hole.

[0024] S3. The second laser puncher is driven by the moving mechanism to move above the punching position of the circuit board. The second laser puncher emits a laser to penetrate the second copper layer 3 at the bottom of the circuit board to form a second hole. The inner diameter of the first hole is larger than the inner diameter of the second hole. Then the first laser puncher and the second laser puncher are reset to complete the punching of the circuit board. When in use, the first laser puncher first punches the first hole on the circuit board. The first hole penetrates the first copper layer 1 and the middle layer 2. Then the second laser puncher punches the second hole in the remaining second copper layer 3. Since the first laser puncher and the second laser puncher are both located above the circuit board, the positioning process of the laser puncher is simplified, and the step of aligning the two laser punchers up and down is omitted, thereby improving the positioning accuracy of the laser puncher and avoiding the problem of waistline misalignment of the punched holes due to inaccurate up and down alignment of the two laser punchers. In addition, since the inner diameter of the first hole is larger than the inner diameter of the second hole, the part of the second copper layer protruding from the first hole in the top projection plane can form a tip effect, which can effectively stimulate the filling of the blind hole. Since the entire punching process is fully automated, the degree of automation is also high. It has the advantages of simple structure, high degree of automation and high punching accuracy. The up and down directions in this embodiment are Figure 2 The up and down directions in .

[0025] Optionally, in this embodiment, the moving mechanism is a gantry mechanism, and the first laser puncher and the second laser puncher are fixed to the moving end of the gantry mechanism and are located above the circuit board. The gantry mechanism in this embodiment includes a fixed seat, a first electric screw and a second electric screw, the fixed seat spans the base for fixing the circuit board, the first electric screw is fixed to the top of the fixed seat, the second electric screw is fixed to the moving end of the first electric screw, the first laser puncher and the second laser puncher are fixed to the moving end of the second electric screw, the second electric screw, the first laser puncher and the second laser puncher can move back and forth along the X-axis under the drive of the first electric screw, and the first laser puncher and the second laser puncher can move back and forth along the Y-axis under the drive of the second electric screw. In this embodiment, the moving end of the second electric screw is the moving end of the gantry mechanism. The X-axis and the Y-axis in this embodiment are perpendicular to each other but parallel to the ground. The electric screw in this embodiment includes a screw motor, a threaded rod and a nut. Both ends of the threaded rod are rotatably arranged on the frame of the screw. The nut and the threaded rod are threadedly connected. The output shaft of the screw motor is connected to one end of the threaded rod. The nut is the movable end of the electric screw. The nut can move back and forth along the threaded rod under the drive of the screw motor.

[0026] Optionally, this embodiment further includes a camera, which is fixed to the mobile end of the gantry mechanism and is located above the circuit board. The camera can take pictures of the circuit board to determine whether the holes punched by the laser punching machine are qualified, and the camera can provide auxiliary positioning for the device.

[0027] Optionally in this embodiment, the first laser puncher, the second laser puncher, the camera and the gantry mechanism are electrically connected to the control mechanism.

[0028] In this embodiment, the inner wall of the first hole and the inner wall of the second hole overlap in the top projection plane. Figure 3 The view direction.

[0029] Optionally, in this embodiment, the second laser punch can be positioned through the first hole. In this embodiment, the camera shoots the first hole and transmits the position of the first hole to the control mechanism, which controls the gantry mechanism to move the second laser punch to the punching position, and then the second laser punch punches the second hole. The position of the first hole is located by the camera to provide auxiliary positioning, which can further improve the punching accuracy of the device.

[0030] In this embodiment, the first laser puncher and the second laser puncher are both carbon dioxide laser punchers. Using a carbon dioxide laser puncher can reduce the size of the laser puncher, and since the cost of a carbon dioxide laser puncher is relatively low, using a carbon dioxide laser puncher can effectively reduce the cost of the equipment.

[0031] The circuit board punching method of this embodiment has the advantages of simple structure, high automation and high punching accuracy.

Claims

1. A method for punching a circuit board, characterized in that: The steps include: S1. Lay the circuit board flat and fix it on the base, and then input the punching coordinate information of the circuit board on the control mechanism. S2. The first laser punching machine is driven by the moving mechanism to move to above the punching position of the circuit board. The first laser punching machine emits laser light to penetrate the first copper layer (1) located on the top of the circuit board and then penetrate the middle layer (2) to form a first hole. S3. The second laser punching machine is driven by the moving mechanism to move to above the punching position of the circuit board. The second laser punching machine emits a laser to penetrate the second copper layer (3) at the bottom of the circuit board to form a second hole. The inner diameter of the first hole is larger than the inner diameter of the second hole. Then the first laser punching machine and the second laser punching machine are reset to complete the punching of the circuit board.

2. The circuit board punching method according to claim 1, characterized in that: The moving mechanism is a gantry mechanism, and the first laser puncher and the second laser puncher are fixed to the moving end of the gantry mechanism and are located above the circuit board.

3. The circuit board punching method according to claim 2, characterized in that: It also includes a camera, which is fixed to the moving end of the gantry mechanism and is located above the circuit board. The camera can shoot the circuit board.

4. The circuit board punching method according to claim 3, characterized in that: The first laser puncher, the second laser puncher, the camera and the gantry mechanism are electrically connected to the control mechanism.

5. The circuit board punching method according to claim 1, characterized in that: The inner wall on one side of the first hole and the inner wall on one side of the second hole overlap in a top projection plane.

6. The circuit board punching method according to claim 4, characterized in that: The second laser punching machine can be positioned through the first hole.

7. The circuit board punching method according to claim 1, characterized in that: The first laser punching machine and the second laser punching machine are both carbon dioxide laser punching machines.

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