Cavity manufacturing method using solder resist dam, cavity manufacturing device and substrate

Abstract

The invention relates to the technical field of circuit board manufacturing, and discloses a cavity manufacturing method using a solder resist dam, a cavity manufacturing device and a substrate. The method comprises the following steps: determining an opening position of a first core plate; manufacturing a solder mask layer on the upper surface / lower surface of the first core plate according to the position of the opening; the solder mask covers the opening position; forming a cavity in the first core plate according to the opening position; the cavity penetrates through the first core plate and the solder mask layer, and the two sides of the solder mask layer are located on the outer side of the cavity to form solder mask dams; opening the prepregs according to the positions of the solder resist dams to obtain opening cavities penetrating through the prepregs, and stacking the prepregs on the upper surface / lower surface of the first core plate to enable the solder resist dams to be located in the opening cavities; a second core plate is stacked on the side, away from the first core plate, of the prepreg, and the first core plate, the prepreg and the second core plate are laminated to form a laminated plate. According to the method, the resin can be effectively prevented from flowing into the cavity of the circuit board, the production process is simplified, and mass production is facilitated.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board manufacturing, and in particular to a cavity manufacturing method using a solder resist dam, a cavity manufacturing device, and a substrate. Background Art

[0002] The common method for making the cavity at present is to use a pre-opened low-flow P sheet (prepreg) and control the resin flow during lamination so that the resin does not flow into the cavity. However, this method has some disadvantages. For example, the thickness of the low-flow prepreg provided by the low-flow prepreg supplier is inconsistent, and the thickness of the low-flow prepreg needs to be strictly limited in different productions. In addition, because different prepregs have different standards, it is necessary to modify the lamination parameters in different productions, which makes the production process cumbersome and difficult to achieve mass production. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a cavity manufacturing method, a cavity manufacturing device, and a substrate using a solder resist dam, which can effectively prevent the resin from flowing into the cavity, and no longer has restrictions on the type and thickness of the prepreg, simplifies the production lamination process, and is more conducive to mass production of circuit boards with cavities.

[0004] In a first aspect, a cavity manufacturing method using a solder resist dam according to an embodiment of the present invention comprises:

[0005] Determining an opening position of the first core plate;

[0006] According to the opening position, a solder resist layer is formed on the upper surface / lower surface of the first core board; the solder resist layer covers the opening position;

[0007] According to the opening position, a cavity is opened in the first core board; the cavity passes through the first core board and the solder resist layer, and two sides of the solder resist layer are located outside the cavity to form a solder resist dam;

[0008] According to the position of the solder dam, the prepreg is opened to obtain an open cavity penetrating the prepreg, and the prepreg is stacked on the upper surface / lower surface of the first core board so that the solder dam is located in the open cavity;

[0009] A second core board is stacked on a side of the prepreg away from the first core board, and the first core board, the prepreg and the second core board are pressed together to form a pressed board.

[0010] According to some embodiments of the present invention, the step of making a solder resist layer on the upper surface / lower surface of the first core board according to the opening position includes:

[0011] Printing solder resist oil at the opening position of the upper surface / lower surface of the first core board and within a preset range around the opening position;

[0012] The solder resist oil is exposed, developed and cured to form a solder resist layer.

[0013] According to some embodiments of the present invention, the preset range is a range of 0.2 mm extending outward from the edge of the opening position.

[0014] According to some embodiments of the present invention, the method further comprises:

[0015] Drilling a hole at a first preset drilling position of the press plate to obtain a first through hole penetrating the press plate;

[0016] Electroplating a copper layer on the inner wall of the first through hole and the inner wall of the cavity;

[0017] An outer layer circuit is etched on the surface of the laminated board, and the outer layer circuit is connected to the copper layer.

[0018] In a second aspect, a cavity manufacturing method using a solder resist dam according to an embodiment of the present invention comprises:

[0019] Determining an opening position of the first core plate;

[0020] According to the opening position, a solder resist layer is formed on both the upper surface and the lower surface of the first core board; the solder resist layer covers the opening position;

[0021] According to the opening position, a cavity is opened in the first core board; the cavity passes through the first core board and the solder resist layer, and two sides of the solder resist layer are located outside the cavity to form a solder resist dam;

[0022] According to the position of the solder resist dam, the first prepreg and the second prepreg are opened to obtain a first opening cavity penetrating the first prepreg and a second opening cavity penetrating the second prepreg;

[0023] The first prepreg is stacked on the upper surface of the first core board, and the second prepreg is stacked on the lower surface of the first core board, and the solder dam on the upper surface of the first core board is located in the first opening cavity, and the solder dam on the lower surface of the first core board is located in the second opening cavity;

[0024] A second core board is stacked on a side of the first semi-cured sheet away from the first core board, a third core board is stacked on a side of the second semi-cured sheet away from the first core board, and the second core board, the first semi-cured sheet, the first core board, the second semi-cured sheet and the third core board are pressed together to form a pressed board.

[0025] According to some embodiments of the present invention, the method further comprises:

[0026] Drilling a hole at a second preset drilling position of the press plate to obtain a second through hole penetrating the press plate;

[0027] Electroplating a copper layer on the inner wall of the second through hole;

[0028] An outer layer circuit is etched on the surface of the laminated board, and the outer layer circuit is connected to the copper layer.

[0029] According to some embodiments of the present invention, before the step of stacking the second core board on the side of the first prepreg away from the first core board, stacking the third core board on the side of the second prepreg away from the first core board, and pressing the second core board, the first prepreg, the first core board, the second prepreg and the third core board, the method further includes:

[0030] Etching a first preset etching position on the surface of the second core board close to the third core board to form a first inner layer circuit;

[0031] A second preset etching position on the surface of the third core board close to the second core board is etched to form a second inner layer circuit.

[0032] In a third aspect, a cavity manufacturing device using a solder resist dam is provided according to an embodiment of the present invention, wherein the cavity manufacturing device is used to implement the cavity manufacturing method using a solder resist dam as described in the first aspect and / or the second aspect above.

[0033] In a fourth aspect, a substrate according to an embodiment of the present invention includes:

[0034] The first core plate has a cavity;

[0035] A solder dam is disposed on the upper surface / lower surface of the first core board, and the solder dam is located on both sides of the cavity;

[0036] A prepreg sheet having an opening cavity, and the prepreg sheet is pressed on the upper surface / lower surface of the first core board, and the solder resist dam is located in the opening cavity;

[0037] The second core board is pressed onto a side of the prepreg sheet away from the first core board.

[0038] In a fifth aspect, a substrate according to an embodiment of the present invention includes:

[0039] The first core plate has a cavity;

[0040] Solder dams are provided on the upper surface and the lower surface of the first core board, and the solder dams are located on both sides of the cavity;

[0041] A first prepreg is provided with a first opening cavity, and the first prepreg is pressed on the upper surface of the first core board, and the solder dam on the upper surface of the first core board is located in the first opening cavity;

[0042] A second prepreg is provided with a second opening cavity, and the second prepreg is pressed on the lower surface of the first core board, and the solder dam on the lower surface of the first core board is located in the second opening cavity;

[0043] A second core plate, pressed onto a side of the first prepreg away from the first core plate;

[0044] The third core board is pressed onto a side of the second prepreg sheet away from the first core board.

[0045] According to an embodiment of the present invention, a cavity manufacturing method, cavity manufacturing device, and substrate using a solder dam have at least the following beneficial effects: the method of the present application uses a solder dam to separate the prepreg from the cavity, so that the resin can no longer flow into the cavity of the circuit board, ensuring the cleanliness of the cavity, and prepregs of any thickness can be used in the production of the circuit board, simplifying the production process of the circuit board with the cavity, and more conducive to the mass production of the circuit board with the cavity. The device of the present application is used to implement the method of the present application.

[0046] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0048] Figure 1 A schematic diagram of a method for manufacturing a cavity using a solder resist dam according to a first aspect of an embodiment of the present invention;

[0049] Figure 2 It is a schematic diagram of the structure after the solder resist layer is printed on the lower surface of the opening position of the first core board;

[0050] Figure 3 For Figure 2 A schematic diagram of the structure after a cavity is opened on the first core plate;

[0051] Figure 4 For use Figure 3 A schematic diagram of the structure of a laminated board made of a prepreg sheet and a second core board;

[0052] Figure 5 For Figure 4 Schematic diagram of the structure of the pressed plate after drilling;

[0053] Figure 6 For Figure 5 A schematic diagram of the structure after the inner wall of the first through hole and the inner wall of the cavity on the pressed plate are electroplated with a copper layer;

[0054] Figure 7 For Figure 6 A schematic diagram of the structure after the outer layer circuit is etched out of the surface of the laminate;

[0055] Figure 8 A schematic diagram of a method for manufacturing a cavity using a solder resist dam according to a second aspect of an embodiment of the present invention;

[0056] Fig. 9 A schematic diagram of the structure of a second core board with a first inner layer circuit etched out and a third core board with a second inner layer circuit etched out;

[0057] Fig.10 It is a schematic diagram of the structure after the solder resist layer is printed on the upper and lower surfaces of the opening position of the first core board;

[0058] Fig.11 For Fig.10 A schematic diagram of the structure after a cavity is opened on the first core plate;

[0059] Fig.12 For use Fig. 9 structure, Fig.11 A schematic diagram of the structure of a laminated plate made of a first prepreg and a second prepreg;

[0060] Fig.13 For Fig.12 Schematic diagram of the structure of the pressed plate after drilling;

[0061] Fig.14 For Fig.13 A schematic diagram of the structure after the inner wall of the first through hole on the pressed board is electroplated with a copper layer;

[0062] Fig.15 For Fig.14 Schematic diagram of the structure after the outer layer circuit is etched out of the surface of the laminate.

[0063] Figure numerals: first core board 100, cavity 110, solder resist layer 200, solder resist dam 210, prepreg 300, second core board 400, first inner layer circuit 410, third core board 500, second inner layer circuit 510, first prepreg 600, second prepreg 700, first through hole 800, second through hole 900. DETAILED DESCRIPTION

[0064] This section will describe in detail the specific embodiments of the present invention. The preferred embodiments of the present invention are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present invention, but it cannot be understood as a limitation on the scope of protection of the present invention.

[0065] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0066] In the description of the present invention, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed", etc. are understood to exclude the number itself, and "above", "below", "within", etc. are understood to include the number itself. If there is a description of "first", "second", etc., it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0067] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably confirm the specific meanings of the above terms in the present invention in combination with the specific content of the technical solution.

[0068] First, refer to Figure 1 According to a cavity manufacturing method using a solder resist dam according to an embodiment of the present invention, the cavity manufacturing method includes steps S100, S200, S300, S400, and S500, wherein:

[0069] Step S100, determining the opening position of the first core plate 100;

[0070] According to the required position of the cavity 110 , the opening position and opening range of the cavity 110 to be opened on the first core board 100 (core board A) are defined.

[0071] Step S200, according to the opening position, a solder resist layer 200 is formed on the upper surface / lower surface of the first core board 100; the solder resist layer 200 covers the opening position;

[0072] It should be noted that in this example, Figure 2As shown, the upper surface of the first core plate 100 is the outer surface in the upward direction, and the lower surface of the first core plate 100 is the outer surface in the downward direction. Figure 2 In this example, according to the designated opening position and opening range, a solder resist layer 200 is made to cover the lower surface of the first core board 100 and cover a range slightly larger than the opening position. The solder resist layer 200 can be made of any solder resist oil. It is conceivable that the solder resist layer 200 can also be made on the upper surface of the first core board 100 and cover a range slightly larger than the opening position.

[0073] Step S300, according to the opening position, a cavity 110 is opened on the first core board 100; the cavity 110 penetrates the first core board 100 and the solder resist layer 200, and two sides of the solder resist layer 200 are located outside the cavity 110 to form a solder resist dam 210;

[0074] Among them, reference Figure 3 After the cavity 110 is opened, the solder resist layer 200 covering the area outside the opening position is retained, and the retained solder resist layer 200 forms a solder resist dam 210. The inner wall of the cavity 110 includes the side wall of the opening position and the side wall of the solder resist dam 210 connected to the side wall of the opening position. At this time, the inner wall of the cavity 110 has no copper layer.

[0075] Step S400, opening the prepreg 300 according to the position of the solder dam 210 to obtain an opening cavity penetrating the prepreg 300, and stacking the prepreg 300 on the upper surface / lower surface of the first core board 100 so that the solder dam 210 is located in the opening cavity;

[0076] Among them, reference Figure 4 The cavity range of the open cavity is equal to the outer edge range of the solder dam 210 away from the cavity 110. When the prepreg 300 is stacked on the first core board 100, the prepreg 300 and the cavity 110 are separated by the solder dam 210. In order to more conveniently stack the prepreg 300 on the first core board 100, the cavity range of the open cavity can be set to be slightly larger than the outer edge range of the solder dam 210 away from the cavity 110.

[0077] Step S500 , stacking the second core board 400 on the side of the prepreg 300 away from the first core board 100 , and pressing the first core board 100 , the prepreg 300 , and the second core board 400 to form a pressed board.

[0078] Among them, reference Figure 4, core board A is the first core board 100, and core board B is the second core board 400. The cavity 110 on the first core board 100 is separated from the semi-cured sheet 300 by the solder resist dam 210, so that when the layers are pressed together in the subsequent process, the adhesive materials such as resin used to glue the layers for packaging will not flow into the cavity 110, thereby ensuring the cleanliness of the cavity 110 and reducing the subsequent process caused by the need to clean the adhesive materials retained in the cavity 110, thereby simplifying the production process and improving production efficiency. At this time, the cavity 110 on the pressed board, the side walls of the cavity 110 include the side walls at the opening position, the side walls of the solder resist dam 210 connected to the side walls at the opening position, and a portion of the upper surface of the second core board 400, and the cavity 110 on the pressed board is a concave structure with an opening facing upward.

[0079] refer to Figure 2 and Figure 3 According to some embodiments of the present invention, the step of making a solder resist layer 200 on the upper surface / lower surface of the first core board 100 according to the opening position includes:

[0080] Printing solder resist oil at the opening position of the upper surface / lower surface of the first core board 100 and in a preset range around the opening position;

[0081] The solder resist oil is exposed, developed, and cured to form a solder resist layer 200 .

[0082] refer to Figure 2 and Figure 3 According to some embodiments of the present invention, the preset range is within a range of 0.2 mm extending outward from the edge of the opening position.

[0083] Among them, reference Figure 2 and Figure 3 In this example, at the opening position, any solder resist oil with a single side larger than the opening position by 0.2 mm is printed on the lower surface of the first core board 100, and then the solder resist oil is exposed, developed, and cured to form a solder resist layer 200. It can be imagined that the method of making the solder resist layer 200 on the upper surface of the first core board 100 is consistent with the method of making the solder resist layer 200 on the lower surface of the first core board 100.

[0084] refer to Figure 1 , Figure 5 , Figure 6 and Figure 7 According to some embodiments of the present invention, the method of the present application further includes step S600, step S700, and step S800, wherein:

[0085] Step S600, drilling at a first preset drilling position of the press plate to obtain a first through hole 800 penetrating the press plate;

[0086] Step S700, electroplating a copper layer on the inner wall of the first through hole 800 and the inner wall of the cavity 110;

[0087] Step S800, etching an outer layer circuit on the surface of the laminate, and the outer layer circuit is connected to the copper layer.

[0088] Among them, reference Figure 5 , Figure 6 and Figure 7 , the first through hole 800 can be used to position the laminate or fix the laminate. The inner wall of the first through hole 800 is electroplated with a copper layer to achieve metallization of the first through hole 800. The inner wall of the cavity 110 includes two parts, one part refers to the side wall of the opening position of the first core board 100, and the other part refers to the side wall of the solder dam 210 connected to the side wall of the opening position. Electroplating the copper layer on the inner wall of the cavity 110 can connect the internal space of the cavity 110 as a whole and make the cavity 110 form the same network or signal shielding cover. In this example, the outer layer circuits are etched on the upper and lower surfaces of the laminate. It is conceivable that the outer layer circuits can also be etched only on one required surface or specific position.

[0089] Second, reference Figure 8 According to a cavity manufacturing method using a solder resist dam according to an embodiment of the present invention, the cavity manufacturing method includes steps S900, S1000, S1100, S1200, S1300, and S1400, wherein:

[0090] Step S900, determining the opening position of the first core plate 100;

[0091] According to the required position of the cavity 110 , the opening position and opening range of the cavity 110 to be opened on the first core board 100 are defined.

[0092] Step S1000, according to the opening position, a solder resist layer 200 is formed on both the upper surface and the lower surface of the first core board 100; the solder resist layer 200 covers the opening position;

[0093] It should be noted that in this example, Fig.10 As shown, the upper surface of the first core plate 100 is the outer surface in the upward direction, and the lower surface of the first core plate 100 is the outer surface in the downward direction. Fig.10 In this example, according to the designated opening position and opening range, a solder resist layer 200 is made to cover the upper surface and the lower surface of the first core board 100, and the coverage range is slightly larger than the opening position. The material for making the solder resist layer 200 can be any solder resist oil. The method for making the solder resist layer 200 in this aspect is consistent with the method for making the solder resist layer 200 in the first aspect.

[0094] Step S1100, according to the opening position, a cavity 110 is opened on the first core board 100; the cavity 110 penetrates the first core board 100 and the solder resist layer 200, and two sides of the solder resist layer 200 are located outside the cavity 110 to form a solder resist dam 210;

[0095] Among them, reference Fig.11 After the cavity 110 is opened, the solder resist layer 200 on the upper and lower surfaces of the first core board 100 and covering the area outside the opening position is retained, and the solder resist layer 200 retained on the upper and lower surfaces will form a solder resist dam 210. The inner wall of the cavity 110 includes the side wall of the opening position and the side wall of the solder resist dam 210 connected to the side wall of the opening position. The inner wall of the cavity 110 has no copper layer.

[0096] Step S1200, opening the first prepreg 600 and the second prepreg 700 according to the position of the solder resist dam 210, to obtain a first opening cavity penetrating the first prepreg 600 and a second opening cavity penetrating the second prepreg 700;

[0097] Among them, reference Fig.12 , the cavity range of the first opening cavity is equal to the outer edge range of the solder dam 210 on the upper surface of the first core board 100 away from the cavity 110, and the cavity range of the second opening cavity is equal to the outer edge range of the solder dam 210 on the lower surface of the first core board 100 away from the cavity 110. When the first prepreg 600 is stacked on the upper surface of the first core board 100, the first prepreg 600 and the cavity 110 will be separated by the solder dam 210 on the upper surface of the first core board 100; when the second prepreg 700 is stacked on the lower surface of the first core board 100, the second prepreg 700 and the cavity 110 will be separated by the solder dam 210 on the lower surface of the first core board 100. It can be imagined that in order to facilitate stacking the first semi-cured sheet 600 and the second semi-cured sheet 700 on the first core board 100, the cavity range of the first opening cavity can also be set to be slightly larger than the outer edge range of the solder resist dam 210 on the upper surface of the first core board 100 away from the cavity 110, and the cavity range of the second opening cavity can be set to be slightly larger than the outer edge range of the solder resist dam 210 on the lower surface of the first core board 100 away from the cavity 110.

[0098] Step S1300, stacking the first prepreg 600 on the upper surface of the first core board 100, stacking the second prepreg 700 on the lower surface of the first core board 100, and the solder dam 210 on the upper surface of the first core board 100 is located in the first opening cavity, and the solder dam 210 on the lower surface of the first core board 100 is located in the second opening cavity;

[0099] Step S1400, stack the second core board 400 on the side of the first semi-cured sheet 600 away from the first core board 100, stack the third core board 500 on the side of the second semi-cured sheet 700 away from the first core board 100, and press the second core board 400, the first semi-cured sheet 600, the first core board 100, the second semi-cured sheet 700 and the third core board 500 to form a pressed board.

[0100] Among them, reference Fig.12 , core board C is the first core board 100, core board A is the second core board 400, and core board B is the third core board 500. Through the solder dam 210 on the upper surface of the first core board 100 and the solder dam 210 on the lower surface, the cavity 110 on the first core board 100 is separated from the first prepreg 600 and the second prepreg 700, so that when the layers are pressed together in the subsequent process, the adhesive materials such as resin used to glue the layers for packaging will not flow into the cavity 110, ensuring the cleanliness of the cavity 110, and reducing the subsequent process caused by the need to clean the adhesive materials retained in the cavity 110, simplifying the production process and improving production efficiency. At this time, the cavity 110 on the press board has side walls including the side walls at the opening position, the side walls of the solder dam 210 connected to the side walls at the opening position, part of the lower surface of the second core board 400, and part of the upper surface of the third core board 500. The cavity 110 on the press board has side walls connected by four surfaces and passes through both ends of the press board in a direction perpendicular to the up and down direction. It is conceivable that the cavity 110 on the press board can also only pass through one of the two ends of the press board in a direction perpendicular to the up and down direction, and the cavity 110 on the press board has side walls connected by five surfaces; or, the cavity 110 on the press board can also be completely built into the press board.

[0101] refer to Figure 8 , Fig.13 , Fig.14 and Fig.15 According to some embodiments of the present invention, the method of the present application further includes step S1500, step S1600, and step S1700, wherein:

[0102] Step S1500, drilling at a second preset drilling position of the press plate to obtain a second through hole 900 penetrating the press plate;

[0103] Step S1600, electroplating a copper layer on the inner wall of the second through hole 900;

[0104] Step S1700, etching an outer layer circuit on the surface of the laminate, and the outer layer circuit is connected to the copper layer.

[0105] Among them, reference Fig.13 , Fig.14 and Fig.15The second through hole 900 can be used to position the laminate or fix the laminate. The inner wall of the second through hole 900 is electroplated with a copper layer to achieve metallization of the second through hole 900. In this example, the outer layer circuits are etched on both the upper and lower surfaces of the laminate. It is conceivable that the outer layer circuits can also be etched only on one surface or a specific position as required.

[0106] refer to Fig. 9 According to some embodiments of the present invention, before the step of stacking the second core board 400 on the side of the first prepreg 600 away from the first core board 100, stacking the third core board 500 on the side of the second prepreg 700 away from the first core board 100, and pressing the second core board 400, the first prepreg 600, the first core board 100, the second prepreg 700 and the third core board 500, the method further includes:

[0107] Etching a first preset etching position on the surface of the second core board 400 close to the third core board 500 to form a first inner layer circuit 410;

[0108] A second preset etching position on the surface of the third core board 500 close to the second core board 400 is etched to form a second inner layer circuit 510 .

[0109] Among them, Fig.12 , Fig.13 , Fig.14 , Fig.15 In the embodiment, the first inner layer circuit 410 completely abuts against the inner space of the cavity 110, and the second inner layer circuit 510 completely abuts against the inner space of the cavity 110. It is conceivable that the first inner layer circuit 410 may be set to be not completely abutting against the inner space of the cavity 110, and the second inner layer circuit 510 may be set to be not completely abutting against the inner space of the cavity 110; or, one of the first inner layer circuit 410 and the second inner layer circuit 510 may be set to be not completely abutting against the inner space of the cavity 110, and the other may be set to be completely abutting against the inner space of the cavity 110.

[0110] In a third aspect, a cavity manufacturing device using a solder resist dam according to an embodiment of the present invention is used to implement a cavity manufacturing method using a solder resist dam as described in the first aspect and / or the second aspect above.

[0111] Fourthly, reference Figure 4 , according to a substrate of an embodiment of the present invention, the substrate comprises:

[0112] The first core plate 100 is provided with a cavity 110;

[0113] A solder resist dam 210 is disposed on the upper surface / lower surface of the first core board 100 , and the solder resist dam 210 is located on both sides of the cavity 110 ;

[0114] A prepreg 300 is provided with an opening, and the prepreg 300 is pressed on the upper surface / lower surface of the first core board 100, and the solder resist dam 210 is located in the opening;

[0115] The second core plate 400 is pressed onto a side of the prepreg 300 away from the first core plate 100 .

[0116] Specifically, refer to Figure 5 , Figure 6 and Figure 7 , the first core board 100 is core board A, the second core board 400 is core board B, and a first through hole 800 is also provided on the substrate, and the inner wall of the first through hole 800 and the inner wall of the cavity 110 are both plated with a copper layer. The first through hole 800 can be used to position the substrate or fix the substrate. The inner wall of the first through hole 800 is plated with a copper layer, so that the metallization of the first through hole 800 can be achieved. The inner wall of the cavity 110 includes two parts, one part refers to the side wall of the opening position of the first core board 100, and the other part refers to the side wall of the solder dam 210 connected to the side wall of the opening position. Plating the copper layer on the inner wall of the cavity 110 can connect the internal space of the cavity 110 as a whole, and make the cavity 110 form the same network or signal shielding cover. In this example, outer circuits are etched on both the upper and lower surfaces of the substrate, and the outer circuits are conductive with the copper layer on the inner wall of the first through hole 800 and the copper layer on the inner wall of the cavity 110, and the copper layer is used for circuit layout and heat dissipation. It is conceivable that the outer circuits can also be etched only on one required surface or specific position. The substrate is made by the cavity making device of the third aspect using the method of the first aspect.

[0117] Fifth, reference Fig.12 , according to a substrate of an embodiment of the present invention, the substrate comprises:

[0118] The first core plate 100 is provided with a cavity 110;

[0119] Solder dams 210 are disposed on the upper surface and the lower surface of the first core board 100 , and the solder dams 210 are located on both sides of the cavity 110 ;

[0120] A first prepreg 600 is provided with a first opening cavity, and the first prepreg 600 is pressed on the upper surface of the first core board 100, and the solder dam 210 on the upper surface of the first core board 100 is located in the first opening cavity;

[0121] The second prepreg 700 has a second opening cavity, and the second prepreg 700 is pressed on the lower surface of the first core board 100, and the solder dam 210 on the lower surface of the first core board 100 is located in the second opening cavity;

[0122] The second core plate 400 is pressed onto a side of the first prepreg 600 away from the first core plate 100;

[0123] The third core plate 500 is pressed onto a side of the second prepreg 700 away from the first core plate 100 .

[0124] Specifically, refer to Fig.13 , Fig.14 and Fig.15 , the first core board 100 is core board C, the second core board 400 is core board A, and the third core board 500 is core board B. A second through hole 900 is also provided on the substrate, and the inner wall of the second through hole 900 is plated with a copper layer. The second through hole 900 can be used to position the substrate or fix the substrate. Electroplating the inner wall of the second through hole 900 with a copper layer can achieve metallization of the second through hole 900. A first inner layer circuit 410 is provided on the surface of the second core board 400 close to the third core board 500, and a second inner layer circuit 510 is provided on the surface of the third core board 500 close to the second core board 400. The internal space of the cavity 110 is in large-area contact with the first inner layer circuit 410 and the second inner layer circuit 510, so the first inner layer circuit 410 and the second inner layer circuit 510 have stronger heat dissipation capabilities. Fig.12 , Fig.13 , Fig.14 and Fig.15 In the embodiment, the first inner layer circuit 410 is set to completely abut against the internal space of the cavity 110, and the second inner layer circuit 510 is set to completely abut against the internal space of the cavity 110. In practical applications, the first inner layer circuit 410 can also be set to not completely abut against the internal space of the cavity 110, and the second inner layer circuit 510 can be set to not completely abut against the internal space of the cavity 110; or, one of the first inner layer circuit 410 and the second inner layer circuit 510 is set to not completely abut against the internal space of the cavity 110, and the other is set to completely abut against the internal space of the cavity 110. In this example, the outer layer circuit is etched on the upper and lower surfaces of the substrate, and the outer layer circuit is conductive with the copper layer on the inner wall of the second through hole 900, and the copper layer is used for circuit layout and heat dissipation. It is conceivable that the outer layer circuit can also be etched only on a required surface or specific position. The substrate is made by the cavity making device of the third aspect using the method of the second aspect.

[0125] According to an embodiment of the present invention, a cavity manufacturing method, cavity manufacturing device, and substrate using a solder resist dam have at least the following beneficial effects: The method of the present application uses a solder resist dam to separate the prepreg from the cavity, so that the resin can no longer flow into the cavity of the circuit board, ensuring the cleanliness of the cavity. Therefore, prepregs of any thickness can be used in the production of the circuit board, simplifying the production process of the circuit board with a cavity, and more conducive to the mass production of the circuit board with a cavity. The cavity manufacturing device of the present application is used to implement the method of the present application.

[0126] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0127] Although embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A method for manufacturing a cavity using a solder resist dam, It is characterized in that include: Determining an opening position of the first core plate; According to the opening position, a solder resist layer is formed on the upper surface / lower surface of the first core board; The solder resist layer covers the opening position; According to the opening position, a cavity is opened in the first core board; the cavity passes through the first core board and the solder resist layer, and two sides of the solder resist layer are located outside the cavity to form a solder resist dam; According to the position of the solder dam, the prepreg is opened to obtain an open cavity penetrating the prepreg, and the prepreg is stacked on the upper surface / lower surface of the first core board so that the solder dam is located in the open cavity; A second core board is stacked on a side of the prepreg away from the first core board, and the first core board, the prepreg and the second core board are pressed together to form a pressed board.

2. The method for manufacturing a cavity using a solder resist dam according to claim 1, It is characterized in that The step of making a solder resist layer on the upper surface / lower surface of the first core board according to the opening position includes: Printing solder resist oil at the opening position of the upper surface / lower surface of the first core board and within a preset range around the opening position; The solder resist oil is exposed, developed and cured to form a solder resist layer.

3. The method for manufacturing a cavity using a solder resist dam according to claim 2, It is characterized in that The preset range is within a range of 0.2 mm extending outward from the edge of the opening position.

4. The method for manufacturing a cavity using a solder resist dam according to claim 1, It is characterized in that The method further comprises: Drilling a hole at a first preset drilling position of the press plate to obtain a first through hole penetrating the press plate; Electroplating a copper layer on the inner wall of the first through hole and the inner wall of the cavity; An outer layer circuit is etched on the surface of the laminated board, and the outer layer circuit is connected to the copper layer.

5. A method for making a cavity using a solder resist dam, It is characterized in that include: Determining an opening position of the first core plate; According to the opening position, a solder resist layer is formed on both the upper surface and the lower surface of the first core board; The solder resist layer covers the opening position; According to the opening position, a cavity is opened in the first core board; the cavity passes through the first core board and the solder resist layer, and two sides of the solder resist layer are located outside the cavity to form a solder resist dam; According to the position of the solder resist dam, the first prepreg and the second prepreg are opened to obtain a first opening cavity penetrating the first prepreg and a second opening cavity penetrating the second prepreg; The first prepreg is stacked on the upper surface of the first core board, and the second prepreg is stacked on the lower surface of the first core board, and the solder dam on the upper surface of the first core board is located in the first opening cavity, and the solder dam on the lower surface of the first core board is located in the second opening cavity; A second core board is stacked on a side of the first semi-cured sheet away from the first core board, a third core board is stacked on a side of the second semi-cured sheet away from the first core board, and the second core board, the first semi-cured sheet, the first core board, the second semi-cured sheet and the third core board are pressed together to form a pressed board.

6. The method for manufacturing a cavity using a solder resist dam according to claim 5, It is characterized in that The method further comprises: Drilling a hole at a second preset drilling position of the press plate to obtain a second through hole penetrating the press plate; Electroplating a copper layer on the inner wall of the second through hole; An outer layer circuit is etched on the surface of the laminated board, and the outer layer circuit is connected to the copper layer.

7. The method for manufacturing a cavity using a solder resist dam according to claim 5, It is characterized in that Before the step of stacking the second core board on the side of the first prepreg away from the first core board, stacking the third core board on the side of the second prepreg away from the first core board, and pressing the second core board, the first prepreg, the first core board, the second prepreg and the third core board, the method further comprises: Etching a first preset etching position on the surface of the second core board close to the third core board to form a first inner layer circuit; A second preset etching position on the surface of the third core board close to the second core board is etched to form a second inner layer circuit.

8. A cavity manufacturing device using a solder resist dam, It is characterized in that The cavity manufacturing device is used to implement the cavity manufacturing method using the solder resist dam as described in any one of claims 1 to 7.

9. A substrate, It is characterized in that The substrate comprises: The first core plate has a cavity; A solder dam is disposed on the upper surface / lower surface of the first core board, and the solder dam is located on both sides of the cavity; A prepreg sheet having an opening cavity, and the prepreg sheet is pressed on the upper surface / lower surface of the first core board, and the solder resist dam is located in the opening cavity; The second core board is pressed onto a side of the prepreg sheet away from the first core board.

10. A substrate, It is characterized in that The substrate comprises: The first core plate has a cavity; Solder dams are provided on the upper surface and the lower surface of the first core board, and the solder dams are located on both sides of the cavity; A first prepreg is provided with a first opening cavity, and the first prepreg is pressed on the upper surface of the first core board, and the solder dam on the upper surface of the first core board is located in the first opening cavity; A second prepreg is provided with a second opening cavity, and the second prepreg is pressed on the lower surface of the first core board, and the solder dam on the lower surface of the first core board is located in the second opening cavity; A second core plate, pressed onto a side of the first prepreg away from the first core plate; The third core board is pressed onto a side of the second prepreg sheet away from the first core board.

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