Pad electroplating gold method, structure, electronic device and storage medium

Abstract

The present invention discloses a method, structure, electronic device, and storage medium for electroplating gold on pads, relating to the field of gold plating technology. The method comprises: obtaining a substrate to be gold-plated; silk-screening ink on the gold-plated area, and exposing and developing the ink to reveal the pads to be gold-plated; vacuum laminating the entire substrate to be gold-plated to form a first anti-etching photosensitive dry film on the surface of the substrate to be gold-plated; exposing and developing the first anti-etching photosensitive dry film to form a first window; nickel-plating and soft gold-plating the pads to be gold-plated based on the first window, and removing the first anti-etching photosensitive dry film; vacuum laminating the entire substrate to be gold-plated a second time to form a second anti-etching photosensitive dry film on the surface of the substrate to be gold-plated; exposing and developing the second anti-etching photosensitive dry film to form a second window; hard gold-plating the pads to be gold-plated based on the second window; and removing the second anti-etching photosensitive dry film and the ink layer. The method according to an embodiment of the present invention can improve the problem of plating seepage.

Description

Technical Field

[0001] The present invention relates to the technical field of gold plating, and in particular to a pad electroplating gold method, structure, electronic equipment and storage medium. Background Art

[0002] With technological advancements and the miniaturization and sophistication of electronic products, soldering processes are becoming increasingly widespread in electronics manufacturing. As a key component in the soldering process, the quality and performance of solder pads directly impact soldering reliability. Traditional soldering processes present challenges with solder pad gold plating, such as plating infiltration and inaccurate control of gold layer thickness. These issues can lead to unstable soldering quality and impact product performance and lifespan. Therefore, improving the performance and quality of solder pad gold plating technology has become a pressing issue in the electronics manufacturing industry. Summary of the Invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a pad electroplating gold method, structure, electronic device and storage medium, which can avoid the plating seepage phenomenon during the gold plating process.

[0004] On the one hand, the pad electroplating gold method according to an embodiment of the present invention includes the following steps:

[0005] Obtain a substrate to be gold-plated; the surface of the substrate to be gold-plated includes a gold-plated area and a non-gold-plated area, and the gold-plated area is provided with a pad to be gold-plated;

[0006] Screen printing ink on the gold-plated area, exposing and developing the ink to reveal the pad to be gold-plated, and forming a cured ink layer in a preset area around the pad to be gold-plated;

[0007] According to preset lamination parameters, vacuum lamination is performed on the entire substrate to be gold-plated to form a first anti-etching photosensitive dry film on the surface of the substrate to be gold-plated;

[0008] exposing and developing the first anti-etching photosensitive dry film to form a first window corresponding to the pad to be gold-plated;

[0009] According to the first window, the pad to be gold-plated is subjected to nickel plating and soft gold plating, and the first anti-etching photosensitive dry film is removed;

[0010] According to the lamination parameters, performing a second vacuum lamination on the entire substrate to be gold-plated to form a second anti-etching photosensitive dry film on the surface of the substrate to be gold-plated;

[0011] exposing and developing the second anti-etching photosensitive dry film to form a second window corresponding to the pad to be gold-plated;

[0012] performing hard gold plating on the pad to be gold-plated according to the second window;

[0013] The second resist photosensitive dry film and the ink layer are removed.

[0014] According to some embodiments of the present invention, the step of vacuum laminating the entire substrate to be gold-plated according to preset lamination parameters to form a first anti-etching photosensitive dry film on the surface of the substrate to be gold-plated includes:

[0015] Set the lamination pressure to 0.4-0.5Mpa, the lamination temperature to 105℃-125℃, and the lamination line speed to 2.1-2.5m / min;

[0016] The substrate to be gold-plated is vacuum laminated at the lamination pressure and the lamination temperature at the lamination line speed to form a first anti-etching photosensitive dry film on the surface of the substrate to be gold-plated.

[0017] According to some embodiments of the present invention, the step of exposing and developing the first resist photosensitive dry film to form a first window corresponding to the pad to be gold plated includes:

[0018] Set the exposure time to 14-25 seconds per surface, the exposure energy to 130-150 MJ, the exposure scale to 4-6 grids, and the light intensity to 4-5 kW.

[0019] exposing the first resist photosensitive dry film according to the exposure time, the exposure energy, the exposure scale, and the light source intensity;

[0020] The first anti-etching photosensitive dry film after exposure is developed to form a first window corresponding to the pad to be gold-plated.

[0021] According to some embodiments of the present invention, the preset area is within a range of 0.05-0.25 mm from the pad to be gold-plated.

[0022] According to some embodiments of the present invention, the step of plating nickel and soft gold on the pad to be gold-plated according to the first window includes:

[0023] According to the first window, the pad to be gold-plated is nickel-plated to form a nickel layer with a thickness of 2.5 μm-7 μm;

[0024] Soft gold is electroplated on the surface of the nickel layer to form a soft gold layer with a thickness of 0.03 μm-0.04 μm.

[0025] According to some embodiments of the present invention, after the step of performing nickel plating and soft gold plating on the pad to be gold-plated according to the first window and removing the first anti-etching photosensitive dry film, the method further includes:

[0026] The substrate to be gold-plated is pickled.

[0027] According to some embodiments of the present invention, the thickness of the hard gold layer formed by hard gold plating on the pad to be gold-plated is 0.6 μm.

[0028] On the other hand, according to the pad electroplating gold structure of the embodiment of the present invention, the pad electroplating gold structure is manufactured by the pad electroplating gold method described in the above embodiment.

[0029] On the other hand, an electronic device according to an embodiment of the present invention includes:

[0030] a memory for storing program instructions;

[0031] The processor is used to call the program instructions stored in the memory and execute the pad electroplating gold method described in the above embodiment according to the obtained program instructions.

[0032] On the other hand, a storage medium according to an embodiment of the present invention stores computer-executable instructions, and the computer-executable instructions are used to enable a computer to execute the pad electroplating gold method described in the above embodiment.

[0033] The pad electroplating gold method, structure, electronic device, and storage medium according to the embodiments of the present invention have at least the following beneficial effects: by optimizing lamination parameters and employing vacuum lamination, the lamination effect is improved, bubbles are prevented from forming between the dry film and the substrate to be plated after lamination, and plating bleed caused by bubble bursting during the plating process is avoided. The plating bleed problem is further alleviated by using ink to protect a predetermined area around the pad to be plated.

[0034] Additional aspects and advantages of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description which follows, or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the following description of the embodiments with reference to the accompanying drawings, in which:

[0036] Figure 1 This is a flow chart of the steps of the pad electroplating method according to an embodiment of the present invention;

[0037] Figure 2 A flow chart of the steps of vacuum lamination according to an embodiment of the present invention;

[0038] Figure 3 A flowchart of the exposure and development steps according to an embodiment of the present invention;

[0039] Figure 4 Flow chart of nickel plating and soft gold plating steps according to an embodiment of the present invention. DETAILED DESCRIPTION

[0040] The embodiments of the present invention are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application. The step numbers in the following embodiments are provided only for the convenience of explanation and do not limit the order of the steps. The order of execution of the steps in the embodiments can be adaptively adjusted according to the understanding of those skilled in the art.

[0041] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0042] The terms "first," "second," "third," and "fourth," etc., in the specification, claims, and accompanying drawings of the present invention are used to distinguish between different items, not to describe a specific order. Furthermore, the terms "including," "having," and any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or apparatus comprising a series of steps or elements is not limited to the listed steps or elements, but may optionally include steps or elements not listed, or may optionally include other steps or elements inherent to the process, method, product, or apparatus.

[0043] References to "embodiments" in this disclosure mean that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the disclosure. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0044] With technological advancements and the miniaturization and sophistication of electronic products, soldering processes are becoming increasingly widespread in electronics manufacturing. As a key component in the soldering process, the quality and performance of solder pads directly impact soldering reliability. Traditional soldering processes present challenges with solder pad gold plating, such as plating infiltration and inaccurate control of gold layer thickness. These issues can lead to unstable soldering quality and impact product performance and lifespan. Therefore, improving the performance and quality of solder pad gold plating technology has become a pressing issue in the electronics manufacturing industry.

[0045] Currently, when gold-plating pads, the industry often applies dry film around the edges of the fingers. This inaccurate placement and dimensions of the cover lines can cause gold bleed-through during electroplating. Furthermore, bubbles can form in the dry film during application. Because the entire board is covered with dry film during gold electroplating, the film at the location of the bubbles is not fully cured due to low-energy exposure. These bubbles burst during the high-temperature gold plating process, causing nickel-gold bleed-through to the pads. This bleed-through can lead to short circuits, resulting in defective products.

[0046] To this end, embodiments of the present invention provide a pad electroplating gold method, structure, electronic device, and storage medium. By optimizing lamination parameters and employing vacuum lamination, the lamination effect is enhanced, preventing bubbles from forming between the dry film and the substrate to be plated after lamination, thus avoiding plating seepage caused by bubble bursting during the plating process. The plating seepage problem is further alleviated by using ink to protect a predetermined area around the pad to be plated.

[0047] The following is combined with Figure 1-4 , describes in detail the pad electroplating gold method, structure, electronic device and storage medium of the embodiments of the present invention.

[0048] On the one hand, the present invention provides a method for electroplating gold on a pad, such as Figure 1 As shown, the method includes the following steps:

[0049] Step S100: obtaining a substrate to be gold-plated; the surface of the substrate to be gold-plated includes a gold-plated area and a non-gold-plated area, and the gold-plated area is provided with a pad to be gold-plated;

[0050] Specifically, a substrate to be gold-plated refers to a packaging substrate / circuit board that has already been fabricated with internal and external circuitry, awaiting only nickel, soft gold, or hard gold plating on the surface pads. The surface of this substrate to be gold-plated consists of gold-plated and non-gold-plated areas. The pads to be gold-plated are located in the gold-plated areas, while the remaining circuitry, etc., are located in the non-gold-plated areas. During the gold-plating process, the non-gold-plated areas must be protected to prevent the gold plating solution from entering these areas and causing short circuits, potentially rendering the product scrapped.

[0051] Step S200: screen printing ink on the gold-plated area, exposing and developing the ink to reveal the pad to be gold-plated, and forming a cured ink layer in a preset area around the pad to be gold-plated;

[0052] It should be noted that not all areas of the gold-plated area require gold plating. Only the surfaces of the pads to be gold-plated within the gold-plated area require gold plating. Therefore, the gold-plated area includes not only the pads to be gold-plated but also the areas surrounding the pads to be gold-plated that do not require gold plating. To prevent the gold plating solution from penetrating the area surrounding the pads to be gold-plated and entering the non-gold-plated area during the gold plating process, where it could contact the circuitry on the surface of the substrate to be gold-plated and cause a short circuit, ink is screen-printed on the gold-plated area and baked to solidify, thereby protecting the areas surrounding the pads to be gold-plated. The ink is then exposed and developed, thereby creating windows in the ink and revealing the pads to be gold-plated. The predetermined areas surrounding the pads to be gold-plated are then covered by the ink layer. Because the ink layer has an anti-plating effect, it can protect the areas surrounding the pads to be gold-plated, effectively preventing the gold plating solution from penetrating the areas surrounding the pads to be gold-plated during the gold plating process.

[0053] In this example, the preset area where the ink layer is located is within the range of 0.05-0.25 mm from the pad to be gold-plated, which plays an anti-plating role on the surrounding area of ​​the pad to be gold-plated, preventing plating from occurring during the gold plating process, and preventing the plating solution from entering the non-gold-plated area and causing a short circuit.

[0054] Step S300: vacuum lamination is performed on the entire substrate to be gold-plated according to preset lamination parameters to form a first anti-etching photosensitive dry film on the surface of the substrate to be gold-plated;

[0055] Specifically, by optimizing lamination parameters and adopting a vacuum lamination method, the lamination effect can be effectively improved, ensuring a tight fit between the first photosensitive resist dry film and the substrate to be gold-plated, thereby preventing the generation of bubbles after lamination. Because there are no bubbles between the first photosensitive resist dry film and the substrate to be gold-plated, and the two are tightly fitted, the subsequent gold plating process is less likely to cause problems such as loosening of the dry film or rupture of bubbles in the dry film, making plating less likely to occur.

[0056] Specifically, if Figure 2 As shown, in this example, the above step S300 includes the following two steps:

[0057] Step S310: setting the lamination pressure to 0.4-0.5 MPa, the lamination temperature to 105°C-125°C, and the lamination line speed to 2.1-2.5 m / min;

[0058] Step S320 : vacuum lamination is performed on the substrate to be gold-plated at the lamination pressure and lamination temperature at the lamination line speed to form a first anti-etching photosensitive dry film on the surface of the substrate to be gold-plated.

[0059] Practical verification has shown that good lamination results are achieved under a lamination pressure of 0.4-0.5 MPa and a lamination temperature of 105°C-125°C. Furthermore, by setting the lamination line speed to 2.1-2.5 m / min, reducing the lamination line speed and increasing the lamination time, the problem of height difference can be effectively avoided, thereby improving the effect of lamination bubbles. By optimizing the lamination parameters and achieving precise control of the lamination process, the problem of pad permeation can be improved, thereby enhancing product quality.

[0060] Step S400: exposing and developing the first resist photosensitive dry film to form a first window corresponding to the pad to be gold plated;

[0061] A first photosensitive dry film is applied to the surface of the substrate to be gold-plated. This first photosensitive dry film has excellent selective sensitivity, phase resolution, and fine line adhesion, and its thin film thickness provides high protection. After exposure and development, the first photosensitive dry film forms a first window corresponding to the pad to be gold-plated, facilitating subsequent electroplating of the pad. Simultaneously, the first photosensitive dry film prevents electroplating on other areas of the substrate to be gold-plated.

[0062] In this example, if Figure 3 As shown, the above step S400 includes the following three steps:

[0063] Step S410: Set the exposure time to 14-25 seconds per surface, the exposure energy to 130-150 MJ, the exposure scale to 4-6 grids, and the light source intensity to 4-5 kW.

[0064] Step S420: exposing the first resist photosensitive dry film according to the exposure time, exposure energy, exposure scale and light source intensity;

[0065] Step S430: developing the exposed first resist photosensitive dry film to form a first window corresponding to the pad to be gold plated.

[0066] Specifically, by optimizing exposure parameters and increasing exposure energy, the polymerization and hardening degree of the first photoresist dry film can be increased, reducing the risk of dry film shedding and avoiding dry film damage. This also enhances the first photoresist's corrosion resistance and its adhesion to the copper surface, providing better filling capabilities for uneven surfaces and improving product quality.

[0067] Step S500: nickel plating and soft gold plating are performed on the pad to be gold-plated according to the first window, and the first resist photosensitive dry film is removed;

[0068] Specifically, after exposing and developing the first resist photosensitive dry film to form a first window corresponding to the pad to be gold-plated, the substrate to be gold-plated is placed in a nickel and gold plating solution to plate nickel and gold on the surface of the pad to be gold-plated. After the electroplating is completed, the first resist photosensitive dry film on the surface of the substrate to be gold-plated is removed.

[0069] In this example, if Figure 4 As shown, the above step S500 includes the following two steps:

[0070] Step S510: nickel-plating the pad to be gold-plated according to the first window to form a nickel layer with a thickness of 2.5 μm-7 μm;

[0071] Step S520: electroplating soft gold on the surface of the nickel layer to form a soft gold layer with a thickness of 0.03 μm-0.04 μm.

[0072] First, a 2.5μm-7μm nickel layer is plated on the surface of the pad to be gold-plated, and then a soft gold layer with a thickness of 0.03μm-0.04μm is formed on the surface of the nickel layer to protect the pad to be gold-plated.

[0073] Step S600: performing a second vacuum lamination on the entire substrate to be gold-plated according to the lamination parameters to form a second anti-etching photosensitive dry film on the surface of the substrate to be gold-plated;

[0074] After completing the electroplating of nickel layer and soft gold on the surface of the gold-plated pad, it is also necessary to plate hard gold on the surface of some of the gold-plated pads. To this end, it is necessary to perform a second vacuum lamination on the surface of the entire gold-plated substrate to form a second anti-etching photosensitive dry film on the surface of the gold-plated substrate, so as to protect the rest of the gold-plated substrate during the hard gold plating process. It should be noted that in the second vacuum lamination process, the lamination pressure is also set to 0.4-0.5Mpa, the lamination temperature is 105℃-125℃, and the lamination line speed is 2.1-2.5m / min. At this lamination pressure and lamination temperature, the gold-plated substrate is vacuum lamination at this lamination line speed to form a second anti-etching photosensitive dry film on the surface of the gold-plated substrate. A lamination pressure of 0.4-0.5 MPa and a lamination temperature of 105°C-125°C achieve excellent lamination results. Furthermore, by setting the lamination line speed to 2.1-2.5 m / min, reducing the lamination line speed and increasing the lamination time, the problem of height difference can be effectively avoided, thereby improving lamination bubbles. By optimizing the lamination parameters and achieving precise control of the lamination process, the problem of pad permeation can be improved, thereby enhancing product quality.

[0075] Step S700: exposing and developing the second resist photosensitive dry film to form a second window corresponding to the pad to be gold plated;

[0076] It should be noted that when exposing and developing the second resist photosensitive dry film, the exposure parameters are also optimized, setting the exposure time to 14-25S / side, the exposure energy to 130-150MJ, the exposure scale to 4-6 grids, and the light source intensity to 4-5KW. The second resist photosensitive dry film is exposed according to the exposure time, exposure energy, exposure scale, and light source intensity. The exposed second resist photosensitive dry film is then developed to form a second window at the gold-plated pad that needs to be electroplated with hard gold. By optimizing the exposure parameters and increasing the exposure energy, the degree of polymerization and hardening of the second resist photosensitive dry film can be increased, the risk of the dry film falling off can be reduced, and the situation of dry film damage can be avoided. At the same time, the corrosion resistance of the second resist photosensitive dry film and the bonding strength between the second resist photosensitive dry film and the copper surface can be improved, and the second resist photosensitive dry film has a better filling ability for the drop depression, thereby improving product quality. The second photoresist dry film is selected to have good sensitivity, phase resolution, and fine line adhesion. The thin film thickness provides good protection. The unopened areas of the second photoresist dry film protect the areas of the gold-plated substrate that do not require electroplating.

[0077] Step S800: performing hard gold plating on the pad to be gold-plated according to the second window;

[0078] Specifically, after exposing and developing the second resist photosensitive dry film to form a second window corresponding to the pad to be gold-plated, the substrate to be gold-plated is placed in a gold plating solution, and hard gold is plated on the surface of the pad to be gold-plated to form a hard gold layer. In this example, the thickness of the hard gold layer formed by the hard gold plating of the pad to be gold-plated is 0.6 μm.

[0079] Step S900: removing the second resist photosensitive dry film and the ink layer.

[0080] After the nickel, soft gold, and hard gold layers are electroplated, the second photoresist dry film on the gold-plated substrate needs to be removed. At the same time, the ink layer around the gold-plated pads also needs to be removed. This removal can be done by alkaline etching.

[0081] Furthermore, in some embodiments of the present invention, to further enhance the protective effects of the first and second photosensitive dry films, an optimized window design is implemented in the first and second photosensitive dry films to further mitigate plating issues. Specifically, when creating windows in the first and second photosensitive dry films, the distance from the window edge to the lead is less than 0.5mm, and the distance from the lead to the bonding edge is less than 0.26mm. A small gap is designed for the layout spacing of the cover lines, and a small independent piece / segment of dry film is provided, thereby enhancing the product's cover film window design.

[0082] Furthermore, in some embodiments of the present invention, the gold-plated substrate is acid-washed before vacuum lamination twice to remove impurities on the surface of the gold-plated substrate and improve the vacuum lamination effect. Before nickel plating, soft gold plating, and hard gold plating of the gold-plated pads, the gold-plated substrate is pre-treated to improve the electroplating effect. After the entire gold plating process is completed, the gold-plated substrate needs to be cleaned and the entire gold-plated substrate needs to be inspected by AOI to check whether all circuits are normal, ensure product quality, and prevent the outflow of defective products.

[0083] The pad electroplating gold method according to an embodiment of the present invention optimizes lamination parameters and utilizes vacuum lamination to enhance lamination efficiency, preventing bubbles from forming between the dry film and the substrate to be plated. This prevents plating seepage caused by bubbles bursting during the plating process. The use of ink to protect a predetermined area around the pad to be plated further mitigates this issue.

[0084] On the other hand, the present invention further proposes a pad electroplating gold structure, which is manufactured by the pad electroplating gold method described in the above embodiment.

[0085] The pad electroplating gold structure according to the embodiments of the present invention optimizes lamination parameters and utilizes vacuum lamination, thereby improving lamination efficiency and preventing bubbles from forming between the dry film and the substrate to be plated. This prevents plating seepage caused by bubbles bursting during the plating process. The use of ink to protect a predetermined area around the pad to be plated further mitigates this issue.

[0086] On the other hand, an embodiment of the present invention further provides an electronic device, including:

[0087] a memory for storing program instructions;

[0088] The processor is used to call the program instructions stored in the memory and execute the above-mentioned pad electroplating gold method according to the obtained program instructions.

[0089] The processor may be implemented as a general-purpose central processing unit (CPU), a microprocessor, an application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of the present application.

[0090] The memory can be implemented in the form of a read-only memory (ROM), a static storage device, a dynamic storage device, or a random access memory (RAM). The memory can store an operating system and other application programs. When the technical solutions provided in the embodiments of this specification are implemented through software or firmware, the relevant program code is stored in the memory and is called by the processor to execute the pad electroplating gold method of the embodiments of this application. The memory and the processor can be connected via a bus or the like.

[0091] On the other hand, an embodiment of the present invention further provides a storage medium, which is a computer-readable storage medium and stores a computer program. When the computer program is executed by a processor, the above-mentioned pad electroplating gold method is implemented.

[0092] The memory, as a non-transient computer-readable storage medium, can be used to store non-transient software programs and non-transient computer executable programs. In addition, the memory may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage device. In some embodiments, the memory optionally includes a memory remotely located relative to the processor, and these remote memories can be connected to the processor via a network. Examples of the above-mentioned networks include but are not limited to the Internet, an intranet, a local area network, a mobile communication network and a combination thereof. The device embodiments described above are merely schematic, wherein the units described as separate components may or may not be physically separated, and are located in one place, or may be distributed to multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the present embodiment.

[0093] Although specific embodiments are described herein, those skilled in the art will recognize that many other modifications or alternative embodiments are also within the scope of this disclosure. For example, any of the functions and / or processing capabilities described in conjunction with a particular device or component may be performed by any other device or component. In addition, although various exemplary implementations and architectures have been described in accordance with embodiments of the present disclosure, those skilled in the art will recognize that many other modifications to the exemplary implementations and architectures described herein are also within the scope of this disclosure.

[0094] Some aspects of the present disclosure have been described above with reference to the block diagrams and flow charts of the systems, methods, systems and / or computer program products according to the exemplary embodiments. It should be understood that the combination of one or more blocks in the block diagram and the flow chart and the blocks in the block diagram and the flow chart can be realized by executing computer executable program instructions respectively. Equally, according to some embodiments, some blocks in the block diagram and the flow chart may not need to be executed in the order shown, or may not need to be executed in full. In addition, additional components and / or operations beyond those components and / or operations shown in the blocks in the block diagram and the flow chart may be present in certain embodiments.

[0095] Therefore, the blocks in the block diagrams and flow charts support combinations of means for performing the specified functions, combinations of elements or steps for performing the specified functions, and program instruction means for performing the specified functions. It should also be understood that each block in the block diagrams and flow charts, and combinations of blocks in the block diagrams and flow charts, can be implemented by a dedicated hardware computer system that performs the specific functions, elements, or steps, or a combination of dedicated hardware and computer instructions.

[0096] The program modules, applications, etc. described herein may include one or more software components, including, for example, software objects, methods, data structures, etc. Each such software component may include computer-executable instructions that, in response to execution, cause at least a portion of the functionality described herein (e.g., one or more operations of the illustrative methods described herein) to be performed.

[0097] Software component can be encoded with any one in various programming languages.A kind of exemplary programming language can be low-level programming language, such as the assembly language associated with specific hardware architecture and / or operating system platform.Comprise that the software component of assembly language instruction may need to be converted to executable machine code by assembler before being executed by hardware architecture and / or platform.Another exemplary programming language can be a more advanced programming language, and it can be transplanted across multiple architectures.Comprise that the software component of more advanced programming language may need to be converted to intermediate representation by interpreter or compiler before execution.Other examples of programming language include but are not limited to macro language, shell or command language, job control language, script language, database query or search language or report writing language.In one or more exemplary embodiments, the software component that comprises the instruction of one in the above-mentioned programming language example can be directly executed by operating system or other software component, without first being converted into another form.

[0098] Software components can be stored as files or other data storage structures. Software components of similar types or related functions can be stored together, such as in a specific directory, folder, or library. Software components can be static (e.g., preset or fixed) or dynamic (e.g., created or modified at execution time).

[0099] The embodiments of the present invention are described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various changes can be made within the knowledge of ordinary technicians in the relevant technical field without departing from the scope of the present invention.

Claims

1. A method for electroplating gold on a pad, characterized in that: The following steps are involved: Obtain a substrate to be gold-plated; the surface of the substrate to be gold-plated includes a gold-plated area and a non-gold-plated area, and the gold-plated area is provided with a pad to be gold-plated; Screen printing ink on the gold-plated area, exposing and developing the ink to reveal the pad to be gold-plated, and forming a cured ink layer in a preset area around the pad to be gold-plated; According to preset lamination parameters, vacuum lamination is performed on the entire substrate to be gold-plated to form a first anti-etching photosensitive dry film on the surface of the substrate to be gold-plated; exposing and developing the first anti-etching photosensitive dry film to form a first window corresponding to the pad to be gold-plated; According to the first window, the pad to be gold-plated is subjected to nickel plating and soft gold plating, and the first anti-etching photosensitive dry film is removed; According to the lamination parameters, performing a second vacuum lamination on the entire substrate to be gold-plated to form a second anti-etching photosensitive dry film on the surface of the substrate to be gold-plated; exposing and developing the second anti-etching photosensitive dry film to form a second window corresponding to the pad to be gold-plated; performing hard gold plating on the pad to be gold-plated according to the second window; The second resist photosensitive dry film and the ink layer are removed.

2. The pad gold plating method according to claim 1, wherein: The step of vacuum laminating the entire substrate to be gold-plated according to preset lamination parameters to form a first anti-etching photosensitive dry film on the surface of the substrate to be gold-plated includes: Set the lamination pressure to 0.4-0.5Mpa, the lamination temperature to 105℃-125℃, and the lamination line speed to 2.1-2.5m / min; The substrate to be gold-plated is vacuum laminated at the lamination pressure and the lamination temperature at the lamination line speed to form a first anti-etching photosensitive dry film on the surface of the substrate to be gold-plated.

3. The pad electroplating gold method according to claim 1, wherein: The step of exposing and developing the first anti-etching photosensitive dry film to form a first window corresponding to the pad to be gold-plated includes: Set the exposure time to 14-25 seconds per surface, the exposure energy to 130-150 MJ, the exposure scale to 4-6 grids, and the light intensity to 4-5 kW. exposing the first resist photosensitive dry film according to the exposure time, the exposure energy, the exposure scale, and the light source intensity; The first anti-etching photosensitive dry film after exposure is developed to form a first window corresponding to the pad to be gold-plated.

4. The pad electroplating gold method according to claim 1, wherein: The preset area is within a range of 0.05-0.25 mm from the pad to be gold-plated.

5. The pad electroplating gold method according to claim 1, wherein: The step of plating nickel and soft gold on the pad to be gold-plated according to the first window comprises: According to the first window, the pad to be gold-plated is nickel-plated to form a nickel layer with a thickness of 2.5 μm-7 μm; Soft gold is electroplated on the surface of the nickel layer to form a soft gold layer with a thickness of 0.03 μm-0.04 μm.

6. The pad electroplating gold method according to claim 1, wherein: After the step of plating the gold-plated pad with nickel and soft gold according to the first window and removing the first anti-etching photosensitive dry film, the method further includes: The substrate to be gold-plated is pickled.

7. The pad electroplating gold method according to claim 1, wherein: The thickness of the hard gold layer formed by plating the gold-plated pad with hard gold is 0.6 μm.

8. A pad electroplating gold structure, characterized in that: The pad is prepared by the gold electroplating method for the pad as described in any one of claims 1 to 7.

9. An electronic device, characterized in that: include: a memory for storing program instructions; A processor is used to call the program instructions stored in the memory and execute the pad electroplating gold method according to any one of claims 1 to 7 according to the obtained program instructions.

10. A storage medium, characterized in that: The storage medium stores computer-executable instructions, and the computer-executable instructions are used to enable a computer to execute the pad electroplating gold method according to any one of claims 1 to 7.

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