Card-like data carrier with ceramic

Abstract

The invention relates to a card-like data carrier (10), in particular a smart card, comprising an electronic chip module having at least one chip and a contact structure, and a card body (20) having an arrangement region for receiving the chip module, the chip module being arranged in the arrangement region of the card body (20), the card body (20) has at least one first plastic layer (21) and at least one ceramic layer (23), the first plastic layer (21) being formed from a brittle plastic for setting a fracture characteristic of the card-like data carrier (10).

Description

[0001] The invention relates to a card-shaped data carrier comprising ceramic, in particular a smart card.

[0002] A variety of card-shaped data carriers are known from the prior art, for example smart cards, chip cards, dual-interface cards, integrated circuit cards or identification cards.

[0003] Furthermore, it is known to use different components for contact-based and / or contactless data transmission for the production of card-shaped data carriers, such as a chip module with a chip and a contact structure, a card body on which the chip module is arranged and / or other components, such as an antenna or a capacitor for contactless data transmission.

[0004] It is known that such data carriers or cards are usually made of thermoplastic materials, such as polyvinyl chloride (PVC) and polyethylene terephthalate (PET). The problem is that the surface of a data carrier made of plastic can be easily scratched by mechanical action or damaged by chemical materials, such as acids or bases. According to the prior art, data carriers are very sensitive to high temperatures, because they are easily deformed, for example, when subjected to excessively high temperatures.

[0005] It is also known to use ceramics or ceramic materials for card-shaped data carriers. In particular, card films made of ceramic can be used as cover films or coating films. However, these outer ceramic films are very thin and therefore easily break or crack. It has been found to be disadvantageous that ceramics have undefined fracture properties. Therefore, it is possible for users of card-shaped data carriers to get injured at ceramic splinters or cracks, since they may have very sharp edges.

[0006] The object of the present invention is therefore to provide a card-shaped data carrier, in particular a smart card, with a ceramic material, which can provide safe use and reduce the risk of injury to the user.

[0007] This object is achieved by a card-shaped data carrier having the features of independent claim 1 .

[0008] Embodiments and developments of the invention are specified in the dependent claims and are disclosed with reference to the description and the drawings.

[0009] According to one aspect of the present invention, a card-shaped data carrier is provided, in particular a smart card, which comprises an electronic chip module with at least one chip and a contact structure and a card body with a layout area for accommodating the chip module, wherein the chip module is arranged in the layout area of ​​the card body, wherein the card body has at least one first plastic layer and at least one ceramic layer, wherein the first plastic layer is formed of a brittle plastic for setting the fracture characteristics of the card-shaped data carrier.

[0010] In the context of the present application, the terms "first plastic layer" and "brittle plastic" can be used similarly. In other words, the first plastic layer can also be referred to as a brittle plastic layer or brittle plastic in the context of the present application.

[0011] In the scope of the present application, the chip module includes at least one chip and a contact structure. Therefore, contact-based data transmission can be established between the smart card and the reading device. In particular, the chip is preferably connected to the contacts of the contact structure through a line. The contacts can be determined by international standards in terms of their number, size and position, thereby ensuring the function of the smart card in each reading device. However, other components can be provided for the chip module, such as a capacitor or an antenna (as a coil) for capacitive or inductive contactless data transmission. The contactless smart card can communicate with the reading device through electromagnetic waves, wherein the smart card can work similarly to a sending and receiving device. In particular, the electromagnetic waves emitted by the reading device generate an oscillating electromagnetic field, which, for example, generates an oscillating voltage in the coil or antenna of the chip module, thereby providing current to the chip. The oscillation of the voltage can be captured as a signal and converted into data in the chip. These data can be processed in the chip and converted into changes in the electromagnetic field, which can be captured and converted into data by the reading device. Therefore, in general, the chip module can realize data transmission based on contact and / or contactless.

[0012] In the context of the present application, it is preferably provided that the arrangement area for accommodating the chip module is formed by a recess or module opening in the card body for accommodating the chip module. The card body can preferably be formed from a plurality of layers, wherein recesses are provided in the layers for accommodating the chip module therein. This has the advantage that the chip module is arranged in a protected and space-saving manner in the card body of the card-shaped data carrier.

[0013] The plurality of layers of the card body comprises at least one first plastic layer and at least one ceramic layer. For example, two ceramic layers can be provided, which can be provided in particular as layers located outside the card body. The advantage is that the ceramic layer provides, for example, protection against scratches on the surface of the card-shaped data carrier, because the ceramic layer is usually very hard. In addition, the ceramic layer located outside protects the plastic layer from the influence of chemical materials, such as the influence of acids or bases, because the ceramic layer is insensitive to the influence of chemical materials. For example, the electronic device can be arranged in or on the plastic layer. Another advantage is that when the card-shaped data carrier, for example, falls on a hard ground, the ceramic layer is usually used as an acoustic authenticity feature. In addition, a plurality of plastic layers can be preferably provided, which are especially arranged inside the card body. In the scope of the present application, the ceramic layer comprises ceramics or ceramic materials.

[0014] The present invention has the advantage that by using a brittle plastic layer, the fracture characteristics of the card body can be defined or set, and thus the fracture characteristics of the card-shaped data carrier can be defined or set. The brittle plastic of the plastic layer cooperates with the ceramic hard material of the ceramic layer to achieve a brittle fracture of the card body or the card-shaped data carrier as a whole when there is an external load. In particular, brittle fracture refers to a sudden material failure. In other words, the card-shaped data carrier can be visible and obviously broken for the user. For example, the card-shaped data carrier can be clearly broken into two halves due to the brittle fracture. It has the advantage that the user can immediately recognize that the card-shaped data carrier has broken and the user can immediately start to handle the card-shaped data carrier accordingly carefully. In particular, a clearly identifiable larger split or fracture of the card-shaped data carrier can be achieved by brittle fracture, thereby avoiding the occurrence of multiple small, difficult to identify and sharp-edged cracks or fracture positions. Therefore, the risk of injury to the user can be significantly reduced by setting the fracture characteristics.

[0015] Preferably, it can be provided that the brittle plastic can be formed by a plastic having an elongation at break of at least 0.1% and at most 50%, in particular at least 0.1% and at most 20%, preferably 15%. In the scope of the present application, the elongation at break represents the longitudinal elongation of the corresponding material, in particular the plastic, expressed in %. In other words, the elongation at break describes the deformation capacity as a material characteristic. The elongation at break can preferably be used to distinguish between brittle materials and elastic materials. Brittle materials preferably have a low elongation at break, while elastic materials can have a high elongation at break. In particular, brittle materials will only have a slight longitudinal elongation before the material cracks or breaks. This can be especially due to the fact that brittle materials generally have a high hardness and therefore the brittle materials can only be deformed or stretched to a small extent. Due to the small elongation at break, the brittle fracture of the card-shaped data carrier can be advantageously achieved.

[0016] Preferably, it can be provided that the brittle plastic consists of a plastic having a tensile strength of at least 50 MPa, in particular 70 MPa. In the context of the present application, the tensile strength (in particular the tear strength) can describe the maximum mechanical tensile stress that a material can withstand. In other words, the tensile strength can describe the load-bearing capacity as a characteristic of the material. Advantageously, the brittle plastic can have a high tensile strength. This is in particular because brittle materials generally have a high hardness and therefore also a high load-bearing capacity.

[0017] Advantageously, it can be provided that the brittle plastic consists of a plastic having an elastic modulus of at least 500 MPa. In the context of the present application, the elastic modulus can be considered as a characteristic value, which indicates the extent to which a material can yield to deformation under the action of an external force. In other words, the elastic modulus can indicate the magnitude of the resistance to deformation. In particular, under the same load, elastic materials can yield to a greater extent than hard and brittle materials. In other words, elastic plastics can have a lower resistance to deformation than brittle plastics. In other words, elastic plastics therefore have a low elastic modulus and brittle plastics have a high elastic modulus.

[0018] In summary, it can be determined that the material characteristics elongation at break, tensile strength and modulus of elasticity describe the brittle material characteristics of the plastic and can overall contribute to the brittle fracture of the card-shaped data carrier, which advantageously reduces the risk of injury to the user of the card-shaped data carrier.

[0019] In a particularly preferred embodiment, it can be provided that the brittle plastic is formed by polystyrene or light-modified PVC plastic or high-crystalline plastic. For example, polystyrene can have a tensile strength of about 55 MPa, an elongation at break of about 3%, and an elastic modulus of about 3200 MPa. It is generally conceivable that other brittle plastics are used for the first plastic layer. It is also conceivable that the plastic is brittle by high temperature or the introduction of light or ultraviolet radiation. In particular, the chain length of the plastic molecules can play a role here. For example, in very hot extrusion, the chain length of the molecules can be reduced by chain splitting. The shorter the chain length of the molecules, the more brittle the material. It is also possible to reduce the chain length by chain splitting by introducing light or ultraviolet radiation. Preferably, a mean molar mass distribution of up to 20,000 g / mol is set for the brittle plastic. The molar mass distribution can preferably be analyzed by gel permeation chromatography (GPC).

[0020] It is also conceivable that the ceramic layer is preferably designed to be transparent. This has the advantage that the design or text arranged at or on the plastic layer can be easily recognized from the outside.

[0021] Preferably, it can be provided that the ceramic layer is connected to the first plastic layer via an adhesive. The advantage of connecting the plastic layer to the ceramic layer via an adhesive is that the adhesive is easy to process and can preferably achieve a permanent connection. The ceramic layer can, for example, be arranged separately on the plastic layer and bonded thereto.

[0022] Alternatively or additionally, it can be provided that the card body has at least one second plastic layer, wherein the second plastic layer is formed by an elastic plastic. In the scope of the present application, the terms "second plastic layer" and "elastic plastic" can be used similarly. In other words, the second plastic layer can also be referred to as an elastic plastic layer or an elastic plastic in the scope of the present application. The use of elastic plastic has the advantage that, for example, ceramic fragments of brittle fracture of a ceramic layer and a brittle plastic layer can be connected to the elastic plastic layer. As described above, the ceramic layer and the brittle plastic layer can be broken into two halves due to brittle fracture, but these broken halves can remain on the elastic plastic layer. In particular, the advantage that can be achieved thereby is that the broken layer remains attached to the elastic plastic layer and does not fall apart from each other. Therefore, it is particularly possible to avoid that the scattered ceramic pieces fall and injure the user when the card-shaped data carrier breaks. Therefore, the elastic plastic layer also helps to set the fracture characteristics of the card-shaped data carrier. In other words, the specific fracture characteristics of the card-shaped data carrier can be achieved.

[0023] Preferably, the elastic plastic consists of a plastic which has an elongation at break of at least 100%, preferably 500%. The elastic material preferably has a high elongation at break. In particular, the elastic material has a very large longitudinal elongation before the material cracks or breaks. Due to the high elongation at break, the effect can be advantageously achieved, namely that in the case of brittle fracture, the broken ceramic layer and the broken brittle plastic layer can be connected to the elastic plastic layer.

[0024] Advantageously, provision can be made that the elastic plastic consists of a plastic which has a tensile strength of at most 50 MPa, in particular 20 MPa. In particular, the elastic plastic can have a lower tensile strength than a brittle plastic.

[0025] Furthermore, it can be preferably provided that the elastic plastic consists of a plastic having a modulus of elasticity of at most 200 MPa, in particular 100 MPa. Since elastic materials in particular yield more strongly than hard and brittle materials, the elastic plastic advantageously has a lower resistance to deformation and therefore a lower modulus of elasticity.

[0026] Preferably, the elastic plastic is composed of a thermoplastic elastomer, in particular a thermoplastic polyurethane or a thermoplastic polyester. For example, a thermoplastic polyurethane can have a tensile strength of about 45 MPa, an elongation at break of about 300% and an elastic modulus of about 15 MPa. It is generally conceivable that other elastic plastics are used for the second plastic layer. For example, vulcanized materials can also be used. Generally, the elastic plastic can have a relatively large chain length of the plastic molecules. The longer the chain length of the molecule, the more elastic the material. Preferably, a minimum average molar mass distribution of 20,000 g / mol is set for the elastic plastic.

[0027] In a particularly preferred embodiment, it is provided that the card body is composed of a plurality of layers, wherein the layer sequence comprises an external ceramic layer, an adhesive, a first plastic layer, a second plastic layer, another first plastic layer, another adhesive and another external ceramic layer. In other words, the second plastic layer with elastic plastic can be provided as an internal or centrally arranged layer of the card body. For example, the first plastic layer with brittle plastic is respectively arranged on two opposite surfaces of the second plastic layer. In other words, the second plastic layer is arranged between the two first plastic layers. The ceramic layer is arranged on the corresponding first plastic layer by an adhesive. Therefore, the ceramic layer can form an external layer of the card body. The internal plastic layer is used to set the fracture characteristics of the card body or the card-shaped data carrier. As described above, the two first plastic layers with brittle plastic lead to brittle fracture in particular. The centrally arranged second plastic layer with elastic plastic can ensure that the fractured layer remains on the elastic plastic layer.

[0028] The present invention is described below by way of example within the scope of the embodiments with reference to the accompanying drawings. Of course, as long as it makes technical sense, some features of the embodiments can be combined with each other arbitrarily without departing from the scope of the present invention. Elements with the same function and mode of action are provided with the same reference numerals in the drawings. In the drawings:

[0029] Figure 1 A perspective exploded view showing a card-shaped data carrier according to an embodiment of the present invention;

[0030] Figure 2 Show according to Figure 1 a cross section of a card-shaped data carrier having defined breaking properties;

[0031] Figure 3 shows a perspective exploded view of a card-shaped data carrier according to another embodiment of the present invention;

[0032] Figure 4 Show according to Figure 3 A cross section of a card-shaped data carrier having defined breaking properties.

[0033] Figure 1 A perspective exploded view of a card-shaped data carrier 10 according to an embodiment of the present invention is shown. The card-shaped data carrier 10 is, for example, configured as a smart card.

[0034] For example, the card-shaped data carrier 10 includes an electronic chip module (not shown) with at least one chip (not shown) and a contact structure (not shown). In particular, contact-based data transmission can be achieved with the chip module. In particular, other components for contactless data transmission can be provided.

[0035] Furthermore, the card-shaped data carrier 10 comprises a card body 20 with a not shown arrangement region for accommodating a chip module, wherein the chip module is arranged in the arrangement region of the card body 20 .

[0036] In addition, the card body 20 has a plurality of layers. For example, a first plastic layer 21 and two ceramic layers 23 are provided. The first plastic layer 21 is arranged inside or in the center of the card body 20. The two ceramic layers 23 are arranged on the outside of the card body 20. In other words, the first plastic layer 21 is arranged between the ceramic layers 23. The ceramic layers 23 are connected to the first plastic layer 21 by adhesives 24, respectively. In addition, the ceramic layers 23 are configured to be transparent, for example. In addition, the ceramic layer 23 located outside protects the first plastic layer 21 from the influence of chemical materials, such as the influence of acids or alkalis. Therefore, for example, the chip module can be preferably arranged in the first plastic layer 21 or on the first plastic layer.

[0037] For example, it is provided that the first plastic layer 21 is formed of a brittle plastic to set the fracture characteristics of the card-shaped data carrier 10. Preferably, the brittle plastic is made of polystyrene. For example, polystyrene can have a tensile strength of about 55 MPa, a breaking elongation of about 3%, and an elastic modulus of about 3200 MPa.

[0038] The use of a first plastic layer 21 with a brittle plastic has the advantage that the fracture behavior of the card body 20 and thus the card-shaped data carrier 10 under external loads can be defined or set. The brittle plastic of the plastic layer 21 cooperates with the ceramic hard material of the ceramic layer 23 to achieve a brittle fracture of the card body 20 or the card-shaped data carrier 10 as a whole under external loads. This brittle fracture can be achieved, for example, in Figure 2 Shown in.

[0039] Figure 2 Show according to Figure 1 The cross section of the card-shaped data carrier 10 has a defined fracture behavior or a brittle fracture. For example, the card-shaped data carrier 10 breaks visibly and obviously to the user. In particular, due to the brittle fracture, the card-shaped data carrier 10 breaks in two visibly. In other words, a complete crack occurs in the vertical direction through the card body 20.

[0040] The provision of a fracture characteristic or the realization of a brittle fracture of the card body 20 has the advantage that the user can immediately recognize that the card-shaped data carrier 10 has broken and can immediately start to handle the card-shaped data carrier 10 accordingly with care. In particular, the brittle fracture can avoid the occurrence of a plurality of small, difficult to recognize and sharp-edged cracks or fracture locations. Thus, the risk of injury to the user can be significantly reduced by providing a fracture characteristic.

[0041] Figure 3A perspective exploded view of a card-shaped data carrier 10 according to a further embodiment of the invention is shown. The card-shaped data carrier 10 is provided as a smart card, for example.

[0042] For example, the card-shaped data carrier 10 includes an electronic chip module (not shown) with at least one chip (not shown) and a contact structure (not shown). In particular, contact-based data transmission can be achieved with the chip module. In particular, other components for contactless data transmission can be provided.

[0043] Furthermore, the card-shaped data carrier 10 comprises a card body 20 with a not shown arrangement region for accommodating a chip module, wherein the chip module is arranged in the arrangement region of the card body 20 .

[0044] In addition, the card body 20 has a plurality of layers. For example, two first plastic layers 21, a second plastic layer 22 and two ceramic layers 23 are provided. The second plastic layer 22 is arranged inside or in the center of the card body 20. Two ceramic layers 23 are arranged outside the card body 20. The first plastic layer 21 is arranged between the second plastic layer 22 and the ceramic layer 23 located outside. The ceramic layers 23 are connected to the first plastic layer 21 by adhesives 24, respectively.

[0045] In other words, the layer sequence of the card body 20 comprises an outer ceramic layer 23 , an adhesive 24 , a first plastic layer 21 , a second plastic layer 22 , a further first plastic layer 21 , a further adhesive 24 and a further outer ceramic layer 23 .

[0046] Furthermore, the ceramic layer 23 is, for example, transparent. Furthermore, the outer ceramic layer 23 protects the plurality of first plastic layers 21 from the influence of chemical materials, such as acids or bases. Thus, for example, the chip module can be preferably arranged in one of the plurality of first plastic layers 21 or on one of the plurality of first plastic layers 21.

[0047] For example, it is provided that the plurality of first plastic layers 21 are respectively formed of brittle plastics for setting the fracture characteristics of the card-shaped data carrier 10. Preferably, the brittle plastics are made of polystyrene. For example, polystyrene may have a tensile strength of about 55 MPa, a breaking elongation of about 3%, and an elastic modulus of about 3200 MPa.

[0048] Furthermore, it is provided that the second plastic layer 22 is made of an elastic plastic. Preferably, the elastic plastic is made of thermoplastic polyurethane. For example, thermoplastic polyurethane may have a tensile strength of approximately 45 MPa, an elongation at break of approximately 300%, and an elastic modulus of approximately 15 MPa.

[0049] The use of an elastic plastic for the second plastic layer 22 has the advantage that ceramic fragments resulting from brittle fractures of the ceramic layer 23 and the brittle plastic layer 21, for example caused by external loads, can be attached to the centrally arranged elastic plastic layer 22. Figure 1 As described above, the plurality of ceramic layers 23 and the plurality of brittle first plastic layers 21 may be broken into two halves due to brittle fracture, but these broken halves may remain on the elastic plastic layer 22. This is for example Figure 4 Shown in. Figure 4 Here, according to Figure 3 A cross section of a card-shaped data carrier 10 having defined breaking properties.

[0050] In particular, the broken layers 21, 23 can remain attached to the elastic second plastic layer 22 and do not fall apart from each other. In particular, it can be avoided that the broken ceramic pieces fall and injure the user when the card-shaped data carrier 10 breaks. Therefore, the elastic second plastic layer 22 is used to set the breaking properties of the card-shaped data carrier 10. Therefore, the risk of injury to the user can be further reduced by setting the breaking properties.

[0051] Reference numerals list

[0052] 10Card-shaped data carrier

[0053] 20 card body

[0054] 21 First plastic layer

[0055] 22 Second plastic layer

[0056] 23 ceramic layers

[0057] 24 Adhesives

Claims

1. A card-shaped data carrier (10), in particular a smart card, comprising an electronic chip module with at least one chip and a contact structure and a card body (20) with an arrangement area for accommodating the chip module, wherein: The chip module is arranged in an arrangement region of a card body (20), wherein the card body (20) has at least one first plastic layer (21) and at least one ceramic layer (23). The invention is characterized in that the first plastic layer (21) is formed of brittle plastic and is used to set the breaking characteristics of the card-shaped data carrier (10).

2. The card-shaped data carrier (10) according to claim 1, characterized in that The brittle plastic is formed from a plastic which has an elongation at break of at least 0.1% and at most 50%, in particular at least 0.1% and at most 20%, preferably 15%.

3. Card-shaped data carrier (10) according to one of the preceding claims, characterized in that The brittle plastic consists of a plastic which has a tensile strength of at least 50 MPa, in particular 70 MPa.

4. Card-shaped data carrier (10) according to one of the preceding claims, characterized in that The brittle plastic consists of a plastic which has a modulus of elasticity of at least 500 MPa.

5. Card-shaped data carrier (10) according to one of the preceding claims, characterized in that The brittle plastic is formed of polystyrene or light-modified PVC plastic or highly crystalline plastic.

6. Card-shaped data carrier (10) according to one of the preceding claims, characterized in that The ceramic layer (23) is designed to be transparent.

7. Card-shaped data carrier (10) according to one of the preceding claims, characterized in that The ceramic layer (23) is connected to the first plastic layer (21) via an adhesive (24).

8. Card-shaped data carrier (10) according to one of the preceding claims, characterized in that The card body (20) has at least one second plastic layer (22), wherein the second plastic layer (22) is formed from an elastic plastic.

9. The card-shaped data carrier (10) according to claim 8, characterized in that The elastic plastic consists of a plastic which has an elongation at break of at least 100%, preferably 500%.

10. The card-shaped data carrier (10) according to claim 8, characterized in that The elastic plastic consists of a plastic which has a tensile strength of at most 50 MPa, in particular 20 MPa.

11. Card-shaped data carrier (10) according to one of claims 8 to 10, characterized in that The elastic plastic consists of a plastic which has a modulus of elasticity of at most 200 MPa, in particular 100 MPa.

12. Card-shaped data carrier (10) according to one of claims 8 to 11, characterized in that The elastic plastic consists of a thermoplastic elastomer, in particular a thermoplastic polyurethane or a thermoplastic polyester.

13. Card-shaped data carrier (10) according to one of claims 8 to 12, characterized in that The card body (20) is composed of a plurality of layers, wherein the layer sequence comprises an outer ceramic layer (23), an adhesive (24), a first plastic layer (21), a second plastic layer (22), a further first plastic layer (21), a further adhesive (24) and a further outer ceramic layer (23).

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