Apparatus and method for manufacturing display device

Abstract

An apparatus for manufacturing a display device includes: a platform on which a substrate of the display device is disposed; a mold including a surface including a recess; an application device that applies ink including a light emitting element to a surface of the mold; a scraper that retains the ink placed in the recess of the mold and removes the ink placed on the surface of the mold; and a laminating device that laminates the surface of the mold to the substrate.

Description

Technical Field

[0001] Embodiments relate to an apparatus for manufacturing a display device and a method of manufacturing the display device. Background Art

[0002] Recently, as interest in information display increases, research and development of display devices have been ongoing. Summary of the invention

[0003] Technical issues

[0004] The embodiment provides an apparatus for manufacturing a display device, which can efficiently and accurately dispose a light emitting element on a substrate of the display device by using a mold including recesses corresponding to the arrangement of the light emitting element and removing ink on a surface of the mold by using a scraper.

[0005] The embodiment provides a method of manufacturing a display device by using an apparatus.

[0006] However, the embodiments are not limited to those set forth herein. The above and other embodiments will become more apparent to those of ordinary skill in the art to which the disclosure pertains by referring to the detailed description of the disclosure given below.

[0007] Technical Solution

[0008] In an embodiment, an apparatus for manufacturing a display device may include: a platform on which a substrate of the display device is disposed; a mold including a surface including a recess; an ejector to apply ink including a light-emitting element to the surface of the mold; a scraper to remove the ink applied to the surface of the mold and retain the ink disposed in the recess of the mold; and a compressor to compress the surface of the mold to the substrate.

[0009] A depth of each of the recesses may be greater than a diameter of each of the light emitting elements, and a depth of each of the recesses may be less than about 1.5 times the diameter of each of the light emitting elements.

[0010] Each of the recesses may include an alignment hole filled with at least one of the light emitting elements.

[0011] The length of the alignment hole in the first direction may be greater than the length of each of the light emitting elements, the width of the alignment hole in a second direction intersecting the first direction may be greater than the diameter, and the width of the alignment hole in the second direction may be less than about 1.5 times the diameter.

[0012] The recesses may be provided in the first direction and the second direction, and the recesses may be provided in a shape in which the light emitting elements are aligned on the substrate.

[0013] The scraper may scrape the ink in one direction on the surface of the mold, and the light emitting element may be provided in the form of an alignment recess.

[0014] The lower surface of the alignment hole may be substantially flat.

[0015] The alignment hole may include a curved surface or an inclined surface.

[0016] Each of the recesses may also include a stepped portion or an inclined surface adjacent to the alignment hole.

[0017] The apparatus may further include a dryer to evaporate and remove a solvent of the ink remaining on the surface of the mold or on the surface of the substrate.

[0018] The apparatus may further include a vibrator to vibrate the substrate or the mold to which the ink is applied.

[0019] The vibrator may be configured to vibrate the mold by generating sound waves or ultrasonic waves, and at least one of the light emitting elements may be filled in each of the recesses by the vibrator.

[0020] With the mold and the substrate separated, the vibrator may be configured to vibrate the substrate.

[0021] The apparatus may further include an electric field generator to fix a position of each of the light emitting elements by applying an electric field to the substrate in a state where the mold and the substrate are separated.

[0022] In an embodiment, a method for manufacturing a display device may include the following steps: applying ink including a light-emitting element to a surface including a recess of a mold; removing the ink disposed on the surface of the mold by using a scraper and retaining the ink disposed in the recess of the mold; compressing the mold to a substrate of the display device to dispose the light-emitting element on an electrode formed on the substrate; and separating the mold separated from the light-emitting element from the substrate.

[0023] The step of removing the ink may include: aligning the light emitting element by scraping the surface of the mold with a scraper; and removing a solvent of the ink remaining on the surface of the mold by irradiating light to the surface of the mold.

[0024] The step of removing the ink may include: vibrating the mold by using a vibrator so that at least one of the light emitting elements is filled in each of the recesses; aligning the light emitting elements by scraping the surface of the mold with a scraper; and removing the solvent of the ink remaining on the surface of the mold by irradiating light to the surface of the mold.

[0025] The step of separating the mold from the substrate may include: fixing the light emitting element on the electrode by applying an electric field on the substrate using an electric field generator; and separating the mold from the substrate by moving the mold in a vertical direction.

[0026] The step of separating the mold from the substrate may further include removing a solvent of the ink remaining on the surface of the substrate by irradiating light onto the substrate separated from the mold.

[0027] The step of separating the mold from the substrate may include: fixing the light emitting element on the electrode by applying an electric field on the substrate using an electric field generator; applying vibration to the substrate by a vibrator; and separating the mold from the substrate by moving the mold in a vertical direction.

[0028] Beneficial Effects

[0029] The apparatus for manufacturing a display device and the method for manufacturing a display device according to the embodiment can arrange the pre-set light-emitting element on the electrode on the substrate by using the arrangement of the concave portion of the mold. Therefore, the misalignment of the light-emitting element can be greatly reduced. Therefore, product defects can be reduced, and alignment reliability and manufacturing yield can be improved.

[0030] However, the effects of the disclosure are not limited to the above-mentioned effects and may be variously extended without departing from the spirit and scope of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 is a schematic perspective view showing a light emitting element according to an embodiment.

[0032] Figure 2 It is shown Figure 1 Schematic cross-sectional view of an example of a light emitting element.

[0033] Figure 3 is a schematic plan view showing a display device according to an embodiment.

[0034] Figure 4 It is shown that the Figure 3 Schematic diagram of an example of a pixel in a display device.

[0035] Figure 5 is a schematic diagram illustrating an apparatus for manufacturing a display device according to an embodiment.

[0036] Figure 6a It is shown that the Figure 5 A schematic cross-sectional view of an example of a portion of a mold in an apparatus.

[0037] Figure 6b It is shown Figure 6a A plan view of an example of a portion of a mold.

[0038] Figures 7 to 12 It is shown that the Figure 5 Schematic cross-sectional views of other examples of a portion of a mold in an apparatus.

[0039] Fig.13 It is shown Figure 5 A schematic diagram of another example of an apparatus for manufacturing a display device.

[0040] Fig.14 It is shown Figure 5 A schematic diagram of yet another example of an apparatus for manufacturing a display device.

[0041] Fig.15 It is shown Figure 5 A schematic diagram of yet another example of an apparatus for manufacturing a display device.

[0042] Figures 16 to 25 is a schematic diagram illustrating a method of manufacturing a display device according to an embodiment.

[0043] Fig.26 It is shown Fig.25 Schematic diagram of an example of a process of separating a substrate from a mold.

[0044] Fig. 27 It is shown Fig.25 Schematic diagram of another example of a process of separating a substrate from a mold.

[0045] Fig.28 is a schematic diagram illustrating an example of a process of removing a solvent of ink. DETAILED DESCRIPTION

[0046] Hereinafter, the disclosed preferred embodiments will be described in more detail with reference to the accompanying drawings. In the accompanying drawings, the same reference numerals are used for the same components, and repeated description of the same components is omitted.

[0047] Since the embodiments described in this specification are intended to clearly describe the spirit of the disclosure to those skilled in the art, the disclosure is not limited to the embodiments described in this specification, and the scope of the disclosure should be interpreted as including modifications or changes that do not depart from the spirit of the disclosure.

[0048] The drawings related to this specification are intended to facilitate the description of the disclosure. Since the shapes shown in the drawings may be exaggerated and displayed as needed to help understand the disclosure, the disclosure is not limited by the drawings.

[0049] In this specification, when it is determined that a detailed description of a known configuration (configuration) or function related to the disclosure may obscure the subject matter of the disclosure, the detailed description thereof will be omitted as necessary.

[0050] Figure 1 is a schematic perspective view showing a light emitting element LD according to the embodiment, Figure 2 It is shown Figure 1 A schematic cross-sectional view of an example of a light emitting element LD.

[0051] In the embodiment, the type and / or shape of the light emitting element LD is not limited to Figure 1 and Figure 2 The embodiment shown in .

[0052] Reference Figure 1 and Figure 2 , the light emitting element LD may include a first semiconductor layer 11, a second semiconductor layer 13, and an active layer 12 disposed between the first semiconductor layer 11 and the second semiconductor layer 13. For example, the light emitting element LD may be implemented as a light emitting stack (or stacking pattern) in which the first semiconductor layer 11, the active layer 12, and the second semiconductor layer 13 are sequentially stacked.

[0053] The light emitting element LD may be formed into a shape extending in one direction. In the case where the extending direction of the light emitting element LD is referred to as a length direction, the light emitting element LD may include a first end portion EP1 and a second end portion EP2 along the length direction. One of the first semiconductor layer 11 and the second semiconductor layer 13 may be located at the first end portion EP1 of the light emitting element LD, and the other of the first semiconductor layer 11 and the second semiconductor layer 13 may be located at the second end portion EP2 of the light emitting element LD. For example, the second semiconductor layer 13 may be located at the first end portion EP1 of the light emitting element LD, and the first semiconductor layer 11 may be located at the second end portion EP2 of the light emitting element LD.

[0054] The light emitting element LD can be formed in various shapes. Figure 1 As shown in , the light emitting element LD may have a rod-like shape, a strip-like shape, or a column-like shape that is long in the length direction (or has an aspect ratio greater than 1). As another example, the light emitting element LD may have a rod-like shape, a strip-like shape, or a column-like shape that is short in the length direction (or has an aspect ratio less than 1). As yet another example, the light emitting element LD may have a rod-like shape, a strip-like shape, or a column-like shape with an aspect ratio of 1. In another example, the diameter D of the first end portion EP1 may be different from the diameter D of the second end portion EP2.

[0055] The light emitting element LD may have, for example, a diameter D of about nanometer order (or nanometer) to micrometer order (or micrometer) and / or a length L. For example, the light emitting element LD may be a light emitting diode (LED) type.

[0056] For example, the first semiconductor layer 11 may include at least one n-type semiconductor layer. For example, the first semiconductor layer 11 may include any semiconductor material among InAlGaN, GaN, AlGaN, InGaN, AlN, and InN, and may be an n-type semiconductor layer doped with a first conductive dopant (or n-type dopant) such as Si, Ge, or Sn. However, the material of the first semiconductor layer 11 is not limited thereto, and other various materials may be used to form the first semiconductor layer 11.

[0057] The active layer 12 may be disposed on the first semiconductor layer 11 and may be formed as a single quantum well structure or a multiple quantum well structure. For example, in the case where the active layer 12 is formed as a multiple quantum well structure, in the active layer 12, the barrier layer, the strain enhancement layer, and the well layer may be periodically and repeatedly stacked as a single unit. The strain enhancement layer may have a lattice constant smaller than that of the barrier layer to further enhance the strain (e.g., compressive strain) applied to the well layer. However, the structure of the active layer 12 is not limited to the above-described embodiments.

[0058] The active layer 12 may emit light having a wavelength of about 400 nm to about 900 nm, and a double heterostructure may be used. In an embodiment, a cladding layer doped with a conductive dopant may be formed on the active layer 12 and / or below the active layer 12 along the length direction of the light emitting element LD. For example, the cladding layer may be formed of an AlGaN layer, an InAlGaN layer, a GaAs layer, or the like. According to an embodiment, materials such as AlGaN, InAlGaN, GaAs, or the like may be used to form the active layer 12, and various other materials may be used to form the active layer 12. The active layer 12 may include a first surface contacting the first semiconductor layer 11 and a second surface contacting the second semiconductor layer 13.

[0059] In an embodiment, the color (or output light color) of the light emitting element LD may be determined according to the wavelength of light emitted from the active layer 12. The color of the light emitting element LD may determine the color of the corresponding pixel. For example, the light emitting element LD may emit red light, green light, or blue light.

[0060] When a (specific) voltage or a higher electric field is applied to ends (e.g., opposite ends) of the light emitting element LD, the light emitting element LD can emit light by combining electron-hole pairs performed in the active layer 12. By controlling the light emission of the light emitting element LD, the light emitting element LD can be used as a light source (or light emitting source) of various light emitting devices including pixels of a display device.

[0061] The second semiconductor layer 13 may be disposed on the second surface of the active layer 12. The first semiconductor layer 11 and the second semiconductor layer 13 may include different kinds of semiconductor layers. For example, the second semiconductor layer 13 may include at least one p-type semiconductor layer. For example, the second semiconductor layer 13 may include at least one semiconductor material among InAlGaN, GaN, AlGaN, InGaN, AlN and InN, and may include a p-type semiconductor layer doped with a second conductive dopant (or p-type dopant) such as Mg, Zn, Ca, Sr or Ba. However, the material of the second semiconductor layer 13 is not limited thereto, and various other materials may be used to form the second semiconductor layer 13.

[0062] Although the first semiconductor layer 11 and the second semiconductor layer 13 are shown as a single layer, the embodiment is not limited thereto. In an embodiment, each of the first semiconductor layer 11 and the second semiconductor layer 13 may further include at least one or more layers (e.g., a cladding layer and / or a tensile strain barrier reduction (TSBR) layer) depending on the material of the active layer 12. The TSBR layer may be a strain relief layer disposed between semiconductor layers having different lattice structures and used as a buffer for reducing the lattice constant difference. The TSBR layer may be formed of a p-type semiconductor layer such as p-GaInP, p-AlInP, and p-AlGaInP, but the embodiment is not limited thereto.

[0063] According to an embodiment, in addition to the above-mentioned first semiconductor layer 11, active layer 12 and second semiconductor layer 13, the light emitting element LD may further include a contact electrode (hereinafter referred to as a "first contact electrode") disposed on the second semiconductor layer 13. According to an embodiment, the light emitting element LD may further include another contact electrode (hereinafter referred to as a "second contact electrode") disposed at an end portion of the first semiconductor layer 11.

[0064] In an embodiment, the light emitting element LD may further include an insulating layer (or insulating film) 14. In another example, the insulating layer 14 may be omitted. In another example, the insulating layer 14 may only cover a portion of the first semiconductor layer 11, the active layer 12, and the second semiconductor layer 13.

[0065] The insulating layer 14 may prevent an electrical short circuit that may occur if the active layer 12 contacts a conductive material other than the first semiconductor layer 11 and the second semiconductor layer 13 .

[0066] The insulating layer 14 may include a transparent insulating material. The insulating layer 14 may be formed in the form of a single layer, or may be formed in the form of a multi-layer including a double layer.

[0067] The above-mentioned light emitting element LD can be used as a light source (or light source) of various display devices. The light emitting element LD can be manufactured by a surface treatment process. For example, in the case where the light emitting element LD is mixed in a fluid solution (or solvent) and supplied to each pixel area (for example, the emission area of ​​each pixel or the emission area of ​​each sub-pixel), each of the light emitting elements LD can be subjected to surface treatment so that the light emitting element LD can be uniformly sprayed without unevenly agglomerating in the solution.

[0068] The above-mentioned light emitting element LD can be used for various types of electronic devices including display devices that require light sources. For example, the light emitting element LD can be used as a light source for each pixel. However, the application field of the light emitting element LD is not limited to the above examples. For example, the light emitting element LD can be used for other types of electronic devices that require light sources such as lighting devices.

[0069] Figure 3 is a schematic plan view showing a display device DD according to the embodiment.

[0070] The display device DD may be applied to at least one surface of an electronic device such as a smartphone, TV, tablet PC, video phone, e-book reader, desktop PC, laptop PC, workstation, server, PDA, medical device, camera, or wearable device.

[0071] Reference Figure 1 , Figure 2 and Figure 3 The display device DD may include a substrate SUB, a pixel PXL formed on the substrate SUB and including at least one light emitting element LD, a driver disposed on the substrate SUB and driving the pixel PXL, and a line unit connecting the pixel PXL and the driver.

[0072] The substrate SUB may include a display area DA and a non-display area NDA.

[0073] The display area DA may be a region in which pixels PXL displaying an image are disposed. The non-display area NDA may be a region in which a driver and a portion of a line unit connecting the pixels PXL to the driver are disposed.

[0074] The non-display area NDA may be adjacent to the display area DA. The non-display area NDA may be disposed at least one side of the display area DA.

[0075] The line unit may provide a signal to the pixel PXL, and may include a scan line, a data line, an emission control line, and a fan-out line connected to each of the scan line, the data line, and the emission control line.

[0076] The substrate SUB may include a transparent insulating material to transmit light. The substrate SUB may be a rigid substrate or a flexible substrate.

[0077] The pixel PXL may be one of a red pixel, a green pixel, and a blue pixel. The red pixel, the green pixel, and the blue pixel may be provided (arranged) in combination in the display area DA. However, the embodiment is not limited thereto, and each of the pixels PXL may emit light of a color other than red, green, and blue. For example, the pixel PXL may emit white light.

[0078] The pixel PXL may include a light emitting element LD. The light emitting element LD may have a size as small as a nanometer level (or nanometer) to a micrometer level (or micrometer). The light emitting element LD may be used to form a light source of the pixel PXL.

[0079] Figure 4 It is shown that the Figure 3 Schematic diagram of an example of a pixel PXL in a display device DD.

[0080] exist Figure 4 In the figure, for the convenience of description, the circuit for driving the light emitting element LD of the pixel PXL is omitted. Figure 4 A part of the emission area EMA of the pixel PXL is schematically shown.

[0081] Reference Figure 1 , Figure 2 and Figure 4 , the pixel PXL may include a region defined as an emission area EMA that emits light of a (specific) color. The emission area EMA may be a region in which a light emitting element LD for emitting light of a specific wavelength band is disposed.

[0082] The pixel PXL may further include a non-emission region as a region other than the emission region EMA. The light emitting element LD may not be disposed in the non-emission region, and the non-emission region may be a region where light emitted from the light emitting element LD does not reach and thus does not emit light.

[0083] In an embodiment, the pixel PXL may include a first electrode ELT1, a second electrode ELT2, and a light emitting element LD.

[0084] The first electrode ELT1 and the second electrode ELT2 may be spaced apart from each other. The first electrode ELT1 and the second electrode ELT2 may be connected (e.g., electrically connected) to the light emitting element LD. For example, the first electrode ELT1 may be connected (e.g., electrically connected) to a first end EP1 of the light emitting element LD, and the second electrode ELT2 may be connected (e.g., electrically connected) to a second end EP2 of the light emitting element LD.

[0085] One of the first electrode ELT1 and the second electrode ELT2 may be an anode electrode of the light emitting element LD, and the other may be a cathode electrode of the light emitting element LD. For example, different power sources may be connected (eg, electrically connected) to the first electrode ELT1 and the second electrode ELT2.

[0086] In an embodiment, each of the first electrode ELT1 and the second electrode ELT2 may extend in the second direction DR2 in the emission area EMA.

[0087] The first electrode ELT1 and the second electrode ELT2 may be formed into a single layer by a material selected from the group consisting of molybdenum (Mo), tungsten (W), aluminum neodymium (AlNd), titanium (Ti), aluminum (Al), silver (Ag) and alloys thereof, alone or in combination, or may be in a double-layer or multi-layer structure of molybdenum (Mo), titanium (Ti), copper (Cu), aluminum (Al) or silver (Ag) which is a low-resistance material for reducing line resistance.

[0088] However, this is an example, and the first electrode ELT1 and the second electrode ELT2 may include various transparent conductive materials including indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO x ), indium gallium zinc oxide (IGZO), indium tin zinc oxide (ITZO), etc.) at least one of the following.

[0089] The light emitting element LD may be disposed between the first electrode ELT1 and the second electrode ELT2. In an embodiment, the first end EP1 of the light emitting element LD may contact (e.g., directly contact) the first electrode ELT1, and the second end EP2 of the light emitting element LD may contact (e.g., directly contact) the second electrode ELT2. In another example, the first end EP1 of the light emitting element LD may be connected (e.g., electrically connected) to the first electrode ELT1 through a separate first contact electrode, and the second end EP2 of the light emitting element LD may be connected (e.g., electrically connected) to the second electrode ELT2 through a separate second contact electrode.

[0090] The light emitting elements LD may be spaced apart from each other. For example, the light emitting elements LD may be aligned parallel to each other in the emission area EMA. The distance at which the light emitting elements LD are spaced apart is not limited.

[0091] In the embodiment, the light emitting element LD may have a shape extending in the first direction DR1. However, this is an example, and the light emitting element LD may be disposed obliquely with respect to the first direction DR1.

[0092] The light emitting element LD may have a diameter D and / or a length of about nanometer to micrometer order. For example, the light emitting element LD may have a rod shape, a bar shape, or a column shape that is long in a length direction.

[0093] In a conventional method of manufacturing a display device, ink INK in which light emitting elements LD as bipolar elements are dispersed is ejected onto a substrate on which electrodes such as a first electrode ELT1 and a second electrode ELT2 are formed, and the light emitting elements LD are aligned by applying an electric signal to the electrodes. For example, a dielectrophoretic force may be transmitted to the light emitting element LD by an electric field generated by an electric signal applied to the electrodes, and each of the light emitting elements LD may be aligned on the first electrode ELT1 and the second electrode ELT2 while controlling the orientation and position of the light emitting element LD.

[0094] However, during the inkjet process, a portion of the light emitting element LD included in the ink INK may be formed in a space where the first electrode ELT1 and the second electrode ELT2 are not provided. For example, at least a portion of the light emitting element LD may contact a lower insulating layer (e.g., a dielectric layer) exposed by the first electrode ELT1 and the second electrode ELT2.

[0095] For example, an attractive force such as a van der Waals force may be generated between the light emitting element LD and a lower structure (e.g., a dielectric layer) of the first electrode ELT1 and the second electrode ELT that contacts the light emitting element LD. In the case where the attractive force affects the dielectrophoretic force, the light emitting element LD may not move or may not be aligned in an orientation at a specific position. The light emitting element LD that is not properly aligned on the first electrode ELT1 and the second electrode ELT2 may not emit light with a specific brightness, which may cause a defect in the display device DD.

[0096] Therefore, the apparatus 1000 for manufacturing the display device DD and the method of manufacturing the display device DD for improving the alignment reliability and the manufacturing yield of the light emitting element LD according to the embodiment are described.

[0097] Figure 5 is a schematic diagram illustrating an apparatus 1000 for manufacturing a display device DD according to an embodiment.

[0098] exist Figure 5 In the embodiment, a first direction DR1, a second direction DR2 and a third direction DR3 are defined. The first direction DR1 and the second direction DR2 are directions arranged in the same plane and orthogonal to each other, and the third direction DR3 is a direction perpendicular to the first direction DR1 and the second direction DR2.

[0099] exist Figure 5 In the embodiment, for the convenience of description, each of the elements of the device 1000 is schematically shown. Each of the elements can be implemented in various shapes, positional relationships, etc. to correspond to the actual manufacturing method and operation.

[0100] Reference Figure 4 and Figure 5, the apparatus 1000 for manufacturing the display device DD may include a platform 100, a mold 200, an application device (eg, a sprayer or a sprinkler) 300, a scraper 400, and a pressure application device (eg, a compressor) 500. The apparatus 1000 may further include a drying device (eg, a dryer) 600.

[0101] The platform 100 may provide an area in which a substrate SUB of the display device DD is disposed. The substrate SUB may be disposed and fixed on the platform 100. The platform 100 may be fixed, stationary, or movable according to a process method. For example, in a process of compressing the mold 200 and the substrate SUB against each other, the platform 100 may be turned over so that the upper surface of the substrate SUB faces the bottom surface (or lower surface).

[0102] The mold 200 may have a surface including a recessed portion RP. The recessed portion RP may be formed on the surface of the mold 200 to correspond to the arrangement form of the light emitting element LD. The mold 200 may include a material such as metal, ceramic, plastic, or the like.

[0103] In an embodiment, at least one light emitting element LD may be filled in each of the recesses RP. The recesses RP may be arranged in the first direction DR1 and the second direction DR2. For example, the recesses RP may be arranged in a form in which the light emitting element LD is aligned on the substrate SUB. In other words, the recesses RP may determine a form in which the light emitting element LD is aligned on the substrate SUB.

[0104] Each of the recesses RP may be filled with at least one light emitting element LD.

[0105] The applying device 300 may apply, spray, or eject the ink INK in which the light emitting elements LD are dispersed, on the surface of the mold 200. The applying device 300 may be spaced apart from the mold 200 by a (certain) distance.

[0106] In an embodiment, the application device 300 may move in the first direction DR1 and / or the second direction DR2 to eject the ink INK onto the mold 200. However, this is an example, and the application device 300 may eject the ink INK in a fixed state, and the mold 200 may move, so that the ink INK may be applied to the surface of the mold 200.

[0107] The ink INK may include a solvent SOL and a light emitting element LD contained in the solvent SOL. For example, the ink INK may further include a dispersant for uniformly dispersing the light emitting element LD in the solvent SOL. The solvent included in the ink INK may be in a liquid state or a colloid state.

[0108] The solvent SOL may include acetone, water, ethanol, toluene, propylene glycol (PG), propylene glycol methyl acetate (PGMA), etc. However, this is an example, and the solvent SOL may include propylene glycol methyl ether (PGME), dipropylene glycol methyl ether (DGME), tripropylene glycol methyl ether (TGME), propylene glycol methyl ether acetate (PGMEA), dipropylene glycol methyl ether acetate (DGMEA), propylene glycol n-propyl ether (PGPE), dipropylene glycol n-propyl ether (DGPE), propylene glycol n-butyl ether (PGBE), dipropylene glycol n-butyl ether (DGBE), tripropylene glycol n-butyl ether (TGBE), propylene glycol phenyl ether (PGPE), propylene glycol diacetate (PGD), dipropylene glycol dimethyl ether (DGDE), diethylene glycol dimethyl ether (DGDE), diethylene glycol dimethyl ether (DGDE), dipropylene ...ME), dipropylene glycol dimethyl ether (DGME), dipropylene glycol di At least one of glycol ethyl ether (DGEE), diethylene glycol methyl ether (DGME), diethylene glycol n-butyl ether (DGBE), diethylene glycol hexyl ether (DGHE), diethylene glycol n-butyl ether acetate (DGBEA), ethylene glycol propyl ether (EGPE), ethylene glycol n-butyl ether (EGBE), ethylene glycol hexyl ether (EGHE), ethylene glycol n-butyl ether acetate (EGBEA), triethylene glycol methyl ether (TGME), triethylene glycol ethyl ether (TGEE), triethylene glycol n-butyl ether (TGBE), ethylene glycol phenyl ether (EGPE) and ethylene glycol n-butyl ether mixture (EGBEM).

[0109] In an embodiment, the application device 300 may be implemented as an inkjet printing module, a dispensing module, a slit coating module, etc. For example, the application device 300 may apply, spray, or eject the ink INK on the mold 200 by using a print head. However, this is an example, and the application device 300 is not limited thereto. For example, the application device 300 may be replaced with an immersion device for immersing the surface of the mold 200 in ink.

[0110] The scraper 400 may remove the ink INK applied to a portion other than the recessed portion RP of the mold 200. The scraper 400 may have a metal or resin thin plate shape.

[0111] The scraper 400 may contact the surface of the mold 200 and move in one direction with a (specific) contact pressure. The scraper 400 may push the ink INK including the light emitting element LD into the recess RP, and at the same time scrape away the ink INK outside the recess RP. For example, the scraper 400 may remove the ink INK disposed on the surface of the mold 200, and may retain the ink disposed in the recess RP. A series of processes using the scraper 400 may include a scraper process.

[0112] In an embodiment, the length of the scraper 400 in the second direction DR2 may correspond to the length of the mold 200 in the second direction DR2. For example, the scraper 400 may contact the surface of the mold 200 and move in the first direction DR1 or in a direction opposite to the first direction DR1. For example, the contact pressure between the scraper 400 and the mold 200 may be determined (controlled) so that the scraper 400 contacts only the surface of the mold 200 except the recessed portion RP.

[0113] However, this is an example, and the material, shape, moving direction, contact pressure, angle, etc. of the scraper 400 may be determined according to the conditions of the characteristics, viscosity, material, etc. of the mold 200 .

[0114] The pressure applying device 500 may compress the surface of the mold 200 (e.g., the upper surface including the recess RP) onto the substrate SUB. The pressure applying device 500 may be located on the rear surface of the mold 200, and may pressurize the mold 200 in a state where the mold 200 and the substrate SUB are in contact with each other. Therefore, the ink INK in the recess RP and the light emitting element LD included therein may drip (or spray) onto the substrate SUB.

[0115] The drying device 600 can evaporate and remove the solvent SOL of the ink INK remaining on the surface of the mold 200 or the solvent SOL of the ink INK remaining on the substrate SUB. In an embodiment, the drying device 600 may include a light source for evaporating the solvent SOL. For example, the light source may be an infrared lamp or an infrared irradiation device. However, this is an example, and the light source may be a lamp or a light irradiation device that irradiates visible light or ultraviolet light.

[0116] In an embodiment, when the solvent SOL included in the ink INK on the mold 200 is removed, the light emitting element LD filled in the recess RP may be exposed. In another example, when the solvent SOL included in the ink INK on the substrate SUB is removed, the light emitting element LD on the first electrode ELT1 and the second electrode ELT2 may be exposed.

[0117] Figure 6a It is shown that the Figure 5 A schematic cross-sectional view of an example of a portion of a mold 200 in the apparatus 1000, Figure 6b It is shown Figure 6a Schematic plan view of an example of a portion of a mold 200.

[0118] Reference Figure 4 , Figure 5 , Figure 6a and Figure 6b , the surface of the mold 200 may include a recessed portion RP.

[0119] The recess RP may determine the position at which the light emitting element LD is disposed / arranged on the substrate SUB. For example, the light emitting element LD may be disposed on the substrate SUB to correspond to the position of the recess RP (or to overlap the position of the recess RP). The width W, length R_L, and depth H of the recess RP may be determined based on the size of the light emitting element LD. For example, the recess RP may be designed (or formed) to have a space therein in which the light emitting element LD may be disposed in a flat state.

[0120] For ease of description, Figure 6a A first recess RP1 not filled with ink INK and a second recess RP2 filled with ink INK including a light emitting element LD and a solvent SOL are shown. The shapes of the first recess RP1 and the second recess RP2 may be substantially the same. Unless otherwise specified, it is understood that the description of the recess RP also applies to the first recess RP1 and the second recess RP2.

[0121] In an embodiment, the depth H of the recess RP may be greater than the diameter D of the light emitting element LD. Therefore, the light emitting element LD placed flat and disposed in the recess RP does not protrude from the recess RP. In the case where a portion of the light emitting element LD protrudes from the recess RP, excessive friction or impact may be applied to the light emitting element LD during the scraper process, and thus damage and / or defects of the corresponding light emitting element LD may occur.

[0122] Since the diameter D of the light emitting element LD may be non-uniform, the depth H of the recess RP may be determined based on the maximum diameter D of the light emitting element LD actually used. For example, the diameter D of the light emitting element LD may be the light emitting element LD or the maximum diameter D of the light emitting element LD.

[0123] In an embodiment, the depth H of the recess RP may be less than about 1.5 times the diameter D of the light emitting element LD. In the case where the depth H of the recess RP is equal to or greater than about 1.5 times the diameter D of the light emitting element LD, the light emitting element LD may be unintentionally stacked in the recess RP. In order to prevent the light emitting element LD from stacking, the depth H of the recess RP may be less than about 1.5 times the diameter D of the light emitting element LD.

[0124] In an embodiment, the recess RP may include an alignment hole ARH and a step portion STP including a step side surface STS and a step lower surface STL. The step portion STP may be distinguished from the alignment hole ARH by a height difference between the alignment hole ARH and the step portion STP (or the step portion STP and the alignment hole ARH may be defined by a height difference between the alignment hole ARH and the step portion STP). The alignment hole ARH may be a portion in which the light emitting element LD is actually filled or disposed.

[0125] In an embodiment, Figure 6bAs shown in FIG. 1 , the length R_L of the alignment hole ARH in the first direction DR1 may be greater than the length L of the light emitting element LD. For example, since the length of the light emitting element LD may not be uniform, the length L of the light emitting element LD may be the maximum length among the actual lengths of the light emitting element LD.

[0126] In the case where the length R_L of the alignment hole ARH is less than twice the length L of the light emitting element LD, as shown in FIG. Figure 6a As shown in , only one (single) light emitting element LD may be filled in the aligning hole ARH. In the case where the length R_L of the aligning hole ARH is greater than twice the maximum length L1 of the light emitting element LD, two or more light emitting elements LD may be arranged in the aligning hole ARH in the first direction DR1.

[0127] In an embodiment, Figure 6a As shown in FIG, a width W of the alignment hole ARH in the second direction DR2 may be greater than a diameter D of the light emitting element LD and may be less than about 1.5 times the diameter D of the light emitting element LD. Therefore, only one light emitting element LD may be arranged in the alignment hole ARH with respect to the second direction DR2.

[0128] In an embodiment, the depth H1 of the alignment hole ARH may be greater than the radius (e.g., D / 2) of the light emitting element LD, and may be less than or equal to the diameter D of the light emitting element LD. Therefore, the light emitting element LD properly filled (or disposed) in the alignment hole ARH may not be detached (or moved out) from the alignment hole ARH during the scraper process.

[0129] In an embodiment, the bottom surface (or lower surface) of the alignment hole ARH may be flat. Figure 6a As shown in , the cross-section of the alignment hole ARH may have a quadrilateral shape. However, this is an example, and the cross-sectional shape of the alignment hole ARH is not limited thereto. The cross-sectional shape of the alignment hole ARH may be variously designed (or formed) according to the shape of the light emitting element LD, etc.

[0130] The step portion STP of the recess RP can assist the alignment of the light emitting element LD in the recess RP. For example, the depth H2 of the step portion STP (or the height of the step side surface STS) can be smaller than the radius of the light emitting element LD. Therefore, in the case where the light emitting element LD is supplied on the step portion STP, the removal of the corresponding light emitting element LD by the scraper 400 can be improved.

[0131] For example, Figure 6a As shown in FIG. 1 , the light emitting element LD_R initially supplied by the applying device 300 may be disposed on the step portion STP (eg, the step lower surface STL) of the second recess RP2 .

[0132] At this time, the scraper 400 may move while contacting only the surface of the mold 200 except for the recess RP including the first recess RP1 and the second recess RP2. In the case where the scraper 400 moves in the second direction DR2 while contacting the mold 200, the supplied light emitting element LD_R may come out of the step portion STP and may be removed from the second recess RP2. As described above, since the depth H2 of the step portion STP is smaller than the radius of the light emitting element LD, the supplied light emitting element LD_R disposed on the step portion STP (e.g., the step lower surface STL) may be easily removed from the step portion STP (e.g., the step lower surface STL) by the movement of the scraper 400.

[0133] For example, the scraper 400 may move in a direction opposite to the second direction DR2 while in contact with the mold 200. In the case where the light emitting element LD is not disposed in the alignment hole ARH of the second recess RP2, the supplied light emitting element LD_R may fall (or move) into the alignment hole ARH by the movement of the scraper 400, and may fill the alignment hole ARH of the second recess RP2. In the case where the light emitting element LD is disposed in the alignment hole ARH of the second recess RP2, the supplied light emitting element LD_R may move from the second recess RP2 and move to the first recess RP1. Since the ink INK has a solution state or a colloid state, friction / collision between the supplied light emitting elements LD_R in the scraper process, impact on the supplied light emitting element LD_R caused by friction between the mold 200 and the supplied light emitting element LD_R, damage caused by the impact, etc. may be prevented, mitigated, or minimized.

[0134] As described above, the light emitting elements LD may be aligned on the mold 200 according to the recesses RP periodically or non-periodically arranged in the mold 200 .

[0135] Figures 7 to 12 It is shown that the Figure 5 Schematic cross-sectional views of other examples of a portion of the mold 200 in the apparatus 1000 .

[0136] exist Figures 7 to 12 In, refer to Figure 6a and Figure 6b The same or similar components are described using the same reference numerals, and redundant descriptions are omitted for ease of description. Figures 7 to 12 The molds 200a, 200b, 200c, 200d, 200e and 200f can be Figure 6a and Figure 6b The recessed portions RP are substantially the same or similar.

[0137] Reference Figure 4 , Figure 5and Figures 7 to 12 , each of the molds 200a, 200b, 200c, 200d, 200e, and 200f may include a recessed portion RP. The recessed portion RP may be deformed or modified into various cross-sectional shapes.

[0138] In an embodiment, the depth H of the recess RP may be greater than the diameter D of the light emitting element LD and less than about 1.5 times the diameter D of the light emitting element LD.

[0139] In an embodiment, Figure 7 As shown in FIG. 4 , the recess RP may include an align hole ARH which may be filled with at least one light emitting element LD and a step portion STP spaced apart from (or adjacent to) the align hole ARH.

[0140] The step portion STP (e.g., the step side surface STS and the step lower surface STL) of the recess RP can assist the alignment of the light emitting element LD in the recess RP. For example, the depth H2 of the step portion STP can be smaller than the radius of the light emitting element LD. Therefore, in the case where the light emitting element LD is supplied on the step portion STP (e.g., the step lower surface STL), the removal of the corresponding light emitting element LD by the scraper 400 can be improved.

[0141] The light emitting element LD may be disposed in the alignment hole ARH in a substantially flat state. Figure 7 and Fig. 9 As shown in , the bottom surface (or lower surface) of the alignment hole ARH of the molds 200a and 200c may include a curved surface. The curved surface of the bottom surface (or lower surface) may be similar to a portion of the outer peripheral surface of the light emitting element LD. Therefore, the fluidity of the light emitting element LD in the alignment hole ARH may be reduced.

[0142] In an embodiment, Figure 8 , Fig. 9 and Fig.10 As shown in FIG. 1 , the recessed portion RP of the molds 200b, 200c, and 200d may include an alignment hole ARH and an inclined surface IS spaced apart from the alignment hole ARH. The bottom surface (or lower surface) of the alignment hole ARH may be flat (eg, Figure 8 and Fig.10 ), or may have a curved surface (as shown in Fig. 9 ).

[0143] The inclined surface IS can facilitate (or guide) the movement of the light emitting element LD into the alignment hole ARH and the removal of the light emitting element LD. For example, in an ink application process including the light emitting element LD, the light emitting element LD supplied on the inclined surface IS can be easily moved into the alignment hole ARH through the inclined surface IS. For example, in a scraper process, the movement of the light emitting element LD can be improved through the inclined surface IS.

[0144] In an embodiment, Figure 7 , Figure 8 , Fig. 9 and Fig.11 As shown in FIG. 1 , the first recesses RP1 and the second recesses RP2 of the molds 200a, 200b, 200c, and 200e may be separated (or spaced apart) from each other. Fig.10 and Fig.12 As shown in FIG. 1 , the first recess RP1 and the second recess RP2 may be continuously formed in the second direction DR2 . The distance, size, etc. between the first recess RP1 and the second recess RP2 may be determined to correspond to the alignment shape, etc. of the light emitting element LD.

[0145] In an embodiment, Fig.11 and Fig.12 As shown in , the recess RP may include an alignment hole ARH having a slope surface SP. The depth H of the alignment hole ARH may be substantially the same as the depth H of the recess RP. When viewed along the first direction DR1, only one light emitting element LD may be filled in the recess RP. The light emitting element LD to be removed supplied to the second recess RP2 may be moved to the outside of the second recess RP2 by a scraper process.

[0146] Fig.13 It is shown Figure 5 Schematic diagram of another example of an apparatus 1000A for manufacturing a display device DD.

[0147] exist Fig.13 In, refer to Figure 5 The same or similar components are described using the same reference numerals, and redundant descriptions are omitted for ease of description. In addition to the first vibrator in the form of the first vibration device 700, Fig.13 The apparatus 1000A for manufacturing a display device DD may be used with Figure 5 The apparatus 1000 for manufacturing a display device DD is substantially the same or similar.

[0148] Reference Figure 4 and Fig.13 , an apparatus 1000A for manufacturing a display device DD may include a platform 100 , a mold 200 , an applying device 300 , a scraper 400 , a pressure applying device 500 , a drying device 600 , and a first vibrating device 700 .

[0149] In an embodiment, the first vibration device 700 can vibrate the mold 200 to which the ink INK is applied. The first vibration device 700 can be connected to the pressure applying device 500 connected to the mold 200. The first vibration device 700 can vibrate the mold 200 through the pressure applying device 500. In another example, the first vibration device 700 can be connected (e.g., directly connected) to the mold 200 to vibrate the mold 200.

[0150] In an embodiment, the first vibration device 700 may generate sound waves or ultrasonic waves to vibrate the mold 200. For example, the first vibration device 700 may include a sonic vibrator or an ultrasonic vibrator. The position and / or orientation of the light emitting element LD included in the ink INK disposed on the mold 200 may be changed by the vibration of the mold 200. Therefore, at least one of the light emitting elements LD may be filled or disposed in each recess RP.

[0151] However, this is an example, and the first vibration device 700 is not limited thereto. For example, the first vibration device 700 itself may vibrate slightly at a (specific) frequency, and thus the pressure applying device 500 and / or the mold 200 contacting the first vibration device 700 may vibrate slightly.

[0152] Therefore, most of the light emitting elements LD can be aligned in advance before the doctor blade process, and the alignment accuracy can be improved.

[0153] Fig.14 It is shown Figure 5 Schematic diagram of still another example of an apparatus 1000B for manufacturing a display device DD.

[0154] exist Fig.14 In, refer to Figure 5 The same or similar components are described using the same reference numerals, and redundant descriptions are omitted for ease of description. In addition to the electric field generator in the form of the electric field applying device 800, Fig.14 The apparatus 1000B for manufacturing a display device DD may be used with Figure 5 The apparatus 1000 for manufacturing a display device DD is substantially the same or similar.

[0155] Reference Figure 4 and Fig.14 , an apparatus 1000B for manufacturing a display device DD may include a platform 100 , a mold 200 , an applying device 300 , a scraper 400 , a pressure applying device 500 , a drying device 600 , and an electric field applying device 800 .

[0156] In an embodiment, the electric field applying device 800 may apply an electric field on the substrate SUB to fix the position of the light emitting element LD. For example, the electric field applying device 800 may include a first probe unit 820 connected (e.g., electrically and physically connected) to one side of the substrate SUB and a second probe unit 840 connected (e.g., electrically and physically connected) to the other side of the substrate SUB opposite to the one side.

[0157] The first probe unit 820 and the second probe unit 840 may include a probe pad (or referred to as a "pad") for transmitting an electrical signal. The probe pad of the first probe unit 820 may be connected (e.g., electrically connected) to a pad or electrode disposed on one side of the substrate SUB, and the probe pad of the second probe unit 840 may be connected (e.g., electrically connected) to a pad or electrode on the other side of the substrate SUB. Fig.14 , the first probe unit 820 and the second probe unit 840 are schematically shown as a plate shape, in which the first probe unit 820 and the second probe unit 840 are respectively arranged on the sides (e.g., opposite sides) of the substrate SUB, but this is an example, and the shapes and arrangements of the first probe unit 820 and the second probe unit 840 are not limited thereto.

[0158] The electric field applying device 800 may provide an electric signal to the first probe unit 820 and the second probe unit 840, and the probe pad may form an electric field on the substrate SUB through the electric signal. The electric signal may be an alternating voltage.

[0159] The light emitting elements LD may receive the dielectrophoretic force by the electric field, and the position / orientation of each of the light emitting elements LD may be fixed according to the magnitude and direction of the dielectrophoretic force when the electric field is applied.

[0160] The electric field applying drive of the electric field applying device 800 may be performed during the process of separating the mold 200 and the substrate SUB. In an embodiment, the electric field applying device 800 may be driven before the mold 200 and the substrate SUB are separated. Therefore, misalignment and separation due to movement / rotation of the light emitting element LD, etc. may be prevented, and the mold 200 and the substrate SUB may be separated in a state where an electric field is applied to the substrate SUB.

[0161] Therefore, separation, misalignment, etc. of the light emitting element LD that may occur during a process in which the mold 200 is separated from the substrate SUB may be prevented or reduced.

[0162] In an embodiment, the apparatus 1000B for manufacturing a display device DD may further include a reference Fig.13 A first vibration device 700 is described.

[0163] Fig.15 It is shown Figure 5Schematic diagram of still another example of an apparatus 1000C for manufacturing a display device DD.

[0164] exist Fig.15 In, refer to Figure 5 and Fig.14 The same or similar components are described using the same reference numerals, and redundant descriptions are omitted for ease of description. In addition to the second vibrator in the form of the second vibration device 900, Fig.15 The apparatus 1000C for manufacturing a display device DD may be used with Fig.14 The apparatus 1000B for manufacturing a display device DD is substantially the same as or similar to the apparatus 1000B for manufacturing a display device DD.

[0165] Reference Figure 5 and Fig.15 , an apparatus 1000C for manufacturing a display device DD may include a platform 100 , a mold 200 , an applying device 300 , a scraper 400 , a pressure applying device 500 , a drying device 600 , an electric field applying device 800 , and a second vibration device 900 .

[0166] In an embodiment, the second vibration device 900 may vibrate the substrate SUB. The second vibration device 900 may be connected to the substrate SUB and / or the platform 100 supporting the substrate SUB.

[0167] In an embodiment, the second vibration device 900 may generate sound waves or ultrasonic waves to vibrate the substrate SUB. For example, the second vibration device 900 may include a sonic wave vibrator or an ultrasonic vibrator.

[0168] When the mold 200 and the substrate SUB are separated, the second vibration device 900 can vibrate the substrate SUB. For example, the second vibration device 900 can assist the separation process of the mold 200 and the substrate SUB. For example, the separation of the mold 200 and the substrate SUB and the separation of the mold 200 and the ink INK (for example, the solvent SOL of the ink INK) can be improved by the vibration of the second vibration device 900. At this time, the force transmitted to the light emitting element LD by the vibration can be less than the dielectrophoretic force caused by the electric field. Therefore, the mold 200 and the substrate SUB can be easily separated without changing the position and orientation of the light emitting element LD due to the vibration of the substrate SUB.

[0169] In an embodiment, the apparatus 1000C for manufacturing a display device DD may further include a reference Fig.13 A first vibration device 700 is described.

[0170] Figures 16 to 25 is a schematic diagram illustrating a method of manufacturing a display device DD according to an embodiment.

[0171] Reference Figures 16 to 25, a method for manufacturing a display device DD may include: applying ink INK in which light emitting elements LD are dispersed to a surface of a mold 200 including a recess RP; removing the ink INK applied to a portion of the mold 200 other than the recess RP by using a scraper 400; compressing the mold 200 to a substrate SUB of the display device DD to dispose the light emitting element LD on electrodes ELT1 and ELT2 formed on the substrate; and separating the mold 200 separated from the light emitting element LD from the substrate SUB.

[0172] First, if Fig.16 and Fig.17 As shown in , the ink INK can be applied to the surface of the mold 200 by using the application device 300. In an embodiment, the application device 300 can spray or apply the ink INK to the surface of the mold 200 while moving in the first direction DR1. However, this is an example, and the moving direction of the application device 300 is not limited thereto. For example, the movement of the application device 300 can be fixed, and the ink INK can be applied to the mold 200 while the mold 200 moves in a (specific) direction.

[0173] The ink INK may be applied on the mold 200 by various process methods such as an inkjet printing method, a dispensing method, a coating method such as a slit coating or a dipping method.

[0174] like Fig.17 As shown in , the ink INK may include a fluid solution (e.g., a solvent SOL) and light emitting elements LD dispersed in the solvent SOL. The solvent SOL may be in a liquid state or a colloidal state. The solvent SOL may be uniformly applied to the surface of the mold 200 including the first recess RP1 and the second recess RP2. The light emitting elements LD may be randomly arranged on the surface of the mold 200.

[0175] For example, a portion of the light emitting element LD may be disposed in the alignment hole ARH, and another portion of the light emitting element LD may be disposed on the step portion STP (e.g., the step side surface STS and the step lower surface STL) of the recess RP. For example, another portion of the light emitting element LD may be disposed on the surface of the mold 200 other than the recess RP, and the form in which the light emitting element LD is disposed may also be different.

[0176] For example, Fig.17 The cross-sectional shape of the mold 200 is an example, and the embodiment is not limited thereto. For example, the cross-sectional shape of the mold 200 may be designed (or formed) as shown in FIG. Figures 7 to 12 The various shapes described.

[0177] Then, a portion of the ink INK on the mold 200 may be removed. Figures 18 to 23As shown in FIG. 1 , the mold 200 may be vibrated using a first vibration device 700 to fill the recess RP with at least a portion of the light emitting element LD (see FIG. 1 ). Fig.18 and Fig.19 ), the surface of the mold 200 may be scraped with a scraper 400 to align the light emitting element LD on the mold 200 (see Fig. 20 and Fig.21 ), and the solvent SOL of the ink INK remaining on the surface of the mold 200 can be removed by irradiating light to the surface of the mold 200 (see Fig. 22 and Fig.23 ).

[0178] like Fig.18 and Fig.19 As shown in , by vibrating the mold 200 with the first vibration device 700, the light emitting element LD can be filled in the first recess RP1 and the second recess RP2. For example, the light emitting element LD disposed on the step portion STP can fall into the alignment hole ARH. Therefore, the mold 200 can be vibrated so that the light emitting element LD is filled in all the recesses RP. In an embodiment, the first vibration device 700 may include a sonic vibrator or an ultrasonic vibrator.

[0179] According to the embodiment, Fig.19 As shown in FIG. 2 , a portion of the light emitting element LD may remain on the surface of the mold 200 except for the alignment hole ARH.

[0180] In another example, the Fig.18 The mold vibration process.

[0181] Then, if Fig. 20 and Fig.21 As shown in FIG. 4 , the surface of the mold 200 may be scraped with a scraper 400, and thus the light emitting element LD may be aligned in the alignment hole ARH (see FIG. 4 ). Fig.19 ). The scraper 400 may move in a direction (eg, a first direction DR1 ) with a (specific) contact pressure while being in contact with a portion of the surface of the mold 200 .

[0182] The light emitting element LD and the solvent SOL disposed in a portion other than the alignment hole ARH may be removed together.

[0183] Then, in an embodiment, as Fig. 22 and Fig.23 As shown in FIG. 1 , the solvent SOL of the ink INK remaining on the surface of the mold 200 can be removed by light irradiation of the drying device 600. Fig.21 ). For example, all of the solvent SOL may be evaporated by the drying device 600. Therefore, only the light emitting element LD disposed or fixed in the recess RP remains in the mold 200.

[0184] Then, if Fig.24 As shown in FIG. 2 , the light emitting element LD may be disposed on the electrodes ELT1 and ELT2 formed on the substrate SUB by compressing the mold 200 and the substrate SUB ( Fig.25 First, as shown in Fig.24 As shown in , the substrate SUB and the platform 100 may be aligned or disposed on the mold 200 in a state where the substrate SUB and the platform 100 are turned over. Therefore, the recess RP may face the third direction DR3. In a state where the substrate SUB and the platform 100 are turned over, the mold 200 and the substrate SUB may be compressed. In a state where the mold 200 and the substrate SUB are joined together, the platform 100, the substrate SUB, the mold 200, and the pressure applying device 500 may be turned over again. Therefore, a structure such as Fig.24 , the positions of the platform 100, the substrate SUB, the mold 200, and the pressure applying device 500 are shown in FIG. For example, in a state where the mold 200 and the pressure applying device 500 are turned over, a (specific) pressure can be applied by the pressure applying device 500 in a direction opposite to the third direction DR3.

[0185] Therefore, the light emitting element LD may be separated from the recessed portion RP and may be disposed on the electrodes ELT1 and ELT2 of the substrate SUB.

[0186] Then, if Fig.25 As shown in FIG. 1 , the mold 200 separated from the light emitting element LD may be separated from the substrate SUB. In an embodiment, the mold 200 may be lifted or moved in the third direction DR3. The light emitting element LD may be arranged on the first and second electrodes ELT1 and ELT2 to correspond to the arrangement of the recess RP of the mold 200.

[0187] For example, the light emitting element LD can be disposed on the first electrode ELT1 and the second electrode ELT2 in an aligned state by the arrangement of the recess RP of the mold 200. Therefore, the misalignment of the light emitting element LD can be minimized and greatly reduced. Therefore, product defects can be reduced, and alignment reliability and manufacturing yield can be improved.

[0188] Fig.26 It is shown Fig.25 FIG. 1 is a schematic diagram of an example of a process of separating the substrate SUB from the mold 200 .

[0189] Reference Fig.26 , the mold 200 separated from the light emitting element LD may be separated from the substrate SUB.

[0190] In an embodiment, the light emitting element LD may be fixed on the first and second electrodes ELT1 and ELT2 by applying an electric field on the substrate SUB using the electric field applying device 800. In this state, the mold 200 may be moved in the third direction DR3 to be separated from the substrate SUB.

[0191] The light emitting element LD may receive a dielectrophoretic force through an electric field, and the position / orientation of each of the light emitting elements LD may be fixed on the substrate SUB when the electric field is applied. Therefore, separation, misalignment, etc. of the light emitting element LD that may occur during separation of the mold 200 and the substrate SUB may be prevented or reduced. Therefore, process reliability may be further improved.

[0192] Fig. 27 It is shown Fig.25 FIG. 1 is a schematic diagram of another example of a process of separating the substrate SUB and the mold 200 .

[0193] Reference Fig. 27 , the mold 200 separated from the light emitting element LD may be separated from the substrate SUB.

[0194] In an embodiment, the light emitting element LD can be fixed on the first electrode ELT1 and the second electrode ELT2 by applying an electric field on the substrate SUB using an electric field applying device 800, vibration can be applied to the substrate SUB by a second vibration device 900, and in this state, the mold 200 can be moved in the third direction DR3 to separate it from the substrate SUB.

[0195] The second vibration device 900 can assist the separation process of the mold 200 and the substrate SUB. The separation of the mold 200 and the substrate SUB and the separation of the mold 200 and the ink INK (e.g., the solvent SOL of the ink INK) can be improved by vibration of the second vibration device 900. Fig.15 The operation by the second vibration device 900 is described, and thus redundant description is omitted for convenience of description.

[0196] Fig.28 is a schematic diagram illustrating an example of a process of removing the solvent SOL of the ink INK.

[0197] Reference Fig.25 and Fig.28 , after the mold 200 is separated from the substrate SUB, the solvent SOL of the ink INK remaining on the surface of the substrate SUB may be completely removed by irradiating light onto the substrate SUB.

[0198] In the embodiments, reference Fig. 22 and Fig.23 The process described for removing the ink INK remaining in the mold 200 may be used Fig.28The process of removing the ink INK remaining on the substrate SUB after separating the mold 200 and the substrate SUB is replaced.

[0199] As described above, the apparatus 1000, 1000A, 1000B or 1000C for manufacturing a display device DD and the method for manufacturing a display device DD according to the embodiment can arrange the pre-arranged light emitting element LD on the electrodes ELT1 and ELT2 on the substrate SUB by using the arrangement of the recess RP of the mold 200. Therefore, the misalignment of the light emitting element LD can be greatly reduced. Therefore, product defects can be reduced, and alignment reliability and manufacturing yield can be improved.

[0200] In summarizing the detailed description, it will be appreciated by those skilled in the art that many changes and modifications may be made to the embodiments without departing substantially from the principles and spirit and scope of the disclosure. Therefore, the disclosed embodiments are used in a general and descriptive sense only and not for the purpose of limitation.

Claims

1. An apparatus for manufacturing a display device, the apparatus include: a platform, on which the substrate of the display device is disposed; a mold including a surface including a recess; an ejector for applying ink including light emitting elements onto the surface of the mold; a scraper that removes the ink disposed on the surface of the mold and retains the ink disposed in the concave portion of the mold; as well as A compressor compresses the surface of the mold to the substrate.

2. The device according to claim 1, in, The depth of each of the recesses is greater than the diameter of each of the light emitting elements, and The depth of each of the recesses is less than about 1.5 times the diameter of each of the light emitting elements.

3. The device according to claim 2, in, Each of the recesses includes an alignment hole filled with at least one of the light emitting elements.

4. The device according to claim 3, in, The length of the alignment hole in the first direction is greater than the length of each of the light emitting elements, The width of the alignment hole in a second direction intersecting the first direction is greater than the diameter, and The width of the alignment hole in the second direction is less than about 1.5 times the diameter.

5. The device according to claim 4, in, The recesses are arranged in the first direction and the second direction, and The recess is provided in a shape in which the light emitting element is aligned on the substrate.

6. The device according to claim 5, in, The scraper scrapes the ink in one direction on the surface of the mold, and The light emitting element is arranged in a manner aligned with the recess.

7. The device according to claim 3, in, The lower surface of the alignment hole is flat.

8. The device according to claim 3, in, The alignment hole includes a curved surface or an inclined surface.

9. The device according to claim 3, in, Each of the recesses also includes a stepped portion or an inclined surface adjacent to the alignment hole.

10. The device according to claim 1, further comprising: include: A dryer evaporates and removes a solvent of the ink remaining on the surface of the mold or on a surface of the substrate.

11. The device according to claim 10, further comprising: include: A vibrator vibrates the mold to which the ink is applied.

12. The device according to claim 11, in, The vibrator is configured to vibrate the mold by generating sound waves or ultrasonic waves, and At least one of the light emitting elements is filled in each of the recesses through the vibrator.

13. The device according to claim 11, in, The vibrator is configured to vibrate the substrate when the mold and the substrate are separated.

14. The device according to claim 10, further comprising: include: An electric field generator fixes a position of each of the light emitting elements by applying an electric field to the substrate when the mold and the substrate are separated.

15. A method for manufacturing a display device, the method The following steps are involved: applying ink including light emitting elements to a surface of the mold including the recessed portion; removing the ink disposed on the surface of the mold and retaining the ink disposed in the concave portion of the mold by using a scraper; compressing the mold onto a substrate of the display device to dispose the light emitting element on an electrode formed on the substrate; as well as The mold separated from the light emitting element is separated from the substrate.

16. The method according to claim 15, in, The step of removing the ink comprises: aligning the light emitting element by scraping the surface of the mold with the scraper; and A solvent of the ink remaining on the surface of the mold is removed by irradiating light to the surface of the mold.

17. The method according to claim 15, in, The step of removing the ink comprises: vibrating the mold using a vibrator so that at least one of the light emitting elements is filled in each of the recesses; aligning the light emitting element by scraping the surface of the mold with the scraper; and A solvent of the ink remaining on the surface of the mold is removed by irradiating light to the surface of the mold.

18. The method according to claim 15, in, The step of separating the mold from the substrate comprises: Fixing the light emitting element on the electrode by applying an electric field on the substrate using an electric field generator; and The mold is separated from the substrate by moving the mold in a vertical direction.

19. The method according to claim 18, in, The step of separating the mold from the substrate further includes removing a solvent of the ink remaining on a surface of the substrate by irradiating light on the substrate separated from the mold.

20. The method according to claim 15, in, The step of separating the mold from the substrate comprises: Fixing the light emitting element on the electrode by applying an electric field on the substrate using an electric field generator; applying vibration to the substrate by a vibrator; and The mold is separated from the substrate by moving the mold in a vertical direction.

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