Protection method, application and protection device for cutting steel wire and cutting machine

Abstract

The invention discloses a protection method, application and protection device for a cutting steel wire and a cutting machine. The method comprises the steps that a direct-current stabilized power supply with the voltage range of 0-1.6 V is arranged, the negative electrode of the direct-current stabilized power supply is connected to the cutting steel wire through a negative electrode wire, and the positive electrode of the direct-current stabilized power supply is connected to an inert metal piece through a positive electrode wire; at least part of the negative wire and at least part of the positive wire are immersed in the water-based cutting fluid, and the water-based cutting fluid, the cutting steel wire and the inert metal piece form a current loop; in the cutting process, the direct-current stabilized power supply impressed current to the cutting steel wire, the cutting steel wire becomes a cathode of the surrounding environment, and the inert metal piece becomes an anode of the surrounding environment; the electrochemical reaction is carried out by utilizing the conductivity of the water-based cutting fluid, the cathode obtains electrons and combines H < + > in the water-based cutting fluid to generate alkali, the anode loses electrons to generate acid, and the pH value of the water-based cutting fluid in the cutting process is controlled within a target value through acid-base neutralization. The corrosion of metasilicic acid generated by mixing the water-based cutting fluid and the silicon powder to the cutting steel wire can be reduced.

Description

Technical Field

[0001] The invention relates to the field of photovoltaic technology, and in particular to a protection method, application, protection device and cutting machine for a cutting steel wire. Background Art

[0002] As the cost per kilowatt-hour of the photovoltaic industry decreases, the slicing direction is moving towards larger-sized silicon wafers and thinner slices. Correspondingly, the diamond wire used to cut silicon wafers is also gradually becoming thinner. However, as the thinning progresses, the mother wire in the diamond wire becomes thinner and thinner, and its breaking force during the cutting process becomes lower and lower. In addition, the main component of the water-based cutting fluid used during cutting is water. During the cutting process, the silicon powder produced by the diamond wire cutting silicon parts will react with the water in the water-based cutting fluid to generate metasilicic acid, which will cause the nickel layer on the surface of the diamond wire to corrode, further reducing the breaking force of the diamond wire, resulting in a higher and higher wear and tear rate of the diamond wire during the cutting process. Excessive breakage rate will lead to yield loss and production capacity loss.

[0003] In the prior art, the amount of diamond wire used in the production process is usually increased to reduce the wear of diamond particles on the steel wire, thereby reducing the wear of the steel wire. However, the unit consumption of steel wire is increased, resulting in an increase in production costs. Although the wear of diamond particles is reduced, in order to ensure that the silicon wafer is thick enough to meet the use requirements, the guide wheel needs to engrave a larger groove pitch, resulting in a decrease in the number of wafers output by a single knife and a decrease in production efficiency. In addition, the problem of water-based cutting fluid mixed with silicon powder to generate metasilicic acid to corrode the nickel layer on the surface of the diamond wire has not yet been solved or improved. Summary of the invention

[0004] The technical problem to be solved by the present invention is how to reduce the corrosion of the nickel layer on the surface of the diamond wire by metasilicic acid generated by mixing water-based cutting fluid and silicon powder, thereby reducing the wear and breakage of the diamond wire during the cutting process.

[0005] In order to achieve the above-mentioned object of the invention, the technical solution adopted by the present invention is:

[0006] A method for protecting a cutting steel wire, wherein the cutting steel wire is used for cutting a target silicon part. During the cutting process, the cutting steel wire sprays a water-based cutting liquid stored in a liquid storage unit to a contact area between the cutting steel wire and the target silicon part through a nozzle. The method for protecting the cutting steel wire comprises the following steps:

[0007] Based on the cutting machine with the cutting steel wire, a DC regulated power supply is provided, the voltage range of the DC regulated power supply is 0V-1.6V, the negative electrode of the DC regulated power supply is connected to the cutting steel wire through a negative wire, the positive electrode of the DC regulated power supply is connected to the inert metal part through a positive wire, and at least part of the negative wire and at least part of the positive wire are immersed in the water-based cutting fluid, and the water-based cutting fluid, the cutting steel wire and the inert metal part form a current loop by utilizing the conductivity of the water-based cutting fluid;

[0008] During the cutting process, the DC regulated power supply applies a current to the cutting steel wire, so that the environmental potential is higher than the potential of the cutting steel wire, the cutting steel wire becomes the cathode of the surrounding environment, and the inert metal part becomes the anode of the surrounding environment;

[0009] The conductivity of the water-based cutting fluid is used to generate an electrochemical reaction, and the cathode obtains electrons and combines with H in the water-based cutting fluid. + Base is generated to increase the pH value around the cutting steel wire, and the anode loses electrons to generate acid to reduce the pH value of the water-based cutting fluid. Through acid-base neutralization, the pH value of the water-based cutting fluid during the cutting process is controlled within the target value.

[0010] Furthermore, the target pH value ranges from 5.0 to 7.0.

[0011] Furthermore, the preferred voltage range of the DC regulated power supply is 0.5V-1.5V.

[0012] Further, the reaction of the cathode is:

[0013] 4H + +4e - →2H 2 .

[0014] 4H 2 O+4e - →4OH - +2H 2 .

[0015] Furthermore, the reaction of the anode is: 2H 2 O-4e - →4H + +O 2 .

[0016] Furthermore, the acid-base neutralization reaction is: OH - +H + →H 2 O.

[0017] Furthermore, the inert metal part is platinum.

[0018] The present invention also provides an application of a cutting steel wire protection method, in which the pH value of a water-based cutting fluid is controlled within a target value during the cutting process of a target silicon piece, so as to protect the cutting steel wire.

[0019] The present invention also provides a protective device for cutting steel wires, comprising:

[0020] DC regulated power supply;

[0021] Inert metal parts;

[0022] A positive wire, one end of which is connected to the positive electrode of the DC regulated power supply, and the other end of which is connected to the inert metal part, so that the inert metal part becomes an anode of the surrounding environment; and

[0023] A negative electrode wire, one end of which is connected to the negative electrode of the DC regulated power supply, and the other end of which is connected to the cutting steel wire, so that the cutting steel wire becomes the cathode of the surrounding environment;

[0024] At least part of the positive electrode wire and at least part of the negative electrode wire are immersed in the water-based cutting fluid stored in the liquid storage unit, so that the water-based cutting fluid, the cutting steel wire and the inert metal member form a current loop.

[0025] The present invention also provides a cutting machine, comprising a cutting steel wire and a protective device, wherein the cutting steel wire is used to cut a target silicon piece, and the protective device is used to control the pH value of a water-based cutting fluid within a target value during the cutting process to protect the cutting steel wire.

[0026] Due to the application of the above technical solution, the beneficial effects of the present invention compared with the prior art are:

[0027] The present invention combines electrochemistry with physical cutting of a cutting steel wire. By setting a DC regulated power supply, a current is continuously applied to the cutting steel wire during the cutting process to change the environmental potential, so that the environmental potential is higher than the potential of the cutting steel wire, so that the cutting steel wire becomes the cathode of the surrounding environment and is always in an electron-gaining state, and combines with hydrogen ions in a water-based cutting fluid to generate alkali to increase the pH value around the cutting steel wire. Correspondingly, the inert metal parts become the anode of the surrounding environment and are always in a state of losing electrons to generate acid, thereby reducing the pH value of the water-based cutting fluid.

[0028] On the whole, alkali is generated at the cathode and acid is generated at the anode, and the acid and alkali are neutralized to control the pH value of the water-based cutting fluid within the target value during the cutting process, thereby reducing the surface corrosion of the cutting steel wire by the metasilicic acid generated by the reaction of silicon powder produced by cutting the target silicon parts with water in the water-based cutting fluid. Compared with the existing technology, there is no need to reduce the wear of the cutting steel wire by increasing the amount of process wire, thereby reducing the wire breakage rate, process unit consumption and slot pitch, thereby increasing the unit output of the target silicon parts and reducing the production cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0030] Figure 1 Schematic diagram of the process of the cutting wire protection method according to Embodiment 1 of the present invention. DETAILED DESCRIPTION

[0031] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present application.

[0032] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present application described here. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0033] In the present application, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings. These terms are mainly used to better describe the present invention and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0034] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those skilled in the art, the specific meanings of these terms in the present invention can be understood according to specific circumstances.

[0035] In addition, the terms "installed", "set", "provided with", "connected", "connected", and "socketed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0036] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0037] Example 1

[0038] This embodiment provides a method for protecting a cutting steel wire, wherein the cutting steel wire is used to cut a target silicon component. During the cutting process, a water-based cutting liquid stored in a liquid storage unit is sprayed to a contact area between the cutting steel wire and the target silicon component through a nozzle.

[0039] See also Figure 1 , the protection method for cutting steel wire includes the following steps:

[0040] S1: Based on a cutting machine with a cutting steel wire, a DC regulated power supply is set, and the voltage range of the DC regulated power supply is 0V-1.6V. The negative pole of the DC regulated power supply is connected to the cutting steel wire through a negative wire, and the positive pole of the DC regulated power supply is connected to an inert metal part through a positive wire, and at least part of the negative wire and at least part of the positive wire are immersed in a water-based cutting fluid. Using the conductivity of the water-based cutting fluid, the water-based cutting fluid, the cutting steel wire and the inert metal part form a current loop.

[0041] Among them, the preferred voltage range of the DC regulated power supply is 0.5V-1.5V.

[0042] Inert metal refers to a metal with stable chemical properties that is not easily changed. In this embodiment, the inert metal piece is specifically platinum, which is a known metal material. Its properties are common knowledge and are not described here. Of course, in other embodiments, the inert metal can also be set to gold, silver, etc., which is not specifically limited here.

[0043] S2: During the cutting process, a DC regulated power supply is used to apply an external current to the cutting wire so that the environmental potential is higher than the potential of the cutting wire. The cutting wire becomes the cathode of the surrounding environment, and the inert metal parts become the anode of the surrounding environment.

[0044] S3: The conductivity of the water-based cutting fluid is used to generate an electrochemical reaction, where the cathode obtains electrons and combines with H in the water-based cutting fluid. + Alkali is generated to increase the pH value around the cutting steel wire, and the anode loses electrons to generate acid to lower the pH value of the water-based cutting fluid. Through acid-base neutralization, the pH value of the water-based cutting fluid during the cutting process is controlled within the target value.

[0045] It should be noted that, during the cutting process, when the pH value of the water-based cutting fluid is at the target value, it is possible to prevent the silicon powder generated by the cutting of the target silicon part from reacting with the water in the water-based cutting fluid to generate metasilicic acid that will corrode the nickel layer on the surface of the cutting steel wire. In this embodiment, the target pH value range is 5.0-7.0.

[0046] Specifically, the cathode reaction is: 4H + +4e - →2H 2 and 4H 2 O+4e - →4OH - +2H 2 The reaction at the anode is: 2H 2 O - 4e - →4H + +O 2 The acid-base neutralization reaction is: OH - +H + →H 2 O.

[0047] It should be noted that the cutting steel wire is a diamond wire, and the surface of the diamond wire has a nickel layer. In the prior art, during the cutting process, the nickel layer on the surface of the cutting steel wire reacts with the hydrogen ions in the water-based cutting fluid to generate hydrogen on the surface of the cutting steel wire. The reaction is: Ni+2H + →Ni 2 + +H 2, that is, nickel loses electrons, reacts to generate nickel ions that dissolve in the solution, and thus loses its protective effect on the cutting steel wire. The reaction is: Ni-2e - →Ni 2 + .

[0048] In this embodiment, a DC regulated power supply is provided and an external current is continuously applied to the cutting steel wire during the cutting process to change the environmental potential so that the environmental potential is higher than the potential of the cutting steel wire, thereby making the cutting steel wire the cathode of the surrounding environment and being in an electron-gaining state all the time, and combining with the hydrogen ions in the water-based cutting fluid to generate alkali to increase the pH value around the cutting steel wire. Correspondingly, the inert metal parts become the anode of the surrounding environment and are in a state of losing electrons all the time to generate acid, thereby lowering the pH value of the water-based cutting fluid.

[0049] Overall, alkali is generated at the cathode and acid is generated at the anode, and the acid and base are neutralized to control the pH value of the water-based cutting fluid within the target value during the cutting process, thereby reducing the surface corrosion of the cutting steel wire by the metasilicic acid generated by the reaction of silicon powder generated by cutting the target silicon parts with water in the water-based cutting fluid. Specific embodiment: Specific embodiment (1):

[0052] The positive electrode of the DC regulated power supply is connected to the inert metal part through the positive wire, and the negative electrode is connected to the cutting steel wire through the negative wire. At least part of the positive wire and at least part of the negative wire are immersed in the water-based cutting fluid, so that the cutting steel wire, the water-based cutting fluid and the inert metal part form a current loop. The positive output voltage of the DC regulated power supply is set to 1.3V. At room temperature of 20℃-25℃, the cutting steel wire is immersed in the water-based cutting fluid for 2 hours, which is the sample of specific embodiment (1). Specific embodiment (2):

[0054] The positive electrode of the DC regulated power supply is connected to the inert metal part through the positive wire, and the negative electrode is connected to the cutting steel wire through the negative wire. At least part of the positive wire and at least part of the negative wire are immersed in the water-based cutting fluid, so that the cutting steel wire, the water-based cutting fluid and the inert metal part form a current loop. The positive output voltage of the DC regulated power supply is set to 0.5V. At room temperature of 20℃-25℃, the cutting steel wire is immersed in the water-based cutting fluid for 2 hours, which is the sample of specific embodiment (2). Specific embodiment (3):

[0056] The positive electrode of the DC regulated power supply is connected to the inert metal part through the positive wire, and the negative electrode is connected to the cutting steel wire through the negative wire. At least part of the positive wire and at least part of the negative wire are immersed in the water-based cutting fluid, so that the cutting steel wire, the water-based cutting fluid and the inert metal part form a current loop. The positive output voltage of the DC regulated power supply is set to 1.6V. At room temperature of 20℃-25℃, the cutting steel wire is immersed in the water-based cutting fluid for 2 hours, which is the sample of specific embodiment (3). Specific embodiment (4):

[0058] The positive electrode of the DC regulated power supply is connected to the inert metal part through the positive wire, and the negative electrode is connected to the cutting steel wire through the negative wire. At least part of the positive wire and at least part of the negative wire are immersed in the water-based cutting fluid, so that the cutting steel wire, the water-based cutting fluid and the inert metal part form a current loop. The positive output voltage of the DC regulated power supply is set to be less than 0.5V. At room temperature of 20℃-25℃, the cutting steel wire is immersed in the water-based cutting fluid for 2 hours, which is the sample of specific embodiment (4). Specific embodiment (5):

[0060] The positive electrode of the DC regulated power supply is connected to the inert metal part through the positive wire, and the negative electrode is connected to the cutting steel wire through the negative wire. At least part of the positive wire and at least part of the negative wire are immersed in the water-based cutting fluid, so that the cutting steel wire, the water-based cutting fluid and the inert metal part form a current loop. The positive output voltage of the DC regulated power supply is set to be greater than 1.5V. At room temperature of 20℃-25℃, the cutting steel wire is immersed in the water-based cutting fluid for 2 hours, which is the sample of specific embodiment (5).

[0061] Comparative Example:

[0062] Without setting up a DC regulated power supply, the cutting steel wire is directly immersed in a water-based cutting fluid at room temperature of 20°C-25°C for 2 hours, which is a comparative sample.

[0063] Performance Testing:

[0064] The surface corrosion rates of the samples of Specific Example (1), Specific Example (2), Specific Example (3), Specific Example (4), Specific Example (5) and the comparative example were observed by metallographic microscope.

[0065] The samples of Specific Example (1), Specific Example (2), Specific Example (3), Specific Example (4), Specific Example (5) and Comparative Example were applied to the cutting process to detect the breaking tensile force and the wear breakage rate.

[0066] in conclusion:

[0067] The surface corrosion rate of the comparative sample is 6 times that of the sample of specific embodiment (1), the breaking tensile force of the sample of specific embodiment (1) is 1.2 times that of the comparative sample, and the wear and tear rate of the sample of specific embodiment (1) is reduced by 25% compared with the comparative sample.

[0068] The surface corrosion rate of the comparative sample is 3 times that of the sample of specific embodiment (2), the breaking tensile force of the sample of specific embodiment (2) is 1.1 times that of the comparative sample, and the wear and tear rate of the sample of specific embodiment (2) is reduced by 18% compared with the comparative sample.

[0069] The surface corrosion rate of the comparative sample is 3 times that of the sample of specific embodiment (3), the breaking tensile force of the sample of specific embodiment (3) is 1.15 times that of the comparative sample, and the wear and tear rate of the sample of specific embodiment (3) is reduced by 20% compared with the comparative sample.

[0070] The surface corrosion rate of the comparative sample is similar to that of the sample of specific embodiment (4). The breaking tensile force of the sample of specific embodiment (4) is 1.05 times that of the comparative sample. The wear and tear rate of the sample of specific embodiment (4) is reduced by 5% compared with the comparative sample.

[0071] The surface corrosion rate of the comparative sample is similar to that of the sample of specific embodiment (5). The breaking tensile force of the sample of specific embodiment (5) is 1.08 times that of the comparative sample. The wear and tear rate of the sample of specific embodiment (5) is reduced by 5% compared with the comparative sample.

[0072] Example 2

[0073] This embodiment provides a protection device for cutting steel wires, including a DC stabilized voltage power supply, an inert metal part, a positive wire and a negative wire. The voltage range of the DC stabilized voltage power supply, the type of the inert metal part, the specifications of the positive wire and the negative wire, and the connection structure between the parts are the same as those of the DC stabilized voltage power supply, the inert metal part, the positive wire and the negative wire in the aforementioned embodiment 1.

[0074] Specifically, one end of the positive wire is connected to the positive electrode of the DC regulated power supply, and the other end is connected to the inert metal part, so that the inert metal part becomes the anode of the surrounding environment. One end of the negative wire is connected to the negative electrode of the DC regulated power supply, and the other end is connected to the cutting steel wire, so that the cutting steel wire becomes the cathode of the surrounding environment. At least part of the positive wire and at least part of the negative wire are immersed in the water-based cutting liquid stored in the liquid storage unit, so that the water-based cutting liquid, the cutting steel wire and the inert metal part form a current loop.

[0075] The protection device is used to implement the protection method in Example 1. The principle and implementation steps of the protection method can be specifically referred to in the aforementioned Example 1, and will not be described in detail here.

[0076] Example 3

[0077] This embodiment provides a cutting machine including a cutting steel wire and a protective device, wherein the cutting steel wire is used to cut a target silicon component, and the protective device is used to control the pH value of a water-based cutting fluid within a target value during the cutting process to protect the cutting steel wire.

[0078] The cutting steel wire is the same as the cutting steel wire in Example 1, and the protection device includes a DC regulated power supply, an inert metal part, a positive wire and a negative wire. The voltage range of the DC regulated power supply, the type of the inert metal part, the specifications of the positive wire and the negative wire, and the connection structure between the parts are the same as those of the DC regulated power supply, the inert metal part, the positive wire and the negative wire in the aforementioned Examples 1 and 2. For details, please refer to Examples 1 and 2, which will not be repeated here.

[0079] Finally, it should be noted that the above are only preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for protecting a cutting steel wire, wherein the cutting steel wire is used to cut a target silicon part, and during the cutting process, the cutting steel wire sprays a water-based cutting liquid stored in a liquid storage unit to a contact area between the cutting steel wire and the target silicon part through a nozzle, characterized in that: The protection method for cutting steel wire comprises the following steps: Based on the cutting machine with the cutting steel wire, a DC regulated power supply is provided, the voltage range of the DC regulated power supply is 0V-1.6V, the negative electrode of the DC regulated power supply is connected to the cutting steel wire through a negative wire, the positive electrode of the DC regulated power supply is connected to the inert metal part through a positive wire, and at least part of the negative wire and at least part of the positive wire are immersed in the water-based cutting fluid, and the water-based cutting fluid, the cutting steel wire and the inert metal part form a current loop by utilizing the conductivity of the water-based cutting fluid; During the cutting process, the DC regulated power supply applies a current to the cutting steel wire, so that the environmental potential is higher than the potential of the cutting steel wire, the cutting steel wire becomes the cathode of the surrounding environment, and the inert metal part becomes the anode of the surrounding environment; The conductivity of the water-based cutting fluid is used to generate an electrochemical reaction, and the cathode obtains electrons and combines with H in the water-based cutting fluid. + Base is generated to increase the pH value around the cutting steel wire, and the anode loses electrons to generate acid to reduce the pH value of the water-based cutting fluid. Through acid-base neutralization, the pH value of the water-based cutting fluid during the cutting process is controlled within the target value.

2. The cutting wire protection method according to claim 1, characterized in that: The target pH value range is 5.0-7.

0.

3. The cutting wire protection method according to claim 1, characterized in that: The preferred voltage range of the DC regulated power supply is 0.5V-1.5V.

4. The cutting wire protection method according to claim 1, characterized in that: The cathode reaction is: 4H + +4e - →2H. 4H2O+4e - →4OH - +2H2.

5. The cutting wire protection method according to claim 4, characterized in that: The reaction of the anode is: 2H20-4e - →4H+O2.

6. The cutting wire protection method according to claim 5, characterized in that: The acid-base neutralization reaction is: OH - +H + →H2O.

7. The cutting wire protection method according to claim 1, characterized in that: The inert metal piece is platinum.

8. Application of a method for protecting a cutting steel wire, characterized in that: During the cutting process of the target silicon piece, the pH value of the water-based cutting fluid is controlled within the target value to protect the cutting steel wire.

9. A protective device for cutting steel wire, characterized in that: include: DC regulated power supply; Inert metal parts; A positive wire, one end of which is connected to the positive electrode of the DC regulated power supply, and the other end of which is connected to the inert metal part, so that the inert metal part becomes an anode of the surrounding environment; and A negative electrode wire, one end of which is connected to the negative electrode of the DC regulated power supply, and the other end of which is connected to the cutting steel wire, so that the cutting steel wire becomes the cathode of the surrounding environment; At least part of the positive electrode wire and at least part of the negative electrode wire are immersed in the water-based cutting fluid stored in the liquid storage unit, so that the water-based cutting fluid, the cutting steel wire and the inert metal member form a current loop.

10. A cutting machine, characterized in that: The invention comprises a cutting steel wire and a protective device, wherein the cutting steel wire is used for cutting a target silicon piece, and the protective device is used for controlling the pH value of a water-based cutting fluid within a target value during the cutting process so as to protect the cutting steel wire.

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