Dynamic film soldering flux printing method and printing device

Abstract

The invention relates to a dynamic thin film soldering flux printing method and device, and the method comprises the steps: 1, taking out a thin film, tensioning the thin film, and covering a steel mesh with the thin film; 2, air pressure is applied to the thin film, so that the thin film protrudes out of meshes of the steel mesh; 3, dipping the protruding part of the thin film into the scaling powder; and 4, pressing the thin film on the substrate, and coating the soldering flux on a welding pad of the substrate. The invention discloses a dynamic thin film soldering flux printing method and device. The printing device specifically comprises a thin film, a tensioning mechanism, a steel mesh, an air pressurizing device and a printing lifting device. The method has the advantages that a flexible and efficient scaling powder coating solution is provided, the protruding degree of the thin film is controlled through air pressurization, and the method is suitable for substrates of different sizes and shapes by means of dynamic deformation of the thin film; and accurate coating thickness and uniformity of the soldering flux are realized.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor packaging, in particular to a dynamic thin film soldering flux printing method and a printing device. Background Art

[0002] In the electronics manufacturing process, it is critical to ensure that flux is evenly coated on the soldering substrate. Traditionally, a stencil is used for coating, but there are some limitations, such as the handling of large substrates, uneven printing on uneven and warped substrate surfaces, and flux waste.

[0003] In response to the above problems, the Chinese utility model patent: Special-shaped steel mesh based on solder paste printing of special-shaped copper substrate (publication number: CN 215512787U) provides a technical solution for printing special-shaped substrates: special-shaped steel mesh based on solder paste printing of special-shaped copper substrates, based on the existing process technology, the flat steel mesh is improved into a new process with a high degree of 3D state, and then the printing process of special-shaped groove copper substrates can be completed. The above solution solves the problem of uneven printing of special-shaped substrates to a certain extent, but it is necessary to customize the steel mesh protrusions that match the substrate grooves according to the printing requirements, which has a high production cost and poor flexibility and applicability.

[0004] Therefore, there is a need to further improve the substrate soldering flux printing method and device to more effectively solve the problem of poor soldering flux printing quality. Summary of the invention

[0005] The object of the present invention is to provide a dynamic thin film soldering flux printing method and printing device, which realizes a more flexible and efficient soldering flux coating process by utilizing a thin film to replace the traditional steel screen printing.

[0006] A first aspect of the present invention provides a dynamic thin film solder flux printing method, comprising the following steps:

[0007] Step 1: Take out the film, stretch it and cover it on the steel mesh;

[0008] Step 2: Apply air pressure to the film so that the film protrudes from the mesh of the steel mesh;

[0009] Step 3: Dip the protruding part of the film into the flux;

[0010] Step 4: The film is pressed down onto the substrate, applying flux to the substrate's pads.

[0011] In the above step 2, mesh holes are opened in the steel mesh according to the corresponding positions of each welding point, and printing is performed synchronously.

[0012] In the above step 2, mesh holes are opened in the steel mesh at a fixed interval and printed in steps.

[0013] In the above step 2, optical detection is added to the film pressurization process to observe the contact between the protruding film and the welding pad.

[0014] Based on the above-mentioned dynamic thin film solder flux printing method, the second aspect of the present invention provides a dynamic thin film solder flux printing device, which runs the above-mentioned dynamic thin film solder flux printing method, and specifically includes a film, a tensioning mechanism, a steel mesh, an air pressurizing device, and a printing lifting device;

[0015] The steel mesh is provided with a plurality of mesh holes, and the tensioning mechanism is located on the side of the steel mesh;

[0016] The air pressurizing device and the printing lifting device are both located above the steel mesh;

[0017] The tensioning mechanism is used for tensioning and covering the film in step 1;

[0018] The air pressurizing device is used to apply air pressure to the film in step 2;

[0019] The printing lifting device is used for pressing down the film and applying the soldering flux in step 4.

[0020] Preferably, a drum is provided on the side of the steel mesh, and the film is stored in the drum.

[0021] As a further improvement of the invention, the number and spacing of the mesh holes are adapted to the welding pads.

[0022] As a further improvement of the invention, the mesh holes are arranged at equal intervals on the steel mesh.

[0023] As a further improvement of the invention, the air pressurizing device is provided with an optical detection device.

[0024] The key point of the present invention is that it is particularly suitable for processing large warped substrates and substrates with irregular surfaces. The film is laid flat on a steel mesh, and the tensioning mechanism gives the laid film a certain tension, which is convenient for subsequent film deformation; the air pressurizing device causes the film to deform and bulge in each mesh, and the steel mesh and the film are moved to the top of the existing material trough using the existing moving device. After the protruding part of the film is dipped in the soldering flux in the trough, the protruding part of the film is pressed down. The film is flexibly and dynamically deformed according to the shape of the substrate, and the film can be better fitted with the soldering pad, and the soldering flux is evenly coated on the soldering pad to achieve the printing of the soldering flux.

[0025] Compared with the prior art, the dynamic thin film solder flux printing method and printing device of the present invention have the following advantages:

[0026] It provides a flexible and efficient flux coating solution, which controls the protrusion of the film through air pressurization and utilizes the dynamic deformation of the film. It is suitable for substrates of different sizes and shapes, and achieves precise flux coating thickness and uniformity. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 A schematic diagram of a dynamic thin film solder flux printing method of the present invention;

[0028] Figure 2 A schematic diagram of a dynamic thin film solder flux printing device of the present invention;

[0029] Figure 3 This is a schematic diagram of the state where the film is laid flat on the steel mesh;

[0030] Figure 4 Schematic diagram of the deformation state of the film in the mesh;

[0031] Figure 5 It is a structural schematic diagram of the steel mesh opening method 1;

[0032] Figure 6 This is a structural schematic diagram of the second steel mesh opening method;

[0033] Figure 7 Schematic diagram of two-step printing using steel mesh opening method. DETAILED DESCRIPTION

[0034] The specific implementation modes of the present invention are further described in detail below in conjunction with the accompanying drawings.

[0035] A first aspect of the present invention provides a dynamic thin film solder flux printing method, comprising the following steps:

[0036] Step 1: Take out the film, stretch it and cover it on the steel mesh;

[0037] Step 2: Apply air pressure to the film so that the film protrudes from the mesh of the steel mesh;

[0038] Step 3: Dip the protruding part of the film into the flux;

[0039] Step 4: The film is pressed down onto the substrate, applying flux to the substrate's pads.

[0040] In the above step 2, mesh holes are opened in the steel mesh according to the corresponding positions of each welding point, and printing is performed synchronously.

[0041] In the above step 2, mesh holes are opened in the steel mesh at a fixed interval and printed in steps.

[0042] In the above step 2, optical detection is added to the film pressurization process to observe the contact between the protruding film and the welding pad.

[0043] like Figure 1-2 As shown, based on the above-mentioned dynamic thin film solder flux printing method, the second aspect of the present invention provides a dynamic thin film solder flux printing device, which runs the above-mentioned dynamic thin film solder flux printing method, and specifically includes a film 2, a tensioning mechanism 3, a steel mesh 4, an air pressurizing device 5, and a printing lifting device 7;

[0044] The steel mesh 4 is provided with a plurality of mesh holes 41, and the tensioning mechanism 3 is located on the side of the steel mesh 4;

[0045] The air pressurizing device 5 and the printing lifting device 7 are located above the steel mesh 4;

[0046] A tensioning mechanism 3, used for tensioning and covering the film in step 1;

[0047] An air pressurizing device 5, used to apply air pressure to the film in step 2;

[0048] The printing lifting device 7 is used for pressing down the film in step 4 and applying the soldering flux.

[0049] The present invention further introduces in detail the related equipment involved in a dynamic thin film soldering flux printing device.

[0050] Film 2

[0051] A drum 1 is provided on the side of the steel mesh 4, and the film 2 to be used is stored in the drum 1. The drum 1 can ensure the cleanliness of the stored film 2 and facilitate the extraction of each film, thus meeting the needs of online production.

[0052] The film 2 can be a disposable consumable material, which is convenient for replacement after each use, thereby reducing cleaning and maintenance costs.

[0053] The film 2 can also be made of a reusable and easily recoverable material. The film can be reused repeatedly to ensure long-term stable performance and coating quality without repeated debugging.

[0054] Steel mesh 4

[0055] The opening structure of the steel mesh 4 can be the following two types:

[0056] Method 1: If Figure 5 As shown, the number and spacing of the meshes 41 are matched with the pads 61. During printing, the protruding portions of the film in each mesh 41 are dipped in the soldering flux 8 and then pressed down on the corresponding soldering pads 61, and the soldering flux of the substrate 6 is synchronously printed to improve production efficiency.

[0057] Method 2: If Figure 6-7As shown, each mesh 41 is arranged at equal intervals on the steel mesh 4. During printing, after the protruding portion of the film in each mesh 41 is dipped in the soldering flux 8, the film 2 is pressed down onto the soldering pads 61 at equal intervals. Subsequently, the steel mesh 4 is moved in parallel using existing mobile equipment, and each soldering pad 61 is alternately printed in batches to achieve step-by-step printing of the soldering flux. The above-mentioned opening structure can reduce the number of openings, and is more conducive to the deformation of the film 2 according to the soldering pads 61 of different shapes, ensuring close fit with the soldering pads 61, making the printing more uniform, and can be flexibly used on various substrates 6.

[0058] Air pressurizing device 5

[0059] The tensioning mechanism 3, the air pressurizing device 5, and the printing lifting device 7 are existing devices.

[0060] The air pressurizing device 5 is provided with an existing optical detection device. After the single film 2 is stretched and covered on the steel mesh 4, the air pressurizing device 5 pressurizes the film 2. Figure 3-4 As shown, the ductile film 2 is deformed downward from the mesh 41 and extends out of the mesh 41, and the protruding portion of the film can be dipped in the soldering flux 8 to facilitate subsequent printing.

[0061] Due to the different warping values ​​of the substrate 6, for the film 2 used for the first time, the contact between the protruding part of the film and the welding pad 61 of the substrate 6 can be observed through optical detection equipment. According to the fit and printing conditions between the film 2 and the surface of the welding pad 61, the air pressure of the air pressurizing device 5 can be adjusted to ensure that the deformation degree of the film 2 in the mesh 41 is within the appropriate range required for printing quality.

[0062] A dynamic film solder flux printing device of the present invention is particularly suitable for processing a large warp substrate 6 and a substrate 6 with an irregular surface. The film 2 is laid flat on a steel mesh 4, and the tensioning mechanism 3 makes the laid film 2 have a certain tension, which is convenient for subsequent film deformation; the air pressurizing device 5 makes the film 2 deform and bulge in each mesh 41, and the steel mesh 2 and the film 2 are moved to the top of the existing material tank using the existing moving device. After the protruding part of the film is dipped in the solder flux 8 in the tank, the protruding part of the film is pressed down, and the film 2 is flexibly and dynamically deformed according to the shape of the substrate 6, and the film 2 can be better fitted with the solder pad 61, and the solder flux 8 is evenly coated on the solder pad 61 to achieve the printing of the solder flux.

[0063] The preferred embodiments of the present invention have been specifically described above, but the present invention is not limited to the described embodiments. Those skilled in the art may make various equivalent modifications or substitutions without violating the spirit of the present invention. These equivalent modifications or substitutions are all included in the scope defined by the claims of this application.

Claims

1. A dynamic thin film solder flux printing method, characterized in that: The steps include: Step 1: Take out the film, stretch it and cover it on the steel mesh; Step 2: Apply air pressure to the film so that the film protrudes from the mesh of the steel mesh; Step 3: Dip the protruding part of the film into the flux; Step 4: The film is pressed down onto the substrate, applying flux to the substrate's pads.

2. A dynamic thin film soldering flux printing method as claimed in claim 1, characterized in that: The steel mesh is opened with mesh holes according to the corresponding positions of each welding point and printed synchronously.

3. A dynamic thin film soldering flux printing method as claimed in claim 1, characterized in that: The steel mesh is opened with mesh holes at a fixed interval and printed in steps.

4. A dynamic thin film soldering flux printing method as claimed in claim 1, characterized in that: Add optical detection to the film pressurization process to observe the contact between the protruding film and the pad.

5. A dynamic thin film solder flux printing device, characterized in that: Running the above-mentioned dynamic thin film solder flux printing method, specifically including a film, a tensioning mechanism, a steel mesh, an air pressurizing device, and a printing lifting device; The steel mesh is provided with a plurality of mesh holes, and the tensioning mechanism is located on the side of the steel mesh; The air pressurizing device and the printing lifting device are both located above the steel mesh; The tensioning mechanism is used for tensioning and covering the film in step 1; The air pressurizing device is used to apply air pressure to the film in step 2; The printing lifting device is used for pressing down the film and applying the soldering flux in step 4.

6. A dynamic thin film solder flux printing device as claimed in claim 5, characterized in that: A rotating drum is arranged on the side of the steel mesh, and the film is stored in the rotating drum.

7. A dynamic thin film solder flux printing device as claimed in claim 5, characterized in that: The number and spacing of the mesh holes are matched with the welding pad.

8. A dynamic thin film solder flux printing device as claimed in claim 5, characterized in that: The mesh holes are arranged on the steel mesh at equal intervals.

9. A dynamic thin film solder flux printing device as claimed in claim 5, characterized in that: The air pressurizing device is provided with an optical detection device.

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