Detection device for ultra-fine gold bonding wires for advanced packaging
By designing an advanced packaged ultrafine bonded alloy wire detection device, using automated transportation components and detection components, the problems of complex operation and low detection efficiency in the prior art are solved, and more efficient and accurate detection effects are achieved.
Patent Information
- Application Number
- CN202411661307.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-20
- Publication Date
- 2025-03-21
- Estimated Expiration
- 2044-11-20
AI Technical Summary
The existing bonded wire detection device is complex in operation, and artificial mobile chips can easily lead to inaccurate detection position, and inconvenient disassembly of the detection head, which reduces the detection efficiency.
An advanced packaged ultrafine bonded wire detection device is designed, using a combination of transportation components and detection components to realize automated bonded wire detection and collection through mechanical and electrical components such as cylinders, servo motors and sensors, simplifying the operation process.
The stability and efficiency of detection are improved, human error is reduced, the operation of the detection device is simplified, and the accuracy of the detection results and the user experience of the detection device are improved.
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Figure CN119147372B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field related to gold bonding wire detection, and in particular to a detection device for ultra-fine gold bonding wires of advanced packaging. Background Art
[0002] The use of integrated circuits and semiconductor components is becoming more and more widespread, and the use of bonding wires for integrated circuits and semiconductor components is also increasing. After the production of bonding wires, the bonding wires need to undergo multiple quality tests, including tensile tests.
[0003] At present, when the existing detection device for bonding gold wires detects the gold wires on the chip, the staff is required to move the position of the chip several times and fix it, and then perform tension detection on the gold wires on the chip through the detection device above. This detection method is relatively complicated for the staff to operate, and the manual movement of the chip can easily lead to inaccurate detection position, which in turn affects the result of the tension detection. At the same time, the detection head in the existing detection device for bonding gold wires is inconvenient to disassemble, which reduces the detection efficiency of the bonding gold wires. Summary of the invention
[0004] In order to solve the defects in the prior art, the present invention provides a detection device for ultra-fine gold bonding wires of advanced packaging.
[0005] In order to solve the above technical problems, the present invention provides the following technical solutions:
[0006] The present invention discloses a detection device for an ultrafine gold bonding wire of advanced packaging. The material formula of the ultrafine gold bonding wire includes the following chemical components by mass content: silver: 7.0% to 8.5%; palladium: 2.5% to 5.0%; copper: 0.0035% to 0.0039%; nickel: 0.0016% to 0.002%; cobalt: 0.0016% to 0.0022%; silicon: 0.00015% to 0.0045%; indium: 0.00015% to 0.0045%; calcium: 0.00015% to 0.0045%; bismuth 0.0006% to 0.0018%, aluminum 0.00022% to 0.00075%; cerium: 0.00015% to 0.0045%, and the balance is gold and unavoidable impurity elements;
[0007] The purity of the gold is not less than 99.998wt%, the purity of the silver is not less than 99.99wt%, the purity of the palladium is not less than 99.995wt%, the purity of the copper is not less than 99.95wt%, and the purity of the calcium is not less than 99.9wt%;
[0008] The detection device includes:
[0009] A main machine platform, wherein a transport component is arranged on the upper surface of the main machine platform at the front end, a bonding wire component is installed inside the upper side of the transport component, and a frame is fixedly connected to the upper surface of the main machine platform at the rear end, and a detection component is installed on the top of the frame for performing tension detection on the bonding wire component;
[0010] The transport assembly includes two lower support plates, the bottoms of the two lower support plates are fixedly connected to the middle part of the upper surface of the main platform, the upper ends of the two lower support plates are fixedly connected to the transport platform, a storage cylinder is embedded in the upper surface of the right end of the transport platform, and two side surfaces of the lower end of the storage cylinder are provided with a conveying groove for conveying the bonding gold wire assembly, a lower guide hole is provided on the lower surface of the right end of the transport platform, a conveying plate is arranged in the groove at the right end of the transport platform, a driven plate is fixedly connected to the lower surface of the right end of the conveying plate, a lower adjustment cylinder is fixedly installed on the lower surface of the left end of the transport platform, and a piston rod on the right side of the lower adjustment cylinder is fixedly connected to the left side of the driven plate;
[0011] The transport component also includes two outer panels, one end of the two outer panels close to each other is respectively fixedly connected to the top of the two lower support panels away from each other, and two alignment cylinders are fixedly installed on the top of the opposite sides of the two outer panels, and the transport platform is provided with two alignment holes on the front and back sides of the left end thereof, and the inner cavities of the two alignment holes are clamped with two main splints, and the sides of the two main splints away from each other are respectively fixedly connected to the opposite ends of the two alignment cylinders, and the left sides of the opposite sides of the two main splints are fixedly connected to two corner blocks, and the two corner blocks are embedded with two pressure sensors on the sides of the lower ends thereof, and the right ends of the two pressure sensors are fixedly connected to two inner splints;
[0012] Two inner clamps are fixedly connected to the lower surfaces of the two corner blocks at the right ends thereof, a recycling box is fixedly connected to the lower surface of the left end of the transport platform, an infrared transmitter is embedded in the upper right corner of the front of the recycling box, and an infrared receiver is embedded in the upper right corner of the back of the recycling box;
[0013] The bonding gold wire assembly includes a substrate, the substrate is arranged on the upper surface of the left end of the transport platform, the upper surface of the substrate is connected with a chip, and the chip and the upper surface of the substrate are both welded with ultra-fine bonding gold wires;
[0014] The detection component includes a lifting cylinder, the bottom of which is mounted on the top of the frame, a servo motor is mounted on the end of the piston rod of the lifting cylinder located on the lower side, a carrier box is connected to the end of the output shaft of the servo motor located on the lower side, two upper guide holes are provided on the front and back of the carrier box, driven boxes are inserted into the inner cavities of the two upper guide holes, a horizontal adjustment cylinder is mounted on the right side of the carrier box, and the left end of the horizontal adjustment cylinder is fixedly connected to the right side of the driven box;
[0015] A longitudinal adjustment hole is provided on the lower surface of the driven box, and a longitudinal adjustment column is inserted into the longitudinal adjustment hole and the inner cavity at the front end of the driven box. The inner wall of the longitudinal adjustment column at the upper end is threadedly connected with a longitudinal adjustment rod, and the front end and rear end of the longitudinal adjustment rod are respectively embedded in the front and back of the driven box through bearings. A longitudinal adjustment motor is fixedly installed on the back of the driven box, and the front end of the longitudinal adjustment motor is fixedly connected to the rear end of the longitudinal adjustment rod. The lower end of the longitudinal adjustment column is fixedly connected to a carrier plate, and a tension sensor is installed on the lower surface of the front end of the carrier plate, and the lower end of the tension sensor is fixedly connected to an assembly set;
[0016] A positioning spring is fixedly connected to the top surface of the inner cavity of the assembly sleeve, and an inner pad is fixedly connected to the lower end of the positioning spring. A right guide hole is provided on the outer wall on the right side of the assembly sleeve, and two guide grooves are provided on the front and rear surfaces of the inner cavity of the right guide hole. The inner cavities of the two guide grooves are both clamped with hand plates, and the left end of the hand plate is fixedly connected to the right outer wall of the inner pad. A T-shaped left unloading hole is provided on the left outer wall of the assembly sleeve, and a hook is inserted into the inner cavity of the assembly sleeve at the lower end, and two butterfly plates are fixedly connected to the outer walls on both sides of the hook at the upper end;
[0017] A camera is installed on the lower surface of the rear end of the carrier, a tension display is installed on the front of the front outer panel, and an image display is installed on the lower surface of the frame at the front end.
[0018] As a preferred technical solution of the present invention, the two inner chucks are made of silicone and are both hemispherical in shape.
[0019] As a preferred technical solution of the present invention, the tension sensor is electrically connected to the tension display, the camera is tilted at an angle of 15°, and the camera is electrically connected to the image display.
[0020] The beneficial effects of the present invention are:
[0021] 1. The detection device for the ultra-fine gold bonding wire of the advanced package, through the transportation component set, first controls the start of the downward adjustment cylinder to drive the gold bonding wire component in the conveying trough to move to the left, when the gold bonding wire component contacts the pressure sensor, the two alignment cylinders will be started, and the start of the two alignment cylinders can drive the two main clamping plates to move in opposite directions, when the opposite sides of the two main clamping plates are in full contact with the end face of the gold bonding wire component, the clamping and fixing of the gold bonding wire component is quickly completed, and the gold bonding wire can be more stable during detection, and then the start of the two alignment cylinders can be controlled again to drive the two main clamping plates to separate from the surface of the gold bonding wire component, and then the start of the downward adjustment cylinder can drive the new The gold bonding wire assembly moves to the left, and the movement of the gold bonding wire assembly to the left can push the detected gold bonding wire assembly to move to the left. When the detected gold bonding wire assembly moves to the arc surface on the left side of the transport platform, it will automatically fall into the recycling box. In this way, the automatic collection of the detected gold bonding wire assembly can be quickly completed. Finally, when the fallen gold bonding wire assembly passes between the infrared transmitter and the infrared receiver, the alignment cylinder will be controlled to start again. The start of the alignment cylinder can drive the corner block to return to the initial position again. At this time, the corner block can block and limit the new gold bonding wire assembly moving to the left, thereby facilitating the detection assembly to detect the new gold bonding wire assembly, thereby greatly improving the practicability of the detection device.
[0022] 2. The detection device for the ultra-fine gold bonding wire of the advanced package is provided with a lifting cylinder, a servo motor, a horizontal adjustment cylinder, a vertical adjustment motor, a tension sensor, a tension display, a camera and an image display. First, the lifting cylinder is controlled to start to drive the hook to move downward to the position of the gold bonding wire. Then, the lifting cylinder is controlled to start again to drive the hook to move upward. The upward movement of the hook can pull the gold bonding wire. When the gold bonding wire breaks, the tension sensor and the tension display can be used in conjunction to record the detection result in time. Then, the horizontal adjustment cylinder is controlled to start to drive the hook to move left and right. By controlling the forward and reverse rotation of the longitudinal adjustment motor, the hook can be driven to move forward and backward. By controlling the forward and backward movement of the hook, the detection device can perform tension detection on different positions of the bonding gold wires, which can improve the accuracy of the detection results. Finally, controlling the start of the servo motor can drive the driven box and the hook to rotate at the same time. By controlling the rotation of the hook, the hook can detect the bonding gold wires around the chip separately. This can ensure the integrity of the detection data and greatly improve the user experience of the detection device.
[0023] 3. The detection device for the ultra-fine bonded gold wire of the advanced package, through the assembly set, positioning spring, inner pad, hook, hand plate and butterfly plate, firstly controls the rotation of the butterfly plate to drive the rotation of the hook, and the rotation of the hook can be conveniently stuck to the outside of the bonded gold wire, and at the same time, it can also be convenient to detach from the bonded gold wire and perform tension detection on other bonded gold wires, which greatly improves the convenience of the detection device, and then controls the hand plate to move upward, and the upward movement of the hand plate can drive the inner pad to move upward. When the inner pad moves upward to the highest position, the hook is pushed upward and the top of the hook is controlled to move to the top position of the left unloading hole, and then the hook is controlled to move to the left to quickly complete its disassembly. This disassembly method saves time and effort, and finally the new hook is inserted into the inner cavity of the assembly set through the left unloading hole. At this time, the hand plate is released, and the elastic force of the positioning spring will push the inner pad to move downward. The inner pad moves downward and can squeeze the upper end of the hook downward, so that the hook is quickly replaced, thereby further improving the working efficiency of the detection device. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:
[0025] Figure 1 It is a structural schematic diagram of a detection device for ultra-fine gold bonding wires of advanced packaging of the present invention;
[0026] Figure 2 It is a front view of a detection device for ultra-fine gold bonding wires of advanced packaging of the present invention;
[0027] Figure 3 It is a structural schematic diagram of a detection device for ultra-fine gold bonding wires for advanced packaging of the present invention from a right side perspective;
[0028] Figure 4 It is a schematic structural diagram of a detection device for ultra-fine gold bonding wires for advanced packaging of the present invention from a bottom perspective;
[0029] Figure 5 It is a front cross-sectional view of a detection device for ultra-fine gold bonding wires for advanced packaging of the present invention;
[0030] Figure 6 The invention is a detection device for ultra-fine bonding gold wire of advanced packaging Figure 5 Stereoscopic image of
[0031] Figure 7 It is a side cross-sectional view of a detection device for ultra-fine gold bonding wires for advanced packaging of the present invention;
[0032] Figure 8 The invention is a detection device for ultra-fine bonding gold wire of advanced packaging Figure 7 Stereoscopic image of
[0033] Fig. 9 The invention is a detection device for ultra-fine bonding gold wire of advanced packaging Figure 8 Structural diagram from the right side perspective;
[0034] Fig.10 It is an exploded view of the structure of the detection component part of the detection device of the ultra-fine bonding gold wire of the advanced packaging of the present invention;
[0035] Fig.11 The invention is a detection device for ultra-fine bonding gold wire of advanced packaging Fig.10 The structural diagram from the left perspective;
[0036] Fig.12 It is a structural schematic diagram of a gold bonding wire assembly of a detection device for ultra-fine gold bonding wires of advanced packaging of the present invention;
[0037] Fig.13 It is a front view of the connection structure between the alignment cylinder and the main clamping plate of the detection device of the advanced packaged ultra-fine bonding gold wire of the present invention;
[0038] Fig.14 The invention is a detection device for ultra-fine bonding gold wire of advanced packaging Fig.13 Stereoscopic image of
[0039] Fig.15 The invention is a detection device for ultra-fine bonding gold wire of advanced packaging Figure 5 Enlarged view of point A in the middle;
[0040] Fig.16 The invention is a detection device for ultra-fine bonding gold wire of advanced packaging Figure 7 Enlarged view of point B in the middle.
[0041] In the figure: 1. Main platform; 2. Transport assembly; 201. Lower support plate; 202. Transport platform; 203. Storage barrel; 204. Transport trough; 205. Lower guide hole; 206. Transport plate; 207. Follower plate; 208. Lower adjustment cylinder; 209. External plate; 210. Alignment cylinder; 211. Alignment hole; 212. Main clamping plate; 213. Corner block; 214. Pressure sensor; 215. Inner clamping plate; 216. Inner clamping head; 217. Recycling box; 218. Infrared transmitter; 219. Infrared receiver; 3. Bonding wire assembly; 301. Substrate; 302. Chip; 303. Ultrafine bonding wire ;4. Rack;5. Detection component;501. Lifting cylinder;502. Servo motor;503. Carrier box;504. Upper guide hole;505. Driven box;506. Horizontal adjustment cylinder;507. Vertical adjustment hole;508. Vertical adjustment column;509. Vertical adjustment rod;510. Vertical adjustment motor;511. Carrier plate;512. Tension sensor;513. Assembly set;514. Positioning spring;515. Inner pad;516. Right guide hole;517. Guide groove;518. Hand plate;519. Left unloading hole;520. Hook;521. Butterfly plate;522. Camera;523. Tension display;524. Image display. DETAILED DESCRIPTION
[0042] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.
[0043] Example: Figure 1-16As shown, the present invention is a detection device for an ultrafine bonding gold wire for advanced packaging, and the material formula of the ultrafine bonding gold wire includes the following chemical components by mass content: silver: 7.0% to 8.5%; palladium: 2.5% to 5.0%; copper: 0.0035% to 0.0039%; nickel: 0.0016% to 0.002%; cobalt: 0.0016% to 0.0022%; silicon: 0.00015% to 0.0045%; indium: 0.00015% ~0.0045%; calcium: 0.00015%~0.0045%; bismuth: 0.0006~0.0018%, aluminum: 0.00022~0.00075%; cerium: 0.00015%~0.0045%, the remainder is gold and unavoidable impurity elements; the purity of gold is not less than 99.998wt%, the purity of silver is not less than 99.99wt%, the purity of palladium is not less than 99.995wt%, and the purity of copper is not less than 99.95w t%, the purity of calcium is not less than 99.9wt%, and its material formula includes the following chemical components by mass content: silver: 7.0%~8.5%; palladium: 2.5%~5.0%; copper: 0.0035%~0.0039%; nickel: 0.0016%~0.002%; cobalt: 0.0016%~0.0022%; silicon: 0.00015%~0.0045%; indium: 0.00015%~0.0045%; calcium: 0. 0.00015%~0.0045%; bismuth 0.0006~0.0018%, aluminum 0.00022~0.00075%; cerium: 0.00015%~0.0045%, the remainder is gold and unavoidable impurity elements; the purity of gold is not less than 99.998wt%, the purity of silver is not less than 99.99wt%, the purity of palladium is not less than 99.995wt%, the purity of copper is not less than 99.95wt%, and the purity of calcium is not less than 99.9wt%; the detection device comprises: a main platform 1, a transport component 2 is arranged on the upper surface of the main platform 1 at the front end thereof, a bonding gold wire component 3 is installed inside the upper side of the transport component 2, a frame 4 is fixedly connected to the upper surface of the main platform 1 at the rear end thereof, a detection component 5 is installed on the top of the frame 4 for performing tension detection on the bonding gold wire component 3; the transport component 2 comprises two lower support plates 201, the bottoms of the two lower support plates 201 are fixedly connected to the middle of the upper surface of the main platform 1, the upper ends of the two lower support plates 201 are fixedly connected to a transport platform 202, a storage barrel 203 is embedded in the upper surface of the right end of the transport platform 202, and the two side surfaces of the lower end of the storage barrel 203 are provided with transport holes for transporting the bonding gold wire component 3 The lower surface of the right end of the transport platform 202 is provided with a lower guide hole 205, a conveying plate 206 is arranged in the groove at the right end of the transport platform 202, a driven plate 207 is fixedly connected to the lower surface of the right end of the conveying plate 206, a downward adjustment cylinder 208 is fixedly installed on the lower surface of the left end of the transport platform 202, and the piston rod on the right side of the downward adjustment cylinder 208 is fixedly connected to the left side of the driven plate 207; the bonding wire assembly 3 includes a substrate 301, the substrate 301 is arranged on the upper surface of the left end of the transport platform 202, a chip 302 is connected to the upper surface of the substrate 301, and the chip 302 and the upper surface of the substrate 301 are welded with ultrafine bonding wire 303, and the diameter of the ultrafine bonding wire (303) is 12 to 25 microns. .
[0044] The transport assembly 2 also includes two outer panels 209, the ends of the two outer panels 209 close to each other are fixedly connected to the tops of the two lower support plates 201 away from each other, and two alignment cylinders 210 are fixedly installed on the tops of the opposite sides of the two outer panels 209. The transport platform 202 is located at the front and back of the left end thereof. Two alignment holes 211 are provided, and the inner cavities of the two alignment holes 211 are clamped with two main splints 212, and the sides of the two main splints 212 away from each other are fixedly connected to the opposite ends of the two alignment cylinders 210, and the two main splints Two corner blocks 213 are fixedly connected to the left side of the opposite side 212, and two pressure sensors 214 are embedded in the side surfaces of the lower ends of the two corner blocks 213, and two inner clamps 215 are fixedly connected to the right ends of the two pressure sensors 214; two inner clamps 216 are fixedly connected to the lower surfaces of the right ends of the two corner blocks 213, and a recycling box 217 is fixedly connected to the lower surface of the left end of the transport platform 202, and an infrared transmitter 218 is embedded in the upper right corner of the front of the recycling box 217, and an infrared receiver 219 is embedded in the upper right corner of the back of the recycling box 217.
[0045] Among them, through the set transportation component 2, first control the lowering cylinder 208 to start, the lowering cylinder 208 starting can drive the driven plate 207 and the conveying plate 206 to move to the left at the same time, the conveying plate 206 moving to the left can drive the bonding wire assembly 3 in the conveying groove 204 to move to the left, when the bonding wire assembly 3 contacts with the pressure sensor 214, the two alignment cylinders 210 will be started, the two alignment cylinders 210 starting can drive the two main clamping plates 212 to move in opposite directions, when the opposite sides of the two main clamping plates 212 are in full contact with the end face of the bonding wire assembly 3, the bonding wire assembly 3 is quickly clamped and fixed, and it can ensure that the bonding wire is more stable during detection.
[0046] The detection component 5 includes a lifting cylinder 501, the bottom of which is mounted on the top of the frame 4, a servo motor 502 is mounted at the end of the piston rod of the lifting cylinder 501 at the lower side thereof, a carrier box 503 is connected to the end of the output shaft of the servo motor 502 at the lower side thereof, two upper guide holes 504 are provided on the front and back sides of the carrier box 503, driven boxes 505 are inserted into the inner cavities of the two upper guide holes 504, a horizontal adjustment cylinder 506 is mounted on the right side of the carrier box 503, and the left end of the horizontal adjustment cylinder 506 is connected to the driven box 505. 5 is fixedly connected to the right side of the driven box 505; a longitudinal adjustment hole 507 is opened on the lower surface of the driven box 505, and a longitudinal adjustment column 508 is inserted into the inner cavity of the longitudinal adjustment hole 507 and the front end of the driven box 505. The inner wall of the longitudinal adjustment column 508 at the upper end is threadedly connected to a longitudinal adjustment rod 509, and the front and rear ends of the longitudinal adjustment rod 509 are respectively embedded in the front and back of the driven box 505 through bearings, and a longitudinal adjustment motor 510 is fixedly installed on the back of the driven box 505, and the front end of the longitudinal adjustment motor 510 is fixedly connected to the rear end of the longitudinal adjustment rod 509, and the longitudinal adjustment column 50 The lower end of the mounting sleeve 518 is fixedly connected to a carrier plate 511, a tension sensor 512 is installed on the lower surface of the front end of the carrier plate 511, and an assembly sleeve 513 is fixedly connected to the lower end of the tension sensor 512; a positioning spring 514 is fixedly connected to the top surface of the inner cavity of the assembly sleeve 513, and an inner pad 515 is fixedly connected to the lower end of the positioning spring 514. A right guide hole 516 is provided on the outer wall on the right side of the assembly sleeve 513, and two guide grooves 517 are provided on the front and rear surfaces of the inner cavity of the right guide hole 516, and the inner cavities of the two guide grooves 517 are both clamped with hand plates. 518, and the left end of the hand plate 518 is fixedly connected with the right outer wall of the inner pad 515, the left outer wall of the assembly sleeve 513 is provided with a T-shaped left unloading hole 519, the inner cavity of the assembly sleeve 513 at its lower end is plugged with a hook 520, and the outer walls on both sides of the hook 520 at its upper end are fixedly connected with two butterfly plates 521; a camera 522 is installed on the lower surface of the rear end of the carrier plate 511, a tension display 523 is installed on the front of the front outer panel 209, and an image display 524 is installed on the lower surface of the frame 4 at its front end.
[0047] Among them, by setting up the detection component 5, first controlling the lifting cylinder 501 to start can drive the servo motor 502 and the carrier box 503 to move downward at the same time, the downward movement of the carrier box 503 can drive the longitudinal adjustment column 508 and the carrier plate 511 to move downward at the same time, the downward movement of the carrier plate 511 can drive the tension sensor 512 and the assembly set 513 to move downward at the same time, and the downward movement of the assembly set 513 can drive the hook 520 to move downward to the position of the ultra-fine bonding gold wire 303. At this time, the camera 522 can transmit the captured image to the image display 524, which is convenient for the staff to clamp the hook 520 on the ultra-fine bonding gold wire 303, and then control it again. When the lifting cylinder 501 is started, the hook 520 can be driven to move upward, and the upward movement of the hook 520 can pull the ultra-fine bonding gold wire 303. When the ultra-fine bonding gold wire 303 breaks, the coordinated use of the tension sensor 512 and the tension display 523 can record the detection results in time, and then the horizontal adjustment cylinder 506 is controlled to start, which can drive the driven box 505 and the vertical adjustment column 508 to move left and right at the same time. The left and right movement of the vertical adjustment column 508 can drive the hook 520 to move left and right. Through the left and right movement of the hook 520, multiple bonding gold wires on the same side can be easily detected, thereby improving the detection efficiency of the bonding gold wires in advance.
[0048] The two inner clamps 216 are made of silicone and are both hemispherical in shape.
[0049] The inner clamp 216 can conveniently clamp and limit the top of the bonding wire assembly 3 inserted into the corner block 213.
[0050] like Figure 7 and Fig.16 As shown, the tension sensor 512 is electrically connected to the tension display 523 , the camera 522 is tilted at an angle of 15°, and the camera 522 is electrically connected to the image display 524 .
[0051] The tension detected by the tension sensor 512 will be displayed and recorded on the tension display 523 , and the camera 522 can transmit the captured image to the image display 524 , making it convenient for the staff to clamp the hook 520 on the ultra-fine bonding gold wire 303 .
[0052] During operation, the positioning of the detection part: first, the lowering cylinder 208 is controlled to start, and the lowering cylinder 208 can drive the driven plate 207 and the conveying plate 206 to move to the left at the same time, and the conveying plate 206 can drive the bonding wire assembly 3 in the conveying groove 204 to move to the left. When the bonding wire assembly 3 contacts the inner clamping plate 215 on the pressure sensor 214, the two alignment cylinders 210 will be started. The two alignment cylinders 210 can drive the two main clamping plates 212 to move in opposite directions. When the opposite sides of the two main clamping plates 212 are fully in contact with the end faces of the bonding wire assembly 3, the bonding wire assembly 3 is quickly clamped and fixed, and it can ensure that the bonding wire is more stable during detection;
[0053] Gold bonding wire detection: First, control the lifting cylinder 501 to start, which can drive the servo motor 502 and the carrier box 503 to move downward at the same time. The downward movement of the carrier box 503 can drive the longitudinal adjustment column 508 and the carrier plate 511 to move downward at the same time. The downward movement of the carrier plate 511 can drive the tension sensor 512 and the assembly set 513 to move downward at the same time. The downward movement of the assembly set 513 can drive the hook 520 to move downward to the position of the ultra-fine gold bonding wire 303. At this time, the camera 522 can transmit the captured image to the image display 524, which is convenient for the staff to clamp the hook 520 on the ultra-fine gold bonding wire 303. Control the lifting cylinder 501 to start again, which can drive the hook 520 to move upward. The upward movement of the hook 520 can pull the ultra-fine gold bonding wire 303. When the ultra-fine gold bonding wire 303 breaks, the tension sensor 512 and the tension display 523 can be used in conjunction to record the detection results in time. Then control the horizontal adjustment cylinder 506 to start, which can drive the driven box 5 05 and the longitudinal adjustment column 508 move left and right at the same time, and the longitudinal adjustment column 508 moves left and right to drive the hook 520 to move left and right. Through the left and right movement of the hook 520, multiple bonding gold wires on the same side can be easily detected, which first improves the detection efficiency of the bonding gold wires. Then, the forward and reverse rotation of the longitudinal adjustment motor 510 can drive the longitudinal adjustment rod 509 to move forward and backward, and the forward and reverse rotation of the longitudinal adjustment rod 509 can drive the longitudinal adjustment column 508 to move forward and backward. The forward and backward movement of the longitudinal adjustment column 508 can drive the hook 520 to move forward and backward. By controlling the forward and backward movement of the hook 520, it is convenient for the detection device to perform tension detection on different positions of the ultra-fine bonding gold wire 303, which can improve the accuracy of the detection result. Finally, controlling the servo motor 502 to start can drive the driven box 505 and the hook 520 to rotate at the same time. By controlling the rotation of the hook 520, it is convenient for the hook 520 to detect the ultra-fine bonding gold wires 303 around the chip 302 separately, which can ensure the integrity of the detection data.
[0054] Replacement of the gold bonding wire assembly 3: First, control the two alignment cylinders 210 to start. When the two alignment cylinders 210 are started, the two main clamping plates 212 can be driven to move in opposite directions. When the opposite sides of the two main clamping plates 212 are separated from the surface of the gold bonding wire assembly 3, control the lowering cylinder 208 to start. When the lowering cylinder 208 is started, the conveying plate 206 can be driven to move left again. The conveying plate 206 can drive the new gold bonding wire assembly 3 to move left. The gold bonding wire assembly 3 can push the tested gold bonding wire assembly 3 to move left. When the tested gold bonding wire assembly 3 moves to the curved surface on the left side of the transport platform 202 and automatically falls into the inside of the recycling box 217, so that the automatic collection of the detection bonding gold wire assembly 3 can be quickly completed. Finally, when the dropped bonding gold wire assembly 3 passes between the infrared transmitter 218 and the infrared receiver 219, the alignment cylinder 210 will be controlled to start again. The start of the alignment cylinder 210 can drive the corner block 213 to return to the initial position again. At this time, the inner clamping plate 215 in the corner block 213 can block and limit the new bonding gold wire assembly 3 moving to the left, so as to facilitate the detection component 5 to detect the new bonding gold wire assembly 3;
[0055] Replacement of the hook 520: First, the butterfly plate 521 is controlled to rotate to drive the hook 520 to rotate. The hook 520 can be easily stuck to the outside of the ultra-fine bonded gold wire 303 when it rotates. At the same time, it can also be easily separated from the ultra-fine bonded gold wire 303 and perform tension detection on other ultra-fine bonded gold wires 303, which greatly improves the convenience of the detection device. Then, the hand plate 518 is controlled to move upward. The upward movement of the hand plate 518 can drive the inner pad 515 to move upward. When the inner pad 515 moves upward to the highest position, this At this time, push the hook 520 upward and control the top end of the hook 520 to move to the top position of the left unloading hole 519, and then control the hook 520 to move to the left to quickly complete its disassembly. This disassembly method saves time and effort. Finally, the new hook 520 is inserted into the inner cavity of the assembly sleeve 513 through the left unloading hole 519. At this time, release the hand plate 518, and the elastic force of the positioning spring 514 will push the inner pad 515 to move downward. The downward movement of the inner pad 515 can squeeze the upper end of the hook 520 downward, so that the replacement of the hook 520 is quickly completed.
[0056] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.
Claims
1. A detection device for ultra-fine gold bonding wires for advanced packaging, characterized in that: The material of the ultrafine bonding gold wire includes the following chemical components by mass content: silver: 7.0% to 8.5%; Palladium: 2.5% to 5.0%; Copper: 0.0035%~0.0039%; Nickel: 0.0016% to 0.002%; Cobalt: 0.0016% to 0.0022%; Silicon: 0.00015%~0.0045%; Indium: 0.00015%~0.0045%; Calcium: 0.00015% to 0.0045%; Bismuth: 0.0006% to 0.0018%; Aluminum: 0.00022% to 0.00075%; Cerium: 0.00015% to 0.0045%, the balance being gold and unavoidable impurity elements; The purity of the gold is not less than 99.998wt%, the purity of the silver is not less than 99.99wt%, the purity of the palladium is not less than 99.995wt%, the purity of the copper is not less than 99.95wt%, and the purity of the calcium is not less than 99.9wt%; The detection device includes: A main machine platform (1), wherein a transport component (2) is arranged on the upper surface of the main machine platform (1) at the front end thereof, a bonding gold wire component (3) is installed inside the upper side of the transport component (2), and a frame (4) is fixedly connected to the upper surface of the main machine platform (1) at the rear end thereof, and a detection component (5) is installed on the top of the frame (4) for performing tension detection on the bonding gold wire component (3); The transport assembly (2) comprises two lower support plates (201), the bottoms of the two lower support plates (201) are fixedly connected to the middle of the upper surface of the main platform (1), the upper ends of the two lower support plates (201) are fixedly connected to the transport platform (202), a storage cylinder (203) is embedded in the upper surface of the right end of the transport platform (202), and two side surfaces of the lower end of the storage cylinder (203) are provided with a conveying groove (204) for conveying the bonding wire assembly (3), a lower guide hole (205) is provided on the lower surface of the right end of the transport platform (202), a conveying plate (206) is arranged in the groove at the right end of the transport platform (202), the lower surface of the right end of the conveying plate (206) is fixedly connected to a driven plate (207), and a lower adjustment cylinder (208) is fixedly installed on the lower surface of the left end of the transport platform (202), and the piston rod on the right side of the lower adjustment cylinder (208) is fixedly connected to the left side of the driven plate (207); The transport component (2) also includes two outer panels (209), the ends of the two outer panels (209) close to each other are respectively fixedly connected to the tops of the two lower support plates (201) away from each other, two alignment cylinders (210) are fixedly installed on the tops of the opposite sides of the two outer panels (209), the transport platform (202) is provided with two alignment holes (211) on the front and back sides of the left end thereof, the inner cavities of the two alignment holes (211) are clamped with two main clamping plates (212), and the sides of the two main clamping plates (212) away from each other are respectively fixedly connected to the opposite ends of the two alignment cylinders (210), the left sides of the opposite sides of the two main clamping plates (212) are fixedly connected with two corner blocks (213), the two corner blocks (213) are embedded with two pressure sensors (214) on the side surfaces located at the lower ends thereof, and the right ends of the two pressure sensors (214) are fixedly connected with two inner clamping plates (215); Two inner clamps (216) are fixedly connected to the lower surfaces of the two corner blocks (213) at the right ends thereof, a recycling box (217) is fixedly connected to the lower surface of the left end of the transport platform (202), an infrared transmitter (218) is embedded in the upper right corner of the front side of the recycling box (217), and an infrared receiver (219) is embedded in the upper right corner of the back side of the recycling box (217); The gold bonding wire assembly (3) comprises a substrate (301), the substrate (301) being arranged on the upper surface of the left end of the transport platform (202), the upper surface of the substrate (301) being connected with a chip (302), the chip (302) and the upper surface of the substrate (301) being welded with an ultra-fine gold bonding wire (303), the diameter of the ultra-fine gold bonding wire (303) being 12 to 25 micrometers; The detection component (5) comprises a lifting cylinder (501), the bottom of the lifting cylinder (501) is mounted on the top of the frame (4), a servo motor (502) is mounted on the end of the piston rod of the lifting cylinder (501) located on the lower side thereof, the end of the output shaft of the servo motor (502) located on the lower side thereof is connected to a carrier box (503), two upper guide holes (504) are provided on the front and back sides of the carrier box (503), the inner cavities of the two upper guide holes (504) are both plugged with driven boxes (505), a horizontal adjustment cylinder (506) is mounted on the right side of the carrier box (503), and the left end of the horizontal adjustment cylinder (506) is fixedly connected to the right side of the driven box (505); A longitudinal adjustment hole (507) is provided on the lower surface of the driven box (505); a longitudinal adjustment column (508) is inserted into the inner cavity of the longitudinal adjustment hole (507) and the front end of the driven box (505); a longitudinal adjustment rod (509) is threadedly connected to the inner wall of the upper end of the longitudinal adjustment column (508); the front end and the rear end of the longitudinal adjustment rod (509) are respectively embedded in the front and back of the driven box (505) through bearings; a longitudinal adjustment motor (510) is fixedly installed on the back of the driven box (505); the front end of the longitudinal adjustment motor (510) is fixedly connected to the rear end of the longitudinal adjustment rod (509); the lower end of the longitudinal adjustment column (508) is fixedly connected to a carrier plate (511); a tension sensor (512) is installed on the lower surface of the front end of the carrier plate (511); and the lower end of the tension sensor (512) is fixedly connected to an assembly sleeve (513); A positioning spring (514) is fixedly connected to the top surface of the inner cavity of the assembly sleeve (513), and an inner pad (515) is fixedly connected to the lower end of the positioning spring (514). A right guide hole (516) is provided on the outer wall on the right side of the assembly sleeve (513), and two guide grooves (517) are provided on the front and rear surfaces of the inner cavity of the right guide hole (516). Hand plates (518) are clamped in the inner cavities of the two guide grooves (517), and the left end of the hand plate (518) is fixedly connected to the right outer wall of the inner pad (515). A T-shaped left unloading hole (519) is provided on the left outer wall of the assembly sleeve (513). A hook (520) is inserted into the inner cavity of the assembly sleeve (513) at its lower end, and two butterfly plates (521) are fixedly connected to the outer walls on both sides of the hook (520) at its upper end. A camera (522) is installed on the lower surface of the rear end of the carrier plate (511), a tension display (523) is installed on the front of the front exterior panel (209), and an image display (524) is installed on the lower surface of the front end of the frame (4).
2. The detection device for ultra-fine gold bonding wire for advanced packaging according to claim 1, characterized in that: The material of the two inner clamps (216) is silicone, and the shape of the inner clamps (216) is a hemisphere.
Citation Information
Patent Citations
A bond alloy wire and a preparation method thereof
CN109003903A
Gold alloy bonding wire and preparation method thereof
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