Wafer grabbing method and device

Abstract

The invention relates to the technical field of semiconductors, in particular to a wafer grabbing method and device.The wafer grabbing method comprises the following steps that S01, materials are placed and adsorbed to a base; s02, a driving piece is adopted to drive a top plate to get close to the base, and the top plate presses the materials to the base; s03, when the materials need to be loosened, adsorption between the materials and the base is relieved, and a driving piece is adopted to drive the top plate to be away from the base; s04, when the materials need to be grabbed, the steps S01 to S03 are repeatedly executed; according to the invention, automatic grabbing of the wafer is smoothly realized, position deviation of the wafer is prevented, accurate positioning of the wafer is facilitated, and equipment precision is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a wafer grabbing method and device. Background Art

[0002] Wafer refers to the silicon chip used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polysilicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod forms a wafer. The back of the wafer will be covered with a thin film, which is supported by the wafer frame to form an overall sheet material. Multiple sheets of sheet materials are usually loaded in a sheet material box, which is used as a carrier for transportation.

[0003] At present, manual grasping is usually used in the wafer transplanting process, which can easily cause wafer position deviation and is not convenient for accurate wafer positioning, thus causing equipment accuracy deviation. Summary of the invention

[0004] In view of the deficiencies in the prior art, the present invention provides a wafer grasping method and device, which can smoothly realize automatic grasping of wafers, prevent wafer position deviation, facilitate accurate wafer positioning, and improve equipment accuracy.

[0005] In order to solve the above technical problems, the present invention adopts the following technical solutions: The present invention provides a wafer grabbing method, comprising the following steps: S01. Place the material and adsorb it on the base; S02, using a driving member to drive the top plate close to the base, so that the top plate presses the material against the base; S03. When the material needs to be released, the adsorption between the material and the base is released, and the driving member is used to drive the top plate away from the base; S04: When it is necessary to grab materials, repeat the above steps S01 to S03.

[0006] Wherein, in step S02 and step S03, a connecting component is provided; When the material is close to the base, the connecting parts are used to drive the top plate to move in a direction close to the base; When the top plate is away from the base, the connecting component is used to drive the top plate to translate in a direction away from the base.

[0007] The base is provided with a support area for placing materials, one end of the top plate is provided with a pressing portion, the pressing portion is located above the support area, and at least two positioning members are installed in the support area; When it is necessary to grab the material, the material is placed in the support area, the positioning member is used to position the material, and the driving member drives the top plate to approach the base, so that the material is pressed between the pressing part and the support area.

[0008] Wherein, at least two support arms are symmetrically arranged at one end of the base away from the driving member, and an adsorption area is arranged on the base; When the material needs to be adsorbed, the material is placed on the base, and the material is supported by the support arm so that the bottom surface of the material fits the adsorption area, and the material is adsorbed in the adsorption area under negative pressure.

[0009] Wherein, the base includes a mounting plate and a support plate connected to the mounting plate, the connecting component is at least two parallel flip blocks, the top end of the flip block is hinged to the top plate through a top axis, and the bottom end of the flip block is hinged to the support plate through a bottom axis.

[0010] Among them, the mounting plate includes a supporting part and an adsorption part connected to the supporting part, one end of the supporting part is connected to the supporting plate, the adsorption parts are the same in number as the supporting arms and are connected to the other end of the supporting part, the adsorption parts are connected to the supporting arms one-to-one, and the supporting area is arranged on the supporting part.

[0011] Wherein, a ventilation channel is arranged on the back side of the mounting plate, and the ventilation channel is communicated with the adsorption area.

[0012] Among them, the other end of the top plate is provided with a mounting part, the mounting part is connected to a moving block, the driving member is drivingly connected to the moving block, and the driving member enables the moving block to drive the top plate to move forward and backward so that the clamping part is close to or away from the supporting area.

[0013] The mounting portion is provided with a bearing, the movable block is provided with a guide groove, and the bearing is arranged in the guide groove; the mounting portion is provided with a clearance opening, the bearing is installed in the clearance opening, and the front end wall of the guide groove is arranged in the clearance opening.

[0014] The present invention also provides a wafer grabbing device, comprising a base, a top plate, and connecting components hinged to the base and the top plate at both ends, the base is provided with a supporting area for placing materials, one end of the top plate is provided with a pressing portion, the pressing portion is located above the supporting area, the other end of the top plate is connected to a driving member, at least two supporting arms are symmetrically provided at one end of the base away from the driving member, and an adsorption area is provided on the base; When the material needs to be grabbed, the material is placed in the support area, and the material is adsorbed by the negative pressure of the adsorption area. The driving member drives the top plate to move toward the material, and drives the connecting member to swing, so that the pressing part presses the material against the base.

[0015] Beneficial effects of the present invention: The present invention smoothly realizes automatic grasping of wafers, prevents wafer position deviation, is conducive to accurate wafer positioning, and improves equipment accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1It is a three-dimensional diagram of the structure of a wafer grabbing method of the present invention.

[0017] Figure 2 It is a structural diagram of the base and the top plate.

[0018] Figure 3 Schematic diagram of the connection structure between the base and the support arm.

[0019] Figure 4 Schematic diagram of the exploded structure with base, connecting parts and top plate.

[0020] Figure 5 Schematic diagram of the exploded structure of the mounting plate.

[0021] Figure 6 Schematic diagram of the connection structure between the top plate and the moving block.

[0022] Figure 7 It is a structural schematic diagram of the installation part and the moving block.

[0023] Figure 8 It is a schematic diagram of the exploded structure of the mounting part and the moving block.

[0024] Fig. 9 This is a schematic diagram of the structure of the wafer grabbing device.

[0025] 1. base; 101. support area; 102. adsorption area; 110, mounting plate; 1101, supporting portion; 1102, adsorption portion; 11021, ventilation channel; 120, support plate; 11. Positioning member; 12. Support arm; 2. Top plate; 201, pressing part; 202, installation part; 2021, yielding opening; 3. driving member; 4. connecting member; 41. top shaft; 42. bottom shaft; 5. Moving block; 501. Guide groove; 6. Bearings. DETAILED DESCRIPTION

[0026] In order to facilitate the understanding of those skilled in the art, the present invention is further described below in conjunction with the examples and drawings. The specific implementation methods of the present invention will be described below. It should be noted that in the specific description of these implementation methods, in order to provide a concise description, this specification cannot provide a detailed description of all the features of the actual implementation methods. It should be understood that in the actual implementation of any one of the implementation methods, it should be understood that for those of ordinary skill in the art related to the content disclosed in the present invention, some changes such as design, manufacturing or production based on the technical content disclosed in the present invention are only conventional technical means, and should not be understood as the content of the present disclosure being insufficient. The present invention is described in detail below in conjunction with the drawings.

[0027] refer to Figures 1 to 9 As shown, the present invention provides a wafer grasping method, comprising the following steps: S01, placing and adsorbing a material on a base 1; S02, using a driving member 3 to drive a top plate 2 close to the base 1, so that the top plate 2 presses the material against the base 1; S03, when it is necessary to release the material, release the adsorption of the material and the base 1, and use the driving member 3 to drive the top plate 2 away from the base 1; S04, when it is necessary to grasp the material, repeat the above steps S01 to S03; in actual application, the material is a wafer, and automatic grasping of the wafer is smoothly realized, which prevents the wafer position deviation, facilitates accurate positioning of the wafer, and improves the equipment accuracy.

[0028] refer to Figures 1 to 4 As shown, in this embodiment, in step S02 and step S03, a connecting component 4 is provided; when the material is close to the base 1, the connecting component 4 is used to drive the top plate 2 to translate toward the base 1; when the top plate 2 is away from the base 1, the connecting component 4 is used to drive the top plate 2 to translate away from the base 1. When the top plate 2 presses the material, the force is applied vertically to the material, preventing the material from being subjected to the horizontal force and moving horizontally accordingly, thereby improving the material pressing accuracy.

[0029] refer to Figure 2 As shown, in this embodiment, the base 1 is provided with a supporting area 101 for placing materials, and a clamping portion 201 is provided at one end of the top plate 2, and the clamping portion 201 is located above the supporting area 101, and at least two positioning members 11 are installed in the supporting area 101; when it is necessary to grab the material, the material is placed in the supporting area 101, and the positioning member 11 is used to position the material, and the driving member 3 drives the top plate 2 to approach the base 1, so that the material is pressed between the clamping portion 201 and the supporting area 101, so as to facilitate stable clamping of the material; specifically, the number of the positioning members 11 is two, and the positioning members 11 are pins. There are two positioning cavities in the circumference of the wafer, and the positioning cavities are adapted to the pins to quickly position the wafer, thereby accelerating the wafer installation efficiency.

[0030] refer to Figure 3 As shown, in this embodiment, at least two support arms 12 are symmetrically provided at one end of the base 1 away from the driving member 3, and an adsorption area 102 is provided on the base 1; when material needs to be adsorbed, the material is placed on the base 1, and the material is supported by the support arms 12 so that the bottom surface of the material fits the adsorption area 102, and the material is negatively pressure adsorbed on the adsorption area 102. In actual application, the adsorption area 102 is externally connected to a negative pressure device, such as a negative pressure pump, to facilitate the stable adsorption of the material in the adsorption area 102, stabilize the placement position of the material, and improve the material clamping accuracy.

[0031] refer to Figure 4 As shown, in this embodiment, the base 1 includes a mounting plate 110 and a support plate 120 connected to the mounting plate 110, the connecting component 4 is at least two parallel flip blocks, the top end of the flip block is hinged to the top plate 2 through a top shaft 41, and the bottom end of the flip block is hinged to the support plate 120 through a bottom shaft 42; in actual application, the driving member 3 is an oil cylinder, an air cylinder or an electric cylinder, and the driving member 3 drives the top plate 2 to move back and forth. During this process, the flip block, the top plate 2 and the support plate 120 form a parallelogram structure, so that the top plate 2 moves smoothly, and the top plate 2 maintains a stable parallel state relative to the support plate 120, which is convenient for applying a stable force to the material and facilitating the smooth clamping of the material.

[0032] refer to Figure 4 As shown, in this embodiment, the mounting plate 110 includes a supporting portion 1101 and an adsorption portion 1102 connected to the supporting portion 1101, one end of the supporting portion 1101 is connected to the supporting plate 120, the adsorption portions 1102 are the same in number as the supporting arm 12 and are connected to the other end of the supporting portion 1101, the adsorption portions 1102 are connected to the supporting arm 12 one-to-one, and the supporting area 101 is arranged on the supporting portion 1101; in actual application, the material fits the placement area in the supporting portion 1101 to facilitate stable support of the material, and the support arm 12 is smoothly connected through the adsorption portion 1102, and the support arm 12 can smoothly support both ends of the material, thereby improving the placement stability of the material.

[0033] refer to Figure 5 As shown, in this embodiment, a ventilation channel 11021 is provided on the back side of the mounting plate 110, and the ventilation channel 11021 is connected to the adsorption area 102; in actual application, the end of the ventilation channel 11021 away from the adsorption part 1102 is connected to the negative pressure, and a corresponding cover plate is installed on the outer side of the ventilation channel 11021 to prevent the outflow of negative pressure airflow and ensure the stable delivery of negative pressure. The lower end surface of the material is attached to the top opening of the adsorption area 102, and the material is effectively adsorbed by the negative pressure, which is conducive to stabilizing the material.

[0034] refer to Figure 6As shown, in this embodiment, the other end of the top plate 2 is provided with a mounting portion 202, the mounting portion 202 is connected to a moving block 5, the driving member 3 is drivingly connected to the moving block 5, and the driving member 3 enables the moving block 5 to drive the top plate 2 to move forward and backward, so that the clamping portion 201 is close to or away from the supporting area 101; in actual application, the driving member 3 drives the moving block 5 to move forward and backward, drives the mounting portion 202 and the top plate 2 to move synchronously, thereby driving the clamping portion 201 to move close to or away from the supporting area 101, and smoothly drives the clamping portion 201 to move.

[0035] refer to Figure 6 , 8 As shown, in this embodiment, the mounting portion 202 is installed with a bearing 6, the moving block 5 is provided with a guide groove 501, and the bearing 6 is arranged in the guide groove 501; in actual application, the moving block 5 moves back and forth to drive the bearing 6 to move in the guide groove 501, and the bearing 6 has a moving distance in the direction of the support area 101 and along the extension direction of the guide groove 501 during the movement, so that the moving trajectory of the bearing 6 and the mounting portion 202 is arc-shaped, and the top plate 2 maintains stable translation under the action of the connecting component 4.

[0036] refer to Figure 7 , 8 As shown, the mounting portion 202 is provided with a clearance opening 2021, the bearing 6 is installed in the clearance opening 2021, the front end wall of the guide groove 501 is arranged in the clearance opening 2021, and part of the structure passes through the clearance opening 2021 when the moving block 5 moves forward and backward, saving space.

[0037] refer to Fig. 9 As shown, the present invention also provides a wafer grasping device, comprising a base 1, a top plate 2 and a connecting component 4 hinged to the base 1 and the top plate 2 at both ends, the base 1 is provided with a supporting area 101 for placing materials, one end of the top plate 2 is provided with a clamping portion 201, the clamping portion 201 is located above the supporting area 101, the other end of the top plate 2 is connected to a driving member 3, at least two supporting arms 12 are symmetrically provided at one end of the base 1 away from the driving member 3, and an adsorption area 102 is provided on the base 1; in actual application, when it is necessary to grasp the material, the material is placed in the supporting area 101, the material is stably supported by the supporting arms 12 and the supporting area 101, the material is negatively adsorbed by the adsorption area 102, the driving member 3 drives the top plate 2 to translate toward the material, and drives the connecting component 4 to swing, so that the clamping portion 201 presses the material against the base 1, thereby realizing automatic grasping of the wafer, preventing wafer position deviation, facilitating accurate positioning of the wafer, and improving equipment accuracy.

[0038] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention is disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technician familiar with the profession can make some changes or modifications to equivalent embodiments of equivalent changes by using the technical contents disclosed above without departing from the scope of the technical solution of the present invention. However, any simple modification, equivalent changes and modifications made to the above embodiments according to the technology of the present invention are within the scope of the technical solution of the present invention without departing from the content of the technical solution of the present invention.

Claims

1. A wafer grabbing method, characterized in that: The following steps are involved: S01. Place the material and adsorb it on the base (1); S02, using the driving member (3) to drive the top plate (2) to approach the base (1), so that the top plate (2) presses the material against the base (1); S03. When the material needs to be released, the adsorption between the material and the base (1) is released, and the driving member (3) is used to drive the top plate (2) away from the base (1); S04: When it is necessary to grab materials, repeat the above steps S01 to S03.

2. The wafer grabbing method according to claim 1, characterized in that: In step S02 and step S03, a connecting component (4) is provided; When the material approaches the base (1), the connecting component (4) is used to drive the top plate (2) to move in a direction close to the base (1); When the top plate (2) is away from the base (1), the connecting component (4) is used to drive the top plate (2) to move in a direction away from the base (1).

3. The wafer grabbing method according to claim 2, characterized in that: The base (1) is provided with a support area (101) for placing materials, one end of the top plate (2) is provided with a pressing portion (201), the pressing portion (201) is located above the support area (101), and at least two positioning members (11) are installed in the support area (101); When it is necessary to grab a material, the material is placed in the support area (101), the positioning member (11) is used to position the material, and the driving member (3) drives the top plate (2) to approach the base (1), so that the material is pressed between the pressing portion (201) and the support area (101).

4. The wafer grabbing method according to claim 3, characterized in that: At least two support arms (12) are symmetrically provided at one end of the base (1) away from the driving member (3), and an adsorption area (102) is provided on the base (1); When a material needs to be adsorbed, the material is placed on the base (1), and the material is supported by the support arm (12) so that the bottom surface of the material fits the adsorption area (102), and the material is adsorbed on the adsorption area (102) under negative pressure.

5. The wafer grabbing method according to claim 4, characterized in that: The base (1) comprises a mounting plate (110) and a support plate (120) connected to the mounting plate (110); the connecting component (4) is at least two parallel flip blocks; the top ends of the flip blocks are hinged to the top plate (2) via top shafts (41); and the bottom ends of the flip blocks are hinged to the support plate (120) via bottom shafts (42).

6. The wafer grabbing method according to claim 5, characterized in that: The mounting plate (110) comprises a support portion (1101) and an adsorption portion (1102) connected to the support portion (1101); one end of the support portion (1101) is connected to the support plate (120); the adsorption portions (1102) are the same in number as the support arms (12) and are connected to the other end of the support portion (1101); the adsorption portions (1102) and the support arms (12) are connected in a one-to-one correspondence; and the support area (101) is arranged on the support portion (1101).

7. The wafer grabbing method according to claim 6, characterized in that: A ventilation channel (11021) is provided on the back side of the mounting plate (110), and the ventilation channel (11021) is in communication with the adsorption area (102).

8. The wafer grabbing method according to claim 1, characterized in that: The other end of the top plate (2) is provided with a mounting portion (202), the mounting portion (202) being connected to a moving block (5), the driving member (3) being drivingly connected to the moving block (5), the driving member (3) causing the moving block (5) to drive the top plate (2) to move forward and backward, so that the pressing portion (201) moves closer to or farther from the supporting area (101).

9. The wafer grabbing method according to claim 8, characterized in that: The mounting portion (202) is mounted with a bearing (6); the movable block (5) is provided with a guide groove (501), and the bearing (6) is arranged in the guide groove (501); the mounting portion (202) is provided with a clearance opening (2021), the bearing (6) is mounted in the clearance opening (2021), and the front end wall of the guide groove (501) is arranged in the clearance opening (2021).

10. A wafer grabbing device, characterized in that: The invention comprises a base (1), a top plate (2), and a connecting component (4) whose two ends are respectively hinged to the base (1) and the top plate (2), wherein the base (1) is provided with a supporting area (101) for placing materials, one end of the top plate (2) is provided with a pressing portion (201), and the pressing portion (201) is located above the supporting area (101), the other end of the top plate (2) is connected to a driving member (3), and at least two supporting arms (12) are symmetrically provided at one end of the base (1) away from the driving member (3), and an adsorption area (102) is provided on the base (1); When it is necessary to grab a material, the material is placed on the support area (101), and the material is adsorbed by the negative pressure of the adsorption area (102). The driving member (3) drives the top plate (2) to move horizontally toward the material, and drives the connecting member (4) to swing, so that the pressing part (201) presses the material against the base (1).

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