Clamping carrier, detection equipment and clamping method
By designing a clamping vehicle for detection, the contact module is used to fit the side of the wafer, the wear and pollution of the wafer is avoided, the damage and pollution of the wafer is solved during the detection process, and the wafer is improved yield and stability of clamping.
Patent Information
- Application Number
- CN202411046800.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-31
- Publication Date
- 2024-12-17
AI Technical Summary
When detecting wafers, the non-detection surface of the wafer is prone to wear and contaminate the detection machine, resulting in a decrease in chip yield.
Design a clamping vehicle, including a contact module and a control module, and fits the side of the wafer through the clamping structure to avoid direct contact with the detection surface and non-detection surface. Use the buffer module and the detection module to adjust the pressure to ensure stable clamping And it does not damage the wafer.
It effectively prevents the detection surface and non-detection surface of the wafer from being contaminated or scratched, reduces the risk of scrapping of wafers, and is suitable for wafers of different sizes and types, improving the stability and accuracy of clamping.
Smart Images
Figure CN119153384A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor technology, and in particular to a clamping carrier, a testing device and a clamping method. Background Art
[0002] As chip size decreases, the impact of defects on chip yield gradually increases. The conventional practice is to use a detection machine to detect the surface of the wafer and determine the type of defect based on the detection results; then, corresponding improvements are made based on the type of defect to improve the chip yield. However, in the process of detecting surface defects on one side of the wafer, the other side of the wafer is placed on the carrier inside the detection machine by adsorption. The wafer surface is in direct contact with the carrier, which is easy to wear the wafer surface; and the residues produced by the wear of the wafer surface are easy to contaminate the detection machine and the wafers that enter the detection machine for subsequent inspection. Summary of the invention
[0003] Based on this, the present application provides a clamping carrier, a detection device and a clamping method for clamping a wafer to avoid damaging the non-detection surface of the wafer.
[0004] On the one hand, the present application provides a clamping carrier for clamping a wafer, wherein the wafer comprises a detection surface, a non-detection surface and a side surface, wherein the detection surface and the non-detection surface are arranged opposite to each other, and the side surface connects the detection surface and the non-detection surface; the clamping carrier comprises:
[0005] At least two spaced-apart clamping structures, the clamping structures comprising a contact module and a control module;
[0006] The control module is used to control the contact module to move towards the wafer so that the contact module fits the side and clamps the wafer; the control module is also used to control the contact module to move away from the wafer to release the wafer.
[0007] In one of the embodiments, the control module is further configured to control the contact module to move towards a direction close to the wafer when it is detected that the wafer is in a wafer clamping area; and / or
[0008] The control module is further configured to control the contact module to move away from the wafer to release the wafer when detecting that the wafer is in the wafer release area.
[0009] In one of the embodiments, the topography of the surface of the contact module in contact with the side surface matches the topography of the corresponding side surface.
[0010] In one embodiment, the material of the portion of the contact module that contacts the wafer is an insulating material; and / or
[0011] The contact module further includes a buffer unit disposed on a side of the contact module facing the side surface.
[0012] In one embodiment, the control module is located at a side of the contact module away from the wafer preset area; and / or
[0013] The clamping structure further includes a buffer module located between the control module and the contact module.
[0014] In one embodiment, the clamping structure further comprises:
[0015] a detection module, connected to the contact module and the control module respectively, for detecting the pressure between the contact module and the side surface and generating a pressure detection signal, and the detection module is further used to send the pressure detection signal to the control module;
[0016] The control module is further used to receive the pressure detection signal and control the movement of the contact module according to the pressure detection signal.
[0017] In one embodiment, the clamping carrier further comprises:
[0018] A parameter setting module, connected to the control module, for setting a preset pressure signal corresponding to the control module and a pressure value corresponding to the preset pressure signal;
[0019] The control module controls the movement of the contact module according to the magnitude relationship between the pressure value corresponding to the pressure detection signal and the pressure value corresponding to the preset pressure signal.
[0020] In one embodiment, the contact module includes a horizontal portion and an extension portion, the horizontal portion includes a first portion and a second portion connected, the extension portion extends from the first portion to a side away from the horizontal portion; the extension length of the extension portion to the side away from the horizontal portion is greater than or equal to the thickness of the wafer;
[0021] Wherein, when the clamping structure clamps the wafer, the extension portion contacts the side surface close to the wafer, and the width of the contact portion between the non-detection surface and the second portion is less than or equal to the width of the incomplete graphic area of the wafer.
[0022] In one embodiment, the control module and the contact module are arranged in a one-to-one correspondence, and one control module and one corresponding contact module constitute one clamping structure; and / or
[0023] The clamping carrier also includes:
[0024] The flipping assembly is used for adsorbing the detection surface and flipping the wafer; the flipping assembly is also used for moving the wafer to the wafer clamping area.
[0025] In a second aspect, the present application provides a detection device for detecting a wafer, the detection device comprising:
[0026] Loading platform;
[0027] A clamping carrier as described above;
[0028] A detection device, used for detecting the detection surface;
[0029] When the detection device detects the detection surface, the clamping carrier clamps the wafer, and the clamping carrier and the wafer are located between the carrier platform and the detection device, and there is a distance between the wafer and the carrier platform.
[0030] In a third aspect, the present application provides a clamping method, which is applicable to the above-mentioned clamping carrier, and is used to clamp a wafer, wherein the wafer includes a detection surface, a non-detection surface, and a side surface, wherein the detection surface and the non-detection surface are arranged opposite to each other, and the side surface connects the detection surface and the non-detection surface; the clamping method includes:
[0031] moving the wafer to a wafer holding area;
[0032] When it is detected that the wafer is in the wafer clamping area, the control module controls the contact module to move toward the direction close to the wafer, so that the contact module fits with the side surface and clamps the wafer;
[0033] When it is detected that the wafer is in the wafer release area, the control module controls the contact module to move away from the wafer to release the wafer.
[0034] In one embodiment, the control module controls the contact module to move toward the direction close to the wafer so that the contact module fits with the side surface, and clamping the wafer further includes:
[0035] detecting the pressure between the contact module and the corresponding side surface, and generating a pressure detection signal;
[0036] According to the pressure detection signal corresponding to the contact module, the movement of the contact module is controlled. In the above-mentioned clamping carrier, when the clamping carrier clamps the wafer, the contact module fits with the side of the wafer to fix the wafer, avoid contamination or scratches on the detection surface and non-detection surface of the wafer, and reduce the risk of scrapping the wafer. When the side of the wafer and each contact module in the clamping carrier fit together, the wafer can be fixedly clamped. There is no limitation on the size and type of the wafer. It is suitable for wafers of different sizes and types. The clamping carrier has a wide range of applications.
[0037] In the above-mentioned testing equipment, the wafer is fixed by a clamping carrier. When the detection device detects the detection surface, there is a spacing wafer between the wafer and the carrier table, which avoids the problem of the carrier table scratching the non-detection surface of the wafer close to the carrier table, thereby reducing the risk of wafer scrapping.
[0038] In the above clamping method, when it is detected that the wafer is in the wafer clamping area, the control module controls the contact module to move in the direction close to the wafer so that the contact module fits with the side of the wafer and clamps the wafer to achieve clamping and fixation of the wafer. When it is detected that the wafer is in the wafer release area, the control module controls the contact module to move in the direction away from the wafer to release the wafer. In the process of clamping and releasing the wafer by the clamping carrier, there is no need to contact the detection surface and non-detection surface of the wafer, so as to avoid contaminating or scratching the detection surface and non-detection surface of the wafer, thereby reducing the risk of scrapping the wafer. BRIEF DESCRIPTION OF THE DRAWINGS
[0039] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0040] FIG. 1a is a schematic top view of a wafer after being located in a wafer clamping area in some embodiments;
[0041] Figure 1b Schematic diagram of a top view of a wafer after being located in a wafer clamping area in some other embodiments;
[0042] Figure 2 A schematic top view of a wafer clamped by a clamping carrier in some embodiments;
[0043] Figure 3 In some embodiments Figure 1b Schematic diagram of the cross section along the AA direction;
[0044] Figure 4It is a cross-sectional schematic diagram of a clamping carrier when a wafer is located in a predetermined wafer area in some other embodiments;
[0045] Figure 5 A schematic cross-sectional view of a clamping carrier when a wafer is located in a predetermined wafer area in some other embodiments;
[0046] Figure 6 It is a schematic diagram of the structure of the detection device in some embodiments;
[0047] Figure 7 Schematic diagram of the flow of the clamping method in some embodiments.
[0048] Description of reference numerals:
[0049] Clamping structure 102 , 303 , wafer clamping area 104 , wafer 106 , parameter setting module 108 , carrier platform 110 , detection device 112 , contact module 202 , 302 , control module 204 , 304 , buffer module 206 , detection module 208 . DETAILED DESCRIPTION
[0050] In order to facilitate understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.
[0051] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.
[0052] Spatially relative terms such as "below," "beneath," "below," "under," "above," "above," and the like may be used herein to describe the relationship of an element or feature shown in the figures to other elements or features. It should be understood that, in addition to the orientations shown in the figures, spatially relative terms also include different orientations of the device in use and operation. For example, if the device in the accompanying drawings is flipped, an element or feature described as "below" or "beneath" or "below" the other elements would be oriented "above" the other elements or features. Thus, the exemplary terms "below" and "under" may include both upper and lower orientations. In addition, the device may also include alternative orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptors used herein are interpreted accordingly.
[0053] It should be noted that when an element is considered to be "connected" to another element, it can be directly connected to the other element, or connected to the other element through an intermediate element. In addition, the "connection" in the following embodiments should be understood as "electrical connection", "communication connection", etc. if there is transmission of electrical signals or data between the connected objects.
[0054] When used herein, the singular forms of "a", "an", and "said / the" may also include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "include / comprise" or "have" and the like specify the presence of stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not exclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. In the description of the present disclosure, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In the description of the present disclosure, the meaning of "several" is at least one, such as one, two, etc., unless otherwise clearly and specifically defined.
[0055] FIG. 1a is a schematic top view of a wafer after it is located in a predetermined area of the wafer in some embodiments. Figure 1b Schematic diagram of a top view of a wafer after it is located in a predetermined wafer area in some other embodiments. Figure 2 It is a top view schematic diagram of a wafer clamped by a clamping carrier in some embodiments. Figure 3 In some embodiments Figure 1b The cross-sectional view along the AA direction is shown in Figure 1a. Figure 1b , Figure 2 , Figure 3 As shown, in this embodiment, a clamping carrier is provided for clamping a wafer 106, wherein the wafer 106 includes a detection surface, a non-detection surface and a side surface, wherein the detection surface and the non-detection surface are arranged opposite to each other, and the side surface connects the detection surface and the non-detection surface; the clamping carrier includes at least two clamping structures 102 arranged at intervals; each of the clamping structures 102 includes a contact module 202 and a control module 204; when the clamping carrier clamps the wafer 106, the contact module 202 is in contact with the side surface of the wafer 106;
[0056] Among them, the control module 204 is used to control the contact module 202 to move towards the direction close to the wafer 106 so that the contact module 202 fits the side of the wafer 106 and clamps the wafer 106; the control module 204 is also used to control the corresponding contact module 202 to move away from the wafer 106 to release the wafer 106.
[0057] The inspection surface is the surface of the wafer 106 that needs to be inspected, and the inspection surface is any one of the first surface of the wafer 106 on which the device pattern is formed and the second surface arranged opposite to the first surface; when the first surface is the inspection surface, the second surface is the non-inspection surface, and when the second surface is the inspection surface, the first surface is the non-inspection surface.
[0058] In one embodiment, the control module 204 is arranged in one-to-one correspondence with the contact module 202, and the control module 202 and the corresponding contact module 202 constitute a clamping structure 102. The control module 204 controls the contact module 202 arranged corresponding to it to move toward the side of the wafer 106 until the contact module 202 is in contact with the side of the wafer 106. After each contact module 202 in the clamping carrier is in contact with the side of the wafer 106, the clamping of the wafer 106 is completed. The control module 204 of the present disclosure can independently adjust the distance that the contact module 202 moves toward the wafer 106, and the contact pressure between different contact modules 202 and the side of the wafer 106 can be different, so as to avoid the risk of damage defects of the wafer 106 when the contact pressure between each contact module 202 and the side of the wafer 106 is the same.
[0059] In the above-mentioned clamping carrier, when the clamping carrier clamps the wafer 106, the contact module 202 is fitted with the side of the wafer 106 to fix the wafer 106, avoid wear on the non-detection surface of the wafer 106, and reduce the risk of scrapping the wafer 106. After the wafer 106 and each contact module 202 in the clamping carrier are fitted, the wafer 106 can be fixedly clamped. There is no limitation on the size and type of the wafer 106, and it is suitable for wafers 106 of different sizes and types. The application range of the clamping carrier is wide. In addition, in the process of the contact structure 202 moving toward the wafer 106, different contact modules 202 are individually controlled by the control module 204, and the distance that the contact module 202 moves toward the wafer 106 can be individually adjusted to avoid excessive or insufficient force on some sides of the wafer 106, which may cause the risk of damage to the wafer 106 and falling, thereby improving the stability of the clamping carrier in clamping the wafer 106.
[0060] As shown in Figure 1a and Figure 1b As shown, in one embodiment, the control module 204 is also used to detect whether the wafer 106 is in the wafer clamping area. When the control module 204 detects that the wafer 106 is in the wafer clamping area, the contact module 202 controls the contact module 202 to move towards the direction close to the wafer 106.
[0061] It is understood that the wafer clamping area 104 is a preset position where the clamping structure 102 is close to the wafer 106 and clamps the wafer. The position of the wafer clamping area 104 can be set as needed, for example, the area surrounded by the clamping structure 102, as shown in FIG. Figure 1b , Figure 2 or the area within the travel range of the clamping carrier, for example, the travel range of the clamping carrier is three meters, then the wafer clamping area is the area within three meters of the position of the clamping carrier when the wafer 106 is detected as the origin. Figure 1b , Figure 2 As shown, in one embodiment, the morphology of the surface of the contact module 202 in contact with the side of the wafer 106 matches the morphology of the side of the corresponding wafer 106. Exemplarily, the side of the wafer 106 is an arc surface, and the surface of the contact module 202 in contact with the side of the wafer 106 is an arc surface, the contact module 202 has better contact with the side of the wafer 106, the wafer 106 is clamped more stably, and the risk of the wafer 106 falling is reduced.
[0062] like Figure 1b and 2 As shown, in some embodiments, the clamping carrier includes three clamping structures 102 , which improves the accuracy of the clamping carrier in clamping the wafer 106 and reduces the probability of the wafer 106 being damaged or dropped.
[0063] In some embodiments, when the clamping carrier clamps the wafer 106 , the side surfaces of the wafer 106 are in contact with the contact module 202 along the direction surrounding the wafer 106 , thereby improving the stability of the clamping carrier clamping the wafer 106 .
[0064] In other embodiments, when the clamping carrier clamps the wafer 106 , there is a gap between adjacent clamping structures 102 along the direction surrounding the wafer 106 , thereby reducing the volume of the clamping structure 102 and lowering the manufacturing cost of the clamping carrier.
[0065] In one embodiment, the material of the portion of the contact module 202 that contacts the wafer 106 is an insulating material, such as marble, insulating rubber, or insulating silicone, to avoid damage to the wafer 106 due to contact discharge during the contact between the contact module 202 and the wafer 106, thereby reducing the probability of damage to the wafer 106.
[0066] In one embodiment, the control module 204 is located on a side of the contact module 202 away from the wafer preset area 104. The control module 204 includes a motor. The contact module 202 is connected to the motor. The motor drives the contact module 202 to move, so that the contact module 202 clamps or releases the wafer 106.
[0067] Figure 4 2 is a cross-sectional schematic diagram of a clamping carrier when a wafer is located in a predetermined wafer area in some other embodiments. Figure 4 As shown, in one embodiment, the clamping structure 102 further includes a buffer module 206, and the buffer module 206 is located between the control module 204 and the contact module 202. The buffer module 206 is used to buffer the contact pressure of the direct contact between the contact module 202 and the side of the wafer 106, such as the contact pressure between the contact module 202 made of rigid material and the wafer 106. The buffer module 206 can adjust the force between the contact module 202 and the side of the wafer 106, so that the clamping carrier clamps the wafer 106 more stably, reduces the vibration of the wafer 106 during the clamping process, and reduces the probability of damage to the wafer 106 during the clamping process. In addition, the influence of the heat generated by the control module 204 in the process of controlling the movement of the contact module 202 on the contact module 202 can be reduced, and the service life of the contact module 202 can be extended.
[0068] In one embodiment, the contact module 202 includes a buffer unit, which is disposed on a side of the contact module 202 facing the side of the wafer 106; wherein, when the contact module 202 clamps the wafer 106, the buffer unit fits the side of the wafer 106, and the flexible contact between the buffer unit and the side of the wafer 106 reduces the probability of damage to the wafer 106. Exemplarily, the material of the buffer unit includes flexible rubber and / or silicone.
[0069] like Figure 4 As shown, in one embodiment, the clamping structure 102 further includes a detection module 208; the detection module 208 is connected to the contact module 202 and the control module 204 respectively, and is used to detect the pressure between the contact module 202 and the side of the wafer 106, and generate a pressure detection signal, and the detection module 208 is also used to send the pressure detection signal to the control module 204; wherein the control module 204 is used to receive the pressure detection signal, and control the movement of the contact module 202 according to the pressure detection signal, and when the pressure detection signal meets the preset condition, the contact module 202 is controlled to stop moving, so as to avoid the excessive pressure between the contact module 202 and the wafer 106 causing damage to the wafer 106; or when the pressure detection signal does not meet the preset condition, the contact module 202 is controlled to move, so as to avoid the problem that the pressure between the contact module 202 and the wafer 106 is too small, causing the wafer 106 to fall. Exemplarily, the detection module 208 includes a pressure sensor.
[0070] In one embodiment, the control module 204 determines that the pressure detection signal satisfies a preset condition when the pressure value corresponding to the pressure detection signal is greater than or equal to the pressure value corresponding to a preset pressure signal, and the preset pressure signal is a pressure signal between the contact module 202 and the side of the wafer when the clamping carrier stably clamps the wafer 106. That is, when the pressure value corresponding to the pressure detection signal is greater than or equal to the pressure value corresponding to the preset pressure signal, the control module 204 determines that the pressure detection signal satisfies the preset condition, and the control module 204 controls the contact module 202 to stop moving.
[0071] In other embodiments, the control module 204 is used to determine that the pressure detection signal does not meet the preset condition when the pressure value corresponding to the pressure detection signal is smaller than the pressure value corresponding to the preset pressure signal, and control the contact module 202 to move. That is, when the pressure value corresponding to the pressure detection signal is smaller than the pressure value corresponding to the preset pressure signal, it is determined that the pressure detection signal does not meet the preset condition, and the control module 204 controls the contact module 202 to move.
[0072] like Figure 4 As shown, the clamping carrier further includes a parameter setting module 108, which is connected to the control module 204 and is used to set the preset pressure signal corresponding to each of the control modules 204 and the pressure value corresponding to the preset pressure signal; wherein each of the control modules 204 controls the movement of the corresponding contact module 202 according to the magnitude relationship between the pressure value corresponding to the pressure detection signal and the pressure value corresponding to the preset pressure signal. The preset pressure signal corresponding to the clamping structure 102 and the pressure value corresponding to the preset pressure signal can be set by the parameter setting module 108 according to the morphology of the side surface of the wafer 106 corresponding to the clamping structure 102, so as to realize the independent adjustment of the pressure between the contact module 202 and the side surface of the wafer 106, and improve the accuracy of clamping the wafer 106.
[0073] Figure 5 2 is a cross-sectional schematic diagram of a clamping carrier when a wafer is located in a predetermined wafer area in some other embodiments. Figure 5As shown, in one embodiment, the clamping structure 303 includes a contact module 302 and a control module 304, the contact module 302 includes a horizontal portion and an extension portion, the horizontal portion includes a first portion and a second portion connected, and the extension portion extends from the first portion to a side away from the horizontal portion; wherein, when the clamping structure 303 clamps the wafer 106, the side of the extension portion close to the wafer 106 is in contact with the side of the wafer 106, the non-detection surface is in contact with the second portion, and the width of the contact portion between the non-detection surface and the second portion is less than or equal to the width of the incomplete graphic area of the wafer, and the incomplete graphic area is the area where the graphics with a part missing are located compared with the repeated graphics of the complete graphic area. When the clamping carrier clamps the wafer 106, the non-detection surface of the wafer 106 is in contact with the second portion, so that the horizontal portion supports the wafer 106, facilitates the positioning and carrying of the wafer 106, and reduces the risk of the wafer 106 falling.
[0074] like Figure 5 As shown, in one embodiment, the extension length D of the extension portion away from the horizontal portion is greater than or equal to the thickness T of the wafer 106, so as to avoid the risk of uneven force on the side of the wafer 106 and cracking when the wafer 106 is clamped by the clamping carrier.
[0075] It is understandable that in Figure 5 In the embodiment shown, the clamping carrier may also include a detection module and a parameter setting module, whose structure and function are similar to those of Figure 4 The detection module 208 and the parameter setting module 108 in the illustrated embodiment are the same and will not be described in detail below.
[0076] In one embodiment, the clamping carrier further includes a flipping assembly, which is used to absorb the detection surface of the wafer 106 and flip the wafer 106; and is also used to move the wafer 106 to the wafer clamping area 104; or move the wafer 106 away from the wafer clamping area 104; wherein the control module 304 or the control module 204 controls the corresponding contact module 302 or the contact module 202 to move when detecting that the wafer 106 is in the wafer clamping area 104. Exemplarily, the flipping assembly includes a robotic arm.
[0077] As shown in Figure 1a and Figure 1b As shown, in one embodiment, the control module 204 is further configured to control the contact module 202 to move away from the wafer 106 to release the wafer 106 when detecting that the wafer 106 is in a wafer release area.
[0078] Specifically, after the wafer 106 has completed the inspection, the clamping carrier clamps the wafer 106 that has completed the inspection and is located in the wafer release area, the flip assembly adsorbs the inspection surface of the wafer 106 that has completed the inspection, and when the control module 204 detects that the wafer 106 is in the wafer release area and the flip assembly adsorbs the wafer 106, it controls the corresponding contact module 202 to move away from the wafer 106 to release the wafer 106; the flip assembly transports the wafer 106 that has completed the inspection to the test completion area, and then releases the wafer 106. Among them, the wafer release area is a preset position where the clamping carrier releases the wafer 106 that has completed the inspection. The position of the wafer release area can be set as needed, for example, the position of the wafer release area can be the same as or different from the position of the wafer clamping area 104; the test completion area is the position where the wafer 106 that has completed the inspection is placed.
[0079] In some embodiments, the present application provides a testing device for testing wafers. The testing device includes a carrier, a clamping carrier as described above, and a testing device; the parts that are the same or corresponding to the embodiments of the clamping carrier described above will not be described in detail below.
[0080] The detection device is used to detect the detection surface of the wafer. When the detection device detects the detection surface of the wafer, the clamping carrier clamps the wafer, and the clamping carrier and the wafer are located between the carrier platform and the detection device, and there is a distance between the wafer and the carrier platform.
[0081] Figure 6 is a schematic diagram of the structure of the detection device in some embodiments, such as Figure 6 As shown, in some embodiments, the present application provides a detection device, which is used to detect a wafer 106 to be tested, and the detection device includes a carrier 110, a clamping carrier as described above, and a detection device 112. When the detection device 112 detects the detection surface of the wafer 106, each of the contact modules 302 in the clamping carrier is located on the surface of the carrier 110, and the bottom surface of each of the contact modules 302 is in contact with the carrier 110; the detection device 112 is used to detect the detection surface of the wafer 106, and the detection device 112 is located on a side of each of the contact modules 302 away from the carrier 110, and is spaced apart from each of the contact modules 302; the wafer 106 is located above the carrier 110 and is spaced apart from the carrier 110.
[0082] In the above-mentioned testing equipment, the wafer is fixed by a clamping carrier. The wafer is located above the carrier and separated from the carrier to avoid the problem of the carrier scratching the non-testing surface of the wafer close to the carrier, thereby reducing the risk of scrapping the wafer. When the wafer and each contact module in the clamping carrier fit together close to the side of the wafer, the wafer can be fixed and clamped. The test equipment has no restrictions on the size and type of the wafer, and is suitable for wafers of different sizes and types, with a wide range of applications.
[0083] In some embodiments, the inspection device 112 is used to inspect defects on an inspection surface of the wafer 106 .
[0084] In some embodiments, the detection device includes a scanning electron microscope.
[0085] Figure 7 Schematic diagram of the flow of the clamping method in some embodiments. In some embodiments, the present application provides a clamping method for clamping a wafer, which is suitable for the above-mentioned clamping carrier, wherein the wafer includes a detection surface, a non-detection surface and a side surface, wherein the detection surface and the non-detection surface are arranged opposite to each other, and the side surface connects the detection surface and the non-detection surface; Figure 7 As shown, the clamping method comprises:
[0086] S102, moving the wafer to a wafer holding area.
[0087] Specifically, the flipping assembly absorbs the detection surface of the wafer and moves the wafer to the wafer clamping area.
[0088] S104, when it is detected that the wafer is in the wafer clamping area, the control module controls the contact module to move toward the direction close to the wafer, so that the contact module fits with the side surface of the wafer and clamps the wafer.
[0089] Specifically, when the control module in the clamping carrier detects that the wafer is in the wafer clamping area, it controls the corresponding contact module to move towards the direction close to the wafer so that the contact module fits with the side of the wafer and clamps the wafer adsorbed by the flipping assembly to fix the wafer; then, the flipping assembly releases the wafer.
[0090] S106, when it is detected that the wafer is in the wafer release area, the control module controls the contact module to move away from the wafer to release the wafer.
[0091] Specifically, after the wafer has completed inspection, the clamping carrier clamps the wafer that has completed inspection and is located in the wafer release area, the flipping component adsorbs the inspection surface of the wafer that has completed inspection, and when the control module detects that the wafer is in the wafer release area and the flipping component adsorbs the wafer, the contact module is controlled to move away from the wafer to release the wafer; the flipping component transfers the wafer that has completed inspection to the test completion area, and then releases the wafer; wherein the wafer release area is a preset position where the clamping carrier releases the wafer that has completed inspection, and the position of the wafer release area can be set as needed, for example, the position of the wafer release area can be the same as or different from the position of the wafer clamping area; the test completion area is the position where the wafer that has completed inspection is placed.
[0092] In the above clamping method, when it is detected that the wafer is in the wafer clamping area, the control module controls the contact module to move in the direction close to the wafer so that the contact module fits with the side of the wafer and clamps the wafer to achieve clamping and fixation of the wafer. When it is detected that the wafer is in the wafer release area, the control module controls the contact module to move in the direction away from the wafer to release the wafer. In the process of clamping and releasing the wafer by the clamping carrier, it is not necessary to contact the detection surface and non-detection surface of the wafer, so as to avoid contamination or scratching the detection surface and non-detection surface of the wafer, thereby reducing the risk of wafer scrapping.
[0093] In one embodiment, the control module controls the contact module to move toward the direction close to the wafer so that the contact module is in contact with the side of the wafer, and clamping the wafer further includes:
[0094] Detecting the pressure between each of the contact modules and the side surface of the corresponding wafer, and generating a pressure detection signal;
[0095] The movement of the contact module is controlled according to the pressure detection signal corresponding to the contact module.
[0096] Specifically, the detection module in the clamping structure detects the pressure between each contact module and the side of the wafer, generates a pressure detection signal according to the pressure, and then sends the pressure detection signal to the control module; the control module receives the pressure detection signal, and controls the movement of the contact module according to the pressure detection signal, and when the pressure detection signal meets the preset conditions, controls the contact module to stop moving to avoid excessive pressure between the contact module and the wafer causing damage to the wafer; or when the pressure detection signal does not meet the preset conditions, controls the contact module to move to avoid the problem of too little pressure between the contact module and the wafer causing the wafer to fall.
[0097] In one of the embodiments, the clamping method also includes a control module that determines that the pressure detection signal satisfies a preset condition when the pressure value corresponding to the pressure detection signal is greater than or equal to the pressure value corresponding to a preset pressure signal, and the preset pressure signal is a pressure signal between the contact module and the side of the wafer when the clamping carrier stably clamps the wafer. That is, when the pressure value corresponding to the pressure detection signal is greater than or equal to the pressure value corresponding to the preset pressure signal, the control module determines that the pressure detection signal satisfies the preset condition and controls the contact module to stop moving.
[0098] In other embodiments, the clamping method also includes a control module for determining that the pressure detection signal does not satisfy a preset condition and controlling the contact module to move when the pressure value corresponding to the pressure detection signal is smaller than the pressure value corresponding to the preset pressure signal. That is, when the pressure value corresponding to the pressure detection signal is smaller than the pressure value corresponding to the preset pressure signal, determining that the pressure detection signal does not meet the preset condition and controlling the contact module to move.
[0099] In other embodiments, the clamping method also includes setting a preset pressure signal corresponding to each control module and a pressure value corresponding to the preset pressure signal through a parameter setting module; wherein each control module controls the movement of the corresponding contact module according to the relationship between the pressure value corresponding to the pressure detection signal and the pressure value corresponding to the preset pressure signal.
[0100] It should be understood that although Figure 7 The steps in the flowchart are shown in sequence as indicated by the arrows, but these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified in this document, there is no strict order restriction for the execution of these steps, and these steps can be executed in other orders. Moreover, Figure 7 At least part of the steps may include multiple steps or multiple stages. These steps or stages are not necessarily performed at the same time, but can be performed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed in turn or alternately with other steps or at least part of the steps or stages in other steps.
[0101] In the description of this specification, the description with reference to the terms "some embodiments", "other embodiments", "ideal embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example.
[0102] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0103] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.
Claims
1. A clamping carrier for clamping a wafer, wherein the wafer comprises a detection surface, a non-detection surface and a side surface, wherein the detection surface and the non-detection surface are arranged opposite to each other, and the side surface connects the detection surface and the non-detection surface; characterized in that: The clamping carrier comprises: At least two spaced-apart clamping structures, the clamping structures comprising a contact module and a control module; The control module is used to control the contact module to move towards the wafer so that the contact module fits the side and clamps the wafer; the control module is also used to control the contact module to move away from the wafer to release the wafer.
2. The clamping carrier according to claim 1, characterized in that: The control module is further configured to control the contact module to move towards the direction close to the wafer when it is detected that the wafer is in the wafer clamping area; and / or The control module is further configured to control the contact module to move away from the wafer to release the wafer when detecting that the wafer is in the wafer release area.
3. The clamping carrier according to claim 1, characterized in that: The topography of the surface of the contact module in contact with the side surface matches the topography of the corresponding side surface.
4. The clamping carrier according to claim 1, characterized in that: The material of the portion of the contact module that contacts the wafer is an insulating material; and / or The contact module further includes a buffer unit disposed on a side of the contact module facing the side surface.
5. The clamping carrier according to claim 1, characterized in that: The control module is located at a side of the contact module away from the preset area of the wafer; and / or The clamping structure further includes a buffer module located between the control module and the contact module.
6. The clamping carrier according to claim 1, characterized in that: The clamping structure also includes: a detection module, connected to the contact module and the control module respectively, for detecting the pressure between the contact module and the side surface and generating a pressure detection signal, and the detection module is further used to send the pressure detection signal to the control module; The control module is further used to receive the pressure detection signal and control the movement of the contact module according to the pressure detection signal.
7. The clamping carrier according to claim 6, characterized in that: The clamping carrier also includes: A parameter setting module, connected to the control module, for setting a preset pressure signal corresponding to each control module and a pressure value corresponding to the preset pressure signal; The control module controls the movement of the contact module according to the magnitude relationship between the pressure value corresponding to the pressure detection signal and the pressure value corresponding to the preset pressure signal.
8. The clamping carrier according to claim 1, characterized in that: The contact module comprises a horizontal portion and an extension portion, the horizontal portion comprises a first portion and a second portion connected, the extension portion extends from the first portion to a side away from the horizontal portion; the extension length of the extension portion to the side away from the horizontal portion is greater than or equal to the thickness of the wafer; Wherein, when the clamping structure clamps the wafer, the extension portion contacts the side surface close to the wafer, and the width of the contact portion between the non-detection surface and the second portion is less than or equal to the width of the incomplete graphic area of the wafer.
9. The clamping carrier according to claim 2, characterized in that: The control modules and the contact modules are arranged in a one-to-one correspondence, and one control module and one correspondingly arranged contact module constitute one clamping structure; and / or The clamping carrier also includes: A flipping component, used for adsorbing the detection surface and flipping the wafer; The flip assembly is also used to move the wafer to the wafer clamping area.
10. A detection device, characterized in that: Used to detect wafers, the detection equipment includes: Loading platform; The clamping carrier according to any one of claims 1 to 9; A detection device, used for detecting the detection surface; When the detection device detects the detection surface, the clamping carrier clamps the wafer, and the clamping carrier and the wafer are located between the carrier platform and the detection device, and there is a distance between the wafer and the carrier platform.
11. A clamping method for clamping a wafer, wherein the wafer comprises a detection surface, a non-detection surface and a side surface, wherein the detection surface and the non-detection surface are arranged opposite to each other, and the side surface connects the detection surface and the non-detection surface; characterized in that: The clamping method is applicable to the clamping carrier according to any one of claims 1 to 9, and the clamping method comprises: moving the wafer to a wafer holding area; When it is detected that the wafer is in the wafer clamping area, the control module controls the contact module to move toward the direction close to the wafer, so that the contact module fits with the side surface and clamps the wafer; When it is detected that the wafer is in the wafer release area, the control module controls the contact module to move away from the wafer to release the wafer.
12. The clamping method according to claim 11, characterized in that: The control module controls the contact module to move toward the direction close to the wafer so that the contact module is in contact with the side surface and clamps the wafer, and the step of: Detecting the pressure between each of the contact modules and the corresponding side surface, and generating a pressure detection signal; The movement of the contact module is controlled according to the pressure detection signal corresponding to the contact module.