A two-phase jet heat exchange structure and chip packaging

Abstract

The present invention discloses a two-phase jet heat exchange structure and chip packaging, the two-phase jet heat exchange structure includes a carrier and a cooling fluid; the carrier has a heat exchange end, and is provided with a heat exchange chamber, a liquefaction chamber, an evaporation channel and a cooling channel, the heat exchange chamber is located at the heat exchange end, the liquefaction chamber is arranged above the heat exchange chamber, the evaporation channel connects the upper end of the heat exchange chamber with the liquefaction chamber, and the cooling channel connects the heat exchange chamber with the liquefaction chamber; the cooling fluid circulates between the heat exchange chamber and the liquefaction chamber, and can absorb heat and vaporize in the heat exchange chamber, and dissipate heat and liquefy in the liquefaction chamber. Compared with the traditional air convection cooling method, this scheme usually has a higher heat transfer coefficient, and can achieve more uniform surface cooling, avoid local hot spots, have good stability and reliability, and can achieve efficient heat transfer per unit area through the phase change process, meeting the heat dissipation requirements of increasingly highly integrated electronic chips.

Description

Technical Field

[0001] The invention relates to the technical field of electronic chip cooling, and in particular to a two-phase jet heat exchange structure and chip packaging. Background Art

[0002] The performance of electronic components is very sensitive to temperature changes. For every 10°C increase in temperature, the service life of electronic components is reduced by half, and at 70°C to 80°C, for every 1°C increase in temperature, its reliability decreases by 5%. Traditional cooling methods, such as natural convection and forced air cooling, are widely used in the field of electronic components.

[0003] For example, patent CN215299235U discloses a chip cooling device, which includes a PCB board, a chip, thermally conductive silicone, a heat dissipation shell, a fan and a temperature sensor. By setting thermally conductive silicone on the upper surface of the chip and heat dissipation fins on the heat dissipation shell, heat is radiated to the outside air through heat exchange through the thermally conductive silicone and the heat dissipation fins to achieve the effect of passive heat dissipation, and the heat dissipation fan can be started to switch from passive heat dissipation to active heat dissipation, thereby improving the heat dissipation efficiency.

[0004] However, with the rapid development of the electronics industry, electronic chips are developing towards high integration, small size, high sensitivity, and multifunctionality, and micro-electronic devices and high integrated circuits have been widely used. According to Moore's law, the crystal density on integrated circuits will double every 18 months, and the performance will also double. As the crystal density in electronic components increases, the power and heat flux required by electronic components will inevitably increase, and their heating power will also increase. However, the thermal conductivity of air is small, which makes it difficult to meet the heat dissipation needs of increasingly highly integrated electronic chips. Summary of the invention

[0005] The purpose of the present invention is to overcome the above technical deficiencies, propose a two-phase jet heat exchange structure and chip packaging, and solve the technical problem that air heat dissipation in the prior art is difficult to meet the heat dissipation requirements of increasingly highly integrated electronic chips.

[0006] In order to achieve the above technical objectives, the present invention adopts the following technical solutions:

[0007] In a first aspect, the present invention provides a two-phase jet heat exchange structure, comprising:

[0008] A carrier having a heat exchange end for contacting a heat source, and provided with a heat exchange chamber, a liquefaction chamber, an evaporation channel and a cooling channel, wherein the heat exchange chamber is located at the heat exchange end, the liquefaction chamber is spaced above the heat exchange chamber, the evaporation channel connects the upper end of the heat exchange chamber with the liquefaction chamber, and the cooling channel connects the heat exchange chamber with the liquefaction chamber; and

[0009] The cooling fluid circulates between the heat exchange chamber and the liquefaction chamber, and can absorb heat and vaporize in the heat exchange chamber, and dissipate heat and liquefy in the liquefaction chamber.

[0010] In one embodiment, the cooling channel includes a liquid inlet section, a connecting section and a liquid outlet section connected in sequence along a direction close to the heat exchange end, the upper end of the liquid inlet section is connected to the liquefaction chamber, the lower end of the liquid outlet section is connected to the heat exchange chamber, and its inner diameter is smaller than the inner diameter of the liquid inlet section, and the connecting section is gradually tapered along a direction close to the liquid outlet section.

[0011] In one of the embodiments, a heat dissipation groove is provided on the bottom wall of the heat exchange chamber, and one end of the cooling channel connected to the heat exchange chamber extends into the heat dissipation groove.

[0012] In one of the embodiments, the heat exchange end is further provided with a microchannel connected to the heat exchange chamber.

[0013] In one of the embodiments, the carrier is further provided with a heat-insulating chamber between the heat-exchange chamber and the liquefaction chamber, and a heat-insulating layer is provided on the upper side of the inner wall of the heat-exchange chamber.

[0014] In one of the embodiments, the cooling flow channel and the evaporation flow channel are respectively provided through the heat insulation cavity, and a portion of the evaporation flow channel located in the heat insulation cavity is surrounded by a first heat insulation board.

[0015] In one embodiment, the evaporation flow channel includes a steam chamber, an evaporation pipe and a circulation pipe, the steam chamber is located between the liquefaction chamber and the heat exchange chamber, the evaporation pipe connects the upper end of the heat exchange chamber with the steam chamber, and the circulation pipe connects the upper end of the liquefaction chamber with the steam chamber.

[0016] In one embodiment, the cooling channel passes through the steam chamber, and a portion of the cooling channel located in the steam chamber is surrounded by a second heat insulation plate.

[0017] In one embodiment, the cooling flow channel and the evaporation flow channel are provided in plurality, and the plurality of cooling flow channels and the plurality of evaporation flow channels are alternately arranged in sequence along the horizontal direction.

[0018] In a second aspect, the present invention further provides a chip package, comprising the two-phase jet heat exchange structure as described in any one of the above.

[0019] Compared with the prior art, in the two-phase jet heat exchange structure provided by the present invention, the heat exchange end located at the lower end of the carrier contacts the heat source of the chip, and a heat exchange chamber is provided at the heat exchange end, and a liquefaction chamber is provided above the heat exchange chamber. In this way, the liquid in the liquefaction chamber can flow from the cooling channel to the heat exchange chamber under the drive of its own weight, and the liquid has a certain speed when moving down to the heat exchange chamber to form a jet, and impacts on the inner wall of the heat exchange chamber; because the jet impact can destroy the boundary layer and increase the heat transfer efficiency of the cooling surface, compared with the traditional air convection cooling method, its heat transfer coefficient is usually higher, and it can achieve more uniform surface cooling, avoid local hot spots, and has better stability and reliability. When the liquid impacts the inner wall of the heat exchange chamber, it absorbs the heat of the heat source transferred from the heat exchange end to dissipate the heat source, and can vaporize in the process of absorbing heat. The vaporized fluid is discharged from the liquefaction chamber from the evaporation flow channel to take away the heat and circulates to the liquefaction chamber. The vaporized fluid dissipates heat and liquefies in the liquefaction chamber, and is circulated again to the heat exchange chamber to restart the cooling process, thereby achieving efficient heat transfer per unit area through the phase change process to meet the heat dissipation needs of increasingly highly integrated electronic chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a schematic diagram of a two-phase jet heat exchange structure provided by an embodiment of the present invention;

[0021] Figure 2 yes Figure 1 AA section view of the two-phase jet heat exchange structure;

[0022] Figure 3 yes Figure 1 Working principle diagram of the two-phase jet heat exchange structure;

[0023] Figure 4 yes Figure 2 Schematic diagram of the cooling channel;

[0024] Figure 5 yes Figure 2 A partial schematic diagram of the two-phase jet heat exchange structure;

[0025] Figure 6 The chip package has Figure 1 When the two-phase jet heat exchange structure is not set Figure 1 Temperature comparison diagram of the two-phase jet heat exchange structure.

[0026] Description of reference numerals:

[0027] 1. Carrier; 1a. Heat exchange chamber; 1b. Liquefaction chamber; 1c. Insulation chamber; 1d. Heat dissipation tank; 11. Heat exchange end; 2. Evaporation channel; 21. Evaporation pipeline; 22. Steam chamber; 23. Circulation pipeline; 3. Cooling channel; 31. Liquid inlet section; 32. Connection section; 33. Liquid outlet section; 4. Insulation layer; 5. First insulation board; 6. Second insulation board; 7. Heat source. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0029] In order to solve the technical problem in the prior art that air cooling is difficult to meet the heat dissipation requirements of increasingly highly integrated electronic chips, the present invention provides a two-phase jet heat exchange structure that can achieve relatively uniform surface cooling, avoid local hot spots, have good stability and reliability, and achieve efficient heat transfer per unit area through a phase change process, thereby meeting the heat dissipation requirements of increasingly highly integrated electronic chips.

[0030] It should be noted that the two-phase jet heat exchange structure described in the present invention is used for but not limited to chip packaging, etc. For the convenience of explanation, in the present invention, only the application of the two-phase jet heat exchange structure to chip packaging is used as an example for explanation, and the principle of applying the two-phase jet heat exchange structure to other types of equipment is essentially the same as the principle applied to chip packaging, which will not be repeated here.

[0031] See also Figures 1 to 3 , Figures 1 to 3 The schematic diagram of the structure of a two-phase jet heat exchange structure in one embodiment of the present invention includes a carrier 1 and a cooling fluid; the carrier 1 has a heat exchange end 11 for contacting a heat source 7, and is provided with a heat exchange chamber 1a, a liquefaction chamber 1b, an evaporation channel 2 and a cooling channel 3, the heat exchange chamber 1a is located at the heat exchange end 11, the liquefaction chamber 1b is arranged above the heat exchange chamber 1a, the evaporation channel 2 connects the upper end of the heat exchange chamber 1a with the liquefaction chamber 1b, and the cooling channel 3 connects the heat exchange chamber 1a with the liquefaction chamber 1b; the cooling fluid circulates between the heat exchange chamber 1a and the liquefaction chamber 1b, and can absorb heat and vaporize in the heat exchange chamber 1a, and dissipate heat and liquefy in the liquefaction chamber 1b. Specifically, in this solution, the heat exchange end 11 is located at the lower end of the carrier 1.

[0032] In the two-phase jet heat exchange structure provided by the present invention, the heat exchange end 11 located at the lower end of the carrier 1 is in contact with the heat source 7 of the chip, and a heat exchange chamber 1a is provided at the heat exchange end 11, and a liquefaction chamber 1b is provided above the heat exchange chamber 1a. In this way, the liquid in the liquefaction chamber 1b can flow from the cooling channel 3 to the heat exchange chamber 1a under the drive of its own weight, and the liquid has a certain speed when moving down to the heat exchange chamber 1a to form a jet, and impacts on the inner wall of the heat exchange chamber 1a; because the jet impact can destroy the boundary layer and increase the heat transfer efficiency of the cooling surface, compared with the traditional air convection cooling method, its heat transfer coefficient is usually higher, and it can achieve more uniform surface cooling, avoid local hot spots, and have better stability and reliability. When the liquid impacts the inner wall of the heat exchange chamber 1a, it absorbs the heat of the heat source 7 transmitted by the heat exchange end 11 to dissipate the heat from the heat source 7, and can be vaporized in the process of absorbing heat. The vaporized fluid is discharged from the liquefaction chamber 1b from the evaporation flow channel 2 to take away the heat, and circulates to the liquefaction chamber 1b. The vaporized fluid dissipates heat and liquefies in the liquefaction chamber 1b, and is circulated again to the heat exchange chamber 1a to restart the cooling process, thereby achieving efficient heat transfer per unit area through the phase change process to meet the heat dissipation needs of increasingly highly integrated electronic chips.

[0033] It should be understood that in this solution, when the chip generates heat, the liquid is heated to boiling, the generated steam takes away the heat, and then the steam condenses and circulates again, restarting the cooling process, that is, the two-phase cooling technology utilizes the simultaneous existence of liquid and gas (usually liquid coolant and steam) to achieve efficient heat transfer per unit area through phase change processes (such as boiling or condensation). Compared with single-phase fluid, two-phase flow cooling can significantly improve the heat transfer coefficient, thereby achieving higher heat load handling capacity under the same size and working conditions. Due to the characteristics of the phase change process, two-phase flow cooling can effectively reduce the temperature gradient on the hot surface, thereby achieving a more uniform temperature distribution, which is crucial to reducing thermal stress, improving system life and performance stability.

[0034] In one embodiment, see Figure 4 The cooling channel 3 includes a liquid inlet section 31, a connecting section 32 and a liquid outlet section 33 which are connected in sequence along the direction close to the heat exchange end 11. The upper end of the liquid inlet section 31 is connected to the liquefaction chamber 1b, and the lower end of the liquid outlet section 33 is connected to the heat exchange chamber 1a, and its inner diameter is smaller than the inner diameter of the liquid inlet section 31. The connecting section 32 is gradually reduced along the direction close to the liquid outlet section 33.

[0035] In the present embodiment, the cooling channel 3 is configured as the liquid inlet section 31, the connecting section 32 and the liquid outlet section 33 as described above, so that the flow cross-sectional area of ​​the liquid is reduced as it moves downward along the cooling channel 3, thereby accelerating the liquid flow rate and improving the impact ability of the liquid on the inner wall of the heat exchange chamber 1a, so that the liquid can destroy the boundary layer at the moment of impacting the inner wall of the heat exchange chamber 1a, thereby increasing the heat transfer efficiency of the cooling surface.

[0036] In one embodiment, see Figure 5 A heat dissipation groove 1d is provided on the bottom wall of the heat exchange chamber 1a, and one end of the cooling channel 3 connected to the heat exchange chamber 1a extends into the heat dissipation groove 1d.

[0037] In this embodiment, a heat dissipation groove 1d is also provided on the bottom wall of the heat exchange chamber 1a to expand the surface area of ​​the bottom wall of the heat exchange chamber 1a, thereby expanding the contact area between the liquid and the bottom wall of the heat exchange chamber and improving the heat exchange capacity. Specifically, in this solution, the cooling channel 3 is also extended into the heat dissipation groove 1d, and the evaporation channel 2 is located at the upper end of the heat exchange chamber 1a, which is convenient for gas-liquid separation, so that the steam can be better transported from the evaporation channel 2 to the liquefaction chamber 1b.

[0038] In one embodiment, the heat exchange end 11 is further provided with a microchannel communicating with the heat exchange chamber 1a.

[0039] In this embodiment, by combining microchannels with jet cooling technology, the microchannels can provide a high surface area density, which helps to quickly transfer heat from the heat source 7 to the fluid, while the jet cooling can effectively take the heat away from the fluid, so the combination of the two can achieve higher heat transfer efficiency. The microchannel structure is compact, and the overall system can be designed to be lightweight when used in an environment with limited space.

[0040] It should be noted that in terms of the technical principle of this scheme, the "two-phase impingement jet cooling" technology is to directly construct a liquid-filled microchannel inside the microchip package. When the chip body generates heat, the liquid in the carrier 1 is heated to boiling, and the generated steam takes away the heat. The steam then condenses and circulates again, and the cooling process begins again. Among them, the structure of the microchannel can effectively increase the surface area, thereby improving the heat exchange rate. In jet impingement cooling, these structures can more effectively enhance the contact between the coolant and the hot surface, thereby improving the cooling effect. In addition, the structure of the microchannel can also adjust the flow characteristics of the fluid on the surface, change the speed, turbulence and flow direction, thereby optimizing the heat transfer and cooling effect of the coolant. Such a design is particularly important for improving jet impingement cooling because it can increase the residence time and heat transfer of the coolant on the cooled surface.

[0041] In addition, this heat dissipation technology is not just a simple hole, but includes a multi-layer micro-nano processing of the tiny structure design, forming a very complex multi-layer gas-liquid transport distribution system, such a design can not only efficiently dissipate heat, but also reduce the resistance of liquid flow. The specific structure and principle of the microchannel are existing technologies and will not be elaborated here.

[0042] In one embodiment, the carrier 1 is further provided with a heat-insulating chamber 1c between the heat-exchange chamber 1a and the liquefaction chamber 1b, and a heat-insulating layer 4 is provided on the upper side of the inner wall of the heat-exchange chamber 1a.

[0043] In this embodiment, an insulating chamber 1c is further provided in the heat exchange chamber 1a and the liquefaction chamber 1b, and a corresponding insulating layer 4 is provided to prevent the heat in the heat exchange chamber 1a from being transferred to the liquefaction chamber 1b, thereby ensuring that the liquefaction chamber 1b is in a relatively low temperature environment, so that the gasified fluid is quickly liquefied when entering the liquefaction chamber 1b.

[0044] In one embodiment, the cooling channel 3 and the evaporation channel 2 are respectively disposed in the heat-insulating chamber 1 c , and a portion of the evaporation channel 2 located in the heat-insulating chamber 1 c is surrounded by a first heat-insulating plate 5 .

[0045] In this embodiment, the cooling channel 3 and the evaporation channel 2 are respectively provided with an insulation cavity 1c, so that the overall structure is relatively compact and easy to integrate. In addition, a first insulation board 5 is provided on the periphery of the portion of the evaporation channel 2 corresponding to the insulation cavity 1c to prevent the heat in the evaporation channel 2 from dissipating and radiating into the cooling channel 3. It should be noted that, in one embodiment, the pipe walls of the cooling channel 3 and the evaporation channel 2 are made of insulation material.

[0046] In one embodiment, the evaporation flow channel 2 includes a steam chamber 22, an evaporation pipe 21 and a circulation pipe 23. The steam chamber 22 is located between the liquefaction chamber 1b and the heat exchange chamber 1a. The evaporation pipe 21 connects the upper end of the heat exchange chamber 1a with the steam chamber 22, and the circulation pipe 23 connects the upper end of the liquefaction chamber 1b with the steam chamber 22.

[0047] In this embodiment, the evaporation flow channel 2 is configured in the form of a steam chamber 22, an evaporation pipe 21 and a circulation pipe 23, and the circulation stroke of the steam is extended, so that the steam can gradually dissipate heat in the process of flowing to the liquefaction chamber 1b, and condense into liquid in the liquefaction chamber 1b, so as to achieve a stable circulation of gas and liquid. In this scheme, the circulation pipe 23 is connected to the upper end of the liquefaction chamber 1b to prevent the liquid in the liquefaction chamber 1b from flowing back to the steam chamber 22. It should be noted that, in one embodiment, the circulation pipe 23 is surrounded by the carrier 1 so that the ends thereof connecting the steam chamber 22 and the liquefaction chamber 1b are respectively located at opposite ends of the carrier 1 in the horizontal direction.

[0048] In one embodiment, the cooling channel 3 penetrates the steam chamber 22 , and a portion of the cooling channel 3 located in the steam chamber 22 is surrounded by a second heat insulation plate 6 .

[0049] In this embodiment, the liquid inlet section 31 of the cooling channel 3 is also penetrated into the steam chamber 22, and a second heat insulation plate 6 is provided around the portion of the liquid inlet section 31 located in the steam chamber 22 to prevent the liquid in the cooling channel 3 from exchanging heat with the steam and thereby reducing its heat exchange efficiency in the heat exchange chamber 1a.

[0050] In one embodiment, a plurality of cooling channels 3 and a plurality of evaporation channels 2 are provided respectively, and the plurality of cooling channels 3 and the plurality of evaporation channels 2 are alternately arranged in sequence along the horizontal direction.

[0051] In this embodiment, a plurality of cooling channels 3 and evaporation channels 2 are respectively provided, and the cooling channels 3 and evaporation channels 2 are alternately provided in sequence, so as to improve the heat dissipation capacity and enable the structure to dissipate heat evenly. Specifically, in this embodiment, the cooling channels 3 and evaporation channels 2 are alternately provided in sequence along the width direction and the length direction of the carrier 1, respectively.

[0052] In addition, the present invention further provides a chip package, which includes the two-phase jet heat exchange structure as described in any one of the above items. It should be noted that the detailed structure of the two-phase jet heat exchange structure of the chip package can refer to the above-mentioned embodiment of the two-phase jet heat exchange structure, which will not be repeated here; since the above-mentioned two-phase jet heat exchange structure is used in the chip package of the present invention, the embodiment of the chip package of the present invention includes all technical solutions of all embodiments of the above-mentioned two-phase jet heat exchange structure, and the technical effects achieved are also exactly the same, which will not be repeated here.

[0053] In order to better understand the present invention, the following Figures 1 to 6 The technical solution of the present invention is described in detail:

[0054] The two-phase cooling technology in this scheme achieves efficient heat transfer through the phase change process of liquid and gas, significantly improves the heat transfer coefficient, and achieves a higher heat load handling capacity. The microchannel is combined with jet cooling technology, and the high surface area density of the microchannel is used to quickly transfer heat. The jet cooling efficiently removes heat and achieves higher heat transfer efficiency. The microchannel structure is compact, suitable for environments with limited space, and the system can be designed to be lightweight. Jet impact cooling technology uses high-speed fluid to impact the heated surface to achieve a high heat transfer coefficient and uniform cooling, avoid local hot spots, improve equipment stability and reliability, and has efficient heat transfer and precise local cooling. The tiny structure enhances the jet impact cooling effect by increasing the surface area, enhancing the contact between the coolant and the hot surface, and adjusting the fluid flow characteristics. It prolongs the coolant residence time and heat transfer, optimizes the cooling effect, and improves the heat exchange efficiency. It should be noted that Figure 6: The figure in the figure is a temperature comparison diagram of the chip package from the boundary line, where the greater the distance from the boundary line, the closer to the chip heat source. The control group is the chip package temperature distribution without the two-phase jet heat exchange structure in this scheme, and the invention group is the chip package temperature distribution with the two-phase jet heat exchange structure in this scheme.

[0055] The specific implementation of the present invention described above does not constitute a limitation on the protection scope of the present invention. Any other corresponding changes and modifications made based on the technical concept of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A two-phase jet heat exchange structure, characterized in that: include: A carrier having a heat exchange end for contacting a heat source, and provided with a heat exchange chamber, a liquefaction chamber, an evaporation channel and a cooling channel, wherein the heat exchange chamber is located at the heat exchange end, the liquefaction chamber is spaced above the heat exchange chamber, the evaporation channel connects the upper end of the heat exchange chamber with the liquefaction chamber, and the cooling channel connects the heat exchange chamber with the liquefaction chamber; and A cooling fluid circulates between the heat exchange chamber and the liquefaction chamber, and can absorb heat and vaporize in the heat exchange chamber, and dissipate heat and liquefy in the liquefaction chamber; Among them, the cooling channel includes a liquid inlet section, a connecting section and a liquid outlet section connected in sequence along the direction close to the heat exchange end, the upper end of the liquid inlet section is connected to the liquefaction chamber, the lower end of the liquid outlet section is connected to the heat exchange chamber, and its inner diameter is smaller than the inner diameter of the liquid inlet section, and the connecting section is gradually tapered along the direction close to the liquid outlet section.

2. The two-phase jet heat exchange structure according to claim 1, characterized in that: The bottom wall of the heat exchange chamber is provided with a heat dissipation groove, and one end of the cooling channel connected to the heat exchange chamber extends into the heat dissipation groove.

3. The two-phase jet heat exchange structure according to claim 1, characterized in that: The heat exchange end is also provided with a microchannel communicating with the heat exchange chamber.

4. The two-phase jet heat exchange structure according to claim 1, characterized in that: The carrier is further provided with a heat-insulating chamber between the heat-exchange chamber and the liquefaction chamber, and a heat-insulating layer is provided on the upper side of the inner wall of the heat-exchange chamber.

5. The two-phase jet heat exchange structure according to claim 4, characterized in that: The cooling flow channel and the evaporation flow channel are respectively arranged in the heat insulation cavity, and the portion of the evaporation flow channel located in the heat insulation cavity is surrounded by a first heat insulation board.

6. The two-phase jet heat exchange structure according to claim 1, characterized in that: The evaporation flow channel includes a steam chamber, an evaporation pipe and a circulation pipe. The steam chamber is located between the liquefaction chamber and the heat exchange chamber. The evaporation pipe connects the upper end of the heat exchange chamber with the steam chamber. The circulation pipe connects the upper end of the liquefaction chamber with the steam chamber.

7. The two-phase jet heat exchange structure according to claim 6, characterized in that: The cooling channel passes through the steam chamber, and a portion of the cooling channel located in the steam chamber is surrounded by a second heat insulation board.

8. The two-phase jet heat exchange structure according to claim 1, characterized in that: A plurality of the cooling channels and a plurality of the evaporation channels are provided respectively, and the plurality of the cooling channels and the plurality of the evaporation channels are alternately arranged in sequence along a horizontal direction.

9. A chip package, characterized in that: It comprises the two-phase jet heat exchange structure as described in any one of claims 1 to 8.

Images