Immersion server and immersion liquid cooling system

Abstract

The invention relates to the technical field of refrigeration, and discloses an immersion server and an immersion liquid cooling system, the immersion server comprises an immersion chamber, a heat exchange device, a first joint and a second joint; wherein the immersion chamber is internally provided with a server mainboard, and the server mainboard is provided with a target processing unit; the heat exchange device is in contact with the target processing unit and is used for carrying out heat exchange with the target processing unit; the first joint is used for communicating the immersion chamber and the refrigerating system; the second connector is used for communicating with the heat exchange device and the refrigerating system. The immersion liquid cooling system comprises a server rack and a refrigerating system; wherein the server rack is provided with at least one mounting groove, and the mounting groove is used for mounting an immersion server; the refrigerating system is used for providing a cooled first fluid for the immersion chamber of the immersion server and providing a cooled second fluid for the heat exchange device of the immersion server. The problem that an immersion liquid cooling system is poor in heat dissipation effect when the heat flux density of the server is ultrahigh can be solved.

Description

Technical Field

[0001] The present disclosure relates to the field of refrigeration technology, and in particular to an immersion server and an immersion liquid cooling system. Background Art

[0002] Currently, immersion cooling systems immerse the server motherboard in a sealed chamber filled with refrigerant. When the server is running, the refrigerant in the chamber exchanges heat with the server's components. The high-temperature refrigerant is then pumped out and sent to a plate heat exchanger. After cooling with cold water supplied by an outdoor cooling tower, it returns to the chamber. However, this immersion cooling system utilizes the refrigerant's natural convection heat transfer, resulting in limited heat transfer capacity. This results in poor heat dissipation when the server's heat flux density is extremely high. Summary of the Invention

[0003] In view of this, the present disclosure provides an immersion server and an immersion liquid cooling system to solve the problem of poor heat dissipation effect of the immersion liquid cooling system when the heat flux density of the server is extremely high.

[0004] In a first aspect, the present disclosure provides an immersion server, comprising:

[0005] an immersion chamber, wherein a server mainboard is disposed in the immersion chamber, and a target processing unit is disposed on the server mainboard;

[0006] a heat exchange device, the heat exchange device being in contact with the target processing unit and being used to perform heat exchange with the target processing unit;

[0007] a first joint, the first joint being used to connect the immersion chamber and a refrigeration system, the refrigeration system being used to provide a first cooling fluid for the immersion chamber;

[0008] A second joint is used to connect the heat exchange device and the refrigeration system, and the refrigeration system is also used to provide a second cooling fluid for the heat exchange device.

[0009] In a second aspect, the present disclosure provides an immersion liquid cooling system, comprising:

[0010] A server rack, wherein the server rack is provided with at least one mounting slot for mounting the immersion server;

[0011] A refrigeration system is connected to the first joint and the second joint of the immersion server, and the refrigeration system is used to provide a first cooling fluid for the immersion chamber of the immersion server and a second cooling fluid for the heat exchange device of the immersion server.

[0012] The immersion server and immersion liquid cooling system provided by the embodiments of the present disclosure employ an immersion chamber to separately seal the server motherboard in the immersion server, and is provided with a heat exchange device in contact with the target processing unit on the server motherboard. Furthermore, the immersion server is further provided with a first joint and a second joint. The first joint is used to connect the immersion chamber and the refrigeration system so as to utilize the refrigeration system to provide a first cooling fluid for the immersion chamber. The second joint is used to connect the heat exchange device and the refrigeration system so as to utilize the refrigeration system to provide a second cooling fluid for the heat exchange device. Therefore, the cooling fluid output by the refrigeration system can be divided into two routes to enter the immersion server. One route enters the immersion chamber to provide cooling for the various components on the server motherboard. The other route enters the heat exchange device to provide cooling for the target processing unit. After absorbing the heat from the various components, the first fluid flowing through the immersion chamber can be returned to the refrigeration system through the first joint for cooling again, so as to enter the next round of refrigeration. After absorbing the heat from the target components, the second fluid flowing through the heat exchange device can also be returned to the refrigeration system for cooling through the second joint or the immersion chamber using an open structure to enter the next round of refrigeration, thereby completing the heat dissipation cycle. As a result, the target processing unit can be immersed in the first fluid to exchange heat with the cooled first fluid, and can also exchange heat with the heat exchange device, so that the heat generated by the target processing unit can be effectively absorbed. In addition, the heat exchange device is also immersed in the first fluid, which helps to improve the heat exchange efficiency of the heat exchange device, so that when the heat flux density of the immersion server is extremely high, the immersion server can be effectively cooled to achieve a better heat dissipation effect. In addition, since the immersion server is sealed, multiple immersion servers can be placed in the form of a server rack to fully utilize the height space of the data center computer room and improve the power density per unit area of ​​the computer room. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the specific embodiments of the present disclosure or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0014] Figure 1 It is a structural schematic diagram of an immersion liquid cooling system in the related art;

[0015] Figure 2 is a schematic diagram of an immersion cooling method in the related art;

[0016] Figure 3 is a structural diagram of an immersion server according to an embodiment of the present disclosure;

[0017] Figure 4 is a schematic structural diagram of a first immersion liquid cooling system according to an embodiment of the present disclosure;

[0018] Figure 5 is a structural diagram of another immersion server according to an embodiment of the present disclosure;

[0019] Figure 6 is a structural schematic diagram of a second immersion liquid cooling system according to an embodiment of the present disclosure;

[0020] Figure 7 is a structural schematic diagram of a third immersion liquid cooling system according to an embodiment of the present disclosure;

[0021] Figure 8 is a front schematic diagram of a server rack according to an embodiment of the present disclosure;

[0022] Figure 9 is a schematic diagram of the back of a server rack according to an embodiment of the present disclosure;

[0023] Figure 10 2 is a schematic diagram of the back of another server rack according to an embodiment of the present disclosure.

[0024] The figures are marked as follows: 1. Immersed server; 11. Immersed chamber; 12. Heat exchange device; 13. First joint; 14. Second joint; 15. Server motherboard; 2. Refrigeration system; 21. First distribution unit; 211. First heat exchange subunit; 212. First circulation subunit; 213. First filtering subunit; 22. Second distribution unit; 221. Second heat exchange subunit; 222. Second circulation subunit; 223. Second filtering subunit; 23. Refrigeration device; 3. Server rack; 31. Third joint; 32. Fourth joint; 33. Main liquid distributor; 331. First liquid distributor; 332. Second liquid distributor; 34. Main liquid collector; 341. First liquid collector; 342. Second liquid collector. DETAILED DESCRIPTION

[0025] To make the purpose, technical solutions, and advantages of the embodiments of the present disclosure more clear, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments of the present disclosure, all other embodiments obtained by those skilled in the art without making creative efforts shall fall within the scope of protection of the present disclosure.

[0026] With data center energy consumption increasing and chip power density rising, the power density of general-purpose servers per cabinet has increased significantly. Traditional air cooling methods are insufficient for high-power density servers, and are limited by local weather conditions in data centers, making it difficult to achieve year-round natural cooling.

[0027] Faced with the dual pressures of energy shortage and rising energy costs, data centers not only need to ensure high-performance computing, but also need to reduce server cooling and heat dissipation energy consumption and the indicator for evaluating data center energy efficiency (Power Usage Effectiveness, or PUE) to save energy, reduce consumption, and reduce energy consumption and carbon emissions.

[0028] In this context, immersion cooling has been widely used for server cooling. Immersion cooling completely immerses heat-generating components like the server motherboard, central processing unit (CPU), and memory in a refrigerant, utilizing temperature differences or phase changes in the liquid to transfer heat and cool the server.

[0029] Compared to air cooling, immersion cooling offers the following advantages: First, direct contact between the refrigerant and the heat-generating device eliminates contact thermal resistance, resulting in improved heat dissipation. Second, the specific heat capacity of liquids is higher than that of air, allowing them to transfer up to a thousand times more heat per unit volume. This results in high heat exchange efficiency and enables high heat flux density. Third, immersion cooling can address the heat dissipation issues of all server components at once. Fourth, in a suitable immersion environment, electronic components such as the CPU are unaffected by external temperature, humidity, and air quality, maintaining a constant temperature, effectively improving their reliability and service life. Fifth, immersion cooling utilizes cold water from an outdoor cooling tower for heat dissipation, which is energy-efficient and highly efficient. This allows for year-round natural cooling in any location, achieving a power usage effectiveness (PUE) of approximately 1.1. Sixth, the refrigerant used in immersion cooling is insulated, meaning that leaks will not short-circuit the server. Seventh, while immersion cooling requires additional fans and heat sinks, it can significantly reduce noise levels in data center computer rooms, achieving a silent environment. Eighth, immersion liquid cooling does not require chillers, precision air conditioning in the computer room, underfloor air supply, and isolation of hot and cold channels, which simplifies the computer room structure and reduces the construction difficulty and engineering workload.

[0030] In related technologies, such as Figure 1As shown, an immersion liquid cooling system using immersion cooling immerses the server motherboard in a refrigerant-filled immersion chamber (TANK). When the server is running, the refrigerant in the chamber exchanges heat with the server's components. The high-temperature refrigerant after heat exchange is pumped out and sent to a plate heat exchanger. After heat exchange with cold water supplied by an outdoor cooling tower, the refrigerant's temperature is reduced. The cooled refrigerant is then filtered and returned to the immersion chamber. The pump, plate heat exchanger, filter, and related piping sensors, valves, and other accessories are integrated into a cooling dispensing unit (CDU).

[0031] like Figure 2 As shown, in the related art, the cooling distribution unit is integrated with the immersion cavity, and the cooling distribution unit is provided with a power supply interface, a weak current line interface, and a water supply and return pipe for liquid supply and return. When the server needs to be maintained, it is necessary to open the upper cover of the immersion cavity and vertically plug and unplug the server motherboard for maintenance. Therefore, the immersion cavity usually adopts a horizontal structure and is laid flat on the ground. As a result, the floor area of ​​the immersion cavity is larger than that of the cabinet using air cooling, and the height space cannot be fully utilized. When the server power density is high, the server power density per square meter exceeds that of air cooling, but when the server power density is low, the power density per square meter of the computer room using the immersion liquid cooling system in the related art will be the same as or even lower than that of the computer room using air cooling, which is contrary to the original intention of improving the power density of the computer room.

[0032] Moreover, in the immersion liquid cooling system of the related technology, the refrigerant is separated from the bottom liquid distributor and flows to the central processing unit of the server motherboard. It adopts the natural convection heat exchange method, which has limited heat exchange capacity and poor heat dissipation effect when the heat flux density of the server is extremely high.

[0033] In addition, in other related technologies, a heat dissipation method combining liquid cooling and air cooling has been proposed. However, in this heat dissipation method, only the chips and some components of the cold plate server use liquid cooling, and other components of the server need to be air cooled. It is necessary to use two heat dissipation systems of air cooling and liquid cooling, and natural cooling cannot be achieved.

[0034] In view of this, according to an embodiment of the present disclosure, an immersion server embodiment is provided. Figure 3 As shown, the immersion server 1 includes an immersion chamber 11, a heat exchange device 12, a first joint 13 and a second joint 14. A server motherboard 15 is provided in the immersion chamber, and a target processing unit is provided on the server motherboard 15. The heat exchange device 12 is in contact with the target processing unit and is used to perform heat exchange with the target processing unit. Figure 4As shown, the first connector 13 is used to connect the immersion chamber 11 with the refrigeration system 2, and the refrigeration system 2 is used to provide a cooling first fluid to the immersion chamber 11. The second connector 14 is used to connect the heat exchange device 12 with the refrigeration system 2, and the refrigeration system 2 is also used to provide a cooling second fluid to the heat exchange device 12.

[0035] It is worth noting that the server motherboard 15 is provided with multiple components, and the target processing unit is the component to be cooled on the server motherboard 15. For example, the target processing unit is the component with the highest heat generation on the server motherboard 15, the component with heat generation exceeding a preset heat threshold, the component with the highest power density, or the component with power density exceeding a preset power threshold.

[0036] Optionally, the target processing unit is a chip.

[0037] The heat exchange device 12 can be located above or below the target processing unit. The location of the heat exchange device 12 can be adjusted based on actual conditions. The installation location of the heat exchange device 12 must ensure that the heat exchange device 12 can effectively exchange heat with the target processing unit. If there are multiple target processing units, a corresponding heat exchange device 12 can be installed for each target processing unit. The heat exchange devices 12 can be connected in series or in parallel.

[0038] For example, the fluid inlet of the first heat exchanger 12 is connected to the second connector 14, the fluid outlet of the first heat exchanger 12 is connected to the fluid inlet of the second heat exchanger 12, and so on. The fluid outlet of the n-1th heat exchanger 12 is connected to the fluid inlet of the nth heat exchanger 12, and the fluid outlet of the nth heat exchanger 12 is connected to the second connector 14, thereby forming a second fluid loop with the refrigeration system 2. Here, n is the total number of heat exchangers 12. Alternatively, the fluid inlet and fluid outlet of each heat exchanger 12 are connected to the second connector 14, thereby forming a second fluid loop with the refrigeration system 2. In addition, the connection method between the heat exchangers 12 can also be adjusted according to actual conditions and is not limited here.

[0039] It should be noted that the first fluid and the second fluid are insulating liquids. The first fluid and the second fluid can be the same insulating liquid or different insulating liquids.

[0040] The immersion server provided in this embodiment utilizes an immersion chamber 11 to individually seal the server motherboard 15 and is equipped with a heat exchanger 12 that contacts the target processing unit on the server motherboard 15. The immersion server 1 also includes a first connector 13 and a second connector 14. The first connector 13 connects the immersion chamber 11 with the refrigeration system 2, allowing the refrigeration system 2 to supply a first cooling fluid to the immersion chamber 11. The second connector 14 connects the heat exchanger 12 with the refrigeration system 2, allowing the refrigeration system 2 to supply a second cooling fluid to the heat exchanger 12. Therefore, the cooling fluid output from the refrigeration system 2 can enter the immersion server 1 in two ways: one path enters the immersion chamber 11 to provide cooling for the various components on the server motherboard 15, and the other path enters the heat exchanger 12 to provide cooling for the target processing unit. After absorbing heat from the components, the first fluid flowing through the immersion chamber 11 can be returned to the refrigeration system 2 through the first connector 13 for cooling, allowing it to enter the next round of cooling. At the same time, after absorbing the heat from the target components, the second fluid flowing through the heat exchange device 12 can be returned to the refrigeration system 2 for cooling through the second joint 14 or through the immersion chamber 11 using an open structure to enter the next round of refrigeration, thereby completing the heat dissipation cycle. As a result, the target processing unit can be immersed in the first fluid to exchange heat with the cooled first fluid, and can also exchange heat with the heat exchange device 12, and can effectively absorb the heat generated by the target processing unit. At the same time, the heat exchange device 12 is also immersed in the first fluid, which helps to improve the heat exchange efficiency of the heat exchange device 12, so that when the heat flux density of the immersion server 1 is extremely high, it can effectively cool the immersion server 1 and achieve a better heat dissipation effect.

[0041] In some optional embodiments, such as Figure 4 As shown, the first connector 13 includes a first supply interface and a first return interface. One end of the first supply interface is connected to the fluid inlet of the immersion chamber 11, and the other end of the first supply interface is used to communicate with the fluid outlet of the refrigeration system 2. One end of the first return interface is connected to the fluid outlet of the immersion chamber 11, and the other end of the first return interface is used to communicate with the fluid inlet of the refrigeration system 2.

[0042] In some optional embodiments, such as Figure 3 and Figure 4 As shown, when the first fluid and the second fluid are of the same type, the fluid inlet of the heat exchange device 12 is connected to the second joint 14 , and the fluid outlet of the heat exchange device 12 is connected to the immersion chamber 11 .

[0043] Furthermore, when the fluid outlet of the heat exchange device 12 is connected to the immersion chamber 11, the second joint 14 only includes a second fluid supply interface. One end of the second fluid supply interface is connected to the fluid inlet of the heat exchange device 12, and the other end of the second fluid supply interface is used to communicate with the fluid outlet of the refrigeration system 2.

[0044] For example, taking the case where the first fluid and the second fluid are the same type of fluorinated liquid, since the first fluid and the second fluid are of the same fluid type, the first fluid and the second fluid can be mixed. Therefore, the fluid outlet of the heat exchange device 12 can be connected to the immersion chamber 11, and the fluid in the immersion chamber 11 can be returned to the refrigeration system 2 only through the first reflux interface in the first joint 13.

[0045] Optionally, the heat exchange device 12 is an open cold plate, or other heat exchange devices with cooling channels exposed to the outside.

[0046] In other optional embodiments, such as Figure 5 As shown, the second connector 14 includes a second supply interface and a second return interface. One end of the second supply interface is connected to the fluid inlet of the heat exchange device 12, and the other end of the second supply interface is used to communicate with the fluid outlet of the refrigeration system 2. One end of the second return interface is connected to the fluid outlet of the heat exchange device 12, and the other end of the second return interface is used to communicate with the fluid inlet of the refrigeration system 2.

[0047] For example, Figure 6 As shown, the fluid inlet of the heat exchange device 12 is connected to the second liquid supply interface of the second joint 14, and the fluid outlet of the heat exchange device 12 is connected to the second return interface of the second joint 14, thereby forming a second fluid loop with the refrigeration system 2.

[0048] In some optional embodiments, when the first fluid and the second fluid are of the same type, such as Figure 6 As shown, the refrigeration system 2 may only include the first distribution unit 21, which is respectively connected to the first joint 13 and the second joint 14. The first distribution unit 21 provides the immersion chamber 11 and the heat exchange device 12 with the first fluid and the second fluid for cooling, respectively.

[0049] In other optional embodiments, such as Figure 7 As shown, the refrigeration system 2 includes a first distribution unit 21 and a second distribution unit 22. The first joint 13 is used to connect the immersion chamber 11 and the first distribution unit 21. The second joint 14 is used to connect the heat exchange device 12 and the second distribution unit 22.

[0050] It should be noted that the first distribution unit 21 and the second distribution unit 22 are cooling capacity distribution units. The first fluid and the second fluid provided by the first distribution unit 21 and the second distribution unit 22 can be fluids of the same type or fluids of different types. In addition, the liquid supply temperature of the first distribution unit 21 and the liquid supply temperature of the second distribution unit 22 can be the same or different. That is, the temperature of the first fluid provided and the temperature of the second fluid provided can be the same or different. Among them, if the heat flux density of the target processing unit is too high, the temperature of the second fluid provided by the second distribution unit 22 can be lower than the temperature of the first fluid provided by the first distribution unit 21, thereby solving the heat dissipation problem of the target processing unit.

[0051] In the immersion server provided in this embodiment, when the cooling system 2 includes a first distribution unit 21 and a second distribution unit 22, the first connector 13 is used to connect the immersion chamber 11 and the first distribution unit 21, and the second connector 14 is used to connect the heat exchange device 12 and the second distribution unit 22. Therefore, the first distribution unit 21 and the second distribution unit 22 can be used to provide different types of fluids to the heat exchange device 12 and the immersion chamber 11 according to the needs and the difference in contact materials, thereby adapting to a variety of application scenarios.

[0052] Furthermore, if Figure 7 As shown, one end of the first fluid supply interface of the first joint 13 is connected to the fluid inlet of the immersion chamber 11, and the other end of the first fluid supply interface is used to communicate with the fluid outlet of the first distribution unit 21. One end of the first return interface of the first joint 13 is connected to the fluid outlet of the immersion chamber 11, and the other end of the first return interface is used to communicate with the fluid inlet of the first distribution unit 21.

[0053] It can be understood that the first supply interface is used to provide the first fluid output by the first distribution unit 21 to the immersion chamber 11, and the first reflux interface is used to discharge the first fluid after absorbing heat in the immersion chamber 11 to the first distribution unit 21 to cool the first fluid in the first distribution unit 21.

[0054] The immersion server provided in this embodiment is configured with a first supply interface and a first return interface on the first joint 13. Therefore, the cooling first fluid provided by the first distribution unit 21 and the first fluid absorbing heat in the immersion chamber 11 can be controlled separately to accurately adjust the flow rate of the first fluid input into the immersion chamber 11 and the flow rate of the first fluid output to the first distribution unit 21, thereby effectively regulating the temperature in the immersion chamber 11 and improving the heat dissipation effect.

[0055] Furthermore, one end of the second supply interface of the second joint 14 is connected to the fluid inlet of the heat exchange device 12, and the other end of the second supply interface is used to communicate with the fluid outlet of the second distribution unit 22. One end of the second return interface of the second joint 14 is connected to the fluid outlet of the heat exchange device 12, and the other end of the second return interface is used to communicate with the fluid inlet of the second distribution unit 22.

[0056] The immersion server provided in this embodiment is configured with a second supply interface and a second return interface on the second joint 14. Therefore, the cooling second fluid provided by the second distribution unit 22 and the second fluid absorbing heat in the heat exchange device 12 can be controlled separately to accurately adjust the flow rate of the second fluid input into the heat exchange device 12 and the flow rate of the second fluid output to the second distribution unit 22, thereby effectively regulating the temperature in the heat exchange device 12 and improving the heat dissipation effect.

[0057] In some optional embodiments, the first connector 13 and the second connector 14 are provided on the same outer surface of the immersion chamber 11 to facilitate connection with the refrigeration system 2. For example, the first connector 13 and the second connector 14 are provided at the rear end of the immersion server 1 or the immersion chamber 11.

[0058] In some optional embodiments, the heat exchange device 12 is a cold plate. For example, an open cold plate or a closed cold plate. The open cold plate is only applicable when the first and second fluids are of the same type. The closed cold plate does not specify the type of the first and second fluids.

[0059] It should be noted that, in addition to using a cold plate as the heat exchange device 12 , a heat exchange device 12 such as a finned heat exchange tube may also be used according to actual needs, and the heat exchange device 12 is not limited here.

[0060] The immersion server provided in this embodiment features a compact cold plate structure and high heat exchange efficiency. Compared to other heat exchange devices, the cold plate is smaller, lighter, and has a larger heat transfer area. Therefore, when a cold plate is used as heat exchange device 12, whether installed above the target processing unit or elsewhere, it is less likely to damage small components such as the target processing unit. Furthermore, because the cold plate utilizes indirect cooling, it can prevent the target processing unit from being corroded by the second fluid.

[0061] In this embodiment, an immersion liquid cooling system is also provided, which includes a server rack 3 (RACK) and a refrigeration system 2. Figure 8As shown, the server rack 3 is provided with at least one mounting slot for mounting the immersion server 1. The refrigeration system 2 is connected to the first connector 13 and the second connector 14 of the immersion server 1. The refrigeration system 2 is used to provide a first cooling fluid to the immersion chamber 11 of the immersion server 1 and a second cooling fluid to the heat exchange device 12 of the immersion server 1.

[0062] Specifically, if Figure 8 As shown, the installation slots are arranged layer by layer in the height direction of the server rack 3.

[0063] The immersion liquid cooling system provided in this embodiment eliminates the need for an additional immersion chamber because the immersion server 1 is sealed in a single unit. Multiple immersion servers 1 can be placed in a server rack 3 to form an immersion cabinet. This three-dimensional cabinet design allows for the immersion of the immersion servers 1, fully utilizing the height of the data center computer room, increasing the power density per unit area, and reducing the footprint of individual cabinets.

[0064] In some optional embodiments, the refrigeration system 2 includes a first distribution unit 21. When the first fluid and the second fluid are of the same type, the first distribution unit 21 is configured to provide the first cooling fluid to the immersion chamber 11 of the immersion server 1 and to provide the second cooling fluid to the heat exchange device 12 of the immersion server 1.

[0065] In other optional embodiments, the refrigeration system 2 includes a first distribution unit 21 and a second distribution unit 22. The first distribution unit 21 is connected to the first connector 13 of the immersion server 1 and is used to provide a cooling first fluid to the immersion chamber 11 of the immersion server 1. The second distribution unit 22 is connected to the second connector 14 of the immersion server 1 and is used to provide a cooling second fluid to the heat exchange device 12 of the immersion server 1.

[0066] In the immersion liquid cooling system provided in this embodiment, the refrigeration system 2 is configured with a first distribution unit 21 and a second distribution unit 22. The first distribution unit 21 is connected to the first connector 13 of the immersion server 1, and the second distribution unit 22 is connected to the second connector 14 of the immersion server 1. Therefore, the first distribution unit 21 and the second distribution unit 22 can be used to provide different types of fluids to the heat exchange device 12 and the immersion chamber 11 of the immersion server 1 according to the needs and the difference in contact materials, thereby adapting to a variety of application scenarios.

[0067] Specifically, the fluid inlet of the first distribution unit 21 is connected to the first return interface of the first connector 13 . The fluid outlet of the first distribution unit 21 is connected to the first liquid supply interface of the first connector 13 .

[0068] Specifically, the fluid inlet of the second distribution unit 22 is connected to the second return interface of the second joint 14 to communicate with the fluid outlet of the heat exchange device 12. The fluid outlet of the second distribution unit 22 is connected to the second liquid supply interface of the second joint 14 to communicate with the fluid inlet of the heat exchange device 12.

[0069] Specifically, the first distribution unit 21 and the second distribution unit 22 are cooling capacity distribution units.

[0070] It should be noted that the liquid supply temperatures of the first distribution unit 21 and the second distribution unit 22 may be the same or different.

[0071] In some optional embodiments, the liquid supply temperature of the first distribution unit 21 and the liquid supply temperature of the second distribution unit 22 are different.

[0072] Specifically, the first distribution unit 21 and the second distribution unit 22 can be used to provide fluids of different temperatures to the immersion chamber 11 and the heat exchange device 12, respectively, based on actual needs. For example, if the heat flux density of the target processing unit is extremely high, the heat exchange device 12 can be supplied with a fluid that is much lower than the temperature within the immersion chamber 11. In other words, the temperature of the second fluid is lower than that of the first fluid, thereby solving the heat dissipation problem of the target processing unit. Furthermore, because the heat exchange device 12 is immersed in the first fluid, there is no need to worry about condensation on the heat exchange device 12, even if the temperature of the second fluid is very low. Furthermore, if the first and second fluids are the same insulating liquid, there is no need to worry about leakage of the second fluid.

[0073] In the immersion liquid cooling system provided in this embodiment, the liquid supply temperatures of the first distribution unit 21 and the second distribution unit 22 are different. Therefore, the temperature of the heat exchange device 12 and the immersion chamber 11 can be flexibly adjusted according to different heat dissipation requirements to further improve the heat exchange efficiency.

[0074] Furthermore, the liquid supply temperature of the first distribution unit 21 is higher than the liquid supply temperature of the second distribution unit 22. The first distribution unit 21 includes a first heat exchange subunit 211, and the second distribution unit 22 includes a second heat exchange subunit 221. The fluid outlet of the second heat exchange subunit 221 at the cold end is connected to the fluid inlet of the first heat exchange subunit 211 at the cold end.

[0075] It should be noted that the first heat exchange subunit 211 is used to perform heat exchange with the first fluid flowing through the first distribution unit 21, and the second heat exchange subunit 221 is used to perform heat exchange with the second fluid flowing through the second distribution unit 22. Specifically, the hot end of the first heat exchange subunit 211 contacts the first fluid flowing through the first distribution unit 21. The hot end of the first heat exchange subunit 211 absorbs heat from the first fluid and transfers the absorbed heat to the cold end of the first heat exchange subunit 211, where it performs heat exchange with the cooling medium flowing through the cold end of the first heat exchange subunit 211, thereby cooling the first fluid. The hot end of the second heat exchange subunit 221 contacts the second fluid flowing through the second distribution unit 22. The hot end of the second heat exchange subunit 221 absorbs heat from the second fluid and transfers the absorbed heat to the cold end of the second heat exchange subunit 221, where it performs heat exchange with the cooling medium flowing through the cold end of the second heat exchange subunit 221, thereby cooling the second fluid.

[0076] It's worth noting that if the liquid supply temperature of the second distribution unit 22 is low, the temperature of the fluid entering and exiting the second distribution unit 22 will also be low. Therefore, the cooling medium (i.e., water) after heat exchange in the second heat exchange subunit 221 of the second distribution unit 22 can be used to dissipate heat from the first heat exchange subunit 211 of the first distribution unit 21, thereby utilizing excess heat. Alternatively, different heat sources can be used to match different heating needs, with the cooling medium (i.e., water) after heat exchange in the first and second heat exchange subunits being delivered to the data center or surrounding heat-using locations.

[0077] In the immersion liquid cooling system provided in this embodiment, when the liquid supply temperature of the first distribution unit 21 is higher than that of the second distribution unit 22, the fluid outlet at the cold end of the second heat exchange subunit 221 is connected to the fluid inlet at the cold end of the first heat exchange subunit 211. Therefore, the cooling medium after heat exchange in the second heat exchange subunit 221 can be used to dissipate heat from the first heat exchange subunit 211, thereby utilizing the remaining heat.

[0078] In other optional embodiments, the liquid supply temperature of the second distribution unit 22 is higher than the liquid supply temperature of the first distribution unit 21, and the fluid outlet of the first heat exchange subunit 211 at the cold end is connected to the fluid inlet of the second heat exchange subunit 221 at the cold end.

[0079] Specifically, the liquid supply temperature of the first distribution unit 21 and the second distribution unit 22 can be adjusted according to actual conditions, and is not limited here.

[0080] In some optional embodiments, the refrigeration system 2 further includes a refrigeration device 23, which is used to provide a cooling medium for the first distribution unit 21 and the second distribution unit 22. Optionally, the refrigeration device 23 is a cooling tower, and the cooling medium is water.

[0081] Furthermore, if Figure 6 As shown, the first distribution unit 21 also includes a first circulation subunit 212 and a first filtering subunit 213. The fluid inlet of the first circulation subunit 212 is connected to the first reflux interface of the first joint 13 via the fluid inlet of the first distribution unit 21, and the fluid outlet of the first circulation subunit 212 is connected to the fluid inlet of the first heat exchange subunit 211 at the hot end. The fluid outlet of the first heat exchange subunit 211 at the hot end is connected to the fluid inlet of the first filtering subunit 213, the fluid inlet of the first heat exchange subunit 211 at the cold end is connected to the fluid outlet of the refrigeration device 23, and the fluid outlet of the first heat exchange subunit 211 at the cold end is connected to the fluid inlet of the refrigeration device 23. The fluid outlet of the first filtering subunit 213 is connected to the first liquid supply interface of the first joint 13 via the fluid outlet of the first distribution unit 21. It should be noted that if the cooling medium after heat exchange in the second heat exchange subunit 221 provides coldness for the first heat exchange subunit 211 , the cold end of the first heat exchange subunit 211 may not be connected to the refrigeration device 23 .

[0082] Furthermore, if Figure 7 As shown, the second distribution unit 22 also includes a second circulation subunit 222 and a second filtering subunit 223. The fluid inlet of the second circulation subunit 222 is connected to the second return interface of the second joint 14 via the fluid inlet of the second distribution unit 22, and the fluid outlet of the second circulation subunit 222 is connected to the fluid inlet of the second heat exchange subunit 221 at the hot end. The fluid outlet of the second heat exchange subunit 221 at the hot end is connected to the fluid inlet of the second filtering subunit 223, the fluid inlet of the second heat exchange subunit 221 at the cold end is connected to the fluid outlet of the refrigeration device 23, and the fluid outlet of the second heat exchange subunit 221 at the cold end is connected to the fluid inlet of the refrigeration device 23. The fluid outlet of the second filtering subunit 223 is connected to the second liquid supply interface of the second joint 14 via the fluid outlet of the second distribution unit 22. It should be noted that if the cooling medium after heat exchange in the first heat exchange subunit 211 provides coldness for the second heat exchange subunit 221 , the cold end of the second heat exchange subunit 221 may not be connected to the refrigeration device 23 .

[0083] Optionally, the first circulation subunit 212 and the second circulation subunit 222 are circulation pumps.

[0084] Optionally, the first heat exchange subunit 211 and the second heat exchange subunit 221 are plate heat exchangers.

[0085] Optionally, the first filtering subunit 213 and the second filtering subunit 223 are filters.

[0086] In some optional embodiments, the first fluid provided by the first dispensing unit 21 and the second fluid provided by the second dispensing unit 22 are of the same type.

[0087] In some other optional embodiments, the first fluid provided by the first distribution unit 21 and the second fluid provided by the second distribution unit 22 are of different types.

[0088] It is worth noting that when the first fluid and the second fluid used in the heat exchange device 12 and the immersion chamber 11 are different, the first distribution unit 21 and the second distribution unit 22 can be used to provide two different types of fluids to the heat exchange device 12 and the immersion chamber 11, depending on actual needs. For example, different types of fluorinated liquids, a refrigerant composed of a fluorinated liquid and oil, or a refrigerant obtained by other combinations. In this case, the temperatures of the first and second fluids can be the same or different, without limitation.

[0089] In the immersion liquid cooling system provided in this embodiment, the first fluid provided by the first distribution unit 21 is different from the second fluid provided by the second distribution unit 22. Therefore, different fluids can be provided based on the materials of the heat exchange device 12 and the immersion chamber 11, expanding the range of fluid options and enabling flexible matching of fluids to accommodate a wider range of application scenarios.

[0090] In some optional embodiments, the first fluid and the second fluid respectively include at least one of a fluorinated liquid, a refrigerant consisting of a fluorinated liquid and oil, and other refrigerants.

[0091] In some optional embodiments, such as Figure 9 As shown, the server rack 3 includes a third connector 31 corresponding to the mounting slot and a fourth connector 32 corresponding to the mounting slot. The third connector 31 mates with the first connector 13 and is used to connect the first connector 13 of the corresponding immersion server 1 with the cooling system 2. The fourth connector 32 mates with the second connector 14 and is used to connect the second connector 14 of the corresponding immersion server 1 with the cooling system 2.

[0092] It should be noted that the first connector 13 and the third connector 31 , as well as the second connector 14 and the fourth connector 32 may be quick-connect or other connection methods, which are not limited here.

[0093] In the immersion liquid cooling system provided in this embodiment, since the immersion server 1 is provided with a first connector 13, a second connector 14, and corresponding pipelines, a third connector 31 and a fourth connector 32 are provided on the server rack 3, which are adapted to the first connector 13 and the second connector 14, respectively. The third connector 31 and the fourth connector 32 can be used to quickly connect the immersion server 1 to the cooling system 2.

[0094] In some optional embodiments, such as Figure 9 As shown, the server rack 3 further includes a primary liquid distributor 33. The fluid inlet of the primary liquid distributor 33 is connected to the fluid outlet of the refrigeration system 2, and the fluid outlet of the primary liquid distributor 33 is connected to the fluid supply interface of the third connector 31 and the fluid supply interface of the fourth connector 32, respectively. The fluid supply interface of the third connector 31 is used to provide the first fluid to the first connector 13, and the fluid supply interface of the fourth connector 32 is used to provide the second fluid to the second connector 14.

[0095] In some optional embodiments, such as Figure 9 As shown, the server rack 3 further includes a main liquid collector 34. The fluid inlet of the main liquid collector 34 is connected to the return interface of the third joint 31 and the return interface of the fourth joint 32, respectively. The fluid outlet of the main liquid collector 34 is connected to the fluid inlet of the refrigeration system 2. The return interface of the third joint 31 is used to recover the first fluid returned from the first joint 13, and the return interface of the fourth joint 32 is used to recover the second fluid returned from the second joint 14.

[0096] It should be noted that the return port of the fourth joint 32 is connected to the second return port of the second joint 14 to recover the second fluid returned from the second joint 14 only if the second joint 14 is provided with a second return port. If the first fluid and the second fluid are of the same type, the fluid outlet of the heat exchange device 12 is connected to the immersion chamber 11, and the second joint 14 is not provided with a second return port, then the return port of the fourth joint 32 does not need to recover the second fluid returned from the second joint 14.

[0097] Specifically, if Figure 9 As shown, the flow supply interface of the third joint 31 and the flow supply interface of the fourth joint 32 are provided on the main liquid distributor 33, and the return interface of the third joint 31 and the return interface of the fourth joint 32 are provided on the main liquid collector 34. The flow supply interface of the third joint 31 and the flow supply interface of the fourth joint 32 correspond to the position of the installation slot and are spaced apart on the main liquid distributor 33. The return interface of the third joint 31 and the return interface of the fourth joint 32 correspond to the position of the installation slot and are spaced apart on the main liquid collector 34. In addition, in order to facilitate the connection between the first joint 13 and the third joint 31 and the connection between the second joint 14 and the fourth joint 32, the third joint 31 matches the installation position of the first joint 13 when the immersion server 1 is installed in the installation slot, and the fourth joint 32 matches the installation position of the second joint 14 when the immersion server 1 is installed in the installation slot.

[0098] Specifically, the main liquid distributor 33 and the main liquid collector 34 are disposed oppositely on one side of the server rack 3. For example, the main liquid distributor 33 and the main liquid collector 34 are located on the left and right sides of the back of the server rack 3, respectively.

[0099] The immersion liquid cooling system provided in this embodiment is configured with a main liquid distributor 33 and a main liquid collector 34 on the server rack 3. Thus, the main liquid distributor 33 can be used to distribute cooling to the immersion servers 1, while the main liquid collector 34 can be used to combine the hot fluid from the immersion servers 1 and then send it to the refrigeration system 2, completing the heat dissipation cycle.

[0100] In some optional embodiments, such as Figure 10 As shown, if the refrigeration system 2 includes a first distribution unit 21 and a second distribution unit 22, the first distribution unit 21 is connected to the first connector 13 of the immersion server 1, and the second distribution unit 22 is connected to the second connector 14 of the immersion server 1. Then, the main liquid distributor 33 includes a first liquid distributor 331 and a second liquid distributor 332. The fluid inlet of the first liquid distributor 331 is connected to the fluid outlet of the first distribution unit 21, and the fluid outlet of the first liquid distributor 331 is connected to the fluid supply interface of the third connector 31. The fluid inlet of the second liquid distributor 332 is connected to the fluid outlet of the second distribution unit 22, and the fluid outlet of the second liquid distributor 332 is connected to the fluid supply interface of the fourth connector 32.

[0101] The immersion cooling system provided in this embodiment includes a first liquid distributor 331 and a second liquid distributor 332 on the server rack 3 for the first distribution unit 21 and the second distribution unit 22, respectively. Thus, the first liquid distributor 331 and the second liquid distributor 332 can effectively distribute the cooling energy provided by the first distribution unit 21 and the second distribution unit 22.

[0102] In some optional embodiments, such as Figure 10 As shown, if the refrigeration system 2 includes a first distribution unit 21 and a second distribution unit 22, the first distribution unit 21 is connected to the first connector 13 of the immersion server 1, and the second distribution unit 22 is connected to the second connector 14 of the immersion server 1. Then, the main liquid collector 34 includes a first liquid collector 341 and a second liquid collector 342. The fluid inlet of the first liquid collector 341 is connected to the return interface of the third connector 31, and the fluid outlet of the first liquid collector 341 is connected to the fluid inlet of the first distribution unit 21. The fluid inlet of the second liquid collector 342 is connected to the return interface of the fourth connector 32, and the fluid outlet of the second liquid collector 342 is connected to the fluid inlet of the second distribution unit 22.

[0103] The immersion liquid cooling system provided in this embodiment includes a first liquid collector 341 and a second liquid collector 342 disposed on the server rack 3 for the first distribution unit 21 and the second distribution unit 22, respectively. Thus, the first liquid collector 341 and the second liquid collector 342 can effectively combine the fluid returning from the immersion chamber 11 of the immersion server 1 and the heat exchange device 12 for delivery to the corresponding distribution unit.

[0104] It should be noted that, in order to facilitate distinction and connection, the first liquid distributor 331 and the second liquid distributor 332 are arranged side by side on one side of the server rack 3, and the first liquid collector 341 and the second liquid collector 342 are arranged side by side on the other side of the server rack 3. Figure 10 As shown, from left to right, they are the first liquid separator 331 , the second liquid separator 332 , the second liquid collector 342 , and the first liquid collector 341 .

[0105] Specifically, if Figure 10 As shown, the flow supply interface of the third joint 31 is arranged on the first liquid separator 331, the flow supply interface of the fourth joint 32 is arranged on the second liquid separator 332, the return interface of the third joint 31 is arranged on the first liquid collector 341, and the return interface of the fourth joint 32 is arranged on the second liquid collector 342.

[0106] It is worth noting that after adopting the immersion server 1 and the immersion liquid cooling system disclosed in the present invention, the following application modes can be obtained:

[0107] In the first scenario, the immersion chamber 11 and the heat exchange device 12 use the same fluid, and the refrigeration system 2 utilizes a single distribution unit, such as a first distribution unit 21, which provides cooling fluid to the immersion chamber 11 and the heat exchange device 12, respectively. In this scenario, the fluid outlet of the heat exchange device 12 (e.g., an open cold plate) communicates with the immersion chamber 11, and the second joint 14 used between the refrigeration system 2 and the heat exchange device 12 is provided with only a second supply interface. Alternatively, the second joint 14 used between the refrigeration system 2 and the heat exchange device 12 is provided with both a second supply interface and a second return interface, and the fluid outlet of the heat exchange device 12 (e.g., a closed cold plate) is connected to the refrigeration system 2 via the second return interface of the second joint 14.

[0108] In the second method, the immersion chamber 11 and the heat exchange device 12 use the same fluid. The refrigeration system uses two distribution units, such as a first distribution unit 21 and a second distribution unit 22. The first distribution unit 21 provides the first cooling fluid to the immersion chamber 11, and the second distribution unit 22 provides the second cooling fluid to the heat exchange device 12. The fluid outlet of the heat exchange device 12 (such as an open cold plate) is connected to the immersion chamber 11, and the second joint 14 used between the second distribution unit 22 and the heat exchange device 12 is only provided with a second fluid supply interface.

[0109] In the third method, the immersion chamber 11 and the heat exchange device 12 use the same fluid. The refrigeration system uses two distribution units, such as a first distribution unit 21 and a second distribution unit 22. The first distribution unit 21 provides the first cooling fluid to the immersion chamber 11, and the second distribution unit 22 provides the second cooling fluid to the heat exchange device 12. The second joint 14 used between the second distribution unit 22 and the heat exchange device 12 is provided with a second supply interface and a second return interface. The fluid outlet of the heat exchange device 12 (such as a closed cold plate) is connected to the second distribution unit 22 through the second return interface of the second joint 14.

[0110] Fourth, the immersion chamber 11 and the heat exchange device 12 use different types of fluids, and the temperatures of the fluids in the immersion chamber 11 and the heat exchange device 12 are different. The cooling system uses two distribution units, such as a first distribution unit 21 and a second distribution unit 22. The first distribution unit 21 provides the cooling first fluid to the immersion chamber 11, and the second distribution unit 22 provides the cooling second fluid to the heat exchange device 12.

[0111] Fifth, the immersion chamber 11 and the heat exchange device 12 use different types of fluids, and the fluid temperatures in the immersion chamber 11 and the heat exchange device 12 are the same. The cooling system uses two distribution units, such as a first distribution unit 21 and a second distribution unit 22. The first distribution unit 21 provides the immersion chamber 11 with a cooled first fluid, and the second distribution unit 22 provides the heat exchange device 12 with a cooled second fluid.

[0112] In the application method given above, if the immersion chamber 11 and the heat exchange device 12 use the same type of fluid, and the second joint 14 is provided with a second supply interface and a second return interface, then corresponding quick-connect interfaces need to be provided for the supply interface and return interface of the first joint 13 and the second joint 14 respectively (that is, the supply interface and return interface of the third joint 31 and the fourth joint 32). At this time, two quick-connect interfaces are required for supply and return respectively. The two quick-connect interfaces for supply can share a manifold (Mainfold) connected to the refrigeration system 2, and the two quick-connect interfaces for return can share a manifold connected to the refrigeration system 2. At least two manifolds are required for supply and return.

[0113] If the immersion chamber 11 and the heat exchange device 12 use the same type of fluid, then in the second application mode, only one quick-connect interface is required for the first return interface of the first joint 13 (i.e., the return interface of the third joint 31), and two quick-connect interfaces are provided for the first supply interface of the first joint 13 and the second supply interface of the second joint 14 (i.e., the supply interfaces of the third joint 31 and the fourth joint 32). In this case, two quick-connect interfaces are required for supply and one quick-connect interface is required for return. The two quick-connect interfaces for supply can share a manifold (Mainfold) connected to the refrigeration system 2. At least two manifolds are required for supply and return.

[0114] If the immersion chamber 11 and the heat exchange device 12 use different types of fluids, corresponding quick-connect interfaces need to be provided for the supply interface and return interface of the first joint 13 and the second joint 14 (i.e., the supply interface and return interface of the third joint 31 and the fourth joint 32). In this case, two quick-connect interfaces are required for the supply and return respectively. Each of the two supply quick-connect interfaces requires a manifold connected to the refrigeration system 2, and each of the two return quick-connect interfaces also requires a manifold connected to the refrigeration system 2. At least four manifolds are required for the supply and return.

[0115] It is worth noting that the immersion server 1 and immersion liquid cooling system disclosed herein have the following advantages over related technologies: First, the immersion server 1 is individually sealed, allowing it to be immersed in a three-dimensional cabinet configuration. Compared to a flat tank structure, this fully utilizes the height of the computer room, improves the power density per unit area, and reduces the footprint of a single cabinet. Second, the target processing unit (e.g., chip) of the immersion server 1 is covered with a heat exchanger 12 (e.g., a cold plate), which can resolve the target processing unit heat dissipation bottleneck caused by natural convection during immersion in the existing tank. At the same time, the target processing unit is immersed in the first fluid and covered by the heat exchanger 12, resulting in high heat dissipation efficiency. Third, since the heat exchanger 12 is immersed in the first fluid, it helps to cool the heat exchanger 12. Fourth, without the need for an auxiliary air cooling system, it can also solve the heat dissipation of other components on the server motherboard 15 besides the target processing unit, thereby achieving natural cooling throughout the year. Fifth, the heat exchanger 12 can use an insulating liquid, so even if it leaks, there is no need to worry about it affecting the server. Sixth, the same fluid can be used in the heat exchange device 12 and the immersion chamber 11, and the fluid temperatures can be the same or different. Even if there is a leak, there is no need to worry about fluid mixing. Seventh, different types of fluids can be used in the heat exchange device 12 and the immersion chamber 11 according to the needs and the difference in the fluid contact materials, so as to achieve a flexible combination of fluids to suit different application scenarios and scopes. Eighth, the present disclosure adds a sealed immersion chamber 11 to a single service motherboard, and sets a liquid distributor and a liquid collector in the server rack 3. The liquid distributor and the liquid collector are similar in shape to the liquid distributor and the liquid collector of the cold plate cabinet. Only an immersion interface needs to be added, and the existing immersion server 1 and server cabinet require little modification. Ninth, insulating liquid can be used as the first fluid and the second fluid, which reduces the sealing requirements for the heat exchange device 12 and the screenshot, and even other connection methods other than quick connect can be used.

[0116] As can be understood, the immersion server 1 and immersion liquid cooling system disclosed herein combine the advantages of both immersion cooling and cold plate cooling, enabling 100% liquid cooling. This also addresses the issue of localized hotspots when immersing chips, thereby achieving ultra-high power density heat dissipation and increasing computing service output per unit area.

[0117] As a specific application example, taking an immersion server 1 equipped with a first connector 13 and a second connector 14, and a server rack 3 equipped with a third connector 31 and a fourth connector 32, the immersion server 1 and the immersion liquid cooling system of the present disclosure are used in a data center. Whenever a new immersion server 1 is connected to the server rack 3, the first connector 13 of the immersion server 1 is connected to the corresponding third connector 31 on the server rack 3, and the second connector 14 of the immersion server 1 is connected to the corresponding fourth connector 32 on the server rack 3 to connect the immersion server 1 to the cooling system 2 of the immersion liquid cooling system, thereby dissipating heat from the immersion server 1 when the immersion server 1 is in operation.

[0118] Although the embodiments of the present disclosure have been described with reference to the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present disclosure, and such modifications and variations are all within the scope defined by the appended claims.

Claims

1. An immersion server, characterized in that: The immersion server comprises: an immersion chamber, wherein a server mainboard is disposed in the immersion chamber, and a target processing unit is disposed on the server mainboard; a heat exchange device, the heat exchange device being in contact with the target processing unit, the heat exchange device being used to perform heat exchange with the target processing unit; a first joint, the first joint being used to connect the immersion chamber with a refrigeration system, the refrigeration system being used to provide a first cooling fluid for the immersion chamber; A second joint, wherein the second joint is used to connect the heat exchange device and the refrigeration system, and the refrigeration system is also used to provide a second cooling fluid for the heat exchange device.

2. The immersion server according to claim 1, characterized in that: The refrigeration system includes a first distribution unit and a second distribution unit; the first joint is used to connect the immersion chamber and the first distribution unit; the second joint is used to connect the heat exchange device and the second distribution unit.

3. The immersion server according to claim 2, characterized in that: The first connector comprises: A first fluid supply interface, one end of which is connected to the fluid inlet of the immersion chamber, and the other end of which is connected to the fluid outlet of the first dispensing unit; A first reflux interface, one end of which is connected to the fluid outlet of the immersion chamber, and the other end of which is connected to the fluid inlet of the first distribution unit.

4. The immersion server according to claim 2, characterized in that: The second connector comprises: A second fluid supply interface, one end of which is connected to the fluid inlet of the heat exchange device, and the other end of which is connected to the fluid outlet of the second distribution unit; A second reflux interface, one end of which is connected to the fluid outlet of the heat exchange device, and the other end of which is connected to the fluid inlet of the second distribution unit.

5. The immersion server according to claim 1, characterized in that: The fluid inlet of the heat exchange device is connected to the second joint, and the fluid outlet of the heat exchange device is connected to the immersion chamber.

6. An immersion liquid cooling system, characterized in that: The immersion liquid cooling system comprises: A server rack, wherein the server rack is provided with at least one mounting slot, wherein the mounting slot is used to mount the immersion server according to any one of claims 1 to 5; A refrigeration system is connected to the first joint and the second joint of the immersion server, and the refrigeration system is used to provide a first cooling fluid for the immersion chamber of the immersion server and a second cooling fluid for the heat exchange device of the immersion server.

7. The immersion liquid cooling system according to claim 6, characterized in that: The refrigeration system comprises: a first distribution unit, the first distribution unit being in communication with a first joint of the immersion server, the first distribution unit being used to provide a first cooling fluid for an immersion chamber of the immersion server; A second distribution unit, the second distribution unit is connected to the second joint of the immersion server, and the second distribution unit is used to provide a second cooling fluid for the heat exchange device of the immersion server.

8. The immersion liquid cooling system according to claim 7, characterized in that: The first distribution unit and the second distribution unit have different liquid supply temperatures.

9. The immersion liquid cooling system according to claim 7, characterized in that: The liquid supply temperature of the first distribution unit is higher than the liquid supply temperature of the second distribution unit; the first distribution unit includes a first heat exchange subunit, the second distribution unit includes a second heat exchange subunit, and the fluid outlet of the second heat exchange subunit at the cold end is connected to the fluid inlet of the first heat exchange subunit at the cold end.

10. The immersion liquid cooling system according to claim 7, characterized in that: The first fluid provided by the first dispensing unit and the second fluid provided by the second dispensing unit are of the same fluid type.

11. The immersion liquid cooling system according to claim 7, characterized in that: The first fluid provided by the first dispensing unit and the second fluid provided by the second dispensing unit are of different fluid types.

12. The immersion liquid cooling system according to claim 6, characterized in that: The server rack comprises: a third joint corresponding to the mounting slot, the third joint being adapted to the first joint, and the third joint being used to connect the corresponding first joint of the immersion server with the refrigeration system; A fourth joint corresponding to the mounting slot, the fourth joint being adapted to the second joint, and the fourth joint being used to connect the corresponding second joint of the immersion server with the refrigeration system.

13. The immersion liquid cooling system according to claim 12, characterized in that: The server rack also includes: A main liquid distributor, wherein the fluid inlet of the main liquid distributor is connected to the fluid outlet of the refrigeration system, and the fluid outlet of the main liquid distributor is respectively connected to the fluid supply interface of the third joint and the fluid supply interface of the fourth joint, the fluid supply interface of the third joint is used to provide a first fluid to the first joint, and the fluid supply interface of the fourth joint is used to provide a second fluid to the second joint; A main liquid collector, wherein the fluid inlet of the main liquid collector is respectively connected to the refrigeration system's refrigeration interface, the refrigeration interface of the third joint and the refrigeration interface of the fourth joint, the fluid outlet of the main liquid collector is connected to the fluid inlet of the refrigeration system, the refrigeration interface of the third joint is used to recover the first fluid returned from the first joint, and the refrigeration interface of the fourth joint is used to recover the second fluid returned from the second joint.

14. The immersion liquid cooling system according to claim 13, characterized in that: The refrigeration system comprises a first distribution unit and a second distribution unit, wherein the first distribution unit is connected to a first joint of the immersion server, and the second distribution unit is connected to a second joint of the immersion server; the main liquid distributor comprises: a first liquid distributor, wherein a fluid inlet of the first liquid distributor is connected to a fluid outlet of the first dispensing unit, and a fluid outlet of the first liquid distributor is connected to a fluid supply interface of the third connector; A second liquid distributor, wherein the fluid inlet of the second liquid distributor is connected to the fluid outlet of the second dispensing unit, and the fluid outlet of the second liquid distributor is connected to the fluid supply interface of the fourth connector.

15. The immersion liquid cooling system according to claim 14, characterized in that: The main liquid collector comprises: a first liquid collector, wherein a fluid inlet of the first liquid collector is connected to a reflux interface of the third joint, and a fluid outlet of the first liquid collector is connected to a fluid inlet of the first distribution unit; A second liquid collector, wherein the fluid inlet of the second liquid collector is connected to the return interface of the fourth connector, and the fluid outlet of the second liquid collector is connected to the fluid inlet of the second distribution unit.

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