Flexible separating device for LED pre-cutting substrate

Abstract

The flexible separating device for the LED pre-cut substrate comprises a first air bag and a second air bag which are longitudinally arranged in parallel, and a substrate placing position is reserved between the first air bag and the second air bag. And the first air bag and / or the second air bag are / is inflated and expanded to longitudinally extrude the LED pre-cutting substrate placed in the substrate placing position, so that each chip packaging area in the substrate deforms towards multiple directions, and the pre-cutting lines of the substrate are extruded to be broken, so that the substrate is divided into multiple LED units. When in use, an LED pre-cutting substrate on which a plurality of transversely parallel LED chips are packaged is placed in the substrate placing position; and then the first air bag and the second air bag are inflated and expanded to longitudinally extrude the LED pre-cutting substrate, so that each chip packaging area in the substrate deforms towards multiple directions, the pre-cutting lines of the substrate are forced to be brittle-broken, and the LED pre-cutting substrate is divided into multiple LED units. According to the separating device, the flexible air bag is adopted to carry out flexible separation on the LED pre-cut substrate, and packaging materials on the substrate are not prone to being damaged.

Description

Technical Field

[0001] The invention relates to the technical field of LED pre-cut substrate separation, and in particular to a LED pre-cut substrate flexible separation device. Background Art

[0002] The production process of LED units is as follows: take out a pre-cut substrate with multiple parallel chip packaging areas, place an LED chip on each chip packaging area to form an LED pre-cut substrate; use packaging materials such as glass or plastic for packaging; after packaging, manually break the LED pre-cut substrate into multiple LED units along the pre-cut line between each two adjacent chip packaging areas. In the process of manually breaking the LED pre-cut substrate, if too much force is applied or the force is uneven, it is easy to damage the packaging material on the LED pre-cut substrate, affecting the luminous effect of the LED unit. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide a flexible separation device for LED pre-cut substrates, which is used to separate LED pre-cut substrates without easily damaging the packaging materials on the substrates.

[0004] In order to solve the above technical problems, the LED pre-cut substrate flexible separation device of the present invention includes a first airbag and a second airbag arranged in parallel longitudinally, and a substrate placement position is reserved between the first airbag and the second airbag for placing the LED pre-cut substrate encapsulated with multiple LED chips arranged in parallel laterally. The first airbag and / or the second airbag is inflated to longitudinally squeeze the LED pre-cut substrate placed in the substrate placement position so that each chip packaging area in the substrate is deformed in multiple directions, the pre-cutting line of the substrate is squeezed off, and the substrate is divided into multiple LED units.

[0005] Furthermore, the first airbag and / or the second airbag are inflated to compress the substrate placement position into an arc shape so that each chip packaging area in the substrate is deformed along a tangent line of the substrate placement position.

[0006] Furthermore, the first airbag and / or the second airbag are inflated to compress the substrate into an arc shape bent toward one side.

[0007] Furthermore, the substrate placement position is specifically a substrate placement position for vertically placing an LED pre-cut substrate encapsulating a plurality of LED chips arranged in parallel laterally.

[0008] Furthermore, the first airbag and / or the second airbag are inflated to compress the substrate to a longitudinal width of 1.5 mm to 2.5 mm.

[0009] Furthermore, a collection box with an upward opening is provided below the substrate placement position, and when the first airbag and / or the second airbag is deflated, the LED unit falls into the collection box from the box opening.

[0010] Furthermore, a support plate is provided at the box opening of the collection box to support the substrate placed in the substrate placement position, and the support plate can be removed from the box opening of the collection box.

[0011] Furthermore, it includes a driving mechanism to drive the support plate to move away from the box opening of the supporting box.

[0012] When in use, the LED pre-cut substrate encapsulating multiple LED chips arranged in parallel in a horizontal direction is first placed in the substrate placement position, and then the first airbag and / or the second airbag are inflated to longitudinally squeeze the LED pre-cut substrate so that each chip encapsulation area in the substrate is deformed in multiple directions, forcing the pre-cut line of the substrate to break brittlely, thereby dividing the LED pre-cut substrate into multiple LED units. The separation device uses a soft airbag to flexibly separate the LED pre-cut substrate, and is not easy to damage the encapsulation material on the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 Schematic diagram of a flexible separation device for LED pre-cut substrates, in which the two airbags have not yet been inflated.

[0014] Figure 2 2. It is a schematic diagram of a flexible separation device for LED pre-cut substrates, in which two airbags are inflated to squeeze the LED pre-cut substrates.

[0015] Figure 3 It is a schematic diagram of a flexible separation device for LED pre-cut substrates, in which the rod body of the electric push rod extends forward to connect the support plate.

[0016] Figure 4 2. It is a schematic diagram of a flexible separation device for LED pre-cut substrates. In the figure, the rod body of the electric push rod retracts backwards to drive the support plate to move away from the box opening of the collection box. DETAILED DESCRIPTION

[0017] The present invention is further described in detail below in conjunction with specific implementation methods.

[0018] LED pre-cut substrate flexible separation device Figure 1 , including a mounting frame 9, on which two air bags 1 and 2 are mounted in parallel longitudinally, one behind the other, and a horizontal substrate placement position 3 is left between the front and rear air bags 1 and 2. An air pump 30 is also mounted on the mounting frame 9, which is connected to the front and rear air bags 1 and 2 through an air pipe 31. A collection box 6 is provided below the two air bags 1 and 2, such as Figure 3 The box opening 60 of the collection box 6 is facing upwards and aligned with the substrate placement position 3, and a support plate 7 is provided at the box opening 60; an electric push rod 8 is installed on the mounting frame 9, and its rod body 81 extends forward to connect with the support plate 7. Figure 1 and Figure 3When in use, firstly, the LED pre-cut substrate 4 encapsulating 6 LED chips 40 arranged side by side on the left and right is placed upright in the substrate placement position 3 and supported on the support plate 7, and then the air pump 30 is started to inflate the front and rear air bags 1 and 2 so that the front and rear air bags 1 and 2 are expanded respectively, thereby compressing the substrate placement position 3 into an arc shape that is bent toward the rear side and has a longitudinal width of 1.5mm to 2.5mm (preferably 2mm), such as Figure 2 See Figure 1 , Figure 2 During the expansion process, the front and rear airbags 1 and 2 longitudinally squeeze the LED pre-cut substrate 4 one after the other, so that each chip packaging area 42 in the LED pre-cut substrate 4 is deformed in multiple different directions along the tangent of the substrate placement position 3, so that the pre-cut line 41 of the LED pre-cut substrate 4 is squeezed off, thereby dividing the LED pre-cut substrate 4 into 6 LED units 5; the two inflated airbags 1 and 2 clamp the 6 LED units 5 together. Since the separation device uses soft airbags 1 and 2 to flexibly separate the LED pre-cut substrate 4, it is not easy to damage the packaging material on the substrate 4. After the flexible separation is completed, the 6 LED units 5 are collected: see Figure 4 First, the electric push rod 8 is controlled to retract the rod body 81 backwards, thereby driving the support plate 7 to move backwards and away from the box opening 60 of the collection box 6, and then the air pump 30 is turned off to allow the air bags 1 and 2 to automatically discharge the gas for deflation so that the two air bags 1 and 2 no longer clamp the 6 LED units 5, and the 6 LED units 5 fall into the collection box 6 from the box opening 60 of the collection box 6.

[0019] This embodiment sees Figure 1 , Figure 2 , the air pump 30 inflates the two air bags 1 and 2 through an air tube 31 so that the two air bags 1 and 2 are expanded and squeezed the LED pre-cut substrate 4. In other embodiments, the air pump 30 can be changed to connect the two air bags 1 and 2 through two air tubes respectively. When in use: first, the air pump 30 inflates the rear air bag 2 through the first air tube so that the rear air bag 2 is expanded, and then the connection between the air pump 30 and the first air tube is released and the first air tube is tied with a rope so that the rear air bag 2 is always kept in an expanded state; the LED pre-cut substrate 4 is placed in the substrate placement position 3, and then the air pump 30 inflates the front air bag 1 through the second air tube so that the front air bag 1 is inflated and expanded to squeeze the LED pre-cut substrate 4.

[0020] In order to make each chip packaging area 42 in the LED pre-cut substrate 4 deform in multiple different directions, the present embodiment Figure 2 The two air bags 1 and 2 are inflated to compress the base plate placement position 3 into an arc shape that bends toward the rear side. In other embodiments, the arc shape that bends toward the rear side can be changed to other shapes, such as a wave shape or a sawtooth shape.

[0021] This embodiment sees Figure 4The electric push rod 8 is used as a driving mechanism to drive the support plate 7 to move away from the box opening 60 of the support box 6. Other embodiments can use other driving mechanisms such as cylinders to drive the support plate.

[0022] The above is only an implementation method of the invention, and does not limit the scope of patent protection. Those skilled in the art can make non-substantial changes or substitutions based on the invention, which still fall within the scope of patent protection.

Claims

1. LED pre-cut substrate flexible separation device, characterized by: The method comprises a first airbag and a second airbag arranged in parallel longitudinally, wherein a substrate placement position is reserved between the first airbag and the second airbag for placing a pre-cut LED substrate encapsulating a plurality of LED chips arranged in parallel transversely. The first airbag and / or the second airbag is inflated to longitudinally squeeze the pre-cut LED substrate placed in the substrate placement position, so that each chip encapsulation area in the substrate is deformed in multiple directions, the pre-cutting line of the substrate is squeezed off, and the substrate is divided into a plurality of LED units.

2. The LED pre-cut substrate flexible separation device according to claim 1, characterized in that: The first airbag and / or the second airbag are inflated to compress the substrate placement position into an arc shape so that each chip packaging area in the substrate is deformed along the tangent line of the substrate placement position.

3. The LED pre-cut substrate flexible separation device according to claim 2, characterized in that: The first airbag and / or the second airbag are inflated to compress the substrate into an arc shape bent toward one side.

4. The LED pre-cut substrate flexible separation device according to claim 1, characterized in that: The substrate placement position is specifically a substrate placement position for vertically placing an LED pre-cut substrate encapsulating a plurality of LED chips arranged in parallel laterally.

5. The LED pre-cut substrate flexible separation device according to claim 4, characterized in that: The first airbag and / or the second airbag are inflated to compress the substrate to a longitudinal width of 1.5 mm to 2.5 mm.

6. The LED pre-cut substrate flexible separation device according to claim 1, characterized in that: A collection box with an upward opening is provided below the substrate placement position, and the LED unit falls into the collection box from the box opening when the first airbag and / or the second airbag is deflated.

7. The LED pre-cut substrate flexible separation device according to claim 6, characterized in that: A support plate is provided at the box opening of the collection box to support the substrate placed in the substrate placement position, and the support plate can be removed from the box opening of the collection box.

8. The LED pre-cut substrate flexible separation device according to claim 7, characterized in that: The driving mechanism drives the supporting plate to move away from the box opening of the supporting box.

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