Cable processing device and cable processing method

Abstract

The invention discloses a cable processing device and method. The cable processing device comprises: a fixed seat in which a V-shaped groove is formed; the plurality of first rotating rollers are rotationally mounted in the V-shaped groove of the fixed seat; the movable seat is arranged to be capable of moving relative to the fixed seat; the sliding block is mounted on the moving seat in a sliding manner; and a cutting blade fixed to the slide block. When the semi-conductive layer is processed, the processed end part of the cable is positioned in the V-shaped groove and is clamped between the fixed seat and the movable seat, the blade of the cutting knife is pressed against the semi-conductive layer, and the cable processing device rotates around the cable. According to the invention, the feed amount of the cutting knife can be accurately controlled, so that the inner insulating layer of the cable cannot be scratched. In addition, the cutting knife can quickly remove the semi-conductive layer and realize smooth transition from the semi-conductive layer to the inner insulating layer, so that the processing efficiency and the processing quality of the semi-conductive layer are improved.

Description

Technical Field

[0001] The present invention relates to a cable processing device and a cable processing method, in particular to a cable processing device and a cable processing method for processing a semiconductive layer of a cable. Background Art

[0002] In the prior art, a utility blade or a round file is usually used to process the fracture of the semi-conductive layer of the cable. For the scheme of using a utility blade to process the fracture of the semi-conductive layer of the cable, the operator is required to accurately control the depth of the utility blade entering the semi-conductive layer of the cable. Since the thickness of the semi-conductive layer of the cable is usually only about 1.2 mm, a slight excessive force will cause the utility blade to scratch the inner insulating layer under the semi-conductive layer, and the scratch of the insulating layer needs to be reworked and polished in minor cases, and the cable needs to be sawed off in serious cases. Moreover, even if the utility blade completes the operation, it is still necessary to flatten the steps at the fracture of the semi-conductive layer and polish it with sandpaper to achieve a smooth transition from the semi-conductive layer to the inner insulating layer. For the scheme of using a round file to process the fracture of the semi-conductive layer of the cable, the semi-conductive layer after filing is very rough and needs to be polished with sandpaper to achieve a smooth transition from the semi-conductive layer to the inner insulating layer, so the overall operation time is long. Summary of the invention

[0003] The purpose of the present invention is to solve at least one aspect of the above-mentioned problems and defects in the prior art.

[0004] According to one aspect of the present invention, there is provided a cable processing device for processing a semiconductive layer wrapped on an inner insulating layer of a cable. The cable processing device comprises: a fixed seat formed with a V-shaped groove for positioning the processed end of the cable; a plurality of first rotating rollers rotatably mounted in the V-shaped groove of the fixed seat for rolling contact with the outer peripheral surface of the processed end of the cable; a moving seat configured to be movable relative to the fixed seat in a first direction perpendicular to the central axis of the first rotating roller; a sliding block slidably mounted on the moving seat to be movable relative to the moving seat in the first direction; and a cutting knife fixed to the sliding block to be movable with the sliding block. When processing the semiconductive layer, the processed end of the cable is positioned in the V-shaped groove and clamped between the fixed seat and the moving seat, the blade of the cutting knife is pressed against the semiconductive layer, and the cable processing device rotates around the cable to remove the semiconductive layer by the cutting knife.

[0005] According to an exemplary embodiment of the present invention, the cable processing device also includes: a guide column extending along the first direction and one end of which is fixed to the fixed seat, a guide hole is formed on the movable seat, and the guide column cooperates with the guide column to guide the movable seat to move in the first direction.

[0006] According to another exemplary embodiment of the present invention, the cable processing device also includes: a fixed block, to which the other end of the guide column is fixed; and a first adjustment mechanism, which is installed on the fixed seat and the fixed block, and the first adjustment mechanism is used to adjust the position of the movable seat in the first direction to clamp or release the processed end of the cable.

[0007] According to another exemplary embodiment of the present invention, the first adjustment mechanism includes: a first lead screw, both ends of which are rotatably mounted on the fixed seat and the fixed block, respectively; and a first knob, which is connected to the end of the first lead screw and is adjacent to the fixed block, and a first threaded hole engaged with the first lead screw is formed on the movable seat. When the first lead screw is rotated by the first knob, the first lead screw drives the movable seat to move along the first direction to adjust the position of the movable seat in the first direction.

[0008] According to another exemplary embodiment of the present invention, the cable processing device further comprises: a second adjustment mechanism mounted to the moving seat for adjusting the positions of the sliding block and the cutting knife fixed to the sliding block in the first direction.

[0009] According to another exemplary embodiment of the present invention, the second adjustment mechanism includes: a second lead screw, one end of which is rotatably mounted on the moving seat; and a second knob connected to the one end of the second lead screw, and a second threaded hole engaged with the second lead screw is formed on the sliding block. When the second lead screw is rotated by the second knob, the second lead screw drives the sliding block to move along the first direction to adjust the position of the sliding block and the cutting knife in the first direction.

[0010] According to another exemplary embodiment of the present invention, the cable processing device further comprises: a fixing member threadedly connected to the movable seat, for fixing the sliding block and the cutting knife to a predetermined position.

[0011] According to another exemplary embodiment of the present invention, the fixing member includes: a screw rod threadedly connected to the moving seat; and a knob connected to the end of the screw rod, a relief groove extending along the first direction is formed on the sliding block, a threaded hole is formed on the moving seat, and the screw rod of the fixing member passes through the relief groove on the sliding block and is threadedly connected to the threaded hole on the moving seat. When the screw rod is rotated by the knob, the fixing member can fix or loosen the sliding block.

[0012] According to another exemplary embodiment of the present invention, the cable processing device also includes: a second rotating roller, which is rotatably mounted on the bottom of the movable seat opposite to the fixed seat, and the first rotating roller and the second rotating roller are used for rolling contact with the outer peripheral surface of the processed end of the cable.

[0013] According to another exemplary embodiment of the present invention, the blade of the cutting knife is inclined at a predetermined angle relative to the central axis of the cut semiconductive layer so that the end of the cut semiconductive layer has a smooth transition slope (140a).

[0014] According to another aspect of the present invention, there is provided a cable processing method, comprising the following steps:

[0015] S10: providing the aforementioned cable processing device;

[0016] S20: Positioning the processed end of the cable in the V-shaped groove of the fixing seat;

[0017] S30: moving the cable processing device along the axial direction of the cable to move the cutting knife onto the semiconductive layer of the cable to be processed;

[0018] S40: moving the movable seat to clamp the processed end of the cable between the fixed seat and the movable seat;

[0019] S50: moving the sliding block to press the blade of the cutting knife against the semiconductive layer of the cable;

[0020] S60: rotating the cable processing device around the cable to remove a portion of the semiconductive layer by the blade of the cutting knife; and

[0021] S70: repeating the above steps S50 and S60 until the inner insulation layer of the cable is exposed.

[0022] According to another exemplary embodiment of the present invention, the step S40 includes: moving the movable seat to the clamping position by rotating the first knob of the first adjustment mechanism of the cable processing device, so that the processed end of the cable is clamped between the movable seat and the fixed seat.

[0023] According to another exemplary embodiment of the present invention, the step S50 includes step S51: moving the cutting knife to a predetermined cutting position by rotating the second knob of the second adjustment mechanism of the cable processing device so that the blade of the cutting knife is pressed against the semiconductive layer of the cable.

[0024] According to another exemplary embodiment of the present invention, the step S50 further includes a step S52: fixing the sliding block to the moving seat so that the cutting knife is fixed to a predetermined cutting position.

[0025] According to another exemplary embodiment of the present invention, the step S52 includes: fixing the sliding block to the moving seat by rotating a knob of a fixing member of the cable processing device.

[0026] In the above-mentioned various exemplary embodiments according to the present invention, the cutting knife's feed rate can be precisely controlled so as not to scratch the inner insulating layer of the cable. In addition, in the present invention, by rotating the cutting knife around the cable, the semiconductive layer can be quickly removed, thereby improving the processing efficiency of the semiconductive layer.

[0027] Furthermore, in some of the aforementioned exemplary embodiments according to the present invention, the cutting blade can achieve a smooth transition from the semiconductive layer to the inner insulating layer, and basically no grinding is required, thereby improving the processing quality and efficiency of the semiconductive layer.

[0028] Other objects and advantages of the present invention will become apparent from the following description of the present invention with reference to the accompanying drawings, which will help to provide a comprehensive understanding of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 A perspective schematic diagram showing a cable processing device according to an exemplary embodiment of the present invention;

[0030] Figure 2 A perspective schematic diagram showing a cable processing device according to an exemplary embodiment of the present invention, wherein the cable has been clamped between a movable seat and a fixed seat of the cable processing device;

[0031] Figure 3 A perspective schematic diagram showing a cable processing device according to an exemplary embodiment of the present invention, wherein the blade of the cutting knife has been pressed against the semiconductive layer of the cable;

[0032] Figure 4 A longitudinal cross-sectional view of a cable is shown according to an exemplary embodiment of the present invention, wherein a cutting knife is shown. DETAILED DESCRIPTION

[0033] The technical solution of the present invention is further specifically described below by examples and in conjunction with the accompanying drawings. In the specification, the same or similar reference numerals indicate the same or similar components. The following description of the embodiments of the present invention with reference to the accompanying drawings is intended to explain the overall inventive concept of the present invention and should not be construed as a limitation of the present invention.

[0034] In addition, in the detailed description below, for ease of explanation, many specific details are set forth to provide a comprehensive understanding of the disclosed embodiments. However, it is apparent that one or more embodiments may be implemented without these specific details. In other cases, known structures and devices are embodied in a schematic manner to simplify the accompanying drawings.

[0035] According to an overall technical concept of the present invention, a cable processing device is provided for processing a semiconductive layer wrapped on an inner insulating layer of a cable. The cable processing device comprises: a fixed seat, formed with a V-shaped groove for positioning the processed end of the cable; a plurality of first rotating rollers, rotatably mounted in the V-shaped groove of the fixed seat, for rolling contact with the outer peripheral surface of the processed end of the cable; a moving seat, configured to be movable relative to the fixed seat in a first direction perpendicular to the central axis of the first rotating roller; a sliding block, slidably mounted on the moving seat, so as to be movable relative to the moving seat in the first direction; and a cutting knife, fixed to the sliding block, so as to be movable with the sliding block. When processing the semiconductive layer, the processed end of the cable is positioned in the V-shaped groove and clamped between the fixed seat and the moving seat, the blade of the cutting knife is pressed against the semiconductive layer, and the cable processing device rotates around the cable to remove the semiconductive layer by the cutting knife.

[0036] According to another overall technical concept of the present invention, a cable processing method is provided, comprising: providing the aforementioned cable processing device; positioning the processed end of the cable in the V-shaped groove of the fixed seat; moving the cable processing device along the axial direction of the cable to move the cutting knife to the semi-conductive layer to be processed of the cable; moving the movable seat to clamp the processed end of the cable between the fixed seat and the movable seat; moving the sliding block to press the blade of the cutting knife against the semi-conductive layer of the cable; rotating the cable processing device around the cable to remove a portion of the semi-conductive layer by the blade of the cutting knife; and repeating the previous two steps until the inner insulating layer of the cable is exposed.

[0037] Figure 1 A perspective schematic diagram showing a cable processing device according to an exemplary embodiment of the present invention; Figure 2 A perspective schematic diagram showing a cable processing device according to an exemplary embodiment of the present invention, wherein a cable 100 has been clamped between a movable seat 3 and a fixed seat 1 of the cable processing device; Figure 3 A schematic perspective view showing a cable processing device according to an exemplary embodiment of the present invention, wherein the blade 9a of the cutting knife 9 has been pressed against the semiconductive layer 140 of the cable 100; Figure 4A longitudinal cross-sectional view of a cable 100 according to an exemplary embodiment of the present invention is shown, wherein the cutting knife 9 is shown.

[0038] like Figures 1 to 4 As shown, in an exemplary embodiment of the present invention, a cable processing device is disclosed. The cable processing device is used to process a semiconductive layer 140 wrapped on an inner insulating layer 130 of a cable 100 .

[0039] like Figures 1 to 4 As shown, in the illustrated embodiment, the cable processing device includes: a fixed seat 1, a plurality of first rotating rollers 10, a movable seat 3, a sliding block 6 and a cutting knife 9. The fixed seat 1 is formed with a V-shaped groove 101 for positioning the processed end of the cable 100. The plurality of first rotating rollers 10 are rotatably mounted in the V-shaped groove 101 of the fixed seat 1 for rolling contact with the outer peripheral surface of the processed end of the cable 100. The movable seat 3 is configured to be movable relative to the fixed seat 1 in a first direction perpendicular to the central axis of the first rotating rollers 10. The sliding block 6 is slidably mounted on the movable seat 3 so as to be movable relative to the movable seat 3 in the first direction. The cutting knife 9 is fixed to the sliding block 6 so as to be movable with the sliding block 6.

[0040] like Figures 1 to 4 As shown, in the illustrated embodiment, when processing the semiconductive layer 140, the processed end of the cable 100 is positioned in the V-shaped groove 101 and clamped between the fixed seat 1 and the movable seat 3, the blade 9a of the cutting knife 9 is pressed against the semiconductive layer 140, and the cable processing device rotates around the cable 100 to cut the semiconductive layer 140 by the cutting knife 9. In this way, the semiconductive layer 140 on the cable 100 can be gradually removed until the inner insulating layer 130 is exposed.

[0041] like Figures 1 to 4 As shown, in the illustrated embodiment, the cable processing device further includes a guide post 5, which extends along the first direction and one end of which is fixed to the fixed seat 1. A guide hole is formed on the movable seat 3, and the guide post 5 cooperates with the guide post 5 to guide the movable seat 3 to move in the first direction.

[0042] like Figures 1 to 4 As shown, in the illustrated embodiment, the cable processing device further includes a fixed block 2 and a first adjustment mechanism 4. The other end of the guide column 5 is fixed to the fixed block 2. The first adjustment mechanism 4 is mounted on the fixed seat 1 and the fixed block 2, and the first adjustment mechanism 4 is used to adjust the position of the movable seat 3 in the first direction to clamp or release the processed end of the cable 100.

[0043] like Figures 1 to 4As shown, in the illustrated embodiment, the first adjustment mechanism 4 includes: a first lead screw 41 and a first knob 42. The two ends of the first lead screw 41 are rotatably mounted on the fixed seat 1 and the fixed block 2, respectively. The first knob 42 is connected to the end of the first lead screw 41 and is adjacent to the fixed block 2. A first threaded hole engaged with the first lead screw 41 is formed on the moving seat 3. When the first lead screw 41 is rotated by the first knob 42, the first lead screw 41 drives the moving seat 3 to move in the first direction to adjust the position of the moving seat 3 in the first direction.

[0044] like Figures 1 to 4 As shown, in the illustrated embodiment, the cable processing device further comprises a second adjusting mechanism 7 which is mounted to the moving seat 3 and is used to adjust the positions of the sliding block 6 and the cutting knife 9 fixed to the sliding block 6 in the first direction.

[0045] like Figures 1 to 4 As shown, in the illustrated embodiment, the second adjustment mechanism 7 includes: a second lead screw (not shown) and a second knob 72. One end of the second lead screw is rotatably mounted on the moving seat 3. The second knob 72 is connected to one end of the second lead screw. A second threaded hole engaged with the second lead screw is formed on the sliding block 6. When the second lead screw is rotated by the second knob 72, the second lead screw drives the sliding block 6 to move along the first direction to adjust the position of the sliding block 6 and the cutting knife 9 in the first direction.

[0046] like Figures 1 to 4 As shown, in the illustrated embodiment, the cable processing device further comprises a fixing member 8, which is threadedly connected to the movable seat 3 and is used to fix the sliding block 6 and the cutting knife 9 to a predetermined position.

[0047] like Figures 1 to 4 As shown, in the illustrated embodiment, the fixing member 8 includes: a screw (not shown) and a knob 82. The screw is threadedly connected to the moving seat 3. The knob 82 is connected to the end of the screw. An escape groove 61 extending along a first direction is formed on the sliding block 6, and a threaded hole is formed on the moving seat 3. The screw of the fixing member 8 passes through the escape groove 61 on the sliding block 6 and is threadedly connected to the threaded hole on the moving seat 3. When the screw is turned by the knob 82, the fixing member 8 can fix or loosen the sliding block 6.

[0048] like Figures 1 to 4 As shown, in the illustrated embodiment, the cable processing device further includes a second rotating roller (not shown), which is rotatably mounted on the bottom of the movable seat 3 opposite to the fixed seat 1. The first rotating roller 10 and the second rotating roller are used to roll in contact with the outer circumference of the processed end of the cable 100, which enables the cable processing device to be more easily rotated around the cable 100.

[0049] like Figures 1 to 4As shown, in the illustrated embodiment, the blade 9a of the cutting knife 9 is inclined at a predetermined angle relative to the central axis of the cut semiconductive layer 140, so that the end of the cut semiconductive layer 140 has a smooth transition slope 140a. In this way, a smooth transition from the semiconductive layer 140 to the inner insulating layer 130 can be ensured, and local concentration of the electric field can be effectively avoided.

[0050] like Figures 1 to 4 As shown, in an exemplary embodiment of the present invention, a cable processing method is also disclosed, and the cable processing method includes the following steps:

[0051] S10: providing the aforementioned cable processing device;

[0052] S20: Positioning the processed end of the cable 100 in the V-shaped groove 101 of the fixing seat 1;

[0053] S30: moving the cable processing device along the axial direction of the cable 100 to move the cutting knife 9 onto the semiconductive layer 140 to be processed of the cable 100;

[0054] S40: moving the movable seat 3 to clamp the processed end of the cable 100 between the fixed seat 1 and the movable seat 3;

[0055] S50: moving the sliding block 6 to press the blade 9a of the cutting knife 9 against the semiconductive layer 140 of the cable 100;

[0056] S60: rotating the cable processing device around the cable 100 to remove a portion of the semiconductive layer 140 by the blade 9a of the cutting knife 9; and

[0057] S70: repeating the aforementioned steps S50 and S60 until the inner insulating layer 130 of the cable 100 is exposed.

[0058] like Figures 1 to 4 As shown, in the illustrated embodiment, step S40 includes: moving the movable seat 3 to the clamping position by rotating the first knob 42 of the first adjustment mechanism 4 of the cable processing device, so that the processed end of the cable 100 is clamped between the movable seat 3 and the fixed seat 1.

[0059] like Figures 1 to 4 As shown, in the illustrated embodiment, step S50 includes step S51: moving the cutting knife 9 to a predetermined cutting position by rotating the second knob 72 of the second adjustment mechanism 7 of the cable processing device, so that the blade 9a of the cutting knife 9 is pressed against the semiconductive layer 140 of the cable 100.

[0060] like Figures 1 to 4As shown, in the illustrated embodiment, step S50 further includes step S52: fixing the sliding block 6 to the moving seat 3 so that the cutting knife 9 is fixed to a predetermined cutting position.

[0061] like Figures 1 to 4 As shown, in the illustrated embodiment, step S52 includes: fixing the sliding block 6 to the moving seat 3 by rotating the knob 82 of the fixing member 8 of the cable processing device.

[0062] Those skilled in the art will appreciate that the embodiments described above are exemplary and may be improved upon by those skilled in the art. The structures described in the various embodiments may be freely combined without causing any conflicts in structure or principle, and these changes should fall within the scope of protection of the present invention.

[0063] Although the present invention has been described in conjunction with the accompanying drawings, the embodiments disclosed in the accompanying drawings are intended to exemplify the preferred implementations of the present invention and should not be construed as limiting the present invention.

[0064] Although some embodiments of the general inventive concept have been shown and described, it will be appreciated by those skilled in the art that changes may be made to these embodiments without departing from the principles and spirit of the general inventive concept, the scope of which is defined in the claims and their equivalents.

[0065] It should be noted that the word "comprising" does not exclude other elements or steps, and the word "a" or "an" does not exclude a plurality. In addition, any element reference signs in the claims shall not be construed as limiting the scope of the present invention.

Claims

1. A cable processing device for processing a semiconductive layer (140) of a cable (100) wrapped on an inner insulating layer (130), characterized in that: The cable processing device comprises: A fixing seat (1) formed with a V-shaped groove (101) for positioning the processed end of the cable (100); A plurality of first rotating rollers (10) rotatably mounted in the V-shaped groove (101) of the fixing seat (1) and configured to be in rolling contact with the outer peripheral surface of the processed end portion of the cable (100); A movable seat (3) is arranged to be movable relative to the fixed seat (1) in a first direction perpendicular to the central axis of the first rotating roller (10); a sliding block (6) slidably mounted on the moving seat (3) so as to be movable in the first direction relative to the moving seat (3); and a cutting knife (9) fixed to the sliding block (6) so as to be movable with the sliding block (6), When processing the semiconductive layer (140), the processed end of the cable (100) is positioned in the V-shaped groove (101) and clamped between the fixed seat (1) and the movable seat (3), the blade (9a) of the cutting knife (9) is pressed against the semiconductive layer (140), and the cable processing device rotates around the cable (100) to remove the semiconductive layer (140) by the cutting knife (9).

2. The cable processing device according to claim 1, characterized in that: Also includes: a guide column (5), extending along the first direction and having one end fixed to the fixing seat (1), A guide hole is formed on the movable seat (3), and the guide column (5) cooperates with the guide column (5) to guide the movable seat (3) to move in the first direction.

3. The cable processing device according to claim 2, characterized in that: Also includes: A fixed block (2), the other end of the guide column (5) being fixed to the fixed block (2); and The first adjustment mechanism (4) is mounted on the fixing seat (1) and the fixing block (2). The first adjustment mechanism (4) is used to adjust the position of the movable seat (3) in the first direction to clamp or release the processed end of the cable (100).

4. The cable processing device according to claim 3, characterized in that: The first adjustment mechanism (4) comprises: A first screw (41), both ends of which are rotatably mounted on the fixing seat (1) and the fixing block (2), respectively; and a first knob (42), connected to the end of the first lead screw (41) and adjacent to the fixing block (2), A first threaded hole engaged with the first lead screw (41) is formed on the movable seat (3). When the first screw (41) is rotated by the first knob (42), the first screw (41) drives the moving seat (3) to move along the first direction to adjust the position of the moving seat (3) in the first direction.

5. The cable processing device according to claim 4, characterized in that: Also includes: The second adjustment mechanism (7) is mounted on the movable seat (3) and is used to adjust the position of the sliding block (6) and the cutting knife (9) fixed to the sliding block (6) in the first direction.

6. The cable processing device according to claim 5, characterized in that: The second adjustment mechanism (7) comprises: a second lead screw, one end of which is rotatably mounted on the movable seat (3); and a second knob (72) connected to the one end of the second lead screw, A second threaded hole engaged with the second lead screw is formed on the sliding block (6). When the second lead screw is rotated by the second knob (72), the second lead screw drives the sliding block (6) to move along the first direction to adjust the positions of the sliding block (6) and the cutting knife (9) in the first direction.

7. The cable processing device according to claim 1, characterized in that: Also includes: A fixing member (8) is threadedly connected to the movable seat (3) and is used to fix the sliding block (6) and the cutting knife (9) to a predetermined position.

8. The cable processing device according to claim 7, characterized in that: The fixing member (8) comprises: A screw, threadedly connected to the movable seat (3); and A knob (82) connected to the end of the screw, The sliding block (6) is formed with an avoidance groove (61) extending along the first direction, and the moving seat (3) is formed with a threaded hole. The screw of the fixing member (8) passes through the avoidance groove (61) on the sliding block (6) and is threadedly connected to the threaded hole on the moving seat (3). When the screw rod is rotated by the knob (82), the fixing member (8) can fix or release the sliding block (6).

9. The cable processing device according to claim 1, characterized in that: Also includes: The second rotating roller is rotatably mounted on the bottom of the movable seat (3) opposite to the fixed seat (1), The first rotating roller (10) and the second rotating roller are used to roll in contact with the outer peripheral surface of the processed end portion of the cable (100).

10. The cable processing device according to any one of claims 1 to 9, characterized in that: The blade (9a) of the cutting knife (9) is inclined at a predetermined angle relative to the central axis of the cut semiconductive layer (140), so that the end of the cut semiconductive layer (140) has a smooth transition slope (140a).

11. A cable processing method, characterized in that: The following steps are involved: S10: providing a cable processing device according to any one of claims 1 to 10; S20: positioning the processed end of the cable (100) in the V-shaped groove (101) of the fixing seat (1); S30: moving the cable processing device along the axial direction of the cable (100) to move the cutting knife (9) onto the semiconductive layer (140) of the cable (100) to be processed; S40: moving the movable seat (3) to clamp the processed end of the cable (100) between the fixed seat (1) and the movable seat (3); S50: moving the sliding block (6) to press the blade (9a) of the cutting knife (9) against the semiconductive layer (140) of the cable (100); S60: rotating the cable processing device around the cable (100) to remove a portion of the semiconductive layer (140) by the blade (9a) of the cutting knife (9); and S70: repeating the aforementioned steps S50 and S60 until the inner insulating layer (130) of the cable (100) is exposed.

12. The cable processing method according to claim 11, characterized in that: The step S40 comprises: By rotating the first knob (42) of the first adjustment mechanism (4) of the cable processing device, the movable seat (3) is moved to the clamping position, so that the processed end of the cable (100) is clamped between the movable seat (3) and the fixed seat (1).

13. The cable processing method according to claim 11, characterized in that: The step S50 comprises the steps of: S51: By rotating the second knob (72) of the second adjustment mechanism (7) of the cable processing device, the cutting knife (9) is moved to a predetermined cutting position so that the blade (9a) of the cutting knife (9) is pressed against the semiconductive layer (140) of the cable (100).

14. The cable processing method according to claim 13, characterized in that: The step S50 further comprises the steps of: S52: Fixing the sliding block (6) to the movable seat (3) so that the cutting knife (9) is fixed to a predetermined cutting position.

15. The cable processing method according to claim 14, characterized in that: The step S52 comprises: The sliding block (6) is fixed to the moving seat (3) by rotating the knob (82) of the fixing member (8) of the cable processing device.

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