Automatic packaging equipment for weighing sensor signal unit

Abstract

The present application provides an automatic packaging device for a weighing sensor signal unit, which belongs to the field of sensor processing technology, and comprises a machine tool and a linear driver and a first cylinder arranged therein, wherein an assembly table is arranged at an execution end of the linear driver, a plurality of placement grooves for inserting cushion strips are arranged on the upper surface of the assembly table, and a material turnover arm and a driving motor are arranged at an execution end of the first cylinder; two columns are arranged on the machine tool, and the columns can be inserted into the wafer positioning holes opened on the I-shaped plate, and the diameter of the columns is smaller than the aperture of the wafer positioning holes; a second cylinder is arranged on the material turnover arm, and a first electric suction cup for picking up the I-shaped plate is arranged at the execution end of the second cylinder, a plurality of cone head pins corresponding to the wafer positioning holes are arranged on the material turnover arm, and straightening plates are arranged at both ends of the material turnover arm; the present application can reduce the probability of displacement and misalignment of the cushion strips and the I-shaped plate during packaging.

Description

Technical Field

[0001] The present application relates to the technical field of sensor processing, and in particular to an automatic packaging device for a weighing sensor signal unit. Background Art

[0002] A weighing sensor is actually a device that converts mass signals into measurable electrical signals. When the weighing sensor is working, the elastic body inside it will produce elastic deformation under the action of external force, causing the resistance strain gauge attached to its surface to deform. At this time, the resistance value of the resistance strain gauge will change (increase or decrease), and then the corresponding measurement circuit will convert this resistance change into an electrical signal, thus completing the process of converting external force into an electrical signal.

[0003] When weighing sensors are used in highway overweight detection, some weighing sensors will also be equipped with quartz dynamic signal units. The pressure information detection method that combines quartz dynamic sensors and strain-type static sensors can make the detection results more accurate.

[0004] Reference Figure 8 and Fig. 9 In the assembly process of the signal unit 9, the gasket strip 91 is used as a bearing base, and then two groups of gaskets 92, an I-shaped plate 93, a group of chips 94, a conductive sheet 95, two insulating sheets 96 and a sealing sheet 97 are packaged on the gasket strip 91 in the order shown in the figure, wherein the gasket 92, the I-shaped plate 93 and the chip 94 are packaged by vertical pressing, and the conductive sheet 95, the insulating sheet 96 and the sealing sheet 97 are packaged by horizontal insertion. Finally, the signal unit 9 is inserted into the corresponding fitting groove on the weighing sensor 8 to complete the assembly of the signal unit 9.

[0005] Regarding the above technical solution, in order to save space, the I-shaped plates are usually placed in a stacked manner. At the same time, due to the shape of the I-shaped plates, the chip positioning holes opened on the I-shaped plates are generally used as limit holes, and then the I-shaped plates are positioned by two columns that can pass through the chip positioning holes. Under this condition, if the diameter of the column is equal to the aperture of the chip positioning hole, during the picking process of the I-shaped plate, the chip positioning hole may have excessive friction with the column, resulting in a change in the aperture, which in turn affects the subsequent packaging of the chip; on the contrary, when the diameter of the column is smaller than the aperture of the chip positioning hole, the I-shaped plates at different heights will inevitably be offset and misaligned during the stacking process, which may affect the alignment accuracy of the pad and the I-shaped plate. Summary of the invention

[0006] In view of this, the present application provides an automatic packaging device for a weighing sensor signal unit, which is mainly used to solve the problem that the pad strips and I-shaped plates are easily offset and misaligned during the packaging process.

[0007] In order to solve the above technical problems, the present application provides an automatic packaging device for a weighing sensor signal unit, including a machine tool and a linear driver and a first cylinder arranged inside the machine tool, wherein an assembly table is arranged at the execution end of the linear driver, a plurality of placement grooves for inserting pads are arranged on the upper surface of the assembly table, and a material turnover arm and a driving motor capable of driving the material turnover arm to swing left and right in the horizontal direction are arranged at the execution end of the first cylinder; two columns are arranged on the machine tool, the columns can be inserted into the chip positioning holes opened on the I-shaped plate, and the diameter of the columns is smaller than the aperture of the chip positioning holes; a second cylinder is arranged on the material turnover arm, and a first electric suction cup for picking up the I-shaped plate is arranged at the execution end of the second cylinder, a plurality of cone head pins corresponding to the chip positioning holes are arranged on the material turnover arm, and straightening plates are arranged at both ends of the material turnover arm, and the bottom edges of the relative inner sides of the two straightening plates are inclined outward from top to bottom.

[0008] By adopting the above technical solution, the cone head pin and the straightening plate cooperate to respectively correct the positions of the I-shaped plate and the cushion strip, so that the cushion strip and the I-shaped plate can be accurately aligned during the packaging process.

[0009] Optionally, the column is composed of a supporting column, a lifting column and a spring. The supporting column is arranged on the machine tool, the lifting column is sleeved on the outside of the supporting column, and the spring is fixedly connected between the supporting column and the lifting column.

[0010] By adopting the above technical solution, the columns can shrink and avoid being compressed, and continue to provide support and limit for other stacked I-beams without interfering with the picking up of the I-beams.

[0011] Optionally, a second electric suction cup is provided at the bottom end of each of the cone head pins, and the second suction cup is used to pick up a gasket or a wafer.

[0012] Optionally, the machine tool is provided with a gasket reserve bin, a chip reserve bin, a conductive sheet reserve bin, a sealing sheet reserve bin and two insulating sheet reserve bins, and the gasket reserve bin, the chip reserve bin, the conductive sheet reserve bin, the sealing sheet reserve bin, the two insulating sheet reserve bins and the bottom of the two columns are all provided with ejecting push rods.

[0013] By adopting the above technical solution, when the gasket, chip, conductive sheet, sealing sheet, insulating sheet or I-shaped plate in the topmost waiting-to-pick-up station in the storage state is picked up, the subsequent materials can be automatically lifted to the topmost waiting-to-pick-up station through the cooperation of the lifting push rod.

[0014] Optionally, a circumferential array of air gaps are provided on the gasket channel cavity wall of the gasket reserve bin and on the wafer channel cavity wall of the wafer reserve bin.

[0015] By adopting the above technical solution, the air gap can prevent negative pressure from being generated inside the gasket storage bin or the chip storage bin to a certain extent, so as to prevent the picking work of the second electric suction cup from being interfered by negative pressure resistance.

[0016] Optionally, the conductive sheet storage bin, the sealing sheet storage bin and the two insulating sheet storage bins are each provided with a feeding cylinder on the top, and the execution ends of the plurality of feeding cylinders are each provided with a third suction cup, and the heights of the plurality of third suction cups increase successively from left to right.

[0017] By adopting the above technical solution, multiple feeding cylinders cooperate with the third suction cup to insert the conductive sheet, two insulating sheets and one sealing sheet into the I-shaped plate in sequence in a longitudinal insertion manner.

[0018] Optionally, the feeding cylinder actuator ends at the tops of the sealing sheet storage bin and the two insulating sheet storage bins are provided with pressure wheels, each of the pressure wheels is located in front of the third suction cup, and the heights of the multiple pressure wheels increase successively from left to right.

[0019] By adopting the above technical solution, the pressure wheel can limit the lower layer of material placed inside the I-shaped plate by rolling, so as to prevent the lower layer of material inside the I-shaped plate from being longitudinally offset due to the influence of friction.

[0020] Optionally, both left and right inner walls of the placement groove are provided with limiting rubber strips capable of abutting against the I-shaped plate.

[0021] By adopting the above technical solution, the limiting rubber strip can increase the friction between the I-shaped plate and the placement groove, and reduce the probability of longitudinal deviation between the pad strip and the I-shaped plate.

[0022] In summary, compared with the prior art, the present application includes at least one of the following beneficial technical effects:

[0023] 1. Using a column with a diameter smaller than the hole diameter of the wafer positioning hole to position the I-shaped plate can reduce the probability of excessive friction of the wafer positioning hole. At the same time, the position of the I-shaped plate and the pad can be corrected during the picking and packaging process of the I-shaped plate, reducing the possibility of displacement and misalignment of the pad and the I-shaped plate.

[0024] 2. The column adopts a telescopic design, which can provide support and limit for the I-beam while having a certain avoidance function to prevent the column from interfering with the correction work during the picking process of the I-beam.

[0025] 3. In the process of longitudinally inserting the insulating sheet and the sealing sheet into the I-shaped plate, the lower layer material placed inside the I-shaped plate is limited by rolling, which can reduce the probability of longitudinal deviation of the lower layer material due to the influence of friction. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1This is a structural schematic diagram of an automatic packaging device for a weighing sensor signal unit of the present application;

[0027] Figure 2 This is a schematic diagram of the structure of the machine tool for this application;

[0028] Figure 3 This is a schematic diagram of the structure of the linear actuator and the first cylinder of the present application;

[0029] Figure 4 For this application Figure 3 A partial enlarged view of the middle area A;

[0030] Figure 5 This is a schematic diagram of the structure of the column for this application;

[0031] Figure 6 This is a schematic diagram of the structure of the ejector push rod and the feeding cylinder of this application;

[0032] Figure 7 For this application Figure 3 A partial enlarged view of the middle area B;

[0033] Figure 8 This is a schematic diagram of the structure of the weighing sensor and signal unit of this application;

[0034] Fig. 9 This is an exploded view of the signal unit of this application.

[0035] Explanation of reference numerals: 1. machine tool; 11. gasket storage bin; 12. wafer storage bin; 13. conductive sheet storage bin; 14. sealing sheet storage bin; 15. insulating sheet storage bin; 2. linear drive; 21. assembly table; 22. placement slot; 221. limiting rubber strip; 3. first cylinder; 31. material turnover arm; 311. second cylinder; 312. first electric suction cup; 313. cone head pin; 314. straightening plate; 315. second Electric suction cup; 32. Driving motor; 4. Column; 41. Support column; 42. Lifting column; 43. Spring; 5. Ejecting push rod; 6. Air gap; 7. Feeding cylinder; 71. Third suction cup; 72. Pressure wheel; 8. Weighing sensor; 9. Signal unit; 91. Pad strip; 92. Gasket; 93. I-shaped plate; 94. Wafer; 95. Conductive sheet; 96. Insulating sheet; 97. Sealing sheet; 98. Gasket positioning hole; 99. Wafer positioning hole. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the following will be combined with the embodiments of the present application. Figure 1-Figure 9, the technical scheme of the embodiment of the present application is clearly and completely described. Obviously, the described embodiment is a part of the embodiment of the present application, not all of the embodiments. Based on the described embodiment of the present application, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of this application.

[0037] Reference Figure 1 and Figure 2 The present embodiment provides an automatic packaging device for a weighing sensor signal unit, including a machine tool 1 and a linear drive 2 arranged inside the machine tool, two columns 4, a turnover component, a correction component, a gasket storage bin 11, a wafer storage bin 12, a conductive sheet storage bin 13, a sealing sheet storage bin 14 and two insulating sheet storage bins 15.

[0038] Among them, refer to Figure 2 , Figure 3 , Figure 8 and Fig. 9 The linear drive 2 is arranged inside the machine tool 1, and an assembly table 21 is arranged at the execution end of the linear drive 2. A plurality of placement grooves 22 are opened on the upper surface of the assembly table 21. The placement grooves 22 are used to place the pads 91. When the personnel place the pads 91 into the placement grooves 22, the operation of the linear drive 2 can drive the assembly table 21 and the pads 91 to move to the packaging station; two columns 4 are arranged on the machine tool 1 and can be inserted into the chip positioning holes 99, and the diameter of the columns 4 is smaller than the aperture of the chip positioning holes 99; the gasket storage bin 11 and the chip storage bin 12 are arranged on the left side inside the machine tool 1, and the conductive sheet storage bin 13, the two insulating sheet storage bins 15, and the sealing sheet storage bin 14 are arranged on the right side inside the machine tool 1 from left to right.

[0039] Among them, refer to Figure 3 , Figure 4 and Fig. 9 The turnover assembly includes a first cylinder 3, a material turnover arm 31, a drive motor 32, a second cylinder 311, a first electric suction cup 312, and a second electric suction cup 315. The first cylinder 3 is vertically arranged inside the machine tool 1, the material turnover arm 31 is hinged at the top of the execution end of the first cylinder 3, and the material turnover arm 31 can be raised and lowered when the first cylinder 3 is running. The drive motor 32 is arranged at the top of the execution end of the first cylinder 3, and the drive motor 32 can drive the material turnover arm 31 to swing left and right in the horizontal direction when it is running; the second cylinder 311 is arranged on the material turnover arm 31, the first electric suction cup 312 is arranged at the execution end of the second cylinder 311 and is used to pick up the I-shaped plate 93, and the second electric suction cup 315 is arranged on the material turnover arm 31 and is used to pick up the gasket 92 or the wafer 94.

[0040] When the assembly table 21 and the pad strip 91 are moved to the packaging station, the first layer of gaskets 92 are transferred from the inside of the gasket storage bin 11 to the gasket positioning holes 98 on the pad strip 91 under the cooperation of the drive motor 32, the first cylinder 3 and the second electric suction cup 315. Then the drive motor 32 is operated to transfer the material turnover arm 31 to the top of the two columns 4, the first cylinder 3 is operated to lower the material turnover arm 31, and the second cylinder 311 is operated to further lower the first electric suction cup 312 to complete the picking of the I-shaped plate 93, and then the I-shaped plate 93 is transferred to the top of the pad strip 91 through the cooperation of the first cylinder 3, the drive motor 32 and the second cylinder 311 and the packaging action is performed.

[0041] Among them, refer to Figure 3 , Figure 4 and Fig. 9 The correction assembly includes a plurality of cone head pins 313 and two straightening plates 314. The cone head pins 313 are arranged in an array on the material turnover arm 31 and correspond to the wafer positioning holes 99 one by one. The two straightening plates 314 are respectively arranged at both ends of the bottom surface of the material turnover arm 31, and the bottom edges of the opposite inner sides of the two straightening plates 314 are inclined outward from top to bottom.

[0042] During the picking process of the I-plate 93, when the first cylinder 3 operates to drive the material turnover arm 31 to descend, the cone head pin 313 will gradually insert into the chip positioning hole 99 from top to bottom until the cone head pin 313 abuts against the edge of the chip positioning hole 99. At this time, the I-plate 93 in an offset and misaligned state will gradually return to the correct position with the cooperation of multiple cone head pins 313, and then the second cylinder 311 will cooperate with the first electric suction cup 312 to complete the picking of the I-plate 93, which can reduce the probability of misalignment between the pad strip 91 and the I-plate 93. In addition, when the I-plate 93 is transferred to the top of the pad 91 for packaging, the first cylinder 3 drives the material turnover arm 31 to descend, which will cause the straightening plate 314 to move downward. If the pad 91 is not fully loaded (that is, the pad 91 is not completely placed in the placement groove 22), the inclined edge of the straightening plate 314 will abut against the end of the pad 91. As the straightening plate 314 moves downward, the pad 91 that is not fully loaded will be pushed into the placement groove 22 by the straightening plate 314, further reducing the possibility of misalignment between the pad 91 and the I-plate 93.

[0043] In addition, refer to Figure 3 , Figure 5 and Fig. 9 The column 4 is composed of a support column 41, a lifting column 42 and a spring 43. The support column 41 is arranged on the machine tool 1, the lifting column 42 is sleeved outside the support column 41, and the spring 43 is fixedly connected between the support column 41 and the lifting column 42.

[0044] When the cone head pin 313 is inserted into the chip positioning hole 99 from top to bottom, the cone head pin 313 will first abut against the lifting column 42 and press the lifting column 42 down along the support column 41 to prevent the cone head pin 313 from being interfered with and unable to enter the chip positioning hole 99 normally. When the top I-shaped plate 93 and the cone head pin 313 are moved away together, the lifting column 42 will automatically reset under the action of the spring 43 so as to continue to provide support and limit for other stacked I-shaped plates 93.

[0045] Reference Figure 2 , Figure 6 and Fig. 9 The gasket storage bin 11, the wafer storage bin 12, the conductive sheet storage bin 13, the sealing sheet storage bin 14, the two insulating sheet storage bins 15 and the bottom of the two columns 4 are all provided with a material ejecting rod 5.

[0046] When the gasket 92, chip 94, conductive sheet 95, sealing sheet 97, insulating sheet 96 or I-shaped plate 93 in the uppermost waiting-to-be-picked station in the reserve state is picked up, the subsequent materials can be automatically lifted to the uppermost waiting-to-be-picked station through the cooperation of the material pushing rod 5.

[0047] Reference Figure 2 and Fig. 9 A circumferential array of air gaps 6 are provided at the gasket channel cavity wall of the gasket storage bin 11 and the wafer channel cavity wall of the wafer storage bin 12.

[0048] When the second electric suction cup 315 picks up the gasket 92 or the chip 94, the existence of the air gap 6 can prevent negative pressure from being generated inside the gasket storage bin 11 or the chip storage bin 12 to a certain extent, so as to prevent the picking work of the second electric suction cup 315 from being interfered by negative pressure resistance.

[0049] Reference Figure 2 and Figure 6 The tops of the conductive sheet storage bin 13, the sealing sheet storage bin 14 and the two insulating sheet storage bins 15 are all provided with a feeding assembly, which includes a feeding cylinder 7 and a third suction cup 71. The feeding cylinder 7 is longitudinally arranged on the tops of the conductive sheet storage bin 13, the sealing sheet storage bin 14 and the two insulating sheet storage bins 15, and the third suction cup 71 is arranged at the execution end of the feeding cylinder 7, and the heights of the plurality of third suction cups 71 are increased from left to right.

[0050] When the gasket strip 91, the first layer of gasket 92, the I-plate 93 and the chip 94 are packaged on the assembly table 21, the linear drive 2 can drive the assembly table 21 to move to the right. When the assembly table 21 reaches the packaging station in front of the conductive sheet storage bin 13, the two insulating sheet storage bins 15 and the sealing sheet storage bin 14 in sequence, the feeding cylinder 7 and the third suction cup 71 can cooperate to insert the conductive sheet 95, the two insulating sheets 96 and the sealing sheet 97 into the I-plate 93 in sequence in a longitudinal insertion manner.

[0051] Among them, refer to Figure 6 The execution ends of the feeding cylinders 7 at the tops of the sealing sheet storage bin 14 and the two insulating sheet storage bins 15 are provided with pressure wheels 72, which are located in front of the third suction cup 71, and the heights of the multiple pressure wheels 72 increase from left to right.

[0052] During the process of inserting the two insulating sheets 96 and one sealing sheet 97 into the I-shaped plate 93 , the pressing wheel 72 can roll the lower layer of material that has been placed inside the I-shaped plate 93 to prevent the lower layer of material from being longitudinally offset due to the influence of friction.

[0053] Reference Figure 3 and Figure 7 The left and right inner walls of the placement groove 22 are both provided with limiting rubber strips 221 that can abut against the I-shaped plate 93.

[0054] When the pad 91 is packaged together with the I-shaped plate 93, the limiting rubber strip 221 can increase the friction between the I-shaped plate 93 and the placement groove 22, thereby improving the placement stability of the pad 91 inside the placement groove 22, so as to prevent the pad 91 from being longitudinally offset when the conductive sheet 95, two insulating sheets 96 and one sealing sheet 97 are inserted into the I-shaped plate 93.

[0055] The implementation principle of the automatic packaging device for the signal unit of a weighing sensor in the embodiment of the present application is as follows:

[0056] First, the gasket strip 91 is placed in the placement groove 22 on the assembly table 21, and then the assembly table 21 and the gasket strip 91 are moved to the packaging station. With the cooperation of the drive motor 32, the first cylinder 3 and the second electric suction cup 315, the first layer of gasket 92 is transferred from the gasket storage bin 11 to the gasket positioning hole 98 on the gasket strip 91.

[0057] Then the drive motor 32 operates to transfer the material turnover arm 31 to the top of the two columns 4, the first cylinder 3 operates to lower the material turnover arm 31, and the second cylinder 311 operates to further lower the first electric suction cup 312 to complete the picking up of the I-shaped plate 93, and then the I-shaped plate 93 is transferred to the top of the pad 91 and the packaging action is performed through the cooperation of the first cylinder 3, the drive motor 32 and the second cylinder 311. Then the drive motor 32, the first cylinder 3 and the second electric suction cup 315 cooperate again to transfer the wafer 94 from the inside of the wafer storage bin 12 to the wafer positioning hole 99 on the I-shaped plate 93.

[0058] When the gasket strip 91, the first layer of gasket 92, the I-plate 93 and the chip 94 are packaged on the assembly table 21, the linear drive 2 can drive the assembly table 21 to move to the right. When the assembly table 21 reaches the packaging station in front of the conductive sheet storage bin 13, the two insulating sheet storage bins 15 and the sealing sheet storage bin 14 in sequence, the feeding cylinder 7 and the third suction cup 71 can cooperate to insert the conductive sheet 95, the two insulating sheets 96 and the sealing sheet 97 into the I-plate 93 in sequence in a longitudinal insertion manner.

[0059] Finally, the linear drive 2 drives the assembly table 21 to move to the left again, and the driving motor 32, the first cylinder 3 and the second electric suction cup 315 transfer the second layer of gasket 92 from the gasket storage bin 11 to the gasket positioning hole 98 on the sealing sheet 97 to complete the automatic packaging of the signal unit 9.

[0060] In addition, it should be noted that in the description of this application, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For those skilled in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0061] The above is a preferred embodiment of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles described in the present application. These improvements and modifications should also be regarded as the scope of protection of the present application.

Claims

1. An automatic packaging device for a weighing sensor signal unit, comprising a machine tool (1) and a linear drive (2) and a first cylinder (3) arranged therein, wherein: The linear drive (2) is provided with an assembly table (21) at the execution end, and a plurality of placement grooves (22) for inserting cushion strips (91) are provided on the upper surface of the assembly table (21). The first cylinder (3) is provided with a material turnover arm (31) and a driving motor (32) capable of driving the material turnover arm (31) to swing left and right in the horizontal direction. The linear drive (2) is characterized in that: The machine tool (1) is provided with two columns (4), the columns (4) being capable of being inserted into a wafer positioning hole (99) provided on the I-shaped plate (93), and the diameter of the columns (4) being smaller than the aperture of the wafer positioning hole (99); The material turnover arm (31) is provided with a second cylinder (311), and the execution end of the second cylinder (311) is provided with a first electric suction cup (312) for picking up the I-shaped plate (93). The material turnover arm (31) is provided with a plurality of cone head pins (313) corresponding to the wafer positioning holes (99) one by one. Both ends of the material turnover arm (31) are provided with straightening plates (314), and the bottom edges of the opposite inner side surfaces of the two straightening plates (314) are arranged to be inclined outward from top to bottom. The upright column (4) is composed of a support column (41), a lifting column (42) and a spring (43); the support column (41) is arranged on the machine tool (1); the lifting column (42) is sleeved outside the support column (41); and the spring (43) is fixedly connected between the support column (41) and the lifting column (42).

2. The automatic packaging equipment for weighing sensor signal unit according to claim 1, characterized in that: A second electric suction cup (315) is provided at the bottom end of each cone head pin (313), and the second suction cup is used to pick up a gasket (92) or a wafer (94).

3. The automatic packaging equipment for weighing sensor signal unit according to claim 1, characterized in that: The machine tool (1) is provided with a gasket storage bin (11), a wafer storage bin (12), a conductive sheet storage bin (13), a sealing sheet storage bin (14) and two insulating sheet storage bins (15), and a material ejection push rod (5) is provided at the bottom of the gasket storage bin (11), the wafer storage bin (12), the conductive sheet storage bin (13), the sealing sheet storage bin (14), the two insulating sheet storage bins (15) and the two columns (4).

4. The automatic packaging equipment for weighing sensor signal unit according to claim 3 is characterized in that: A circumferential array of air slits (6) are provided on the gasket channel cavity wall of the gasket storage bin (11) and on the wafer channel cavity wall of the wafer storage bin (12).

5. The automatic packaging equipment for weighing sensor signal unit according to claim 3, characterized in that: The conductive sheet storage bin (13), the sealing sheet storage bin (14) and the two insulating sheet storage bins (15) are all provided with feeding cylinders (7) at the top, and the execution ends of the plurality of feeding cylinders (7) are all provided with third suction cups (71), and the heights of the plurality of third suction cups (71) increase in sequence from left to right.

6. The automatic packaging equipment for weighing sensor signal unit according to claim 4, characterized in that: The feed cylinders (7) at the top of the sealing sheet storage bin (14) and the two insulating sheet storage bins (15) are each provided with a pressing wheel (72), each pressing wheel (72) is located in front of the third suction cup (71), and the heights of the plurality of pressing wheels (72) increase in sequence from left to right.

7. The automatic packaging equipment for weighing sensor signal unit according to claim 1, characterized in that: The left and right inner walls of the placement groove (22) are both provided with limiting rubber strips (221) capable of abutting against the I-shaped plate (93).

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