Display panel, preparation method thereof and display device
By forming uneven side walls and setting smooth side walls on the support part of the OLED display panel, the problem of insufficient packaging strength is solved, and higher packaging stability and display performance are achieved.
Patent Information
- Application Number
- CN202411266867.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-10
- Publication Date
- 2024-12-17
AI Technical Summary
The packaging strength of the existing OLED display panels is insufficient, causing substances such as water vapor, oxygen and medicinal liquid to enter the pixel packaging area, affecting the display performance.
By forming a concave and uneven first side wall in the support portion, close contact between the support portion and the first packaging layer is achieved, packaging strength is increased, and a second side wall and a third side wall are provided in the isolation structure to enhance packaging stability sex.
It improves the overall reliability and process performance of the display panel, prevents harmful substances from entering the pixel packaging area, and improves packaging stability and display effect.
Smart Images

Figure CN119156089A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of display technology, and in particular to a display panel and a method for preparing the same, and a display device. Background Art
[0002] Organic Light Emitting Diode (OLED) and flat panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages such as high image quality, power saving, thin body and wide application range, becoming the mainstream in display devices.
[0003] However, the process performance of current OLED display products needs to be improved. Summary of the invention
[0004] In view of this, the purpose of the present application is to provide a display panel and a preparation method thereof, as well as a display device that are helpful in increasing packaging strength and improving process performance.
[0005] Based on the above purpose, the present application provides a display panel, which includes:
[0006] substrate;
[0007] An isolation structure, the isolation structure is arranged on one side of the substrate, the isolation structure encloses an isolation opening, and the isolation opening is used to accommodate the light-emitting unit; the isolation structure includes a support portion and a crown portion, the crown portion is located on the side of the support portion away from the substrate, and the orthographic projection of one end of the support portion close to the crown portion on the substrate is located within the orthographic projection of the crown portion on the substrate;
[0008] A first encapsulation layer, the first encapsulation layer at least covers the light-emitting unit;
[0009] The supporting portion includes a first side wall, a concave-convex structure is arranged on the first side wall, and the first side wall is in contact with the first packaging layer.
[0010] In one embodiment, the isolation structure further includes a second sidewall, the second sidewall being located between the first sidewall and the substrate;
[0011] The light-emitting unit includes a first electrode, a light-emitting functional layer, and a second electrode which are stacked on the substrate and sequentially away from the substrate, and the light-emitting functional layer and the second electrode are located in the isolation opening;
[0012] Wherein, the second electrode overlaps the second side wall;
[0013] Preferably, the first electrode is an anode and the second electrode is a cathode;
[0014] Preferably, the second side wall comprises a flat surface.
[0015] In one embodiment, the second side wall is located on the supporting portion.
[0016] In one embodiment, the isolation structure further includes a connecting portion, the connecting portion is located between the substrate and the supporting portion, and the second side wall is located in the connecting portion.
[0017] In one embodiment, the roughness of the first sidewall gradually decreases along a direction approaching the substrate.
[0018] In one embodiment, the support portion includes a third side wall, and the third side wall is located between the second side wall and the first side wall.
[0019] In one embodiment, the third side wall includes a smooth surface, and the second electrode is further overlapped with the third side wall.
[0020] In one embodiment, the third side wall includes a second concave-convex structure;
[0021] Preferably, the roughness of the third side wall is smaller than the roughness of the first side wall.
[0022] In one embodiment, the thickness of the isolation structure is 0.4-1 μm.
[0023] In one embodiment, the thickness of the first sidewall is 0.2-0.5 μm.
[0024] In one embodiment, the orthographic projection of the first side wall on the substrate is located within the orthographic projection of the second side wall on the substrate.
[0025] In one embodiment, an orthographic projection of an end of the second side wall close to the first side wall on the substrate is located within an orthographic projection of an end of the second side wall close to the substrate on the substrate.
[0026] In one embodiment, the display panel also includes a pixel defining layer, which is located between the isolation structure and the substrate, and the pixel defining layer defines a plurality of pixel openings corresponding to the isolation openings respectively, the pixel openings are connected to the corresponding isolation openings, and the pixel defining layer covers the gaps between adjacent first electrodes and the edges of the first electrodes so that the pixel openings expose at least a portion of the first electrode.
[0027] In one embodiment, the isolation openings include a first type of isolation openings and a second type of isolation openings, the light-emitting units include a first light-emitting unit located in the first type of isolation openings and a second light-emitting unit located in the second type of isolation openings, and the colors of the light emitted by the first light-emitting unit and the second light-emitting unit are different;
[0028] Wherein, in a direction perpendicular to the substrate, the thickness of the first sidewall corresponding to the first type of isolation opening is different from the thickness of the first sidewall corresponding to the second type of isolation opening.
[0029] In one embodiment, the isolation opening further includes a third type of isolation opening, and the light-emitting unit further includes a third light-emitting unit located in the third type of isolation opening, and the colors of the light emitted by the third light-emitting unit are different from those of the first light-emitting unit and the second light-emitting unit;
[0030] In the direction perpendicular to the substrate, the thicknesses of the first side walls corresponding to the first type of isolation openings, the second type of isolation openings and the third type of isolation openings are all different.
[0031] Based on the same inventive concept, the present application also provides a method for preparing a display panel, comprising:
[0032] An isolation structure and a light-emitting unit are formed on one side of the substrate; wherein the isolation structure encloses an isolation opening, and the isolation opening is used to accommodate the light-emitting unit; the isolation structure includes a support portion and a crown portion, wherein the crown portion is located on a side of the support portion away from the substrate, and an orthographic projection of one end of the support portion close to the crown portion on the substrate is located within an orthographic projection of the crown portion on the substrate, wherein the support portion includes a first side wall, and a first concave-convex structure is provided on the first side wall;
[0033] A first encapsulation layer is formed on a side of the light emitting unit away from the substrate, so that the first encapsulation layer is in contact with the first side wall.
[0034] In one embodiment, an isolation structure and a light-emitting unit are formed on one side of a substrate, including:
[0035] forming a first electrode and an isolation structure on a substrate;
[0036] Coating a protective adhesive layer on a side of the first electrode away from the substrate, the protective adhesive layer covering the first electrode located in the isolation opening and the second side wall of the support portion;
[0037] Etching the side wall of the support portion to remove the protective glue layer to form a first side wall; wherein the first side wall is located on a side of the second side wall away from the substrate;
[0038] A light-emitting functional layer and a second electrode are sequentially stacked on the first electrode to form a light-emitting unit; wherein the second electrode overlaps the second side wall.
[0039] In one embodiment, the isolation structure further includes a connecting portion, the connecting portion is located between the substrate and the supporting portion, and the second side wall is at least located at the connecting portion. In one embodiment, the preparation method further includes:
[0040] A first encapsulation layer is formed on a side of the light emitting unit away from the substrate, and then,
[0041] Light-emitting units of different colors and corresponding first packaging layers are repeatedly formed; wherein, in a direction perpendicular to the substrate, the thickness of the first sidewall corresponding to the isolation opening where the light-emitting units of different colors are located is different.
[0042] Based on the same inventive concept, the present application also provides a display device, which includes the above-mentioned display panel.
[0043] Compared with the prior art, the display panel provided in the present application forms an uneven first side wall on the support portion to achieve close contact between the support portion and the first packaging layer, thereby increasing the packaging strength and ensuring the stability of the packaging, thereby preventing water vapor, oxygen, and chemical liquid from entering the pixel packaging area, thereby improving the reliability of the overall display panel device and thus improving the process performance. BRIEF DESCRIPTION OF THE DRAWINGS
[0044] In order to more clearly illustrate the technical solutions in the present application or related technologies, the drawings required for use in the embodiments or related technical descriptions are briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0045] Figure 1 is a schematic diagram of a hierarchical structure of a related display panel;
[0046] Figure 2 A schematic diagram of a hierarchical structure of a display panel provided in an embodiment of the present application;
[0047] Figure 3 A schematic diagram of a hierarchical structure of a display panel provided in another embodiment of the present application;
[0048] Figure 4 A schematic diagram of a hierarchical structure of a display panel provided in another embodiment of the present application;
[0049] Figure 5 A schematic diagram of a hierarchical structure of a display panel provided in another embodiment of the present application;
[0050] Figure 6 A schematic diagram of a hierarchical structure of a display panel provided in another embodiment of the present application;
[0051] Figure 7 A schematic diagram of a hierarchical structure of a display panel provided in another embodiment of the present application;
[0052] Figure 8 A flow chart of a method for preparing a display panel provided in another embodiment of the present application;
[0053] Fig. 9A flow chart of a method for preparing a display panel provided in another embodiment of the present application;
[0054] Fig.10 A schematic diagram of a hierarchical structure in a display panel manufacturing process provided by another embodiment of the present application;
[0055] Fig.11 A schematic diagram of a hierarchical structure in a display panel manufacturing process provided by another embodiment of the present application;
[0056] Fig.12 A schematic diagram of a hierarchical structure in a display panel manufacturing process provided by another embodiment of the present application;
[0057] Fig.13 A schematic diagram of a hierarchical structure in a display panel manufacturing process provided by another embodiment of the present application;
[0058] Fig.14 A schematic diagram of a hierarchical structure in a display panel manufacturing process provided by another embodiment of the present application;
[0059] Fig.15 A schematic diagram of the hierarchical structure in the display panel preparation process provided by another embodiment of the present application.
[0060] Marking Description:
[0061] 100. Display panel;
[0062] 10. Substrate; 11. Light-emitting unit; 111. First electrode; 112. Light-emitting functional layer; 113. Second electrode; 12. Isolation structure; 120. Isolation opening; 121. Support portion; 1211. First side wall; 1212. Second side wall; 1213. Third side wall; 122. Crown; 123. Connecting portion; 13. First encapsulation layer; 14. Pixel defining layer; 1101. First light-emitting unit; 1102. Second light-emitting unit; 1103. Third light-emitting unit; 1201. First type of isolation opening; 1202. Second type of isolation opening; 1203. Third type of isolation opening; 20. Protective adhesive layer; 30. Gap. DETAILED DESCRIPTION
[0063] In order to make the objectives, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below in combination with specific embodiments and with reference to the accompanying drawings.
[0064] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present application should be the usual meanings understood by people with ordinary skills in the field to which the present application belongs. The "first", "second" and similar words used in the embodiments of the present application do not represent any order, quantity or importance, but are only used to distinguish different components. "Including" or "comprising" and similar words mean that the elements or objects appearing in front of the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.
[0065] Reference Figure 1 , is a related display panel 100, which includes a substrate 10, a light-emitting unit 11, an isolation structure 12 and a first encapsulation layer 13, the isolation structure 12 is used to separate and accommodate the light-emitting unit 11, and the first encapsulation layer 13 covers the light-emitting unit 11.
[0066] During the preparation of the display panel 100, repeated etching is required to form a light-emitting unit in the isolation structure 12 and to encapsulate the light-emitting unit 11. However, the inventors have found through research that since the encapsulation strength of the first encapsulation layer 13 is not high, a gap 30 is easily generated at the position in contact with the isolation structure 12, so that destructive substances such as water oxygen and liquid medicine in the air enter the pixel encapsulation area through the gap 30, thereby damaging the light-emitting unit 11 and affecting the display performance.
[0067] Based on this, the present application provides a display panel solution, as detailed in the following embodiments.
[0068] Reference Figure 2 As shown, an embodiment of the present application provides a display panel 100, which includes a substrate 10, an isolation structure 12 and a first encapsulation layer 13. The isolation structure 12 is disposed on one side of the substrate 10, and the isolation structure 12 encloses an isolation opening 120, and the isolation opening 120 is used to accommodate the light-emitting unit 11; the isolation structure 12 includes a support portion 121 and a crown portion 122, and the crown portion 122 is located on the side of the support portion 121 away from the substrate 10, and the orthographic projection of one end of the support portion 121 close to the crown portion 122 on the substrate 10 is located within the orthographic projection of the crown portion 122 on the substrate 10. The first encapsulation layer 13 at least covers the light-emitting unit 11. Among them, the support portion 121 includes a first sidewall 1211, the first sidewall 1211 includes a first concave-convex structure, and the first sidewall 1211 is in contact with the first encapsulation layer 13.
[0069] The display panel 100 provided in the present application forms an uneven first side wall 1211 on the support portion 121, so that the contact surface between the support portion 121 and the first encapsulation layer 13 is a rough surface, thereby achieving close contact, increasing the encapsulation strength, and ensuring the stability of the encapsulation, thereby preventing water vapor, oxygen, and chemical liquid from entering the pixel encapsulation area, thereby improving the reliability of the overall device of the display panel 100 and thus improving the process performance.
[0070] Specifically, the first encapsulation layer 13 covers the light emitting unit 11 and also covers part of the isolation structure 12, including part of the sidewall covering the support portion 121. The position where the support portion 121 contacts the first encapsulation layer 13 is the uneven first sidewall 1211.
[0071] It should be noted that, in the embodiments of the present application, the direction perpendicular to the substrate 10 is the thickness direction.
[0072] Specifically, the isolation structure 12 can be used as a mask for preparing the light-emitting unit 11. The light-emitting material is evaporated on the substrate 10 with the isolation structure 12, and the light-emitting material is separated into independent light-emitting units 11 by the isolation structure 12, thereby omitting the precision mask plate evaporation process and simplifying the preparation of the display panel 100. The isolation structure 12 is an isolation column, and the isolation opening 120 is used to accommodate the light-emitting unit 11. It can be understood that the isolation opening 120 accommodates the main part of the light-emitting unit 11, and the main part determines the position of the main light-emitting area of the light-emitting unit 11.
[0073] The composition, preparation and other contents of the isolation structure 12 are further described in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, and PCT / CN2024 / 099072 for reference.
[0074] Reference Figure 2 As shown, in one embodiment, the isolation structure 12 also includes a second side wall 1212, the second side wall 1212 includes a smooth surface, the second side wall 1212 is located between the first side wall 1211 and the substrate 10, the light-emitting unit 11 includes a first electrode 111, a light-emitting functional layer 112 and a second electrode 113 stacked on the substrate 10 and sequentially away from the substrate 10, the light-emitting functional layer 112 and the second electrode 113 are located in the isolation opening 120, and the second side wall 1212 overlaps the second electrode 113.
[0075] In one preferred embodiment, the first electrode 111 is an anode, and the second electrode 113 is a cathode.
[0076] In other embodiments, the first electrode 111 may also be a cathode, and the second electrode 113 may also be an anode.
[0077] The isolation structure 12 includes a conductive structure, and the second electrode 113 is electrically connected to the second side wall 1212, so that the support portion 121 can connect the second electrode 113 in series, so that the support portion 121 and the second electrode 113 constitute a common electrode for driving. The overlapped portion of the isolation structure 12 and the second electrode 113 adopts a smooth surface to avoid electrical disconnection, thereby ensuring the reliability of the overlap.
[0078] It can be understood that the smooth surface may include a plane, but is not limited to a plane. For example, the smooth surface may also be a curved surface or other surface without sharp corners or concave-convex structures.
[0079] Specifically, the first side wall 1211 is located on the side of the second side wall 1212 away from the substrate 10, so that the roughness of the upper and lower side walls of the isolation structure 12 is different, thereby strengthening the encapsulation at the position where gaps are easily generated at the top, and maintaining continuous contact at the overlapping position below, which can improve the encapsulation capacity while ensuring the electrode overlap. Further, the light-emitting functional layer 112 may include a first common layer, a light-emitting layer, and a second common layer, and the first common layer, the light-emitting layer, and the second common layer are sequentially stacked on the first electrode 111. The first common layer may include a hole injection layer, a hole transport layer, an electron blocking layer, etc. The second common layer may include an electron injection layer, an electron transport layer, a hole blocking layer, etc. The setting of the isolation structure 12 requires that the first common layers of each light-emitting unit 11 are electrically disconnected from each other, which can reduce the current crosstalk.
[0080] Reference Figure 2 As shown, in one embodiment, the second side wall 1212 is located on the supporting portion 121 .
[0081] Specifically, in this embodiment, the material can be removed from a portion of the sidewall of the support portion 121 by half engraving technology to form a rough first sidewall 1211 and a smooth second sidewall 1212 . The thickness of the first sidewall 1211 is less than that of the support portion 121 .
[0082] Reference Figure 3 As shown, in another embodiment, the isolation structure 12 further includes a connecting portion 123 , the connecting portion 123 is located between the substrate 10 and the supporting portion 121 , and the second side wall 1212 is located at the connecting portion 123 .
[0083] Specifically, in this embodiment, the connection portion 123 of the isolation structure 12 overlaps the second electrode 113 through the smooth second sidewall 1212, and a rough first sidewall 1211 can be formed on the support portion 121 by full etching technology. The thickness of the first sidewall 1211 can be equal to the thickness of the support portion 121.
[0084] In another embodiment, the roughness of the first sidewall 1211 gradually decreases along a direction approaching the substrate 10 .
[0085] Among them, since the topmost position of the support portion 121 is most susceptible to water and oxygen erosion, the surface there is set to be the roughest, so that it is in the closest contact with the first packaging layer 13, thereby enhancing the packaging performance.
[0086] Reference Figure 4 , Figure 5 As shown, in some other embodiments, the support portion 121 includes a third side wall 1213 , and the third side wall 1213 is located between the second side wall 1212 and the first side wall 1211 .
[0087] Reference Figure 4 As shown, in one embodiment, the third sidewall 1213 includes a smooth surface, and the third sidewall 1213 is also overlapped with the second electrode 113 .
[0088] Specifically, the second electrode 113 can overlap the second side wall 1212 and the third side wall 1213 at the same time, and the electrical contact area between the second electrode 113 and the isolation structure 12 is larger, which can improve the overlapping reliability.
[0089] Reference Figure 5 As shown, in one embodiment, the third sidewall 1213 includes a second concave-convex structure.
[0090] Preferably, the roughness of the third sidewall 1213 is smaller than the roughness of the first sidewall 1211 .
[0091] Specifically, the sidewall of the support portion 121 may be etched in sections to form a rough surface with two roughnesses, thereby forming a first sidewall 1211 and a third sidewall 1213 .
[0092] In one embodiment, the thickness of the isolation structure 12 is 0.4-1 μm. For example, the thickness of the isolation structure 12 can be 0.4 μm, 0.7 μm, 1 μm, etc.
[0093] In one embodiment, the thickness of the first sidewall 1211 is 0.2-0.5 μm. For example, the thickness of the first sidewall 1211 can be 0.2 μm, 0.3 μm, 0.5 μm, etc.
[0094] Reference Figure 2As shown, in one embodiment, the orthographic projection of the first side wall 1211 on the substrate 10 is within the orthographic projection of the second side wall 1212 on the substrate 10. The portion of the isolation structure 12 corresponding to the first side wall 1211 is narrower than the portion corresponding to the second side wall 1212, and a step is formed at the connection between the first side wall 1211 and the second side wall 1212. During the preparation process, the first side wall 1211 can be formed by etching on the basis of the original side wall of the isolation structure 12, and the formation of a narrow upper and wide lower structure also helps to improve the stability and sealing of the package.
[0095] In one embodiment, the orthographic projection of one end of the second side wall 1212 close to the first side wall 1211 on the substrate 10 is located within the orthographic projection of one end of the second side wall 1212 close to the substrate 10 on the substrate 10. The second side wall 1212 forms a trapezoidal structure that is narrow at the top and wide at the bottom, and the portion in contact with the first encapsulation layer 13 may be an inclined surface or a stepped surface, which may increase the overlap area to a certain extent.
[0096] Reference Figure 2 As shown, in one embodiment, the display panel 100 also includes a pixel defining layer 14, which is located between the isolation structure 12 and the substrate 10, and the pixel defining layer 14 is defined by a plurality of pixel openings corresponding one by one to the isolation openings 120, respectively, and the pixel openings are connected to the corresponding isolation openings 120, and the pixel defining layer 14 covers the gaps between adjacent first electrodes 111 and the edges of the first electrodes 111, so that the pixel openings expose at least a portion of the first electrode 111.
[0097] The pixel defining layer 14 defines the exposed area of the first electrode 111 (the area of the portion in contact with the light-emitting functional layer 112), thereby defining the boundary of the light-emitting region of the light-emitting unit 11. In the preparation process, the pixel defining layer 14 is prepared after the anode is formed, and then the isolation structure 12 is formed on the pixel defining layer 14, and then the whole surface evaporation and photolithography patterning steps are performed to prepare the pixel.
[0098] Reference Figure 6 As shown, in one embodiment, the isolation opening 120 includes a first type of isolation opening 1201 and a second type of isolation opening 1202, and the light emitting unit 11 includes a first light emitting unit 1101 located in the first type of isolation opening 1201 and a second light emitting unit 1102 located in the second type of isolation opening 1202, and the colors of the light emitted by the first light emitting unit 1101 and the second light emitting unit 1102 are different. In the direction perpendicular to the substrate 10, the thickness dimension H1 of the first side wall 1211 corresponding to the first type of isolation opening 1201 is different from the thickness dimension H2 of the first side wall 1211 corresponding to the second type of isolation opening 1202.
[0099] Among them, for light-emitting units 11 of different colors, they can be opened separately and form first concave-convex structures of different thicknesses, and the corresponding first sidewalls 1211 have different thicknesses. Since the thickness of the isolation structure 12 is uniform, when the thickness of the first sidewall 1211 obtained by side engraving is different, the thickness of the second sidewall 1212 that has not been side engraved is also different. In view of the different device thicknesses of light-emitting units 11 of different colors, the thickness ratio of the rough wall surface to the smooth wall surface on the isolation structure 12 can be set separately for each color according to the evaporation angle and device thickness of the device. For example, the thickness of the second sidewall 1212 corresponding to the light-emitting unit 11 with a large device thickness needs to be larger, so the thickness of the etched first sidewall 1211 can be relatively small, which helps to improve the reliability of the isolation structure 12 overlapping with the electrodes of the light-emitting units 11 of different thicknesses.
[0100] Reference Figure 7 As shown, in one embodiment, the isolation opening 120 further includes a third type of isolation opening 1203, and the light emitting unit 11 further includes a third light emitting unit 1103 located in the third type of isolation opening 1203. The colors of the light emitted by the third light emitting unit 1103 are different from those of the first light emitting unit 1101 and the second light emitting unit 1102. In the direction perpendicular to the substrate 10, the thickness dimension H3 of the first side wall 1211 corresponding to the third type of isolation opening 1203 is different from the thickness dimension H1 of the first side wall 1211 corresponding to the first type of isolation opening 1201 and the thickness dimension H2 of the first side wall 1211 corresponding to the second type of isolation opening 1202.
[0101] Among them, the light-emitting unit 11 usually includes R, G, and B, which are respectively used to emit red light, green light, and blue light. Correspondingly, the isolation opening 120 usually also includes three types of isolation openings for accommodating R, G, and B light-emitting units of different colors, respectively, which are the first type of isolation opening 1201, the second type of isolation opening 1202, and the third type of isolation opening 1203. Since the device thickness of the light-emitting units 11 of different colors is different, correspondingly, the thickness of the first side wall 1211 corresponding to the first type of isolation opening 1201, the second type of isolation opening 1202, and the third type of isolation opening 1203 are all different.
[0102] In one embodiment, the display panel 100 may further include a second encapsulation layer and a third encapsulation layer, the second encapsulation layer is located between the first encapsulation layer and the third encapsulation layer, the first encapsulation layer and the third encapsulation layer are inorganic layers, the inorganic layers have high density to isolate water and oxygen, and the second encapsulation layer is an organic layer, so it has a larger thickness to flatten the surface of the display panel 100, thereby realizing inorganic-organic-inorganic three-layer encapsulation.
[0103] Based on the same inventive concept, Figure 8As shown, another embodiment of the present application provides a method for preparing a display panel, wherein the display panel 100 prepared by the preparation method can refer to Figures 2 to 7 As shown, the preparation method comprises the following steps:
[0104] Step S1, forming an isolation structure 12 and a light-emitting unit 11 on one side of the substrate 10; wherein the isolation structure 12 encloses an isolation opening 120, and the isolation opening 120 is used to accommodate the light-emitting unit 11; the isolation structure 12 includes a support portion 121 and a crown portion 122, the crown portion 122 is located on the side of the support portion 121 away from the substrate 10, and the orthographic projection of one end of the support portion 121 close to the crown portion 122 on the substrate 10 is located within the orthographic projection of the crown portion 122 on the substrate 10; wherein the support portion 121 includes a first side wall 1211, and the first side wall 1211 is provided with a first concave-convex structure.
[0105] Step S2 , forming a first encapsulation layer 13 on a side of the light emitting unit 11 facing away from the substrate 10 , so that the first encapsulation layer 13 is in contact with the first side wall 1211 .
[0106] The method for preparing a display panel provided in the present application forms an uneven first side wall 1211 on the support portion 121 to achieve close contact between the support portion 121 and the first encapsulation layer 13, thereby increasing the encapsulation strength and ensuring the stability of the encapsulation, thereby preventing water vapor, oxygen, and chemical liquid from entering the pixel encapsulation area, thereby improving the reliability of the overall device of the display panel 100 and thus improving the process performance.
[0107] Reference Fig. 9 As shown, in one embodiment, in step S1, an isolation structure 12 and a light emitting unit 11 are formed on one side of a substrate 10, including:
[0108] Step S11 , forming a first electrode 111 and an isolation structure 12 on the substrate 10 .
[0109] Specifically, refer to Fig.10 and Fig.11 As shown, a first electrode 111 and an initial isolation structure are formed on a substrate 10 , and then a selective etching liquid is used to remove unnecessary materials and to form an isolation structure 12 by etching.
[0110] Step S12 , coating a protective adhesive layer 20 on a side of the first electrode 111 away from the substrate 10 , wherein the protective adhesive layer 20 covers the first electrode 111 in the isolation opening 120 and the second sidewall 1212 of the isolation structure 12 .
[0111] Specifically, refer to Fig.12As shown, the first electrode 111 is coated with glue on the entire surface of the side away from the substrate 10, and the glue is self-leveled to form a protective glue layer 20, which can protect the first electrode 111 located in the isolation opening 120 and the second side wall 1212 of the support portion 121. The protective glue layer 20 protects the first electrode 111 and the second side wall 1212 thereunder, thereby ensuring the integrity and performance of the device in the subsequent manufacturing process.
[0112] Step S13 , etching the side wall of the support portion 121 to remove the protective glue layer 20 , and forming a first side wall 1211 ; wherein the first side wall 1211 is located on a side of the second side wall 1212 away from the substrate 10 .
[0113] Specifically, refer to Fig.13 and Fig.14 As shown, another selective etching solution is used to etch the side wall of the support portion 121 that is not covered by the protective glue layer 20. After the etching is completed, the protective glue layer 20 is washed away, and the upper half of the side wall of the support portion 121 forms an uneven first side wall 1211, and the lower half of the side wall of the support portion 121 is a second side wall 1212 covered by the protective glue layer 20, and the second side wall 1212 can be a smooth or less rough plane.
[0114] Step S14 , stacking the light-emitting functional layer 112 and the second electrode 113 in sequence on the first electrode 111 to form a light-emitting unit 11 , wherein the second side wall 1212 overlaps the second electrode 113 .
[0115] Specifically, refer to Fig.15 As shown, a first electrode 111 , a light-emitting functional layer 112 , and a second electrode 113 are sequentially stacked on a substrate 10 to form a light-emitting unit 11 of a first color, which is then encapsulated by a first encapsulation layer 13 .
[0116] Reference Fig.10 and Fig.11 As shown, in one preferred embodiment, the display panel 100 also includes a pixel defining layer 14, which is located between the isolation structure 12 and the substrate 10, and the pixel defining layer 14 is defined by a plurality of pixel openings corresponding one-to-one to the isolation openings 120, respectively, and the pixel openings are connected to the corresponding isolation openings 120, and the pixel defining layer 14 covers the gaps between adjacent first electrodes 111 and the edges of the first electrodes 111, so that the pixel openings expose at least a portion of the first electrode 111.
[0117] In step S11, a first electrode 111 and an isolation structure 12 are formed on the substrate 10, including:
[0118] Step S111 : After forming the first electrodes 111 on the substrate 10 , a pixel defining layer 14 is formed so that the pixel defining layer 14 covers the gaps between adjacent first electrodes 111 and the edges of the first electrodes 111 .
[0119] Step S112 , forming an isolation structure 12 on the pixel definition layer 14 .
[0120] The pixel defining layer 14 defines an exposed area of the first electrode 111 (an area of a portion in contact with the light-emitting functional layer 112 ), thereby defining a boundary of a light-emitting region of the light-emitting unit 11 .
[0121] Reference Figure 3 As shown, in another embodiment, the isolation structure 12 further includes a connecting portion 123 , the connecting portion 123 is located between the substrate 10 and the supporting portion 121 , and the second sidewall 1212 is at least located on the connecting portion 123 .
[0122] Specifically, in this embodiment, the connection portion 123 of the isolation structure 12 overlaps the second electrode 113 through the smooth second side wall 1212, and a rough first side wall 1211 can be formed on the support portion 121 through the full etching technology. The thickness of the first side wall 1211 can be equal to the thickness of the support portion 121. In addition, the rough wall surface and the smooth wall surface can also be retained on the side wall of the support portion 121 at the same time, and it can be considered that the second side wall 1212 is located on the connection portion 123 and part of the support portion 121.
[0123] In one embodiment, the method for preparing a display panel further includes:
[0124] In step S2, a first encapsulation layer 13 is formed, and then,
[0125] Step S3, repeatedly forming light-emitting units 11 of different colors and corresponding first encapsulation layers 13; wherein, in a direction perpendicular to the substrate 10, the thicknesses of the first sidewalls 1211 corresponding to the isolation openings 120 where the light-emitting units 11 of different colors are located are different.
[0126] For example, refer to Figure 6 As shown, the isolation openings 120 include a first type of isolation openings 1201 and a second type of isolation openings 1202, the light emitting unit 11 includes a first light emitting unit 1101 located in the first type of isolation openings 1201 and a second light emitting unit 1102 located in the second type of isolation openings 1202, and the colors of the light emitted by the first light emitting unit 1101 and the second light emitting unit 1102 are different. In the direction perpendicular to the substrate 10, the thickness dimension H1 of the first side wall 1211 corresponding to the first type of isolation openings 1201 is different from the thickness dimension H2 of the first side wall 1211 corresponding to the second type of isolation openings 1202.
[0127] For light-emitting units 11 of different colors, they can be opened independently and form isolation structures 12 of different heights, and the thickness of the corresponding first sidewalls 1211 can also be different. The device thickness of light-emitting units 11 of different colors is different. According to the evaporation angle and thickness of the device, an isolation structure 12 can be set separately for each color to ensure normal electrode overlap.
[0128] Reference Figure 7 As shown, in one embodiment, the isolation opening 120 further includes a third type of isolation opening 1203, and the light emitting unit 11 further includes a third light emitting unit 1103 located in the third type of isolation opening 1203. The colors of the light emitted by the third light emitting unit 1103 are different from those of the first light emitting unit 1101 and the second light emitting unit 1102. In the direction perpendicular to the substrate 10, the thickness dimension H3 of the first side wall 1211 corresponding to the third type of isolation opening 1203 is different from the thickness dimension H1 of the first side wall 1211 corresponding to the first type of isolation opening 1201 and the thickness dimension H2 of the first side wall 1211 corresponding to the second type of isolation opening 1202.
[0129] Specifically, after step S2, portions of the substrate 10 that do not need to be retained can be selectively removed through photolithography processes such as coating, exposure, development, etching, and stripping, thereby completing the patterning of the first color; for example, the process of preparing the light-emitting unit 11 and the corresponding first encapsulation layer 13 is repeated twice to complete the full-color patterning of the three primary colors of RGB.
[0130] Another embodiment of the present application provides a display device, which includes the display panel 100 in the above embodiment. The display device can be located in a smart device (such as a mobile phone, VR device, computer, TV, car display, etc.).
[0131] The display device provided in the present application has a display panel 100, which achieves close contact between the support portion 121 and the first encapsulation layer 13 through the uneven first side wall 1211 on the support portion 121, thereby increasing the encapsulation strength and ensuring the stability of the encapsulation, thereby preventing water vapor, oxygen, chemical liquid, etc. from entering the pixel encapsulation area, improving the reliability of the overall device of the display panel 100, thereby improving the process performance.
[0132] Although the present application has been described in conjunction with specific embodiments thereof, many alternatives, modifications and variations of these embodiments will be apparent to those skilled in the art in light of the foregoing description.
[0133] It should be noted that the above is a description of an embodiment of the present application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in an order different from that in the above embodiments and still achieve the desired results. In addition, the processes depicted in the accompanying drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.
[0134] The embodiments of the present application are intended to cover all such substitutions, modifications and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the embodiments of the present application should be included in the scope of protection of the present application.
Claims
1. A display panel, characterized in that: include: substrate; An isolation structure, wherein the isolation structure is disposed on one side of the substrate, and the isolation structure encloses an isolation opening, and the isolation opening is used to accommodate a light-emitting unit; The isolation structure at least comprises a support portion and a crown portion, wherein the crown portion is located on a side of the support portion away from the substrate, and an orthographic projection of an end of the support portion close to the crown portion on the substrate is located within an orthographic projection of the crown portion on the substrate; A first encapsulation layer, wherein the first encapsulation layer at least covers the light-emitting unit; The supporting portion includes a first side wall, a first concave-convex structure is arranged on the first side wall, and the first side wall is in contact with the first packaging layer.
2. The display panel according to claim 1, characterized in that: The isolation structure further includes a second sidewall, the second sidewall includes a smooth surface, and the second sidewall is located between the first sidewall and the substrate; the light-emitting unit includes a first electrode, a light-emitting functional layer, and a second electrode stacked on the substrate and sequentially away from the substrate, and the light-emitting functional layer and the second electrode are located in the isolation opening; Wherein, the second electrode overlaps the second side wall; Preferably, the first electrode is an anode and the second electrode is a cathode; Preferably, the second side wall comprises a plane.
3. The display panel according to claim 2, characterized in that: The second side wall is located on the supporting portion.
4. The display panel according to claim 2, characterized in that: The isolation structure further includes a connecting portion, wherein the connecting portion is located between the substrate and the supporting portion, and the second side wall is located at the connecting portion.
5. The display panel according to claim 1, characterized in that: The roughness of the first sidewall gradually decreases along a direction approaching the substrate.
6. The display panel according to claim 2, characterized in that: The supporting portion includes a third side wall located between the second side wall and the first side wall.
7. The display panel according to claim 6, characterized in that: The third side wall includes a smooth surface, and the second electrode is also overlapped with the third side wall.
8. The display panel according to claim 6, characterized in that: The third side wall includes a second concave-convex structure; Preferably, the roughness of the third side wall is smaller than the roughness of the first side wall.
9. The display panel according to claim 1, characterized in that: The thickness of the isolation structure is 0.4-1 μm.
10. The display panel according to claim 1, characterized in that: The thickness of the first side wall is 0.2-0.5 μm.
11. The display panel according to claim 2, characterized in that: An orthographic projection of the first side wall on the substrate is located within an orthographic projection of the second side wall on the substrate.
12. The display panel according to claim 2, characterized in that: An orthographic projection of one end of the second side wall close to the first side wall on the substrate is located within an orthographic projection of one end of the second side wall close to the substrate on the substrate.
13. The display panel according to claim 2, characterized in that: The display panel also includes a pixel defining layer, which is located between the isolation structure and the substrate. The pixel defining layer defines a plurality of pixel openings corresponding to the isolation openings respectively, and the pixel openings are connected to the corresponding isolation openings. The pixel defining layer covers the gaps between adjacent first electrodes and the edges of the first electrodes so that the pixel openings expose at least a portion of the first electrode.
14. The display panel according to claim 1, characterized in that: The isolation openings include a first type of isolation openings and a second type of isolation openings, the light-emitting units include a first light-emitting unit located in the first type of isolation openings and a second light-emitting unit located in the second type of isolation openings, and the colors of the light emitted by the first light-emitting unit and the second light-emitting unit are different; Wherein, in a direction perpendicular to the substrate, a thickness of the first sidewall corresponding to the first type of isolation opening is different from a thickness of the first sidewall corresponding to the second type of isolation opening.
15. The display panel according to claim 14, characterized in that: The isolation opening further includes a third type of isolation opening, and the light emitting unit further includes a third light emitting unit located in the third type of isolation opening, and the color of the light emitted by the third light emitting unit is different from that of the first light emitting unit and the second light emitting unit; Wherein, in a direction perpendicular to the substrate, thicknesses of the first side walls corresponding to the first type of isolation openings, the second type of isolation openings and the third type of isolation openings are all different.
16. A method for preparing a display panel, characterized in that: include: An isolation structure and a light-emitting unit are formed on one side of the substrate; wherein the isolation structure encloses an isolation opening, and the isolation opening is used to accommodate the light-emitting unit; the isolation structure includes a support portion and a crown portion, wherein the crown portion is located on a side of the support portion away from the substrate, and an orthographic projection of an end of the support portion close to the crown portion on the substrate is located within an orthographic projection of the crown portion on the substrate; wherein the support portion includes a first side wall, and a first concave-convex structure is provided on the first side wall; A first encapsulation layer is formed on a side of the light emitting unit away from the substrate, so that the first encapsulation layer is in contact with the first side wall.
17. The method for manufacturing a display panel according to claim 16, characterized in that: The isolation structure and the light-emitting unit are formed on one side of the substrate, comprising: forming a first electrode and the isolation structure on the substrate; Coating a protective adhesive layer on a side of the first electrode away from the substrate, wherein the protective adhesive layer covers the first electrode in the isolation opening and the second side wall of the isolation structure; Etching the side wall of the support portion to remove the protective glue layer to form the first side wall; wherein the first side wall is located on a side of the second side wall away from the substrate; A light-emitting functional layer and a second electrode are sequentially stacked on the first electrode to form the light-emitting unit; wherein the second electrode overlaps the second side wall.
18. The method for preparing a display panel according to claim 17, characterized in that: The isolation structure further includes a connecting portion, wherein the connecting portion is located between the substrate and the supporting portion, and the second side wall is at least located at the connecting portion.
19. The method for preparing a display panel according to claim 16, characterized in that: The preparation method further comprises: The first encapsulation layer is formed on a side of the light emitting unit away from the substrate, and then, The light-emitting units of different colors and the corresponding first encapsulation layer are repeatedly formed; wherein, in a direction perpendicular to the substrate, the thickness of the first side wall corresponding to the isolation opening where the light-emitting units of different colors are located is different.
20. A display device, characterized in that: A display panel comprising any one of claims 1-15.
Citation Information
Patent Citations
Display panel and display device
CN118251982A
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CN119866136A
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